Dissertations / Theses on the topic 'Simulation spice'
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Alali, Oussama. "Modélisation VHDL-AMS analogique et simulation SPICE /." Paris : École nationale supérieure des télécommunications, 1998. http://catalogue.bnf.fr/ark:/12148/cb367111244.
Full textMitter, Chang Su. "Insulated gate bipolar transistor (IGBT) simulation using IG-Spice." Thesis, This resource online, 1991. http://scholar.lib.vt.edu/theses/available/etd-03022010-020115/.
Full textLeung, Hong Man. "SPICE simulation and modeling of DC-DC flyback converter." Thesis, Massachusetts Institute of Technology, 1995. http://hdl.handle.net/1721.1/36643.
Full textBadcock, Stephen G. "Viability study of SiGe/Si heterojunction MOSFET technology by computer simulation." Thesis, University of Newcastle Upon Tyne, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.324925.
Full textBonhomme, Phillip. "Circuit modeling of spintronic devices: a SPICE implementation." Thesis, Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/51818.
Full textYen, Wen-Tsung. "Comparison of SPICE and Network C simulation models using the CAM system." PDXScholar, 1991. https://pdxscholar.library.pdx.edu/open_access_etds/4243.
Full textStein, Félix. "SPICE Modeling of TeraHertz Heterojunction bipolar transistors." Thesis, Bordeaux, 2014. http://www.theses.fr/2014BORD0281/document.
Full textThe aim of BiCMOS technology is to combine two different process technologies intoa single chip, reducing the number of external components and optimizing power consumptionfor RF, analog and digital parts in one single package. Given the respectivestrengths of HBT and CMOS devices, especially high speed applications benefit fromadvanced BiCMOS processes, that integrate two different technologies.For analog mixed-signal RF and microwave circuitry, the push towards lower powerand higher speed imposes requirements and presents challenges not faced by digitalcircuit designs. Accurate compact device models, predicting device behaviour undera variety of bias as well as ambient temperatures, are crucial for the development oflarge scale circuits and create advanced designs with first-pass success.As technology advances, these models have to cover an increasing number of physicaleffects and model equations have to be continuously re-evaluated and adapted. Likewiseprocess scaling has to be verified and reflected by scaling laws, which are closelyrelated to device physics.This thesis examines the suitability of the model formulation for applicability to production-ready SiGe HBT processes. A derivation of the most recent model formulationimplemented in HICUM version L2.3x, is followed by simulation studies, whichconfirm their agreement with electrical characteristics of high-speed devices. Thefundamental geometry scaling laws, as implemented in the custom-developed modellibrary, are described in detail with a strong link to the specific device architecture.In order to correctly determine the respective model parameters, newly developed andexisting extraction routines have been exercised with recent HBT technology generationsand benchmarked by means of numerical device simulation, where applicable.Especially the extraction of extrinsic elements such as series resistances and parasiticcapacitances were improved along with the substrate network.The extraction steps and methods required to obtain a fully scalable model library wereexercised and presented using measured data from a recent industry-leading 55nmSiGe BiCMOS process, reaching switching speeds in excess of 300GHz. Finally theextracted model card was verified for the respective technology
Angel, Nathan A. "EQUIVALENT CIRCUIT IMPLEMENTATION OF DEMYELINATED HUMAN NEURON IN SPICE." DigitalCommons@CalPoly, 2011. https://digitalcommons.calpoly.edu/theses/611.
Full textVu, Dinh Thanh, and Jean Chilo. "Simulation des effets de propagation couplée et dissipative sur simulateur électrique nodal (SPICE)." Grenoble INPG, 1993. http://www.theses.fr/1993INPG0101.
Full textFrank, Florian. "Effiziente Methoden zur netzwerkbasierten Modellbeschreibung für die EMV-Simulation im Automobilbereich /." Tönning ; Lübeck Marburg : Der Andere Verl, 2008. http://d-nb.info/990427889/04.
Full textLemoigne, Pascal. "Simulation de la variabilité du transistor MOS." Thesis, Aix-Marseille 1, 2011. http://www.theses.fr/2011AIX10214/document.
Full textContinuous improvement in integrated circuits density of integration lead us to study process-induced variations in the framework of the 45 nm node, and to determine their principal contributions with the ultimate goal being to allow an accurate simulation of both transistor and circuit level variability. This work starts with a study of the state of the art of variability sources of the MOS transistor and associated simulation means. Then it focuses on the fluctuations of the channel doping, which is a difficult factor to measure statistically.After that we study the 45 nm node through a design of experiment which let us learn about natural variations of process factors but mostly about electrical performances sensitivity to those factors.Thanks to that we could identify major causes of process-induced variability at this stage of this node development. At last, with respect to those experimental results, we propose to enhance the taking in account of process variations in Monte-Carlo and corner simulations applied to compact models
Naber, John F. "The optimization of SPICE modeling parameters utilizing the Taguchi methodology." Diss., Virginia Tech, 1992. http://hdl.handle.net/10919/38542.
Full textPh. D.
Gallardo, Saavedra Sara. "Analysis and simulation of shading effects on photovoltaic cells." Thesis, Högskolan i Gävle, Avdelningen för bygg- energi- och miljöteknik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:hig:diva-21725.
Full textNapieralska, Malgorzata. "Modélisation du transistor V. DMOS pour simulation de circuits en électronique de puissance." Toulouse, INSA, 1991. http://www.theses.fr/1991ISAT0009.
Full textWerner, Tony Lee 1965. "A spice enhancement for the simulation and analysis of electro-thermal interactions on integrated circuit devices." Thesis, The University of Arizona, 1991. http://hdl.handle.net/10150/277863.
Full textLi, Zhao. "SPICE-accurate iterative methods for efficient time-domain simulation of VLSI circuits with strong parasitic couplings /." Thesis, Connect to this title online; UW restricted, 2005. http://hdl.handle.net/1773/5830.
Full textMikkola, Esko Olavi. "Hierarchical Simulation Method for Total Ionizing Dose Radiation Effects on CMOS Mixed-Signal Circuits." Diss., The University of Arizona, 2008. http://hdl.handle.net/10150/194066.
Full textPoivey, Christian. "Methodes d'optimisation pour la cao de circuits integres : interface avec le simulateur electrique spice-pac : applications." Clermont-Ferrand 2, 1987. http://www.theses.fr/1987CLF2D203.
Full textKarlsson, Mattias. "COMPARISON AND EVALUATION OF HARDWARE MODELLING AND SIMULATION TOOLS." Thesis, Tekniska Högskolan, Högskolan i Jönköping, JTH, Data- och elektroteknik, 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-16734.
Full textZhang, Xiaowei. "A METHODOLOGY OF SPICE SIMULATION TO EXTRACT SRAM SETUP AND HOLD TIMING PARAMETERS BASED ON DFF DELAY DEGRADATION." UKnowledge, 2015. http://uknowledge.uky.edu/ece_etds/75.
Full textPouget, Vincent. "Simulation expérimentale par impulsions laser ultra-courtes des effets des radiations ionisantes sur les circuits intégrés." Bordeaux 1, 2000. http://www.theses.fr/2000BOR12250.
Full textTomas, Jean. "Caractérisation par simulation de la métastabilité des circuits séquentiels : application à des structures VLSI." Bordeaux 1, 1988. http://www.theses.fr/1988BOR10580.
Full textIannello, Christopher J. "A unified approach to dynamic modeling of high switching frequency pwm converters." Doctoral diss., University of Central Florida, 2001. http://digital.library.ucf.edu/cdm/ref/collection/RTD/id/4918.
Full textThis dissertation will present the development of a unified approach for dynamic modeling of the PWM and soft-switching power converters. Dynamic modeling of non-linear power converters is very important for the design and stability of their closed loop control. While the use of equivalent circuits is often preferred due to simulation efficiency issues, no unified and widely applicable method for the formulation of these equivalents exists.
Ph.D.
Doctorate;
School of Electrical Engineering and Computer Science
Engineering
Electrical Engineering and Computer Science
252 p.
xi, 252 leaves, bound : ill. ; 28 cm.
Xing, Zengping. "Magnetoelectric Device and the Measurement Unit." Diss., Virginia Tech, 2009. http://hdl.handle.net/10919/27387.
Full textPh. D.
Peters, Kevin Christopher. "TOUCHSPICE: PHYSICAL-VIRTUAL CIRCUIT EMULATOR." DigitalCommons@CalPoly, 2012. https://digitalcommons.calpoly.edu/theses/769.
Full textCaillé, Denis. "Contribution à l'étude de la technologie bipolaire STL : caractérisation, modélisation et simulation de diodes Schottky TiW-Si et PtSi-Si." Bordeaux 1, 1988. http://www.theses.fr/1988BOR10571.
Full textBen, M'Hamed Bruno. "Contribution à l’analyse de la susceptibilité des composants électroniques à des perturbations transitoires : caractérisation et modélisation des éléments de protection." Limoges, 2010. https://aurore.unilim.fr/theses/nxfile/default/81a2f024-301f-467e-b07d-748c5a35fba1/blobholder:0/2010LIMO4049.pdf.
Full textThe presence of embedded systems using electronics has widely spread in the civil and military domains. Moreover, the significant increases of operating frequencies and integration densities are accompanied by a reduction of noise margins which obviously increases the sensitivity of the circuits against external electromagnetic interferences. In parallel, the number of potential disturbances continues growing, and the main problem is to assess the proper functioning of the systems to be used in this environment. The context of our study is to analyse the influence of the coupling of powerful parasitic sources on electronic systems. At the component level, the first elements seen by the signal are the protection devices. So the investigations achieved during this thesis have consisted in developing a theoretical and experimental methodology to evaluate the transient behaviour of the protections present in electronic circuits, with a special attention to the charge behaviour and the non-linear effects of the parasitic capacitances. The accuracy of this methodology is assessed to both discrete and on-chip protection devices
Kane, Ibrahim. "Contribution à l'analyse de la susceptibilité électromagnétique des composants : Caractérisation et modélisation des étages d'entrée des circuits intégrés numériques." Thesis, Limoges, 2016. http://www.theses.fr/2016LIMO0119/document.
Full textThe proliferation of electronic components increases the interest of investigations about their vulnerability against electromagnetic interference intentionally emitted or not. Our study falls in this context and is specifically devoted to digital devices. These devices usually include, at their input/output ports, protection elements to prevent against electrostatic discharges and all kind of signals with very high amplitude. However, the perturbating signals can have low amplitude and complex waveforms that can cause trouble to these digital devices without triggering protection elements. In this case, first stages are the front, and their behaviors against these perturbation signals can alter the good operation of the device. Thus, we propose to study and model the behaviors of these first stages against such aggressions. First of all, an experimental platform was defined for the digital devices. A selection of devices is done and CMOS inverter was naturally chosen because of its presence in almost all of the first stages of digital devices, and because its structure is simple and well known. The choice of the CMOS technology is also due to its simplicity and omnipresence in current electronic equipments. Different perturbation signals were applied to these CMOS inverters to observe and record their typical and particular behaviors. Secondly, with the experimental results, a behavioral and generic SPICE model of CMOS inverters was developed. Different models exist for digital devices, but SPICE is the only one explicitly describing their complete architecture. But, for intellectual proprieties reasons, the manufacturers are usually reluctant to share information on their devices’ internals. However, the SPICE models are only valid within some operating limits defined by manufacturers. We have brought different modifications to this SPICE model to incorporate the observed behaviors of CMOS inverters inside and outside their normal operating conditions. The generic criterion of the final model imposed to study a large number of CMOS inverters of different manufacturers and different logic families. Finally, a synthesis of models and simulation results, by manufacturer and logic family, is produced
Zebbache, Ahmed. "Analyse et synthèse statistiques des circuits électroniques : mise en œuvre du simulateur ouvert SPICE-PAC et de la méthode du recuit simule." Châtenay-Malabry, Ecole centrale de Paris, 1996. http://www.theses.fr/1996ECAP0467.
Full textGuitard, Nicolas. "Caractérisation de défauts latents dans les circuits intégrés soumis à des décharges électrostatiques." Phd thesis, Université Paul Sabatier - Toulouse III, 2006. http://tel.archives-ouvertes.fr/tel-00139542.
Full textBui, Van Diep. "Conception et modélisation de transistors TFTs en silicium microcristallin pour les écrans AMOLED." Phd thesis, Ecole Polytechnique X, 2006. http://pastel.archives-ouvertes.fr/pastel-00002258.
Full textBertrand, Géraldine. "Conception et modélisation électrique de structures de protection contre les décharges électrostatiques en technologies BICMOS et CMOS analogique." Toulouse, INSA, 2001. http://www.theses.fr/2001ISAT0037.
Full textThe sensitivity of modern integrated circuits to ElectroStatic Discharges (ESD) increases with the technology shrink and the introduction of new process techniques. To move towards a "first pass success", ESD must be taken into account at an early stage of a project development which requires capability to predict efficiency of ESD protection strategies. The availability of an ESD protection library including both optimized layouts and electrical models is part of the solution. However, ESD protection structures operate in avalanche breakdown and high current regimes, which cannot be simulated with standard SPICE models. In this thesis, a methodology to extend classical models to these regimes is first developed for the vertical bipolar NPN transistor widely used in BiCMOS technologies. This methodology is then applied to the NMOS transistor in an analog CMOS process, with the modeling of its parasitic lateral NPN transistor. Physics-based compact models are provided thanks to 2D device simulation, TLP characterization and photoemission experiments (EMMI)
Dosev, Dosi Konstantinov. "Fabrication, characterisation and modelling of nanocrystalline silicon thin-film transistors obtained by hot-wire chemical vapour deposition." Doctoral thesis, Universitat Politècnica de Catalunya, 2003. http://hdl.handle.net/10803/6324.
Full textIn this work, thin-film transistors (TFTs) were fabricated using nanocrystalline hydrogenated silicon film (nc-Si:H), deposited by HWCVD over thermally oxidized silicon wafer. The employed substrate temperature during the deposition process permits inexpensive materials as glasses or plastics to be used for various applications in large-area electronics. The deposition rate was about one order of magnitude higher than in other conventionally employed techniques. The deposited nc-Si:H films show good uniformity and reproducibility. The films consist of vertically grown columnar grains surrounded by amorphous phase. The columnar grains are thinner at the bottom (near the oxide interface) and thicker at the top of the film. Chromium layer was evaporated over the nc-Si:H in order to form drain and source contacts. Using photolithography techniques, two types of samples were fabricated. The first type (simplified) was with the chromium contacts directly deposited over the intrinsic nc-Si:H layer. No dry etching was involved in the fabrication process of this sample. The transistors on the wafer were not electrically separated from each other. Doped n+ layer was incorporated at the drain and source contacts in the second type of samples (complete samples). Dry etching was employed to eliminate the nc-Si:H between the TFTs and to isolate them electrically from each other.
The electrical characteristics of both types of nc-Si:H TFTs were similar to a-Si:H based TFTs. Nevertheless, some significant differences were observed in the characteristics of the two types of samples. The increasing of the off-current in the simplified structure was eliminated by the n+ layer in the second type of samples. This led to the improving of the on/off ratio. The n+ layer also eliminated current crowding of the output characteristics. On the other hand, the subthreshold slope, the threshold voltage and the density of states were slightly deteriorated in the samples with incorporated n+ layer. Surface states created by the dry etching could be a possible reason. Other cause could be a bad quality of the nc-Si:H/SiO2 interface. The TFTs with incorporated n+ contact layer and electrically separated on the wafer were used in the further studies of stability and device modelling.
The nc-Si:H TFTs were submitted under prolonged positive and negative gate bias stress in order to study their stability. We studied the influence of the stressing time and voltage on the transfer characteristics, threshold voltage, activation energy and density of states. The threshold voltage increased under positive gate bias stress and decreased under negative gate bias stress. After both positive and negative stresses, the threshold voltage recovered its initial values without annealing. This behaviour indicated that temporary charge trapping in the channel/gate insulator interface is the responsible process for the device performance under stress. Measurements of space-charge limited current confirmed that bulk states were not affected by the positive nor by negative stress.
Analysis of the activation energy and the density of states gave more detailed information about the physical processes taking place during the stress. Typical drawback of the nc-Si:H films grown by HWCVD with tungsten (W) filament is the bad quality of the bottom, initially grown, interfacial layer. It is normally amorphous and porous. We assume that this property of the nc-Si:H film is determining for charge trapping and the consecutive temporary changes of the TFT's characteristics. On the other hand, the absence of defect-state creation during the gate bias stress demonstrates that the nc-Si:H films did not suffer degradation under the applied stress conditions.
The electrical characteristics and the operational regimes of the nc-Si:H TFTs were studied in details in order to obtain the best possible fit using the Spice models for a-Si:H and poly-Si TFTs existing until now. The analysis of the transconductance gm showed behaviour typical for a-Si:H TFTs at low gate voltages. In contrast, at high gate voltages unexpected increasing of gm was observed, as in poly-Si TFTs. Therefore, it was impossible to fit the transfer and output characteristics with the a-Si:H TFT model neither with poly-Si TFT model.
We performed numerical simulations using the Silvaco's Atlas simulator of semiconductor devices in order to understand the physical parameters, responsible for the device behaviour. The simulations showed that the reason for this behaviour is the density of acceptor-like states, which situates the properties of nc-Si:H TFTs between the amorphous and the polycrystalline transistors. Taking into account this result, we performed analysis of the concentrations of the free and the trapped carriers in nc-Si:H layer. It was found that nc-Si:H operates in transitional regime between above-threshold and crystalline-like regimes. This transitional regime was predicted earlier, but not experimentally observed until now. Finally, we introduced new equations and three new parameters into the existing a-Si TFTs model in order to account for the transitional regime. The new proposed model permits the shapes of the transconductance, the transfer and the output characteristics to be modelled accurately.
Chen, Haoning (William). "LLC Resonant Current Doubler Converter." Thesis, University of Canterbury. Electrical and Computer Engineering, 2013. http://hdl.handle.net/10092/8492.
Full textJaulent, Patrice. "Etude des effets singuliers transitoires dans les amplificateurs opérationnels linéaires par photogénération impulsionnelle non-linéaire." Phd thesis, Bordeaux 1, 2009. http://tel.archives-ouvertes.fr/tel-00997385.
Full textKimoto, Daiki. "Characterization and Modeling of SiC Integrated Circuits for Harsh Environment." Thesis, KTH, Skolan för informations- och kommunikationsteknik (ICT), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-223422.
Full textHarsh environment electronics, which can be operated at high-temperature, high-radiation, and corrosive gas environment, has been strongly desired in space exploration and monitoring of nuclear reactors. Silicon Carbide (SiC) is one of the candidates of materials for harsh environment electronics because of its high-temperature and high-radiation tolerance. The objective of this thesis is to characterize 4H-SiC MOSFETs at high- temperature and to construct SPICE models of the 4H-SiC MOSFETs. The MOSFET devices were characterized up to 500ºC. Using the characteristic of a 4H-SiC NMOSFET with L/W = 10 µm/50 µm, a SPICE LEVEL 2 circuit model was constructed. This model describes the DC characteristic of the 4H-SiC MOSFETs in the range of 25 – 450ºC. Based on the SPICE circuit model, the characteristics of operational amplifiers and digital inverters were simulated. Furthermore, the operation of pseudo-CMOS at high-temperature was analyzed and the operation principle of pseudo-CMOS was suggested. The device area and yield of pseudo-CMOS integrated circuits were estimated and it is shown that SiC pseudo-CMOS integrated circuits can use less area than SiC CMOS integrated circuits.
TREMOUILLES, David. "Optimisation et modélisation de protection intégrées contre les décharges électrostatique, par l'analyse de la physique mise en jeu." Phd thesis, INSA de Toulouse, 2004. http://tel.archives-ouvertes.fr/tel-00010263.
Full textNajari, Montassar. "Modélisation compacte des transistors à nanotube de carbone à contacts Schottky et application aux circuits numériques." Phd thesis, Université Sciences et Technologies - Bordeaux I, 2010. http://tel.archives-ouvertes.fr/tel-00560346.
Full textKernstine, Kemp H. "Design space exploration of stochastic system-of-systems simulations using adaptive sequential experiments." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/44799.
Full textMorancho, Frédéric. "Le transistor MOS de puissance à tranchées : modélisation et limites de performances." Phd thesis, Université Paul Sabatier - Toulouse III, 1996. http://tel.archives-ouvertes.fr/tel-00165581.
Full textAli, Ehsan. "Fast and efficient modeling and design methodology of arbitrary ordered mixed-signal PLLs." Thesis, Aix-Marseille, 2015. http://www.theses.fr/2015AIXM4352.
Full textThe Charge-Pump Phase Locked Loop (CP-PLL) is a mixed-signal system and the important block for the frequency generation or frequency synthesis in radio frequency communications, instrumentations, metrology, sensors and so on. There are two types of devices: a full digital PLL and an analog PLL. The fully digital PLL is mainly used in instrumentation field and in clock and data recovery circuits where moderate frequency operation is used. For wireless communication or high data-rate optical transceiver analog CP-PLL is the most used architecture where the operating frequency is in the range of GHz. Since a PLL is at least a second order system, it is subjected to an instability that can lead to non-functional device. Thus, common design methodology contains several steps including i) Linear models ii) Behavioral modeling iii) and transistor level simulations. Electrical simulation (like SPICE) of the transient operation of PLL is time consuming and may take up to several weeks. In fact, the simulator must perform, for each time step of the reference signal, calculations where complexity increases with the division factor. This is known as technological bottleneck, designing a PLL at transistor level is very hard in a reasonable time. In this thesis the work is focused on the behavioral modeling of CP-PLL operating with voltage switched charge-pump (VSCP), where the characterization of its transient time “off-locking” and highly non-linear and even in chaotic mode remains a critical issue. The main objective is to establish a fast and efficient modeling and design methodology of high order CP-PLL and its characterization using the event driven technique
Müller, Anne-Dorothea. "Elektrochemische Metallabscheidung mit Kapillarsonden." Doctoral thesis, Universitätsbibliothek Chemnitz, 2002. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-200200103.
Full textA method for the localized electrochemical deposition of metal structures using capillary tips is presented. The experimental set-up, the tip preparation, the distance detection in near-field operation (shear-force detection), as well as the different types of circuiting of the electrochemical cell are described in detail. In addition to the experimental work, numerical simulations for the qualitative visualization of the potential distribution around the apex region show, how the films thickness profile can be adjusted with the variable parameters (electrode voltages, tip-sample distance). Circuit simulations of the electrochemical cell allow to pre-estimate the optimum working conditions for the used (bi)-potentiostatic electrode set-up. With this method, clusters have been deposited in a thin film of porous alumin oxide and imaged in shear-force mode. Gold and copper structures have been deposited on ITO, while the film growth was observed optically. The lateral dimension of the deposited structures can be smaller than the inner diameter of the capillaries (maximum focus: 8:1). The smallest structures produced in this work have lateral dimensions of 5 micrometers
Kešner, Filip. "Design of Digital Circuits at Transistor Level." Master's thesis, Vysoké učení technické v Brně. Fakulta informačních technologií, 2014. http://www.nusl.cz/ntk/nusl-236048.
Full textSamant, Gajanan Balkrishna. "Verification of the "Energy Accumulation in Waves Travelling through a Checkerboard Dielectric Material Structure in Space-time" Using Spice Simulations." Digital WPI, 2009. https://digitalcommons.wpi.edu/etd-theses/1210.
Full textSouza, Junior Rodolfo Renato de. "Modelo de IGBT para um conversor CC-CC de 1000A usado em controle de motores de tração de locomotivas diesel-elétricas." Universidade Tecnológica Federal do Paraná, 2017. http://repositorio.utfpr.edu.br/jspui/handle/1/2854.
Full textThis paper presents the design report for an analog IGBT SPICE model, part number 2MBI1200U4G-170. The modeling was perceived as a interesting tool in order to analyze the switching times and losses during the development, not performed at the University, of a chopper DC-DC converter used for current control of traction motors of diesel-electric locomotives. The main motivational factor was that an practical and quick approach was wanted and none standard model was found for the intended IGBT part number. As part of the process, an attempt to modify the standard SPICE model of the Cadence Orcad 16.5, which is a physics model based on Hefner works, was made. It was verified that the correct data collecting for the standard model would not be compensatory, so other modeling techniques were needed. It was decided an analog modeling would be used. The modeling achieved uses no more than the information found on the component datasheet described in tables format, voltage and current sources. The validation was done in two different topologies with load currents up to 1400A, switching frequencies of 200Hz, 416Hz, 1kHz and 2kHz and input voltages of 74V, 300V, 900V and 1000V . Comparatives were done with the vendor catalog and laboratory data. The model is satisfactory for heat, collector and gate currents analysis. The simulation current and temperature results showed differences up to 3% and 7%, respectively, when compared to laboratories measurements.
Bayer, Ozgur. "Simulation Of Refrigerated Space With Radiation." Phd thesis, METU, 2009. http://etd.lib.metu.edu.tr/upload/3/12610454/index.pdf.
Full textHällqvist, Robert. "Temperature Control of Space Simulation Chamber." Thesis, KTH, Rymd- och plasmafysik, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-101931.
Full textLiao, Si-yu. "Caractérisation électrique et électro-optique de transistor à base de nanotube de carbone en vue de leur modélisation compacte." Thesis, Bordeaux 1, 2011. http://www.theses.fr/2011BOR14254/document.
Full textThis PhD thesis presents a computationally efficient physics-based compact model for optically-gated carbon nanotube field effect transistors (OG-CNTFETs), especially in the non-volatile memory application. This model includes memory operations such as “read”, “write”, “erase” or “program”, and “reset” which are modeled using trapping and detrapping mechanisms at the polymer/oxide interface. The relaxation of the memory state is taken into account. Furthermore, the self-consistent modeling of Schottky barriers at contacts between the carbon nanotube channel and metal electrodes is integrated in this model applying the effective Schottky barrier method. The Schottky contact model can be included in CNTFET based devices for a typical biasing range of carbon nanotube transistors. This compact model is validated by the good agreement between simulation results and experimental data (I-V characteristics). In the non-volatile memory application, this model can fully reproduce device behaviors in transient simulations. A prediction study of the key technological parameter, the CNT diameter variety is established to expect its impact on the transistor performance, and more importantly, on the memory operation. In the other hand, this thesis presents a preliminary electric characterization (I-V) of CNTFETs and OG-CNTFETs for the device modeling database. A preliminary optoelectronic characterization method is proposed
Woodcock, Jonathan Peter. "Simulations of space plasma instabilities." Thesis, Queen Mary, University of London, 1997. http://qmro.qmul.ac.uk/xmlui/handle/123456789/131.
Full textKucukyavuz, Fatih. "Transforming Conceptual Models Of The Mission Space Into Simulation Space Models." Master's thesis, METU, 2011. http://etd.lib.metu.edu.tr/upload/12613158/index.pdf.
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