Relevant bibliographies by topics / Silicon Microfabrication

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Academic literature on the topic 'Silicon Microfabrication'

Author: Grafiati
Published: 4 June 2021
Last updated: 14 February 2022

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Journal articles on the topic "Silicon Microfabrication"

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Baxter, G. T., L. J. Bousse, T. D. Dawes, J. M. Libby, D. N. Modlin, J. C. Owicki, and J. W. Parce. "Microfabrication in silicon microphysiometry." Clinical Chemistry 40, no. 9 (September 1, 1994): 1800–1804. http://dx.doi.org/10.1093/clinchem/40.9.1800.

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Abstract Over the past 5 years, microphysiometry has proved an effective means for detecting physiological changes in cultured cells, particularly as a functional assay for the activation of many cellular receptors. To demonstrate the clinical relevance of this method, we have used it to detect bacterial antibiotic sensitivity and to discriminate between bacteriostatic and bacteriocidal concentrations. The light-addressable potentiometric sensor, upon which microphysiometry is based, is well suited for structural manipulations based on photolithography and micromachining, and we have begun to take advantage of this capability. We present results from a research instrument with eight separate assay channels on a 5-cm2 chip. We discuss the planned evolution of the technology toward high-through-put instruments and instruments capable of performing single-cell measurements.
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Triqueneaux, S., E. Collin, D. J. Cousins, T. Fournier, C. Bäuerle, Yu M. Bunkov, and H. Godfrin. "Microfabrication of silicon vibrating wires." Physica B: Condensed Matter 284-288 (July 2000): 2141–42. http://dx.doi.org/10.1016/s0921-4526(99)03063-x.

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Kim, Kwang-Ryul, and Young-Keun Jeong. "Laser Microfabrication for Silicon Restrictor." Journal of Korean Powder Metallurgy Institute 15, no. 1 (February 28, 2008): 46–52. http://dx.doi.org/10.4150/kpmi.2008.15.1.046.

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Owen, Valerie M. "USA — Microfabrication in silicon microphysiometry." Biosensors and Bioelectronics 10, no. 1-2 (January 1995): xii. http://dx.doi.org/10.1016/0956-5663(95)96821-f.

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Csepregi, L. "Micromechanics: A silicon microfabrication technology." Microelectronic Engineering 3, no. 1-4 (December 1985): 221–34. http://dx.doi.org/10.1016/0167-9317(85)90031-0.

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Dong, Mingzhi, Elina Iervolino, Fabio Santagata, Guoyi Zhang, and Guoqi Zhang. "Silicon microfabrication based particulate matter sensor." Sensors and Actuators A: Physical 247 (August 2016): 115–24. http://dx.doi.org/10.1016/j.sna.2016.05.036.

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ESASHI, Masayoshi. "Challenge for Ultra Microfabrication : Silicon Micromachining." Journal of the Society of Mechanical Engineers 100, no. 941 (1997): 390–95. http://dx.doi.org/10.1299/jsmemag.100.941_390.

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Cheng, Yong Qiang, Li Yang, Cui Lian Guo, Yang Zhou, and Ying Yang. "Research Progress of Materials and Fabrication Technologies of Microfluidic Chip." Advanced Materials Research 542-543 (June 2012): 891–94. http://dx.doi.org/10.4028/www.scientific.net/amr.542-543.891.

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We review the current typical materials of microfluidic chip and discuss the microfabrication technologies. A variety of materials exist for fabrication of microchip, including silicon, glass, quartz, polymers and paper. Early developments in microchip materials were focus on the silicon, glass and quartz by referring to the sophisticated microfabrication techniques from microelectronics field. Recently, the introductions of low-cost materials and easily fabricated techniques have offered more alternative ways for rapid prototyping of disposable devices.
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Tsuchizawa, T., K. Yamada, H. Fukuda, T. Watanabe, Jun-ichi Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita. "Microphotonics devices based on silicon microfabrication technology." IEEE Journal of Selected Topics in Quantum Electronics 11, no. 1 (January 2005): 232–40. http://dx.doi.org/10.1109/jstqe.2004.841479.

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Farooqui, M. M., and A. G. R. Evans. "Microfabrication of submicron nozzles in silicon nitride." Journal of Microelectromechanical Systems 1, no. 2 (June 1992): 86–88. http://dx.doi.org/10.1109/84.157362.

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Dissertations / Theses on the topic "Silicon Microfabrication"

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Song, Mi Yeon. "Microfabrication of silicon tips for scanning probe microscopy." Thesis, University of Birmingham, 2009. http://etheses.bham.ac.uk//id/eprint/482/.

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This thesis investigates the microfabrication of silicon tips for Scanning Probe Microscopy. First, a microfabrication process was developed to produce silicon tips over 100 um height with a sharp apex of ~10–20 nm. To prevent inadvertent contact between the substrate bearing the tip and the sample being probed, the tip is elevated on a mesa structure. Atomic resolution STM images of graphite are successfully obtained using silicon tips. Subsequently, a co-axial tip was developed for SPELS. SPELS uses an STM tip in field emission mode and then analyses the energy of electrons backscattered. However, the electric field distorts the trajectories of the backscattered electrons. A screened co-axial tip was thus designed; the tip consists of a multilayer Si/Au/HfO\(-2\)/Au structure. The outermost Au layer is grounded. SPELS spectra of graphite were successfully obtained for the first time. Third, a multilayered tip was fabricated for the Scanning Probe Electron AnalyseR.. This approach is a combination of STM with an ultraviolet light source. The designed structure is a multilayered silicon tip consisting of Si/SiO\(_2\)/Au/SiO\(_2\)/Au; the three conducting layers act as an electron collector, retarding field analyser, and grounded shield layer, respectively.
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Wong, Chun Keung. "Realization of integrated photonic devices using silicon-based materials and microfabrication technology /." access full-text access abstract and table of contents, 2009. http://libweb.cityu.edu.hk/cgi-bin/ezdb/thesis.pl?phd-ee-b23750431f.pdf.

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Thesis (Ph.D.)--City University of Hong Kong, 2009.
"Submitted to Department of Electronic Engineering in partial fulfillment of the requirements for the degree of Doctor of Philosophy." Includes bibliographical references.
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Pecholt, Benjamin Francis. "Laser microfabrication and testing of silicon carbide diaphragms for MEMS applications." [Ames, Iowa : Iowa State University], 2009.

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Choi, Dongwon 1973. "Silicon carbide process development for microengine applications : residual stress control and microfabrication." Thesis, Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/28348.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2004.
Includes bibliographical references.
The high power densities expected for the MIT microengine (silicon MEMS-based micro-gas turbine generator) require the turbine and compressor spool to rotate at a very high speed at elevated temperatures (1300 to 1700 K). However, the thermal softening of silicon (Si) at temperatures above 900 K limits the highest achievable operating temperatures, which in turn significantly compromises the engine efficiency. Silicon carbide (SiC) offers great potential for improved microengine efficiency due to its high stiffness, strength, and resistance to oxidation at elevated temperatures. However, techniques for microfabricating SiC to the high level of precision needed for the microengine are not currently available. Given the limitations imposed by the SiC microfabrication difficulties, this thesis proposed Si-SiC hybrid turbine structures, explores key process steps, identified, and resolved critical problems in each of the processes along with a thorough characterization of the microstructures, mechanical properties, and composition of CVD SiC. Three key process steps for the Si-SiC hybrid structures are CVD SiC deposition on silicon wafers, wafer-level SiC planarization, and Si-to-SiC wafer bonding. Residual stress control in SiC coatings is of the most critical importance to the CVD process itself as well as to the subsequent wafer planarization, and bonding processes since residual stress-induced wafer bow increases the likelihood of wafer cracking significantly. Based on CVD parametric studies performed to determine the relationship between residual stresses in SiC and H2/MTS ratio, deposition temperature, and HCl/MTS ratio, very low residual stress (less than several tens of MPa) in thick CVD SiC coatings (up to -50 pm) was achieved.
(cont.) In the course of the residual stress study, a general method for stress quantification was developed to isolate the intrinsic stress from the thermal stress. In addition, qualitative explanations for the residual stress generation are also offered, which are in good agreement with experimental results. In the post-CVD processes, the feasibility of SiC wafer planarization and Si-to-SiC wafer bonding processes have successfully been demonstrated, where CVD oxide was used as an interlayer bonding material to overcome the roughness of SiC surface. Finally, the bonding interface of the Si-SiC hybrid structures with oxide interlayer was verified to retain its integrity at high temperatures through four-point flexural tests.
by Dongwon Choi.
Ph.D.
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Zhu, Likun. "Development and application of integrated silicon-in-plastic microfabrication in polymer microfluidic systems." College Park, Md. : University of Maryland, 2006. http://hdl.handle.net/1903/3861.

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Thesis (Ph. D.) -- University of Maryland, College Park, 2006.
Thesis research directed by: Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
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Morris, Christopher J. "Capillary-force driven self-assembly of silicon microstructures /." Thesis, Connect to this title online; UW restricted, 2007. http://hdl.handle.net/1773/5963.

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Stahl, Brian C. "DESIGN, FABRICATION, MODELING AND CHARACTERIZATION OF ELECTROSTATICALLY-ACTUATED SILICON MEMBRANES." DigitalCommons@CalPoly, 2008. https://digitalcommons.calpoly.edu/theses/90.

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This thesis covers the design, fabrication, modeling and characterization of electrostatically actuated silicon membranes, with applications to microelectromechanical systems (MEMS). A microfabrication process was designed to realize thin membranes etched into a silicon wafer using a wet anisotropic etching process. These flexible membranes were bonded to a rigid counterelectrode using a photo-patterned gap layer. The membranes were actuated electrostatically by applying a voltage bias across the electrode gap formed by the membrane and the counterelectrode, causing the membrane to deflect towards the counterelectrode. This deflection was characterized for a range of actuating voltages and these results were compared to the deflections predicted by calculations and Finite Element Analysis (FEA). This thesis demonstrates the first electrostatically actuated MEMS device fabricated in the Cal Poly, San Luis Obispo Microfabrication Facility. Furthermore, this thesis should serve as groundwork for students who wish to improve upon the microfabrication processes presented herein, or who wish to fabricate thin silicon structures or electrostatically actuated MEMS structures of their own.
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Brooks, Elizabeth L. "THE DESIGN AND FABRICATION OF AN ELECTROSTATICALLY ACTUATED DIAPHRAGM WITH A SILICON-ON-INSULATOR WAFER." DigitalCommons@CalPoly, 2013. https://digitalcommons.calpoly.edu/theses/1084.

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Electrostatically actuated silicon membranes were designed, modeled, fabricated, and characterized. The intended application was for use in a microspeaker. Fabrication issues necessitated the use of thick diaphragms with a large gap between the electrodes. The devices did not function as speakers but did show actuation with a high DC voltage. Device dimensions were chosen by examining membrane mechanics, testing the processing steps required for device fabrication, and modeling with COMSOL. Several adhesives were researched to fabricate the device sidewalls, including BCB, PMMA, and TRA-Bond F112. A method for patterning PMMA through photolithography was found using a scanning electron microscope. Masks were designed in AutoCAD to create the electrostatically actuated devices and a microfabrication process was developed to produce diaphragms that could be characterized. Twenty micron thick diaphragms were fabricated by etching an SOI wafer in 25% TMAH and the etch depth was measured with a profilometer. Glass slides were coated with gold and patterned with positive photoresist to create counter-electrodes. The diaphragms were bonded to the glass slides using a forty micron thick layer of patterned SU-8 as sidewalls. Bonding was successful in the initial fabrication testing but not successful for the final devices. The final fabrication run resulted in eight devices that were partially bonded. Three devices were chosen to test the membrane actuation and the data analyzed for statistical significance. A DC voltage was applied to the electrodes with a MEMS driver and the change in force measured with a micro-force displacement system. Data analysis showed device actuation at high voltages (300V) for the medium and large devices.
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Diehl, Michael S. "Design and Fabrication of Out-of-Plane Silicon Microneedles with Integrated Hydrophobic Microchannels." Diss., CLICK HERE for online access, 2007. http://contentdm.lib.byu.edu/ETD/image/etd2074.pdf.

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Sun, Xida. "Structured Silicon Macropore as Anode in Lithium Ion Batteries." Wright State University / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=wright1316470033.

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Books on the topic "Silicon Microfabrication"

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International Symposium on Electrochemical Microfabrication (1st 1991 Phoenix, Ariz.). Proceedings of the First International Symposium on Electrochemical Microfabrication. Pennington, NJ: Electrochemical Society, 1992.

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International Symposium on Electrochemical Microfabrication (2nd 1994 Miami Beach, Fla.). Proceedings of the Second International Symposium on Electrochemical Microfabrication. Edited by Datta Madhav, Sheppard Keith, Dukovic John O, and Electrochemical Society Electrodeposition Division. Pennington, NJ: Electrochemical Society, 1995.

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Keller, Christopher G. Microfabricated high aspect ratio silicon flexures: HEXSIL, RIE, and KOH etched design and fabrication. MEMS Precision Instruments, 1998.

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Book chapters on the topic "Silicon Microfabrication"

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Smela, Elisabeth, Olle Inganäs, and Ingemar Lundström. "New Devices Made from Combining Silicon Microfabrication and Conducting Polymers." In Molecular Manufacturing, 189–213. Boston, MA: Springer US, 1996. http://dx.doi.org/10.1007/978-1-4899-0215-3_12.

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"Silicon." In Introduction to Microfabrication, 35–46. Chichester, UK: John Wiley & Sons, Ltd, 2010. http://dx.doi.org/10.1002/9781119990413.ch4.

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"Appendix A: Properties of Silicon." In Introduction to Microfabrication, 499–500. Chichester, UK: John Wiley & Sons, Ltd, 2010. http://dx.doi.org/10.1002/9781119990413.app1.

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"Microfabrication Processes for Silicon and Glass Chips." In Biochip Technology, 33–56. CRC Press, 2001. http://dx.doi.org/10.1201/9781482283662-6.

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"Brief Overview of Silicon Wafer Manufacturing and Microfabrication Techniques." In Silicon Wet Bulk Micromachining for MEMS, 23–65. Jenny Stanford Publishing, 2017. http://dx.doi.org/10.1201/9781315364926-2.

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"Silicon Single Crystal Is Still King." In Fundamentals of Microfabrication and Nanotechnology, Three-Volume Set, 229–312. CRC Press, 2018. http://dx.doi.org/10.1201/9781315274164-8.

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"Historical Note: The Ascent of Silicon, MEMS, and NEMS." In Fundamentals of Microfabrication and Nanotechnology, Three-Volume Set, 19–50. CRC Press, 2018. http://dx.doi.org/10.1201/9781315274164-5.

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Miao, X., and Y. Dong. "Development of an electromagnetic microswitch based on non-silicon microfabrication." In Energy Science and Applied Technology, 131–33. CRC Press, 2015. http://dx.doi.org/10.1201/b19779-32.

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Hirano-Iwata, Ayumi, Azusa Oshima, Yasuo Kimura, and Michio Niwano. "Stable and Reproducible Bilayer Lipid Membranes Based on Silicon Microfabrication Techniques." In Advances in Planar Lipid Bilayers and Liposomes, 71–86. Elsevier, 2010. http://dx.doi.org/10.1016/s1554-4516(10)11005-9.

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Conference papers on the topic "Silicon Microfabrication"

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Ju, Hui, Ping Zhang, Shurong Wang, Jingqiu Liang, and Yihui Wu. "A Blazed silicon grating made of (111) silicon wafer." In Micromachining and Microfabrication, edited by John A. Yasaitis, Mary Ann Perez-Maher, and Jean Michel Karam. SPIE, 2003. http://dx.doi.org/10.1117/12.478239.

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Dubois, Philippe, Stephane von Gunten, August Enzler, Urs Lippuner, Alex Dommann, and Nicolaas-F. de Rooij. "Reciprocating silicon microtribometer." In Micromachining and Microfabrication, edited by Rajeshuni Ramesham and Danelle M. Tanner. SPIE, 2003. http://dx.doi.org/10.1117/12.478200.

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Jung-Kubiak, C., J. Gill, T. Reck, C. Lee, J. Siles, G. Chattopadhyay, R. Lin, K. Cooper, and I. Mehdi. "Silicon microfabrication technologies for THz applications." In 2012 IEEE Silicon Nanoelectronics Workshop (SNW). IEEE, 2012. http://dx.doi.org/10.1109/snw.2012.6243285.

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Ashruf, Colin M. A., Patrick J. French, Pasqualina M. Sarro, and John J. Kelly. "Galvanic etching of silicon." In Micromachining and Microfabrication, edited by James H. Smith. SPIE, 1998. http://dx.doi.org/10.1117/12.324329.

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Voss, Ralf. "Silicon micromachined vibrating gyroscopes." In Micromachining and Microfabrication, edited by Kevin H. Chau and Patrick J. French. SPIE, 1997. http://dx.doi.org/10.1117/12.284541.

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Ohji, Hiroshi, Sami Lahteenmaki, and Patrick J. French. "Macroporous silicon formation for micromachining." In Micromachining and Microfabrication, edited by Shih-Chia Chang and Stella W. Pang. SPIE, 1997. http://dx.doi.org/10.1117/12.284480.

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Hughes, Henry G. "Chemical gas sensors on silicon." In Micromachining and Microfabrication, edited by Ray M. Roop and Kevin H. Chau. SPIE, 1995. http://dx.doi.org/10.1117/12.221158.

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Williams, Mark, Jeff Smith, Judy Mark, George Matamis, and Bishnu P. Gogoi. "Development of a low-stress silicon-rich silicon nitride film for micromachined sensor applications." In Micromachining and Microfabrication, edited by Jean Michel Karam and John A. Yasaitis. SPIE, 2000. http://dx.doi.org/10.1117/12.396464.

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Mehregany, Mehran, and Christian A. Zorman. "Silicon carbide micro- and nanoelectromechanical systems." In Micromachining and Microfabrication, edited by Mary A. Maher and Jerome F. Jakubczak. SPIE, 2004. http://dx.doi.org/10.1117/12.548920.

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Hokkanen, Ari P., Joona Koponen, Kai Kolari, and Ingmar Stuns. "Active silicon support for DNA diagnostics." In Micromachining and Microfabrication, edited by Holger Becker and Peter Woias. SPIE, 2003. http://dx.doi.org/10.1117/12.472735.

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Reports on the topic "Silicon Microfabrication"

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Maghribi, Mariam Nader. Microfabrication of an Implantable silicone Microelectrode array for an epiretinal prosthesis. Office of Scientific and Technical Information (OSTI), June 2003. http://dx.doi.org/10.2172/15005780.

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