Log in

Relevant bibliographies by topics / Silicon machining

Contents

Journal articles
Dissertations / Theses
Books
Book chapters
Conference papers
Reports

Academic literature on the topic 'Silicon machining'

Author: Grafiati

Published: 4 June 2021

Last updated: 17 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Silicon machining.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Silicon machining"

1

Tönshoff, H. K., W. v. Schmieden, I. Inasaki, W. König, and G. Spur. "Abrasive Machining of Silicon." CIRP Annals 39, no. 2 (1990): 621–35. http://dx.doi.org/10.1016/s0007-8506(07)62999-0.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Wilson, Paul. "Tutorial: silicon micro‐machining." Sensor Review 10, no. 4 (April 1990): 178–81. http://dx.doi.org/10.1108/eb007830.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Sreejith, P. S. "Machining force studies on ductile machining of silicon nitride." Journal of Materials Processing Technology 169, no. 3 (December 2005): 414–17. http://dx.doi.org/10.1016/j.jmatprotec.2005.04.092.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Makarov, V. F., K. R. Muratov, T. R. Ablyaz, E. A. Gashev, D. M. Lagunov, and N. V. Varlamov. "Precision Machining of Silicon Substrates." IOP Conference Series: Materials Science and Engineering 498 (April 16, 2019): 012009. http://dx.doi.org/10.1088/1757-899x/498/1/012009.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Yu, Po Huai, Jung Chou Hung, Hsin Min Lee, Kun Ling Wu, and Biing Hwa Yan. "Machining Characteristics of Magnetic Force-Assisted Electrolytic Machining for Polycrystalline Silicon." Advanced Materials Research 325 (August 2011): 523–29. http://dx.doi.org/10.4028/www.scientific.net/amr.325.523.

Full text

Abstract:

Wire electrical discharge machining (WEDM) of polycrystalline silicon (polysilicon) involves high-temperature melting that easily produces cracks on the silicon surface. This paper studies improvements of cracks and craters on surface of polysilicon after wire electrical discharge machining (WEDM) by magnetic force-assisted electrolytic machining (MFA-EM). The effects of different MFA-EM parameters on material removal and surface roughness are explored to understand the machining characteristics of MFA-EM and how magnetic field assistance contributes to high-efficiency and high-quality machining. Experimental results show that compared with standard EM, MFA-EM can achieve better machining efficiency and surface quality because MFA-EM can effectively enhance electrolyte circulation and replenishment, which contributes to better machining stability.

APA, Harvard, Vancouver, ISO, and other styles

6

Broniszewski, Kamil, Jarosław Woźniak, Mateusz Petrus, Kazimierz Czechowski, Lucyna Jaworska, and Andrzej Olszyna. "Silicon nitride – molybdenum cutting tools for the cast iron machining." Mechanik, no. 2 (February 2015): 126/167–126/175. http://dx.doi.org/10.17814/mechanik.2015.2.85.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Yu, Po-Huai, Hsiang-Kuo Lee, Yang-Xin Lin, Shi-Jie Qin, Biing-Hwa Yan, and Fuang-Yuan Huang. "Machining Characteristics of Polycrystalline Silicon by Wire Electrical Discharge Machining." Materials and Manufacturing Processes 26, no. 12 (December 2011): 1443–50. http://dx.doi.org/10.1080/10426914.2010.544808.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Han, Jide, Lihua Li, and Wingbun Lee. "Machining of Lenticular Lens Silicon Molds with a Combination of Laser Ablation and Diamond Cutting." Micromachines 10, no. 4 (April 16, 2019): 250. http://dx.doi.org/10.3390/mi10040250.

Full text

Abstract:

Lenticular lenses are widely used in the three-dimensional display industry. Conventional lenticular lens components are made of plastics that have low thermal stability. An alternative is to use glass to replace plastic as the lenticular lens component material. Single crystal silicon is often used as the mold material in the precision glass molding process. It is, however, difficult to fabricate a lenticular lens silicon mold that has a large feature size compared to the critical depth of cut of silicon. In order to solve the problems of machining lenticular lens silicon molds using the conventional diamond cutting method, such as low machining efficiency and severe tool wear, a hybrid machining method that combined laser ablation and diamond cutting was proposed. A feasibility study was performed to investigate the possibility of using this method to fabricate a lenticular lens silicon mold. The influence of the laser parameters and machining parameters on the machining performance was investigated systematically. The experimental results indicated that this hybrid machining method could be a possible method for manufacturing lenticular lens silicon molds or other similar microstructures.

APA, Harvard, Vancouver, ISO, and other styles

9

ZHANG, Zhiyu, Jiwang YAN, and Tsunemoto KURIYAGAWA. "C21 Wear Mechanism of Diamond Tools in Ductile Machining of Reaction-bonded Silicon Carbide(Ultra-precision machining)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2009.5 (2009): 425–30. http://dx.doi.org/10.1299/jsmelem.2009.5.425.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Yamamoto, Norimasa, Satarou Yamaguchi, and Tomohisa Kato. "Effects of Machining Fluid on Electric Discharge Machining of SiC Ingot." Materials Science Forum 778-780 (February 2014): 767–70. http://dx.doi.org/10.4028/www.scientific.net/msf.778-780.767.

Full text

Abstract:

Recently, ingots of silicon carbide have been adapted to be sliced by the wire-cut electrical discharge machining. Fast slicing, and the reduction in the loss are important for slicing of the wafer. In this paper, characteristic features of the electric discharge machining in the ion-exchange water and the fluorine-based fluid were compared for these improvement. The discharge was caused by a pulse voltage applied to a ingot of silicon carbide and the wire in machining fluid, and the slicing was proceeded. As a result, improvement of surface roughness and kerf loss was confirmed, for the first time. In addition, the improving methods for fast slicing were considered.

APA, Harvard, Vancouver, ISO, and other styles

More sources

Dissertations / Theses on the topic "Silicon machining"

1

Ghadimzadeh, Seyed Reza. "Machining of hypereutectic aluminium-silicon alloy." Thesis, Coventry University, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.281726.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Quinn, R. W. "Machining damage in silicon nitride ceramics." Thesis, University of Surrey, 1992. http://epubs.surrey.ac.uk/843210/.

Full text

Abstract:

This Thesis is primarily concerned with the effects of abrasive machining (diamond grinding) and diamond indentation on the fracture properties of a range of silicon nitride materials. Test specimens machined to surface finishes representative of those found on Aero Gas Turbine components were produced for Modulus of Rupture (MOR) testing, and variations in the fracture strengths were assessed. Optical and Scanning Electron Microscopy (SEM) were performed as a means of identifying the nature of the defects found within these materials. Having determined the dependence of strength and reliability on the machined surface finish, attempts were made to palliate the machining damage by thermal annealing and Nitrogen Ion Implantation. X-ray diffraction residual stress measurements were performed in order to quantify the magnitude of the near surface stresses in both the "as machined" and annealed conditions.* Diamond indentation techniques (Vickers and Knoop) were employed in order to determine the hardness of the materials studied and to quantify the extent of the Indentation Size Effect (ISE). These studies were then extended to the point of indentation fracture as a means of assessing the materials fracture toughness (KIC) and the nature of the crack systems beneath the indentation. *Residual stress measurements were carried out on a sub contract basis at the CEGB Central Laboratories by P E J Flewitt and D Lonsdale, their help throughout this work is gratefully acknowledged.

APA, Harvard, Vancouver, ISO, and other styles

3

Nicholson, Garth Martyn John. "The ultrasonic machining of silicon carbide/alumina composites." Thesis, Sheffield Hallam University, 1998. http://shura.shu.ac.uk/20119/.

Full text

Abstract:

Silicon carbide fibre reinforced alumina is a ceramic composite which was developed in conjunction with the Rolls-Royce Aerospace Group. The material is intended for use in the latest generation of jet engines, specifically for high temperature applications such as flame holders, combustor barrel segments and turbine blade tip seals. The material in question has properties which have been engineered by optimizing fibre volume fractions, weaves and fibre interface materials to meet the following main requirements : high thermal resistance, high thermal shock resistance and low density. Components intended for manufacture using this material will use the "direct metal oxidation" (DIMOX) method. This process involves manufacturing a near net shape component from the woven fibre matting, and infiltrating the matting with the alumina matrix material. Some of the components outlined require high tolerance features to be included in their design. The combustor barrel segments for example require slots to be formed within them for sealing purposes, the dimensions of these features preclude their formation using DIMOX, and therefore require a secondary process to be performed. Conventional machining techniques such as drilling, turning and milling cannot be used because of the brittle nature of the material. Electrodischarge machining (E.D.M.) cannot be used since the material is an insulator. Electrochemical machining (E.C.M.) cannot be used since the material is chemically inert. One machining method which could be used is ultrasonic machining (U.S.M.).The research programme investigated the feasibility of using ultrasonic machining as a manufacturing method for this new fibre reinforced composite. Two variations of ultrasonic machining were used : ultrasonic drilling and ultrasonic milling. Factors such as dimensional accuracy, surface roughness and delamination effects were examined. Previously performed ultrasonic machining experimental programmes were reviewed, as well as process models which have been developed. The process models were found to contain empirical constants which usually require specific material data for their calculation. Since a limited amount of the composite was available, and ultrasonic machining has many process variables, a Taguchi factorial experiment was conducted in order to ascertain the most relevant factors in machining. A full factorial experiment was then performed using the relevant factors. Techniques used in the research included both optical and scanning electron microscopy, surface roughness analysis, x-ray analysis and finite element stress analysis. A full set of machining data was obtained including relationships between the factors examined and both material removal rates, and surface roughness values. An attempt was made to explain these findings by examining established brittle fracture mechanisms. These established mechanisms did not seem to apply entirely to this material, an alternative method of material removal is therefore proposed. It is hoped that the data obtained from this research programme may contribute to the development of a more realistic mathematical model.

APA, Harvard, Vancouver, ISO, and other styles

4

Crawford, Gregory Allan. "Process characterization of Electrical Discharge Machining of highly doped silicon." Thesis, Massachusetts Institute of Technology, 2012. http://hdl.handle.net/1721.1/74893.

Full text

Abstract:

Thesis (Nav. E. and S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 107).
Electrical Discharge Machining (EDM) is an advanced machining process that removes material via thermal erosion through a plasma arc. The machining process is accomplished through the application of high frequency current (typically through a fine wire or some other electrode) to a conductive workpiece. The electrode is physically separated from the workpiece by some small distance and the potential difference is commonly discharged through an insulating dielectric material such as deionized water or oil. This short duration application of current produces a spark across the gap between the electrode and workpiece, causing vaporization and melting of local material in both the electrode and workpiece. The EDM process is most frequently used for conductive substrates (i.e. metals); however, research has shown that the process may be successfully used on semiconductor substrates such as doped silicon wafers'. The purpose of this research was to characterize the EDM process using Design of Experiments (DOE) statistical methodology on highly doped silicon wafer workpieces for material removal rate (MRR) and surface roughness (Ra) for both Wire EDM (WEDM) and die sinker EDM machines. Once process characterization was completed, confirmation testing was conducted for each machine. The applied spark energy had a significant impact on processing speed for both machines as expected, with the WEDM processing also heavily dependent on selected control speed. Surface roughness was also found to be highly dependent on spark energy for both machines. Evaluation of minimum obtainable feature sizes for some specific geometries as well as evaluation of various effects on the processing of silicon were also conducted.
by Gregory Allan Crawford.
Nav.E.and S.M.

APA, Harvard, Vancouver, ISO, and other styles

5

Kirwan, M. A. Q. "Diamond machining in 5 wt% Y2O3 sinter hipped silicon nitride." Thesis, University of Surrey, 1992. http://epubs.surrey.ac.uk/843045/.

Full text

Abstract:

A collaborative research project was set up to study peripheral diamond wheel machining damage in silicon nitride ceramics. The objective of the work to be carried out at the University of Surrey was to study the nature and depth of machining damage in 3 point flexural rupture test bars made from 5 wt% Y2O3 sintered hot isostatically pressed silicon nitride. The bars were machined to three surface finishes. The work carried out at Rolls-Royce by Mr R Quinn concentrated on the effects the machining damage had on the fracture strengths of the test bars. Work at the University of Surrey has identified in detail the nature and depth of machining damage in "coarse" 0. 4mum centre line average roughness surfaces. Deep grooves up to 2mum depth, 18mum width are found to have been superimposed on the general surface roughness by singularly large diamonds in the 350 grit diamond wheel. Sub-surface median cracks normal to the machining direction were clearly identified in bar cross-sections using oblique, diffuse "penumbra" illumination in an optical microscope, an as yet undocumented technique. Cross-section views of the machined surface and sub-surface were made possible by the very difficult and delicate technique of producing sandwich cross-sections of the machined bars. An analysis of machining-induced median cracks has not been carried out in such detail before. Semi-elliptical in shape the median cracks extend from 6mum - 45mum below the machined surface, and range from 19mum to 101mum in length parallel to the machining direction. They initiate at the focal point of a tributary system of microcracks at an average depth of 4mum - 5mum below the machined surface. It is believed that the median cracks initiate at the plastic/elastic boundary of a plastically deformed surface layer. Therefore a residual compressive layer, formed by the overlap of localised residual stresses from multi-particle contact events. and bound by an underlying tensile field, is thought to have an average depth of 4mum - 5mum. A very innovative technique was used to reveal sub-surface deformation, where TEM X-ray microdiffraction spots were distorted by mechanical damage in the ceramic grain structure. The "arcing" or "streaking" of the diffraction spots tended to disappear at a depth of 4mum - 5mum below the machined surface. This is further evidence of the existence of a thin layer in residual compression, which has an average depth of 4mum - 5mum. This technique is not known to have been used before. Fine diamond machining with a 600 grit wheel produced a centre line average roughness of 0.01/0.02 mum. However, evidence of machining damage is still present in the form of "remnant tracks" which lie parallel to the machining direction and consist of material pull-out. They are remnants of machining damage under grinding grooves introduced in previous machining stages. Single point Vickers pyramid diamond scratches were implemented at different loads on a polished surface. The morphology of the grooves and material fragmentation and the sub-surface median cracks were examined. Many features were found to resemble the deformation/fracture formed under a deep grinding groove in the coarse machined surface. Work carried out at Rolls-Royce by R Quinn showed that an increase in the quality of surface finish is accompanied by an increase in the mean strength and Weibull modulus of the machined bars. Furthermore a distinct anisotropy in the fracture strengths parallel and normal to the "coarse" machining direction is evidence of anisotropy in machining damage formed by a peripheral diamond grinding wheel. X-ray diffraction tests carried out at the CEGB by P E J Flewitt showed that machining damage produces a long range biaxial residual compressive field with the highest component acting normal to the machining direction. These results are consistent with the nature of machining damage identified at the University of Surrey, namely the strength-controlling median cracks which lie parallel to the machining direction and the residual compressive stress which exists as a thin 4mum - 5mum layer below the machined surface. Processing flaws were discovered in the as-hipped billets received for the project. Their elemental composition and likely origin were examined. A three dimensional "cellular network" flaw ranging from 400mum to 2.1mm in size (in different production batches) is believed to have been formed as a result of flocculation clustering during processing. Clusters of 1mum - 3mum metallic particles were also identified. They range from 5mum - 45mum in size. The contaminant particles are steel and were introduced as a result of the original ceramic powder ball milling process which employed a steel ball mill.

APA, Harvard, Vancouver, ISO, and other styles

6

Cannon, Bennion Rhead. "Design and Analysis of End-Effector Systems for Scribing on Silicon." BYU ScholarsArchive, 2003. https://scholarsarchive.byu.edu/etd/95.

Full text

Abstract:

This thesis investigates end-effector systems used in a chemomechanical scribing process. Chemomechanical scribing is a method of patterning silicon to selectively deposit a monolayer of material on the surface of the silicon. This thesis details the development of a unique end-effector for chemomechanical scribing using a compliant mechanism solution. The end-effector is developed to scribe lines that have uniform geometry and produce less chipping on the surface of the silicon. The resulting scribing mechanism is passively controlled, has high lateral stiffness, and low axial stiffness. The mechanism is analyzed using the pseudo-rigid-body model and linear-elastic beam method to determine the axial stiffness, finite element methods to determine the lateral stiffness, and fatigue analysis to determine mechanism cycle life. This thesis also investigates the significance of mechanical factors on the chemomechanical scribing process using the compliant end-effector. The factors examined are scribing force, scribing speed, tip geometry, wafer orientation, and wetting liquid. The factors are analyzed using a two-step approach: first, an analysis of the influence of the mechanical factors on line characteristics and second, an analysis of the influence of line characteristics on line performance.

APA, Harvard, Vancouver, ISO, and other styles

7

Guo, Lei. "Modelling of microstructure development in silicon-containing bainitic free-machining steels." Thesis, University of Cambridge, 2017. https://www.repository.cam.ac.uk/handle/1810/264766.

Full text

Abstract:

This research aims to model the microstructure development of Si-containing bainitic free-machining steel, including allotriomorphic ferrite, idiomorphic ferrite, pearlite, Widmanstatten ferrite, bainite and martensite. The effect of recalescence has been included to give a better estimation of the cooling curve under natural cooling conditions. A model for estimating retained austenite size distribution in the carbide-free bainitic microstructure has been developed. Manganese sulphide particles are used in the free-machining steel to break chips during machining; its effect on the prior austenite grain size has been investigated, taking account of the sulphide shape. The theories of all the major solid state phase transformations involved in steel are reviewed in chapter 2. The theory of the simultaneous transformation model is presented in chapter 3.uu A recalescence model dealing with the heat of reaction has been developed in chapter 5 for bar-shaped products. The model is based on the integration of a heat transfer model, considering latent heat generation, into the simultaneous transformation framework. It has been found that latent heat can greatly affect the transformation, especially in the case of pearlite and Widmanstatten ferrite. Chapter 6 presents the model for estimating the size distribution of retained austenite regions. The model builds on the random division of an austenite grain by bainite sheaves, which means the sizes of the two new compartments generated by the division of an austenite grain by a bainite sheaf are allocated randomly. The next compartment to be divided is also chosen at random. Good agreement between prediction and experiment has been achieved for high carbon carbide-free bainitic microstructures. The transition temperature from upper to lower bainite is modelled in chapter 7. The model compares the time required for decarburising a supersaturated bainitic ferrite platelet and that for cementite precipitation within the ferrite platelet. Manganese, silicon and chromium are considered in the model. It is suggested that carbon and manganese favour lower bainite, whereas silicon promotes upper bainite. The effect of manganese sulphide particles on austenite grain boundary motion has been studied in chapter 8. These rod-shaped particles span many austenite grains; the result shows that the long rod-shaped particles are more effective in pinning the austenite grain boundary than spheres of the same volume, or even strings of identical spheres with the same total volume. Experimental work is presented in chapters 9 and 10. In situ synchrotron X-ray study of the bainite transformation reveals that the distribution of carbon in the residual austenite becomes heterogeneous as transformation progresses. Low carbon regions transform preferentially into martensite during cooling after isothermal bainite transformation. The partitioning of carbon was found to lag behind the bainite transformation; more time is needed as the transformation temperature is reduced. Tetragonality was not observed in either the bainitic ferrite or martensite, because the carbon content of the alloy is relatively low, and the Zener ordering temperature is below the bainite and martensite transformation temperature. No significant difference was observed in the kinetics of bainite transformation between the high sulphur and low sulphur steel.

APA, Harvard, Vancouver, ISO, and other styles

8

Shen, Xinwei. "Numerical modeling and experimental investigation of laser-assisted machining of silicon nitride ceramics." Diss., Kansas State University, 2010. http://hdl.handle.net/2097/6645.

Full text

Abstract:

Doctor of Philosophy
Department of Industrial & Manufacturing Systems Engineering
Shuting Lei
Laser-assisted machining (LAM) is a promising non-conventional machining technique for advanced ceramics. However, the fundamental machining mechanism which governs the LAM process is not well understood so far. Hence, the main objective of this study is to explore the machining mechanism and provide guidance for future LAM operations. In this study, laser-assisted milling (LAMill) of silicon nitride ceramics is focused. Experimental experience reveals that workpiece temperature in LAM of silicon nitride ceramics determines the surface quality of the machined workpiece. Thus, in order to know the thermal features of the workpiece in LAM, the laser-silicon nitride interaction mechanism is investigated via heating experiments. The trends of temperature affected by the key parameters (laser power, laser beam diameter, feed rate, and preheat time) are obtained through a parametric study. Experimental results show that high operating temperature leads to low cutting force, good surface finish, small edge chipping, and low residual stress. The temperature range for brittle-to-ductile transition should be avoided due to the rapid increase of fracture toughness. In order to know the temperature distribution at the cutting zone in the workpiece, a transient three-dimensional thermal model is developed using finite element analysis (FEA) and validated through experiments. Heat generation associated with machining is considered and demonstrated to have little impact on LAM. The model indicates that laser power is one critical parameter for successful operation of LAM. Feed and cutting speed can indirectly affect the operating temperatures. Furthermore, a machining model is established with the distinct element method (or discrete element method, DEM) to simulate the dynamic process of LAM. In the microstructural modeling of a β-type silicon nitride ceramic, clusters are used to simulate the rod-like grains of the silicon nitride ceramic and parallel bonds act as the intergranular glass phase between grains. The resulting temperature-dependent synthetic materials for LAM are calibrated through the numerical compression, bending and fracture toughness tests. The machining model is also validated through experiments in terms of cutting forces, chip size and depth of subsurface damage.

APA, Harvard, Vancouver, ISO, and other styles

9

Rivero, Paz Ive. "The effect of key microstructure features on the machining of an aluminum-silicon casting alloy /." View online, 2010. http://ecommons.txstate.edu/engttad/1.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Velasco, Ivann Civi Lomas-E. "Dynamic Body Armor Shape Sensing Using Fiber Bragg Gratings and Photoassisted Silicon Wire-EDM Machining." BYU ScholarsArchive, 2021. https://scholarsarchive.byu.edu/etd/9201.

Full text

Abstract:

In this thesis, a method to improve survivability is developed for fiber Bragg gratings under high velocity impact in dynamic body armor shape sensing applications by encasing the fiber in silicone. Utilizing the slipping of the fiber within the silicone channel, a proportionality relationship between the strain of the fiber to the acceleration of the impacting projectile is found and is used to obtain the rate of the back-face deformation. A hybrid model is developed to handle errors caused by the stick-slip of the fiber by fitting an inverse exponential to stuck sections found in a captured strain profile and double integrated to transform the stuck section to its equivalent slipping. Displacement errors below 10% was achieved using the hybrid model. A graphical user interface with a step-by-step walkthrough and a fiber Bragg grating interrogation system was designed for test engineers to utilize this technology. Test engineers from the Army Test Center in Aberdeen, MD were trained on this technology and successfully captured and processed shots using this technology. A method for cutting Silicon through wire-EDM machining is developed by utilizing the photoconductive properties of Silicon. Cut rates for unilluminated and illuminated Silicon was compared and a 3x faster cut was achieved on the illuminated cuts.

APA, Harvard, Vancouver, ISO, and other styles

More sources

Books on the topic "Silicon machining"

1

Quinn, G. D. On the fractographic analysis of machining cracks in ground ceramics: A case study on silicon nitride. Gaithersburg, MD: U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology, 2003.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

2

Raftery, Theresa Maria. Electroconductive sialon-interstitial carbide composites. Dublin: University College Dublin, 1997.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

3

American Society for Precision Engineeri. Proceedings from Aspe Spring Topical Meeting on Silicon Machining. American Society for Precision Engineering, 1998.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

4

On the Fractrographic Analysis of Machining Cracks in Ground Ceramics: A Case Study on Silicon Nitride (NIST Special Publication). National Institute of Standards and Tech, 2004.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

5

Mechanical Microsensors (Microtechnology and MEMS). Springer, 2001.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

6

Elwenspoek, M., and R. Wiegerink. Mechanical Microsensors. Springer, 2010.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

Book chapters on the topic "Silicon machining"

1

Wehner, Martin, and Martin Burström. "Excimer Laser Machining of Silicon Nitride." In 4th International Symposium on Ceramic Materials and Components for Engines, 813–20. Dordrecht: Springer Netherlands, 1992. http://dx.doi.org/10.1007/978-94-011-2882-7_90.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Wang, Yan Hui, Jing Lu, X. H. Qi, and Jian Bing Zang. "Silicon Atomic Layer Deposition on Nanocrystalline Diamond." In Advances in Machining & Manufacturing Technology VIII, 436–39. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-999-7.436.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Sciammarella, Federico, Joe Santner, Jeff Staes, Richard Roberts, Frank Pfefferkorn, Stephen T. Gonczy, Stefan Kyselica, and Ricardo Deleon. "Production Environment Laser Assisted Machining of Silicon Nitride." In Advanced Processing and Manufacturing Technologies for Structural and Multifunctional Materials IV, 183–93. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470944066.ch18.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Biermann, D., T. Jansen, and M. Feldhoff. "Machining of Carbon Fibre-Reinforced Silicon-Ccarbide Composites." In Advanced Materials Research, 51–54. Stafa: Trans Tech Publications Ltd., 2008. http://dx.doi.org/10.4028/3-908454-01-8.51.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Fan, X. Q., H. H. Zhang, S. Liu, K. Jia, and Z. Y. Gan. "Fabrication of Nanoscale Gratings by Nanoimprint on Silicon Wafer." In Advances in Machining & Manufacturing Technology VIII, 825–28. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-999-7.825.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Ram Prakash, S., G. Selvakumar, and S. Vijayan. "Experimental Study on Machining of Aluminium Silicon Alloy (LM6) in Wire Electrical Discharge Machining." In Advances in Lightweight Materials and Structures, 579–85. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-7827-4_59.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Bleck, Wolfgang, Ming Di Wang, Dun Wen Zuo, Min Wang, and Yan Nian Rui. "Experimental Study on Ultrasonic Grinding and Polishing for Large-Scale Silicon Wafer." In Advances in Machining & Manufacturing Technology VIII, 6–9. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-999-7.6.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Zheng, Jia Jin, Zhao Zhong Zhou, Ju Long Yuan, and Ping Zhao. "Study on the Mechanism of the Continuous Composite Electroplating Polishing for Silicon Wafer." In Advances in Machining & Manufacturing Technology VIII, 289–93. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-999-7.289.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

Eladawi, Ahmad E., Tamer O. Diab, and Hammad T. Elmetwally. "Forming Temperature Investigation of Aluminum and Aluminum/Silicon Carbide Using Image Texture Features." In Machining, Joining and Modifications of Advanced Materials, 33–44. Singapore: Springer Singapore, 2016. http://dx.doi.org/10.1007/978-981-10-1082-8_4.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Krishnaraj, Vijayan, and S. Senthil Kumar. "An Investigation of Ductile Regime Machining of Silicon Nitride Ceramics." In Machinability of Advanced Materials, 175–228. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2014. http://dx.doi.org/10.1002/9781118576854.ch6.

Full text

APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Silicon machining"

1

WALLACE, R. J., S. M. COPLEY, and M. BASS. "Laser machining of silicon nitride." In Conference on Lasers and Electro-Optics. Washington, D.C.: OSA, 1985. http://dx.doi.org/10.1364/cleo.1985.fp2.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Hung, N. P., Z. W. Zhong, and J. C. Wong. "DUCTILE-REGIME MACHINING OF SILICON WAFER." In Processing and Fabrication of Advanced Materials VIII. WORLD SCIENTIFIC, 2001. http://dx.doi.org/10.1142/9789812811431_0009.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Hamann, Christoph, and Hans-Georg Rosen. "Laser Machining Of Ceramic And Silicon." In Hague International Symposium, edited by Ernst-Wolfgang Kreutz, A. Quenzer, and Dieter Schuoecker. SPIE, 1987. http://dx.doi.org/10.1117/12.941232.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Sciammarella, F., and Michael J. Matusky. "Fiber laser assisted machining of silicon nitride." In ICALEO® 2009: 28th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Laser Institute of America, 2009. http://dx.doi.org/10.2351/1.5061598.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Nantel, Marc, Yuri Yashkir, Seong-Kuk Lee, and Bernard Hockley. "Laser machining of silicon for photonics components." In ICALEO® 2001: Proceedings of the Laser Materials Processing Conference and Laser Microfabrication Conference. Laser Institute of America, 2001. http://dx.doi.org/10.2351/1.5059837.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Yu, Z., X. Hu, and K. P. Rajurkar. "Study of Micro Ultrasonic Machining of Silicon." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-79244.

Full text

Abstract:

As a micro mechanical machining process, micro ultrasonic machining (micro USM) has the major advantage of producing micro-scale components or features in brittle (glass, quartz crystal, and sapphire) and hard (ceramics) materials. Micro USM is used to generate micro holes with 5μm in diameter and 3D micro cavities. However, the relationship of machining parameters such as static load, abrasive particle and amplitude of vibration and the material removal rate is not clearly understood. In this paper, a mathematical model is developed to describe the material removal process in micro USM. Experiments were carried out to verify the model. It was found that the machining speed decreases when the load is over a certain value, which is different from that of theoretical model. To understand this phenomenon, a simple model was proposed to analyze it qualitatively. It was found that the debris accumulation around the crater in a short time is the main reason resulting in the low machining efficiency.

APA, Harvard, Vancouver, ISO, and other styles

7

Li, Shujuan, Jiabin Wang, Aofei Tang, and Robert G. Landers. "Force modeling of silicon monocrystal wire saw machining." In 2016 International Symposium on Flexible Automation (ISFA). IEEE, 2016. http://dx.doi.org/10.1109/isfa.2016.7790148.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Ren, Jun, Sergei S. Orlov, and Lambertus Hesselink. "Water-assisted silicon machining with femtosecond laser pulses." In Frontiers in Optics. Washington, D.C.: OSA, 2003. http://dx.doi.org/10.1364/fio.2003.thp2.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

Yan, Zhanhui. "Precision machining of silicon wafers using multi-cutters." In 2010 International Conference on Computer, Mechatronics, Control and Electronic Engineering (CMCE 2010). IEEE, 2010. http://dx.doi.org/10.1109/cmce.2010.5609902.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Corboline, Tom M., Edward C. Rea, Jr., and Corey M. Dunsky. "High-power UV laser machining of silicon wafers." In Fourth International Symposium on laser Precision Microfabrication, edited by Isamu Miyamoto, Andreas Ostendorf, Koji Sugioka, and Henry Helvajian. SPIE, 2003. http://dx.doi.org/10.1117/12.540931.

Full text

APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Silicon machining"

1

MARYLAND UNIV COLLEGE PARK. Aluminum / Silicon Carbide Matrix Material Machining for Targeting Systems. Fort Belvoir, VA: Defense Technical Information Center, July 2006. http://dx.doi.org/10.21236/ada481261.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Crawford, Gregory A. Process Characterization of Electrical Discharge Machining of Highly Doped Silicon. Fort Belvoir, VA: Defense Technical Information Center, June 2012. http://dx.doi.org/10.21236/ada567674.

Full text

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!