Academic literature on the topic 'Solder and soldering Printed circuits industry Printed circuits industry'
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Journal articles on the topic "Solder and soldering Printed circuits industry Printed circuits industry"
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Suh, Seigi, Ryan Persons, Doug Hargrove, and Gregory Berube. "Solderable Polymer Thick-film Conductors for Low Temperature Substrates." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000310–16. http://dx.doi.org/10.4071/2380-4505-2018.1.000310.
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Abstract For decades, polymer thick-film (PTF) systems have provided a low cost, non-fired option for screen-printing simple electronic circuits. The ability to apply these types of pastes on temperature sensitive substrates such as PET, polycarbonate, polyimide, and other polymers has facilitated a variety of applications, for instance membrane touch-switch keypads, buss bars for touch screens, various types of sensors, and flexible circuitry. Polymer thick-film is also one of the primary technology solutions utilized in the rapidly emerging Printed Electronic market, where flexible, durable materials are paramount to the success of these technologies. One of the largest emerging markets for polymer thick-film is wearable electronics, where engineers are designing “smart fabrics” with active circuitry for medical monitoring, performance enhancement in sports, and personal comfort. Polymer thick-film pastes include silver pastes for conductors, carbon pastes for resistive applications, silver-silver chloride fillers for glucose sensors, and dielectric pastes. The major challenge with PTF silver conductors is that they are not conducive to soldering. This hinders the ability to attach components, leads, dies, wires, or other features to the prints. As copper is solderable, one possible solution would be a copper polymer thick-film metallization; however they start oxidizing at the typical paste curing temperatures, 110 – 130°C, rendering them unsuitable for the vast majority of conductive applications. In order to meet these challenges, Heraeus has developed a new line of solderable polymer thick-film conductors based on a high-performance silver-coated copper conductive filler. These metallizations are solderable, resistant to solder leaching, and result in sheet resistivities approaching that of pure silver polymer conductors. The prints do not degrade in performance when cured at temperatures as high as 200°C. The new product line was formulated to accept different types of solders, especially traditional SAC-305, which provides a complete matched solution for designers. The new metallization opens up new applications given its ability to print polymer circuitry on a variety of substrates including aluminum, steel, FR4, Kapton, Mylar, and glass. The technology also allows for the fabrication of more complex circuitry on these types of substrates, giving circuit designers a powerful new tool in their toolbox in applications such as LED lighting, sensors, and heaters. Finally, these materials may provide a lower-cost option for solderable flexible polymer end terminations for components used in vibration sensitive applications, for instance the automotive industry. In our paper, we will present the properties of the new pastes and printed conductors. Performance testing includes surface resistivity, solderability, solder leach resistance, voiding, and adhesion on two substrates: FR4 and Kapton. Furthermore, we show that the solderable PTF conductor will provide a potential cost- savings over the current technology used on FR4 boards, stamped copper films. By replacing the stamped copper with our solderable PTF conductor, manufacturers will have the advantage of replacing a subtractive process for etching their patterns with an additive, environmentally friendly process, not only saving processing time but eliminating a large, dangerous copper waste stream. Finally, we will summarize the applications that the new technology enables.
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Abdul Aziz, M. S., M. Z. Abdullah, and C. Y. Khor. "Thermal fluid-structure interaction of PCB configurations during the wave soldering process." Soldering & Surface Mount Technology 27, no. 1 (February 2, 2015): 31–44. http://dx.doi.org/10.1108/ssmt-07-2014-0013.
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Purpose – This paper aims to investigate the thermal fluid–structure interactions (FSIs) of printed circuit boards (PCBs) at different component configurations during the wave soldering process and experimental validation. Design/methodology/approach – The thermally induced displacement and stress on the PCB and its components are the foci of this study. Finite volume solver FLUENT and finite element solver ABAQUS, coupled with a mesh-based parallel code coupling interface, were utilized to perform the analysis. A sound card PCB (138 × 85 × 1.5 mm3), consisting of a transistor, diode, capacitor, connector and integrated circuit package, was built and meshed by using computational fluid dynamics pre-processing software. The volume of fluid technique with the second-order upwind scheme was applied to track the molten solder. C language was utilized to write the user-defined functions of the thermal profile. The structural solver analyzed the temperature distribution, displacement and stress of the PCB and its components. The predicted temperature was validated by the experimental results. Findings – Different PCB component configurations resulted in different temperature distributions, thermally induced stresses and displacements to the PCB and its components. Results show that PCB component configurations significantly influence the PCB and yield unfavorable deformation and stress. Practical implications – This study provides PCB designers with a profound understanding of the thermal FSI phenomenon of the process control during wave soldering in the microelectronics industry. Originality/value – This study provides useful guidelines and references by extending the understanding on the thermal FSI behavior of molten solder for PCBs. This study also explores the behaviors and influences of PCB components at different configurations during the wave soldering process.
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Abdul Aziz, M. S., M. Z. Abdullah, and C. Y. Khor. "Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis." Scientific World Journal 2014 (2014): 1–13. http://dx.doi.org/10.1155/2014/482363.
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An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) <T< 643.15 K (370°C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. TheΔTobtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry.
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Guéné, Emmanuelle, Richard Anisko, and Céline Puechagut. "Solderability and Reliability Evolution of No-Clean Solder Fluxes For Selective Soldering." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000547–56. http://dx.doi.org/10.4071/isom-2017-tha26_146.
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Abstract Flux consumption for wave soldering tends to decrease, mainly due to its gradual replacement by reflow soldering methods (i.e. pin-in-paste) in many electronics applications. However, in several cases, wave soldering still remains a must, with an increasing share of “selective” soldering processes, either using wave frames with dedicated apertures or solder fountains. Such processes are more challenging for the fluxes in terms of reliability under operation, since some chemistries remaining on the printed circuit boards after soldering may promote corrosion. Thus, flux manufacturers had to adapt their formulations to minimize such issues while keeping an efficient activation level, with several types of alloys (tin-lead, tin-silver-copper and low/no-silver) and associated with the numerous types of finishes encountered. The paper will cover the types of flux used in the electronic industry according to their chemistry and activation level (rosin-based, halides, alcohol-based or water-based flux…), and their characteristics with reference to standards. The limits of current standards will be discussed in regards to the last generation solder fluxes. Then, the development of two low-residue new generation fluxes, an alcohol-based flux and a true VOC-free flux, will be described, according to requirements: the lab tests results (surface tension, spread tests, wettability tests…) will be presented and discussed. Reliability will be especially investigated through surface insulation resistance, electro-chemical migration test, ionic contamination as well as Bono tests to determine the candidates able to provide high processability combined with chemical inertness of residues. Finally, the performance of flux will be assessed through customer tests, involving several types of boards, finishes and different solder alloys and wave equipment.
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Fonseka, C. L. S. C., and J. A. K. S. Jayasinghe. "Localization of component lead inside a THT solder joint for solder defects classification." Journal of Achievements in Materials and Manufacturing Engineering 2, no. 83 (August 1, 2017): 57–66. http://dx.doi.org/10.5604/01.3001.0010.7033.
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Purpose: Automatic Optical Inspection (AOI) systems, used in electronics industry have been primarily developed to inspect soldering defects of Surface Mount Devices (SMD) on a Printed Circuit Board (PCB). However, no commercially available AOI system exists that can be integrated to a desktop soldering robotic system, which is capable of identifying soldering defects of Through Hole Technology (THT) solder joints along with the soldering process. In our research, we have implemented an AOI platform that is capable of performing automatic quality assurance of THT solder joints in a much efficient way. In this paper, we have presented a novel approach to identify soldering defects of THT solder joints, based on the location of THT component lead top. This paper presents the methodologies that can be used to precisely identify and localize THT component lead inside a solder joint. Design/methodology/approach: We have discussed the importance of lead top localization and presented a detailed description on the methodologies that can be used to precisely segment and localize THT lead top inside the solder joint. Findings: It could be observed that the precise localization of THT lead top makes the soldering quality assurance process more accurate. A combination of template matching algorithms and colour model transformation provide the most accurate outcome in localizing the component lead top inside solder joint, according to the analysis carried out in this paper. Research limitations/implications: When the component lead top is fully covered by the soldering, the implemented methodologies will not be able to identify the actual location of it. In such a case, if the segmented and detected lead top locations are different, a decision is made based on the direction in which the solder iron tip touches the solder pad. Practical implications: The methodologies presented in this paper can be effectively used to have a precise localization of component lead top inside the solder joint. The precise identification of component lead top leads to have a very precise quality assurance capability to the implemented AOI system. Originality/value: This research proposes a novel approach to identify soldering defects of THT solder joints in a much efficient way based on the component lead top. The value of this paper is quite high, since we have taken all the possibilities that may appear on a solder joint in a practical environment.
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Schwebig, Alida Ilse Maria, and Rainer Tutsch. "Compilation of training datasets for use of convolutional neural networks supporting automatic inspection processes in industry 4.0 based electronic manufacturing." Journal of Sensors and Sensor Systems 9, no. 1 (July 1, 2020): 167–78. http://dx.doi.org/10.5194/jsss-9-167-2020.
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Abstract. Ensuring the highest quality standards at competitive prices is one of the greatest challenges in the manufacture of electronic products. The identification of flaws has the uppermost priority in the field of automotive electronics, particularly as a failure within this field can result in damages and fatalities. During assembling and soldering of printed circuit boards (PCBs) the circuit carriers can be subject to errors. Hence, automatic optical inspection (AOI) systems are used for real-time detection of visible flaws and defects in production. This article introduces an application strategy for combining a deep learning concept with an optical inspection system based on image processing. Above all, the target is to reduce the risk of error slip through a second inspection. The concept is to have the inspection results additionally evaluated by a convolutional neural network. For this purpose, different training datasets for the deep learning procedures are examined and their effects on the classification accuracy for defect identification are assessed. Furthermore, a suitable compilation of image datasets is elaborated, which ensures the best possible error identification on solder joints of electrical assemblies. With the help of the results, convolutional neural networks can achieve a good recognition performance, so that these can support the automatic optical inspection in a profitable manner. Further research aims at integrating the concept in a fully automated way into the production process in order to decide on the product quality autonomously without human interference.
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Straubinger, Daniel, István Bozsóki, David Bušek, Balázs Illés, and Attila Géczy. "Modelling of temperature distribution along PCB thickness in different substrates during reflow." Circuit World 46, no. 2 (December 21, 2019): 85–92. http://dx.doi.org/10.1108/cw-07-2019-0074.
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Purpose In this paper, analytical modelling of heat distribution along the thickness of different printed circuit board (PCB) substrates is presented according to the 1 D heat transient conduction problem. This paper aims to reveal differences between the substrates and the geometry configurations and elaborate on further application of explicit modelling. Design/methodology/approach Different substrates were considered: classic FR4 and polyimide, ceramics (BeO, Al2O3) and novel biodegradables (polylactic-acid [PLA] and cellulose acetate [CA]). The board thicknesses were given in 0.25 mm steps. Results are calculated for heat transfer coefficients of convection and vapour phase (condensation) soldering. Even heat transfer is assumed on both PCB sides. Findings It was found that temperature distributions along PCB thicknesses are mostly negligible from solder joint formation aspects, and most of the materials can be used in explicit reflow profile modelling. However PLA shows significant temperature differences, pointing to possible modelling imprecisions. It was also shown, that while the difference between midplane and surface temperatures mainly depend on thermal diffusivity, the time to reach solder alloy melting point on the surface depends on volumetric heat capacity. Originality/value Results validate the applicability of explicit heat transfer modelling of PCBs during reflow for different heat transfer methods. The results can be incorporated into more complex simulations and profile predicting algorithms for industrial ovens controlled in the wake of Industry 4.0 directives for better temperature control and ultimately higher soldering quality.
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Che Ani, Fakhrozi, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Roslina Ismail, Zuraihana Bachok, Mohamad Aizat Abas, and Norinsan Kamil Othman. "SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly." Soldering & Surface Mount Technology 30, no. 1 (February 5, 2018): 1–13. http://dx.doi.org/10.1108/ssmt-04-2017-0011.
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Purpose This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.
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Gera, Günter, Udo Welzel, Yin Jizhe, and Harald Feufel. "Qualitative Model Describing Hot Tear Above VIPPO and Numerous Other Design Elements." Journal of Surface Mount Technology 33, no. 1 (July 14, 2020): 28–33. http://dx.doi.org/10.37665/smt.v33i1.15.
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Over the last couples of years there have been numerous reports of a unique soldering failure resulting in a separation of BGA solder joints from the intermetallic compound at the interposer during reflow. In most cases, the failures were correlated with the use of Via-In-Pad-Plated-Over-Technology. Since the separation could be proven to occur during the phase transition from solid to liquid [1] the term Hot Tear was used. Even though this term is traditionally only used for tears during solidification its scope was extended to tears during any phase transition. Since the Hot Tear results in a very thin separation it is usually not inspectable, neither by means of X-Ray inspection nor by electrical testing, but results in very early field failures.
In this paper, the general mechanism for the formation of Hot Tears will be discussed and applied to numerous other design elements that can be found on Printed Circuit Board Assemblies. We will show that due to several industry trends e.g. VIPPO, heavy copper PCBs, buried vias, non-eutectic alloys, thinner components, thicker boards, via in pad, etc. the probability of Hot Tears is steadily increasing.
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Géczy, Attila, Bíborka Kvanduk, Balazs Illes, and Gábor Harsányi. "Comparative study on proper thermocouple attachment for vapour phase soldering profiling." Soldering & Surface Mount Technology 28, no. 1 (February 1, 2016): 7–12. http://dx.doi.org/10.1108/ssmt-10-2015-0033.
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Purpose – The paper aims to present a comparative study of various thermocouple (TC) attaching methods for the proper measurement of soldering temperature profiling during vapour phase soldering (VPS). The heat transfer process during VPS is different from common methods, while the required heat for reflow is provided by the condensation. The condensate is a flowing layer on the board, where the dynamic behaviour also affects the local conditions on the surfaces. Temperature measurements based on TCs are also affected this way; it is important to investigate the process for deeper understanding. Design/methodology/approach – Bare printed circuit boards (PCBs) were prepared for standard K-Type TCs attachment with industry standard materials: kapton polyimide tape, aluminium tape, SMD adhesive and high-temperature solder (HTS). Heating experiments were performed in a batch-type VPS oven with Galden LS240 fluid and fixed oven parameters. Findings – According to the specific attachment requirements, HTS and Alu-tape are the suggested methods for better profiling reliability and repeatability. Alu-tape is the preferred all-around method, for fast, exchangeable, cheap, reliable and repeatable profiling in a VPS oven. It was presented that the heating factor (Q?) gives more reliable comparison overview; the time period-based comparisons may be affected by the thermal inertia, while heating factor also includes temperature conditions at the given time points. Originality/value – The paper presents the reliability of the presented methods for VPS and present suggestions for the use of different TC ends and attaching materials during condensation heating of the PCBs. Also a new approach on profiling data evaluation based on the heating factor is presented and suggested for wider use.
Dissertations / Theses on the topic "Solder and soldering Printed circuits industry Printed circuits industry"
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Schuh, Amy Jeanne. "Monitoring and control system for hot air solder leveling process." Master's thesis, This resource online, 1991. http://scholar.lib.vt.edu/theses/available/etd-01122010-020101/.
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Leal, James Andrew 1963. "Automated radiographic inspection of through-hole electronic circuit board solder defects." Thesis, The University of Arizona, 1988. http://hdl.handle.net/10150/276672.
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A study has been carried out to investigate the use of "real-time" radiography as a method of automated inspection of through-hole electronic circuit board solder joints. By evaluating five major solder defects it has been found that film radiography employing high contrast film results in a definite distinction between a good solder joint and a defective solder joint. The same five defects were also found to be distinguishable from a good solder joint when evaluated by a real-time radiographic inspection unit using digital image processing. Although the type of defect being investigated was not discernible, the ability to distinguish a good solder joint from a defective solder joint is a major step in the implementation of automated solder joint inspection for military electronics.
Books on the topic "Solder and soldering Printed circuits industry Printed circuits industry"
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Lyssel, Melanie Van. Environmentally acceptable soldering and cleaning materials in electronics. Norwalk, CT: Business Communications Co., 1997.
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Gurnett, Keith W. No-clean technology: An assessment of market & technical potential. Oxford, UK: Elsevier Advanced Technology, 1995.
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Daniels, Ron. New Cleaning Strategies: Environmental Issues and Technical Developments (Circuits Assembly Technical Insight Series). Backbeat Books, 1994.
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Ron, Daniels, ed. New cleaning strategies: Environmental issues and technical developments. San Francisco: Miller Freeman Books, 1994.
Find full textConference papers on the topic "Solder and soldering Printed circuits industry Printed circuits industry"
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Barbosa, Flávia V., Pedro E. A. Ribeiro, Maria F. Cerqueira, Delfim F. Soares, José C. F. Teixeira, Senhorinha F. C. F. Teixeira, Rui A. M. M. Lima, and Diana M. D. Pinho. "Rheology Characterization of Solder Paste." In ASME 2017 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/imece2017-71413.
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Reflow soldering process is widely implemented in the electronics industry. This method allows the attachment of electronic components to a printed circuit board (PCB) through the melting of solder paste, which makes the interconnection between them. The reflow soldering process must ensures the correctly melting of the solder paste and heating of the adjoining surfaces, without the electronic components suffer overheating or any other type of damage. Solder paste is the most widespread material in the SMT (Surface Mount Technology) process using reflow soldering. An ideal solder paste will increase production efficiency, decreasing the amount of defects associated with the reflow soldering process. However, several factors affects the performance of the solder paste, from rheology, printability, and reliability to the adhesion strength of components and the ability to avoid defects related to reflow. Therefore, all these factors need to be considered during the selection of a solder paste for a specific application. The rheological properties were determined using both a double cylinder (PHYSICA-RHEOLAB MC1) and a double plate (Malvern) rheometers. The later enable the determination of viscoelastic properties. The present paper analyses the rheological behavior of a SAC405 solder paste, a mixture containing a metal alloy powder (25–45 μm) and a flux which at its base is a resin. The tests were carried out at conditions (temperature and shear rate) of relevance to the printing process. The results obtained show that the paste viscosity closely follows the Herschel-Bulkley model and shows a thixotropic behavior without fully recovery between applications. In addition, the viscosity decreases with the increase of shear rate confirming that the solder paste is a non-Newtonian fluid, shear thinning in behavior. The oscillatory tests have shown that the transition from elastic to viscous behavior occurs at a shear stress above 35 Pa. On the other hand, the creep/recovery test confirms that the level of solicitation influences the capacity of recovery of the solder paste.
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Cheong, Kah Chin. "Techniques in Extracting CSP Device from Underfilled PCB Module and Performing Solder Rework and Reballing for ATE Testing." In ISTFA 2017. ASM International, 2017. http://dx.doi.org/10.31399/asm.cp.istfa2017p0585.
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Abstract The application of underfill materials for board level assembly has been increasing rapidly in semiconductor industry to enhance strength and reliability performance of semiconductor components in harsh environments. However, due to the intractability of the capillary underfill after curing, extracting a chip scale package (CSP) device from a printed circuit board (PCB) with a combination of mold compound and capillary underfill for ATE testing has become difficult and challenging. This poses a severe limitation to this technology regarding electrical testing and failure analysis. In order to address the challenge in extracting a CSP device from an underfilled PCB without inducing any mechanical damage, a series of sample preparation techniques has been introduced. This paper discusses the techniques in removing the fine pitch CSP device from underfilled PCB module in a relatively simple way which includes application of chemical solutions, de-soldering, residual solder remnants cleaning and reballing. The established process enables ATE testing, electrical testing and failure analysis to be performed on any CSP devices. An electrical evaluation on the efficiency of a CSP device after a series of sample preparation processes will also be highlighted.
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Zhang, Yifei, Kanth Kurumaddali, Jeffrey C. Suhling, Pradeep Lall, and Michael J. Bozack. "Material Behavior of Mixed Formulation Solder Joints." In ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89003.
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The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC) solder balls. Such parts are often assembled to printed circuit boards using traditional 63Sn-37Pb solder paste. The resulting solder joints contain unusual quaternary alloys of Sn, Ag, Cu, and Pb. In addition, the alloy composition can vary across the solder joint based on the paste to ball solder volumes and the reflow profile utilized. The mechanical and physical properties of such Sn-Ag-Cu-Pb alloys have not been explored extensively in the literature. In addition, the reliability of mixed formulation solder joints is poorly understood. In this work, we have explored the physical properties and mechanical behavior of mixed formulation solder materials. Seven different mixture ratios of 63Sn-37Pb and SAC305 solder materials have been formed, which include five carefully controlled mixtures of the two solder alloys (by weight percentage) and the two extreme cases (pure Sn-Pb and pure SAC). For the various percentage mixtures, the melting point, pasty range, stress-strain curves, mechanical properties (modulus, strength), and creep curves have been characterized. The variations of the mechanical properties and creep rates with aging at room temperature (25 °C) and elevated temperature (100 °C) have also been measured. Finally, the microstructures realized with the various mixtures have been found and correlated to the mechanical measurements and microstructures found in actual mixed formulation BGA solder joints. The results for the mechanical and physical properties show a very complicated dependence on the mixture ratio.