Relevant bibliographies by topics / Solder Bond Failure

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Solder Bond Failure'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 February 2022

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Journal articles on the topic "Solder Bond Failure"

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Satyanarayan and K. N. Prabhu. "Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses." Materials Science Forum 830-831 (September 2015): 265–69. http://dx.doi.org/10.4028/www.scientific.net/msf.830-831.265.

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In the present work, the bond strength of Sn-0.7Cu, Sn-0.3Ag-0.7Cu, Sn-2.5Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solders solidified on Cu substrates was experimentally determined. The bond shear test was used to assess the integrity of Sn–Cu and Sn–Ag–Cu lead-free solder alloy drops solidified on smooth and rough Cu substrate surfaces. The increase in the surface roughness of Cu substrates improved the wettability of solders. The wettability was not affected by the Ag content of solders. Solder bonds on smooth surfaces yielded higher shear strength compared to rough surfaces. Fractured surfaces r
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Lee, R. T. P., A. S. Zuruzi, and S. K. Lahiri. "Maskless Process for Fabrication of Ultra-Fine Pitch Solder Bumps for Flip Chip Interconnects." Journal of Electronic Packaging 125, no. 4 (2003): 597–601. http://dx.doi.org/10.1115/1.1604806.

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The results of this study demonstrate the viability of a low cost maskless process for the fabrication of ultra-fine pitch solder bumps. The fabricated solder bump arrays have a pitch and diameter of 120 and 70 μm, respectively. Widely used eutectic 63Sn37Pb and lead-free 95.5Sn3.8Ag0.7Cu solders were used to form the bumps. No solder bridging was observed between adjacent bumps, and the solder bumps exhibited good dimensional uniformity. The solder bump to aluminum (Al) pad bond integrity was found to be excellent, as evidenced by the high stress to failure. The failure mode is predominately
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Meekisho, L. L., and K. Nelson-Owusu. "Interfacial Bond Stress Relationship for Gullwing Solder Joints." Journal of Electronic Packaging 126, no. 1 (2004): 57–59. http://dx.doi.org/10.1115/1.1646428.

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Lead frame bond connections are susceptible to bond shear and peeling stress failure due to high thermomechanical loads resulting from the combined effects of thermal and vibration effects. Solder joint integrity has also been found to be highly dependent on the solder joint configuration, which, in turn, is determined by bond pad size, the alloy material, and the lead frame geometric details. This study considers the complete joint configuration in formulating the expression for bond stress. A new bond stress equation is proposed to predict the solder joint peeling stress at the interface bet
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Shen, Y. L. "Numerical Study of Solder Bond Failure in Photovoltaic Modules." Procedia Engineering 139 (2016): 93–100. http://dx.doi.org/10.1016/j.proeng.2015.08.1113.

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Wang, Chenyuan, Yigang He, Chuankun Wang, Lie Li, and Xiaoxin Wu. "Multi-Chip IGBT Module Failure Monitoring Based on Module Transconductance with Temperature Calibration." Electronics 9, no. 10 (2020): 1559. http://dx.doi.org/10.3390/electronics9101559.

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The Insulated Gate Bipolar Transistor (IGBT) is the component with the highest failure rate in power converters, and its reliability is a critical issue in power electronics. IGBT module failure is largely caused by solder layer fatigue or bond wires fall-off. This paper proposes a multi-chip IGBT module failure monitoring method based on the module transconductance, which can accurately monitor IGBT module chip failures and bond wire failures. The paper first introduces the failure mechanism and module structure of the multi-chip IGBT module; then, it proposes a reliability model based on the
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Nah, Jae-Woong, Fei Ren, Kyung-Wook Paik, and K. N. Tu. "Effect of electromigration on mechanical shear behavior of flip chip solder joints." Journal of Materials Research 21, no. 3 (2006): 698–702. http://dx.doi.org/10.1557/jmr.2006.0086.

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Effect of electromigration on mechanical shear behavior of flip chip solder joints consisting of 97Pb3Sn and 37Pb63Sn composite solder joints was studied. The under bump metallurgy (UBM) on the chip side was TiW/Cu/electroplated Cu, and the bond pad on the board side was electroless Ni/Au. It was found that the mode of shear failure has changed after electromigration and the mode depends on the direction of electron flow during electromigration. The shear induced fracture occurs in the bulkof 97Pb3Sn solder without current stressing, however, after 10 h current stressing at 2.55 × 104 A/cm2 at
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Tikale, Sanjay, Mrunali Sona, and K. N. Prabhu. "Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate." Materials Science Forum 830-831 (September 2015): 215–18. http://dx.doi.org/10.4028/www.scientific.net/msf.830-831.215.

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Lead-free solders are environment friendly and are in great demand for microelectronic applications. In the present study, Sn-9Zn lead free solder alloy was solidified on Cu substrate for different reflow times from 10 to 1000s. The influence of reflow time on wetting, formation of intermetallic compounds (IMCs) and bond shear strength was studied using dynamic contact angle analyzer, bond tester and scanning electron microscopy. The results indicate that, the wettability of the solder alloy increased with increase in reflow time. Microstructure study revealed the presence of Cu5Zn8 and CuZn5
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Sharif, Ahmed, Y. C. Chan, and H. W. Zhong. "Effect of multiple reflows on mechanical strength of the interface formed between Sn–Zn–Bi solder and Au/Ni/Cu bond pad." Journal of Materials Research 22, no. 1 (2007): 40–45. http://dx.doi.org/10.1557/jmr.2007.0029.

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In this work, the shear strengths and interfacial reactions of Sn–8Zn–3Bi and Sn–8Zn–1Bi (wt%) solders with Au/Ni/Cu ball grid array (BGA) pad metallization were systematically investigated after multiple reflows. The peak reflow temperature was fixed at 230 °C. After the shear test, fracture surfaces were investigated using a scanning electron microscope equipped with an energy dispersive x-ray spectrometer. Cross-sectional studies of the interfaces were also conducted to correlate with the fracture surfaces. Two failure modes, ball cut and pad lift, were assessed for the different solders an
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Ekpu, M., R. Bhatti, M. I. Okereke, and K. C. Otiaba. "Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications." International Symposium on Microelectronics 2013, no. 1 (2013): 000473–77. http://dx.doi.org/10.4071/isom-2013-wa23.

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The reliability of microelectronic devices during operation has been a major challenge in recent years. Microelectronics devices will fail if one or more components do not function properly. Thermal interface materials are more likely to fail because of the role they play in heat management. Lead free solders such as SAC305 solder (Sn96.5Ag3.0Cu0.5) have become the thermal materials of interest because of their high thermal conductivity and government legislations on the ban of lead. Ansys finite element software was used for the design and analysis of the microelectronic device studied. The b
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Wu, X., X. Dou, C. P. Yeh, and K. Waytt. "Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow." Journal of Electronic Packaging 120, no. 2 (1998): 141–44. http://dx.doi.org/10.1115/1.2792601.

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The failure of electrical devices associated with solder joints has become one of the most critical reliability issues for surface-mounted devices. Solder joint reliability performance has been found to be highly dependent on the solder joint configuration, which, in turn, is governed by bond pad size, alloy material, and leadframe structure, as well as solder reflow characteristics. To investigate tombstone effects causing solder joint failure during leadless component reflow process, this work has focused on (1) developing a numerical model for the simulations of the solder joint formation d
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Dissertations / Theses on the topic "Solder Bond Failure"

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(9525959), Reza Asadpour. "EXPLORING THE POTENTIAL OF LOW-COST PEROVSKITE CELLS AND IMPROVED MODULE RELIABILITY TO REDUCE LEVELIZED COST OF ELECTRICITY." Thesis, 2020.

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<div>The manufacturing cost of solar cells along with their efficiency and reliability define the levelized cost of electricity (LCOE). One needs to reduce LCOE to make solar cells cost competitive compared to other sources of electricity. After a sustained decrease since 2001 the manufacturing cost of the dominant photovoltaic technology based on c-Si solar cells has recently reached a plateau. Further reduction in LCOE is only possible by increasing the efficiency and/or reliability of c-Si cells. Among alternate technologies, organic photovoltaics (OPV) has reduced manufacturing cost, but t
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Books on the topic "Solder Bond Failure"

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Keohane, Georgia Levenson. Capital and the Common Good. Columbia University Press, 2017. http://dx.doi.org/10.7312/columbia/9780231178020.001.0001.

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Despite social and economic advances around the world, poverty and disease persist, exacerbated by the mounting challenges of climate change, natural disasters, political conflict, mass migration, and economic inequality. While governments commit to addressing these challenges, traditional public and philanthropic dollars are not enough. Here, innovative finance has shown a way forward: by borrowing techniques from the world of finance, we can raise capital for social investments today. Innovative finance has provided polio vaccines to children in the DRC, crop insurance to farmers in India, p
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Book chapters on the topic "Solder Bond Failure"

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Dufallo, Basil. "Wayward Sons and Wandering Bacchic Revels." In Disorienting Empire. Oxford University Press, 2021. http://dx.doi.org/10.1093/oso/9780197571781.003.0003.

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In the years between Plautus and the heyday of Terence (160s BCE), Rome made a series of momentous conquests, including victory over Antiochus III in Asia Minor. Beginning from this historical background, Chapter 2 considers the wandering, exilic journey of a soldier, Clinia, in Asia while in service to an unnamed “King,” and his Odysseus-like return to his waiting girlfriend, Antiphila. Clinia’s story forms a part of Terence’s Heautontimorumenos, a play put on at the Roman festival of Cybele in 163 BCE. Other plays of Terence as well as the fragments of Caecilius Statius and Ennius add depth and context to the discussion. The chapter argues that Clinia’s lovelorn wandering presents an amusing image of Greek military activities in the East, but simultaneously alludes to Roman expansion through its recollection of Seleucid aggression. Further, by portraying the residents of an Attic deme struggling with the negative effects of an alluring Dionysiac figure, the itinerant prostitute Bacchis, Terence presents Bacchus’s cult in a less favorable light than that of Cybele. Bacchis’s submissive lover, Clitipho, who expresses a close bond with Clinia, is in his own fashion becoming lost, morally as well as spatially, from the moment we first meet him. The behavior of the comic adulescentes Clinia and Clitipho, the chapter suggests, is usefully regarded as queerly deviant in Ahmed’s terms, because seeing their behavior in this way helps illuminate the connection between their failure to live up to Roman gender expectations and the disorienting effects of the East.
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Whittow, Mark. "Communication and Empire." In Political Communication in Chinese and European History, 800-1600. Amsterdam University Press, 2021. http://dx.doi.org/10.5117/9789463720038_ch07.

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The Roman world in the second century was remarkably homogeneous, and the ties that bound it together remarkably thick and apparently strong. But what happened when the western half went its own way, when imperial territories were limited to bits of Asia Minor and the Balkans, when the construction of new monumental buildings had slowed to a trickle or stopped entirely, when the epigraphic habit had died? How did political communication work in the Roman empire of the Middle Ages that we know as Byzantium? The answer requires conjuring up a picture of people on the move; of soldiers, priests, students, pilgrims, appellants, merchants, tax collectors, administrators, painters, and builders. And it requires thinking about the messages they received and passed on. Placing the Byzantine experience in comparative perspective to Song China, this chapter surveys the evidence of Byzantine political communication to investigate both the means of transmitting news and orders as well as the underlying networks of shared discourse and identity. It shows that the survival of the Byzantine state depended largely on its ability to create an imagined community as the nation-state of the Romans. The decline of Byzantium and the rise of Muslim identities in its former territories can thus be linked to a failure to maintain effective long-distance communication networks that projected a ‘Roman’ narrative across the entirety of the empire.
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Conference papers on the topic "Solder Bond Failure"

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Liu, Wenzhao, Dao Zhou, Michael Hartmann, Francesco Iannuzzo, and Frede Blaabjerg. "Separation of Bond-Wire and Solder Layer Failure Modes in IGBT Power Modules." In 2020 IEEE Energy Conversion Congress and Exposition (ECCE). IEEE, 2020. http://dx.doi.org/10.1109/ecce44975.2020.9235367.

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Lindsay, J., P. Trimby, J. Goulden, S. McCracken, and R. Andrews. "Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS." In ISTFA 2018. ASM International, 2018. http://dx.doi.org/10.31399/asm.cp.istfa2018p0037.

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Abstract The results presented here show how high-speed simultaneous EBSD and EDS can be used to characterize the essential microstructural parameters in SnPb solder joints with high resolution and precision. Analyses of both intact and failed solder joints have been carried out. Regions of strain localization that are not apparent from the Sn and Pb phase distribution are identified in the intact bond, providing key insights into the mechanism of potential bond failure. In addition, EBSD provides a wealth of quantitative detail such as the relationship between parent Sn grain orientations and
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Asadpour, Reza, Muhammed Tahir Patel, Steven Clark, and Muhammad A. Alam. "Worldwide Physics-Based Analysis of Solder Bond Failure in c-Si Modules for Lifetime Prediction." In 2021 IEEE 48th Photovoltaic Specialists Conference (PVSC). IEEE, 2021. http://dx.doi.org/10.1109/pvsc43889.2021.9518931.

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Varma, Ramesh, Jeffrey Bartolovitch, Victor Brzozowski, and Carl Sokolowski. "Scanning Acoustic Microscopy for Solder Joint Failure Analysis and Design Improvements." In ISTFA 2008. ASM International, 2008. http://dx.doi.org/10.31399/asm.cp.istfa2008p0099.

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Abstract This paper reports using Scanning Acoustic Microscopy for solder joint failure analysis and process and design improvements. There are reliability concerns associated with solder voids or non-wetting of the solder to the bond pads which is particularly important for higher electrical power or temperature applications. Defects in solder can also occur and grow during operation and thermal cycling. Sonoscan is an attractive non-destructive test to characterize solder joints and is often used to study the growth of defects during life test simulations. X-ray imaging cannot identify very
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Bunis, Carl B. "High Temperature Solder (Au/Sn) Failures from Nickel Plating Impurities." In ISTFA 2000. ASM International, 2000. http://dx.doi.org/10.31399/asm.cp.istfa2000p0373.

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Abstract High temperature gold/tin eutectic (80 Au/ 20 Sn) solder is used in manufacturing for multiple reasons. These motives may include the ability to post solder a part/device without reflow, high temperature field applications, and allow soldering to thick Au layers without the possibility of precipitating AuSn4 brittle intermetallics. In the following military case, Au/Sn eutectic was employed because of high temperature service and the guarantee of no occurrence of gold embrittlement when soldering to the thick Au outer plating. The Au was plated over an electroplated nickel (Ni) layer
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Rahangdale, Unique, Pavan Rajmane, Abel Misrak, and Dereje Agonafer. "Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74279.

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The reliability assessment of package assembly is important to predict the performance of any microelectronic devices. Formation of fatigue cracks at the interface between the solder joint and component is the common failure occur in widely used microelectronic devices. Lead-free solders and advanced silicon process nodes with ultra-low-k (ULK) dielectrics flip chip package are used and are facing significant reliability challenges. The ultra-low-k materials improve performance by reducing parasitic capacitance and crosstalk between adjacent metal lines. [2] With low modulus, lower fracture to
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Tuček, Marek, Martin Búran, Rostislav Váňa, Lukáš Hladík, and Jozef Vincenc Oboňa. "Laser Ablation for Throughput Increase in Large Volume Semiconductor Failure Analysis Tasks." In ISTFA 2020. ASM International, 2020. http://dx.doi.org/10.31399/asm.cp.istfa2020p0017.

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Abstract As the semiconductor industry demands higher throughput for failure analysis, there is a constant need to rapidly speed up the sample preparation workflows. Here we present extended capabilities of the standard Xe plasma Focused Ion Beam failure analysis workflows by implementing a standalone laser ablation tool. Time-to-sample advantages of such workflow is shown on four distinct applications: cross-sectioning of a large solder ball, cross-sectioning of a deeply buried wire bond, cross-sectioning of the device layer of an OLED display, and removing the MEMS silicon cap to access unde
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Herschbein, Steven B., Carmelo F. Scrudato, George K. Worth, and Edward S. Hermann. "Silicon and Package Preparation Options for Focused Ion Beam (FIB) Circuit Editing and General Packaging Failure Analysis." In ISTFA 2013. ASM International, 2013. http://dx.doi.org/10.31399/asm.cp.istfa2013p0123.

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Abstract The Focused Ion Beam (FIB) technique of internal modification for chip repair, layout verification, and internal signal probe access has become an integral part of the process for bringing advanced products to market. The pervasive switch from wire bond connections to single component flipchip solder bump mounting on high value products has greatly aided the task of FIB editing by placing the bare backside silicon of the die within easy reach. FIB chip circuit access begins with task-specific sample preparation. The package opening and silicon prep process is well defined and quite ro
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Tumne, Pushkraj, Vikram Venkatadri, Santosh Kudtarkar, et al. "Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52078.

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Today’s consumer market demands electronics that are smaller, faster and cheaper. To cater to these demands, novel materials, new designs, and new packaging technologies are introduced frequently. Wafer Level Chip Scale Package (WLCSP) is one of the emerging package technologies that have the key advantages of reduced cost and smaller footprint. The portable consumer electronics are frequently dropped; hence the emphasis of reliability is shifting towards study of effects of mechanical shock loading increasingly. Mechanical loading typically induces brittle fractures (also known as intermetall
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Fasoro, Abiodun A., Praveen Pandojirao-S., Dan O. Popa, Harry E. Stephanou, and Dereje A. Agonafer. "Die and Wafer-Level Hermetic Sealing for MEMS Applications." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33850.

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Two of the primary causes of MEMS failure are stiction of the moving microparts due to moisture from environment and particulate contamination due to the degradation of organic materials. The use of getters such as sputtered Ti and Ba to maintain a moisture free environment within the MEMS package has been proposed and is well documented. Though getters ensure a moisture free environment within the package, they do not ensure hermeticity over long periods of time. Hermetic packaging is sometimes desirable for MEMS and optical MEMS (especially those that require long shelf lives) in order to gu
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