Journal articles: 'Silver-copper alloy'

1

Strohmeier, Brian R. "Copper/Silver/Gold Alloy by XPS." Surface Science Spectra 3, no. 3 (July 1994): 175–81. http://dx.doi.org/10.1116/1.1247744.

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Ciacotich, Nicole, Lasse Kvich, Nicholas Sanford, Joseph Wolcott, Thomas Bjarnsholt, and Lone Gram. "Copper-Silver Alloy Coated Door Handles as a Potential Antibacterial Strategy in Clinical Settings." Coatings 10, no. 8 (August 14, 2020): 790. http://dx.doi.org/10.3390/coatings10080790.

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Coating surfaces with a copper-silver alloy in clinical settings can be an alternative or complementary antibacterial strategy to other existing technologies and disinfection interventions. A newly developed copper-silver alloy coating has a high antibacterial efficacy against common pathogenic bacteria in laboratory setups, and the purpose of this study is to determine the antibacterial efficacy of this copper-silvery alloy in real-world clinical settings. Two field trials were carried out at a private clinic and a wound care center. Door handles coated with the copper-silver alloy had a lower total aerobic plate count (1.3 ± 0.4 Log CFU/cm2 and 0.8 ± 0.3 Log CFU/cm2, CFU stands for Colony Forming Units) than the reference uncoated material on-site (2.4 ± 0.4 Log CFU/cm2 for the stainless steel and 1.7 ± 0.4 Log CFU/cm2 for the satin brass). The copper-silver alloy did not selectively reduce specific bacterial species. This study points to the possibility of a successful long-term implementation of the copper-silver alloy coating as an antibacterial strategy.

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Bronner, S. W., and P. Wynblatt. "Surface segregation in a dilute copper–silver alloy." Journal of Materials Research 1, no. 5 (October 1986): 646–51. http://dx.doi.org/10.1557/jmr.1986.0646.

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The equilibrium surface composition of a Cu-0.83 at. % Ag alloy has been studied over the range from 600°–400°C. Above 450°C the alloy consists of a single phase, whereas below that temperature the material separates into copper-rich and silver-rich phases. The kinetics of equilibration appear to be controlled by grain boundary diffusion, leading to more rapid equilibration than expected on the basis of lattice diffusion-controlled kinetics. In the single-phase regime, silver segregates to the surface with an average enthalpy of segregation of −24 kJ/mol and an entropy of segregation of 0.94 J/mol K, and displays a trend of increasing equilibrium silver surface concentration with decreasing temperature. Theoretical estimates of the enthalpy of segregation yield the somewhat more negative values of −60 and −47 kJ/mol, respectively. In the two-phase regime, the surface continues to be enriched in silver, but the silver surface concentration decreases with decreasing temperature as a result of the rapidly decreasing equilibrium solubility of silver in copper.

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Hampshire, Bethany, Kevin Butcher, Katsu Ishida, George Green, Don Paul, and Adrian Hillier. "Using Negative Muons as a Probe for Depth Profiling Silver Roman Coinage." Heritage 2, no. 1 (January 29, 2019): 400–407. http://dx.doi.org/10.3390/heritage2010028.

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Debasement of silver Roman coins is a well-known phenomenon and understanding the quality of ancient silver coinages can provide an idea about the underlying fiscal condition of the issuing states. These coins are made from a silver-copper alloy, the surfaces of which were deliberately enhanced at the mints by a process of surface-enrichment to give them the appearance of being made of pure silver. Therefore, any surface analysis would provide a composition of the silver-copper alloy that would not be representative of the original alloy from which the coin blank was made; the result would be too high in silver. However, the bulk of the sample, the interior, should provide a composition that is true to the original alloy. Elemental analysis using negative muons has been used to provide a depth dependent compositional, completely non-destructive analysis of a silver-copper alloy denarius of the empress Julia Domna datable to 211–217 CE. The composition of the coin, beyond the surface enrichment layer, is 51 ± 1.8 % copper and 49 ± 1.9% silver, taken at a muon depth of 402 ± 61 µm. The surface enrichment layer is approximately 190 µm thick.

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Knight, J. M., R. K. Wells, and J. P. S. Badyal. "Plasma oxidation of copper-silver alloy surfaces." Chemistry of Materials 4, no. 3 (May 1992): 640–41. http://dx.doi.org/10.1021/cm00021a026.

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Lin, C. H., and W. K. Leau. "Copper-Silver Alloy for Advanced Barrierless Metallization." Journal of Electronic Materials 38, no. 11 (August 8, 2009): 2212–21. http://dx.doi.org/10.1007/s11664-009-0904-2.

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Iliev, Ilian, Ivelin Kuleff, Jörg Adam, and Ernst Pernicka. "Electrochemical lead separation from copper, copper alloy, silver and silver alloy for isotope ratio determination in archaeometric investigations." Analytica Chimica Acta 497, no. 1-2 (November 2003): 227–33. http://dx.doi.org/10.1016/j.aca.2003.07.008.

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Aamir, Muhammad, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin, and Vadim V. Silberschmidt. "A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics." Soldering & Surface Mount Technology 32, no. 2 (October 14, 2019): 115–26. http://dx.doi.org/10.1108/ssmt-11-2018-0046.

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Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

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Rudnik, Ewa, Iwona Dobosz, Krzysztof Fitzner, and Zbigniew Miazga. "Hydrometallurgical Treatment of Smelted Low-Grade WEEE in Ammoniacal Solutions." Key Engineering Materials 682 (February 2016): 293–98. http://dx.doi.org/10.4028/www.scientific.net/kem.682.293.

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Hydrometallurgical routes of copper recovery from smelted low-grade e-waste are presented. Electronic scrap was smelted to produce Cu–Zn–Ag-Sn alloys of various phase compositions. The alloys were then treated in the following ways: (a) anodic dissolution with simultaneous metal electrodeposition using ammoniacal solutions with various ammonium salts (chloride, carbonate, sulfate). This resulted in the separation of metals, where lead, silver and tin accumulated mainly in the slimes, while copper was transferred to the slime, electrolyte and then recovered on the cathode. (b) leaching in ammoniacal solutions of various compositions and then copper electrowinning. Alloy was leached in chloride, carbonate, sulfate and thiosulfate baths. This resulted in the separation of the metals, wherein copper and zinc were transferred to the electrolyte, while metallic tin and silver as well as lead remained in the slimes. Copper was selectively recovered from the ammoniacal solutions by the electrolysis, leaving zinc ions in the electrolyte. The best conditions of the alloy treatment were obtained, where the final product was copper of high purity (99.9%) at the current efficiency of 60%. Thiosulfate solution was not applicable for the leaching of the copper alloy due to secondary reactions of the formation of copper(I) thiosulfate complexes and precipitation of copper(I) sulfide.

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Wang, Yaoli, Kexing Song, Jilin He, Ran Yang, Yanjun Zhou, Jun Cao, and Chu Cheng. "Abnormal structure and properties of copper–silver bar billet by cold casting." REVIEWS ON ADVANCED MATERIALS SCIENCE 60, no. 1 (January 1, 2021): 591–98. http://dx.doi.org/10.1515/rams-2021-0038.

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Abstract Copper alloy rod billet with 20% silver was prepared using homemade three-chamber vacuum cold-type vertical continuous casting equipment. The variation rules of the microhardness, eutectic ratio, and size and distribution of silver particles precipitated in the primary α-Cu phase at the end of the continuous casting alloy rod blanks were studied using a microhardness tester and scanning electron microscope. The obtained results show that when the cold-type vertical continuous casting speed is 120 mm·min−1, there is obvious reverse segregation of solute element near the end of the prepared ∅7.8 mm copper–silver alloy rod blank. From the end of the continuous casting alloy rod blank to 5 mm from the end, the Cu–Ag eutectic structure in the copper–silver alloy increases from 13.4 to 15.9%, and the size of Ag particles precipitated in the primary α-Cu phase increases from 100 to 350 nm. The microhardness increases from 56 HV0.05 to 85 HV0.05. When the distance from the end exceeds 5 mm, the microstructure and properties of the continuous casting alloy rod blank are basically stable.

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Stephenson, Richard, Kyle Bandaccari, and Howard Imhof. "New Low Temperature Alloy Core-Shell Structures for Joining Applications." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000705–10. http://dx.doi.org/10.4071/isom-2016-wp42.

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Abstract Silver and copper core-shell powder materials are introduced and discussed in low temperature joining applications. Properties of the core-shell powders are reviewed and suggested process conditions are shown. Examination of ductile fracture area corroborate bonding strength results for both silver and copper core-shell materials. Selectable materials sets are presented to address different application process needs for lead-free systems.

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Chowdhury, Sanchari, Venkat R. Bhethanabotla, and Rajan Sen. "Silver-copper alloy nanoparticles for metal enhanced luminescence." Applied Physics Letters 95, no. 13 (September 28, 2009): 131115. http://dx.doi.org/10.1063/1.3242007.

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Oudbashi, Omid, and Russell Wanhill. "Long-Term Embrittlement of Ancient Copper and Silver Alloys." Heritage 4, no. 3 (September 10, 2021): 2287–319. http://dx.doi.org/10.3390/heritage4030130.

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The manifestations of ancient metals’ embrittlement, cracking and fracture, are challenging problems for restorers and conservators, yet the scientific understanding of these problems is limited. In particular, the study and interpretation of fracture surfaces, fractography, is a minor or non-existent consideration for most archaeometallurgical investigations. This paper presents a survey of fractographic analyses, in combination with the more widely used disciplines of microstructural studies, metallography, and chemical analyses for some Old-World copper alloy (bronzes) and high-silver alloy artifacts that have undergone long-term corrosion and embrittlement damage. We show that fractography, as an adjunct to metallography, can improve the interpretation of these types of damage and assist in selecting the best methods for restoration and conservation of the objects made from these alloys.

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Demakopoulou, K., E. Mangou, R. E. Jones, and E. Photos-Jones. "Mycenaean black inlaid metalware in the National Archaeological Museum, Athens: a technical examination." Annual of the British School at Athens 90 (November 1995): 137–53. http://dx.doi.org/10.1017/s0068245400016117.

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Current technical interest in the nature of the black inlaid decoration on ancient metalware has stimulated an examination of some of the well-known bronze daggers, silver vessels, and other fragments, all with inlaid decoration and dating to the 16–14th centuries BC, from Mycenae, Prosymna, Dendra, Routsi, and Pylos. Results of non-destructive X-ray fluorescence analysis point to great versatility in working with copper (or bronze)–gold–silver alloys. The black inlaid decoration is usually copper/bronze–gold alloy with small quantities of silver. Four of the objects were also examined by X-ray radiography.

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Grekulovic, Vesna, Mirjana Rajcic-Vujasinovic, and Zoran Stevic. "Electrochemical behavior of Ag-Cu alloy in alkaline media." Chemical Industry 64, no. 2 (2010): 105–10. http://dx.doi.org/10.2298/hemind100114005g.

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Results of the investigation of electrochemical behaviour of Ag-Cu alloy containing 50 mass% Ag and 50 mass% Cu are presented in this paper. Pure silver and copper were investigated, too. Working electrodes were prepared by metallurgical process. 1 mol dm-3 and 0.5 mol dm-3 solutions of NaOH are chosen as the electrolyte. On the cyclic voltammograms, some current waves corresponding to number and quantity of phases present in the investigated electrodes appeared and they can be used for characterization of investigated alloy. On the voltammogram recorded for pure silver, two anodic and two cathodic peaks appeared. First peak consisted of two joined current waves which can be ascribed to the formation of the two different types of silver(I) oxide, Ag2O. Second peak should correspond to the formation of silver(II) oxide, AgO. Voltammogram obtained for pure copper exhibits one broad current wave corresponding to the formation of copper oxides, followed by a wide potential area in which copper is completely passive. At 0.4 V vs. SCE, current starts to increase again due to oxygen evolution and probably due to simultaneous dissolution of copper with formation of CuO22- as a product. In alkaline solutions copper has no significant influence on the shape and current values of the voltammograms recorded for Ag-Cu alloy; however, it has an influence only on the anodic and cathodic peak potentials, which are shifted to more negative values in comparison to Ag. It could mean an easier formation of oxides and their harder reduction. Comparing voltammograms recorded for Ag-Cu alloy in 0.5 moldm-3 NaOH and in 1 moldm-3 NaOH solutions, one can see that current waves appear at more positive potentials on the voltammograms obtained in the solution of lower concentration and with much higher current densities than those on the voltammograms obtained in the solution of higher concentration.

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Chauvin, Adrien, Cyril Delacôte, Mohammed Boujtita, Benoit Angleraud, Junjun Ding, Chang-Hwan Choi, Pierre-Yves Tessier, and Abdel-Aziz El Mel. "Dealloying of gold–copper alloy nanowires: From hillocks to ring-shaped nanopores." Beilstein Journal of Nanotechnology 7 (September 29, 2016): 1361–67. http://dx.doi.org/10.3762/bjnano.7.127.

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We report on a novel fabrication approach of metal nanowires with complex surface. Taking advantage of nodular growth triggered by the presence of surface defects created intentionally on the substrate as well as the high tilt angle between the magnetron source axis and the normal to the substrate, metal nanowires containing hillocks emerging out of the surface can be created. The approach is demonstrated for several metals and alloys including gold, copper, silver, gold–copper and gold–silver. We demonstrate that applying an electrochemical dealloying process to the gold–copper alloy nanowire arrays allows for transforming the hillocks into ring-like shaped nanopores. The resulting porous gold nanowires exhibit a very high roughness and high specific surface making of them a promising candidate for the development of SERS-based sensors.

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Yang, Guang, and Ji Zhou. "The Annealing Effect on Optical Properties of Silver Copper Alloy Films." Applied Mechanics and Materials 320 (May 2013): 329–35. http://dx.doi.org/10.4028/www.scientific.net/amm.320.329.

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In this paper, the dielectric functions of Ag-30.3at.%Cu alloy films upon the annealing effect were investigated by variable angle spectroscopy ellipsometry (VASE). The silver copper alloy films were deposited onto p-type silicon (100) substrate by direct current (DC) magnetron sputtering. With the increase of annealing temperature from 100 °C to 300 °C, the image part of the permittivity for Ag-30.3at.%Cu is significantly decreased in the wavelength below ~500 nm. The structure and surface topography of the alloy films were characterized using high resolution scanning electron microscopy (HR-SEM) and X-ray diffraction (XRD). The effective medium theory (EMA) has been utilized for the treating of surface roughness. The dielectric functions can be manipulated by changing the annealing temperature. Key words: Dielectric functions; silver copper alloy films; magnetron sputtering

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Lu, Yu Ying, Hong Xing Zheng, Fa Qin Xie, and Jian Guo Li. "Directional Solidification of Undercooled Hypoeutectic Silver-Copper Alloy Melt." Materials Science Forum 475-479 (January 2005): 2607–10. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.2607.

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Directional solidification of the undercooled melt which combines melt undercooling with conventional directional solidification is a new method of obtaining directional structure. This method is used to realize the directional solidification of the undercooled Ag70.3Cu29.7 melt. The experiment is performed in two steps: The undercooled melt is obtained by glass fluxing, and the above specimen is remelted and excited with Ga-In-Sn coolant. By this method, directional solidification dendrites of Ag70.3Cu29.7 alloy are achieved successfully. The columnar dendrites are straight and fine. The primary arm spacing is 21µm in average for a 65K undercooling, as compared to 38µm for a 32K undercooling. This confirms that higher undercooling promotes finer dendritic microstructures.

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Lei, Yimin, Fuyi Chen, Bin Huang, and Zongwen Liu. "Synthesis and characterization of L12ordered silver-copper alloy nanodendrites." Materials Research Express 1, no. 1 (March 3, 2014): 015031. http://dx.doi.org/10.1088/2053-1591/1/1/015031.

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Nag, Soumya, Kristopher C. Mahdak, Arun Devaraj, Smita Gohil, Pushan Ayyub, and Rajarshi Banerjee. "Phase separation in immiscible silver–copper alloy thin films." Journal of Materials Science 44, no. 13 (July 2009): 3393–401. http://dx.doi.org/10.1007/s10853-009-3449-0.

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Avarmaa, Katri, Hugh O’Brien, Lassi Klemettinen, and Pekka Taskinen. "Precious metal recoveries in secondary copper smelting with high-alumina slags." Journal of Material Cycles and Waste Management 22, no. 3 (December 31, 2019): 642–55. http://dx.doi.org/10.1007/s10163-019-00955-w.

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AbstractWaste electrical and electronic equipment (WEEE) represents a significant urban resource for precious metals. To maximize the recoveries and sustainable use of these metals, their behavior needs to be characterized in the secondary copper smelting of WEEE. The current study experimentally determined the distributions of gold, silver, platinum and palladium between copper alloy and FeOx–SiO2–Al2O3/FeOx–SiO2–Al2O3–CaO slags (LCu/s[M] = [M]Copper/[M]Slag) over the oxygen partial pressure range of 10−5 – 10−10 atm at 1300 °C. In addition, the equilibria of copper alloy, slag and Al–Fe spinel system are presented and discussed. The experiments were conducted employing an equilibration—drop-quenching technique followed by major element analysis with Electron Probe MicroAnalysis (EPMA) and trace element analysis with sensitive Laser Ablation Inductively Coupled Plasma Mass Spectrometry (LA-ICP-MS). The results showed that the distribution coefficient of silver increased from 10 to 103 as a function of decreasing oxygen partial pressure. For gold, platinum and palladium, the distribution coefficients were at minimum 105. Lime addition improved the recovery of silver notably and had a small positive effect on gold recovery into copper. Overall, the precious metals can be recovered very efficiently in copper alloy via secondary copper smelting with alumina-rich iron-silicate slags.

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Kadhim, Mohammed O., Wisam A. Latif, Fayq Hsan Jabbar, and Sura T. Nassir. "Effect of Copper Content Addition to Dental Amalgam Properties." NeuroQuantology 19, no. 2 (March 20, 2021): 38–44. http://dx.doi.org/10.14704/nq.2021.19.2.nq21015.

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A set of high-copper amalgam alloys have been prepared based on the change in the ratio of copper to silver using elemental components of high purity 99.9%. The amalgamation processes were done by mixing alloy powders with mercury at a fixed ratio. Structural properties were studied using X-ray diffraction and Optical Microscopy. Also, microhardness, and compressive strength were used to study some other important mechanical properties. The prepared amalgams were compared with well-known commercial amalgams; ANA 2000 and Standalloy F. The results of X-ray diffraction showed several prime phases in alloys and amalgams whose proportions and distribution depended on the copper content in the alloy. The results of mechanical test measurements showed a linear increase in the mechanical properties with increasing copper content in the amalgams. The results were similar to the measured values of the commercial amalgam.

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Gale, N. H., Z. A. Stos-Gale, and G. R. Gilmore. "Alloy Types and Copper Sources of Anatolian Copper Alloy Artifacts." Anatolian Studies 35 (December 1985): 143–73. http://dx.doi.org/10.2307/3642880.

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Few will doubt that in the East Mediterranean world and in the Near East the development of metallurgy was an important factor (though certainly not the only one) in the evolution of socio-economic organization in the Late Chalcolithic and especially in the Early and Late Bronze Age. The availability of silver, lead and gold added markedly to the possibilities of the acquisition of prestigious objects by the few, to developments in the concept of wealth and in the development of hierarchical societies. The availability of copper, arsenical copper, and later, tin bronze made possible the production of tools which transformed certain crafts (perhaps particularly carpentry and shipbuilding) and, with the development of weapons, revolutionized warfare.This no doubt led to something of an arms race which put its own pressures on societies in the search for and exploitation of metals. The more successful population groups will have greatly increased the density of their population and changed their structure, not only by moving from local chief to regional monarch but also by that monarch securing his authority by the creation of dependent privileged groups and by the encouragement of the emergence of specialized workers and craftsmen. In turn such socio-economic developments, in which the emergence of class differentiation led to the creation of aristocracies or other forms of elite ruling classes, eventually provided the environments in which skilled metal workers could find the time, necessary incentives and artistic inspiration to develop advanced metalworking skills.

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Nikanorov, A. V. "Silver-Containing Concentrate Processing." Materials Science Forum 989 (May 2020): 456–60. http://dx.doi.org/10.4028/www.scientific.net/msf.989.456.

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The goal of the research was to melt the silver-containing concentrate from the Dukatsk deposit (Magadansk region) in a reverberatory furnace. Preparatory research has established that internal collector smelting is an effective way to recover precious metals from the flotation concentrate of the Dukatsk deposit. This method is based on the property of lead and copper in the concentrate in an amount comparable to that of silver, to collect precious metals in a metal or matte phase in the process of segregation smelting. Recovery of silver in a high-grade alloy in one technological operation corresponds to the planned performance (silver recovery into an alloy of 93.0%) in processing flotation concentrates at non-ferrous industry plants.

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Vaganov, Danil V., Sergei Zhevnenko, and Yuri Terentyev. "Grain Boundary Diffusion of Silver in Copper-Iron Alloys." Defect and Diffusion Forum 323-325 (April 2012): 161–64. http://dx.doi.org/10.4028/www.scientific.net/ddf.323-325.161.

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Grain boundary (GB) diffusion of Ag in Cu-based alloys with Fe (0, 0.14, 0.29, 0.43, 0.55 and 0.99 at. % Fe) was investigated. The experiments were performed at 600, 650 and 700 °C, which corresponded to B-regime. It was proved by the presence of diffusion wedges. The triple product of silver GB diffusion was obtained by measuring of angle at the top of isoconcentration profiles which was detected by electrochemical etching. It was shown that iron decreased the triple product at higher temperatures and didnt affect significantly at lower temperatures. SEM investigation showed the presence of small (10-100 nm) precipitates on the copper grain boundaries. Analysis of particles composition by Auger electron spectroscopy indicated higher concentration of iron comparing with the alloy composition.

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Santella, Michael L., Joseph A. Horton, and Jong Jin Pak. "Microstructure of Alumina Brazed with a Silver-Copper-Titanium Alloy." Journal of the American Ceramic Society 73, no. 6 (June 1990): 1785–87. http://dx.doi.org/10.1111/j.1151-2916.1990.tb09835.x.

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Wagatsuma, Kazuaki, and Kichinosuke Hirokawa. "Emission spectroscopic studies of sputtering on silver-copper alloy surfaces." Analytical Chemistry 58, no. 6 (May 1986): 1112–15. http://dx.doi.org/10.1021/ac00297a029.

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Baryshev, Evgeny, Tatyana Kostina, Gennady Tyagunov, and Ksenya Shmakova. "Investigation of Copper-Silver Solders Properties in Liquid State before Amorphization." Key Engineering Materials 660 (August 2015): 93–96. http://dx.doi.org/10.4028/www.scientific.net/kem.660.93.

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The temperature and concentration dependences of kinematic viscosity of alloys of Cu-Ag system with Ag content to 99 mass % in liquid state have been studied. It has been found that heating above certain critical temperatures leads to transform the melt to equilibrium state. The kinematic viscosity of the Cu-Ag melts are extremely depend from silver content in the alloy. The new regime of amorphous ribbon production is selected. Proposed regime leads to increasing of microhardness and weld strength on 10 % and corrosion resistivity on 15 %.

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Tkalcec, Iva, Daniele Mari, and Robert Schaller. "Anelastic Effects of Phase Decomposition in 14-Carat AuAgCu Alloy." Solid State Phenomena 184 (January 2012): 277–82. http://dx.doi.org/10.4028/www.scientific.net/ssp.184.277.

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A relaxation peak has been observed in the internal friction spectrum of 18-carat AuAgCu yellow gold alloys at about 750K for 0.5Hz. It is related to the presence of grain boundaries, since it is absent in the spectrum of single crystals. For the 14-carat yellow gold alloy (Au38%Ag32%Cu30%), a phase decomposition between silver-rich and copper-rich solid solution occurs in the same temperature range. The effects of the phase decomposition on the internal friction and the dynamic modulus are studied by isochronal and isothermal measurements and correlated with the microstructure evolution. Upon cooling, the phase decomposition starts at grain boundaries at about 840K, producing a fine lamellar structure, and the grain boundary peak amplitude strongly decreases. As the phase decomposition progresses at the interior of the grains upon further cooling, the internal friction background increases. It remains very high in heating until solid solution homogenisation, which occurs above 890K. Such an increase of the internal friction background is observed also in the single crystalline alloy and may be attributed to the interfaces between lamellae of the silver and copper-rich phase.

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Wang, Frank Fan, William McKeague, and Christina Polwarth. "Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000596–601. http://dx.doi.org/10.4071/2380-4505-2018.1.000596.

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Abstract Tin-lead alloys have historically been popular in the electronics industry for use in solder-attach applications. Despite recent restrictions related to lead content, some industries continue to use lead based alloys in solder applications. Tin-lead based alloys, in particular, have proven to have excellent solderability to tin, nickel, copper, gold, and silver metallization surfaces. They have also performed better in reliability than most of the lead free solders. As a result of this, they are still widely used in the aerospace and military electronics industry. Hybrid microelectronics built for space applications use both Tin-Lead-Silver Alloy Sn62 and Lead Free Soldering Alloy Sn96; these solders are used both for wire and component attach as well as substrate to header attach. This article discusses the differences of these two solders, using both literature and experimental study. Experimental testing involving pull tests further supports this conclusion.

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Fokanov, A. N., V. F. Podurazhnaya, A. V. Tebyakin, and V. S. Kaskov. "Brazing the beryllium window in copper frame by silver brazing alloy." Proceedings of VIAM, no. 11 (November 2016): 1. http://dx.doi.org/10.18577/2307-6046-2016-0-11-1-1.

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Ciacotich, Nicole, Rameez Ud Din, Jens J. Sloth, Per Møller, and Lone Gram. "An electroplated copper–silver alloy as antibacterial coating on stainless steel." Surface and Coatings Technology 345 (July 2018): 96–104. http://dx.doi.org/10.1016/j.surfcoat.2018.04.007.

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Knight, J. M., J. L. C. Fonseca, Z. V. Hauptman, and J. P. S. Badyal. "Novel surface segregation phenomena at the plasma/copper-silver alloy interface." Chemistry of Materials 5, no. 9 (September 1993): 1221–26. http://dx.doi.org/10.1021/cm00033a007.

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Bednar, M. "Amorphous and alloy film formation in sliding of silver on copper." Wear 181-183 (March 1995): 922–37. http://dx.doi.org/10.1016/0043-1648(94)07111-x.

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Castro-Dettmer, Z., M. Simmons, and C. Persad. "Obtainable microstructures in electrical conductors made of a copper-silver alloy." IEEE Transactions on Magnetics 39, no. 1 (January 2003): 323–26. http://dx.doi.org/10.1109/tmag.2002.806372.

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Bednar, M. S., and D. Kuhlmann-Wilsdorf. "Amorphous and alloy film formation in sliding of silver on copper." Wear 181-183 (March 1995): 922–37. http://dx.doi.org/10.1016/0043-1648(95)90216-3.

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37

Snigirev, A. I., L. M. Zheleznyak, and E. A. Shushakova. "Improving the quality of strips made of a copper-silver alloy." Metallurgist 56, no. 7-8 (November 2012): 546–50. http://dx.doi.org/10.1007/s11015-012-9612-x.

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Hurtony, Tamás, Oliver Krammer, Balázs Illés, Gábor Harsányi, David Bušek, and Karel Dušek. "Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates." Materials 13, no. 22 (November 20, 2020): 5251. http://dx.doi.org/10.3390/ma13225251.

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Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s. After measuring the shear force and the Vickers hardness, the structures of the fracture surfaces and the intermetallic layer were investigated by SEM (Scanning Electron Microscopy). The mechanical property measurements showed lower shear force for the SAC0307-Mn07 alloy (20–25 N) compared with the SAC305 alloy (27–35 N), independent of the cooling rate. However, the SAC0307-Mn07 alloy was softer; its Vickers hardness was between 12 and 13 HV, whereas the Vickers hardness of the SAC305 alloy was between 19 and 20 HV. In addition, structural analyses revealed rougher intermetallic compound layers in the case of the SAC0307-Mn07 alloy, which can inhibit the propagation of cracks at the solder–substrate interface. These two properties of SAC0307-Mn07 alloy, the softer nature and the rougher intermetallic layer, might result in better thermomechanical behavior of the solder joints during the lifetime of electronic devices.

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Gao, Hongtao, Jun Lu, Richard Lu, Wei Xin, Xiaojing Xu, and Hamza Yilmaz. "Reliability Study of Silver, Copper and Gold Wire Bonding on IC Device." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000850–55. http://dx.doi.org/10.4071/isom-thp33.

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Copper wire bonding in IC packages is not always suitable for devices with active circuit under bonding pad because higher bonding power required for copper wire bonding may cause top aluminum metal splash and mechanically impact the circuit underneath. Silver wire is an alternative solution to this problem based on its physical properties and lower cost compared to gold wire. Ag88%Au8.5%Pd2.5%X1% and Ag95%Au1.5%Pd2.5%X1% alloyed silver wires are used in the study to compare with copper and gold wires of 99.99% in purity. As bonding power plays a dominating role in wire bonding, we focused on the effects of silver, copper and gold bonding wires with different bonding power on the top aluminum metal splash of power device by Optical Microscope(OM) and Scanning Electron Microscope(SEM). The ball shear strength of the bonding wires with different bonding power in samples without mold compound encapsulation was investigated before and after 24, 48, 96 and 192 hours of pressure cooker test (PCT). The intermetallic compound (IMC) formed between silver and aluminum was confirmed by focus ion beam (FIB) and transmission electron microscope (TEM). Although the top surface of the silicon device shows no significant difference after aluminum layer removal for all three wire types, the severity level of vertical deformation and side splash of aluminum layer due to copper wire bonding is much more than silver or gold wire using same amount of bonding power. Ball shear strength of non-encapsulated silver wire decreases dramatically after PCT aging compared with copper wire or gold wire and some samples show zero shear strength after PCT 96 hours and PCT 192 hours for silver wires doped with Pd/Au. Furthermore, larger bonding power induces higher ball shear strength. The major IMC compositions between silver and aluminum are Ag3Al and Ag2Al. A thermo dynamic model was built to explain why silver wire is prone to corrosion compared with copper wire by humidity although copper is easier to be ionized than silver. No electrical test was performed as the samples cannot be tested without package encapsulation and singulation. Furthermore, silver wire samples in SO8 package with mold compound encapsulation were subjected to highly accelerated stress test (HAST), PCT, temperature cycle test (TCT) after MSL1 preconditioning test as well as high temperature operation life test (HTOL) according to JEDEC procedures. The encapsulated samples using either Ag 88wt% or Ag95wt% alloys all passed MSL1 and PCT/HAST/TCT/HTOL. Drain to source on-resistance (Rdson) of the device including package parasitics was measured and it has no significant difference between silver wire and gold wire. The results from this study shows promising data using silver alloy wires but care should be taken to further understand the degradation of silver-aluminum interface under severe humidity condition. Using other metallization on silicon top surface such as NiAu or CuAu can significantly alleviate the interface problem related to AgAl.

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Castro-Dettmer, Z., and C. Persad. "Performance of a copper-silver alloy as an electromagnetic launcher conductor material." IEEE Transactions on Magnetics 41, no. 1 (January 2005): 176–81. http://dx.doi.org/10.1109/tmag.2004.838926.

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Kingstedt, O. T., B. P. Eftink, I. M. Robertson, and J. Lambros. "Anisotropic dynamic compression response of a directionally-cast silver–copper eutectic alloy." Acta Materialia 105 (February 2016): 273–83. http://dx.doi.org/10.1016/j.actamat.2015.12.024.

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Yang, Guang, Xiaojian Fu, and Ji Zhou. "Dielectric properties of the silver–copper alloy films deposited by magnetron sputtering." Journal of the Optical Society of America B 30, no. 2 (January 7, 2013): 282. http://dx.doi.org/10.1364/josab.30.000282.

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Haverkamp, R. G., A. T. Marshall, and D. van Agterveld. "Pick your carats: nanoparticles of gold–silver–copper alloy produced in vivo." Journal of Nanoparticle Research 9, no. 4 (January 11, 2007): 697–700. http://dx.doi.org/10.1007/s11051-006-9198-y.

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Okabe, T., and R. J. Mitchell. "Setting Reactions in Dental Amalgam Part 2. the Kinetics of Amalgamation." Critical Reviews in Oral Biology & Medicine 7, no. 1 (January 1996): 23–35. http://dx.doi.org/10.1177/10454411960070010201.

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The literature on the setting mechanisms of dental amalgams made from powders of silver-rich alloys of tin and/or copper has been critically reviewed. Part 2 is a review of the kinetics of the reactions that convert the mixture of alloy powder and liquid mercury to hardened amalgam containing the phases and microstructures described in Part I . It is emphasized that amalgamation is a non-equilbrium process in which hardened microstructures are determined as much by kinetics as by chemistry. The setting reaction begins with dissolution of silver and tin into liquid mercury; most of the product phases precipitate in the liquid mercury. The processes that produce supersaturation in the liquid mercury and the subsequent nucleation and growth of solid phases are considered. Mass balance relationships that provide insight into the factors that control the volume fraction of the undesirable γ2 Sn-Hg phase are described. The nucleation and growth of η' Cu-Sn crystals are also discussed : it is found that these crystals nucleate on copper-rich phases and grow into the liquid mercury. Finally, aspects of the setting reaction that are controlled by intergranular and interphase diffusion in the solid are discussed. These aspects include the supersaturation of silver and tin within the liquid mercury, nucleation and growth of the β1 Ag-Hg phase in the surfaces of alloy particles, and the decomposition of initially formed γ2 Sn-Hg.

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Sekine, Kazuyoshi, and Zheng Rong Zhang. "The Influence of Palladium Addition on the Texture Transition in Silver." Materials Science Forum 495-497 (September 2005): 1461–66. http://dx.doi.org/10.4028/www.scientific.net/msf.495-497.1461.

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Texture transition in silver introduced by the addition of 10 at% Pd alloying element was analyzed in this study. Experimental results show that the dependence of rolling texture on rolling reduction in thickness rather than on rolling temperature has been mostly detected, and the recrystallization texture transition process in pure silver is so strongly influenced by the addition of alloying element palladium that the final stable state of recrystallization texture has been changed from Brass {011}<211> orientation to Copper {112}<111> orientation. The single cube {001}<100> recrystallization texture in warm rolled silver, Brass {011}<211> recrystallization texture in room-temperature rolled silver, and Copper {112}<111> recrystallization texture in room-temperature rolled or warm rolled Ag-10 at% Pd alloy have been successfully developed for the fabrication of metallic substrates suitable for high-temperature superconducting tapes.

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46

Williams, Rick. "An Experiment in Manufacturing Blanks and Striking Coins." Antichthon 50 (November 2016): 17–32. http://dx.doi.org/10.1017/ann.2016.3.

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AbstractIn the second half of the 6th century BC four South Italian Greek colonial cities – Sybaris, Croton, Metapontum and Caulonia – were minting silver-copper alloy coins, all in the incuse fabric, with the same weight standard of c. 8gm. These incuse coins were to remain in production at Croton and Metapontum for the next 100 years.Coins hoards indicate that these four cities began minting their coinage at the outset as very fine, artistic – even exquisite – objects of fine crafts-manship. Each coin was thin (1mm), broad (30mm) and of a consistently uniform weight and diameter, and each coin was struck between dies of exceptional quality. During subsequent decades the diameter of the coinage was progressively reduced.At Monash University in 1980 we conducted experiments in coin manufacturing to determine how the minters at Croton in the 6th century produced these thin, incuse coins from only a small amount (8gm) of silver alloy, how they maintained a consistent weight standard across a century of minting, and why they progressively reduced the size of their coins during this period.It is well-known that the manufacturing processes of objects made from metal alloys can be revealed by examining their crystal structures.In our experiments in manufacturing broad, thin ‘Monash coins’, we examined the crystal structures at various stages throughout the process. To do this we made coin blanks of various diameters, all made from 8gm of silver-copper alloy. These blanks were subjected to hardness tests and photographs were made of the alloy’s crystal microstructures. ‘Coins’ were then minted by striking blanks between two manufactured replica dies, and their microstructures were compared with the microstructures of a genuine Croton incuse coin fragment.This is the first time these results have been published.

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Cho, Hoon, Han Shin Choi, and Hyung Ho Jo. "Fabrication of Nickel-Silver Rods and Plate through a Small Cross Section Continuous Casting Process." Materials Science Forum 510-511 (March 2006): 322–25. http://dx.doi.org/10.4028/www.scientific.net/msf.510-511.322.

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The environmentally friendly manufacturing process, continuous casting process with small cross sections, is the near net-shaped manufacturing technology used to fabricate copper alloy wires and plates with the required final tolerance and sound quality. Furthermore, the process consumes less energy and discharges less environmental loads because the process can eliminate the need for hot extrusion, hot rolling and heat treatment for production copper alloy wires and plate. In the present study, the effects of a continuous casting speed on the mechanical properties and the microstructure of the nickel-silver (Cu-Ni-Zn) alloy were studied and energy requirements, atmospheric CO2 emission and yield for the production of the Cu-Ni-Zn alloy was investigated quantitatively with respect to continuous casting with small cross sections and conventional material processing including casting, extrusion and heat treatment. The yield for production of Cu-Ni-Zn alloy can be improved above 30% with the application of continuous casting with small cross sections when the productivity is similar. Twice the amount of energy required and CO2 were consumed and emitted in the conventional manufacturing process when the yield of the processes was considered.

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Abdulrehman, Tahir, Shahnaz Qadri, Sini Skariah, Ali Sultan, Said Mansour, Jamil Azzi, and Yousef Haik. "Boron doped silver-copper alloy nanoparticle targeting intracellular S. aureus in bone cells." PLOS ONE 15, no. 4 (April 10, 2020): e0231276. http://dx.doi.org/10.1371/journal.pone.0231276.

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Sakai, Y., K. Inoue, T. Asano, and H. Maeda. "Development of a high strength, high conductivity copper-silver alloy for pulsed magnets." IEEE Transactions on Magnetics 28, no. 1 (1992): 888–91. http://dx.doi.org/10.1109/20.120021.

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Andrieux, J., O. Dezellus, F. Bosselet, and J. C. Viala. "Low-Temperature Interface Reaction Between Titanium and the Eutectic Silver-Copper Brazing Alloy." Journal of Phase Equilibria and Diffusion 30, no. 1 (November 19, 2008): 40–45. http://dx.doi.org/10.1007/s11669-008-9424-7.

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Journal articles on the topic 'Silver-copper alloy'

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