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Dissertations / Theses on the topic 'Solder paste'

Author: Grafiati

Published: 4 June 2021

Last updated: 25 January 2023

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1

Hui, Tak-wai. "Solder paste inspection based on phase shift profilometry." Click to view the E-thesis via HKUTO, 2007. http://sunzi.lib.hku.hk/HKUTO/record/B39558411.

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2

Hui, Tak-wai, and 許德唯. "Solder paste inspection based on phase shift profilometry." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2007. http://hub.hku.hk/bib/B39558411.

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3

Landman, Erik. "Viscosity control of solder paste by ultrasound actuation." Thesis, KTH, Mekatronik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-245871.

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The thixotropic characteristics of solder paste are an obstacle in improving the consistency with which solder paste droplets can be deposited by jet printers. Controlling the viscosity of solder paste may be an important step in improving the deposition. This thesis investigates whether ultrasound can be used as an actuation method to control the viscosity. Rheological measurements were performed to determine the thixotropic flow behaviour of a batch of solder paste. Various thixotropic complex fluid models were evaluated with respect to their ability to describe and predict this flow behavio

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4

Reid, Pamela Patrice. "Variable Frequency Microwave Reflow of Lead-Free Solder Paste." Thesis, Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/5011.

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As the world moves towards eliminating lead from consumer products, the microelectronics industry has put effort into developing lead-free solder paste. The major drawback of lead-free solder is the problems caused by its high reflow temperature. Variable frequency microwave (VFM) processing has been shown to allow some materials to be processed at lower temperatures. Issues addressed in this study include using VFM to reduce the solder reflow temperature, comparing the heating rate of different size solder particles, and comparing the reliability of VFM reflowed solder versus conventionally

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5

Braunstein, Daniel J. (Daniel Judah). "Real time process monitoring of solder paste stencil printing." Thesis, Massachusetts Institute of Technology, 1994. http://hdl.handle.net/1721.1/35374.

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6

Svanberg, Carl. "Pump test analogy." Thesis, Uppsala universitet, Tillämpad materialvetenskap, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-257510.

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Mycronic is a company that manufactures a solder paste printer used to manufacturecircuit boards. Inside the printer solder paste is fed with the help of a screw pump.The solder paste, consisting of relatively soft metals has a tendency to stick to thescrew surface and form particles. These are then detached and passed on in thesystem and can clog the nozzle of the printer. This project investigated the possibilityof creating a model test where different parameters can be varied to evaluate itsinfluence on the amount of solder paste sticking to the surface of the screw. Testingthese parameters

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7

Bhave, Aniket. "A leaded and lead-free solder paste evaluation screening procedure." Diss., Online access via UMI:, 2005. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&res_dat=xri:pqdiss&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&rft_dat=xri:pqdiss:1425610.

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8

Mitchell, Charles Clayton. "PBGA reliability of lead free solder balls assembled with tin lead solder paste for harsh environment electronics." Auburn, Ala., 2006. http://repo.lib.auburn.edu/2006%20Summer/Theses/MITCHELL_CHARLES_16.pdf.

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9

Chu, Ming-hei. "Solder paste inspection and 3D shape estimation using directional LED lightings." Click to view the E-thesis via HKUTO, 2007. http://sunzi.lib.hku.hk/hkuto/record/B39634176.

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10

Chu, Ming-hei, and 朱銘熙. "Solder paste inspection and 3D shape estimation using directional LED lightings." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2007. http://hub.hku.hk/bib/B39634176.

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11

Vinnars, Jacob, and Johan Vinnars. "Correlations Between Rheological Properties and Jetting Results in Solder Paste Jetting." Thesis, Uppsala universitet, Institutionen för teknikvetenskaper, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-324700.

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The purpose of this project has been to investigate potential correlations between rheological properties and jetting quality of solder paste. The project was carried out for Mycronic AB. Data from previously obtained measurements for both rheological properties and jetting quality were used in the analysis. We were only able to suggest preliminary correlations. One reason for this was that the jetting data was not designed for correlation work. It was performed to set parameters for new fluids. The data was inconsistent and difficult to work with in a correlation studie. However, the work led

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12

Rodriguez, German Dario. "Analysis of the solder paste release in fine pitch stencil printing processes." Thesis, Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/18867.

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13

Jomy, Vachaparambil Kurian. "An analytical and numerical study of droplet formation and break-off for jetting of dense suspensions." Thesis, KTH, Mekanik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-194501.

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The jet printing of solder paste from a uid dynamics perspective involves viscosity change due to varying shear rate and eventual break o of the ejected solder paste droplet from the uid in the printer head. The ability to model the jetting process in a simulation package is important as it can be used as a tool for future development of the jetting device. The jetting process is modelled as a two phase (air - solder paste) ow with interface tracking performed using phase eld method and temporal stepping based on a second-order Backward Di erence Formula with relaxed tolerences. This thesis in

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14

Ismail, Ismarani. "Stencil printing of solder paste for reflow soldering of surface mount technology assembly." Thesis, University of Salford, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.426875.

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15

Vujadinovic, Alexandar. "A method for evaluating the robustness of a high-speed solder paste printer." Thesis, KTH, Maskinkonstruktion (Inst.), 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-168843.

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Jetstråleskrivaren MY500 är en del av produktutbudet för PCB-tillverkning som utvecklats och tillverkas av Mycronic AB, tidigare känt som Micronic Mydata AB. Som för många liknande företag, finns det ett tydligt intresse i att minska utvecklingskostnader och göra det möjligt att ta nya produkter och uppgraderingar till marknaden snabbt. Hardware-in-the-loop-simulering är ett sätt att testa delar av ett system innan prototyper konstruerats, och det ger stora fördelar till ett utvecklingsprojekt eftersom olika idéer och systemparametrar kan undersökas till en mycket lägre kostnad jämfört med tes

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16

Hui, Ip Kee. "Analysis of surface mount technology solder joints." Thesis, Brunel University, 1996. http://bura.brunel.ac.uk/handle/2438/5380.

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The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex. The exploration of these factors, and how they may affect the reliability and quality of the joints can only be achieved through continuous research. In this project, essential areas of SMT joints were selected for study and analysis, with the intention of providing additional design and process guidelines for the production of quality SMT joints. In the infrared reflow process, one of the common defect phenomena is the occurrence of tombstoning; that is after soldering only one end o

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17

Dosedla, Milan. "Trendy v oblasti pájecích past a vliv nanočástic." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2016. http://www.nusl.cz/ntk/nusl-242070.

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This thesis deals with novel trends in solder paste technology. It focuses on nanoparticle applications used as a tool for improving a state of the art lead free solder alloys. The recently published results about the impact of different types of nanoparticles on properties of newly-emerged nanocomposite solders are discussed and summarized in the thesis. Preparation, practical application and testing of new solder paste based on low temperature SnBi alloy with an admixture of titanium dioxide are also discussed. Finally, properties of solder joints using these solder pastes are investigated a

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18

Dokoupil, Jakub. "Porovnání pájecích past z pohledu spolehlivosti pájeného spoje." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2018. http://www.nusl.cz/ntk/nusl-376992.

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This thesis deals with the teoretical description of the solder during reflow soldering the solder paste and describing the defects arising during this process. Practical part of the thesis describes the testing of two solder pastes with different silver content before and after the accelerated temperature cycle.

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19

Matras, Jan. "Aplikace reaktivních nanočástic do SAC pájecí pasty." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2018. http://www.nusl.cz/ntk/nusl-377074.

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This work is a research on the topic of reactive nanoparticles and their agitation into the solder paste, which it also describes. It describes in detail the properties of each solder alloys. It explains the creation of intermetallic layers in the soldering process and examines their structure. It also focuses on the evaluation and methodology of testing the properties of solder pastes. In the practical part, individual tests are performed with PF606 and PF610 solder paste.

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20

He, D. "Modelling and computer simulation of the behaviour of solder paste in stencil printing for surface mount assembly." Thesis, University of Salford, 1998. http://usir.salford.ac.uk/14676/.

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One of the main challenges facing the electronics manufacturing industry in solder paste printing for ultra-fine pitch surface mount and flip-chip assembly is the difficulty in achieving consistent paste deposit volumes from pad-to-pad. At the very small aperture geometries required for ultra-fine pitch and flip chip assembly, flow properties of the paste becomes one of the dominant factors in the printing process. It is widely accepted that over 60% of assembly defects originate from the solder paste printing stage, and hence the urgent need for a better understanding of solder paste rheology

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21

Wilson, Antony R. "Modelling and simulation of paradigms for printed circuit board assembly to support the UK's competency in high reliability electronics." Thesis, Loughborough University, 2012. https://dspace.lboro.ac.uk/2134/10236.

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The fundamental requirement of the research reported within this thesis is the provision of physical models to enable model based simulation of mainstream printed circuit assembly (PCA) process discrete events for use within to-be-developed (or under development) software tools which codify cause & effects knowledge for use in product and process design optimisation. To support a national competitive advantage in high reliability electronics UK based producers of aircraft electronic subsystems require advanced simulation tools which offer model based guidance. In turn, maximization of manufact

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22

Rychlý, Ivo. "SnBi pájecí pasta a vliv reaktivních nanočástic." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2018. http://www.nusl.cz/ntk/nusl-377337.

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This work deals with effects of nanoparticles, mainly copper and silver, on properities of lead-free solder pastes. It describes basic tests done on solder pastes according to IPC-TM-650 standards. In practical section this work focuses on the preparation of Sn-Bi solder paste and the measuring of viscosity. After that different concentrations of silver copper alloy nanoparticles are added to the SnBi solder paste. These solder pastes are tested by the IPC standarts and mechanical and resistive tests are done on printed circuit boards where the effects of mixed in nanoparticles are observed.

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23

Mendes, Luiz Tadeu Freire. "Estudo experimental da migração eletroquímica em soldagem eletrônica Sn/Ag/Cu \"Lead Free\"." Universidade de São Paulo, 2009. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-09092009-100846/.

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Sabemos que em placas de circuito impresso montadas com tecnologia SMD Surface Mount Device podem ocorrer problemas com a migração eletroquímica. O fenômeno aparece principalmente porque os novos encapsulamentos possuem terminais com espaçamentos muito próximos. A migração eletroquímica pode tornar-se um potencial problema no processo de soldagem eletrônica quando é utilizado a tecnologia Lead Free na montagem das placas. O processo de migração eletroquímica ocorre quando temos metal, isolante e metal, em ambiente de alta umidade e sobre polarização elétrica, o metal deixa a posição inicial em

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24

Jemai, Norchene. "Développement de la technique de sérigraphie pour la formation de billes de connexions inférieures a 100µm pour l'assemblage 3D : optimisation et étude de fiabilité." Thesis, Toulouse, INSA, 2010. http://www.theses.fr/2010ISAT0010/document.

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L’assemblage et le conditionnement en électronique représentent un enjeu de création de nouveaux systèmes électroniques hybrides rassemblant sur un même substrat des éléments électroniques, optiques, mécaniques… La technologie Flip-chip , introduite par IBM et baptisée C4 (Control Collapse Chip Connection), garantit une plus grande densité d’intégration tout en gardant les mêmes dimensions de puce. Au coeur de cette technologie, le « Bumping » est un procédé qui consiste en l’introduction d’une microbille conductrice entre deux plots de connexion des puces afin de réaliser une liaison électriq

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25

Šimon, Vojtěch. "Spolehlivost pájených spojů LED panelů." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2017. http://www.nusl.cz/ntk/nusl-319627.

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Thesis is focused on the effect of heating factor on quality of solder joints. In theoretical part is solved reflow soldering technology, problematice of solder paste choice or criteria of soldering profile setting. The practical part is dedicated to demonstrating the impact of heating factor on solder joint quality. There are used X-Ray analysis, microsections and electron microscopy. In the final part of this thesis are summarized knowledge from theoretical part and experimental obtained results to defend of next steps in diploma thesis.

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26

Toufar, Michal. "Analýza metod nanášení tavidel a pájecích past na DPS pro BGA komponenty." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2016. http://www.nusl.cz/ntk/nusl-241971.

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This thesis deals with rework of BGA components. There are described defects and errors in a solder joints. The current trend is focused on thin packages with fine pitch. It is assembled with smaller and smaller solder balls. It is described effect of different application of flux and solders paste for rework. The main part is focused on dipping and dispensing. These methods are suitable for repair process.

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27

Šimeček, Ondřej. "Problematika šablonového tisku pájecí pasty pro součástky s malou roztečí vývodů." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2011. http://www.nusl.cz/ntk/nusl-218992.

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Despote the indisputable advantages of fine-pitch components, is need to calculate with a few trouble during production, especially increased requirements for accuracy of mounting and solder printing. In this work I’m concerned with problems of solder printing for these components and evaluation using SPC. For the evaluation I used 3D paste inspection based on laser scanning of the surface. The output of this work is to describe the principles of solder printing and elaborating of GR&R, SPC analysis and histograms of solder printing for some outputs. I focused in my master thesis on motive des

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28

Seman, Anton. "On-line non-destructive ultrasonic rheology measurement of solder pastes." Thesis, University of Greenwich, 2010. http://gala.gre.ac.uk/5649/.

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In surface mount technology (SMT) electronics assembly, the solder paste is printed onto the PCB's surface through a stencil and the components are later placed over the solder paste deposits. Since 2007, the use of extremely small SMT components for assembly of SMT devices has been widespread, and achieving consistent print deposits for fine pitch (the distance between the leads of the components) components has become a real challenge. The majority of the defects at the printing stage, such as skipping and bridging, were found to be related to the quality of the solder paste. These defects a

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29

Yin, Liang. "Reactive wetting and spreading in binary metallic systems." Diss., Online access via UMI:, 2005.

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30

Currie, Mark Andrew. "Characterisation of solder pastes used in the reflow soldering of surface mount assembly." Thesis, University of Salford, 1997. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.360450.

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31

Durairaj, Rajkumar. "Rheological characterisation of solder pastes and isotropic conductive adhesives (ICAs) for microsystems assembly technology." Thesis, University of Greenwich, 2006. http://gala.gre.ac.uk/6153/.

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The printing of solder pastes through very small stencil apertures required for flip-chip pitch sizes, is expected to result in increased stencil clogging and incomplete transfer of paste to the printed circuit board pads. The paste printing process depends on conditions such as good paste roll, complete aperture filling and paste withdrawal. The paste rheology is important in the printing process because the viscosity of the paste must be low enough for the squeegee to force the paste through the stencil apertures, but high enough to recover to its required shape and not flow beyond its stenc

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32

Marks, Antony Edward. "Characterisation of lead-free solder pastes and their correlation with the stencil printing process performance." Thesis, University of Greenwich, 2012. http://gala.gre.ac.uk/9456/.

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Solder pastes are complex materials whose properties are governed by many factors. Variations exhibited in solder paste characteristics make it increasingly difficult to understand the correlations between solder paste properties and their printing process performance. The recent EU directives on RoHS (Restriction of Hazardous Substances – enacted by UK regulations) and WEEE (Waste from Electrical and Electronic Equipment) has led to the use of lead-free soldering in the SMA (surface mount assembly) process, and an urgent need for better understanding of the characteristics and printing perfor

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33

Dhakal, Ramji. "Failure mechanism of lead-free Sn-Ag-Cu solder BGA interconnects." Diss., Online access via UMI:, 2005.

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34

Raut, Rahul. "Thermal management of heat sensitive components in Pb-free assembly." Diss., Online access via UMI:, 2005.

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35

Marquez, de Tino Ursula. "Reduction of nitrogen consumption of lead-free reflow processes and prediction models for behaviors of lead-free assemblies." Diss., Online access via UMI:, 2009.

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Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009.<br>Includes bibliographical references.

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36

Bibette, Jérôme. "Interactions de déplétion et équilibre fluide-solide des émulsions." Phd thesis, Université Sciences et Technologies - Bordeaux I, 1990. http://pastel.archives-ouvertes.fr/pastel-00650854.

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37

Nase, Julia. "Décollement de matériaux viscoélastiques : du liquide visqueux au solide élastique." Phd thesis, Paris 6, 2009. https://pastel.archives-ouvertes.fr/pastel-00005510.

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Dans le cadre de cette thèse expérimentale, nous étudions le décollement en géométrie de probe tack lors de la transition d'un liquide visqueux vers un solide élastique mou. Notre système modèle (du PDMS à différents degrés de réticulation) assure une transition continue entre ces classes de matériaux. Au début du décollement, une instabilité de digitation avec une longueur d'onde caractéristique apparaît. Pour une huile newtonienne nous expliquons le coarsening des structures par analyse de stabilité linéaire. Pour des propriétés du liquide jusqu'au solide, nous identifions des mécanismes vol

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38

Brunel, Marc. "Etude de matériaux solides solgel présentant la proprieté de transmission saturable." Phd thesis, Université Paris Sud - Paris XI, 1996. http://pastel.archives-ouvertes.fr/pastel-00713902.

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Le développement rapide des sources lumineuses intenses, accordables en longueur d'onde, représente une menace croissante pour les différents détecteurs existant, et tout particulièrement l'il. Une méthode de protection envisageable est l'utilisation de composes organiques presentant un comportement d'absorption saturable inverse: leur absorption augmente lorsqu'ils sont eclaires par des faisceaux lumineux tres intenses. En utilisant le procede sol-gel, nous avons pu élaborer des materiaux solides compacts dopes avec des molecules de la famille des phtalocyanines. A la longueur d'onde de 532 n

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39

Petit, Johan. "Monocristaux dopés ytterbium et matériaux assemblés pour lasers de fortes puissances." Phd thesis, Paris 6, 2006. http://pastel.archives-ouvertes.fr/pastel-00001720.

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Les lasers solides dopés terres rares ont certains avantages: ils sont compacts, possèdent un fort rendement et leur faisceau est de bonne qualité. Le principal problème limitant la puissance est la production de chaleur inhérente au processus laser. Cette thèse comporte un premier volet consacré à l'étude de nouveaux matériaux à forte résistance à la puissance de pompage: GdVO4 :Yb et CaGdAlO4 :Yb en particulier. Des émissions laser quasiathermiques et des impulsions ultra-brèves ont été obtenues dans ce dernier. Dans un second volet, une nouvelle méthode d'assemblage par voie sol-gel a été é

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40

Schwartz, Sylvain. "Gyrolaser a l'Etat Solide Application des Lasers a Atomes a la Gyrometrie." Phd thesis, Ecole Polytechnique X, 2006. http://pastel.archives-ouvertes.fr/pastel-00714245.

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41

Schwartz, Sylvain. "Gyrolaser à état solide. Application des lasers à atomes à la gyrométrie." Phd thesis, Ecole Polytechnique X, 2006. http://pastel.archives-ouvertes.fr/pastel-00002959.

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Le gyrolaser est un capteur de rotation utilisé dans la plupart des centrales de navigation inertielle. Dans sa forme usuelle, il est constitué d'une cavité laser en anneau remplie d'un mélange d'hélium et de néon pompé par des électrodes à haute tension. L'utilisation d'un milieu amplificateur gazeux, si elle permet de garantir naturellement le fonctionnement bidirectionnel stable nécessaire à la mesure des rotations, constitue en revanche la principale limitation industrielle des gyrolasers actuels en termes de coût, fiabilité et durée de vie. On étudie dans ce mémoire la possibilité de subs

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42

Ramasubramanian, Arun Shrrivats. "Advanced process window design for 01005 assemblies." Diss., Online access via UMI:, 2008.

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Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008.<br>Includes bibliographical references.

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43

Mallik, Sabuj. "Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications." Thesis, University of Greenwich, 2009. http://gala.gre.ac.uk/8149/.

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The two most important trends in electronic industry are "miniaturisation" and "increased functionality". Over the last fifteen years, the electronic manufacturing industries have experienced tremendous pressure to meet the requirements for miniaturised products, particularly, hand-held consumer products. Functionality of these products has also evolved at the same pace through packing in more and more features. As these trends are set to continue, there is an increasing demand for better understanding of soldering technology, particularly in the area of solder pastes used in the reflow solder

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44

Moto, Mpong Serge. "Etude rhéologique et simulation numérique de l'injection d'un alliage d'aluminium à l'état semi-solide." Phd thesis, École Nationale Supérieure des Mines de Paris, 2002. http://pastel.archives-ouvertes.fr/pastel-00001341.

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Ce travail, qui a été réalisé dans le cadre d'un projet européen, avait pour objectif de faire la simulation numérique de l'injection d'un alliage d'aluminium (A356) à l'état semi-solide. Pour atteindre cet objectif, nous avons travaillé sur deux principaux axes qui sont l'expérience et la simulation numérique. Sur le plan expérimental, l'objectif était de trouver une loi de comportement et ses paramètres pour caractériser le comportement de notre alliage à l'état semi-solide. Cette étude nous a conduit d'une part à passer en revue les différentes classes de loi disponibles dans la bibliograph

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45

Guemnie-Tafo, Alain. "Faisceau de protons générés par l'interaction d'un laser ultra court avec une cible solide." Phd thesis, Ecole Polytechnique X, 2007. http://pastel.archives-ouvertes.fr/pastel-00003039.

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L'accélération de protons par laser a connu une expansion exponentielle ces dernières années principalement grâce à une amélioration des lasers de puissance associée à une diminution de la taille et du coût de telles installations. Les applications envisagées de ces faisceaux sont nombreuses, tant dans le domaine médical (proton thérapie, création d'isotopes pour la TEP...) que dans le domaine énergétique (fusion inertielle, allumeur rapide...). L'interaction entre un faisceau laser intense et une cible solide permet de générer différents types de rayonnement ionisant, notamment des électrons,

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46

Brahim, Cyrine. "Conception et performances électrochimiques de matériaux nanostructurés pour piles à combustible à oxyde solide." Phd thesis, Paris 6, 2006. http://pastel.archives-ouvertes.fr/pastel-00002545.

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Une solution pour limiter les pertes ohmiques résultant de la réduction de la température de fonctionnement des SOFC consiste à élaborer des matériaux d'électrolyte sous forme de couches minces. Dans ce contexte, des couches ultraminces de YSZ et de CGO ont été synthétisées séparément ou sous la forme d'un électrolyte bicouche par dépôt de couches atomiques (ALD) et par pulvérisation cathodique magnétron en condition réactive sur des substrats conducteurs électroniques denses ou poreux. Le dépôt chimique en solution (CBD) a aussi été envisagé comme une technique de dépôt moins onéreuse pour CG

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47

Miled, Houssem. "Modélisation de l'orientation de fibres induite par l'écoulement et comportement élastique anisotrope à l'état solide." Phd thesis, École Nationale Supérieure des Mines de Paris, 2010. http://pastel.archives-ouvertes.fr/pastel-00712985.

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L'objectif de cette thèse consiste consiste à décrire, en un premier temps, l'orientation des fibres pendant la phase d'injection des polymères renforcés à l'état fondu, et comment, en deuxième partie, cette orientation affecte le comportement à l'état solide. Nous avons listé plusieurs modèles dans cette thèse, et nous avons considéré que l'orientation des fibres est régie par l'équation de Folgar et Tucker. Après le procédé d'injection, nous avons considéré que la pièce a un comportement thermo-élastique linéaire anisotrope. Ce comportement thermo-mécanique est relié à l'orientation des fibr

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48

Thorin, Anders. "Modèle non-régulier de la touche de piano à queue." Phd thesis, Ecole Polytechnique X, 2013. http://pastel.archives-ouvertes.fr/pastel-00939493.

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Le mécanisme de la touche de piano à queue sert à propulser le marteau vers les cordes. Ce mécanisme permet au pianiste de contrôler avec précision la vitesse et l'instant d'impact du marteau sur la corde. Il est raisonnable de penser que c'est le comportement dynamique de la touche qui permet cette contrôlabilité. Avec pour perspective l'amélioration du rendu haptique des claviers numériques, cette thèse propose une méthode de simulation d'un modèle complet du mécanisme. Le son généré par la vibration qui suit l'impact du marteau sur les cordes n'entre pas dans le cadre de l'analyse. Des modè

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49

Folzan, Gauthier. "Modélisations multi-matériaux multi-vitesses en dynamique rapide." Phd thesis, Ecole Polytechnique X, 2013. http://pastel.archives-ouvertes.fr/pastel-00803315.

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De nombreuses simulations dans les domaines des impacts, des interactions fluide-structure ou des écoulements multiphasiques impliquent différentes structures indépendantes interagissant entre elles à travers des interfaces complexes. Pour ces problèmes, les stratégies classiques utilisent souvent une approche lagrangienne utilisant un maillage éléments finis par structure et des stratégies de couplage et de mise en contact adéquates. Ceci est très coûteux en terme de génération de maillages et difficile à mettre en place en présence de grandes déformations. Une alternative est d'utiliser une

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50

Trisorio, Alexandre. "Developpement d'une source laser femtoseconde de quelques cycles optiques pour la generation d'harmoniques sur cible solide." Phd thesis, Ecole Polytechnique X, 2008. http://pastel.archives-ouvertes.fr/pastel-00522561.

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