Relevant bibliographies by topics / SIW Circuits

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'SIW Circuits'

Author: Grafiati
Published: 3 June 2025
Last updated: 7 July 2025

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Journal articles on the topic "SIW Circuits"

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Hnilicka, Tomas, Titus Oyedokun, Tomas Zalabsky, and Heru Suhartanto. "Phase shifter based on the substrate integrated waveguide technology." Journal of Electrical Engineering 73, no. 1 (2022): 67–72. http://dx.doi.org/10.2478/jee-2022-0010.

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Abstract Substrate integrated waveguide (SIW) technology is widely known transmission line technology adapted for use in various types of microwave circuits. This article deals with the analysis and design of a phase shifter based on the SIW technology. With simulation and measurement results obtained from the phase shifter with using air holes inside the structure, a test circuit was designed and manufactured. Results show that a phase balance of less than 10° is achieved with the experimental setup. The return loss value is better than 15 dB for working frequency band 8.85 GHz − 9GHz. The main benefit of this work is the easy of implementation air holes inside the structure and also the easy of manufacture of the circuits for antenna arrays, where a certain number of identical circuits is usually needed.
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Song, Kaijun, Mou Luo, Cuilin Zhong, and Yuxuan Chen. "High-isolation diplexer based on dual-mode substrate integrated waveguide resonator." International Journal of Microwave and Wireless Technologies 12, no. 4 (2019): 288–92. http://dx.doi.org/10.1017/s1759078719001387.

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AbstractA high-isolation diplexer based on a dual-mode substrate integrated waveguide (SIW) resonator is proposed in this paper. Based on the theory of the dual-mode resonator, the miniaturized diplexers are designed by using the SIW dual-mode resonators. The superior isolation of the diplexers is obtained because the two operating modes of the dual-mode SIW resonators are not directly coupled and there is no interference with each other. In order to further improve the isolation of the circuit, the number of the order of the diplexer is added. Equivalent circuits are given to analyze and design the dual-mode high-isolation diplexers. Detailed analyses are given according to the equivalent circuits. The dual-mode third-order and fourth-order diplexers are designed and fabricated. The measured results agree well with the simulated ones. The total sizes of the fabricated third-order and fourth-order diplexers are 1.78λg × 2.64λg and 1.79λg × 3.63λg, respectively.
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Punati, Mounika, and R. Yuvaraj. "Substrate integrated circuits for high frequency of opto electronics." International Journal of Reconfigurable and Embedded Systems (IJRES) 9, no. 3 (2020): 224. http://dx.doi.org/10.11591/ijres.v9.i3.pp224-228.

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Another age of high-recurrence coordinated circuits is displayed, which is called substrate incorporated circuits (SICS). Current cutting edge of circuit plan and implementation stages dependent on this new idea are assessed and dis-cussed in delail. Various potential outcomes and various favorable circumstances of the SICS are appeared for microwave, millimeter-wave and opto hardware applications. Down to earth models are delineated with hypothetical and trial results for substrate coordinated waveguide (SIW), substrate incorporated chunk waveguide (SISW) and substrate incorporated non-transmitting dielectric (SI") direct circuits. Future innovative work patterns are likewise dis-cussed regarding ease imaginative plan of millimeter-wave and optoelectronic coordinated circuits.
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P., Mounika, and Yuvaraj R. "Substrate integrated circuits for high frequency of opto electronics." International Journal of Reconfigurable and Embedded Systems 9, no. 3 (2020): 224–28. https://doi.org/10.11591/ijres.v9.i3.pp224-228.

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Another age of high-recurrence coordinated circuits is displayed, which is called substrate incorporated circuits (SICS). Current cutting edge of circuit plan and implementation stages dependent on this new idea are assessed and dis-cussed in delail. Various potential outcomes and various favorable circumstances of the SICS are appeared for microwave, millimeter-wave and opto hardware applications. Down to earth models are delineated with hypothetical and trial results for substrate coordinated waveguide (SIW), substrate incorporated chunk waveguide (SISW) and substrate incorporated non-transmitting dielectric (SI") direct circuits. Future innovative work patterns are likewise dis-cussed regarding ease imaginative plan of millimeter-wave and optoelectronic coordinated circuits.
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Song, Kaijun, Zihang Luo, Song Guo, Maoyu Fan, and Yedi Zhou. "Modified Y-junction SIW power divider/combiner circuit." International Journal of Microwave and Wireless Technologies 10, no. 8 (2018): 877–82. http://dx.doi.org/10.1017/s1759078718000831.

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AbstractA modified compact Y-junction substrate-integrated waveguide (SIW) four-way power divider (PD)/combiner is proposed in this paper. The proposed approach is based on the traditional Y-junction waveguide. By using direct transition structure from SIW to half-mode SIW, four-way PD that provides equal power split to all four output ports is achieved. The even- and odd-mode equivalent circuits are given to analyze and design the PD. The measured results validate the proposed design methodology and show good agreement with the simulation results. The measured 17 dB return loss bandwidth and 1.2 dB insertion loss bandwidth of this four-way PD are both about 2.5 GHz.
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Ben Romdhan Hajri, Jamel, Hafedh Hrizi, and Noureddine Sboui. "Accurate and efficient study of substrate-integrated waveguide devices using iterative wave method." International Journal of Microwave and Wireless Technologies 9, no. 1 (2015): 85–91. http://dx.doi.org/10.1017/s1759078715001336.

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This paper proposes an efficient and fast analysis of substrate integrated waveguide (SIW) components using a new approach of the iterative method called WCIP, i.e. “Wave Concept Iterative Process”. This method is based on the iterative resolution of waves between two domains. The first is the spectral domain. We use the Floquet–Bloch decomposition to describe all modes in the spectral domain. The second describes the configuration of the circuit in the spatial domain. It allows taking the exact structure according to the appropriate boundary conditions. This method permits to reduce numerical complexity. The convergence of this approach is always guaranteed. The theoretical suggested study is validated by the simulation of two different examples of SIW circuits. The obtained results are in good agreement with those of measurement and with software HFSS simulations, which prove the advantage of this method.
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Paliwal, Ruchi, Shweta Srivastava, and Reema Buddhiraja. "Band pass filter size reduction by implementing substrate integrated waveguide technique." Journal of Information and Optimization Sciences 44, no. 6 (2023): 1241–50. http://dx.doi.org/10.47974/jios-1496.

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Pass Band Filter with precise selectivity is one of the major requirements of MMIC circuits. The major challenge while designing is size. This paper presents a size reduction technique for the Pass Band Filter by implementing SIW (Substrate Integrated Waveguide). The simulated results for the based filter show size reduction as resonance is shifting at the lower side of the frequency range. The passband filter without SIW is having resonance at 8.4GHz with return loss -26dB. After Implementing SIW results show resonance frequency at 7.2 GHz with a return loss of -23.86 dB without affecting the selectivity of the pass band filter. For Design Simulation, Ansys HFSS is used.
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Venanzoni, Giuseppe, Davide Mencarelli, Antonio Morini, Marco Farina, and Francesco Prudenzano. "Review of Substrate Integrated Waveguide Circuits for Beam-Forming Networks Working in X-Band." Applied Sciences 9, no. 5 (2019): 1003. http://dx.doi.org/10.3390/app9051003.

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A review of substrate integrated waveguide (SIW) components designed for the use in beam-forming networks working in X-Band is presented. The proposed devices are four-port and six-port couplers and magic tees for the network. The devices take full advantage of the use of SIW technology in order to reduce size, weight, and cost. The design processes of all devices are exposed, and the experimental results of prototypes show the feasibility of these solutions.
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Aitken, John Ross, Jiasheng Hong, and Zhang‐Cheng Hao. "Millimetre wave SIW diplexer circuits with relaxed fabrication tolerances." IET Microwaves, Antennas & Propagation 11, no. 8 (2017): 1133–38. http://dx.doi.org/10.1049/iet-map.2016.0594.

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Akkader, Souad, Hamid Bouyghf, and Abdennaceur Baghdad. "Bio-inspired intelligence for minimizing losses in substrate integrated waveguide." International Journal of Electrical and Computer Engineering (IJECE) 13, no. 3 (2023): 2837. http://dx.doi.org/10.11591/ijece.v13i3.pp2837-2846.

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This paper presents a study of various types of losses in substrate-integrated waveguides (SIW) using a genetic algorithm. Three main types of losses are considered and examined separately: conductor loss, dielectric loss, and radiation loss. Furthermore, the current analysis allows for a physical understanding of the loss impacts as well as the creation of design guidelines to reduce losses at 10 GHz frequency while keeping the miniaturized size of the SIW. Validation results obtained using the software Ansys HFSS, verify that the attenuation constant of the SIW can be significantly reduced to 0.4 dB/m, the Insertion loss S21 to -0.2 dB and the return loss to -38 dB if the geometric parameters are chosen properly. This study enables us to identify the source of losses in a SIW and, as a result, eliminate any type of dispersion. That demonstrates the usability of SIW technologies in the design of microwave circuits used in Internet of things applications.
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Dissertations / Theses on the topic "SIW Circuits"

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Parment, Frédéric. "Guides d’onde Intégrés au Substrat (SIW) multicouches à haute performance pour des circuits millimétriques à faible coût." Thesis, Université Grenoble Alpes (ComUE), 2016. http://www.theses.fr/2016GREAT077/document.

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La technologie SIW, introduite dans les années 2000, suscite aujourd’hui un très vif intérêt pour la conception de circuits micro-ondes compacts, intégrés, faible coût et blindés par nature. Cependant, les guides d’onde métalliques, qui offrent de bien meilleures performances en termes de pertes d’insertion et de tenue en puissance, malgré un coût bien plus important, sont encore incontournables pour de nombreuses applications millimétriques. Afin de proposer une alternative intégrée et faible coût au guide d’onde rectangulaire, et de permettre une large exploitation du spectre millimétrique, cette thèse propose une nouvelle structure SIW appelée SIW creux. Cette nouvelle structure a été étudiée théoriquement et expérimentalement. Aux fréquences millimétriques, comparativement au SIW, le SIW creux offre des pertes d’insertion trois fois plus faible ainsi qu’une tenue en puissance moyenne quatre fois plus importante. De nombreux dispositifs passifs SIW creux ont été conçus en prenant avantage du procédé de circuit imprimé multicouche mis en œuvre. Des coupleurs, déphaseurs, diviseurs de puissance, antennes et filtres ont été réalisés basés sur la technologie introduite. Leurs performances sont théoriquement et expérimentalement comparées avec leur contrepartie SIW afin de démontrer les avantages de la nouvelle technologie proposée<br>The substrate integrated waveguide (SIW) technology, introduced in the early 2000s, has presently trigged a huge interest from academia to industry with the focus on the design and development of low-loss, compact, integrated, self-packaged and low-cost microwave and millimeter-wave circuits, antennas and systems. However, the classical metallic waveguide technology, which offers better performances such as lower insertion loss and higher power handling, has still been used in the design of microwave and millimeter-wave systems, despite its higher cost and bulky structure. To offer a highly integrated, further loss-reduced, low-cost alternative to the conventional waveguide and also to allow a wide-spread use of the millimeter-wave spectrum, this thesis research introduces a new SIW structure called Air-Filled SIW (AFSIW). This new structure has been theoretically and experimentally studied in details with a substantial amount of results. At millimeter wave frequencies, compared to the SIW topologies, the proposed AFSIW scheme exhibits a substantially lower insertion loss (three times, for example) and a much higher average power handling capability (four times, for example). Numerous AFSIW passive components have been investigated designed and demonstrated, which take advantages of the well-established multilayer printed circuit board (PCB) fabrication process. Couplers, phase shifters, power dividers, antennas and filters have been modeled, designed, prototyped and measured based on the introduced technology. Their performances have theoretically and experimentally been compared with their SIW counterparts to demonstrate and validate the benefits of the proposed technology
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Ismail, Alhzzoury Ahmad. "Contribution à la modélisation des structures SIW et SINRD pour application micro-ondes et télécommunication." Phd thesis, Toulouse, INPT, 2013. http://oatao.univ-toulouse.fr/9701/1/ismail_alhzzoury.pdf.

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Les développements technologiques en télécommunication et microondes tendent depuis plusieurs années vers la miniaturisation des circuits, une réduction des coûts, des masses et des pertes dans ces dispositifs. Les circuits SIW (Substrate Integrated Waveguide) s’inscrivent tout à fait dans cette mouvance et font à l’heure actuelle l’objet de nombreux sujets de recherche avec des applications directes dans l’industrie. Les circuits SINRD (Substrate Integrated Non Radiative Dielectric) utilisent eux les propriétés du substrat usiné (insertion de trous) pour la propagation du signal et des fonctions de l’électronique peuvent également être développées avec cette technologie. La conception de ces circuits passe généralement par des outils peu performants car non dédiés. Dans ce travail de thèse, une méthode numérique dédiée à ces circuits est développée. Elle est validée par comparaison à d’autres méthodes numériques et des mesures. Elle présente des temps de calcul très faibles. De nouveaux dispositifs pour des applications en télécommunications spatiales bas coûts et faibles pertes peuvent ainsi être développés grâce à elle.
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Ismail, Alhzzoury Ahmad. "Contribution à la modélisation des structures SIW et SINRD pour application micro-ondes et télécommunications." Phd thesis, Institut National Polytechnique de Toulouse - INPT, 2013. http://tel.archives-ouvertes.fr/tel-00871985.

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Les développements technologiques en télécommunication et microondes tendent depuis plusieurs années vers la miniaturisation des circuits, une réduction des coûts, des masses et des pertes dans ces dispositifs. Les circuits SIW (Substrate Integrated Waveguide) s'inscrivent tout à fait dans cette mouvance et font à l'heure actuelle l'objet de nombreux sujets de recherche avec des applications directes dans l'industrie. Les circuits SINRD (Substrate Integrated Non Radiative Dielectric), utilisent eux les propriétés du substrat usiné (insertion de trous) pour la propagation du signal et des fonctions de l'électronique peuvent également être développées avec cette technologie. La conception de ces circuits passe généralement par des outils peu performants car non dédiés. Dans ce travail de thèse, une méthode numérique dédiée à ces circuits est développée. Elle est validée par comparaison à d'autres méthodes numériques et des mesures. Elle présente des temps de calcul très faibles. De nouveaux dispositifs pour des applications en télécommunications spatiales bas coût et faibles pertes peuvent ainsi être développés grâce à elle.
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Zheng, Tianyu. "Periodic SIW lines with degenerate band edge for the excitation of giant resonances." Thesis, Sorbonne université, 2020. https://accesdistant.sorbonne-universite.fr/login?url=http://theses-intra.upmc.fr/modules/resources/download/theses/2020SORUS087.pdf.

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Dans cette thèse, nous décrivons la conception de guides d'onde intégrés au substrat (substrate integrated substrates, SIW) qui supportent des dégénérescences du quatrième ordre en bord de bandes interdites du diagramme de Brillouin (degenerate band edge, DBE). Le DBE conduit à des « résonances géantes » et à résonateurs à fort facteur de qualité. Le choix de la technologie SIW peut permettre l'utilisation du concept DBE dans les circuits intégrés hyperfréquences et aux ondes millimétriques. Les applications de ce concept sont nombreuses : résonateurs à fort facteur de qualité, oscillateurs robustes aux charges externes, capteurs à directivité et sensibilité élevées. Ici nous caractérisons un type de cellules élémentaires qui permet de concevoir un point DBE après une analyse de plusieurs types de cellules. Sur la base de ces résultats, plusieurs conceptions de SIW qui supportent une DBE sont présentées. On considère l'influence des pertes, des perturbations géométriques et l’effet dû à la troncature de la ligne périodique. Les caractéristiques DBE typiques, telles que l'amplification du champ et une forte augmentation du facteur Q et du retard de groupe par rapport au nombre de cellules sont observées dans un résonateur tronqué, dans des situations sans perte et avec perte. Des transitions nécessaires pour alimenter les lignes SIWs sont conçues et permettent d’effectuer les mesures de prototypes qui valident pleinement les analyses théoriques. Enfin, la procédure de conception est également appliquée à un guide d'ondes intégré multicouche, particulièrement adapté aux applications à ondes millimétrique, montrant la versatilité de la méthodologie proposée<br>In this thesis, we describe the synthesis of periodic substrate-integrated waveguide (SIW) supporting degenerate band edge (DBE) points. The DBE point is a special fourth-order degenerate point encountered at the edge of the stopband in a periodic structure, which leads to field enhancement and high-Q resonances. The choice of SIW technology can lead to the use of the DBE concept in microwave and mm-wave integrated circuits, given the easy fabrication, low profile and low-cost features of this technology. Applications of this concept will be oscillators having low threshold currents and being robust to external loading, and sensors with high directivity and sensitivity. Conditions for the design of a unit cell providing a DBE point are given after an analysis of several kinds of unit cells. Based on these guidelines, several SIWs-DBE designs are presented. The influence of losses, of geometrical perturbations, and of truncation are considered. Typical DBE characteristics, such as field enhancement and a steep increase of Q factor and group delay vs. the number of cells in a truncated resonator are observed in lossless and lossy situations. Feeding transitions are designed to feed the SIWs-DBE lines and to perform measurements which fully validate the theoretical analyses. Finally, the design procedure is also applied to a multilayer integrated waveguide, particularly suitable for integrated millimeter-wave applications, showing the versatility of the proposed methodology
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Zhang, Jingwen. "Système antennaire millimétrique actif bas coût basé sur la technologie guide d’onde intégré au substrat creux pour application de télécommunication satellite." Electronic Thesis or Diss., Université Grenoble Alpes, 2024. http://www.theses.fr/2024GRALT002.

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La technologie des guides d’ondes et celle des circuits imprimés (PCB en anglais) constituent deux jalons dans l’histoire de l’ingénierie des micro-ondes. Les guides d’ondes sont à l’origine de différents types de dispositifs passifs tels que les antennes ou les filtres alors que la technologie des PCB a permis d’intégrer les composants actifs tels que les amplificateurs ou les mélangeurs sur de petits volumes. Les composants passifs basés sur les guides d’ondes présentent des avantages tels que de faibles pertes d’insertion, une capacité de tenue en puissance élevée et un blindage intrinsèque. La technologie des guides d’ondes intégrés au substrat (SIW en anglais) proposée dans les années 2000 a réduit la taille des guides d’ondes volumiques en combinant deux technologies : les guides d’ondes métalliques et les PCBs. Elle permet d’obtenir des pertes d’insertion relativement faibles, un blindage intrinsèque et de faibles dimensions. Le SIW simplifie l’intégration des dispositifs passifs basés sur des guides d’ondes avec les dispositifs actifs sur PCB. Afin d’optimiser ses performances, la technologie SIW a évolué avec l’introduction du guide d’ondes intégré au substrat rempli d’air (AFSIW en anglais). La cavité d’air à l’intérieur de l’AFSIW permet de réduire considérablement les pertes diélectriques. L’AFSIW a alors été appliquée à la conception de dispositifs passifs tels que des filtres, antennes ou déphaseurs.Ces dispositifs sont conçus sur un plan unique et leurs interconnexions pour concevoir un système, tel qu’un émetteur ou récepteur radiofréquence (RF) nécessitant l’association de composants, se fait également sur le même plan. Toutefois, la structure multicouche de l’AFSIW offre de nouvelles possibilités de conceptions en utilisant ses couches inférieure et supérieure. Les composants peuvent être empilés et connectés par des transitions verticales. Le travail de cette thèse exploite la structure multicouche de l’AFSIW pour « verticaliser » un système. L’exploitation des couches inférieure et supérieure est étudiée d’une part pour la connexion de composants et d’autre part pour leur conception individuelle.Pour la connexion de composants, la plupart des transitions entre SIW, AFSIW et lignes micro ruban sont réalisées sur le même plan mais cela augmente considérablement la longueur des circuits. Au contraire, la transition entre la cavité de l’AFSIW et la ligne micro ruban proposée dans cette thèse peut être utilisée pour superposer des composants passifs et actifs sur le plan vertical en utilisant le substrat de la couche supérieure de l’AFSIW pour réduire le volume occupé.Pour la conception de composants, les couches inférieure et supérieure de l’AFSIW sont utiles pour réaliser des composants multi-cavités comme des filtres d’ordre élevé. Le couplage inter cavité d’un filtre se faisant classiquement sur le même plan, l’ordre du filtre augmentant, sa longueur augmente aussi. La transition entre cavités empilées proposé dans cette thèse offre une autre possibilité pour la conception de tels composants quand l’espace horizontal alloué serait insuffisant.L’objectif global de cette thèse est de fournir une nouvelle possibilité pour l’organisation spatiale d’un émetteur-récepteur RF. Afin de fournir une preuve de concept, la conception d’une antenne est aussi proposée permettant d’aboutir à un système comprenant l’ensemble : antenne, filtre et amplificateur. Chaque composant et cavités résonantes du filtre sont situés sur des couches différentes. Comparés à l’état de l’art où les composants sont connectés sur un même plan horizontal, les résultats obtenus démontrent la possibilité de connecter verticalement des composants. Ces deux approches de connexion de composants (exploitant le plan horizontal et vertical) offrent plus de liberté pour une utilisation optimale de l’espace 3D, particulièrement critique pour les communications spatiales en raison des contraintes sur le volume occupé dans les satellites<br>Waveguide technology and printed circuit board (PCB) technology are two milestones in the engineering history of microwave technology. Waveguides are at the origin of different types of passive devices such as antennas or filters while PCB technology has made it possible to integrate today's active components such as amplifiers or mixers on very small volumes. Passive components based on waveguide technology have advantages such as low insertion losses, high power handling capability and auto-blind. Substrate-integrated waveguide (SIW) technology proposed in the early 2000s reduced the size of volume waveguides by combining two technologies: metallic waveguides and PCBs. It allows for relatively low insertion losses, auto-blind and small dimensions. The introduction of SIW technology simplifies the integration of passive waveguide-based devices with active PCB-based devices. To further optimize its performance, SIW technology has evolved with the introduction in 2014 of the air-filled substrate integrated waveguide (AFSIW). The cavity placed inside the AFSIW significantly reduces dielectric losses. Since 2014, this technology has been applied to the design of various passive devices such as filters, antennas or phase shifters.These devices are individually designed on a single plane and their connections to each other to design a system, such as a radio frequency transmitter or receiver which requires the association of several components, is also done on the same plane. However, the multilayer structure of AFSIW offers new possibilities for designing these systems using its lower and upper layers. Components can be stacked and connected using vertical transitions. The work of this thesis exploits the multilayer structure of AFSIW to “verticalize” a system. The use of the lower and upper layers is studied on the one hand for the connection of the different components of a system and on the other hand for the design of components individually.For connecting different components, most of the transitions between SIW, AFSIW and various microstrip lines are made on the same plane but this significantly increases the circuit length. On the contrary, the transition between the AFSIW cavity and the micro strip line proposed in this thesis can be used to achieve the superposition of passive and active components on the vertical plane using the substrate of the upper layer of the AFSIW allowing to reduce the occupied volume.For designing individual components, the bottom and top layers of AFSIW are useful for making multi-cavity components such as high-order filters. The coupling between each cavity of a filter classically taking place on the same plane, as the order of the filter increases, its length also increases. The transition between stacked cavities proposed in this thesis offers another possibility for the design of such components in the case where the allocated horizontal space is insufficient.The overall objective of this thesis is to provide a new possibility for the spatial organization of a radio frequency transceiver. In order to provide a proof of concept, the design of an antenna is also proposed in this thesis leading to a system comprising the assembly: antenna, filter and amplifier. Each component is located on a different layer and the filter's resonant cavities are also positioned on different layers. Compared to the state of the art where the components are connected on the same horizontal plane, the results obtained demonstrate the possibility of connecting components vertically. These two approaches to connecting components (exploiting both the horizontal and vertical plane) thus offer more degrees of freedom for optimal use of 3D space, which is particularly critical for spatial communications due to occupied volume constraints at satellite level
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Regard, Charles. "Qualification accélérée des composants SiP." Thesis, Bordeaux 1, 2010. http://www.theses.fr/2010BOR14097/document.

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NXP Semiconductor à Caen ayant des compétences dans le développement destechnologies System in Package (SiP) et NXP Semiconductor à Eindhoven ayant unespécialité en qualification virtuelle, deux partenariats ont été mis en place pour réaliser uneétude sur la qualification accélérée des composants SiP. Une thèse orientée simulations a étéréalisée à l'université de Delft (Pays-Bas) par Xiaosong Ma et dirigée par Kaspar Jansen, enparallèle une thèse plus expérimentale a été réalisée avec l'université de Bordeaux 1 parCharles Regard, à Caen, et dirigée par Hélène Frémont. Ces deux thèses ont été effectuées enproche collaboration. Dans un premier temps, des véhicules de test ont été définisconjointement. Puis un ensemble de caractérisations des matériaux et de simulations a étémené à Delft, alors que des essais expérimentaux de qualification et des analyses dedéfaillance étaient menés à Caen. Tout au long de ces deux thèses, des échanges constants ontété entretenus afin de corréler les simulations par les expérimentations. Ce besoin industrield'étude sur la qualification des composants SiP vient de la très forte augmentation del'intégration des fonctions au sein des équipements mobiles. En effet la technologie SiPpermet de répondre dans des délais intéressants aux nécessités de miniaturisation imposéespar ces nouveaux développements.L'objectif de ce travail de thèse est donc de mettre en place des méthodes et destechniques pour optimiser la qualification des composants System in Package (SiP)<br>NXP Semiconductor at Caen, which has System in Package (SiP) technologiesdevelopment competences and NXP Semiconductor at Eindhoven, which has virtualqualification specialization jointed to study fast reliability qualification of SiP products. Athesis focused on simulations started at TU Delft University (Netherlands) with Xiaosong Madirected by Kaspar Jansen and another thesis focused on experimentation started atBordeaux 1 University with Charles Regard directed by Hélène Frémont. These thesis werelead on close collaboration. In a first time, the tests vehicles were defined by both the PhDstudents. Then materials characterizations and simulations were performed at TU Delft, andexperimental qualification tests and physical analyses were performed in Caen. A long ofthese thesis, constant exchanges allowed to correlate simulations by experimentation. Thisindustrial need of SiP product qualification study is due to the strong increase of functionsintegration into mobile equipments. Thus the SiP technology allows to provide in relativeshort time miniaturized products imposed by the new developments.This thesis work's goal is to get methods and techniques to optimize System inPackage (SiP) reliability qualification
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Kargarrazi, Saleh. "High Temperature Bipolar SiC Power Integrated Circuits." Doctoral thesis, KTH, Integrerade komponenter och kretsar, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-201618.

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In the recent decade, integrated electronics in wide bandgap semiconductor technologies such as Gallium Nitride (GaN) and Silicon Carbide (SiC) have been shown to be viable candidates in extreme environments (e.g high-temperature and high radiation). Such electronics have applications in down-hole drilling, automobile-, air- and space- industries. In this thesis, integrated circuits (ICs) in bipolar 4H-SiC for high-temperature power applications are explored. In particular, device modelling, circuit design, layout design, and measurements are discussed for a range of circuits including operational amplifiers, linear voltage regulators, drivers for power switches, and power converters with integrated control. The circuits were demonstrated and tested from 25 °C up to 500 °C. Circuit design in bipolar SiC technology involves challenges such as the fabrication process’ uncertainties and incomplete models of the devices. Furthermore, high temperature modelling of the integrated devices is needed for circuit design and simulation. From the circuit design viewpoint, techniques such as negative-feedback, temperature-insensitive biasing, buffering and Darlington stages, and amplifiers with fewer gain stages, were shown to be useful for high-temperature IC design in bipolar SiC. It is shown that the linear voltage regulator can be improved by using a tailored high-current lateral Darlington power device in the same fabrication process. This results in a high temperature high current power supply solution. Moreover, the drivers can be improved by design in order to provide higher voltage levels and peak currents for the power devices (bipolar and MOSFET based). In addition, a DC-DC converter with fully integrated hysteretic control is designed taking advantage of several sub-circuits such as operational amplifier, Schmitt trigger and driver for the power switch. This study is followed by preliminary experimental results for the converter and controller IC.<br><p>QC 20170213</p>
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Suvanam, Sethu Saveda. "Radiation Hardness of 4H-SiC Devices and Circuits." Doctoral thesis, KTH, Integrerade komponenter och kretsar, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-199907.

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Advances in space and nuclear technologies are limited by the capabilities of the conventional silicon (Si) electronics. Hence, there is a need to explore materials beyond Si with enhanced properties to operate in extreme environments. In this regards, silicon carbide (4H-SiC), a wide bandgap semiconductor, provides suitable solutions. In this thesis, radiation effects of 4H-SiC bipolar devices, circuits and dielectrics for SiC are investigated under various radiation types. We have demonstrated for the first time the radiation hardness of 4H-SiC logic circuits exposed to extremely high doses (332 Mrad) of gamma radiation and protons. Comparisons with previously available literature show that our 4H-SiC bipolar junction transistor (BJT) is 2 orders of magnitude more tolerant under gamma radiation to existing Si-technology. 4H-SiC devices and circuits irradiated with 3 MeV protons show about one order of magnitude higher tolerance in comparison to Si. Numerical simulations of the device showed that the ionization is most influential in the degradation process by introducing interface states and oxide charges that lower the current gain. Due to the gain reduction of the BJT, the voltage reference of the logic circuit has been affected and this, in turn, degrades the voltage transfer characteristics of the OR-NOR gates. One of the key advantages of 4H-SiC over other wide bandgap materials is the possibility to thermally grow silicon oxide (SiO2) and process device in line with advanced silicon technology. However, there are still questions about the reliability of SiC/SiO2 interface under high power, high temperature and radiation rich environments. In this regard, aluminium oxide (Al2O3), a chemically and thermally stable dielectric, has been investigated. It has been shown that the surface cleaning treatment prior to deposition of a dielectric layer together with the post dielectric annealing has a crucial effect on interface and oxide quality. We have demonstrated a new method to evaluate the interface between dielectric/4H-SiC utilizing an optical free carrier absorption technique to quantitative measure the charge carrier trapping dynamics. The radiation hardness of Al2O3/4H-SiC is demonstrated and the data suggests that Al2O3 is better choice of dielectric for devices in radiation rich applications.<br><p>QC 20170119</p>
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Soong, Chia-Wei. "ELECTRICAL CHARACTERIZATION OF SiC JFET-BASED INTEGRATED CIRCUITS." Case Western Reserve University School of Graduate Studies / OhioLINK, 2014. http://rave.ohiolink.edu/etdc/view?acc_num=case1386674317.

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Barrera-Gonzalez, Claudia Patricia. "Variable swing optimal parallel links minimal power, maximal density for parallel links /." Access to citation, abstract and download form provided by ProQuest Information and Learning Company; downloadable PDF file, 120 p, 2009. http://proquest.umi.com/pqdweb?did=1818417501&sid=11&Fmt=2&clientId=8331&RQT=309&VName=PQD.

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Books on the topic "SIW Circuits"

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Fuentes, Jorge Díaz. Por un feminismo sin mujeres: [fragmentos del segundo circuito Disidencia Sexual]. Editorxs, 2011.

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Bhatla, Ravi. A Six Sigma approach to the process design of printed circuit board screws. Addison-Wesley Pub. Co., 1993.

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International Symposium on Chemical Mechanical Planarization (2nd 1998 San Diego, Calif.). Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing. Edited by Raghavan S, Opila Robert Leon 1953-, Zhang L, Electrochemical Society Electronics Division, Electrochemical Society. Dielectric Science and Technology Division., and Electrochemical Society Meeting. Electrochemical Society, 1998.

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Glick, Robert R. Six Sigma design of a wideband digital communication system. Addison-Wesley, 1992.

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R, Tobin Michael, ed. Process characterization and optimization. Addison-Wesley, 1993.

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1938-, Huijsing Johan H., Plassche, Rudy J. van der., and Sansen Willy M. C, eds. Operational amplifiers, analog to digital convertors [sic], analog computer aided design. Kluwer Academic Publishers, 1993.

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Advanced Research Working Conference on Correct Hardware Design Methodologies (1993 Arles, France). Correct hardware design and verification methods: IFIP WG10.2 Advanced Research Working Conference, CHARME '93, Arles, Frances [sic], May 24-26, 1993 : proceedings. Springer, 1993.

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Sundaram, Sam L. The generation of system moments for improving product quality in advanced IC manufacturing. Addison-Wesley, 1993.

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Stubbs, W. The crown circuit companion: Containing the practice of the assizes on the crown side : with the courts of General and General Quarter Sessions of the Peace : wherein (among other things incident to the practice of the crown law) is included a collection of useful modern precedbnts [sic] of indictments in criminal cases : as well at common law, as those created by statute ... with references to the printed authorities relating thereto. Printed by E. and R. Nutt and R. Gossling for J. Mechell and J. Bailey, 1992.

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Lei, Yuan. Ventilator System Composition. Oxford University Press, 2017. http://dx.doi.org/10.1093/med/9780198784975.003.0005.

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‘Ventilator System Composition’ describes in depth, each of the six essential parts: the electrical supply, compressed gas supply, ventilator, breathing circuit, artificial airway, and the patient’s lungs. The chapter discusses the internal design of the ventilator, particularly the inspiratory channel and expiratory channel, and the use of a proportional valve. It describes the structure of the various breathing circuits or patient circuits that are used, and their relationship to the humidifier in use. Next, the author addresses the artificial airway or non-invasive patient interface, and finally the additional components that are added to the airway, components that add dead space and resistance to the circuit.
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Book chapters on the topic "SIW Circuits"

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Kumari, Sheelu, Vibha Rani Gupta, and Shweta Srivastava. "Propagation Characteristics of SIW and Waveguide: A Comparison." In Nanoelectronics, Circuits and Communication Systems. Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-7486-3_50.

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Giuppi, Francesco, Apostolos Georgiadis, Ana Collado, Maurizio Bozzi, and Luca Perregrini. "Active Antennas in Substrate Integrated Waveguide (SIW) Technology." In Microwave and Millimeter Wave Circuits and Systems. John Wiley & Sons, Ltd, 2012. http://dx.doi.org/10.1002/9781118405864.ch14.

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Raveu, Nathalie, and Ahmad Ismail Alhzzoury. "WCIP Applied to Substrate Integrated Circuits: Substrate Integrated Waveguide (SIW) and Substrate Integrated Non-Radiative Dielectic (SINRD) Circuits." In The Wave Concept in Electromagnetism and Circuits. John Wiley & Sons, Inc., 2016. http://dx.doi.org/10.1002/9781119332701.ch4.

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Karmakar, Ayan, and Kamaljeet Singh. "Passive Circuits." In Si-RF Technology. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-13-8051-8_3.

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Li, Suny. "RF Circuit Design." In MicroSystem Based on SiP Technology. Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-0083-9_16.

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Kumar, Krishan. "SIC scheduling algorithm based MIMO technique for mobile ad-hoc networks." In Intelligent Circuits and Systems. CRC Press, 2021. http://dx.doi.org/10.1201/9781003129103-24.

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Li, Suny. "Rigid-Flex Circuits and 4D SiP Design." In MicroSystem Based on SiP Technology. Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-0083-9_17.

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Qi, Gengzhen, Pui-In Mak, and Rui P. Martins. "High-Performance SAW-Less TDD/FDD RF Front-Ends." In Analog Circuits and Signal Processing. Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-22231-3_1.

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Kong, Jiayuan, and Zhilei Yao. "Low-Cost SiC MOSFET Driver Circuit with Short-Circuit Protection." In Lecture Notes in Electrical Engineering. Springer Nature Singapore, 2024. http://dx.doi.org/10.1007/978-981-97-1674-6_4.

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Mishra, Zeesha, Shubham Mishra, and Bibhudendra Acharya. "High Throughput Novel Architecture of SIT Cipher for IoT Application." In Nanoelectronics, Circuits and Communication Systems. Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-7486-3_26.

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Conference papers on the topic "SIW Circuits"

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Awan, H. Niaz, Awab Muhammad, Muhammad U. Khan, and Hammad M. Cheema. "A Ku-Band Multiple Beamforming 4x SIW-Based Slot Antenna Array." In 2025 2nd International Conference on Microwave, Antennas & Circuits (ICMAC). IEEE, 2025. https://doi.org/10.1109/icmac64768.2025.11003234.

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Zhao, Zhiyuan, Kai Li, Shuxing Wang, Qingzheng Xu, Fujing Zhu, and Xin Zhou. "Design of dual-band filter using SIW resonators with open circuits on opposite sides." In 2024 14th International Symposium on Antennas, Propagation and EM Theory (ISAPE). IEEE, 2024. https://doi.org/10.1109/isape62431.2024.10840669.

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Yoo, Insang, David R. Smith, and Michael Boyarsky. "Experimental Polarizability Extraction of a Waveguide-fed Tunable Metamaterial Element using SIW Characterization Circuits." In 2024 International Symposium on Antennas and Propagation (ISAP). IEEE, 2024. https://doi.org/10.1109/isap62502.2024.10846233.

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Nguyen, Ngoc Nhat Tan, Tuan Hung Nguyen, Duy Manh Luong, Ta Mai Van, Thuy Linh Nguyen, and Thi Thu Huong Tran. "A Ku-band SIW Power Divider With High Isolation Using Coupled Resonators." In 2024 9th International Conference on Integrated Circuits, Design, and Verification (ICDV). IEEE, 2024. http://dx.doi.org/10.1109/icdv61346.2024.10617110.

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Pasetto, Tadeu Pires, and Hugo Enrique Hernández-Figueroa. "Design of a Slotted SIW Antenna with Omnidirectional Azimuth Pattern and Cosecant Squared Elevation Pattern." In 2024 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS). IEEE, 2024. http://dx.doi.org/10.1109/wmcs62019.2024.10619033.

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Ngan, Kinfung, Yuan Zhan, Constantin Dory, Jelena Vučković, and Shuo Sun. "Hybrid photonic integration of color centers in designer nanodiamond with SiN nanophotonic devices." In CLEO: Fundamental Science. Optica Publishing Group, 2024. http://dx.doi.org/10.1364/cleo_fs.2024.fm2f.1.

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We developed a new technique that enables deterministic assembly of diamond color centers in a SiN photonic circuit. Using this technique, we observed Purcell enhancement of SiV centers coupled to a silicon nitride ring resonator.
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Ngan, Kinfung, Yuan Zhan, Constantin Dory, Jelena Vučković, and Shuo Sun. "Hybrid photonic integration of color centers in designer nanodiamond with SiN nanophotonic devices." In Frontiers in Optics. Optica Publishing Group, 2024. https://doi.org/10.1364/fio.2024.ftu6d.3.

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We developed a new technique that enables deterministic assembly of diamond color centers in a SiN photonic circuit. Using this technique, we observed Purcell enhancement of SiV centers coupled to a silicon nitride ring resonator.
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Kawabata, Shiro. "Integration Technology for Superconducting Quantum Circuits." In 2024 IEEE Silicon Nanoelectronics Workshop (SNW). IEEE, 2024. http://dx.doi.org/10.1109/snw63608.2024.10639225.

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Khan, Md Asif, Pydi Ganga Bahubalindruni, Alexander May, Chiara Rossi, and Mathias Rommel. "Temperature Sensing Readout Circuits with 4H-SiC Technology." In 2024 IEEE International Symposium on Smart Electronic Systems (iSES). IEEE, 2024. https://doi.org/10.1109/ises63344.2024.00023.

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Li, Jianbiao, Yong Chen, Jingshuai Wang, et al. "A Solid-State Circuit Breaker Based on Si-IGBT and SiC MOSFET Hybrid Switch with Self-delay Gate Driver Circuits." In 2024 6th International Conference on Energy Systems and Electrical Power (ICESEP). IEEE, 2024. http://dx.doi.org/10.1109/icesep62218.2024.10651624.

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Reports on the topic "SIW Circuits"

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Weinschenk, Craig, Daniel Madrzykowski, and Paul Courtney. Impact of Flashover Fire Conditions on Exposed Energized Electrical Cords and Cables. UL Firefighter Safety Research Institute, 2019. http://dx.doi.org/10.54206/102376/hdmn5904.

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A set of experiments was conducted to expose different types of energized electrical cords for lamps, office equipment, and appliances to a developing room fire exposure. All of the cords were positioned on the floor and arranged in a manner to receive a similar thermal exposure. Six types of cords commonly used as power supply cords, extension cords, and as part of residential electrical wiring systems were chosen for the experiments. The non-metallic sheathed cables (NMB) typically found in residential electrical branch wiring were included to provide a link to previous research. The basic test design was to expose the six different types of cords, on the floor of a compartment to a growing fire to determine the conditions under which the cord would trip the circuit breaker and/or undergo an arc fault. All of the cords would be energized and installed on a non-combustible surface. Six cord types (18-2 SPT1, 16-3 SJTW, 12-2 NM-B, 12-3 NM-B, 18-3 SVT, 18-2 NISPT-2) and three types of circuit protection (Molded case circuit breaker (MCCB), combination Arc-fault circuit interrupter (AFCI), Ground-fault circuit interrupter (GFCI)) were exposed to six room-scale fires. The circuit protection was remote from the thermal exposure. The six room fires consisted of three replicate fires with two sofas as the main fuel source, two replicate fires with one sofa as the main fuel source and one fire with two sofas and MDF paneling on three walls in the room. Each fuel package was sufficient to support flashover conditions in the room and as a result, the impact on the cords and circuit protection was not significantly different. The average peak heat release rate of the sofa fueled compartment fires with gypsum board ceiling and walls was 6.8 MW. The addition of vinyl covered MDF wall paneling on three of the compartment walls increased the peak heat release rate to 12 MW, although most of the increased energy release occurred outside of the compartment opening. In each experiment during post flashover exposure, the insulation on the cords ignited and burned through, exposing bare conductor. During this period the circuits faulted. The circuit protection devices are not designed to provide thermal protection, and, thus, were installed remote from the fire. The devices operated as designed in all experiments. All of the circuit faults resulted in either a magnetic trip of the conventional circuit breaker or a ground-fault trip in the GFCI or AFCI capable circuit protection devices. Though not required by UL 1699, Standard for Safety for Arc-Fault Circuit-Interrupters as the solution for detection methodology, the AFCIs used had differential current detection. Examination of signal data showed that the only cord types that tripped with a fault to ground were the insulated conductors in non-metallic sheathed cables (12-2 NM-B and 12-3 NM-B). This was expected due to the bare grounding conductor present. Assessments of both the thermal exposure and physical damage to the cords did not reveal any correlation between the thermal exposure, cord damage, and trip type.
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Morgenstern, Mark R. Capacitive Discharge Circuit for Surge Current Evaluation of SiC. Defense Technical Information Center, 2009. http://dx.doi.org/10.21236/ada629347.

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Sung, Woongje, Anant Agarwal, Ayman Fayed, and Bongmook Lee. FINAL TECHNICAL REPORT - SMART SiC Power ICs (Scalable, Manufacturable, and Robust Technology for SiC Power Integrated Circuits). Office of Scientific and Technical Information (OSTI), 2024. https://doi.org/10.2172/2563351.

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Urciuoli, Damian P. Evaluation of SiC VJFET Devices for Scalable Solid-State Circuit Breakers. Defense Technical Information Center, 2008. http://dx.doi.org/10.21236/ada481789.

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Sriraj, P. S., Kazuya Kawamura, Paul Metaxatos, et al. Railroad-Highway Crossing Safety Improvement Evaluation and Prioritization Tool. Illinois Center for Transportation, 2023. http://dx.doi.org/10.36501/0197-9191/23-009.

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The expected crash frequency model of Illinois Department of Transportation’s Bureau of Design and Environment needed improvement to incorporate track circuitry as well as pedestrian exposure at railroad-highway grade crossings to make the model more comprehensive. The researchers developed, calibrated, and validated three models to predict collision rates at public, at-grade railroad-highway crossings in Illinois’ six-county northeast region for prioritizing railroad-highway crossings for safety improvements. The first model updated B-factors in the existing Illinois model, which was last validated with data from 1968. The second model modified B-factors to include circuitry types given the active maximum traffic control device at the crossing and added another factor (i.e., P-factor) to account for pedestrian daily traffic using the crossing. The third model added a P-factor to the existing US Department of Transportation’s web accident prediction system model to account for daily pedestrian traffic. Using year 2018 validation data, the first model had an r2 of 0.20 with reported collision rates. The second model had an r2 of 0.58 with reported collision rates, while the existing BDE model had an r2 of 0.17 with year 2018 reported collision rates. The third model had an r2 of 0.70 with reported collision rates using 2018 validation data whereas the existing US Department of Transportation’s web-based accident prediction system model had an r2 of 0.50 using year 2018 validation data. The three models are presented in this report along with a digital tool using the second model for illustrative purposes.
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Hair. L51725 Drilling Fluids in Pipeline Installation by Horizontal Directional Drilling-Practical Applications. Pipeline Research Council International, Inc. (PRCI), 1994. http://dx.doi.org/10.55274/r0010163.

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Drilling fluid plays a key role in the installation of a pipeline by horizontal directional drilling (HDD) and accounts for the majority of the associated environmental impact. An improper drilling fluid program can result in stuck pipe. Uncontrolled discharge of drilling fluid downhole can damage or undermine adjacent structures.The cost of drilling fluid involved with pipeline installation, particularly when disposal costs are considered, can be substantial. This manual is the principal product of PRC project PR-227-9321. Its purpose is to increase the level of technical sophistication relative to drilling fluids used in the installation of pipelines by Horizontal Directional Drilling (HDD). It is anticipated that this increase will benefit the natural gas industry through reductions in HDD installation costs and environmental impact. The manual contains six sections which address the following general topics: 1 . The HDD installation process, the specific functions of drilling fluids in pipeline installation by HDD, and the composition of drilling fluids; 2. Characteristics of drilling fluid flow, pertinent properties of drilling fluids, and calculation methods relative to drilling fluid flow circuits; 3. Standard classification of soil and rock structures and soil and rock properties relative to drilling fluid flow; 4. The behavior of soil and rock structures relative to drilling fluid flow, general drilling fluid criteria, and general solutions to drilling problems; 5. Methods for estimating drilling fluid quantities, methods for disposing of excess drilling fluids, the environmental impact of drilling fluids used in HDD, and construction specifications relative to drilling fluids; and 6. Materials used drilling fluids.
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Paranjape, Ujjwala, and Shivali Tukdeo. Learning, Livelihood and Possibilities of Socially Just Pedagogy. Indian Institute for Human Settlements, 2023. http://dx.doi.org/10.24943/tesf1907.2024.

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This report reflects our ongoing collaborative research and action engagements in education. Three overlapping interests are at the centre of our inquiry: (a) the relationship between education and work; (b) the transformation of small towns in Maharashtra and the changing role of education therein; and (c) vocational and skill-based programmes in small towns. Anchored in the south-western town of Sangli, Maharashtra, our work focuses on various institutional arrangements in vocational and skill-based education. By mapping the educational landscape, the report also highlights the experiences of students who traverse the domains of work and education. Scholars of diverse disciplinary persuasions have pointed out the intensification of economic and social changes that have occurred since the late 1980s in India. Driven by the imperatives of the global economy, economic liberalisation severely affected a number of domestic sectors. Agriculture and related sectors saw large-scale movement of labour towards non-agrarian livelihoods that also resulted in a consistent increase in short-term, circuitous and at times long-term migration to urban and semi-urban locales. Similarly, there have also been significant shifts that have occurred in education over the course of the past three decades, propelling a change in the social, cultural and economic realms. The desire and demand for quality education has become apparent, while state provisioning of education has gone down and privatisation has occurred at a fast pace.
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Drive modelling and performance estimation of IPM motor using SVPWM and Six-step Control Strategy. SAE International, 2021. http://dx.doi.org/10.4271/2021-01-0775.

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This paper presents a comprehensive evaluation of the performance of an interior permanent magnet (IPM) traction motor drive, and analyses the impact of different modulation techniques. The most widely used modulation methods in traction motor drives are Space vector modulation (SVPWM), over-modulation, and six-step modulation have been implemented. A two-dimensional electromagnetic finite element model of the motor is co-simulated with a dynamic model of a field-oriented control (FOC) circuit. For accurate tuning of the current controllers, extended complex vector synchronous frame current regulators are employed. The DC-link voltage utilization, harmonics in the output waveforms, torque ripple, iron losses, and AC copper losses are calculated and compared with sinusoidal excitation. Overall, it is concluded that the selection of modulation technique is related to the operating condition and motor speed, and a smooth transition between different modulation techniques is essential to achieve a better performance.
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Payment Systems Report - June of 2020. Banco de la República de Colombia, 2021. http://dx.doi.org/10.32468/rept-sist-pag.eng.2020.

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With its annual Payment Systems Report, Banco de la República offers a complete overview of the infrastructure of Colombia’s financial market. Each edition of the report has four objectives: 1) to publicize a consolidated account of how the figures for payment infrastructures have evolved with respect to both financial assets and goods and services; 2) to summarize the issues that are being debated internationally and are of interest to the industry that provides payment clearing and settlement services; 3) to offer the public an explanation of the ideas and concepts behind retail-value payment processes and the trends in retail payments within the circuit of individuals and companies; and 4) to familiarize the public, the industry, and all other financial authorities with the methodological progress that has been achieved through applied research to analyze the stability of payment systems. This edition introduces changes that have been made in the structure of the report, which are intended to make it easier and more enjoyable to read. The initial sections in this edition, which is the eleventh, contain an analysis of the statistics on the evolution and performance of financial market infrastructures. These are understood as multilateral systems wherein the participating entities clear, settle and register payments, securities, derivatives and other financial assets. The large-value payment system (CUD) saw less momentum in 2019 than it did the year before, mainly because of a decline in the amount of secondary market operations for government bonds, both in cash and sell/buy-backs, which was offset by an increase in operations with collective investment funds (CIFs) and Banco de la República’s operations to increase the money supply (repos). Consequently, the Central Securities Depository (DCV) registered less activity, due to fewer negotiations on the secondary market for public debt. This trend was also observed in the private debt market, as evidenced by the decline in the average amounts cleared and settled through the Central Securities Depository of Colombia (Deceval) and in the value of operations with financial derivatives cleared and settled through the Central Counterparty of Colombia (CRCC). Section three offers a comprehensive look at the market for retail-value payments; that is, transactions made by individuals and companies. During 2019, electronic transfers increased, and payments made with debit and credit cards continued to trend upward. In contrast, payments by check continued to decline, although the average daily value was almost four times the value of debit and credit card purchases. The same section contains the results of the fourth survey on how the use of retail-value payment instruments (for usual payments) is perceived. Conducted at the end of 2019, the main purpose of the survey was to identify the availability of these payment instruments, the public’s preferences for them, and their acceptance by merchants. It is worth noting that cash continues to be the instrument most used by the population for usual monthly payments (88.1% with respect to the number of payments and 87.4% in value). However, its use in terms of value has declined, having registered 89.6% in the 2017 survey. In turn, the level of acceptance by merchants of payment instruments other than cash is 14.1% for debit cards, 13.4% for credit cards, 8.2% for electronic transfers of funds and 1.8% for checks. The main reason for the use of cash is the absence of point-of-sale terminals at commercial establishments. Considering that the retail-payment market worldwide is influenced by constant innovation in payment services, by the modernization of clearing and settlement systems, and by the efforts of regulators to redefine the payment industry for the future, these trends are addressed in the fourth section of the report. There is an account of how innovations in technology-based financial payment services have developed, and it shows that while this topic is not new, it has evolved, particularly in terms of origin and vocation. One of the boxes that accompanies the fourth section deals with certain payment aspects of open banking and international experience in that regard, which has given the customers of a financial entity sovereignty over their data, allowing them, under transparent and secure conditions, to authorize a third party, other than their financial entity, to request information on their accounts with financial entities, thus enabling the third party to offer various financial services or initiate payments. Innovation also has sparked interest among international organizations, central banks, and research groups concerning the creation of digital currencies. Accordingly, the last box deals with the recent international debate on issuance of central bank digital currencies. In terms of the methodological progress that has been made, it is important to underscore the work that has been done on the role of central counterparties (CCPs) in mitigating liquidity and counterparty risk. The fifth section of the report offers an explanation of a document in which the work of CCPs in financial markets is analyzed and corroborated through an exercise that was built around the Central Counterparty of Colombia (CRCC) in the Colombian market for non-delivery peso-dollar forward exchange transactions, using the methodology of network topology. The results provide empirical support for the different theoretical models developed to study the effect of CCPs on financial markets. Finally, the results of research using artificial intelligence with information from the large-value payment system are presented. Based on the payments made among financial institutions in the large-value payment system, a methodology is used to compare different payment networks, as well as to determine which ones can be considered abnormal. The methodology shows signs that indicate when a network moves away from its historical trend, so it can be studied and monitored. A methodology similar to the one applied to classify images is used to make this comparison, the idea being to extract the main characteristics of the networks and use them as a parameter for comparison. Juan José Echavarría Governor
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