Relevant bibliographies by topics / Solder paste

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Solder paste'

Author: Grafiati
Published: 4 June 2021
Last updated: 25 January 2023

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Journal articles on the topic "Solder paste"

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Asano, Yasuhiro. "Lead-Free Solder Paste and VOC-Free Solder Paste." Journal of SHM 13, no. 4 (1997): 17–21. http://dx.doi.org/10.5104/jiep1993.13.4_17.

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Hirman, Martin, and Frantisek Steiner. "Optimization of solder paste quantity considering the properties of solder joints." Soldering & Surface Mount Technology 29, no. 1 (2017): 15–22. http://dx.doi.org/10.1108/ssmt-10-2016-0025.

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Purpose The purpose of this paper is to find an optimum between the quantity of solder paste and the desired properties of the soldered joint. A reduction of solder paste quantity is recognized as an opportunity to save money. On the other hand, the quantity of solder paste significantly influences the final properties of the soldered joint. The purpose is also to design recommendations for manufacturers of electronic assemblies. Design/methodology/approach The processing of the paper was initiated by a literature review. The expert analysis was the next step. The result of analysis was a fish
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Hanss, Alexander, and Gordon Elger. "Residual free solder process for fluxless solder pastes." Soldering & Surface Mount Technology 30, no. 2 (2018): 118–28. http://dx.doi.org/10.1108/ssmt-10-2017-0030.

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Purpose For soldering, flux is essential because it enables the wetting of the molten solder. Fluxless soldering, i.e. residue-free soldering with the aid of gaseous activators, has been known for many years, but is only well established in the field of opto- and microwave electronics where the solder is applied as preform. In high-volume SMD applications where solder paste is printed, this technology is rarely used until now. The reducing effect of a gaseous activator like formic acid vapor on certain solder alloys is known in practice. However, the corresponding reactions which occur under s
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ASANO, Shozo. "Flux & Solder Paste." Circuit Technology 9, no. 4 (1994): 284–92. http://dx.doi.org/10.5104/jiep1986.9.284.

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Harada, Manabu. "Rheology of Solder Paste." Journal of SHM 9, no. 5 (1993): 2–8. http://dx.doi.org/10.5104/jiep1993.9.5_2.

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Mannan, S. H. "Solder paste reflow modeling." Soldering & Surface Mount Technology 14, no. 1 (2002): 18–23. http://dx.doi.org/10.1108/09540910210416431.

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Shearer, Catherine, and Ken Holcomb. "Transient Liquid Phase Sintering Pastes as Solder Alternatives in High Temperature Applications." International Symposium on Microelectronics 2015, no. 1 (2015): 000453–58. http://dx.doi.org/10.4071/isom-2015-wp44.

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High operating temperature electronics are a growing market in the electronics industry. Most of the components and substrates necessary to support the production of these harsh environment devices are now available, but the interconnect materials for component, module and board level assembly are lagging in development. Currently the high operating temperature markets are being served by lead-bearing solders and expensive alloys such as gold-tin or gold-germanium. Lead has been banned from the majority of electronics applications in many areas of the world, but so far has been exempted in the
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MARIA, A., K. SRIHARI, and C. R. EMERSON. "Solder advisor—knowledge-based solder paste selection system." International Journal of Computer Integrated Manufacturing 7, no. 4 (1994): 229–41. http://dx.doi.org/10.1080/09511929408944612.

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ASANO, Yasuhiro. "Environmentally-Acceptable Mounting Technology. Lead-Free Solder Paste and VOC-Free Solder Paste." Journal of Japan Institute of Electronics Packaging 1, no. 4 (1998): 271–74. http://dx.doi.org/10.5104/jiep.1.271.

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Dasgupta, Arnab, Fengying Zhou, Christine LaBarbera, Weiping Liu, Paul Bachorik, and Ning-Cheng Lee. "Reliability of PCB Solder Joints Assembled with SACm™ Solder Paste." International Symposium on Microelectronics 2014, no. 1 (2014): 000367–73. http://dx.doi.org/10.4071/isom-tp65.

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The solder alloy SACm™0510 has been reported to be a superior alloy when used as BGA balls, exhibiting not only an outstanding drop test performance when compared to SAC105, but also as having high thermal fatigue reliability when compared to high Ag SAC solders. In this study, SACm0510 solder was evaluated as a solder paste. The voiding behavior of SGA solder joints was comparable for SACm0510, SAC105, and SC305. When evaluating SGA assemblies on a customized drop test, SACm0510 outperformed SAC105 considerably, which in turn was much better than SAC305. The drop test performance was found to
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Dissertations / Theses on the topic "Solder paste"

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Hui, Tak-wai. "Solder paste inspection based on phase shift profilometry." Click to view the E-thesis via HKUTO, 2007. http://sunzi.lib.hku.hk/HKUTO/record/B39558411.

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Hui, Tak-wai, and 許德唯. "Solder paste inspection based on phase shift profilometry." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2007. http://hub.hku.hk/bib/B39558411.

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Landman, Erik. "Viscosity control of solder paste by ultrasound actuation." Thesis, KTH, Mekatronik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-245871.

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The thixotropic characteristics of solder paste are an obstacle in improving the consistency with which solder paste droplets can be deposited by jet printers. Controlling the viscosity of solder paste may be an important step in improving the deposition. This thesis investigates whether ultrasound can be used as an actuation method to control the viscosity. Rheological measurements were performed to determine the thixotropic flow behaviour of a batch of solder paste. Various thixotropic complex fluid models were evaluated with respect to their ability to describe and predict this flow behavio
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Reid, Pamela Patrice. "Variable Frequency Microwave Reflow of Lead-Free Solder Paste." Thesis, Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/5011.

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As the world moves towards eliminating lead from consumer products, the microelectronics industry has put effort into developing lead-free solder paste. The major drawback of lead-free solder is the problems caused by its high reflow temperature. Variable frequency microwave (VFM) processing has been shown to allow some materials to be processed at lower temperatures. Issues addressed in this study include using VFM to reduce the solder reflow temperature, comparing the heating rate of different size solder particles, and comparing the reliability of VFM reflowed solder versus conventionally
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Braunstein, Daniel J. (Daniel Judah). "Real time process monitoring of solder paste stencil printing." Thesis, Massachusetts Institute of Technology, 1994. http://hdl.handle.net/1721.1/35374.

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Svanberg, Carl. "Pump test analogy." Thesis, Uppsala universitet, Tillämpad materialvetenskap, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-257510.

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Mycronic is a company that manufactures a solder paste printer used to manufacturecircuit boards. Inside the printer solder paste is fed with the help of a screw pump.The solder paste, consisting of relatively soft metals has a tendency to stick to thescrew surface and form particles. These are then detached and passed on in thesystem and can clog the nozzle of the printer. This project investigated the possibilityof creating a model test where different parameters can be varied to evaluate itsinfluence on the amount of solder paste sticking to the surface of the screw. Testingthese parameters
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Bhave, Aniket. "A leaded and lead-free solder paste evaluation screening procedure." Diss., Online access via UMI:, 2005. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&res_dat=xri:pqdiss&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&rft_dat=xri:pqdiss:1425610.

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Mitchell, Charles Clayton. "PBGA reliability of lead free solder balls assembled with tin lead solder paste for harsh environment electronics." Auburn, Ala., 2006. http://repo.lib.auburn.edu/2006%20Summer/Theses/MITCHELL_CHARLES_16.pdf.

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Chu, Ming-hei. "Solder paste inspection and 3D shape estimation using directional LED lightings." Click to view the E-thesis via HKUTO, 2007. http://sunzi.lib.hku.hk/hkuto/record/B39634176.

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Chu, Ming-hei, and 朱銘熙. "Solder paste inspection and 3D shape estimation using directional LED lightings." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2007. http://hub.hku.hk/bib/B39634176.

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Books on the topic "Solder paste"

1

Hwang, Jennie S. Solder Paste in Electronics Packaging. Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-011-6050-6.

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Hwang, Jennie S. Solder Paste in Electronics Packaging. Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3528-7.

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Johnson, Colin C. Solder paste technology: Principles and applications. TAB Professional and Reference Books, 1989.

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Mahon, J. Three-dimensional inspection of solder paste on surfacemount printed circuit boards. Trinity College, Department of Computer Science, 1991.

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Ismail, Ismarani. Stencil printing of solder paste for reflow soldering of surface mount technology assembly. University of Salford, 1995.

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Solder paste in electronics packaging: Technology and applications in surface mount, hybrid circuits, and component assembly. Van Nostrand Reinhold, 1989.

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Hwang, Jennie S. Solder paste in electronics packaging: Technology and applications in surface mount, hybrid circuits and component assembly. Van Nostrand Reinhold, 1992.

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Shirley, Dwayne R. Evaluation of the effect of solder paste residues on RF signals between 5 and 10 GHz. National Library of Canada, 2003.

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Bimbi, Franco. Dalla parte giusta, ovvero, Vacanze a spese dello Stato. Lo scarabeo, 1999.

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Kurochkin, Anatoliy, and Vladimir Zimnyakov. Technological equipment for the production of bread, confectionery and pasta. INFRA-M Academic Publishing LLC., 2022. http://dx.doi.org/10.12737/1832088.

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The textbook discusses the classification, the principle of operation, the device, as well as the basic technical data of the equipment for the production of bread, confectionery and pasta. The main technological calculations necessary for the justification and selection of equipment of the corresponding production lines are presented. The structure and content of the textbook are designed to prepare graduates to solve problems of professional activity mainly of technological and project types.
 Meets the requirements of the federal state educational standards of higher education of the l
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Book chapters on the topic "Solder paste"

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Syed-Khaja, Aarief, and Joerg Franke. "Solder Paste Printing." In CIRP Encyclopedia of Production Engineering. Springer Berlin Heidelberg, 2018. http://dx.doi.org/10.1007/978-3-642-35950-7_16835-1.

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Syed-Khaja, Aarief, and Jörg Franke. "Solder Paste Printing." In CIRP Encyclopedia of Production Engineering. Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-53120-4_16835.

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Hwang, Jennie S. "Solder Paste Technology and Applications." In Solder Joint Reliability. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4615-3910-0_2.

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Hwang, Jennie S. "Rheology of Solder Pastes." In Solder Paste in Electronics Packaging. Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3528-7_5.

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Hwang, Jennie S. "Rheology of Solder Pastes." In Solder Paste in Electronics Packaging. Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-011-6050-6_5.

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Prasad, Ray P. "Solder Paste and Its Application." In Surface Mount Technology. Springer US, 1997. http://dx.doi.org/10.1007/978-1-4615-4084-7_9.

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Prasad, Ray P. "Solder Paste and Its Application." In Surface Mount Technology. Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-011-6532-7_9.

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Hwang, Jennie S. "Solder Joint Reliability and Inspection." In Solder Paste in Electronics Packaging. Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3528-7_9.

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Hwang, Jennie S. "Solder Joint Reliability and Inspection." In Solder Paste in Electronics Packaging. Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-011-6050-6_9.

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Hwang, Jennie S. "Fine Pitch Soldering and Solder Paste." In Handbook of Fine Pitch Surface Mount Technology. Springer US, 1994. http://dx.doi.org/10.1007/978-1-4684-1437-0_5.

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Conference papers on the topic "Solder paste"

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Bing, An, Wu Yi-ping, Wu Feng-Shun, Wang Lei, Zhu Yu-chun, and Zhang Jin-song. "Solder Paste Printability Tester." In 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, 2005. http://dx.doi.org/10.1109/hdp.2005.251404.

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Hanss, Alexander, Matthias Hutter, Joerg Trodler, and Gordon Elger. "Solder Process for Fluxless Solder Paste Applications." In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). IEEE, 2016. http://dx.doi.org/10.1109/ectc.2016.330.

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Barbosa, Flávia V., Pedro E. A. Ribeiro, Maria F. Cerqueira, et al. "Rheology Characterization of Solder Paste." In ASME 2017 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/imece2017-71413.

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Reflow soldering process is widely implemented in the electronics industry. This method allows the attachment of electronic components to a printed circuit board (PCB) through the melting of solder paste, which makes the interconnection between them. The reflow soldering process must ensures the correctly melting of the solder paste and heating of the adjoining surfaces, without the electronic components suffer overheating or any other type of damage. Solder paste is the most widespread material in the SMT (Surface Mount Technology) process using reflow soldering. An ideal solder paste will in
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Bing and Yi-ping. "Evaluating the printability of solder paste from paste roll characteristics." In High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5582759.

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An, Bing, Zhe Xu, Hua Chen, et al. "Solder Paste Printability Tester and Method." In 2006 7th International Conference on Electronic Packaging Technology. IEEE, 2006. http://dx.doi.org/10.1109/icept.2006.359750.

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Puechagut, Celine, Anne-Marie Laugt, Emmanuelle Guene, and Richard Anisko. "Solder paste corrosivity assesment: Bono test." In 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC). IEEE, 2015. http://dx.doi.org/10.1109/eptc.2015.7412347.

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Chen, Cherie, Laye Feng, Rita Mohanty, Runsheng Mao, Chuan Xia, and Desmond Teoh. "iNEMI Solder Paste Deposition Project report — Optimizing solder paste printing for large and small components." In 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2010. http://dx.doi.org/10.1109/impact.2010.5699674.

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Trombert, S., Jean Chazelas, P. Bonniau, W. Van Moorleghem, M. Chandrasekaran, and J. F. Silvain. "Solder-paste/shape memory alloy composite for adaptive solder joint." In 3rd International Conference on Intelligent Materials, edited by Pierre F. Gobin and Jacques Tatibouet. SPIE, 1996. http://dx.doi.org/10.1117/12.237163.

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Ribeiro, Pedro E., Delfim F. Soares, Maria F. Cerqueira, Senhorinha F. Teixeira, Daniel A. Barros, and José C. Teixeira. "Creep Behavior of a Solder Paste With Bi Addition." In ASME 2017 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/imece2017-71532.

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A common failure mode of electronic PCB’s is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of component-solder-PCB assembly. Although some experiments show that newer lead-free tin-silver-copper (Sn-Ag-Cu, or SAC) solders perform better than the older SnPb ones, with today’s solder joint thickness decreasing and increasing working temperatures, among others, the stresses and strains due to temperature changes are g
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Nurmi, Sami T., Janne J. Sundelin, Eero O. Ristolainen, and Toivo K. Lepisto¨. "The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35150.

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As environmental issues are raising more interest and are becoming crucial factors in all parts of the world, more and more environmental-friendly electronics products are emerging. Usually this means the introduction of products with lead-free solders. However, the reliability of lead-free solders is still a serious concern despite the vast research done in this field. This paper will describe the interconnect reliability of three kinds of solder joints respectively prepared with lead-free solder paste and lead-free PBGA components, lead-free solder paste and tin-lead-silver PBGA components,
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Reports on the topic "Solder paste"

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Anderson, Iver. Liquid-Phase Diffusion Bonding and the Development of a Cu-Ni/Sn Composite Solder Paste for High Temperature Lead-Free Electrical Connections. Office of Scientific and Technical Information (OSTI), 2018. http://dx.doi.org/10.2172/1468948.

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Choquette, Stephanie Michele. Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections. Office of Scientific and Technical Information (OSTI), 2018. http://dx.doi.org/10.2172/1593363.

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Duty, C., Jellison, D. G.E. P., and P. Joshi. Development of Novel Front Contract Pastes for Crystalline Silicon Solar Cells. Office of Scientific and Technical Information (OSTI), 2012. http://dx.doi.org/10.2172/1038040.

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Weiss, Werner, and Monika Spörk-Dür. Solar Heat Worldwide 2021. IEA Solar Heating and Cooling Programme, 2021. http://dx.doi.org/10.18777/ieashc-shw-2021-0001.

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The Solar Heat Worldwide report has been published annually since 2005 within the framework of the Solar Heating and Cooling Technology Collaboration Programme (SHC TCP) of the International Energy Agency (IEA). The first edition of the report included data from 35 countries. The database has been extended to 68 countries over the past 16 years. In addition to the increased number of countries, also the degree of detail of the data was significantly improved.
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Murphy, Pamela, ed. IEA SHC Annual Report 2019. IEA SHC, 2020. http://dx.doi.org/10.18777/ieashc-ar-2020-0001.

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In 2018, the IEA SHC Technology Collaboration Programme (TCP) members used the year to plan for the future, to reflect on past accomplishments, and to transition to a new Executive Committee Chair. All of which supported our underlying pursuit to be the leading and influencing international collaborative research program that produces high quality data and research on solar heating and cooling.
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Grubb, Michael. Navigating the crises in European energy: Price Inflation, Marginal Cost Pricing, and Principles for Electricity Market Redesign in an Era of Low-Carbon Transition. Institute for New Economic Thinking Working Paper Series, 2022. http://dx.doi.org/10.36687/inetwp191.

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The energy crisis engulfing Europe is a crisis of both gas and electricity markets, with huge cost impacts on consumers across all European countries. In Britain, half of typical household energy expenditure arises from electricity. This paper examines how the cost of gas-powered generation feeds through to electricity bills, on the principle of marginal cost pricing, setting the price for most of the time though it accounts for only about 40% of GB generation. Combined with the steep decline in wind and solar costs over the past decade, this has resulted in an unprecedented degree of ‘cost in
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P., BASTIAENSEN. Triage in the trenches, for the love of animals : a tribute to veterinarians in the First World War. O.I.E (World Organisation for Animal Health), 2018. http://dx.doi.org/10.20506/bull.2018.nf.2883.

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On the occasion of the centenary of the First World War, remembered across the world from 2014 until the end of 2018, many aspects and experiences of this global conflict have been re-examined or brought to light for the first time, as we honour the memory of those estimated 16 million soldiers and civilians who perished in what was then known as the ‘Great War’, or the ‘War to End All Wars’. So many of these died on the infamous fields of Flanders, where Allied and Central Forces dug themselves into trenches for the better part of four years. Over the past few years, new research has brought
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Ruosteenoja, Kimmo. Applicability of CMIP6 models for building climate projections for northern Europe. Finnish Meteorological Institute, 2021. http://dx.doi.org/10.35614/isbn.9789523361416.

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In this report, we have evaluated the performance of nearly 40 global climate models (GCMs) participating in Phase 6 of the Coupled Model Intercomparison Project (CMIP6). The focus is on the northern European area, but the ability to simulate southern European and global climate is discussed as well. Model evaluation was started with a technical control; completely unrealistic values in the GCM output files were identified by seeking the absolute minimum and maximum values. In this stage, one GCM was rejected totally, and furthermore individual output files from two other GCMs. In evaluating t
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Medina, Noelia, Martin Scarone, Wilson Sierra, et al. Hidrógeno verde: un paso natural para Uruguay hacia la descarbonización. Banco Interamericano de Desarrollo, 2021. http://dx.doi.org/10.18235/0003761.

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De acuerdo con el último informe del Grupo Intergubernamental de Expertos sobre el Cambio Climático publicado en 2021, se están produciendo cambios climáticos sin precedentes. El informe establece que para limitar el calentamiento global a cerca de 1,5C ó 2C será necesaria la reducción inmediata, rápida y a gran escala de las emisiones de gases de efecto invernadero. Se requerirá, por lo tanto, mayores compromisos por parte de los países. Varios países se han comprometido a alcanzar emisiones netas cero para el 2050. Particularmente, el sector energético es uno de los que producen más emisione
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Vargas-Herrera, Hernando, Pamela Andrea Cardozo-Ortiz, Daniel Esteban Osorio-Rodríguez, et al. Reporte de Estabilidad Financiera - II semestre 2020. Banco de la República de Colombia, 2020. http://dx.doi.org/10.32468/rept-estab-fin.sem2-2020.

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El sistema financiero colombiano no ha sufrido mayores traumatismos estructurales durante estos meses de profunda contracción económica, y ha continuado prestando con normalidad sus funciones básicas, facilitando la respuesta de la economía a condiciones extremas. Ello es el resultado de la solidez de las entidades financieras al inicio de la crisis, reflejada en elevados indicadores de liquidez y solvencia, y de la oportuna respuesta de distintas entidades. El Banco de la República redujo 250 puntos sus tasas de interés de política, hasta 1,75%, el menor nivel desde la creación del nuevo Banc
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