Relevant bibliographies by topics / Silver Copper

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Silver Copper'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 February 2022

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Journal articles on the topic "Silver Copper"

1

Ciacotich, Nicole, Lasse Kvich, Nicholas Sanford, Joseph Wolcott, Thomas Bjarnsholt, and Lone Gram. "Copper-Silver Alloy Coated Door Handles as a Potential Antibacterial Strategy in Clinical Settings." Coatings 10, no. 8 (August 14, 2020): 790. http://dx.doi.org/10.3390/coatings10080790.

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Coating surfaces with a copper-silver alloy in clinical settings can be an alternative or complementary antibacterial strategy to other existing technologies and disinfection interventions. A newly developed copper-silver alloy coating has a high antibacterial efficacy against common pathogenic bacteria in laboratory setups, and the purpose of this study is to determine the antibacterial efficacy of this copper-silvery alloy in real-world clinical settings. Two field trials were carried out at a private clinic and a wound care center. Door handles coated with the copper-silver alloy had a lower total aerobic plate count (1.3 ± 0.4 Log CFU/cm2 and 0.8 ± 0.3 Log CFU/cm2, CFU stands for Colony Forming Units) than the reference uncoated material on-site (2.4 ± 0.4 Log CFU/cm2 for the stainless steel and 1.7 ± 0.4 Log CFU/cm2 for the satin brass). The copper-silver alloy did not selectively reduce specific bacterial species. This study points to the possibility of a successful long-term implementation of the copper-silver alloy coating as an antibacterial strategy.
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Chekman, I. S. "Pharmacological Properties of Metal (Silver, Copper, and Iron) Nanoparticles." Science and innovation 11, no. 1 (January 30, 2015): 67–71. http://dx.doi.org/10.15407/scine11.01.067.

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Muñoz-Rojas, David. "Silver-copper mixed oxides." Materials Today 14, no. 3 (March 2011): 119. http://dx.doi.org/10.1016/s1369-7021(11)70067-0.

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Savelyev, Yuri, Alexey Gonchar, Boris Movchan, Alexey Gornostay, Sergey Vozianov, Adel Rudenko, Rita Rozhnova, and Tamara Travinskaya. "Novel biologically active polyurethane materials containing silver and copper nanoparticles." Polymer journal 38, no. 3 (June 6, 2016): 255–60. http://dx.doi.org/10.15407/polymerj.38.03.255.

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Choi, Yeon-Uk, and Kenneth N. Han. "The Dissolution Behavior of Silver and Copper from Silver and Copper Alloys." Mineral Processing and Extractive Metallurgy Review 9, no. 1 (February 1, 1992): 43–60. http://dx.doi.org/10.1080/08827509208952693.

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Walraven, Nikolaj, Wiebe Pool, and Conrad Chapman. "The dosing accuracy of copper and silver ionisation systems: separate high purity copper and silver electrodes versus copper/silver alloys." Journal of Water Process Engineering 8 (December 2015): 119–25. http://dx.doi.org/10.1016/j.jwpe.2015.09.008.

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Xie, Xian, Kai Hou, Xiong Tong, Yong Cheng Zhou, and Xiang Wen Lv. "Recovery of Copper and Silver by Flotation from Smelting Copper Slags." Applied Mechanics and Materials 543-547 (March 2014): 3963–66. http://dx.doi.org/10.4028/www.scientific.net/amm.543-547.3963.

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The recovery of copper from smeltery furnace slag by flotation has been studied. By analysis the slag containing 1.61% copper and 27.80g/t silver is available to recovery. The effective factors such as particle size, the amount and type of collector were examined. The combination of the collectors was also examined. With the process utilized in this work, a copper concentrate of 26.47% Cu with a recovery of 78.85% is produced. The associated silver is mostly concentrated to the copper concentrate, and the silver recoveried in the copper concentrate is 97.57%.
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Ortega-Arizmendi, Aldo I., Eugenia Aldeco-Pérez, and Erick Cuevas-Yañez. "Alkyne-Azide Cycloaddition Catalyzed by Silver Chloride and “Abnormal” SilverN-Heterocyclic Carbene Complex." Scientific World Journal 2013 (2013): 1–8. http://dx.doi.org/10.1155/2013/186537.

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A library of 1,2,3-triazoles was synthesized from diverse alkynes and azides using catalytic amounts of silver chloride instead of copper compounds. In addition, a novel “abnormal” silverN-heterocyclic carbene complex was tested as catalyst in this process. The results suggest that the reaction requires only 0.5% of silver complex, affording 1,2,3-triazoles in good yields.
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Sun, Hong Peng, Kai Jun Wang, Xiao Lan Cai, Gang Yue, and Ya Guang Chen. "Preparation and Performance of Silver Coated Copper Powder." Advanced Materials Research 750-752 (August 2013): 1057–62. http://dx.doi.org/10.4028/www.scientific.net/amr.750-752.1057.

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Different parameters are used to characterize the conductivity of copper powder with silver plating. Ethanediamine（C2H8N2） is employed to adjust the pH value of plating solution (solution A), and chelate Cu2+ generated by side reaction, forming sound five-membered ring structure with Cu2+, thus preventing the formation of Cu(NH3)42+ which can avoid adsorption of Cu(NH3)42+ on the surface of copper powder. In this way silver-plated copper powder with conductivity equal to fine silver powder can be obtained, the effects of dosage of C2H8N2 and Tollens' reagent concentration on performance of silver-plated copper powder have also been investigated. The result shows that dosage of C2H8N2 has significant effects on electrical conductivity of silver-plated copper powder. The dosage of C2H8N2 should ensure that pH value of control solution A maintains 9.0~10.0. The concentration of Tollens' reagent should make sure that the generated silver-plated copper powder is most even and continuous and tightness when silver particles in form of heterogeneous nucleation is surrounded on the surface of copper powder, , and the optimum concentration is 0.09mol/L. The conductivity of silver-plated copper powder made by Tollens' reagent with 0.09mol/L concentration is optimal, which is 3.9×10-4Ω•cm,when adjusting the pH value of solution A to 9.5 by C2H8N2 control.
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Zhu, Xiao Yun, Lie Hu, and Man Dong. "Synthesis and Characterization of Silver-Coated Copper Powder Layer." Key Engineering Materials 512-515 (June 2012): 141–46. http://dx.doi.org/10.4028/www.scientific.net/kem.512-515.141.

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This paper presents the process of preparing spherical silver-coated copper powder with a silver content of 30-50%, using chemical reduction and by adjusting the silver-coating process. By means of SEM, XRD, grain size analyser, digital ohmmeter and differential thermal analyser, the surface topology, structure and conductivity of silver-coated copper powder and raw copper powder are characterised. The results show that the spherical silver-coated copper powder has superior compact surface, complete coverage, a coated layer reaching a thickness of 336nm and excellent conductivity and anti-oxidation property.
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Dissertations / Theses on the topic "Silver Copper"

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Torres, Urquidy Oscar Hernando. "Copper Resistant Bacteria Better Tolerate Commercially Available Antimicrobial Treatments Based in Silver and Silver-Copper Ions." Diss., The University of Arizona, 2011. http://hdl.handle.net/10150/202734.

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In the current study, the antibacterial efficacy of zeolites containing silver or copper ions or a combination of these metals was assessed against several diverse copper resistant (CuR) and copper sensitive (CuS) strains of clinically relevant bacterial species. CuR Pseudomonas putida was significantly reduced in comparison to the unamended zeolite control. Unexpectedly, a CuS P. putida strain with no reported metal resistance appeared to be more resistant to the zeolite containing either Ag or Ag/Cu than the CuR strain. Contrary to expectations, after three and six hours of exposure, the CuS Escherichia coli displayed significantly more resistance to the Ag/Cu and Cu treatments than the reportedly CuR E. coli. All three reportedly CuR strains of Salmonella enterica exhibited resistance to Cu and Ag, as well as to the combination of the two metals after three and six hours of exposure. The reductions observed after 24 hours for all three CuR strains with Cu alone were still statistically significant compared to that of the CuS S. enterica strain. In addition, two of the CuR strains were more resistant to silver after 24 hours of exposure, suggesting a shared resistance mechanism such a copper efflux pump that also removes silver ions from the cell. Both the CuR and CuS strains of E. faecium were highly resistant to all of the treatments. In general, after comparison of all the resistances with all the treatments, E. faecium was the most resistant species, P. putida was the least resistant species, and the Salmonella strains were more resistant than E. coli in most cases.
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Speed, David John. "Symmetry in copper and silver cryptates." Thesis, Open University, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.252338.

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The cryptand ligands imBT (l,4,7,10,13,16,21,24-0ctaaza-bicyclo[8.8.8]hexacosa- 4,6,13,15,21,23-hexaene) and amBT (1,4,7,10,13,16,21 ,24-0ctaazabicyc10[ 8.8.8]hexacosane) form interesting disilver(I) and trisilver(I) cryptates, as well as a dicopper(I) and a well studied average valence dicopper(1.5) cryptate. Detailed structural and spectroscopic studies of the silver cryptates show that complex equilibria exist in solution, and the trisilver form appears to be thermodynamically favoured, the additional stabilisation apparently being due to argentophilic interactions. An optically pure form of the dicopper(I) imBT cryptate was successfully obtained, and is undergoing X-ray diffraction studies aimed at determining whether a copper-copper interaction exists, by direct examination of the electron density. Synthetic studies aimed at introducing substitution to the imBT and amBT ligands were complicated by competing reactions. A strategy to modify cryptand cavity size by incorporating asymmetric tetraamine caps succeeded, yielding dicopper(I) and disilver(I) cryptates with properties intermediate between cryptates incorporating the related symmetric caps. Manganese(II) cryptates of imBT and amBT were investigated as potential MRl contrast agents, the iminocryptate showing surprisingly high relaxivity, despite the fact that no water molecules were located in the crystal structure. The observation of high mass peaks in the FAB mass spectra ofimBT and amBT cryptates suggests the presence of 6+4 Schiff base condensation products, as well as the more abundant 3+2 products. It has not proved possible to isolate these molecules as yet, however initial studies aimed at a rational synthesis of the 6+4 condensation products were made, as these ligands could be of great interest for modelling the recently reported CUz site.
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Westlake, Michael Angelo 1966. "The oxidation of copper and silver plated copper lead frames." Thesis, The University of Arizona, 1993. http://hdl.handle.net/10150/278279.

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The effects of thin silver films (15-210 angstroms) on the oxidation of copper alloy lead frames has been characterized. Silver films were deposited onto copper lead frames by immersion plating in a bath containing potassium silver cyanide, potassium cyanide, and a mercaptan inhibitor. The thickness of films was measured by microfocus x-ray fluorescence and cross-checked by Rutherford backscattering spectrometry. Lead frames coated with silver films were oxidized at 150 to 200°C in a controlled humidity oven. The amount of oxide formed was measured by an electrolytic reduction technique and cross-checked with weight gain measurements. Auger, ESCA, and SEM analysis were also performed on the films. A tape test was performed to obtain qualitative information on the adhesion of the films.
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Botez, Cristian E. "Synchrotron x-ray scattering studies of metallic surfaces /." free to MU campus, to others for purchase, 2002. http://wwwlib.umi.com/cr/mo/fullcit?p3052151.

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Mardani, Shabnam. "Copper and Silver Metallization for High Temperature Applications." Doctoral thesis, Uppsala universitet, Fasta tillståndets elektronik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-300796.

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High-temperature electrical- and morphological-stability of interconnect is critical for electronic systems based on wide band gap (WBG) semiconductors. In this context, the thermal stability of both Ag and Cu films with Ta and TaN films as diffusion barriers and/or surface-capping layers at high temperatures up to 800 oC is investigated in this thesis. The investigation of un-capped Ag films with either Ta or TaN diffusion barrier layers shows electrical stability upon annealing up to 600 °C. Degradation occurs above 600 °C mainly as a result of void formation and Ag agglomeration. Sandwiching Ag films between Ta and/or TaN layers is found to electrically and morphologically stabilize the Ag metallization up to 800 °C. The barrier layer plays a key role; the β-to-α phase transition in the underlying Ta barrier layer is identified as the major cause for the morphological instability of the film above 600 °C. This phase transition can be avoided using a stacked Ta/TaN barrier. Furthermore, no observable Ta diffusion in Ag films is found. Copper films with a Ta diffusion barrier show clearly different behaviors. In the Cu/Ta sample, Ta starts to diffuse up to the surface via fast-diffusing grain boundaries (GBs) after annealing at 500 °C. The activation energy for the GB diffusion is 1.0+0.3 eV. Un-capped Cu is electrically stable up to 800 °C. An appreciable increase in sheet resistance occurs above 600 °C for the asymmetric combinations Ta/Cu/TaN and TaN/Cu/Ta. This degradation is closely related to a substantial diffusion of Ta across the Cu film and on to the TaN layer, where Ta1+xN forms. The symmetrical combinations Ta/Cu/Ta and TaN/Cu/TaN show only small changes in sheet resistance even after annealing at 800 °C. No Ta diffusion can be found in the Ta/Cu/Ta and TaN/Cu/TaN stacks. Finally, the influence of barrier and cap, their interfaces to Cu and Ta diffusion and segregation in the Cu GBs on electromigration is studied. Our preliminary results with the TaN/Cu/Ta and TaN/Cu/TaN structures report a 2-fold higher activation energy and a 10-fold longer lifetime for the former, thus confirming an important role of the interface between Cu and the cap and/or barrier.
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馮潔媚 and Kit-mai Wendy Fung. "Luminescent polynuclear copper(I) and silver(I) complexes of bridging acetylides and related studies on copper(I) thiolates." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 1997. http://hub.hku.hk/bib/B3123687X.

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Fung, Kit-mai Wendy. "Luminescent polynuclear copper(I) and silver(I) complexes of bridging acetylides and related studies on copper(I) thiolates /." Hong Kong : University of Hong Kong, 1997. http://sunzi.lib.hku.hk/hkuto/record.jsp?B19102665.

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Lamontagne, Marc Philip. "The effect of impurities on the distribution of silver between copper and copper selenide." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1996. http://www.collectionscanada.ca/obj/s4/f2/dsk3/ftp04/nq20567.pdf.

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Schwaiger, Ruth. "Fatigue behavior of sub-micron silver and copper films." Stuttgart : Max-Planck-Inst. für Metallforschung, 2002. http://deposit.ddb.de/cgi-bin/dokserv?idn=964216345.

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Schwaiger, Ruth. "Fatigue behavior of sub-micron silver and copper films." [S.l. : s.n.], 2001. http://www.bsz-bw.de/cgi-bin/xvms.cgi?SWB9803839.

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Books on the topic "Silver Copper"

1

Powell, Ada. Copper, green, and silver. [Montana?]: A. Powell, 1993.

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Kaunda, Francis. Selling the family silver. [Lusaka]: F. Kaunda, 2002.

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Gunther, Thomas. The potential supply of minerals from undiscovered copper-silver deposits in the Kootenai National Forest. Washington, D.C: U.S. Dept. of the Interior, Bureau of Mines, 1990.

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Gunther, Thomas. The potential supply of minerals from undiscovered copper-silver deposits in the Kootenai National Forest. Washington, D.C: U.S. Dept. of the Interior, Bureau of Mines, 1990.

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Gunther, Thomas. The potential supply of minerals from undiscovered copper-silver deposits in the Kootenai National Forest. Washington, D.C: U.S. Dept. of the Interior, Bureau of Mines, 1990.

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Lee, Andrew Walther. Evolution of the Rosario copper-molybdenum porphyry deposit and associated copper-silver vein system, Collahuasi District. Ann Arbor, MI: [UMI Dissertation Services, 1993.

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Huston, David L. The nature and possible significance of the Batamote copper-bismuth-silver anomaly, Pima County, Arizona. Denver, CO: U.S. Geological Survey, Branch of Central Technical Reports, 1990.

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Huston, David L. The nature and possible significance of the Batamote copper-bismuth-silver anomaly, Pima County, Arizona. Washington: U.S. G.P.O., 1991.

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Kin, gin, dō no Nihon shi. Tōkyō: Iwanami Shoten, 2007.

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Lei, K. P. V. Silver-catalyzed oxidative leaching of an arsenical copper sulfide concentrate. Avondale, Md (4900 LaSalle Rd., Avondale 20782): U.S. Dept. of the Interior, Bureau of Mines, 1987.

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Book chapters on the topic "Silver Copper"

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Franke, P., and D. Neuschütz. "Ag-Cu (Silver - Copper)." In Binary Systems. Part 5: Binary Systems Supplement 1, 1–3. Berlin, Heidelberg: Springer Berlin Heidelberg, 2007. http://dx.doi.org/10.1007/978-3-540-45280-5_11.

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Predel, B. "Ag-Cu (Silver - Copper)." In Ac-Ag ... Au-Zr, 1–4. Berlin, Heidelberg: Springer Berlin Heidelberg, 2006. http://dx.doi.org/10.1007/10793176_26.

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McEvoy, Megan M., and Alayna M. George Thompson. "CusCFBA Copper/Silver Efflux System." In Encyclopedia of Metalloproteins, 744–48. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-1533-6_527.

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Hashmi, A. Stephen K. "A Critical Comparison: Copper, Silver, and Gold." In Silver in Organic Chemistry, 357–79. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470597521.ch12.

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Bowen, H. J. M. "The Cycles of Copper, Silver and Gold." In The Natural Environment and the Biogeochemical Cycles, 1–27. Berlin, Heidelberg: Springer Berlin Heidelberg, 1985. http://dx.doi.org/10.1007/978-3-540-39209-5_1.

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Feng, Dawei, and Pekka Taskinen. "Silver Selenide Thermodynamics for Copper Anode Slime Refining." In REWAS 2013, 133–39. Cham: Springer International Publishing, 2013. http://dx.doi.org/10.1007/978-3-319-48763-2_14.

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Duhamel, Cécilie, Jean-Louis Bonnentien, Michael Walls, Martin Hÿtch, and Yannik Champion. "Synthesis and Processing of Silver Doped Copper Nanopowders." In Nano-Architectured and Nanostructured Materials, 38–45. Weinheim, FRG: Wiley-VCH Verlag GmbH & Co. KGaA, 2005. http://dx.doi.org/10.1002/3527606017.ch6.

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Liu, Wei, and Qionghua Zhou. "Synthesis of Silver Plating Nano-copper Bimetallic Powders." In Supplemental Proceedings, 539–46. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9781118062111.ch61.

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Feng, Dawei, and Pekka Taskinen. "Silver Selenide Thermodynamics for Copper Anode Slime Refining." In REWAS 2013, 133–39. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118679401.ch14.

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Roundhill, D. Max. "Phase Transfer Extraction of Copper, Silver and Gold." In Extraction of Metals from Soils and Waters, 163–92. Boston, MA: Springer US, 2001. http://dx.doi.org/10.1007/978-1-4757-5204-5_8.

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Conference papers on the topic "Silver Copper"

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Manoharan, Subramani, Chandradip Patel, and Patrick McCluskey. "Advancements in Silver Wire Bonding." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74286.

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Silver is a leading competitor to gold and copper in fine pitch wire bonding used in the interconnection of microelectronic devices. Primary material for wire bonding has been gold, which gave way to copper in order for original equipment manufacturers to realize cost benefits. However, copper wire bonding has exhibited several reliability issues, especially in industrial and high temperature applications. Corrosion is the major problem, which was mitigated by coating the wire with palladium, which increased overall cost of production. Other concerns include harder free air ball (FAB) leading to under pad metallization cracking, smaller process window, excessive aluminum splash especially in fine pitch bonding, and lower throughput and yield arising from the hardness and stiffness of copper. Due to the above concerns, automotive, military and aerospace industries are still reluctant to fully adopt copper wire bonding. Light emitting diodes (LEDs) are also not manufactured with copper wires due to its low reflectance. Some of these industries are still using gold wire bonds in most of their packages, but are continually looking for an alternative. Silver wire bonds have good electrical and thermal conductivity, are less prone to corrosion than copper, have low melting points and comparable hardness to gold. Also, cost of silver has been shown to be similar to that of palladium coated copper wire, hence making it a good alternative. Silver wire bonding, a relatively new area of research, has attracted a lot of research focused on wire dopant material, bonding process, quality and reliability. This paper is aimed to serve as a comprehensive review of research done in this area, by summarizing the literature on silver wire bonding, establishing benefits and drawbacks over other wire bond materials and indicating reliability concerns along with failure modes and mechanisms.
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Suzuki, Satoshi, and Mamiko Yamaguchi. "Acid Decapsulation for Silver Wire Bonded Package." In ISTFA 2015. ASM International, 2015. http://dx.doi.org/10.31399/asm.cp.istfa2015p0436.

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Abstract Decap methods which have been used for copper wire packages are not effective for silver wire packages, and the authors recognized the need for the development of a novel method. This paper discusses the development of various processes to decap silver wire packages with acid. The first decap method developed for a silver wire package was to add hydrochloric acid to fuming nitric acid. This method proved insufficient to prevent silver wire from dissolving when solution temperature is 60 degree. The authors then developed the Saturation Etch method for decapsulating silver wire packages using a chemical solution. When dissolution amount of silver wire put in normal fuming HNO3 is defined as 100%, the authors were able to achieve its reduction to less than 3% by using saturated acid. This method is also effective for copper wire packages, and damages to wires can be minimized by dissolving copper into acid.
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Chen, Yi-Ling, and Chin C. Lee. "Strength of solid-state silver bonding between copper." In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575815.

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Hashimoto, Yoshikazu, Yoshiaki Nishijima, Gediminas Seniutinas, Lorenzo Rosa, and Saulius Juodkazis. "Optical constants of gold-silver-copper alloy system." In JSAP-OSA Joint Symposia. Washington, D.C.: OSA, 2014. http://dx.doi.org/10.1364/jsap.2014.19p_c3_13.

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Fujino, Masahisa, Kentaro Abe, and Tadatomo Suga. "Plasma assisted bonding of copper and silver substrates." In 2014 International Conference on Electronics Packaging (ICEP). IEEE, 2014. http://dx.doi.org/10.1109/icep.2014.6826760.

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Jacob, Kyle, Shama Barna, and Placid M. Ferreira. "Solid-State Electrochemical Nanopatterning of Silver and Copper." In 4M/IWMF2016 The Global Conference on Micro Manufacture : Incorporating the 11th International Conference on Multi-Material Micro Manufacture (4M) and the 10th International Workshop on Microfactories (IWMF). Singapore: Research Publishing Services, 2016. http://dx.doi.org/10.3850/978-981-11-0749-8_kn2.

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Gotzmann, Gaby. "Silver/Copper-mixed Layers as Antimicrobial Surface Coating." In 60th Society of Vacuum Coaters Annual Technical Conference. Society of Vacuum Coaters, 2018. http://dx.doi.org/10.14332/svc17.proc.42887.

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Chen, Yi-Ling, Yuan-Yun Wu, and Chin C. Lee. "Silver-assisted copper wire bonding using solid-state processes." In 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). IEEE, 2014. http://dx.doi.org/10.1109/ectc.2014.6897497.

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Zhou, Wei, Zhen Zheng, and Chunqing Wang. "Single crystal copper nanocrystallization and sintered with silver nanoparticles." In 2016 17th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2016. http://dx.doi.org/10.1109/icept.2016.7583299.

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Murayama, Kei, Hiroko Ota, and Kiyoshi Oi. "Thermal Characteristic Evaluation of Silver and Copper Sintering Materials." In 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC). IEEE, 2019. http://dx.doi.org/10.1109/eptc47984.2019.9026702.

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Reports on the topic "Silver Copper"

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Kirkham, R. V., and W. D. Sinclair. Porphyry copper, gold, molybdenum, tungsten, tin, silver. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208014.

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Wheeling, Rebecca. Evaluating MetGlasTM Solderability with Tin-Silver-Copper and Tin-Silver-Bismuth Solder Alloys. Office of Scientific and Technical Information (OSTI), May 2020. http://dx.doi.org/10.2172/1763529.

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Gandhi, S. S., and R. T. Bell. Kiruna/Olympic dam-type iron, copper, uranium, gold, silver. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208028.

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Kichukova, Diana, Daniela Kovacheva, Anna Staneva, and Ivanka Spassova. Аntimicrobial Impact of Nanocomposites of Reduced Graphene Oxide with Silver and Copper. "Prof. Marin Drinov" Publishing House of Bulgarian Academy of Sciences, February 2021. http://dx.doi.org/10.7546/crabs.2021.02.04.

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Laibinis, Paul E., and George M. Whitesides. Omega-Terminated Alkanethiolate Monolayers on Surfaces of Copper, Silver and Gold Have Similar Wettabilities. Fort Belvoir, VA: Defense Technical Information Center, December 1991. http://dx.doi.org/10.21236/ada243529.

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Veblen, D. R., and E. S. Ilton. HRTEM/AEM and SEM study of fluid-rock interactions: Interaction of copper, silver, selenium, chromium, and cadmium-bearing solutions with geological materials at near surface conditions, with an emphasis on phyllosilicates. Office of Scientific and Technical Information (OSTI), May 1992. http://dx.doi.org/10.2172/7075474.

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The nature and possible significance of the Batamote copper-bismuth-silver anomaly, Pima County, Arizona. US Geological Survey, 1990. http://dx.doi.org/10.3133/b1907.

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Resource appraisal map for stratabound copper-silver deposits in the Wallace 1 degree by 2 degrees Quadrangle, Montana and Idaho. US Geological Survey, 1986. http://dx.doi.org/10.3133/i1509f.

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Maps showing mineral resource assessment for copper and molybdenum in porphyry and stockwork deposits and for tungsten, iron, gold, copper, and silver in skarn deposits, Dillion 1 degree by 2 degrees Quadrangle, Idaho and Montana. US Geological Survey, 1992. http://dx.doi.org/10.3133/i1803g.

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Maps showing the distribution of barium, beryllium, copper, lead, molybdenum, silver, and tin in stream-sediment samples, Delta 1 degree by 2 degrees Quadrangle, Utah. US Geological Survey, 1993. http://dx.doi.org/10.3133/mf2081c.

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