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Journal articles on the topic 'Silicon Microfabrication'

Author: Grafiati

Published: 4 June 2021

Last updated: 14 February 2022

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1

Baxter, G. T., L. J. Bousse, T. D. Dawes, J. M. Libby, D. N. Modlin, J. C. Owicki, and J. W. Parce. "Microfabrication in silicon microphysiometry." Clinical Chemistry 40, no. 9 (September 1, 1994): 1800–1804. http://dx.doi.org/10.1093/clinchem/40.9.1800.

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Abstract Over the past 5 years, microphysiometry has proved an effective means for detecting physiological changes in cultured cells, particularly as a functional assay for the activation of many cellular receptors. To demonstrate the clinical relevance of this method, we have used it to detect bacterial antibiotic sensitivity and to discriminate between bacteriostatic and bacteriocidal concentrations. The light-addressable potentiometric sensor, upon which microphysiometry is based, is well suited for structural manipulations based on photolithography and micromachining, and we have begun to take advantage of this capability. We present results from a research instrument with eight separate assay channels on a 5-cm2 chip. We discuss the planned evolution of the technology toward high-through-put instruments and instruments capable of performing single-cell measurements.

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Triqueneaux, S., E. Collin, D. J. Cousins, T. Fournier, C. Bäuerle, Yu M. Bunkov, and H. Godfrin. "Microfabrication of silicon vibrating wires." Physica B: Condensed Matter 284-288 (July 2000): 2141–42. http://dx.doi.org/10.1016/s0921-4526(99)03063-x.

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3

Kim, Kwang-Ryul, and Young-Keun Jeong. "Laser Microfabrication for Silicon Restrictor." Journal of Korean Powder Metallurgy Institute 15, no. 1 (February 28, 2008): 46–52. http://dx.doi.org/10.4150/kpmi.2008.15.1.046.

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4

Owen, Valerie M. "USA — Microfabrication in silicon microphysiometry." Biosensors and Bioelectronics 10, no. 1-2 (January 1995): xii. http://dx.doi.org/10.1016/0956-5663(95)96821-f.

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5

Csepregi, L. "Micromechanics: A silicon microfabrication technology." Microelectronic Engineering 3, no. 1-4 (December 1985): 221–34. http://dx.doi.org/10.1016/0167-9317(85)90031-0.

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6

Dong, Mingzhi, Elina Iervolino, Fabio Santagata, Guoyi Zhang, and Guoqi Zhang. "Silicon microfabrication based particulate matter sensor." Sensors and Actuators A: Physical 247 (August 2016): 115–24. http://dx.doi.org/10.1016/j.sna.2016.05.036.

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7

ESASHI, Masayoshi. "Challenge for Ultra Microfabrication : Silicon Micromachining." Journal of the Society of Mechanical Engineers 100, no. 941 (1997): 390–95. http://dx.doi.org/10.1299/jsmemag.100.941_390.

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8

Cheng, Yong Qiang, Li Yang, Cui Lian Guo, Yang Zhou, and Ying Yang. "Research Progress of Materials and Fabrication Technologies of Microfluidic Chip." Advanced Materials Research 542-543 (June 2012): 891–94. http://dx.doi.org/10.4028/www.scientific.net/amr.542-543.891.

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We review the current typical materials of microfluidic chip and discuss the microfabrication technologies. A variety of materials exist for fabrication of microchip, including silicon, glass, quartz, polymers and paper. Early developments in microchip materials were focus on the silicon, glass and quartz by referring to the sophisticated microfabrication techniques from microelectronics field. Recently, the introductions of low-cost materials and easily fabricated techniques have offered more alternative ways for rapid prototyping of disposable devices.

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9

Tsuchizawa, T., K. Yamada, H. Fukuda, T. Watanabe, Jun-ichi Takahashi, M. Takahashi, T. Shoji, E. Tamechika, S. Itabashi, and H. Morita. "Microphotonics devices based on silicon microfabrication technology." IEEE Journal of Selected Topics in Quantum Electronics 11, no. 1 (January 2005): 232–40. http://dx.doi.org/10.1109/jstqe.2004.841479.

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10

Farooqui, M. M., and A. G. R. Evans. "Microfabrication of submicron nozzles in silicon nitride." Journal of Microelectromechanical Systems 1, no. 2 (June 1992): 86–88. http://dx.doi.org/10.1109/84.157362.

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11

HIRANO-IWATA, Ayumi, Yutaka ISHINARI, Yasuo KIMURA, and Michio NIWANO. "Ion-Channel Chips Based on Silicon Microfabrication." Hyomen Kagaku 35, no. 8 (2014): 438–42. http://dx.doi.org/10.1380/jsssj.35.438.

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12

Lu, Y., J. P. Yang, J. Chen, and S. X. Chen. "A silicon microactuator using integrated microfabrication technology." IEEE Transactions on Magnetics 39, no. 5 (September 2003): 2240–42. http://dx.doi.org/10.1109/tmag.2003.815443.

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13

Majeed, Bivragh, Lei Zhang, Giuseppe Fiorentino, Greet Verbinnen, Huma Ashraf, Edward Walsby, Kerry Roberts, et al. "Silicon microfluidics: An enabling technology for life sciences application." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000188–93. http://dx.doi.org/10.4071/isom-2017-wa21_155.

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Abstract In this paper we review the silicon microfabrication process that has been developed for various life science applications over the last several years. Silicon microfabrication is a key enabling technology in the developing personalized point of care or point of need systems. Silicon microfabrication allows for accurate control of fine features and it can combine active and passive components within a single chip. It is also very reliable, repeatable and it benefits from cost reduction due to mass production capabilities Depending on the application, we have fabricated devices with either a single silicon etch or a two-step approach. Single step etches are typically 250–280μm deep. Two-step etching, the shallow features are 50μm while deeper are 250μm. We have developed an optimized deep silicon etch process that gives very straight profiles with minimum loss of critical dimension (CD) for different features. The minimum CD is 3μm while the largest features are 500μm wide The etching was done an SPTS Rapier DRIE system. We describe the working principles of the various components in the system including PCR and micropillar filters. The filter has been used for high performance liquid chromatography (HPLC). It exhibits very low broadening of the components travelling through it and separation of a mixture of coumarin dyes is efficiently performed in a very short time. A micro PCR chamber with thermal isolation to the surrounding silicon is characterized and DNA amplification is achieved.

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14

Evans, David. "The Future of CMP." MRS Bulletin 27, no. 10 (October 2002): 779–83. http://dx.doi.org/10.1557/mrs2002.250.

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AbstractChemical–mechanical polishing, or planarization (CMP), is one of several advanced microfabrication processes that provide complementary capabilities for constructing advanced electronic devices. At the current state of the art, CMP demonstrates significant advantages due to its high degree of process flexibility, particularly in the chemical formulation of polishing solutions and slurries. This article explores some possible future applications of CMP using new advanced materials other than silicon, silicon oxide, and silicon nitride. Such materials may include refractory and noble metals, high-κ insulators, and mixed metal oxide perovskites. Although no one can predict future applications with absolute certainty, it seems safe to conclude that CMP will remain a key microfabrication technology for the foreseeable future.

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15

Itoh, T., S. Tanaka, J. F. Li, R. Watanabe, and M. Esashi. "Silicon-Carbide Microfabrication by Silicon Lost Molding for Glass-Press Molds." Journal of Microelectromechanical Systems 15, no. 4 (August 2006): 859–63. http://dx.doi.org/10.1109/jmems.2006.872231.

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16

Esashi, Masayoshi. "Packaged Sensors, Microactuators and Three-Dimensional Microfabrication." Journal of Robotics and Mechatronics 7, no. 3 (June 20, 1995): 200–203. http://dx.doi.org/10.20965/jrm.1995.p0200.

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Packaged micromechanical sensors were fabricated using bonded glass-silicon microstructures. These are integrated, resonant, or force-balancing sensors. Distributed electrostatic microactuator (DEMA) and three-dimensional microfabrication methods were developed.

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17

Lamichhane, Shobha Kanta. "Experimental investigation on anisotropic surface properties of crystalline silicon." BIBECHANA 8 (January 15, 2012): 59–66. http://dx.doi.org/10.3126/bibechana.v8i0.4828.

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Anisotropic etching of silicon has been studied by wet potassium hydroxide (KOH) etchant with its variation of temperature and concentration. Results presented here are temperature dependent etch rate along the crystallographic orientations. The etching rate of the (111) surface family is of prime importance for microfabrication. However, the experimental values of the corresponding etch rate are often scattered and the etching mechanism of (111) remains unclear. Etching and activation energy are found to be consistently favorable with the thermal agitation for a given crystal plane. Study demonstrate that the contribution of microscopic activation energy that effectively controls the etching process. Such a strong anisotropy in KOH allows us a precious control of lateral dimensions of the silicon microstructure.Keywords: microfabrication; activation energy; concentration; anisotropy; crystal planeDOI: http://dx.doi.org/10.3126/bibechana.v8i0.4828 BIBECHANA 8 (2012) 59-66

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18

Li, Jing-Feng, Shuji Tanaka, Toshiya Umeki, Shinya Sugimoto, Masayoshi Esashi, and Ryuzo Watanabe. "Microfabrication of thermoelectric materials by silicon molding process." Sensors and Actuators A: Physical 108, no. 1-3 (November 2003): 97–102. http://dx.doi.org/10.1016/s0924-4247(03)00369-8.

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19

Khiat, Ali. "Silicon grating microfabrication for long-range displacement sensor." Journal of Micro/Nanolithography, MEMS, and MOEMS 7, no. 2 (April 1, 2008): 021007. http://dx.doi.org/10.1117/1.2909459.

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20

Hajj-Hassan, M., S. Musallam, and V. P. Chodavarapu. "Microfabrication of ultra-long reinforced silicon neural electrodes." Micro & Nano Letters 4, no. 1 (March 1, 2009): 53–58. http://dx.doi.org/10.1049/mnl:20090007.

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21

Anzalone, Ruggero, Andrea Severino, Christopher Locke, Davide Rodilosso, Cristina Tringali, Stephen E. Saddow, Francesco La Via, and Giuseppe D'Arrigo. "3C-SiC Hetero-Epitaxial Films for Sensors Fabrication." Advances in Science and Technology 54 (September 2008): 411–15. http://dx.doi.org/10.4028/www.scientific.net/ast.54.411.

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Silicon Carbide (SiC) is a very promising material for the fabrication of a new category of sensors and devices, to be used in very hostile environments (high temperature, corrosive ambient, presence of radiation, etc.). The fabrication of SiC MEMS-based sensors requires new processes able to realize microstructures on bulk material or on the SiC surface. The hetero-epitaxial growth of 3CSiC on silicon substrates allows one to overcome the traditional limitations of SiC microfabrication. This approach puts together the standard silicon bulk microfabrication methodologies with the robust mechanical properties of 3C-SiC. Using this approach we were able to fabricate SiC cantilevers for a new class of pressure sensor. The geometries studied were selected in order to study the internal residual stress of the SiC film. X-Ray Diffraction polar figure and Bragg- Brentano scan analysis were used to check to crystal structure and the orientations of the film. SEM analysis was performed to analyze the morphology of the released MEMS structures.

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22

Craighead, H. G., M. Isaacson, P. St John, R. Davis, G. Banker, T. Esch, L. Kam, W. Shain, and J. N. Turner. "Microcontact Printed Substrates for Growing Central Nervous System Neurons and Glia." Microscopy and Microanalysis 3, S2 (August 1997): 287–88. http://dx.doi.org/10.1017/s1431927600008321.

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The application of nano- and microfabrication to biology is an emerging area linking engineering and biology. We are using microfabrication techniques to make patterns of specific bioactive molecules on glass and silicon surfaces to study central nervous system neurons and glia. Cell adhesion and tissue reaction to implanted silicon based electronic prosthetic devices are being studied, and the methods expanded to interface neurons with integrated circuits to study their electrical properties. The number, type and distribution of cells adhering to particular portions of a substrate can be influenced by patterning amine groups, proteins or polypeptides. We are using microcontact printing as an alternative to lithography for chemical patterning.Primary cultures of rat cortical astrocytes and hippocampal neurons, and continuous cultures of transformed astrocytes were prepared on microcontact printed patterns produced by an elastomer stamp made from a silicon master. Fig. 1 shows two such patterns prepared by depositing self-assembled monolayers of N1[3-(Trimethoxylsily)propyl] diethylenetriamine (DETA) and octadecyltrichlorosilane (OTS).

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23

Huan, Junjun, Vamsy P. Chodavarapu, George Xereas, and Charles Allan. "Microfabrication and Packaging Process for a Single-Chip Position, Navigation, and Timing System." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000208–14. http://dx.doi.org/10.4071/isom-2017-wa25_143.

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Abstract The Global Positioning System (GPS) is the primary means of Positioning, Navigation, and Timing (PNT) for most civilian and military systems and applications. The rapid growth in autonomous systems has created a widespread interest in self-contained Inertial Navigation System (INS) for precise navigation and guidance in the absence of GPS. The microscale PNT systems need both specialized and low cost fabrication technologies to cost effectively bring these technologies to market. We describe an ultra-clean (low leak rate) wafer-level vacuum encapsulation microfabrication process of Micro-Electro-Mechanical Systems (MEMS) based sensors and devices. Using this process we have fabricated inertial sensors, frequency reference resonators, and pressure sensors. In addition to providing excellent resistance to shock and vibration, this combined microfabrication and packaging method would allow the use of high volume low cost plastic packaging at the device level. The microfabrication process is an 8” wafer process based on high aspect ratio bulk micromachining of a 30 μm thick single-crystal silicon device layer that is vacuum encapsulated at 10 mTorr between two silicon wafers with the demonstrated leak rate of only 6.5 × 10−18 atm cm3/s.

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24

Giang, Ut-Binh T., Dooyoung Lee, Michael R. King, and Lisa A. DeLouise. "Microfabrication of cavities in polydimethylsiloxane using DRIE silicon molds." Lab on a Chip 7, no. 12 (2007): 1660. http://dx.doi.org/10.1039/b714742b.

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25

Zhou, C., C. J. Muller, M. R. Deshpande, J. W. Sleight, and M. A. Reed. "Microfabrication of a mechanically controllable break junction in silicon." Applied Physics Letters 67, no. 8 (August 21, 1995): 1160–62. http://dx.doi.org/10.1063/1.114994.

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26

Chieh, Y. S., J. P. Krusius, and P. Chapman. "Chemically Assisted Ion Beam Etching for Silicon‐Based Microfabrication." Journal of The Electrochemical Society 141, no. 6 (June 1, 1994): 1585–89. http://dx.doi.org/10.1149/1.2054966.

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27

Meade, Shawn O., and Michael J. Sailor. "Microfabrication of freestanding porous silicon particles containing spectral barcodes." physica status solidi (RRL) – Rapid Research Letters 1, no. 2 (March 2007): R71—R73. http://dx.doi.org/10.1002/pssr.200600077.

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28

Wang, Yaqiang, and Daniel W. van der Weide. "Microfabrication and application of high-aspect-ratio silicon tips." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 23, no. 4 (2005): 1582. http://dx.doi.org/10.1116/1.1947805.

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29

Goryll, Michael, and Nipun Chaplot. "Miniaturized Ion Channel Reconstitution Platform Based On Silicon Microfabrication." Biophysical Journal 96, no. 3 (February 2009): 51a. http://dx.doi.org/10.1016/j.bpj.2008.12.159.

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30

Leblois, Therese G., and C. R. Tellier. "Wet Etching of Si Micro-Arrays: Experimental and Theoretical Shapes." Advances in Science and Technology 54 (September 2008): 445–50. http://dx.doi.org/10.4028/www.scientific.net/ast.54.445.

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In this paper emphasis is placed on the wet micromachining of silicon micro-arrays constituted by very small holes. Microfabrication of various Silicon plates is performed in a KOH etchant maintained at constant temperature. Limitations due to the process are given. A self elaborated simulator is used to predict etching shapes of several micro holes. A comparison between experiments and simulation is presented.

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31

Nara, Takayuki, Kouki Oku, Hirofumi Fukai, Hideki Hatagouchi, and Yasushiro Nishioka. "Silicon Microfabrication Processes Including Anodic Bonding of Extremely Thin (60 μm –Thick) Silicon on Glass." Advanced Materials Research 306-307 (August 2011): 180–84. http://dx.doi.org/10.4028/www.scientific.net/amr.306-307.180.

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A new silicon MEMS process has been proposed utilizing anodic bonding of an extremely thin silicon film (60 m) on a glass substrate, followed by photo lithographically defining micro spring structures on the silicon film and dry etching the silicon film using an inductively coupled plasma (ICP) dry etcher. After that, the underneath glass was selectively etched off using a hydrofluoric (HF) solution to release the micro spring. This technique was successfully applied to a micro vibration detection sensor with the silicon microspring with a cross section of 10 m x 60 m with a length longer than 500 m.

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32

Flemming, Jeb H., Kevin Dunn, James Gouker, Carrie Schmidt, and Colin Buckley. "Cost effective Precision 3D Glass Microfabrication for Electronic Packaging." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000199–201. http://dx.doi.org/10.4071/isom-2011-tp1-paper3.

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The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; (1) electrical leakage and (2) the lack of improved electrical performance beyond 16nm. As a result, the industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this extended abstract, 3D Glass Solutions, a division of Life BioScience, Inc., presents our efforts in glass interposer microfabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. 3D Glass Solution’s APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitch, in 125 micron thick APEX™ Glass ceramic. This extended abstract covers (1) on our efforts producing high aspect ratio TGVs in ultra thin (75–250 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing.

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33

Gaiardo, Andrea, David Novel, Elia Scattolo, Alessio Bucciarelli, Pierluigi Bellutti, and Giancarlo Pepponi. "Dataset of the Optimization of a Low Power Chemoresistive Gas Sensor: Predictive Thermal Modelling and Mechanical Failure Analysis." Data 6, no. 3 (March 9, 2021): 30. http://dx.doi.org/10.3390/data6030030.

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Over the last few years, employment of the standard silicon microfabrication techniques for the gas sensor technology has allowed for the development of ever-small, low-cost, and low-power consumption devices. Specifically, the development of silicon microheaters (MHs) has become well established to produce MOS gas sensors. Therefore, the development of predictive models that help to define a priori the optimal design and layout of the device have become crucial, in order to achieve both low power consumption and high mechanical stability. In this research dataset, we present the experimental data collected to develop a specific and useful predictive thermal-mechanical model for high performing silicon MHs. To this aim, three MH layouts over three different membrane sizes were developed by using the standard silicon microfabrication process. Thermal and mechanical performances of the produced devices were experimentally evaluated, by using probe stations and mechanical failure analysis, respectively. The measured thermal curves were used to develop the predictive thermal model towards low power consumption. Moreover, a statistical analysis was finally introduced to cross-correlate the mechanical failure results and the thermal predictive model, aiming at MH design optimization for gas sensing applications. All the data collected in this investigation are shown.

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34

Fekete, Z., A. Pongrácz, G. Márton, and P. Fürjes. "On the Fabrication Parameters of Buried Microchannels Integrated in In-Plane Silicon Microprobes." Materials Science Forum 729 (November 2012): 210–15. http://dx.doi.org/10.4028/www.scientific.net/msf.729.210.

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This paper aims the characterization of buried microchannels in silicon realized by deep reactive ion etching. The effects of dry etching parameters on the integrability into hollow microprobes are thoroughly investigated from both technological and functional aspects. Results are supposed to give physiology related probe designers a deeper insight into microfabrication-related issues.

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35

Huq, S. E. "Microfabrication and characterization of gridded polycrystalline silicon field emitter devices." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 16, no. 2 (March 1998): 796. http://dx.doi.org/10.1116/1.590219.

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36

Shahosseini, Iman, Elie Lefeuvre, Johan Moulin, Emile Martincic, Marion Woytasik, and Guy Lemarquand. "Optimization and Microfabrication of High Performance Silicon-Based MEMS Microspeaker." IEEE Sensors Journal 13, no. 1 (January 2013): 273–84. http://dx.doi.org/10.1109/jsen.2012.2213807.

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37

Deraoui, A., A. Balhamri, M. Rattal, Y. Bahou, A. Tabyaoui, M. Harmouchi, Az Mouhsen, and E. M. Oualim. "Black Silicon: Microfabrication Techniques and Characterization for Solar Cells Applications." International Journal of Energy Science 3, no. 6 (2013): 403. http://dx.doi.org/10.14355/ijes.2013.0306.04.

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38

Keum, Hohyun, Andrew Carlson, Hailong Ning, Agustin Mihi, Jeffrey D. Eisenhaure, Paul V. Braun, John A. Rogers, and Seok Kim. "Silicon micro-masonry using elastomeric stamps for three-dimensional microfabrication." Journal of Micromechanics and Microengineering 22, no. 5 (April 16, 2012): 055018. http://dx.doi.org/10.1088/0960-1317/22/5/055018.

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39

Teo, E. J., M. B. H. Breese, E. P. Tavernier, A. A. Bettiol, F. Watt, M. H. Liu, and D. J. Blackwood. "Three-dimensional microfabrication in bulk silicon using high-energy protons." Applied Physics Letters 84, no. 16 (April 19, 2004): 3202–4. http://dx.doi.org/10.1063/1.1723703.

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40

Folch, A., M. S. Wrighton, and M. A. Schmidt. "Microfabrication of oxidation-sharpened silicon tips on silicon nitride cantilevers for atomic force microscopy." Journal of Microelectromechanical Systems 6, no. 4 (1997): 303–6. http://dx.doi.org/10.1109/84.650126.

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41

Liang, Jun Sheng, Chong Liu, and Ling Jun Sun. "A Silicon Micro Direct Methanol Fuel Cell Demonstrator Using Microfabrication Techniques." Materials Science Forum 628-629 (August 2009): 423–28. http://dx.doi.org/10.4028/www.scientific.net/msf.628-629.423.

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. This paper presents the design, microfabrication and characterizations of a silicon based, single-cell μDMFC demonstrator for micro/portable electrical power applications. The flow field plates of the fuel cell were made on 2“silicon wafers utilizing wet-etching and sputtering techniques. The fuel cell was assembled in an epoxy-based packaging process. Results show that a lower internal ohmic resistance of the fuel cell can be achieved with a thicker current collecting layer (CCL). Influence of the operating conditions on the μDMFC performance was also investigated. It was found that 2M methanol can yield a better fuel cell performance because it provided a better compromise between the methanol crossover and mass transportation during operation. On the other hand, a 4-time increase of the peak power density of the fuel cell was achieved by increasing the methanol temperature from 20°C to 80°C.

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42

Sharstniou, Aliaksandr, Stanislau Niauzorau, Placid M. Ferreira, and Bruno P. Azeredo. "Electrochemical nanoimprinting of silicon." Proceedings of the National Academy of Sciences 116, no. 21 (May 8, 2019): 10264–69. http://dx.doi.org/10.1073/pnas.1820420116.

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Scalable nanomanufacturing enables the commercialization of nanotechnology, particularly in applications such as nanophotonics, silicon photonics, photovoltaics, and biosensing. Nanoimprinting lithography (NIL) was the first scalable process to introduce 3D nanopatterning of polymeric films. Despite efforts to extend NIL’s library of patternable media, imprinting of inorganic semiconductors has been plagued by concomitant generation of crystallography defects during imprinting. Here, we use an electrochemical nanoimprinting process—called Mac-Imprint—for directly patterning electronic-grade silicon with 3D microscale features. It is shown that stamps made of mesoporous metal catalysts allow for imprinting electronic-grade silicon without the concomitant generation of porous silicon damage while introducing mesoscale roughness. Unlike most NIL processes, Mac-Imprint does not rely on plastic deformation, and thus, it allows for replicating hard and brittle materials, such as silicon, from a reusable polymeric mold, which can be manufactured by almost any existing microfabrication technique.

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43

Folch, A., A. Ayon, O. Hurtado, M. A. Schmidt, and M. Toner. "Molding of Deep Polydimethylsiloxane Microstructures for Microfluidics and Biological Applications." Journal of Biomechanical Engineering 121, no. 1 (February 1, 1999): 28–34. http://dx.doi.org/10.1115/1.2798038.

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Here we demonstrate the microfabrication of deep (>25 μm) polymeric microstructures created by replica-molding polydimethylsiloxane (PDMS) from microfabricated Si substrates. The use of PDMS structures in microfluidics and biological applications is discussed. We investigated the feasibility of two methods for the microfabrication of the Si molds: deep plasma etch of silicon-on-insulator (SOI) wafers and photolithographic patterning of a spin-coated photoplastic layer. Although the SOI wafers can be patterned at higher resolution, we found that the inexpensive photoplastic yields similar replication fidelity. The latter is mostly limited by the mechanical stability of the replicated PDMS structures. As an example, we demonstrate the selective delivery of different cell suspensions to specific locations of a tissue culture substrate resulting in micropatterns of attached cells.

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44

Chandrasekaran, Sharath, and Sriram Sundararajan. "Effect of microfabrication processes on surface roughness parameters of silicon surfaces." Surface and Coatings Technology 188-189 (November 2004): 581–87. http://dx.doi.org/10.1016/j.surfcoat.2004.07.015.

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Bale, M., and R. E. Palmer. "Microfabrication of silicon tip structures for multiple-probe scanning tunneling microscopy." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 20, no. 1 (2002): 364. http://dx.doi.org/10.1116/1.1447242.

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Smart, Wilson H., and Kumar Subramanian. "The Use of Silicon Microfabrication Technology in Painless Blood Glucose Monitoring." Diabetes Technology & Therapeutics 2, no. 4 (December 20, 2000): 549–59. http://dx.doi.org/10.1089/15209150050501961.

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Sabaté, N., J. P. Esquivel, J. Santander, J. G. Hauer, R. W. Verjulio, I. Gràcia, M. Salleras, et al. "New approach for batch microfabrication of silicon-based micro fuel cells." Microsystem Technologies 20, no. 2 (March 30, 2013): 341–48. http://dx.doi.org/10.1007/s00542-013-1781-4.

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Stephani, D., J. Eibl, D. W. Branston, and W. Bartsch. "Microfabrication of metal-coated silicon tips and their field emission properties." Microelectronic Engineering 13, no. 1-4 (March 1991): 505–8. http://dx.doi.org/10.1016/0167-9317(91)90142-z.

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Juodkazis, Kestutis, Jurga Juodkazytė, Putinas Kalinauskas, Titas Gertus, Edgaras Jelmakas, Hiroaki Misawa, and Saulius Juodkazis. "Influence of laser microfabrication on silicon electrochemical behavior in HF solution." Journal of Solid State Electrochemistry 14, no. 5 (May 12, 2009): 797–802. http://dx.doi.org/10.1007/s10008-009-0852-z.

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Shubin, Ivan, John E. Cunningham, Darko Popovic, Hiren Thacker, Xuezhe Zheng, Ying Luo, Jim Mitchell, et al. "Ferro-Electrically Enhanced Proximity Communication." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000084–92. http://dx.doi.org/10.4071/isom-2010-ta3-paper4.

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Abstract:

Capacitively-coupled communication between chips, commonly known as PxC, represents a new class of I-O signaling that offers substantially improved off-chip bandwidth density. However, this form of communication presents a challenge from a packaging perspective, since tight chip alignment tolerances are required to maintain high signal fidelity and avoid cross coupling between neighboring channels. To mitigate the packaging constraints, capacitive coupling between the communication pads can be enhanced with materials that have high dielectric coefficients. Here, ferroelectrics hold promise over contemporary low- and high-k dielectrics, however their processing conditions need to be better understood and the compatibility with CMOS circuitry has to be established during integration with a back end of the line process module. In this paper we present experimental results on microfabrication modules for various families of ferroelectrics when monolithically deposited on Silicon. Additionally, we report their associated dielectric properties as extracted by measured capacitance enhancements in our fabricated devices. In this work Strontium Titanate and Barium Strontium Titanate films are sputter deposited on platinum atop Silicon. Capacitive measurements were accomplished by microfabricating electrodes atop these structures in geometries that are size and shape dependant. Dielectric coefficients as high as 400 times that of air are measured.

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