Relevant bibliographies by topics / Soldering alloy

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Soldering alloy'

Author: Grafiati
Published: 4 June 2021
Last updated: 8 February 2022

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Journal articles on the topic "Soldering alloy"

1

Zhao, Zhihuan, Guanghao Gong, Mingming Jiang, et al. "Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder." Crystals 10, no. 2 (2020): 59. http://dx.doi.org/10.3390/cryst10020059.

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In this study, soldering is conducted between a chip and a CLCC-3 shell base with a sheet-like AuGa0.03 alloy solder as the encapsulating material. X-ray images of chip soldering samples, XRD diffraction analysis of the joints, SEM images reflecting the microstructures of the joints, and EDS of the cross sections of the chip soldering samples show that with gradually increasing soldering temperature, the phase composition is not affected, and all the joint structures are an Au + Si eutectic structure; the Au–Si eutectic reaction occurs during the soldering process. No deposition of meta-stable
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Yoon, Young Ok, Nam Seok Kim, Bong Hwan Kim, and Shae K. Kim. "Interface Reaction between Tool Steel and Molten Al Alloy Containing High Mg Content." Defect and Diffusion Forum 380 (November 2017): 115–19. http://dx.doi.org/10.4028/www.scientific.net/ddf.380.115.

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Interface reaction between SKD61 and three Al melts at 973 K was investigated in this study. In pure Al and A380 alloy, soldering occurred on the samples. Pure Al showed two separated soldering areas consisting of Fe-Al based intermetallic phases, mainly FeAl3. A380 alloy indicated the expanded soldering area consisting of Al3Fe and two AlFeSi based intermetallic phases. Al-10mass%Mg alloy showed the absence of soldering, but a formation of a few Fe-Al intermetallic phases. This would be attributed to weakened interaction between Fe and Al caused by Mg enrichment. Microstructures near solderin
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Zenin, V. V., V. I. Baiko, O. V. Marchenko, V. I. Frolov, and O. V. Khishko. "Lead-free alloy soldering of dies." Russian Microelectronics 38, no. 5 (2009): 345–53. http://dx.doi.org/10.1134/s1063739709050084.

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Avery, William F. "Low Temperature Direct Aluminum Soldering Paste." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (2012): 001597–626. http://dx.doi.org/10.4071/2012dpc-wa31.

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For economic and weight considerations using aluminum to make connections to copper has been important in electronic components and making these connections via soldering provides an excellent thermal and electrical pathway. Soldering aluminum to copper in many applications involves the use of low temperature solder bonding to prevent damage to heat sensitive parts such as sealed copper heat pipes and sensitive electronic components. Typically, aluminum soldering is accomplished by plating over the aluminum to make that surface solderable, which is an expensive extra step in this processing. T
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Chantaramanee, Suchart, Worawit Sriwittayakul, and Phairote Sungkhaphaitoon. "Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate." Materials Science Forum 928 (August 2018): 188–93. http://dx.doi.org/10.4028/www.scientific.net/msf.928.188.

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The effects of antimony and indium addition on wettability and interfacial reaction of Sn-3.0Ag-0.5Cu lead free solder on copper substrate were investigated. The experimental results showed the melting point of solder alloy containing 0.5 wt.% In and 0.5 wt.% Sb were slightly increased about 3.66°C. The pasty range of solder alloys were increased about 6°C while the undercooling of solder alloys were decreased. The microstructures of solder alloy were contained of In and Sb consists of Ag3Sn, Cu6(Sn,In)5, SnIn, Ag3(Sn,In) and SnSb intermetallic compounds (IMCs) dispersed on Sn-rich phase. The
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Sokkalingam, R., M. P. Shankar, Anoop K. Unni, K. Sivaprasad, and Veerappan Muthupandi. "Direct Active Soldering of PEO Coated and Uncoated AA6061 Aluminium Alloy." Advanced Materials Research 1148 (June 2018): 152–58. http://dx.doi.org/10.4028/www.scientific.net/amr.1148.152.

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Active soldering is an emerging technology of joining a range of materials, which utilizes Sn-Ag composition solder alloy other than conventional Sn-Pb solder, along with reactive element additions (like Ti, Ta, Hf and Zr). In the present study, active soldering is employed for bonding AA6061 aluminium alloy using S Bond 220-50 and S Bond 220M active solders. Soldering was achieved by direct active soldering of AA6061 plates each other using S Bond 220-50 and PEO coated AA6061 aluminium alloy using S Bond 220M, taking into consideration of the application of active solder alloy in joining cera
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Terek, Pal, Dragan Kukuruzović, Lazar Kovačević, et al. "The Influence of CrAlN Coating Chemical Composition on Soldering Resistance in Contact with Al-Si-Cu Alloy." Materials Proceedings 2, no. 1 (2020): 28. http://dx.doi.org/10.3390/ciwc2020-06837.

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During the high pressure die casting (HPDC) process the die material is exposed to thermal fatigue, erosion, and corrosion. Corrosion leads to the soldering of cast alloy to tool surfaces which consequently bonds the casting with die material. Besides wear, such a process reduces the casting quality and production efficiency and endangers the tool integrity. Application of thin ceramic coatings on die surfaces reduces the soldering effects and improves the die performance. However, the development of ceramic coatings for these purposes still requires detailed information on the phenomena invol
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Niklas, Andrea, Asier Baquedano, Sergio Orden, Eulalia Noguès, Manel Da Silva, and Ana Isabel Fernández-Calvo. "Microstructure and Mechanical Properties of a New Secondary AlSi10MnMg(Fe) Alloy for Ductile High Pressure Die Casting Parts for the Automotive Industry." Key Engineering Materials 710 (September 2016): 244–49. http://dx.doi.org/10.4028/www.scientific.net/kem.710.244.

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Primary AlSi10MnMg alloy is the most widely used alloy for manufacturing of vacuum assisted high pressure die castings (VPDC) with high ductility requirements. In this alloy, die soldering is avoided by a high Mn level (0.5 - 0.6 wt. %) while Fe is kept low (< 0.25 wt. %). Such combination guarantees that the Al-Fe-Mn-Si intermetallic compounds are of the α-iron rich polyhedral or Chinese script type, which is less harmful to the ductility. However, secondary alloys are cheaper and their production requires less energy than the one of primary alloys. The higher amount of Fe, a common impuri
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Drienovsky, Marian, Marián Palcut, Pavol Priputen, et al. "Properties of Sn-Ag-Cu Solder Joints Prepared by Induction Heating." Advances in Materials Science and Engineering 2020 (March 12, 2020): 1–9. http://dx.doi.org/10.1155/2020/1724095.

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In the present work, one near-eutectic and three hypoeutectic Sn-Ag-Cu alloys have been employed for soldering by induction heating. The alloys were produced by induction melting of high purity Ag, Cu, and Sn lumps. The melting behavior of the alloys was investigated by differential scanning calorimetry. The solder alloys were subsequently applied for soldering by conventional hot-plate heating as well as induction heating and both soldering times and peak temperatures were recorded during soldering. Solder joints of two copper sheets were produced. The electrical resistance, tensile strength,
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Ambroziak, Andrzej, Artur Lange, Wiesław Derlukiewicz, and Sylwia Mosińska. "Aluminium and aluminium alloy hard soldering technology." Welding International 26, no. 5 (2012): 330–34. http://dx.doi.org/10.1080/09507116.2011.581339.

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Dissertations / Theses on the topic "Soldering alloy"

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Bruno, Felix. "An experimental study on voids in area array devices for mixed alloy assemblies." Diss., Online access via UMI:, 2006.

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2

Shehab, Abdul-Hadi. "Comparative Tensile Strengths of Preceramic and Postceramic Solder Connectors Using High-Palladium Alloy." VCU Scholars Compass, 2004. http://scholarscompass.vcu.edu/etd/858.

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Purpose: To evaluate the tensile strength properties of Rx Naturelle Plus and Option (high-palladium) alloys on soldered connectors under simulated preceramic and postceramic soldering conditions. Materials and methods: Eighty cylindrical castings were fabricated (40 using Rx Naturelle Plus alloy and 40 using Option alloy). The 40 castings for each alloy were subdivided into 2 groups of 20 each. In the first group, castings for each alloy were randomly paired and soldered with SMG2 solder to produce 10 preceramic test connector specimens for each alloy. In the second group, castings were simi
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Sees, Jennifer A. (Jennifer Anne). "Solid State Diffusion Kinetics of Intermetallic Compound Formation in Composite Solder." Thesis, University of North Texas, 1993. https://digital.library.unt.edu/ark:/67531/metadc279330/.

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The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, metallic or intermetallic particles have been added to eutectic Sn/Pb solder, and termed composite sold
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Pei, Min. "Effects of Lanthanum doping on the microstructure and mechanical behavior of a SnAg alloy." Diss., Available online, Georgia Institute of Technology, 2007, 2007. http://etd.gatech.edu/theses/available/etd-03272007-120709/.

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Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2007.<br>Neu, Richard W., Committee Member ; Sanders, Thomas H. Jr., Committee Member ; Wong, C.P., Committee Member ; McDowell, David L., Committee Member ; Qu, Jianmin, Committee Chair.
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Gao, Yang 1966. "Solderability Study of Tin/Lead Alloy Under Steam-Aging Treatment by Electrochemical Reduction Analysis and Wetting Balance Tests." Thesis, University of North Texas, 1993. https://digital.library.unt.edu/ark:/67531/metadc501051/.

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Two types of solder samples, pins and through-holes were tested by SERA™ (Sequential Electrochemical Reduction Analysis) and Wetting Balance after various length of steamaging treatment. It was shown that after steam-aging, both types of specimen gave a similar electrochemical reduction curve, and solderabilty predictions made from SERA™ test agree with results obtained from Wetting Balance test on a qualitative base. Wetting balance test of pin samples after SERA™ test confirmed that SERA™ is a non-destructive testing method -- it even restored solderability. Comparison of electrochemical red
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Straškraba, Vojtěch. "Vysokoteplotní pájení výkonových polovodičových součástek." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2014. http://www.nusl.cz/ntk/nusl-220916.

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The thesis deals with study of high-temperature alloying process of power semiconductor devices. Mechanical durability and loss heat extraction is achieved via contacting silicon devices on molybdenum electrode in vacuum alloying furnace. Properties of alloy contact determine electrical, geometrical and mechanical parameters of device and are related with durability of device under heavy load during operation in various industrial machines or transport vehicles. Process parameters are evaluated in terms of input materials and their preparation along with temperature ramp profile and conditions
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Hahnlen, Ryan M. "Development and Characterization of NiTi Joining Methods and Metal Matrix Composite Transducers with Embedded NiTi by Ultrasonic Consolidation." The Ohio State University, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=osu1243886351.

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Chloupek, Tomáš. "Hodnocení materiálových a procesních faktorů na DPS metodou smáčecích vah." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2009. http://www.nusl.cz/ntk/nusl-217899.

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This work deals with issues of the wetting forces during soldering and evaluates material and procedural effects on the soldering process. The aim is to set the technology operations to get best quality of soldered joints.
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Belyakov, Sergey Aleksandrovich. "Microstructure formation and soldering in Sn-Ni alloys." Thesis, Imperial College London, 2013. http://hdl.handle.net/10044/1/17998.

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This thesis develops the understanding of microstructure formation in binary Sn-Ni alloys during solidification and during soldering. Where past research has found metastable NixSny phases after solid-state ageing of Ni-Sn couples, it has been shown for the first time in this work that metastable NiSn4 forms in the Sn-Ni system during (i) solidification of Sn-rich Sn-Ni alloys as both a primary and a eutectic phase, (ii) soldering of Sn-Ni alloys to Ni-containing substrates as the βSn-NiSn4 eutectic and (iii) during storage of Sn-Ni electroplated couples as the interfacial intermetallic layer.
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Smeliková, Lenka. "Kontrola kvality pájeného spoje a Design of Experiments u strojního pájení vlnou." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2014. http://www.nusl.cz/ntk/nusl-220991.

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This master´s thesis deals with problems of wave soldering and application methods Design of Experiments for the new product production. Summarizes the basic knowledge of soldering technology, of solder alloys and Design of Experiments methods. Design of Experiments method has been applied to product to find the optimal for wave soldering setting.
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Books on the topic "Soldering alloy"

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Kvasnit͡skiĭ, V. F. Svarka i paĭka zharoprochnykh splavov v sudostroenii. "Sudostroenie", 1986.

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2

R, Frear D., ed. The Mechanics of solder alloy interconnects. Van Nostrand Reinhold, 1994.

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3

Frear, Darrel R., Steven N. Burchett, Harold S. Morgan, and John H. Lau. Mechanics of Solder Alloy Interconnects (Electrical Engineering). Springer, 1993.

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The Mechanics of solder alloy wetting and spreading. Van Nostrand Reinhold, 1993.

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Book chapters on the topic "Soldering alloy"

1

Jellison, J. L., J. Golden, D. R. Frear, F. M. Hosking, D. M. Keicher, and F. G. Yost. "Advanced Soldering Processes." In The Mechanics of Solder Alloy Wetting and Spreading. Springer US, 1993. http://dx.doi.org/10.1007/978-1-4684-1440-0_8.

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Chen, Z. W., and M. Z. Jahedi. "Mechanisms of Soldering in High Pressure Die Casting of Al-11si-3Cu-1Fe Alloy." In Automotive Alloys 1999. John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118787601.ch23.

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Handwerker, Carol, Ursula Kattner, and Kil-Won Moon. "Fundamental Properties of Pb-Free Solder Alloys." In Lead-Free Soldering. Springer US, 2007. http://dx.doi.org/10.1007/978-0-387-68422-2_2.

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Ohnuma, Ikuo, Xing Jun Liu, Hiroshi Ohtani, and Kiyohito Ishida. "Thermodynamic Database for Micro-Soldering Alloys." In Functional Materials. Wiley-VCH Verlag GmbH & Co. KGaA, 2006. http://dx.doi.org/10.1002/3527607420.ch12.

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Wielage, Bernhard, and Silke Mücklich. "Development of a Flux Free Soldering Technology for Magnesium Alloys." In Magnesium. Wiley-VCH Verlag GmbH & Co. KGaA, 2005. http://dx.doi.org/10.1002/3527603565.ch140.

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Kim, Jong Min, Jeong IL Youn, and Young Jig Kim. "Influence of Die Soldering on Die Erosion and Soldering Layer Between Al Melts and Die in Al-Si-Fe Alloys." In Light Metals 2019. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-05864-7_35.

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Wilden, J., Jean-Pierre Bergmann, M. Dolles, and Sebastian Reich. "Use of Zinc-Alloys for Low Temperature Soldering of Zinc Coated Steels." In Sheet Metal 2005. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-972-5.127.

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Arthur Jebastine Sunderraj, D., D. Ananthapadmanaban, and K. Arun Vasantha Geethan. "Comparative Hardness Studies and Microstructural Characterization of 87Sn–7Zn–3Al–3In and 87.5Sn–6 Zn–2Al–2.5In Lead-Free Soldering Alloys." In Lecture Notes in Mechanical Engineering. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-1780-4_30.

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Nimmo, Kay. "Alloy Selections." In Lead-Free Soldering in Electronics. CRC Press, 2003. http://dx.doi.org/10.1201/9780203025772.ch3.

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"Alloy Selections." In Lead-Free Soldering in Electronics. CRC Press, 2003. http://dx.doi.org/10.1201/9780203025772-9.

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Conference papers on the topic "Soldering alloy"

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Shi, Jing, and Yachao Wang. "Ultrasonic Fluxless Soldering of Eutectic SnPb and SnAgCu Alloys: A Feasibility Study." In ASME 2014 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/imece2014-39476.

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Compared with the traditional eutectic SnPb soldering, lead-free soldering has been a focal point for electronics packaging research in order for the industry to meet the regulations on environment protection. By eliminating the lead element from soldering process, the concerns on environmental pollution can be significantly reduced. However, the current lead-free soldering processes usually still require the flux chemicals for promoting wetting. The use of flux chemicals is not environmentally friendly. In this study, motivated by the potential benefits of soldering using ultrasonic energy, w
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Tsenev, Valentin. "Exploration of the Possibilities of Low Temperature Soldering Alloy LMPA at Selective Wave Soldering (SWS)." In 2018 41st International Spring Seminar on Electronics Technology (ISSE). IEEE, 2018. http://dx.doi.org/10.1109/isse.2018.8443650.

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Li, K. C., Jay C. Y. Huang, J. L. Ku, and Synger Lee. "Investigate the Performance of SnCuNi (SCN) Alloy for Wave Soldering." In Circuits Technology Conference (IMPACT). IEEE, 2008. http://dx.doi.org/10.1109/impact.2008.4783821.

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Subbarayan, Guhan, Buck Warnock, Purushothaman Damodaran, Krishnaswami Srihari, and Jorge Arellano. "An Experimental Study of Lead-Free Wave Soldering Using SAC 305 and No-Clean Flux." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-13927.

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The transition to lead-free assembly will have a significant effect on wave soldering operations. Since the wetting ability of lead-free solder is usually less than that of tin-lead solder, it can result in unacceptable hole fills and inconsistent top side wetting - especially in the case of thick Printed Circuit Boards (PCBs). Presently, there is very little data available on lead-free wave soldering with tin-silver-copper (SnAgCu or SAC) alloy and no-clean flux chemistry. Although some researchers and consortia recommend tin-copper (SnCu) for lead-free wave soldering, demonstrating the feasi
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Choudhury, Pritha, Morgana Ribas, and Siuli Sarkar. "High reliability mid-temperature pb-free alloy for multi-step soldering." In 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE, 2017. http://dx.doi.org/10.1109/eptc.2017.8277487.

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Junjie Wang, Xicheng Wei, Wenqi Zhu, Jian Wu, and Nianzu Wu. "Study on low silver Sn-Ag-Cu-P alloy for wave soldering." In 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2013. http://dx.doi.org/10.1109/ipfa.2013.6599206.

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Anson, Scott J., Jacob G. Slezak, and Krishnaswami Srihari. "Analysis of Solder Wetting in Sn-Ag-Cu.05 Lead Free Alloy." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-15759.

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Lead free electronics soldering is driven by a combination of health and environmental concerns, international legislation and marketing pressure by lead free electronics manufacturing competitors. Since July 1, 2006 companies that do not comply with the European Union legislation are not able to sell circuit assemblies with lead solder in the European Union. China has developed its own regulations, based on the European Union documents with a compliance date of March 1, 2007. Lead free soldering requires an increase in reflow peak temperatures which will further aggravate component moisture s
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Yang, Y., J. N. Balaraju, Z. Tsakadze, and Z. Chen. "Electroless Ni-W-P alloy as a more enduring and reliable soldering metallization." In 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011). IEEE, 2011. http://dx.doi.org/10.1109/eptc.2011.6184383.

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Wang, Qiwei, Yong Xiao, and Xingyi Zhang. "Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder." In 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2017. http://dx.doi.org/10.1109/icept.2017.8046584.

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Costa, João, Delfim Soares, Senhorinha F. Teixeira, et al. "Modeling the Reflow Soldering Process in PCB’s." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48720.

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In the present work two different types of case studies are modelled, carried out involving the fusing of a material using the CFD (Computational Fluid Dynamics) software Ansys Fluent, using the VOF method (Volume of Fluid) to capture the position of the existing interfaces and the Solidification/melting method which uses an enthalpy-porosity approach to simulate the fusion of the material. The first case focus itself in the analysis of fusing process and dropping behavior of the melted plate in the presence of a thermal source. The validation is made using a study found in the bibliography an
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