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Journal articles on the topic 'Silver Copper'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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1

Ciacotich, Nicole, Lasse Kvich, Nicholas Sanford, Joseph Wolcott, Thomas Bjarnsholt, and Lone Gram. "Copper-Silver Alloy Coated Door Handles as a Potential Antibacterial Strategy in Clinical Settings." Coatings 10, no. 8 (August 14, 2020): 790. http://dx.doi.org/10.3390/coatings10080790.

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Coating surfaces with a copper-silver alloy in clinical settings can be an alternative or complementary antibacterial strategy to other existing technologies and disinfection interventions. A newly developed copper-silver alloy coating has a high antibacterial efficacy against common pathogenic bacteria in laboratory setups, and the purpose of this study is to determine the antibacterial efficacy of this copper-silvery alloy in real-world clinical settings. Two field trials were carried out at a private clinic and a wound care center. Door handles coated with the copper-silver alloy had a lower total aerobic plate count (1.3 ± 0.4 Log CFU/cm2 and 0.8 ± 0.3 Log CFU/cm2, CFU stands for Colony Forming Units) than the reference uncoated material on-site (2.4 ± 0.4 Log CFU/cm2 for the stainless steel and 1.7 ± 0.4 Log CFU/cm2 for the satin brass). The copper-silver alloy did not selectively reduce specific bacterial species. This study points to the possibility of a successful long-term implementation of the copper-silver alloy coating as an antibacterial strategy.

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2

Chekman, I. S. "Pharmacological Properties of Metal (Silver, Copper, and Iron) Nanoparticles." Science and innovation 11, no. 1 (January 30, 2015): 67–71. http://dx.doi.org/10.15407/scine11.01.067.

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3

Muñoz-Rojas, David. "Silver-copper mixed oxides." Materials Today 14, no. 3 (March 2011): 119. http://dx.doi.org/10.1016/s1369-7021(11)70067-0.

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4

Savelyev, Yuri, Alexey Gonchar, Boris Movchan, Alexey Gornostay, Sergey Vozianov, Adel Rudenko, Rita Rozhnova, and Tamara Travinskaya. "Novel biologically active polyurethane materials containing silver and copper nanoparticles." Polymer journal 38, no. 3 (June 6, 2016): 255–60. http://dx.doi.org/10.15407/polymerj.38.03.255.

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5

Choi, Yeon-Uk, and Kenneth N. Han. "The Dissolution Behavior of Silver and Copper from Silver and Copper Alloys." Mineral Processing and Extractive Metallurgy Review 9, no. 1 (February 1, 1992): 43–60. http://dx.doi.org/10.1080/08827509208952693.

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6

Walraven, Nikolaj, Wiebe Pool, and Conrad Chapman. "The dosing accuracy of copper and silver ionisation systems: separate high purity copper and silver electrodes versus copper/silver alloys." Journal of Water Process Engineering 8 (December 2015): 119–25. http://dx.doi.org/10.1016/j.jwpe.2015.09.008.

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7

Xie, Xian, Kai Hou, Xiong Tong, Yong Cheng Zhou, and Xiang Wen Lv. "Recovery of Copper and Silver by Flotation from Smelting Copper Slags." Applied Mechanics and Materials 543-547 (March 2014): 3963–66. http://dx.doi.org/10.4028/www.scientific.net/amm.543-547.3963.

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The recovery of copper from smeltery furnace slag by flotation has been studied. By analysis the slag containing 1.61% copper and 27.80g/t silver is available to recovery. The effective factors such as particle size, the amount and type of collector were examined. The combination of the collectors was also examined. With the process utilized in this work, a copper concentrate of 26.47% Cu with a recovery of 78.85% is produced. The associated silver is mostly concentrated to the copper concentrate, and the silver recoveried in the copper concentrate is 97.57%.

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8

Ortega-Arizmendi, Aldo I., Eugenia Aldeco-Pérez, and Erick Cuevas-Yañez. "Alkyne-Azide Cycloaddition Catalyzed by Silver Chloride and “Abnormal” SilverN-Heterocyclic Carbene Complex." Scientific World Journal 2013 (2013): 1–8. http://dx.doi.org/10.1155/2013/186537.

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A library of 1,2,3-triazoles was synthesized from diverse alkynes and azides using catalytic amounts of silver chloride instead of copper compounds. In addition, a novel “abnormal” silverN-heterocyclic carbene complex was tested as catalyst in this process. The results suggest that the reaction requires only 0.5% of silver complex, affording 1,2,3-triazoles in good yields.

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9

Sun, Hong Peng, Kai Jun Wang, Xiao Lan Cai, Gang Yue, and Ya Guang Chen. "Preparation and Performance of Silver Coated Copper Powder." Advanced Materials Research 750-752 (August 2013): 1057–62. http://dx.doi.org/10.4028/www.scientific.net/amr.750-752.1057.

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Different parameters are used to characterize the conductivity of copper powder with silver plating. Ethanediamine（C2H8N2） is employed to adjust the pH value of plating solution (solution A), and chelate Cu2+ generated by side reaction, forming sound five-membered ring structure with Cu2+, thus preventing the formation of Cu(NH3)42+ which can avoid adsorption of Cu(NH3)42+ on the surface of copper powder. In this way silver-plated copper powder with conductivity equal to fine silver powder can be obtained, the effects of dosage of C2H8N2 and Tollens' reagent concentration on performance of silver-plated copper powder have also been investigated. The result shows that dosage of C2H8N2 has significant effects on electrical conductivity of silver-plated copper powder. The dosage of C2H8N2 should ensure that pH value of control solution A maintains 9.0~10.0. The concentration of Tollens' reagent should make sure that the generated silver-plated copper powder is most even and continuous and tightness when silver particles in form of heterogeneous nucleation is surrounded on the surface of copper powder, , and the optimum concentration is 0.09mol/L. The conductivity of silver-plated copper powder made by Tollens' reagent with 0.09mol/L concentration is optimal, which is 3.9×10-4Ω•cm,when adjusting the pH value of solution A to 9.5 by C2H8N2 control.

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10

Zhu, Xiao Yun, Lie Hu, and Man Dong. "Synthesis and Characterization of Silver-Coated Copper Powder Layer." Key Engineering Materials 512-515 (June 2012): 141–46. http://dx.doi.org/10.4028/www.scientific.net/kem.512-515.141.

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This paper presents the process of preparing spherical silver-coated copper powder with a silver content of 30-50%, using chemical reduction and by adjusting the silver-coating process. By means of SEM, XRD, grain size analyser, digital ohmmeter and differential thermal analyser, the surface topology, structure and conductivity of silver-coated copper powder and raw copper powder are characterised. The results show that the spherical silver-coated copper powder has superior compact surface, complete coverage, a coated layer reaching a thickness of 336nm and excellent conductivity and anti-oxidation property.

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11

Han, Wang, Zou, and Shi. "Separation of Ag and Cu from Their Aqueous Thiosulfate Complexes by UV-C Irradiation." Metals 9, no. 11 (October 31, 2019): 1178. http://dx.doi.org/10.3390/met9111178.

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In recent years, there has been renewed interest in the use of thiosulfate as a substitute for cyanide in silver leaching. Copper thiosulfate leaching without ammonia was applied to extract silver from silver sulfide, resulting in the production of Ag–Cu polymetallic thiosulfate complexes in solutions. It is necessary to separate Ag–Cu polymetallic thiosulfate complexes with the purposes of silver recovery and copper recycling. In this paper, the feasibility study on the use of UV-C irradiation to separate Ag–Cu polymetallic thiosulfate complexes was investigated based on the different photosensitivity of silver and copper. First, a kinetic study on the photolysis of silver and copper thiosulfate complexes by UV-C was investigated, indicating that the reactions follow first-order kinetics. The rate constant reactions were calculated, and it decreased with solution concentrations. On the other hand, the photoproducts of the silver and copper thiosulfate complexes were characterized by XRD and XPS in order to confirm the phase and chemical composition. It indicated that the silver photoproducts are Ag2S, S, Ag and the copper photoproducts are Cu2S, CuS, CuO, Cu, S. Finally, the four-step continuous separation of Ag–Cu polymetallic thiosulfate complexes by UV-C irradiation was investigated. The silver component was recovered with the accumulated recovery ratio of 97%, and the copper component was recycled with the accumulated recycle ratio of 51%, which made it possible for silver recovery and copper recycling.

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12

Song, Yong Hui, Ting Su, Yong Yang, Xin Zhe Lan, and Huan Zhan. "Novel Preparation of Silver-Coated Copper in Aqueous Solution." Materials Science Forum 658 (July 2010): 173–76. http://dx.doi.org/10.4028/www.scientific.net/msf.658.173.

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Hollow and solid spherical silver-coated copper powders with size of 1μm were facilely prepared by the reduction of silver nitrate in the polyvinyl pyrrolidone (PVP) dispersed copper hydrosol solution at room temperature in the presence of hydrazine hydrate. Scanning electron microscopy and X-ray diffraction were conducted to investigate the formation process of silver-coated copper core-shell particles. The results showed that the absorption and deposition of the Ag nuclei initially occurred at the active sites on the core surfaces as seeds which urged the further deposition of silver species to form sprinkled-structure core-shell particles. During the growth of the silver shell, the dissolution of copper core would result in the formation of hollow spherical particles, while the hydrazine hydrate would help to generate the solid spherical silver-coated copper powders.

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13

Singh, Rekha, Woohang Kim, and James A. Smith. "Effect of Chloride Ions on the Point-of-Use Drinking Water Disinfection Performance of Porous Ceramic Media Embedded with Metallic Silver and Copper." Water 12, no. 6 (June 6, 2020): 1625. http://dx.doi.org/10.3390/w12061625.

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This study quantifies the effects of chloride ions on silver and copper release from porous ceramic cubes embedded with silver and copper and its effect on E. coli disinfection in drinking water. Log-reduction of E. coli by silver ions decreased after 4 h of contact time as the chloride ion concentration increased from 0 to 250 mg/L but, it was not changed by copper ions under the same conditions. For silver addition by silver-ceramic cubes, log reductions of E. coli decreased sharply from 7.2 to 1.6 after 12 h as the chloride concentration increased from 0 to 250 mg/L. For the silver-ceramic cube experiments, chloride ion also reduced the total silver concentration in solution. After 24 h, total silver concentrations in solution decreased from 61 µg/L to 20 µg/L for corresponding chloride ion concentrations. According to the MINTEQ equilibrium model analysis, the decrease in disinfection ability with silver embedded ceramic cubes could be the result of precipitation of silver ions as silver chloride. This suggests that AgCl was precipitating within the pore space of the ceramic. These results indicate that, although ionic silver is a highly effective disinfectant for E. coli, the presence of chloride ions can significantly reduce disinfection efficacy. For copper-ceramic cubes, log reductions of E. coli by copper embedded cubes increased from 1.2 to 1.5 when chloride ion concentration increased from 0 to 250 mg/L. Total copper concentrations in solution increased from 4 µg/L to 14 µg/L for corresponding chloride ion concentrations. These results point towards the synergistic effect of chloride ions on copper oxidation as an increased concentration of chloride enhances copper release.

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14

Hikmah, Nurul, Nor Faeqah, and Abdul Hadi. "Synthesis of Silver-Copper Nanoparticles via Polyol Method: Effect of Reaction Time and Temperature." Advanced Materials Research 1113 (July 2015): 605–10. http://dx.doi.org/10.4028/www.scientific.net/amr.1113.605.

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This paper discusses the effect of reaction time and temperature of silver-copper nanoparticles prepared by a polyol method. In this study, silver-copper nanoparticles were synthesized through the green approach of polyol method using ethylene glycol (EG) as green solvent and reductant, and polyoxyethylene-(80)-sorbitan monooleate (Tween 80) as a nontoxic stabilizer. The phase and morphology of silver-copper nanoparticles were characterized by X-ray diffraction (XRD) and Field emission scanning electron microscope (FESEM). The results XRD confirmed silver and copper nanoparticles to be phase-pure crystalline silver and copper with face-centered cubic (fcc) structure on the basis of XRD analyses. FESEM analysis confirmed the existence of Ag and Cu nanoparticles.

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15

Kelley, H. E. "Properties of copper-silver and dispersion strengthened copper." Metal Powder Report 56, no. 6 (June 2001): 40–41. http://dx.doi.org/10.1016/s0026-0657(01)80383-0.

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16

Zhu, Xiao Yun, Man Dong, and Xu Xiao Yi. "Preparation of Flake Silver Coated over Copper Powder." Advanced Materials Research 412 (November 2011): 251–54. http://dx.doi.org/10.4028/www.scientific.net/amr.412.251.

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Flake copper powder is coated with silver by using a solution containing [Ag (NH3)]+. Factors such as copper particle size distribution, [Ag (NH3)]+ concentrations and the dispersing agent are studied and correlated with the silver content of coated copper and electric conductivity. At the condition of silver concentration of 0.8 mol/L and dispersing agent of 1.0g/L a powder of copper coated with silver with electric conductivity of 0.8×10-3Ω·cm is obtained. XRD patterns indicate that the powder consists of only the Cu and Ag phases without other intermediate phases. SEM results with different silver contents reveal that when Ag content rises, its surface topography transforms through the steps: individual particles → small islands → continuous 2D layers → multi-layers.

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17

Richtera, Lukáš. "Experimental proof of applicability of alternative sort of plating of contemporary copper forgeries with use of mercury." Numismatické listy 72, no. 1-2 (July 1, 2017): 92–96. http://dx.doi.org/10.1515/nl-2017-0011.

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Abstract Practical applicability of alternative sort of coating of contemporary copper forgeries with use of mercury only (i.e. without use of another metal such as silver or tin) has been experimentally definitely proven. This undescribed way of amalgamation coating is based on simple dipping of a cleaned copper flan in mercury. In few hours, a stable silvery layer of the copper amalgam covers the copper surface. This kind of plating was most likely used by forgers in process of plating of the copper forgeries copying parvi of Wenceslas II at the beginning of the 14th century.

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18

Verbetsky, V. N., and S. V. Mitrokhin. "Copper- Silver- and Gold-Hydrogen." Solid State Phenomena 73-75 (August 2000): 503–0. http://dx.doi.org/10.4028/www.scientific.net/ssp.73-75.503.

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19

Borecki, Aneta, and John F. Corrigan. "New Copper and Silver Trimethylsilylchalcogenolates." Inorganic Chemistry 46, no. 7 (April 2007): 2478–84. http://dx.doi.org/10.1021/ic0618910.

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20

Okamoto, Naoki, Feng Wang, and Tohru Watanabe. "Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates." MATERIALS TRANSACTIONS 45, no. 12 (2004): 3330–33. http://dx.doi.org/10.2320/matertrans.45.3330.

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21

Guan, Y. Charles, and Kenneth N. Han. "An Electrochemical Study on the Dissolution of Copper and Silver from Silver‐Copper Alloys." Journal of The Electrochemical Society 142, no. 6 (June 1, 1995): 1819–24. http://dx.doi.org/10.1149/1.2044199.

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22

Klein, Robert, Martine Desmaison-Brut, Patrick Ginet, Alida Bellosi, and Jean Desmaison. "Wettability of silicon nitride ceramic composites by silver, copper and silver copper titanium alloys." Journal of the European Ceramic Society 25, no. 10 (January 2005): 1757–63. http://dx.doi.org/10.1016/j.jeurceramsoc.2004.12.005.

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23

He, Xin, Ruihui He, Qiuming Lan, Feng Duan, Jundong Xiao, Mingxia Song, Mei Zhang, Yeqing Chen, and Yang Li. "A Facile Fabrication of Silver-Coated Copper Nanowires by Galvanic Replacement." Journal of Nanomaterials 2016 (2016): 1–8. http://dx.doi.org/10.1155/2016/2127980.

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We demonstrated a general strategy to fabricate silver-coated copper nanowires by a galvanic replacement, which is guided by the chemical principle that metal ions (silver ions) with a relatively high reduction potential can galvanically etch nanostructure made from a less metal (copper). Well-dispersed and high-yielded copper nanowires were initially synthesized and then introduced into silver-ammonia solution for the growth of silver nanocrystals on the nanowire surfaces under vigorous oscillation. The results of X-ray diffraction, scanning electron microscope, and transmission electron microscope revealed that the silver nanocrystals were uniformly distributed on the copper nanowire surfaces to form Cu-Ag heterostructures. The concentration of silver-ammonia solution and the time of replacement reaction determine the size and density of the silver nanocrystals. Our investigation might pave the way to the synthesis of other bimetallic nanostructures via a facile, fast, and economical route.

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24

Kimura, Wayne D. "Absorptance characteristics of silver and silver-on-copper mirrors." Applied Optics 26, no. 12 (June 15, 1987): 2450. http://dx.doi.org/10.1364/ao.26.002450.

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25

Zhu, Xiao Yun, and Man Dong. "Study of Preparation on the Flake Silver Coating over Copper Powder for Electronic Industry." Advanced Materials Research 275 (July 2011): 165–69. http://dx.doi.org/10.4028/www.scientific.net/amr.275.165.

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Flake copper powder is coated with silver by using a solution containing [Ag(NH3)]+. Factors such as copper particle size distribution, [Ag(NH3)]+ concentrations and the dispersing agent are studied and correlated with the silver content of coated copper and electric conductivity. At the condition of silver concentration of 0.8 mol/L and dispersing agent of 1.0g/L a powder of copper coated with silver with electric conductivity of 0.8×10-3Ω•cm is obtained. XRD patterns indicate that the powder consists of only the Cu and Ag phases without other intermediate phases. SEM results with different silver contents reveal that when Ag content rises, its surface topography transforms through the steps: individual particles →small islands→continuous 2D layers →multi-layers.

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26

Padhy, Rashmi Rani, and Sangeeta Tiwari. "Antibacterial Action and Efficacy of Silver and Copper Exchanged Na-Y Zeolite from Fly Ash on 304 Stainless Steel Coupons by Agar Diffusion Method." Asian Journal of Chemistry 33, no. 2 (2021): 371–75. http://dx.doi.org/10.14233/ajchem.2021.23002.

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Na-Y Zeolite synthesized from fly ash was exchanged with Ag+ and Cu2+ ions by ion exchange process. The antibacterial action and efficacy of silver and copper exchanged Na-Y zeolite on Escherichia coli and Staphylococcus aureus were investigated. Escherichia coli and Staphylococcus aureus was suspended in broth media and exposed to silver and copper exchanged zeolite Y (ranging from 25-1000 μg) for a period of 24 h. The minimum bactericidal concentration (MBC) of silver and copper loaded zeolite-Y powder was 50 and 250 μg for Escherichia coli. Staphylococcus aureus was destroyed at a powder concentration of 100 μg for both Ag-Y and Cu-Y zeolite. Further, the present work also focuses to incorporate 5% silver and copper exchanged zeolite pigment in coating and study the antibacterial effect on the coated 304 stainless coupons. Paint containing copper exchanged zeolite shows antibacterial activity compared to paint with silver containing zeolite.

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27

Pickles, C. A. "Selective oxidation of copper from liquid copper-silver alloys." Metallurgical and Materials Transactions B 29, no. 1 (February 1998): 39–51. http://dx.doi.org/10.1007/s11663-998-0005-2.

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28

Zhao, Shun, Xiao Wang, Guoqi Niu, Wei Dong, Jia Wang, Ying Fang, Yajing Lin, and Lin Liu. "Structural basis for copper/silver binding by theSynechocystismetallochaperone CopM." Acta Crystallographica Section D Structural Biology 72, no. 9 (August 18, 2016): 997–1005. http://dx.doi.org/10.1107/s2059798316011943.

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Copper homeostasis integrates multiple processes from sensing to storage and efflux out of the cell. CopM is a cyanobacterial metallochaperone, the gene for which is located upstream of a two-component system for copper resistance, but the molecular basis for copper recognition by this four-helical bundle protein is unknown. Here, crystal structures of CopM in apo, copper-bound and silver-bound forms are reported. Monovalent copper/silver ions are buried within the bundle core; divalent copper ions are found on the surface of the bundle. The monovalent copper/silver-binding site is constituted by two consecutive histidines and is conserved in a previously functionally unknown protein family. The structural analyses show two conformational states and suggest that flexibility in the first α-helix is related to the metallochaperone function. These results also reveal functional diversity from a protein family with a simple four-helical fold.

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29

Okamoto, Naoki, and Tohru Watanabe. "The Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates." Journal of the Japan Institute of Metals 68, no. 2 (2004): 110–13. http://dx.doi.org/10.2320/jinstmet.68.110.

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30

Reyes-Blas, Myrna, Nadja M. Maldonado-Luna, Carla M. Rivera-Quiñones, Ana L. Vega-Avila, Felix R. Roman-Velázquez, and Oscar J. Perales-Perez. "Single Step Microwave Assisted Synthesis and Antimicrobial Activity of Silver, Copper and Silver-Copper Nanoparticles." Journal of Materials Science and Chemical Engineering 08, no. 08 (2020): 13–29. http://dx.doi.org/10.4236/msce.2020.88002.

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31

Tzeng, Yonhua, and Bo-Yi Lin. "Silver SERS Adenine Sensors with a Very Low Detection Limit." Biosensors 10, no. 5 (May 15, 2020): 53. http://dx.doi.org/10.3390/bios10050053.

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The detection of adenine molecules at very low concentrations is important for biological and medical research and applications. This paper reports a silver-based surface-enhanced Raman scattering (SERS) sensor with a very low detection limit for adenine molecules. Clusters of closely packed silver nanoparticles on surfaces of discrete ball-like copper bumps partially covered with graphene are deposited by immersion in silver nitrate. These clusters of silver nanoparticles exhibit abundant nanogaps between nanoparticles, where plasmonic coupling induces very high local electromagnetic fields. Silver nanoparticles growing perpendicularly on ball-like copper bumps exhibit surfaces of large curvature, where electromagnetic field enhancement is high. Between discrete ball-like copper bumps, the local electromagnetic field is low. Silver is not deposited on the low-field surface area. Adenine molecules interact with silver by both electrostatic and functional groups and exhibit low surface diffusivity on silver surface. Adenine molecules are less likely to adsorb on low-field sensor surface without silver. Therefore, adenine molecules have a high probability of adsorbing on silver surface of high local electric fields and contribute to the measured Raman scattering signal strength. We demonstrated SERS sensors made of clusters of silver nanoparticles deposited on discrete ball-like copper bumps with very a low detection limit for detecting adenine water solution of a concentration as low as 10−11 M.

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32

Hampshire, Bethany, Kevin Butcher, Katsu Ishida, George Green, Don Paul, and Adrian Hillier. "Using Negative Muons as a Probe for Depth Profiling Silver Roman Coinage." Heritage 2, no. 1 (January 29, 2019): 400–407. http://dx.doi.org/10.3390/heritage2010028.

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Debasement of silver Roman coins is a well-known phenomenon and understanding the quality of ancient silver coinages can provide an idea about the underlying fiscal condition of the issuing states. These coins are made from a silver-copper alloy, the surfaces of which were deliberately enhanced at the mints by a process of surface-enrichment to give them the appearance of being made of pure silver. Therefore, any surface analysis would provide a composition of the silver-copper alloy that would not be representative of the original alloy from which the coin blank was made; the result would be too high in silver. However, the bulk of the sample, the interior, should provide a composition that is true to the original alloy. Elemental analysis using negative muons has been used to provide a depth dependent compositional, completely non-destructive analysis of a silver-copper alloy denarius of the empress Julia Domna datable to 211–217 CE. The composition of the coin, beyond the surface enrichment layer, is 51 ± 1.8 % copper and 49 ± 1.9% silver, taken at a muon depth of 402 ± 61 µm. The surface enrichment layer is approximately 190 µm thick.

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33

Niece, Susan La. "Silver Plating on Copper, Bronze and Brass." Antiquaries Journal 70, no. 1 (March 1990): 102–14. http://dx.doi.org/10.1017/s0003581500070335.

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Silver has generally been valued second only to gold from at least as early as 2000BC. A material which is highly prized becomes a status symbol and cheaper imitations find a ready market. Craftsmen very early developed methods of applying thin layers of silver onto base metal as an economical use of precious metal, whether for its decorative effect or, particularly in the case of plated coins, to deceive the customer. Unfortunately, silver plating is less commonly preserved than gold plating, and corrosion at the interface between the silver and base metal may destroy the evidence of how the plating was applied. The situation is complicated because many of the white metal surfaces on pieces labelled as ‘silvered’ are in fact produced by tin, or more rarely, by arsenic. Nevertheless, there are still sufficient surviving examples to indicate that silver plating has a long history during which techniques were developed to give better results and to allow more economical use of the precious metal.

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34

Sato, M., K. Ohtomo, T. Daimon, T. Sugiyama, and K. Iijima. "Localization of copper to afferent terminals in rat locus ceruleus, in contrast to mitochondrial copper in cerebellum." Journal of Histochemistry & Cytochemistry 42, no. 12 (December 1994): 1585–91. http://dx.doi.org/10.1177/42.12.7983358.

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We examined copper localization in the locus ceruleus and cerebellum of rat brain by Timm's sulfide-silver staining, as modified by Danscher. Dense silver particles revealing copper localization were observed in sections of the locus ceruleus and cerebellum after pre-treatment with trichloroacetic acid. In the locus ceruleus, copper appeared to be distributed to neuropil rather than glial or neuronal cell bodies, and at the ultrastructural level copper was mainly localized on synaptic membranes of afferent terminals in contact with somatic spines or dendrites of locus ceruleus neurons, whereas copper was distributed to mitochondria in the granular layers of cerebellum and fine, sparse silver particles were observed throughout ependymal cells and epithelial cells of blood vessels. The specific localization of copper to afferent terminals in the locus ceruleus was confirmed by X-ray microanalysis, which showed a significant level of copper, but not zinc, in synaptic membranes. These results suggest a distinct role of copper depending on its regional distribution. Copper or copper protein may be involved in neurotransmission in the locus ceruleus but in mitochondrial activity in the cerebellum.

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35

Mittapally, Sirisha, Ruheena Taranum, and Sumaiya Parveen. "Metal ions as antibacterial agents." Journal of Drug Delivery and Therapeutics 8, no. 6-s (December 15, 2018): 411–19. http://dx.doi.org/10.22270/jddt.v8i6-s.2063.

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Metals like mercury, arsenic, copper and silver have been used in various forms as antimicrobials for thousands of years. The use of metals in treatment was mentioned in Ebers Papyrus (1500BC); i.e, copper to decrease inflammation & iron to overcome anemia. Copper has been registered at the U.S. Environmental Protection Agency as the earliest solid antimicrobial material. Copper is used for the treatment of different E. coli, MRSA, Pseudomonas infections. Advantage of use of silver is it has low toxicity to human’s cells than bacteria.It is less susceptible to gram +ve bacteria than gram –bacteria due to its thicker cell wall. Zinc is found to be active against Streptococcus pneumonia, Campylobacter jejuni. Silver & zinc act against vibrio cholera & enterotoxic E. coli. The use of metals as antibacterial got reduce with discovery of antibiotics in twentieth century, immediately after that antibiotic resistance was seen due to transfer of antibiotic resistance genes by plasmids also known as Resistance Transfer Factors or R-factors. Metal complexes are used to show synergistic activity against bacteria’s like copper & chlorhexidine on dental plaque bacteria, silver nanoparticles & cephalexin against E. coli & S. aureus. Keywords: Metals, Oligodynamic effect, Copper, Silver

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36

Сидоров, А. И., В. А. Санина, О. С. Кудаев, and И. Н. Анфимова. "Оптические поглотители для термоэлектрических преобразователей излучения Солнца на основе композитов с наночастицами металлов и полупроводников." Журнал технической физики 128, no. 11 (2020): 1747. http://dx.doi.org/10.21883/os.2020.11.50180.103-20.

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Spectra of optical density jf solid and nanoporous glasses with silver nanoparticles, nanoporous glasses with silver and copper nanowires, and nanoporous glasses with silver sulphide and copper oxide nanoparticles are presented..Comparative analysis of the possibility of their application as absorbers of Sun radiation in thermoelectric comverters of Sun energy.is performed.

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Guan, Deng Gao, Chuan Min Sun, Jin Hui Lin, Yao Sun, Guan Li Xu, and Ting Lei. "Characterizations of Plating Structures and Electromagnetic Shielding Properties of the Micron-Sized Flaky Silver-Coated Copper Powder." Advanced Materials Research 217-218 (March 2011): 321–25. http://dx.doi.org/10.4028/www.scientific.net/amr.217-218.321.

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A new kind of the micron-sized flaky silver-coated copper powder was prepared by electroless silver plating in this paper. Its plating structures were characterized by XRD, SEM and EDS. And a new kind of the electromagnetic shielding composite coatings containing 60 wt% the micron-sized flaky silver-coated copper powders and 40 wt% epoxy resin was prepared. Its electromagnetic shielding properties were analyzed by coaxial transmission line equipment. The study results show the micron-sized flaky silver-coated copper powders are composed of 91.35 wt% Cu and 8.65 wt% Ag and have high width-thickness ratio and crystal structure characteristics. In the frequency range of 0.3-1000 MHz, the shielding effectiveness of the coatings is up to 70.15-77.46 dB and increased an average of 22.18 dB compared with the coatings containing 60 wt% micron-sized flaky copper powders when the coating layer thickness is 300 μm. It is seen that the electroless silver plating method effectively improves the inoxidizability, conductivity and electromagnetic shielding properties of copper powders.

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Bosch, Albert, José M. Díez, and F. Xavier Abad. "Disinfection of Human Enteric Viruses in Water by Copper: Silver and Reduced Levels of Chlorine." Water Science and Technology 27, no. 3-4 (February 1, 1993): 351–55. http://dx.doi.org/10.2166/wst.1993.0374.

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Electrolytically generated copper: silver ions were evaluated in combination with low levels of chlorine for their ability to reduce the infectivity of hepatitis A virus, human rotavirus, adenovirus and poliovirus seeded in well and tap water. Overall, hepatitis A virus and rotavirus showed less than 2.6 log10 titre reduction for concentrations of 1 mg/l of free chlorine. For free chlorine concentrations of 0.5 mg/l or lower, with or without copper: silver ions, both of these viral strains suffered little inactivation. Poliovirus showed more than 4 log10 titre reduction in the presence of copper: silver combined with 0.5 mg/l of free chlorine, or 1 mg/l of free chlorine alone. Copper: silver ions (700:70 µg/l) reduced the infectivity of poliovirus. Although adenovirus was more efficiently inactivated than rotavirus or hepatitis A virus, it persisted longer than poliovirus under the same treatments, and its infectivity was never completely removed. The addition of copper: silver ions to reduce the levels of free chlorine do not ensure the total elimination of viral pathogens from water systems.

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Chen, Lu, Hong Yang Jing, Lian Yong Xu, and Guo Quan Lu. "Study on Non-Cyanide Silver Electroplating with Copper Substrate." Advanced Materials Research 472-475 (February 2012): 2936–39. http://dx.doi.org/10.4028/www.scientific.net/amr.472-475.2936.

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The non-cyanide silver electroplating on copper substrate has been discussed. Based on the surface morphology by using SEM, the smooth and fine silver layer is obtained. The influences of concentration of silver and plating temperature on the thickness of the plating layer are discussed, the thickness of the silver layer is increasing with silver concentration rising and plating temperature rising.

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40

Xing, Wei, Man Lee, and Seung Choi. "Separation of Ag(I) by Ion Exchange and Cementation from a Raffinate Containing Ag(I), Ni(II) and Zn(II) and Traces of Cu(II) and Sn(II)." Processes 6, no. 8 (August 1, 2018): 112. http://dx.doi.org/10.3390/pr6080112.

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Ion exchange and cementation experiments were done to separate silver(I) from a raffinate containing silver(I), nickel(II), and zinc(II) and small amounts of copper(II) and tin(II). The raffinate resulted from the recovery of gold(III), tin(II) and copper(II) by solvent extraction from a leaching solution of anode slime. Ion exchange with anionic resins was not effective in separating silver(I) because tin(II) and zinc(II) were selectively adsorbed into the anionic resins. It was possible to separate silver(I) by cementation with copper sheet. Treatment of the cemented silver with nitric acid solution increased the purity of silver(I) in the solution from 50.9% to 99.99%. Adjusting the pH of the AgNO3 solution to higher than 6, followed by adding ascorbic acid as a reducing agent, led to the synthesis of silver particles with micron size.

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Ben-Knaz Wakshlak, Racheli, Rami Pedahzur, Barak Menagen, and David Avnir. "An antibacterial copper composite more bioactive than metallic silver." Journal of Materials Chemistry B 4, no. 24 (2016): 4322–29. http://dx.doi.org/10.1039/c6tb00719h.

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Entrapment of chlorhexidine within antibacterial copper leads to the formation of a metal composite, whose bactericidal activity exceeds that of silver and that of its individual components. Since the cost of copper is by far lower than that of silver, high volume applications become more accessible.

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Huang, Yingnan, Cun Liu, Peixin Cui, Fei Dang, Min Li, Baoshan Xing, and Dongmei Zhou. "Copper(I) Promotes Silver Sulfide Dissolution and Increases Silver Phytoavailability." Environmental Science & Technology 54, no. 9 (April 10, 2020): 5589–97. http://dx.doi.org/10.1021/acs.est.0c00929.

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43

Pickles, C. A., C. Harris, and J. Peacey. "Silver loss during the oxidative refining of silver–copper alloys." Minerals Engineering 24, no. 6 (May 2011): 514–23. http://dx.doi.org/10.1016/j.mineng.2010.11.006.

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AKTAS, S. "SILVER RECOVERY FROM SILVER-RICH PHOTOGRAPHIC PROCESSING SOLUTIONS BY COPPER." Canadian Metallurgical Quarterly 47, no. 1 (January 2008): 37–44. http://dx.doi.org/10.1179/cmq.2008.47.1.37.

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45

Daoush, Walid M., Turki S. Albogmy, Moath A. Khamis, and Fawad Inam. "Syntheses and Step-by-Step Morphological Analysis of Nano-Copper-Decorated Carbon Long Fibers for Aerospace Structural Applications." Crystals 10, no. 12 (November 28, 2020): 1090. http://dx.doi.org/10.3390/cryst10121090.

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Carbon long fiber/copper composites were prepared using electroless and electroplating methods with copper metal for potential aerospace applications. Carbon fibers were heat-treated at 450 °C followed by acid treatment before the metallization processes. Three different methods of metallization processes were applied: electroless silver deposition, electroless copper deposition and electroplating copper deposition. The metallized carbon fibers were subjected to copper deposition via two different routes. The first method was the electroless deposition technique in an alkaline tartrate bath using formaldehyde as a reducing agent of the copper ions from the copper sulphate solution. The second method was conducted by copper electroplating on the chemically treated carbon fibers. The produced carbon fiber/copper composites were extensively investigated by Field-Emission Scanning Electron Microscopy (FE-SEM) supported with an Energy Dispersive X-Ray Analysis (EDAX) unit to analyze the size, surface morphology, and chemical composition of the produced carbon long fiber/copper composites. The results show that the carbon fiber/copper composites prepared using the electroplating method had a coated type surface morphology with good adhesion between the copper coated layer and the surface of the carbon fibers. However, the carbon fiber/copper composites prepared using the electroless deposition had a decorated type morphology. Moreover, it was observed that the metallized carbon fibers using the silver method enhanced the electroless copper coating process with respect to the electroless copper coating process without silver metallization. The electrical conductivity of the carbon fiber/copper composites was improved by metallization of the carbon fibers using silver, as well as by the electrodeposition method.

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46

Wang, Yi Jie, Shu Ming Wen, Dan Liu, Qin Bo Cao, Qi Cheng Feng, and Chao Lv. "Sulphidizing Flotation of Copper Oxide Ore." Advanced Materials Research 807-809 (September 2013): 2279–83. http://dx.doi.org/10.4028/www.scientific.net/amr.807-809.2279.

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The copper oxide ore in Dali, which contains 0.69% of copper and 11.24g/t of silver, was beneficiated by sulphidizing - xanthate flotation method. The flotation tests were carried out systematically with sodium sulfide as sulphidizing agent and butyl xanthate + ammonium dibutyl dithiophosphate as the combined collectors. Through closed-circuit test, a copper concentrate with 18.34% of Cu grade and a recovery of 70.13% were obtained. In addition, silver also was enriched in copper concentration with a grade of 329.37g/t and a recovery of 78.79%, which is convenience for utilization in metallurgical processes.

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Hai, Hoang Tri, Jong Gwan Ahn, Dong Jin Kim, Jae Ryeong Lee, Y. N. Jang, Hun Saeng Chung, and Chong Oh Kim. "Production of Silver Coated Copper Powders by Electroless Plating Method." Advanced Materials Research 15-17 (February 2006): 570–74. http://dx.doi.org/10.4028/www.scientific.net/amr.15-17.570.

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Copper powders with very dense, uniform silver coating layer were prepared by electroless plating method in aqueous system at room temperature. Silver-copper composite powders were obtained by strictly controlling the activation and complexing process variables such as NH4OH/(NH4)2SO4 molar ratio, tartrate concentration, and feeding rate of silver ion solution. The mechanism of composite powders formation and their characteristics were discussed. It is noted that completely cleansing the oxide layers and protecting the copper particles surface from hydrolysis are key factors to obtain high quality Ag-Cu composite powders.

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Wang, Chen, and Xueling Ren. "Research on the Development Model of Black Copper Walking on Silver in Vitality Inheritance and Industrialization." Frontiers in Business, Economics and Management 1, no. 3 (June 23, 2021): 18–21. http://dx.doi.org/10.54097/fbem.v1i3.25.

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"Black Copper Walking on Silver ", the unique copper production process in Yunnan, as an important part of the excellent traditional Chinese culture, its inheritance has far-reaching significance for us to establish cultural confidence and rebuild cultural identity. However, the current development of black copper and silver walking technology is difficult, and the traditional sense of protection has been unable to solve the root problem. Nowadays, the protection of black copper and silver walking skills should break the traditional static single protection mode, combine the traditional inheritance with modern protection, and grasp the intangible cultural heritage elements from the perspective of productive protection. On the basis of objectively analyzing the characteristics and development status, the article effectively connects the living inheritance with industrialization, and explores the new development mode of folk custom industrialization under the live inheritance mode, so as to promote the live inheritance of black copper walking on silver and the common development of folk economy industry.

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Рійвес, Р. Б., В. А. Кельман, Ю. В. Жменяк, Ю. О. Шпеник, and С. П. Улусова. "Copper-vapor laser with silver admixture." Scientific Herald of Uzhhorod University.Series Physics 15 (June 30, 2004): 53–58. http://dx.doi.org/10.24144/2415-8038.2004.15.53-58.

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Menyhard, M. "Silver Grain Boundary Segregation in Copper." Materials Science Forum 126-128 (January 1993): 205–8. http://dx.doi.org/10.4028/www.scientific.net/msf.126-128.205.

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