Relevant bibliographies by topics / Silver-copper alloy

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Silver-copper alloy'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Silver-copper alloy.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Silver-copper alloy"

1

Strohmeier, Brian R. "Copper/Silver/Gold Alloy by XPS." Surface Science Spectra 3, no. 3 (1994): 175–81. http://dx.doi.org/10.1116/1.1247744.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Ciacotich, Nicole, Lasse Kvich, Nicholas Sanford, Joseph Wolcott, Thomas Bjarnsholt, and Lone Gram. "Copper-Silver Alloy Coated Door Handles as a Potential Antibacterial Strategy in Clinical Settings." Coatings 10, no. 8 (2020): 790. http://dx.doi.org/10.3390/coatings10080790.

Full text
Abstract:
Coating surfaces with a copper-silver alloy in clinical settings can be an alternative or complementary antibacterial strategy to other existing technologies and disinfection interventions. A newly developed copper-silver alloy coating has a high antibacterial efficacy against common pathogenic bacteria in laboratory setups, and the purpose of this study is to determine the antibacterial efficacy of this copper-silvery alloy in real-world clinical settings. Two field trials were carried out at a private clinic and a wound care center. Door handles coated with the copper-silver alloy had a lower total aerobic plate count (1.3 ± 0.4 Log CFU/cm2 and 0.8 ± 0.3 Log CFU/cm2, CFU stands for Colony Forming Units) than the reference uncoated material on-site (2.4 ± 0.4 Log CFU/cm2 for the stainless steel and 1.7 ± 0.4 Log CFU/cm2 for the satin brass). The copper-silver alloy did not selectively reduce specific bacterial species. This study points to the possibility of a successful long-term implementation of the copper-silver alloy coating as an antibacterial strategy.
APA, Harvard, Vancouver, ISO, and other styles
3

Bronner, S. W., and P. Wynblatt. "Surface segregation in a dilute copper–silver alloy." Journal of Materials Research 1, no. 5 (1986): 646–51. http://dx.doi.org/10.1557/jmr.1986.0646.

Full text
Abstract:
The equilibrium surface composition of a Cu-0.83 at. % Ag alloy has been studied over the range from 600°–400°C. Above 450°C the alloy consists of a single phase, whereas below that temperature the material separates into copper-rich and silver-rich phases. The kinetics of equilibration appear to be controlled by grain boundary diffusion, leading to more rapid equilibration than expected on the basis of lattice diffusion-controlled kinetics. In the single-phase regime, silver segregates to the surface with an average enthalpy of segregation of −24 kJ/mol and an entropy of segregation of 0.94 J/mol K, and displays a trend of increasing equilibrium silver surface concentration with decreasing temperature. Theoretical estimates of the enthalpy of segregation yield the somewhat more negative values of −60 and −47 kJ/mol, respectively. In the two-phase regime, the surface continues to be enriched in silver, but the silver surface concentration decreases with decreasing temperature as a result of the rapidly decreasing equilibrium solubility of silver in copper.
APA, Harvard, Vancouver, ISO, and other styles
4

Hampshire, Bethany, Kevin Butcher, Katsu Ishida, George Green, Don Paul, and Adrian Hillier. "Using Negative Muons as a Probe for Depth Profiling Silver Roman Coinage." Heritage 2, no. 1 (2019): 400–407. http://dx.doi.org/10.3390/heritage2010028.

Full text
Abstract:
Debasement of silver Roman coins is a well-known phenomenon and understanding the quality of ancient silver coinages can provide an idea about the underlying fiscal condition of the issuing states. These coins are made from a silver-copper alloy, the surfaces of which were deliberately enhanced at the mints by a process of surface-enrichment to give them the appearance of being made of pure silver. Therefore, any surface analysis would provide a composition of the silver-copper alloy that would not be representative of the original alloy from which the coin blank was made; the result would be too high in silver. However, the bulk of the sample, the interior, should provide a composition that is true to the original alloy. Elemental analysis using negative muons has been used to provide a depth dependent compositional, completely non-destructive analysis of a silver-copper alloy denarius of the empress Julia Domna datable to 211–217 CE. The composition of the coin, beyond the surface enrichment layer, is 51 ± 1.8 % copper and 49 ± 1.9% silver, taken at a muon depth of 402 ± 61 µm. The surface enrichment layer is approximately 190 µm thick.
APA, Harvard, Vancouver, ISO, and other styles
5

Knight, J. M., R. K. Wells, and J. P. S. Badyal. "Plasma oxidation of copper-silver alloy surfaces." Chemistry of Materials 4, no. 3 (1992): 640–41. http://dx.doi.org/10.1021/cm00021a026.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Lin, C. H., and W. K. Leau. "Copper-Silver Alloy for Advanced Barrierless Metallization." Journal of Electronic Materials 38, no. 11 (2009): 2212–21. http://dx.doi.org/10.1007/s11664-009-0904-2.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Iliev, Ilian, Ivelin Kuleff, Jörg Adam, and Ernst Pernicka. "Electrochemical lead separation from copper, copper alloy, silver and silver alloy for isotope ratio determination in archaeometric investigations." Analytica Chimica Acta 497, no. 1-2 (2003): 227–33. http://dx.doi.org/10.1016/j.aca.2003.07.008.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Aamir, Muhammad, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin, and Vadim V. Silberschmidt. "A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics." Soldering & Surface Mount Technology 32, no. 2 (2019): 115–26. http://dx.doi.org/10.1108/ssmt-11-2018-0046.

Full text
Abstract:
Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.
APA, Harvard, Vancouver, ISO, and other styles
9

Rudnik, Ewa, Iwona Dobosz, Krzysztof Fitzner, and Zbigniew Miazga. "Hydrometallurgical Treatment of Smelted Low-Grade WEEE in Ammoniacal Solutions." Key Engineering Materials 682 (February 2016): 293–98. http://dx.doi.org/10.4028/www.scientific.net/kem.682.293.

Full text
Abstract:
Hydrometallurgical routes of copper recovery from smelted low-grade e-waste are presented. Electronic scrap was smelted to produce Cu–Zn–Ag-Sn alloys of various phase compositions. The alloys were then treated in the following ways: (a) anodic dissolution with simultaneous metal electrodeposition using ammoniacal solutions with various ammonium salts (chloride, carbonate, sulfate). This resulted in the separation of metals, where lead, silver and tin accumulated mainly in the slimes, while copper was transferred to the slime, electrolyte and then recovered on the cathode. (b) leaching in ammoniacal solutions of various compositions and then copper electrowinning. Alloy was leached in chloride, carbonate, sulfate and thiosulfate baths. This resulted in the separation of the metals, wherein copper and zinc were transferred to the electrolyte, while metallic tin and silver as well as lead remained in the slimes. Copper was selectively recovered from the ammoniacal solutions by the electrolysis, leaving zinc ions in the electrolyte. The best conditions of the alloy treatment were obtained, where the final product was copper of high purity (99.9%) at the current efficiency of 60%. Thiosulfate solution was not applicable for the leaching of the copper alloy due to secondary reactions of the formation of copper(I) thiosulfate complexes and precipitation of copper(I) sulfide.
APA, Harvard, Vancouver, ISO, and other styles
10

Wang, Yaoli, Kexing Song, Jilin He, et al. "Abnormal structure and properties of copper–silver bar billet by cold casting." REVIEWS ON ADVANCED MATERIALS SCIENCE 60, no. 1 (2021): 591–98. http://dx.doi.org/10.1515/rams-2021-0038.

Full text
Abstract:
Abstract Copper alloy rod billet with 20% silver was prepared using homemade three-chamber vacuum cold-type vertical continuous casting equipment. The variation rules of the microhardness, eutectic ratio, and size and distribution of silver particles precipitated in the primary α-Cu phase at the end of the continuous casting alloy rod blanks were studied using a microhardness tester and scanning electron microscope. The obtained results show that when the cold-type vertical continuous casting speed is 120 mm·min−1, there is obvious reverse segregation of solute element near the end of the prepared ∅7.8 mm copper–silver alloy rod blank. From the end of the continuous casting alloy rod blank to 5 mm from the end, the Cu–Ag eutectic structure in the copper–silver alloy increases from 13.4 to 15.9%, and the size of Ag particles precipitated in the primary α-Cu phase increases from 100 to 350 nm. The microhardness increases from 56 HV0.05 to 85 HV0.05. When the distance from the end exceeds 5 mm, the microstructure and properties of the continuous casting alloy rod blank are basically stable.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Silver-copper alloy"

1

Unsworth, Paul. "Spectroscopic studies of metal alloys and semiconductor interfaces." Thesis, University of Liverpool, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.343647.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Demange, Gilles. "Mise en oeuvre d'une approche multi-échelles fondée sur le champ de phase pour caractériser la microstructure des matériaux irradiés : application à l'alliage AgCu." Thesis, Université Paris-Saclay (ComUE), 2015. http://www.theses.fr/2015ECAP0048/document.

Full text
Abstract:
Anticiper l’évolution de la microstructure d’un matériau en condition d’usage est d’une importance cruciale pour l’industrie. Cette maîtrise du vieillissement nécessite une compréhension claire des mécanismes sous-jacents, qui agissent sur une large gamme d’échelles spatiales et temporelles. Dans cette optique, ce travail de thèse a choisi d’appliquer la méthode de champ de phase qui, en raison du saut d’échelle qu’elle réalise naturellement, est un outil intensivement employé dans le domaine des matériaux, pour prédire l’évolution en temps long de la microstructure. L’enjeu de l’étude a été d’étendre cette méthode à un système porté loin de l’équilibre thermodynamique, en particulier en présence d’irradiation. Nous avons ainsi adopté le formalisme du mélange ionique, introduit par Gras-Marti pour décrire le mélange balistique au sein d’une cascade de déplacements. Par l’utilisation conjointe d’un schéma numérique et d’une approche analytique, il nous a été possible d’établir le diagramme de phase générique d’un matériau irradié. Nous avons ensuite étudié le vieillissement de l’alliage binaire test AgCu sous irradiation, par l’utilisation conjointe de la méthode du champ de phase et d’approches atomistiques, dans une démarche multi-échelles. En fixant les paramètres de contrôle que sont le flux d’irradiation et la température, il nous a ainsi été possible de prédire la taille,la concentration ainsi que la distribution spatiale des nodules de cuivre produits sous irradiation dans cet alliage. La connaissance de ces informations a permis de simuler un diagramme de diffraction en incidence rasante, directement comparable aux diagrammes expérimentaux
It is of dramatic matter for industry to be able to predict the evolution of material microstructure under working conditions. This requires a clear understanding of the underlying mechanisms, which act on numerous space and time scales. Because it intrinsically performs a scale jump, we chose to use a phase field approach, which is widely used amidst the condensed matter community to study the aging of materials. The first challenge of this work was to extend this formalism beyond its thermodynamic scope and embrace the case of far from equilibrium systems when subjected to irradiation. For that purpose, we adopted the model of ion mixing, developed by Gras Marti to account for ballistic exchanges within a displacements cascade. Based on a numerical scheme and ananalytical method, we were able to describe the generic microstructure signature for materials under irradiation.We then applied this formalism to the particular case of the immiscible binary alloy AgCu.With the joined use of the phase field approach and atomistic methods, we managed to predict how the temperature and the irradiation flux tailor the main microstructure features such as the size, the concentration and the distribution of copper precipitates. This eventually allowed us to simulate a diffraction pattern in grazing incidence, which is directly comparable to experimental ones
APA, Harvard, Vancouver, ISO, and other styles
3

Athavale, Saurabh. "Effect of Cu concentration and cooling rate on microstructure of Sn-3.9Ag-XCu." Diss., Online access via UMI:, 2006.

APA, Harvard, Vancouver, ISO, and other styles
4

Benedict, Michael Scott. "Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints." Diss., Online access via UMI:, 2007.

APA, Harvard, Vancouver, ISO, and other styles
5

ISHII, HENRIQUE A. "Elaboracao de ligas Ag-Sn-Cu para amalgama dentario por moagem de alta energia." reponame:Repositório Institucional do IPEN, 2003. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11101.

Full text
Abstract:
Made available in DSpace on 2014-10-09T12:48:21Z (GMT). No. of bitstreams: 0
Made available in DSpace on 2014-10-09T13:57:22Z (GMT). No. of bitstreams: 1 08713.pdf: 6496941 bytes, checksum: 5803cb14028b4639afbb59fbc4cfa0d0 (MD5)
Tese (Doutoramento)
IPEN/T
Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
APA, Harvard, Vancouver, ISO, and other styles
6

Kinyanjui, Robert. "Thermal processes and solidification kinetics of evolution of the microstructure of Sn-xAg-yCu solder alloys." Diss., Online access via UMI:, 2005.

Abstract:
Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Multidisciplinary Program in Materials Science and Engineering, 2005.
Includes bibliographical references.
APA, Harvard, Vancouver, ISO, and other styles
7

Ke, Xing. "Atomistic Simulation Studies Of Grain-Boundary Segregation And Strengthening Mechanisms In Nanocrystalline Nanotwinned Silver-Copper Alloys." ScholarWorks @ UVM, 2019. https://scholarworks.uvm.edu/graddis/995.

Full text
Abstract:
Silver (Ag) is a precious metal with a low stacking fault energy that is known to form copious nanoscale coherent twin boundaries during magnetron sputtering synthesis. Nanotwinned Ag metals are potentially attractive for creating new interface-dominated nanomaterials with unprecedented mechanical and physical properties. Grain-boundary segregation of solute elements has been found to increase the stability of interfaces and hardness of nanocrystalline metals. However, heavily alloying inevitably complicates the underlying deformation mechanisms due to the hardening effects of solutes, or a change of stacking fault energies in Ag caused by alloying. For the above reasons, we developed a microalloying (or doping) strategy by carefully selecting Cu as the primary impurity – a solute that is predicted to have no solid-solution strengthening effect in Ag when its content is below 3.0 wt.%. Neither will Cu affect the stacking fault energy of Ag at a concentration <1.0 wt.%. Moreover, Cu atoms are ~12% smaller than Ag ones, and Ag-Cu is an immiscible system, which facilitates the segregation of Cu into high-energy interface sites such as grain-boundaries and twin-boundary defects. In this thesis, large-scale hybrid Monte-Carlo and molecular dynamics simulations are used to study the unexplored mechanical behavior of Cu-segregated nanocrystalline nanotwinned Ag. First, the small-scale mechanics of solute Cu segregation and its effects on incipient plasticity mechanisms in nanotwinned Ag were studied. It was found that solute Cu atoms are segregated concurrently to grain boundaries and intrinsic twin-boundary kink-step defects. Low segregated Cu contents (< 1 at.%) are found to substantially increase twin-defect stability, leading to a pronounced rise in yield strength at 300 K. Second, atomistic simulations with a constant grain size of 45 nm and a wide range of twin boundary spacings were performed to investigate the Hall-Petch strength limit in nanocrystalline nanotwinned Ag containing either perfect or kinked twin boundaries. Three distinct strength regions were discovered as twin boundary decreases, delineated by normal Hall-Petch strengthening with a positive slope, the grain-boundary-dictated mechanism with near-zero Hall-Petch slope, and twin-boundary defect induced softening mechanism with a negative Hall-Petch slope. Third, by systematically studying smaller grain sizes, we find that the “strongest” size for pure nanotwinned Ag is achieved for a grain size of ~16 nm, below which softening occurs. The controlling plastic deformation mechanism changes from dislocation nucleation to grain boundary motion. This transition decreases to smaller grain sizes when Cu contents are segregated to the interfaces. Our simulations show that continuous Hall-Petch strengthening without softening, down to grain sizes as small as 6 nm, is reached when adding Cu atoms up to 12 at. %. For Cu contents ≥ 15 at. %, however, the predominant plastic deformation mechanism changes to shear-band induced softening. The present thesis provides new fundamental insights into solute segregation, and strengthening mechanisms mediated by grain boundaries and twin boundaries in face-centered cubic Ag metals, which is expected to motivate experimental studies on new nanotwinned metals with superior mechanical properties controlled by microalloying.
APA, Harvard, Vancouver, ISO, and other styles
8

Taylor, Shannon L. S. B. Massachusetts Institute of Technology. "An investigation of the mechanical and physical properties of copper-silver alloys and the use of these alloys in Pre-Columbian America." Thesis, Massachusetts Institute of Technology, 2013. http://hdl.handle.net/1721.1/80903.

Full text
Abstract:
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2013.
This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
"June 2013." Cataloged from student-submitted PDF version of thesis.
Includes bibliographical references (p. 94-96).
In both the Andean zone of South America and in Mesoamerica, copper-silver alloys were important in the production of thin, silver-colored sheet metal artifacts. This thesis examines the mechanical and physical properties of the copper-silver alloy system that are important to understanding why copper-silver alloys became central to the metallurgies that developed among prehistoric societies of the Andean zone and Western Mexico. These properties include their range of malleability, the microstructures behind their toughness, and the recrystallization and annealing behaviors that led to their development of silver-enriched surfaces. To determine these properties, a series of cold rolling, cold hammering, and annealing experiments were performed on five Cu-Ag alloys and pure copper. Results of the cold rolling and cold hammering experiments reported here indicate that over the copper-silver alloy compositional range studied, the alloys can be cold rolled without annealing to over 90% reduction in thickness. Similar reductions in thickness were also achieved in two alloys (95 wt% Cu - 5 wt% Ag and 30 wt% Cu - 70 wt% Ag) by cold hammering. The rate of work hardening and the Vickers Hardness Number, as functions of the percent reduction in thickness, are similar for alloy compositions containing between 30 wt% and 80 wt% Cu. This suggests that ancient metalsmiths likely annealed the copper-silver alloy artifacts intentionally to produce the desired silver surface color rather than for any improvement in malleability. The silver surface colors were important for their cultural associations. The recrystallization temperature for the copper-silver alloys tested (70 wt% Cu - 30 wt% Ag and 30 wt% Cu - 70 wt% Ag) is determined to be 500°C given a 30 minute anneal time.
by Shannon L. Taylor.
S.B.
APA, Harvard, Vancouver, ISO, and other styles
9

Milliken, Damion Alexander. "Uranium doping of silver sheathed bismuth-strontium-calcium-copper-oxide superconducting tapes for increased critical current density through enhanced flux pinning." Access electronically, 2004. http://www.library.uow.edu.au/adt-NWU/public/adt-NWU20040810.154223/index.html.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Tselepis, Efstathios. "Preparation and study of electro-optical properties of oxide films of silver, copper and their alloys using the photovoltaic effect." Thesis, University of Ottawa (Canada), 1988. http://hdl.handle.net/10393/5473.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Silver-copper alloy"

1

Lanagan, T. J. Microstructure-property relationships in Al-Cu-Li-Ag-Mg Weldalite[superscript TM] alloys. National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Division, 1991.

APA, Harvard, Vancouver, ISO, and other styles
2

Woodhead, Eileen. Trademarks on base-metal tableware: Late 18th century to circa 1900 (including marks on Britannia metal, iron, steel, copper alloys, and silver-plated goods). National Historic Sites, Parks Service, Environment Canada, 1991.

APA, Harvard, Vancouver, ISO, and other styles
3

Center, Langley Research, ed. NASA-UVa light aerospace alloy and structures technology program supplement: Aluminum-based materials for high speed aircraft : semi-annual report July 1, 1992 - December 31, 1992. National Aeronautics and Space Administration, Langley Research Center, 1995.

APA, Harvard, Vancouver, ISO, and other styles
4

Center, Langley Research, ed. NASA-UVa light aerospace alloy and structures technology program supplement: Aluminum-based materials for high speed aircraft : semi-annual report July 1, 1992 - December 31, 1992. National Aeronautics and Space Administration, Langley Research Center, 1995.

APA, Harvard, Vancouver, ISO, and other styles
5

Center, Langley Research, ed. NASA-UVa light aerospace alloy and structures technology program supplement: Aluminum-based materials for high speed aircraft : semi-annual report July 1, 1992 - December 31, 1992. National Aeronautics and Space Administration, Langley Research Center, 1995.

APA, Harvard, Vancouver, ISO, and other styles
6

Dungworth, David. Metals and Metalworking. Edited by Martin Millett, Louise Revell, and Alison Moore. Oxford University Press, 2015. http://dx.doi.org/10.1093/oxfordhb/9780199697731.013.030.

Full text
Abstract:
Metals were a fundamental part of Roman life, providing a wide range of weapons, coins, implements, and jewellery. In Roman Britain, mining for gold and silver is known to have taken place and the working of these metals is known sporadically, mostly from urban contexts, while lead, tin, copper, and iron was also widely used, either on their own or in combination to form alloys such as bronze or pewter. This chapter explores the archaeological evidence for mining and the distribution and production of metals and metal objects in order to understand the role that metals played in the economy and life of the province.
APA, Harvard, Vancouver, ISO, and other styles

Book chapters on the topic "Silver-copper alloy"

1

Lu, Yu Ying, Hongxing Zheng, Fa Qin Xie, and Jian Guo Li. "Directional Solidification of Undercooled Hypoeutectic Silver-Copper Alloy Melt." In Materials Science Forum. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-960-1.2607.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Hu, Yuh-Chung, Yi-Ta Wang, and Hsiu-Hsien Wu. "Wiring the Tin–Silver–Copper Alloy by Fused Deposition Modeling." In Lecture Notes in Mechanical Engineering. Springer Singapore, 2016. http://dx.doi.org/10.1007/978-981-10-1771-1_9.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Zhang, Yuan-wang, Shu-sen Wang, and Da-wei Yao. "Microstructure Evolution and Physics Properties of Low Silver Copper Alloy Wires During In Situ Composite Preparation." In TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-05861-6_130.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Ho, C. Y., R. H. Bogaard, H. M. James, T. C. Chi, and T. N. Havill. "Thermoelectric Power of Selected Binary Alloy Systems Part II — Copper-Palladium, Gold-Palladium, and Silver-Palladium." In Thermal Conductivity 18. Springer US, 1985. http://dx.doi.org/10.1007/978-1-4684-4916-7_18.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Sechi, Yoshihisa, Taihei Matsumoto, and Kazuhiro Nakata. "Time Dependence of Contact Angle between Silver-Copper- Titanium Alloys and Boron Nitride." In Ceramic Transactions Series. John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470917145.ch26.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Xiong, Heng, Bin Yang, Dachun Liu, Baoqiang Xu, Xiumin Chen, and Yong Deng. "Copper-Based Multi-Component Alloys by Vacuum Distillation to Separate Copper Enriched Lead, Silver and Other Valuable Metals Research." In 4th International Symposium on High-Temperature Metallurgical Processing. John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118663448.ch32.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Pracejus, Bernhard. "Alloys and Alloy-like Compounds, with Copper, Silver, Gold, and Nickel." In The Ore Minerals Under the Microscope. Elsevier, 2014. http://dx.doi.org/10.1016/b978-0-444-62725-4.50004-1.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Biborski, Marcin, and Mateusz Biborski. "Badania składu chemicznego oraz technologia wykonania wybranych zabytków ze stopu miedzi." In Ocalone Dziedzictwo Archeologiczne. Wydawnictwo Profil-Archeo; Muzeum im. Jacka Malczewskiego w Radomiu, 2020. http://dx.doi.org/10.33547/oda-sah.10.zn.11.

Full text
Abstract:
41 artefacts recovered from the Przeworsk culture cemetery in Żelazna Nowa were originally selected for archaeometric examination. Of that number, 24 brooches and 13 various objects made from copper alloy were analysed. The choice was dictated by their good state of preservation, allowing for reliable results. The method applied was non-destructive energy dispersive X-ray fluorescence analysis (ED-XRF), using an X-ray spectrometer operating at 45kV. In addition, selected artefacts were examined using a scanning electron microscope. The results of chemical analyses are presented in Tables 11.1 and 11.2, with weight percent values given, while the raw material and technical data are shown in Tables 11.3 and 11.4. The results indicate that among the 24 brooches and their fragments analysed, 16 were made of brass, including eight made of multi-component tin brass, one made of tinlead brass, and one made of tin-silver brass. Among the remaining eight brooches one was made of iron and seven were bronze pieces, including two made of multi-component zinc bronze, one of lead bronze, and one of silver bronze (inv. no. CCXXIII/15). The addition of lead had significant technological impact on the alloys used for creating the brooches. Even in small quantities, even far below 1%, this element improves the castability and workability of the metal. Zinc, in turn, is added to bronzes as a reducing agent, making the alloy self-reducible. This also makes it possible to reduce the contents of phosphorus. Moreover, the addition of zinc to bronze significantly lowers its melting temperature. The remaining alloying additions (apart from elements recorded in trace amounts, like Ag, Sb, and Fe, which naturally occurred in copper alloys) have had no significant impact on the quality of the raw material used for manufacturing the artefacts under discussion. The presence of silver (a few percent) recorded in two brooches (inv. nos XXXIII/15 and CCXXIII/15) indicates they may have originally been silver-plated. Two brooches (inv. nos XCIX/15 and 21/08) were inlaid with silver wire. The first one was cast from tin bronze and adorned with a filigree wire (Fig. 11.1) in the type of a simple braid, made of highquality (92.99%) silver (Fig. 11.2). The silver wire with a diameter of merely 338.38 μm (Fig. 11.3) was produced by drawing through a die, and it was later braided and hammered into grooves previously prepared on the two crests of the brooch. The second brooch, made of iron (inv. no. 21/08), was adorned with silver of a similarly high quality (91.85%). In this case, however, the exposure to fire resulted in complete destruction of the decoration: its traces only remained in a few places in the form of tiny melt-down droplets. It is worth noting the similar standard of silver used as inlays in both brooches. This seems to corroborate the assumption that the standards of silver used in trade were generally similar over larger areas. It is worth noting two brooches which, despite representing different types, are made of chemically very similar alloys (Tables 11.1–3). One (inv. no. CCIX/15) belongs to type A.III.58, while another represents group A.IV (inv. no. CIX/17). This may indicate that both were manufactured in the same workshop. Except for one brooch forged from iron, all the remaining brooches were cast using the lost wax technique (Table 11.3). Cast pieces also prevail among other artefacts, especially those having profiled surfaces (Table 11.4). Examples include a fragment of a J.7 shield grip (inv. no. XVI/15), a belt finial of type “O” (inv. no. CCXLIX/15), and fragments of bracelets with round terminals (inv. nos XIII/15 and LXXXVI/17). The performed raw material analysis of copper alloy artefacts from Żelazna Nowa produced interesting findings. The results confirm that during the Older Roman Period brass artefacts prevailed among small metal dress items in the Przeworsk culture. Among the 37 copper alloy artefacts analysed, as many as 27 (75%) are brass objects. A similar picture was observed in other sites, with a prevalence of brass artefacts recorded in cemeteries such as those in Karczyn/Witowy, Sadłów, and Szarbia.
APA, Harvard, Vancouver, ISO, and other styles
9

Gordon, Robert B., and Patrick M. Malone. "Scarce Metals and Petroleum." In The Texture of Industry. Oxford University Press, 1994. http://dx.doi.org/10.1093/oso/9780195058857.003.0011.

Full text
Abstract:
Lured by the potential for substantial wealth, Americans have focused a disproportionate share of their industrial effort on extracting and processing resources that are both scarce and in high demand. Gold and silver were always valuable and eagerly sought, but in the nineteenth century, the demand tor other nonferrous metals and (or petroleum rose to unprecedented levels. Obtaining these scarce, nonrenewable resources brought new patterns of industrial land use and new environmental consequences. The continuing effects on our land, water, and air are serious concerns in American society today. The hope of finding gold and silver, the metals of wealth and display, drew numerous adventurers to North America in the seventeenth century. In the East, those hoping to repeat the Spanish experience in South America and Mexico were disappointed. Although colonial prospectors did discover small deposits of nonferrous-metal ores on the east coast and in the Appalachians, most of the metals were not in the precious category. There was a demand for utilitarian metals as well: English colonists depended on lead for pipes, window carries, and shot; they cooked with copper kettles, drank the products of copper stills, and set their tables with pewter (a tin alloy) tableware. Nevertheless, Americans generally found it cheaper and easier to use imported nonferrous metals until the mineral resources of the center of the continent were exploited in the nineteenth century. Iron was the only metal extensively mined in the English colonies. One of the few relicts of pre-Revolutionary nonferrous metallurgy is the Simsbury Copper Mine in East Granby, Connecticut. This mining enterprise obtained its charter in 1706. The state now preserves the site, not as an industrial monument but because the mine served for a time as the state prison. Visitors can enter the underground workings. Physical evidence of the first gold discovery in the United States, in 1799, exists at the Reed Gold Mine, a state historic site near Georgiaville, North Carolina. Most of the milling survivals are from later development at the mining site in 1854 and 1896. North Carolina led the nation in gold production until the California gold rush of 1849.
APA, Harvard, Vancouver, ISO, and other styles
10

Seruya, Ana Isabel, and Dafydd Griffiths. "Ageing Processes in Gold-Copper-Silver Alloys." In Archaeological Sciences 1995. Oxbow Books, 2017. http://dx.doi.org/10.2307/j.ctvh1dtz1.25.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Silver-copper alloy"

1

Hashimoto, Yoshikazu, Yoshiaki Nishijima, Gediminas Seniutinas, Lorenzo Rosa, and Saulius Juodkazis. "Optical constants of gold-silver-copper alloy system." In JSAP-OSA Joint Symposia. OSA, 2014. http://dx.doi.org/10.1364/jsap.2014.19p_c3_13.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Lefevre, Matthew, Emmanuel Noraz, and Damien Veychard. "Repeatable Method for Automated Decapsulation of Silver Alloy Wire Packages." In ISTFA 2015. ASM International, 2015. http://dx.doi.org/10.31399/asm.cp.istfa2015p0491.

Full text
Abstract:
Abstract Over the past several years there has been a large industry wide effort to change over from gold bonding wires to copper in order to minimize production costs. In certain cases this is not possible due to the relatively high hardness values of Cu [1], which leads to reliability issues in the manufacturing process. Silver (Ag) wire has been proposed and successfully implemented in many instances where Cu wire was not practicable. Unfortunately, currently integrated decapsulation methods severely damaged or destroyed the silver wires and bonds, making it impossible to perform production controls and failure analysis. In this article we present a reliable and repeatable automated method to expose these die and wire bonds. By adding a dilute iodine solution to the nitric acid in an acid decapsulator, these packages can be fully opened without degrading the silver wires, allowing both mechanical and electrical testing on these devices.
APA, Harvard, Vancouver, ISO, and other styles
3

Hongjin Jiang, Kyoung-sik Moon, and C. P. Wong. "Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications." In 2008 58th Electronic Components and Technology Conference (ECTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/ectc.2008.4550160.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

An, Bing, and Chi-man Lawrence Wu. "Evaluation of Wettability of Composite Solder Alloy Reinforced with Silver and Copper Particles." In 2007 8th International Conference on Electronic Packaging Technology. IEEE, 2007. http://dx.doi.org/10.1109/icept.2007.4441443.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Ibrahim, Mohamed, Khaled Al-Athel, and Abul Fazal M. Arif. "Strength and Hardness Assessment of Copper and Copper Alloy Coatings on Stainless Steel Substrates." In ASME 2016 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/imece2016-66612.

Full text
Abstract:
Coatings are extensively used in many areas including industrial and medical fields to serve various functions as corrosion resistance, wear resistance and antibacterial purposes. Copper and copper alloys are among the most widely applied coating materials for several industrial and medical applications. One of their widely used copper coating applications is in the antibacterial coating area. Most of the research done in this field focuses on the antibacterial behavior with no comprehensive assessment regarding their mechanical properties, such as hardness and adhesion strength. In this work, mechanical assessment of strength and hardness of pure copper and several copper alloys including Cu Sn5% P0.6%, Cu Ni18 Zn14 (German silver), and Cu Al9 Fe1 are studied experimentally and numerically. All coatings are deposited on stainless steel substrate disks of 25mm diameter by wire-arc thermal spraying at the center of advanced coating technologies, University of Toronto. All coatings are 150 microns in thickness, with two additional thicknesses up to 350 microns for Cu Ni18 Zn14 (German silver) and Cu Al9 Fe1. The effect of the coating thickness and composition on the mechanical properties is studied for all the copper and copper alloy samples with the varying thicknesses between 150 and 350 microns. Scanning Electron Microscope (SEM) is used to study the surface as well as the cross-sectional microstructure of the coatings. Vickers micro-indentation tests are used to evaluate hardness at various locations on the cross-section of the coating and the substrate. This is used to evaluate the effect of the deposition of the coating material, and the subsequent solidification, on the hardness of the coating layer as well as the substrate near the coating interface. Pull-off adhesion tests are performed to evaluate the effect of the coating composition and thickness on the strength of the coatings. Tests are carried out to compute the pull-off failure stress that causes the delamination between the coating and the substrate. Computational analysis will be used to calibrate the experimental data when available by means of finite element analysis. The preliminary pull-off tests show interesting results as the samples with lower coating thicknesses exhibit delamination at higher strengths. This is due to the increase in residual stresses in higher thicknesses building up during the deposition process. Some of the samples did not even fail at lower thicknesses of 150 microns. A comprehensive analysis between the adhesion strength and hardness will be very useful in understanding the effect of coating composition and thickness on the mechanical properties of the coating.
APA, Harvard, Vancouver, ISO, and other styles
6

Kerisit, François, Bernadette Domenges, and Michael Obein. "Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices." In ISTFA 2014. ASM International, 2014. http://dx.doi.org/10.31399/asm.cp.istfa2014p0087.

Full text
Abstract:
Abstract The introduction of silver as bonding material led to new failure analysis issues. This study compares the efficiency of wet and dry chemistries for decapsulation on Cu and Ag-based alloy wires. It is shown that dry chemistry allows better control and selectivity on the EMC/ Cu and Ag-based bond wires.
APA, Harvard, Vancouver, ISO, and other styles
7

Kure-Chu, Song-Zhu, Rie Nakagawa, Toru Ogasawara, et al. "Sliding friction, wear and tribofilm formation of silver films electro-plated on copper alloy sheets." In 2016 IEEE 62nd IEEE Holm Conference on Electrical Contacts (Holm). IEEE, 2016. http://dx.doi.org/10.1109/holm.2016.7780021.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Felicia, Dian M., R. Rochiem, and Standley M. Laia. "The effect of silver (Ag) addition to mechanical and electrical properties of copper alloy (Cu) casting product." In PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATERIALS AND METALLURGICAL ENGINEERING AND TECHNOLOGY (ICOMMET 2017) : Advancing Innovation in Materials Science, Technology and Applications for Sustainable Future. Author(s), 2018. http://dx.doi.org/10.1063/1.5030297.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Kubota, K., K. Nakaya, T. Tamagawa, et al. "The effect of the nickel underplate on the heat resisting properties of silver plated copper alloy contacts." In 2017 IEEE Holm Conference on Electrical Contacts. IEEE, 2017. http://dx.doi.org/10.1109/holm.2017.8088076.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Kara-Slimane, A., and D. Treheux. "Prebrazing of Ceramics by Plasma Spraying for Metal-Ceramic Joining." In ITSC 1998, edited by Christian Coddet. ASM International, 1998. http://dx.doi.org/10.31399/asm.cp.itsc1998p1513.

Full text
Abstract:
Abstract Traditionnal brazing ailoys does not wet ceramic and therefore are unusable for metal ceramic bonding. To overcome this problem, we have pre-metallized different ceramics (AI2O3, AIN, SiAION) by plasma spraying of copper on ceramics. The good wettability of AgCu or AgCuTi alloy on so-coated ceramics is explained by effect of residual oxygen at interface which favours the thermodynamic adhesion during brazing. The interface analysis showed that silver or titanium segregation occurs at ceramic surface and that, conversely, sprayed copper diffuses in the brazed joint
APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Silver-copper alloy"

1

Wheeling, Rebecca. Evaluating MetGlasTM Solderability with Tin-Silver-Copper and Tin-Silver-Bismuth Solder Alloys. Office of Scientific and Technical Information (OSTI), 2020. http://dx.doi.org/10.2172/1763529.

Full text
APA, Harvard, Vancouver, ISO, and other styles
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography