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Relevant bibliographies by topics / Solder and soldering Quality control

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Academic literature on the topic 'Solder and soldering Quality control'

Author: Grafiati

Published: 4 June 2021

Last updated: 3 February 2022

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Journal articles on the topic "Solder and soldering Quality control"

1

Чуйко М.М. and Завальський В. "THE CONTACT ANGLE CONTROL OF THE SOLDER FOR IMPROVING THE SOLDERING QUALITY." Перспективні технології та прилади, no. 17 (January 27, 2021): 161–66. http://dx.doi.org/10.36910/6775-2313-5352-2020-17-24.

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High quality of the soldering process can be achieved with the right choice of the necessary soldering materials. Since wetting determines the further nature of the connection between the solder and the main soldering material, the contact angle measurement is the basis for quality control of soldering materials, provided that the basic requirements of the technological process. The determination of the contact angle value is carried out by the indirect method of the sessile drop, by measuring the basic parameters of the drop using infrared transducer. A smaller value of the contact angle corresponds to a better interaction of materials, and hence a better electrical contact

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Chen, Zhihua, Cheng He, Ying Zheng, Xiaolong Shi, and Tao Song. "A Novel Thermodynamic Model and Temperature Control Method of Laser Soldering Systems." Mathematical Problems in Engineering 2015 (2015): 1–10. http://dx.doi.org/10.1155/2015/509031.

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Laser technology is vital in production of precision electronic components and has been widely used in modern industry. In laser soldering systems, accurate temperature control remains a challenging problem, since the temperature is highly sensitive to laser power and thermodynamic parameters of solder joints. In this paper, a good solution is proposed to solve the problem by controlling the temperature based on a novel thermodynamic model. In the model, many of the major factors are taken into account, such as laser energy, flux influence, and solder joints with different parameters. Aimed at the thermodynamic process and the influence of solder fluxes, a mixed mode control method is used to track the designed target temperature curve; this method can produce a solder joint with good quality. As a result, a model-based feed-forward and proportional, integral, and derivative (PID) mixed control method is developed. In practice, the proposed method is verified to have a wider product capability and production size; and a rate of good products of 99.94% is achieved with consuming approximately half of the energy comparing with manual soldering and constant laser power soldering.

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Alaya, Mohamed Amine, Balázs Illés, David Bušek, and Attila Géczy. "Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors." Applied Sciences 11, no. 4 (February 16, 2021): 1755. http://dx.doi.org/10.3390/app11041755.

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Electronic manufacturing principles are continuously developing, further improving assembly quality and productivity. There is a continuous need to apply novel and improved methods of process monitoring to provide accurate measurement and control during assembling. In this paper, a new principle for monitoring filmwise condensation-based heat-level—vapour phase soldering (HL-VPS) is presented to improve the process control. The experiment is based on thermocouple sensors in fusion with a sensitive gauge type pressure sensor. The aim is to precisely identify the steps of condensation-based reflow heat transfer process with commercially available components and the mindset of possible retrofitting in the generally used HL-VPS soldering ovens. It was found that the gauge sensor can follow the state of the workspace more precisely as the thermocouples, by monitoring the hydrostatic state of the vapour. The pressure (time) function gives information about the build-up of the vapour column, highlighting four characteristic steps (phases) of the process, meaning: immersion of the sample to be soldered, condensation-based heat transfer, solder-break, and cooling. Combined application with thermocouples enables more precise control, improving soldering quality and can reduce idle time of the oven. In addition, it was showed that the gauge type sensors could highlight any failure in the oven sealing by a sensor signal threshold detection. The original concept of workspace identification also fits the present and future industry 4.0 directives.

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Livovsky, Lubomir, and Alena Pietrikova. "Real-time profiling of reflow process in VPS chamber." Soldering & Surface Mount Technology 29, no. 1 (February 6, 2017): 42–48. http://dx.doi.org/10.1108/ssmt-10-2016-0026.

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Purpose This paper aims to present a new method of real-time monitoring of thermal profiles applied in vapour phase soldering (VPS) reflow processes. The thermal profile setting is a significant variable that affects the quality of joints. The method allows rapid achievement of a required thermal profile based on software control that brings new efficiency to the reflow process and enhanced joint quality, especially for power electronics. Design/methodology/approach A real-time monitoring system based on computerized heat control was realized in a newly developed laboratory VPS chamber using a proportional integral derivation controller within the soldering process. The principle lies in the strictly accurate monitoring of the real defined reflow profile as a reference. Findings Very accurate maintenance of the required reflow profile temperature was achieved with high accuracy (± 2°C). The new method of monitoring and control of the reflow real-time profiling was verified at various maximal reflow temperatures (230°C, 240°C and 260°C). The method is feasible for reflowing three-dimensional (3D) power modules that use various types of solders. The real-time monitoring system based on computerised heat control helped to achieve various heights of vapour zone. Originality/value The paper describes construction of a newly developed laboratory-scale VPS chamber, including novel real-time profiling of the reflow process based on intelligent continuously measured temperatures at various horizontal positions. Real-time profiling in the laboratory VPS chamber allowed reflow soldering on 3D power modules (of greater dimensions) by applying various flux-less solder materials.

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Пискарёв, Павел, Pavel Piskaryov, Александр Герваш, Alexandr Gervash, Андрей Огурский, Andrey Ogursky, Игорь Мазуль, and Igor Mazul. "Preparation to program carrying out of technology qualification of beryllium encasement vacuum induction soldering for components of ITER reactor." Science intensive technologies in mechanical engineering 2018, no. 8 (July 14, 2018): 33–41. http://dx.doi.org/10.30987/article_5b5364029d3393.57902132.

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A process of rapid vacuum induction soldering of the beryllium encasement of inner-chamber components for a thermonuclear reactor is considered. The soldering technological peculiarities, methods of control and tests of soldered joints are analyzed. Basic reasons in the defect formation and corresponding solutions used to increase joint quality are considered.

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Gao, Guilian, Hong Sheng, Sangil Lee, Bong-Sub Lee, Scott McGrath, Liang Wang, Charles Woychik, et al. "Development of 2.5D and 3D IC Fabrication and Assembly Technologies." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (January 1, 2015): 000075–108. http://dx.doi.org/10.4071/2015dpc-ta11.

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2.5D/3D IC assembly is where the traditional foundry and assembly house model breaks down. The greatly reduced feature sizes of microbumps in combination with very large, thin interposers and ICs present many challenges for assembly. With densely integrated packages and stacked thin dies, warpage at various steps of assembly process can lead to die crack, weak or open interconnection, and delamination. Microbump die with copper pillar and solder cap lacks the flexibility of conventional BGA solder balls in warpage compensation. Low temperature dielectric materials for interposer backside passivation lack chemical, thermal stability and mechanical strength compared to similar materials cured at higher temperatures. Ultra- low stand-off between dies creates new challenge for flux residue removal and underfill processing, adhesion and reliability. In this paper, we present learning and results from building two Invensas 2.5D interposer test vehicles with rectangular (19mmx27mm) and square (24mmx24 mm) silicon interposers. Since the industry is still debating where the MEOL processes will take place, these two test vehicles use both assembly centric and fab centric flows. We conducted comprehensive material and process compatibility studies to meet our goal of process capability and product reliability. We explored three different interposer fabrication/ assembly flows that includes copper-to-copper bonding as well as solder capped copper pillar microbumps for microbump die to interposer connection. We optimized the interposer fabrication process to improve interposer quality and warpage. We instituted 100% bump inspection and tight control on microbump die quality and co-planarity to improve assembly yield. We developed robust soldering and cleaning processes to achieve high soldering process yield. We evaluated several methods of flux clean and developed a procedure to achieve optimal flux residue removal without causing mechanical damage to solder joints. We explored vacuum and pressure curing process for underfill and adopted advance underfill cure technology to eliminate voids in underfill. The impact of these factors on assembly yield and reliability will be presented.

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Straubinger, Daniel, István Bozsóki, David Bušek, Balázs Illés, and Attila Géczy. "Modelling of temperature distribution along PCB thickness in different substrates during reflow." Circuit World 46, no. 2 (December 21, 2019): 85–92. http://dx.doi.org/10.1108/cw-07-2019-0074.

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Purpose In this paper, analytical modelling of heat distribution along the thickness of different printed circuit board (PCB) substrates is presented according to the 1 D heat transient conduction problem. This paper aims to reveal differences between the substrates and the geometry configurations and elaborate on further application of explicit modelling. Design/methodology/approach Different substrates were considered: classic FR4 and polyimide, ceramics (BeO, Al2O3) and novel biodegradables (polylactic-acid [PLA] and cellulose acetate [CA]). The board thicknesses were given in 0.25 mm steps. Results are calculated for heat transfer coefficients of convection and vapour phase (condensation) soldering. Even heat transfer is assumed on both PCB sides. Findings It was found that temperature distributions along PCB thicknesses are mostly negligible from solder joint formation aspects, and most of the materials can be used in explicit reflow profile modelling. However PLA shows significant temperature differences, pointing to possible modelling imprecisions. It was also shown, that while the difference between midplane and surface temperatures mainly depend on thermal diffusivity, the time to reach solder alloy melting point on the surface depends on volumetric heat capacity. Originality/value Results validate the applicability of explicit heat transfer modelling of PCBs during reflow for different heat transfer methods. The results can be incorporated into more complex simulations and profile predicting algorithms for industrial ovens controlled in the wake of Industry 4.0 directives for better temperature control and ultimately higher soldering quality.

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Arab, Mohammad Reza, and Mohammad Hossein Heidari. "Histological Study of the Toxic Effects of Solder Fumes on Spermatogenesis in Rats." Applied Mechanics and Materials 319 (May 2013): 115–20. http://dx.doi.org/10.4028/www.scientific.net/amm.319.115.

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Objective: Toxic fumes generated during the soldering process contain various contaminants released at sufficient rates to cause both short- and long-term health problems. Studies have shown that these fumes change the quality and quantity of semen fluid in exposed workers. The aim of the present study was to determine the potentially toxic effects of solder fumes on spermatogenesis in seminiferous tubules of rats as an experimental model, with conditioned media in an exposed chamber. Materials and Methods: A total number of 48 male Sprague Dawley adult rats were randomly divided into experimental (n=30) and control (n=18) groups. Based on exposure time, each group was further subdivided into two, four and six subgroups. Rats in the experimental groups were exposed to solder fumes in an exposure chamber for one hour/ day. The concentrations of fumes [formaldehyde, stanum (Sn) and lead (Pb)] were measured by a standard method via atomic absorption and spectrophotometry. According to a timetable, under deep anesthesia, the rats of both experimental and control subgroups were killed. After fixation of testes, specimens were weighed and routinely processed. Paraffin sections were stained by hematoxylin and eosin. Spermiogenesis index was calculated and data analyzed by Mann Whitney NPAR test. Results: Analysis of air samples in the exposure chamber showed the following fume concentrations: 0.193 mg/m3 for formaldehyde, 0.35 mg/m3 for Sn and 3 mg/m3 for Pb. Although there was no significant difference in testes weight between control and experimental subgroups, there was only a significant difference in spermiogenesis index between the six week experimental and control subgroups (p<0.02). Conclusion: The results of this study showed that solder fumes can change the spermiogenesis index in experimental groups in a time dependent manner.

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Wentlent, Luke A., James Wilcox, and Mohammed Genanu. "Applicability of Selective Laser Reflow for Thin Die Stacking." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000741–47. http://dx.doi.org/10.4071/2380-4505-2018.1.000741.

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Abstract A 3-D packaging approach such as die stacking is an attractive way to package greater functionality and performance into a smaller footprint, often at a reduced overall product cost. Achieving such 3-D integration can however place significant demands on the manufacturing process, often requiring substantial production expense to bond multiple die in a sequential manner. One alternative, potentially offering significant throughput, is the use of selective laser reflow to bond stacked die. This process produces a localized heating of the stacked die sufficient to produce soldered interconnects at the bonding interface but with very short exposure times that minimize the heating of other parts of the assembly and decrease the overall duration of the bonding process. The use of a commercial infrared (IR) laser reflow instrument for the sequential attachment of thin die into a 3-D stack was considered. The bonding technology under study consists of an infrared laser coupled with a custom optics system that allows the laser beam to be shaped into a range of rectangular shapes and sizes. This allows for a single device or target area to be selectively heated and reflowed while other regions in the near vicinity are not. The target reflow area is exposed to a shaped laser beam for a combination of laser powers and exposure times according to the desired thermal profile. The top most materials absorb the IR energy of the incident laser and conduct that thermal energy down to the solder joints and into rest of the assembly. The rates of heat transfer realized depend significantly upon the sample geometry and material composition. Since this produces a highly accelerated reflow, typically 2–8 seconds, the entire process is highly transient in nature. This paper reports on the investigation into the utility of a selective area laser reflow process to sequentially bond thin die into a multi-chip stack. Thin silicon die (~60μm thick) were bonded to a 150μm thick laminate substrate using a selected area laser reflow process. The die interconnects were formed through the soldering of SnAg capped copper pedestals under the local laser heat. First level die were placed onto copper pads on the laminate and then bonded using the laser process. Subsequent die (2nd level) were placed on and bonded to gold plated nickel pad sites on the top of the first level die. At each step of the process the quality of the solder interconnects was examined using optical and electron microscopy. A range of laser profiles were utilized with several different thermal parameters: peak temperatures ranging from 235–255°C, time above liquidus between 1–3 seconds, and a fixed cooling rate of 40°C/s. Control samples of stacked die were assembled using conventional manufacturing techniques to enable direct comparisons of the interconnects and die bonding characteristics.

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Dasgupta, Arnab, Elaina Zito, and Ning-Cheng Lee. "Voiding Control at Preform Soldering." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000630–37. http://dx.doi.org/10.4071/isom-2016-thp43.

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Abstract Assembly of components with large pads such as high brightness LEDs or high power dies often is soldered with preform, mainly due to a lower voiding and lower flux fume generated when compared with solder paste, and also because of its better thermal and electrical conductivity compared with Ag epoxy. This is particularly true when the joints are to be formed within a cavity. Although lower than solder paste, the voiding in the solder joint is still a concern for high reliability and high performance devices. In this study, voiding at high power die attach reflow soldering using preform was simulated with the use of Cu coupons to mimic both die and substrate. The voiding behavior was studied by varying solder alloy type, flux quantity coated on preform, oxidation extent of Cu coupon, reflow peak temperature, and weight applied on the top of simulated die. For SAC305, with increasing weight, the bondline thickness (BLT) maintained constant initially due to solder surface tension, then reduced rapidly at weight higher than 50 g. The voiding area % increased with decreasing BLT first, then levelled off at lower BLT, although the voiding volume decreased with decreasing BLT due to constrained lamellar solder flow. Voiding was the highest for SAC305, followed by 57Bi42Sn1Ag, with 63Sn37Pb being the lowest, and increased with increasing oxidation of Cu coupon. With increasing flux quantity, voiding increased for SAC305 and 63Sn37Pb, but decreased for 57Bi42Sn1Ag, mainly due to the different temperature range at reflow. Voiding increased with increasing reflow temperature up to 170°C due to increasing vaporization, decreased with further increase in reflow temperature up to 210°C due to increasing flux activity, and increased again at temperature beyond 210°C due to rapid flux outgassing.

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Dissertations / Theses on the topic "Solder and soldering Quality control"

1

Howard, Turner A. "Design of an advanced system for inspection of microelectronic devices and their solder connections using laser-induced virbration techniques." Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/16645.

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Schuh, Amy Jeanne. "Monitoring and control system for hot air solder leveling process." Master's thesis, This resource online, 1991. http://scholar.lib.vt.edu/theses/available/etd-01122010-020101/.

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Yang, Jin. "Quality inspection and reliability study of solder bumps in packaged electronic devices [electronic resource] : using laser ultrasound and finite element methods." Diss., Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26593.

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Consumer demands are driving the current trend in the microelectronics industry to make electronic products that are miniature, fast, compact, high-density, reliable and low-cost. The use of surface mount devices (SMDs) has helped to decrease the size of electronic packages through the use of solder bump interconnections between the devices and the substrates/printed wiring boards (PWBs). Solder bumps act as not only mechanical, but also electrical interconnections between the device and the substrate/PWB. Common manufacturing defects ¨C such as open, cracked, missing, and misaligned solder bumps ¨C are difficult to detect because solder bumps are hidden between the device and the substrate/PWB after assembly. The reliability of packaged electronic devices in storage and usage is a major concern in the microelectronics industry. Therefore, quality inspection of solder bumps has become a critical process in the microelectronics industry to help ensure product quality and reliability. In this thesis, a methodology for quality evaluation and reliability study of solder bumps in electronic packages has been developed using the non-destructive and non-contact laser ultrasound-interferometric technique, finite element and statistical methods in this research work. This methodology includes the following aspects: 1) inspection pattern ¨C specific inspection patterns are created according to inspection purpose and package formats, 2) laser pulse energy density calibration ¨C specific laser pulse power and excitation laser spot size are selected in terms of package formats, 3) processing and analysis methods, including integrated analytical, finite element and experimental modal analyses approach, advanced signal processing methods and statistical analysis method, 4) approach combining modal analysis and advanced signal processing to improve measurement sensitivity of laser ultrasound-interferometric inspection technique, and 5) calibration curve using energy based simulation method and laser ultrasound inspection technique to predict thermomechanical reliability of solder bumps in electronic packages. Because of the successful completion of the research objectives, the system has been used to evaluate a broad range of solder bump defects in a variety of packaged electronic devices. The development of this system will help tremendously to improve the quality and reliability of electronic packages.

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Leal, James Andrew 1963. "Automated radiographic inspection of through-hole electronic circuit board solder defects." Thesis, The University of Arizona, 1988. http://hdl.handle.net/10150/276672.

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A study has been carried out to investigate the use of "real-time" radiography as a method of automated inspection of through-hole electronic circuit board solder joints. By evaluating five major solder defects it has been found that film radiography employing high contrast film results in a definite distinction between a good solder joint and a defective solder joint. The same five defects were also found to be distinguishable from a good solder joint when evaluated by a real-time radiographic inspection unit using digital image processing. Although the type of defect being investigated was not discernible, the ability to distinguish a good solder joint from a defective solder joint is a major step in the implementation of automated solder joint inspection for military electronics.

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Šimon, Vojtěch. "Spolehlivost pájených spojů LED panelů." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2017. http://www.nusl.cz/ntk/nusl-319627.

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Thesis is focused on the effect of heating factor on quality of solder joints. In theoretical part is solved reflow soldering technology, problematice of solder paste choice or criteria of soldering profile setting. The practical part is dedicated to demonstrating the impact of heating factor on solder joint quality. There are used X-Ray analysis, microsections and electron microscopy. In the final part of this thesis are summarized knowledge from theoretical part and experimental obtained results to defend of next steps in diploma thesis.

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Otáhal, Alexandr. "Výzkum jakosti pájených spojů u pouzder BGA a QFN." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2012. http://www.nusl.cz/ntk/nusl-219493.

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This diplomas thesis deals with specific technologies and manufacture of BGA and QFN packages. Also summarizes the most used test methods for assessing the reliability for. Describes the making of equipment for soldering in a nitrogen atmosphere, followed by comparison solder joints of BGA and QFN forming in different atmosphere. Finally, summarizes knowledge about the process of soldering and desoldering lead-free solders for BGA packages, followed by experimental evaluation of the causes of malfunction of repaired samples.

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Smeliková, Lenka. "Kontrola kvality pájeného spoje a Design of Experiments u strojního pájení vlnou." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2014. http://www.nusl.cz/ntk/nusl-220991.

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This master´s thesis deals with problems of wave soldering and application methods Design of Experiments for the new product production. Summarizes the basic knowledge of soldering technology, of solder alloys and Design of Experiments methods. Design of Experiments method has been applied to product to find the optimal for wave soldering setting.

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Šelepa, Jan. "Transformátorová páječka 500W." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2010. http://www.nusl.cz/ntk/nusl-218799.

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This thesis contains a complete description of the design and implementation of a 500W transformer soldering station. This soldering station includes a half-bridge DC/DC converter with a pulse transformer. The device works with a very low voltage and extremely high output current. Therefore some parts have a special design to ensure the proper equipment function. Coaxial transformer with very low leakage inductance (nH units) is unusual. A synchronous rectifier is another special feature working with low voltage and high output current of the transformer. The finished functional prototype consists of a soldering station and a soldering adapter.

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Chen, Wei-Ming, and 陳偉銘. "Study on Soldering Reaction between Sn-Cu Solder and Ni UBMs: Prevention of Spalling, Control of Texture, and Modification of Growth of Intermetallics." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/96880915653743313386.

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博士
國立臺灣大學
材料科學與工程學研究所
101
In the field of modern electronic packaging, the three-dimensional integrated circuit (3D IC) packaging has become essential for the microelectronics industry. Under the continuing development of 3D IC packaging, solder micro bumping is regarded as the most accepted solution for executing the chip-to-chip bonding technology. Nevertheless, in solder micro bumping, the volume ratio of intermetallic compound(s) to solder could be very high. In fact, in many scenarios, solder is completely consumed and the joints are entirely made up of intermetallics immediately after assembly. Under such a condition, the mechanical properties of a solder joint will be no longer dominated by the properties of solder, but by those of the intermetallics. This dissertation therefore investigates the very common scenario between Sn-Cu solder and Ni substrate from three objectives regarding intermetallics: (1) to avoid the spalling of interfacial intermetallics, (2) to control the growth morphology of intermetallics, and (3) to modify solder composition and formation of intermetallics. Three corresponding issues are specifically proposed, among them are (1) uncovering the driving force for massive spalling phenomenon in Sn-Cu/Ni system, (2) studying the orientation relationship between intermetallics and substrate in Sn-Cu/Ni soldering reaction, and (3) investigating the effects of minor Ti addition on selected soldering systems and intermetallics. The results unequivocally show that (1) the massive spalling phenomenon of interfacial (Cu,Ni)6Sn5 was mainly driven by a shifting of the equilibrium phase in thermodynamics, (2) a pronounced preferred orientation relationship between (Cu,Ni)6Sn5 and Ni was identified, and it could be used to predict the growth texture of (Cu,Ni)6Sn5 in the future, and (3) Ti addition could effectively reduce the undercooling as well as have the microstructure of Sn stabilized against extreme aging conditions; Ti addition was found to influence the formations of different intermetallics as well. In addition to experimental evidence and data analysis, this dissertation also strives for quantitatively proposing theoretical regulations for reference.

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Chang, Shan-Hsuan, and 張善軒. "The Application of Lean Six Sigma to Construct Process Quality Control Plan－ Case Study in PCB Solder Mask Process." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/47940839993181981028.

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碩士
中原大學
工業與系統工程研究所
101
This study aims to probe the characteristics of solder mask in printed circuit board manufacturing, and also by using the lean six sigma (DMAIC) structure approach to develop the processes (Define, Measure, Analyze, Improve, and Control) to perform solder mask quality control plan. The developed process will be provided to enable the field operator as procedure in order encountered quality issue can be recovered and resulted swiftly, and by it to reduce problem solving time and improve the production efficiency. This quality control plan can be built by departments based on their main flow, and by those accumulated experience in resulting issues to form the preventive actions and finalize those actions to be the field operation standard procedure to improve the company capability in sealing quality issues. In this study, suggestion related to eliminate eight wastes in printed circuit board manufacturing will be also provided as reference based on the lean manufacturing approach.

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Books on the topic "Solder and soldering Quality control"

1

Ibrahim, Guven, and Kilic Bahattin, eds. Fatigue life prediction of solder joints in electronic packages with ANSYS. Boston, Mass: Kluwer Academic Publishers, 2002.

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Savage, Robert M. Automated inspection of soldered joints for surface mount technology. [Washington, D.C.]: National Aeronautics and Space Administration, Scientific and Technical Information Branch, 1993.

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Grossmann, Günter, and Christian Zardini. The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects. London: Springer Verlag, 2011.

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Quality hand soldering and circuit board repair. 5th ed. Clifton Park, NY: Delmar Learning, 2007.

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Quality hand soldering and circuit board repair. Albany, N.Y: Delmar Publishers, 1994.

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Quality hand soldering and circuit board repair. 4th ed. Clifton Park, NY: Thomson Delmar Learning, 2004.

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Quality hand soldering and circuit board repair. 2nd ed. Albany, NY: Delmar, 1997.

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Quality hand soldering and circuit board repair. 6th ed. Clifton Park, NY: Delmar, 2013.

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Ross, Ronald G. Magellan/Galileo solder joint failure analysis and recommendations. Pasadena, Calif: National Aeronautics and Space Administration, Jet Propulsion Laboratory, California Institute of Technology, 1989.

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10

Manko, Howard H. Soldering handbook for printed circuits and surface mounting: Design, materials, processes, equipment, trouble-shooting, quality, economy, and line management. New York: Van Nostrand Reinhold, 1986.

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Book chapters on the topic "Solder and soldering Quality control"

1

Lin, K. M., and R. N. Kackar. "Optimizing the Wave Soldering Process." In Quality Control, Robust Design, and the Taguchi Method, 143–57. Boston, MA: Springer US, 1989. http://dx.doi.org/10.1007/978-1-4684-1472-1_7.

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Vandevelde, Bart. "Excessive Warpage of Large Packages During Reflow Soldering." In The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects, 283–96. London: Springer London, 2011. http://dx.doi.org/10.1007/978-0-85729-236-0_13.

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"Evaluation and Quality Control of Soldered Joints." In Welding, Brazing and Soldering, 1124–28. ASM International, 1993. http://dx.doi.org/10.31399/asm.hb.v06.a0001479.

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Strauss, Rudolf. "Quality control and inspection." In SMT Soldering Handbook, 325–41. Elsevier, 1998. http://dx.doi.org/10.1016/b978-075063589-9/50011-4.

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"Evaluation and Quality Control of Brazed Joints." In Welding, Brazing and Soldering, 1117–23. ASM International, 1993. http://dx.doi.org/10.31399/asm.hb.v06.a0001478.

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Conference papers on the topic "Solder and soldering Quality control"

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Flores, Miguel Angel Neri, Alberto Martinez Villafañe, and Caleb Carreño. "Failure Analysis of Automotive Ultrasonic Parking Sensors." In ISTFA 2016. ASM International, 2016. http://dx.doi.org/10.31399/asm.cp.istfa2016p0237.

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Abstract Automotive ultrasonic parking sensors were analyzed using X- ray computed tomography (XCT or microtomography), in order to determine if there were internal failures generated on the soldering process between copper wires and piezoelectric ceramic on these sensors. This paper reports the use of X-ray radiography and computer image processing for the study of internal defects. By using X-ray tomography technique, pores, cracks, holes, solder balling, insufficient solder, lead related defects, device related defects, and solder bridging may be identified (1-2). When coupled with a real time radiographic detector and image processor, X-ray technology allows instantaneous radiographic imaging and semi-automatic or totally automatic inspection. Analysis was conducted on six produced test samples showing that the application of XCT as a method of quality control of specimens produced by electronic packaging offers a wide range of possibilities to detect defects within materials. There were determined that five sensors contain internal defects on the soldered joints, between the copper wire, and the piezo electric ceramic covered with silver paint, as shown on the computed tomography. Accuracy of XCT method strongly depends on the size of the samples analyzed, but the possibility of obtaining information in 3D nondestructively shows considerable advantages of XCT method over traditional metallographic cross-sectional analysis.

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Svasta, Paul, Ioan Plotog, Traian Cucu, Alexandru Vasile, and Alexandru Marin. "4 P soldering model for solder joints quality assessment." In 2009 32nd International Spring Seminar on Electronics Technology (ISSE). IEEE, 2009. http://dx.doi.org/10.1109/isse.2009.5206936.

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Alaeddine, Marios, Jin Zou, Rajesh Ranganathan, Charalabos C. Doumanidis, Teiichi Ando, and Peter Y. Wong. "Thermal and Mass Modeling of the Laser-Point Sealing Process in MEMS Packaging." In ASME 2004 Heat Transfer/Fluids Engineering Summer Conference. ASMEDC, 2004. http://dx.doi.org/10.1115/ht-fed2004-56116.

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This article addresses the reactive thermal processing of locally heated intermetallic seals for micro-electro-mechanical systems (MEMS) packaging. Traditional post-packaging of MEMS involves high temperature brazing or soldering which results in degrading the quality of the thermally sensitive device. Focused laser heating of multilayer metals, therefore, serves as an attractive alternative due to a decrease in heat affected/degraded area. In this work a model is presented to decipher the dynamics of the thermal reaction and to serve as a tool for optimization and control of the multilayer sealing process. The analytical model is based on three-dimensional space- and time-dependent temperature and concentration Green’s fields and is solved numerically. The laser heat distribution is represented as a spatially varying Gaussian heat source to simulate the temperature and concentration evolution that occurs during the thermal process. The rapid heating induced by the laser source results in melting the sealing layer of lowest melting temperature, and then dissolves the layer in contact with the molten region to facilitate the nucleation and growth of an intermetallic compound. The simulation results show the model can successfully predict the temperature of the layers as well as the amount of barrier layer dissolution, which consequently determines the extent of the intermetallic compound growth in the bonding/sealing process.

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Oncea, Gabriel, Gavril Toderean, and Ovidiu Buza. "Temperature control system for infrared soldering." In 2012 IEEE International Conference on Automation, Quality and Testing, Robotics (AQTR 2012). IEEE, 2012. http://dx.doi.org/10.1109/aqtr.2012.6237774.

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HLADIK, LORI. "Wave solder statistical process control (SPC) implementation and experimental design." In 1st National Total Quality Management Symposium. Reston, Virigina: American Institute of Aeronautics and Astronautics, 1989. http://dx.doi.org/10.2514/6.1989-3701.

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Arcipreste, Bruno, Delfim Soares, Luis Ribas, and José Carlos Teixeira. "Numerical Modeling of Wave Soldering in PCB." In ASME 2014 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/imece2014-39051.

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Manufacturing of electronic boards (commonly referred as PCB) is a highly automated process that requires an accurate control of the various processing variables. Amongst the soldering processes, wave soldering is one of the most often used. In this, the various electronic components are provisionally inserted onto the PCB, and a low velocity jet of melted solder is directed to the moving board. Due to capillarity effects the solder adheres to the component/board interface and the process is completed. This methodology is most often used for small components. The adjusting of the operating parameters (solder nozzle orientation and velocity) is often carried out on a trial and error basis resulting in a time consuming process that is at odds with the increasing demand for smaller production series that the electronics industry is faced with. In addition the number of defects (mostly from missing components that are washed away by the impacting jet) is more likely to occur when thinner substrates are used in the PCB manufacturing. The present paper describes the application of a Computational Fluid Dynamics model to describe the interaction of the solder jet with the PCB and the integrated circuits. The model includes the conservation equations for mass, momentum and energy in a transient time frame. The jet and surrounding ambient atmosphere are modeled as two separate fluids and the interface is tracked by a VOF model. By adjusting the computational mesh refinement the interface is captured with accuracy. The drag forces occurring in the various components are computed from the pressure data field. The model allows the optimization of the wave operating parameters as a function of the component type of and its layout in the PCB.

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Bunis, Carl B. "Characterization of Gold Embrittlement in Solder Joints." In ISTFA 1999. ASM International, 1999. http://dx.doi.org/10.31399/asm.cp.istfa1999p0305.

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Abstract Mechanical strength, integrity, and reliability of solder connections used in the microelectronics industry are important factors in overall quality and reliability of the finished product. In most cases tin (Sn) rich solders are attached to a base metal plated with nickel (Ni) and then with gold (Au). Formation of AuSn4 intermetallics in the solder may result in loss of more than 80% of the initial impact toughness, resulting in loss of reliability of the connection. Gold (Au) embrittlement is a major concern in tin/lead (Sn/Pb) soldering or any other joining process with Au and Sn as major constituents. Noncompliance to Au plating-thickness specifications by vendors or insufficient Sn wicking of Au surfaces can result in embrittled joints and unreliable parts.

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Zhang, Kai, Tao Huang, Ziting Su, and Tianyuan Guan. "Design of Solder Quality Inspection System Based on Machine Vision." In 2021 IEEE 5th Advanced Information Technology, Electronic and Automation Control Conference (IAEAC). IEEE, 2021. http://dx.doi.org/10.1109/iaeac50856.2021.9390646.

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Ryan, Claire, Jeff M. Punch, Bryan Rodgers, Greg Heaslip, Shane O’Neill, and Eamonn Murphy. "An Investigation of the Lead-Free Surface Mount Soldering Process: Solder Joint Evaluation and Process Optimisation." In ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-60491.

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A European Union ban on lead in most electrical and electronic equipment will be imposed as of July 1st 2006. The ban, along with market pressures, means that manufacturers must transfer from a tin-lead soldering process to a lead-free process. In this paper the implications on the surface mount (SMT) soldering process are presented. A set of experiments was conducted to investigate the screen-printing and reflow steps of the SMT process using a tin-silver-copper (95.5Sn3.8Ag0.7Cu) solder and a baseline of standard tin-lead (63Sn37Pb). 10×10 arrays of micro Ball Grid Array (micro-BGA) components mounted on 8-layer FR4 printed wiring boards (PWBs) were used. The screen-printing experiment addressed the deposition of the solder paste on the board. The parameters used in the investigation were print speed, squeegee pressure, snap-off distance, separation speed and cleaning interval, with the responses being measurements of paste height and volume. Optimum screen-printer settings were determined which give adequate paste volume and height and a good print definition. The reflow experiment investigated the following parameters of the temperature profile: preheat, soak, peak and cool down temperatures, and conveyor speed. The resulting solder joints were evaluated using cross-section analysis and x-ray techniques in order to determine the presence of defects. A mechanical fatigue test was also carried out in order to compare the strength of the solder joints. The overall quality of the lead-free solder joints was determined from these tests and compared to that of tin-lead. The outcome is a set of manufacturing guidelines for transferring to lead-free solder including optimum screen-printer and reflow oven settings for use with an SnAgCu solder.

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Goto, Keisuke, Kunihito Kato, Shunsuke Nakatsuka, Takaho Saito, and Hiroaki Aizawa. "Anomaly detection of solder joint on print circuit board by using Adversarial Autoencoder." In Fifteenth International Conference on Quality Control by Artificial Vision, edited by Christophe Cudel, Stéphane Bazeille, and Nicolas Verrier. SPIE, 2019. http://dx.doi.org/10.1117/12.2521762.

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