Academic literature on the topic 'Silver-copper alloy'
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Journal articles on the topic "Silver-copper alloy"
Strohmeier, Brian R. "Copper/Silver/Gold Alloy by XPS." Surface Science Spectra 3, no. 3 (1994): 175–81. http://dx.doi.org/10.1116/1.1247744.
Full textCiacotich, Nicole, Lasse Kvich, Nicholas Sanford, Joseph Wolcott, Thomas Bjarnsholt, and Lone Gram. "Copper-Silver Alloy Coated Door Handles as a Potential Antibacterial Strategy in Clinical Settings." Coatings 10, no. 8 (2020): 790. http://dx.doi.org/10.3390/coatings10080790.
Full textBronner, S. W., and P. Wynblatt. "Surface segregation in a dilute copper–silver alloy." Journal of Materials Research 1, no. 5 (1986): 646–51. http://dx.doi.org/10.1557/jmr.1986.0646.
Full textHampshire, Bethany, Kevin Butcher, Katsu Ishida, George Green, Don Paul, and Adrian Hillier. "Using Negative Muons as a Probe for Depth Profiling Silver Roman Coinage." Heritage 2, no. 1 (2019): 400–407. http://dx.doi.org/10.3390/heritage2010028.
Full textKnight, J. M., R. K. Wells, and J. P. S. Badyal. "Plasma oxidation of copper-silver alloy surfaces." Chemistry of Materials 4, no. 3 (1992): 640–41. http://dx.doi.org/10.1021/cm00021a026.
Full textLin, C. H., and W. K. Leau. "Copper-Silver Alloy for Advanced Barrierless Metallization." Journal of Electronic Materials 38, no. 11 (2009): 2212–21. http://dx.doi.org/10.1007/s11664-009-0904-2.
Full textIliev, Ilian, Ivelin Kuleff, Jörg Adam, and Ernst Pernicka. "Electrochemical lead separation from copper, copper alloy, silver and silver alloy for isotope ratio determination in archaeometric investigations." Analytica Chimica Acta 497, no. 1-2 (2003): 227–33. http://dx.doi.org/10.1016/j.aca.2003.07.008.
Full textAamir, Muhammad, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin, and Vadim V. Silberschmidt. "A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics." Soldering & Surface Mount Technology 32, no. 2 (2019): 115–26. http://dx.doi.org/10.1108/ssmt-11-2018-0046.
Full textRudnik, Ewa, Iwona Dobosz, Krzysztof Fitzner, and Zbigniew Miazga. "Hydrometallurgical Treatment of Smelted Low-Grade WEEE in Ammoniacal Solutions." Key Engineering Materials 682 (February 2016): 293–98. http://dx.doi.org/10.4028/www.scientific.net/kem.682.293.
Full textWang, Yaoli, Kexing Song, Jilin He, et al. "Abnormal structure and properties of copper–silver bar billet by cold casting." REVIEWS ON ADVANCED MATERIALS SCIENCE 60, no. 1 (2021): 591–98. http://dx.doi.org/10.1515/rams-2021-0038.
Full textDissertations / Theses on the topic "Silver-copper alloy"
Unsworth, Paul. "Spectroscopic studies of metal alloys and semiconductor interfaces." Thesis, University of Liverpool, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.343647.
Full textDemange, Gilles. "Mise en oeuvre d'une approche multi-échelles fondée sur le champ de phase pour caractériser la microstructure des matériaux irradiés : application à l'alliage AgCu." Thesis, Université Paris-Saclay (ComUE), 2015. http://www.theses.fr/2015ECAP0048/document.
Full textIt is of dramatic matter for industry to be able to predict the evolution of material microstructure under working conditions. This requires a clear understanding of the underlying mechanisms, which act on numerous space and time scales. Because it intrinsically performs a scale jump, we chose to use a phase field approach, which is widely used amidst the condensed matter community to study the aging of materials. The first challenge of this work was to extend this formalism beyond its thermodynamic scope and embrace the case of far from equilibrium systems when subjected to irradiation. For that purpose, we adopted the model of ion mixing, developed by Gras Marti to account for ballistic exchanges within a displacements cascade. Based on a numerical scheme and ananalytical method, we were able to describe the generic microstructure signature for materials under irradiation.We then applied this formalism to the particular case of the immiscible binary alloy AgCu.With the joined use of the phase field approach and atomistic methods, we managed to predict how the temperature and the irradiation flux tailor the main microstructure features such as the size, the concentration and the distribution of copper precipitates. This eventually allowed us to simulate a diffraction pattern in grazing incidence, which is directly comparable to experimental ones
Athavale, Saurabh. "Effect of Cu concentration and cooling rate on microstructure of Sn-3.9Ag-XCu." Diss., Online access via UMI:, 2006.
Benedict, Michael Scott. "Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints." Diss., Online access via UMI:, 2007.
ISHII, HENRIQUE A. "Elaboracao de ligas Ag-Sn-Cu para amalgama dentario por moagem de alta energia." reponame:Repositório Institucional do IPEN, 2003. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11101.
Full textMade available in DSpace on 2014-10-09T13:57:22Z (GMT). No. of bitstreams: 1 08713.pdf: 6496941 bytes, checksum: 5803cb14028b4639afbb59fbc4cfa0d0 (MD5)
Tese (Doutoramento)
IPEN/T
Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
Kinyanjui, Robert. "Thermal processes and solidification kinetics of evolution of the microstructure of Sn-xAg-yCu solder alloys." Diss., Online access via UMI:, 2005.
Includes bibliographical references.
Ke, Xing. "Atomistic Simulation Studies Of Grain-Boundary Segregation And Strengthening Mechanisms In Nanocrystalline Nanotwinned Silver-Copper Alloys." ScholarWorks @ UVM, 2019. https://scholarworks.uvm.edu/graddis/995.
Full textTaylor, Shannon L. S. B. Massachusetts Institute of Technology. "An investigation of the mechanical and physical properties of copper-silver alloys and the use of these alloys in Pre-Columbian America." Thesis, Massachusetts Institute of Technology, 2013. http://hdl.handle.net/1721.1/80903.
Full textThis electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
"June 2013." Cataloged from student-submitted PDF version of thesis.
Includes bibliographical references (p. 94-96).
In both the Andean zone of South America and in Mesoamerica, copper-silver alloys were important in the production of thin, silver-colored sheet metal artifacts. This thesis examines the mechanical and physical properties of the copper-silver alloy system that are important to understanding why copper-silver alloys became central to the metallurgies that developed among prehistoric societies of the Andean zone and Western Mexico. These properties include their range of malleability, the microstructures behind their toughness, and the recrystallization and annealing behaviors that led to their development of silver-enriched surfaces. To determine these properties, a series of cold rolling, cold hammering, and annealing experiments were performed on five Cu-Ag alloys and pure copper. Results of the cold rolling and cold hammering experiments reported here indicate that over the copper-silver alloy compositional range studied, the alloys can be cold rolled without annealing to over 90% reduction in thickness. Similar reductions in thickness were also achieved in two alloys (95 wt% Cu - 5 wt% Ag and 30 wt% Cu - 70 wt% Ag) by cold hammering. The rate of work hardening and the Vickers Hardness Number, as functions of the percent reduction in thickness, are similar for alloy compositions containing between 30 wt% and 80 wt% Cu. This suggests that ancient metalsmiths likely annealed the copper-silver alloy artifacts intentionally to produce the desired silver surface color rather than for any improvement in malleability. The silver surface colors were important for their cultural associations. The recrystallization temperature for the copper-silver alloys tested (70 wt% Cu - 30 wt% Ag and 30 wt% Cu - 70 wt% Ag) is determined to be 500°C given a 30 minute anneal time.
by Shannon L. Taylor.
S.B.
Milliken, Damion Alexander. "Uranium doping of silver sheathed bismuth-strontium-calcium-copper-oxide superconducting tapes for increased critical current density through enhanced flux pinning." Access electronically, 2004. http://www.library.uow.edu.au/adt-NWU/public/adt-NWU20040810.154223/index.html.
Full textTselepis, Efstathios. "Preparation and study of electro-optical properties of oxide films of silver, copper and their alloys using the photovoltaic effect." Thesis, University of Ottawa (Canada), 1988. http://hdl.handle.net/10393/5473.
Full textBooks on the topic "Silver-copper alloy"
Lanagan, T. J. Microstructure-property relationships in Al-Cu-Li-Ag-Mg Weldalite[superscript TM] alloys. National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Division, 1991.
Woodhead, Eileen. Trademarks on base-metal tableware: Late 18th century to circa 1900 (including marks on Britannia metal, iron, steel, copper alloys, and silver-plated goods). National Historic Sites, Parks Service, Environment Canada, 1991.
Center, Langley Research, ed. NASA-UVa light aerospace alloy and structures technology program supplement: Aluminum-based materials for high speed aircraft : semi-annual report July 1, 1992 - December 31, 1992. National Aeronautics and Space Administration, Langley Research Center, 1995.
Center, Langley Research, ed. NASA-UVa light aerospace alloy and structures technology program supplement: Aluminum-based materials for high speed aircraft : semi-annual report July 1, 1992 - December 31, 1992. National Aeronautics and Space Administration, Langley Research Center, 1995.
Center, Langley Research, ed. NASA-UVa light aerospace alloy and structures technology program supplement: Aluminum-based materials for high speed aircraft : semi-annual report July 1, 1992 - December 31, 1992. National Aeronautics and Space Administration, Langley Research Center, 1995.
Dungworth, David. Metals and Metalworking. Edited by Martin Millett, Louise Revell, and Alison Moore. Oxford University Press, 2015. http://dx.doi.org/10.1093/oxfordhb/9780199697731.013.030.
Full textBook chapters on the topic "Silver-copper alloy"
Lu, Yu Ying, Hongxing Zheng, Fa Qin Xie, and Jian Guo Li. "Directional Solidification of Undercooled Hypoeutectic Silver-Copper Alloy Melt." In Materials Science Forum. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-960-1.2607.
Full textHu, Yuh-Chung, Yi-Ta Wang, and Hsiu-Hsien Wu. "Wiring the Tin–Silver–Copper Alloy by Fused Deposition Modeling." In Lecture Notes in Mechanical Engineering. Springer Singapore, 2016. http://dx.doi.org/10.1007/978-981-10-1771-1_9.
Full textZhang, Yuan-wang, Shu-sen Wang, and Da-wei Yao. "Microstructure Evolution and Physics Properties of Low Silver Copper Alloy Wires During In Situ Composite Preparation." In TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-05861-6_130.
Full textHo, C. Y., R. H. Bogaard, H. M. James, T. C. Chi, and T. N. Havill. "Thermoelectric Power of Selected Binary Alloy Systems Part II — Copper-Palladium, Gold-Palladium, and Silver-Palladium." In Thermal Conductivity 18. Springer US, 1985. http://dx.doi.org/10.1007/978-1-4684-4916-7_18.
Full textSechi, Yoshihisa, Taihei Matsumoto, and Kazuhiro Nakata. "Time Dependence of Contact Angle between Silver-Copper- Titanium Alloys and Boron Nitride." In Ceramic Transactions Series. John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470917145.ch26.
Full textXiong, Heng, Bin Yang, Dachun Liu, Baoqiang Xu, Xiumin Chen, and Yong Deng. "Copper-Based Multi-Component Alloys by Vacuum Distillation to Separate Copper Enriched Lead, Silver and Other Valuable Metals Research." In 4th International Symposium on High-Temperature Metallurgical Processing. John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118663448.ch32.
Full textPracejus, Bernhard. "Alloys and Alloy-like Compounds, with Copper, Silver, Gold, and Nickel." In The Ore Minerals Under the Microscope. Elsevier, 2014. http://dx.doi.org/10.1016/b978-0-444-62725-4.50004-1.
Full textBiborski, Marcin, and Mateusz Biborski. "Badania składu chemicznego oraz technologia wykonania wybranych zabytków ze stopu miedzi." In Ocalone Dziedzictwo Archeologiczne. Wydawnictwo Profil-Archeo; Muzeum im. Jacka Malczewskiego w Radomiu, 2020. http://dx.doi.org/10.33547/oda-sah.10.zn.11.
Full textGordon, Robert B., and Patrick M. Malone. "Scarce Metals and Petroleum." In The Texture of Industry. Oxford University Press, 1994. http://dx.doi.org/10.1093/oso/9780195058857.003.0011.
Full textSeruya, Ana Isabel, and Dafydd Griffiths. "Ageing Processes in Gold-Copper-Silver Alloys." In Archaeological Sciences 1995. Oxbow Books, 2017. http://dx.doi.org/10.2307/j.ctvh1dtz1.25.
Full textConference papers on the topic "Silver-copper alloy"
Hashimoto, Yoshikazu, Yoshiaki Nishijima, Gediminas Seniutinas, Lorenzo Rosa, and Saulius Juodkazis. "Optical constants of gold-silver-copper alloy system." In JSAP-OSA Joint Symposia. OSA, 2014. http://dx.doi.org/10.1364/jsap.2014.19p_c3_13.
Full textLefevre, Matthew, Emmanuel Noraz, and Damien Veychard. "Repeatable Method for Automated Decapsulation of Silver Alloy Wire Packages." In ISTFA 2015. ASM International, 2015. http://dx.doi.org/10.31399/asm.cp.istfa2015p0491.
Full textHongjin Jiang, Kyoung-sik Moon, and C. P. Wong. "Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications." In 2008 58th Electronic Components and Technology Conference (ECTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/ectc.2008.4550160.
Full textAn, Bing, and Chi-man Lawrence Wu. "Evaluation of Wettability of Composite Solder Alloy Reinforced with Silver and Copper Particles." In 2007 8th International Conference on Electronic Packaging Technology. IEEE, 2007. http://dx.doi.org/10.1109/icept.2007.4441443.
Full textIbrahim, Mohamed, Khaled Al-Athel, and Abul Fazal M. Arif. "Strength and Hardness Assessment of Copper and Copper Alloy Coatings on Stainless Steel Substrates." In ASME 2016 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/imece2016-66612.
Full textKerisit, François, Bernadette Domenges, and Michael Obein. "Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices." In ISTFA 2014. ASM International, 2014. http://dx.doi.org/10.31399/asm.cp.istfa2014p0087.
Full textKure-Chu, Song-Zhu, Rie Nakagawa, Toru Ogasawara, et al. "Sliding friction, wear and tribofilm formation of silver films electro-plated on copper alloy sheets." In 2016 IEEE 62nd IEEE Holm Conference on Electrical Contacts (Holm). IEEE, 2016. http://dx.doi.org/10.1109/holm.2016.7780021.
Full textFelicia, Dian M., R. Rochiem, and Standley M. Laia. "The effect of silver (Ag) addition to mechanical and electrical properties of copper alloy (Cu) casting product." In PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATERIALS AND METALLURGICAL ENGINEERING AND TECHNOLOGY (ICOMMET 2017) : Advancing Innovation in Materials Science, Technology and Applications for Sustainable Future. Author(s), 2018. http://dx.doi.org/10.1063/1.5030297.
Full textKubota, K., K. Nakaya, T. Tamagawa, et al. "The effect of the nickel underplate on the heat resisting properties of silver plated copper alloy contacts." In 2017 IEEE Holm Conference on Electrical Contacts. IEEE, 2017. http://dx.doi.org/10.1109/holm.2017.8088076.
Full textKara-Slimane, A., and D. Treheux. "Prebrazing of Ceramics by Plasma Spraying for Metal-Ceramic Joining." In ITSC 1998, edited by Christian Coddet. ASM International, 1998. http://dx.doi.org/10.31399/asm.cp.itsc1998p1513.
Full textReports on the topic "Silver-copper alloy"
Wheeling, Rebecca. Evaluating MetGlasTM Solderability with Tin-Silver-Copper and Tin-Silver-Bismuth Solder Alloys. Office of Scientific and Technical Information (OSTI), 2020. http://dx.doi.org/10.2172/1763529.
Full text