Relevant bibliographies by topics / Solid nickel's etching

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Conference papers

Academic literature on the topic 'Solid nickel's etching'

Author: Grafiati
Published: 8 June 2024
Last updated: 31 July 2025

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Solid nickel's etching.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Solid nickel's etching"

1

Setyarini, Putu Hadi, Elvin Stefano, and Slamet Wahyudi. "STUDY OF ELECTROLESS NICKEL PLATING ON RAPID PROTOTYPING MODEL USING ACRYLONITRILE BUTADIENE STYRENE." Jurnal Rekayasa Mesin 13, no. 1 (2022): 275–81. http://dx.doi.org/10.21776/ub.jrm.2022.013.01.27.

Full text
Abstract:
Electroless plating on Acrylonitrile Butadiene Styrene (ABS) is a metallization process that involves a reduction and oxidation reaction between the nickel source and the substrate material. The purpose of this research is to determine the ability of nickel deposition in the nickel electroless plating process with a specific etching time variation. This nickel electroless procedure begins with a chromic acid etching process that can last anywhere from 15 to 55 minutes and is useful for increasing roughness and creating submicroscopic cavities. After the etching process is finished, the surface
APA, Harvard, Vancouver, ISO, and other styles
2

Hołówko, Bartosz, Jakub Karczewski, Sebastian Molin, and Piotr Jasiński. "Preparation of Hydrogen Electrodes of Solid Oxide Cells by Infiltration: Effects of the Preparation Procedure on the Resulting Microstructure." Materials 13, no. 1 (2019): 131. http://dx.doi.org/10.3390/ma13010131.

Full text
Abstract:
In this work, the infiltration technique was used to produce hydrogen electrodes for solid oxide cells. Different infiltration methodologies were tested in order to try to shorten the infiltration cycle time. The porous scaffolds used for infiltration were based on highly porous yttria-stabilized zirconia (YSZ) obtained by etching the reduced nickel from the Ni-YSZ cermet in HNO3 acid. The support had a complex structure which included a ~130 µm porous functional layer with small pores and a ~320 µm thick supporting layer with large pores. Infiltrations have been carried out using aqueous nick
APA, Harvard, Vancouver, ISO, and other styles
3

Gu, Yuan, and John Federici. "Fabrication of a Flexible Current Collector for Lithium Ion Batteries by Inkjet Printing." Batteries 4, no. 3 (2018): 42. http://dx.doi.org/10.3390/batteries4030042.

Full text
Abstract:
A novel chemical process has been developed to formulate injectable nickel ink for conductive film. This chemical method has the ability to remove the oxidation on nickel nano-particle surfaces during ink fabrication; the nickel ions, which are produced during chemical etching, will be reduced and bridged among original nano-nickel particles in the following thermal sintering process at 350 °C. X-ray diffraction results exhibit that the final nickel film has no significant composition change by this chemical method and that oxidation has been effectively removed. Scanning electron microscopy i
APA, Harvard, Vancouver, ISO, and other styles
4

Horny, Paula, Dominique Drouin, Raynald Gauvin, and Gianluigi A. Botton. "Characterization of Phase Transformation by Fe-SEM and Fe-TEM Analysis." Microscopy and Microanalysis 7, S2 (2001): 490–91. http://dx.doi.org/10.1017/s143192760002852x.

Full text
Abstract:
The formation of a silicon alloy has been achieved by electron beam irradiation of a nickel-silicon bilayer. This process, called SiDWEL1 , has been developed by Quantiscript. The nickel-silicon bilayer is very thin and the electron beam operates at low energy and current. Silicide formation occurred around the interaction volume of the electrons within the material. This paper describes the nature of the structures produced and the origin of the difficulties encountered with the characterization. The necessity of further analysis with TEM based techniques is highlighted.Figure 1 presents a cr
APA, Harvard, Vancouver, ISO, and other styles
5

Wittek, Christian-G. R., Lukas Steinhoff, Selina Raumel, Michael Reißfelder, Folke Dencker, and Marc C. Wurz. "Process Development for Batch Production of Micro-Milling Tools Made of Silicon Carbide by Means of the Dry Etching Process." Micromachines 14, no. 3 (2023): 580. http://dx.doi.org/10.3390/mi14030580.

Full text
Abstract:
Downsized and complex micro-machining structures have to meet quality requirements concerning geometry and convince through increasing functionality. The development and use of cutting tools in the sub-millimeter range can meet these demands and contribute to the production of intelligent components in biomedical technology, optics or electronics. This article addresses the development of double-edged micro-cutters, which consist of a two-part system of cutter head and shaft. The cutting diameters are between 50 and 200 μm. The silicon carbide cutting heads are manufactured from the solid mate
APA, Harvard, Vancouver, ISO, and other styles
6

Wada, Yuri, Kaori Miyamoto, Takatoshi Yamada, and Toru Kuzumaki. "Forming an Optically Transparent Graphene Film via the Transformation of C60 Molecules." Materials Science Forum 1016 (January 2021): 1549–54. http://dx.doi.org/10.4028/www.scientific.net/msf.1016.1549.

Full text
Abstract:
This study aims to optimize the production conditions for forming graphene directly on a quartz substrate, using a carbon 60 (C60) thin film as a solid carbon source. In this experiment, we focused on the relationships between the thickness of the C60 film and the nickel (Ni) catalyst film and the heat treatment conditions. As the thicknesses of the C60 and Ni catalyst films increased, high-crystallinity multi-layered graphene was formed, however the optical transparency of the graphene film decreased. Scanning Electron Microscopy (SEM) observations and Raman scattering spectroscopy showed tha
APA, Harvard, Vancouver, ISO, and other styles
7

Shahana, Chatterjee, S. Ruoff Rodney, Yeon Kim Na, et al. "Synthesis of Highly Oriented Graphite Films with a Low Wrinkle Density and Near-Millimeter-Scale Lateral Grains." Chemistry of Materials 32 (April 1, 2020): 3134−3143. https://doi.org/10.1021/acs.chemmater.0c00154.

Full text
Abstract:
Principal defects found in graphite films include grain boundaries and wrinkles. These defects are well known to have detrimental effects on properties such as thermal and electrical conductivities as well as mechanical properties. With a two-fold objective of synthesizing graphite films with large single crystal grains and no wrinkles, we have developed a relatively low-temperature (&lt;1150 &deg;C) process that involves the precipitation of graphite films from nickel&ndash;carbon solid solutions followed by in-situ etching of the nickel foil substrates with anhydrous chlorine gas to obtain <
APA, Harvard, Vancouver, ISO, and other styles
8

Nakanishi, Kazuhiro, Hiroki Kuroshima, Tsubasa Matsumoto, Takao Inokuma, and Norio Tokuda. "Atomically flat diamond (100) surface formation by anisotropic etching of solid-solution reaction of carbon into nickel." Diamond and Related Materials 68 (September 2016): 127–30. http://dx.doi.org/10.1016/j.diamond.2016.06.011.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Usenko, Alex, Shailesh Dhungana, Anthony N. Caruso, and Stteven L. Bellinger. "Electroless Nickel Plating for Ohmic Contacts to Silicon Power Devices." ECS Meeting Abstracts MA2022-02, no. 23 (2022): 960. http://dx.doi.org/10.1149/ma2022-0223960mtgabs.

Full text
Abstract:
Silicon diodes, FETs, IGBTs still keep the majority of power device market, being much cheaper compared to SiC and GaN wide band gap-based devices. To keep the Si devices competitive, their manufacturing processes must be significantly improved. This includes forming Ohmic contacts. Currently the common process is PVD – physical vapor deposition of metal stacks. This process is not efficient: not selective and wasteful - metal sputtered or evaporated from target coats entire vacuum chamber, not just wafer being processed. Electroless deposition can be potentially used for metallization of Si p
APA, Harvard, Vancouver, ISO, and other styles
10

Kuruma, Takuya, Takayuki Yamamura, Takashi Miura, Daisuke Magori, and Hitohiko Ide. "Improvement of Ionic Conductivity and Suppression of Gas Generation in LiNi0.5Mn1.5O4 Cathode Material By Using P-Ta Aqueous Coating Solution." ECS Meeting Abstracts MA2024-02, no. 5 (2024): 617. https://doi.org/10.1149/ma2024-025617mtgabs.

Full text
Abstract:
With the increasing demand for electrification of mobility, there are high expectations in recent years for improving the quick-charging performance of batteries. However, conventional lithium-ion batteries have a limited recharging speed due to safety concerns, such as heat generation during rapid recharging. Against this backdrop, batteries using lithium titanate (LTO), which has a spinel-type crystal structure with excellent charge acceptance, as the negative electrode have been attracting attention. The combination of lithium nickel manganese oxide (LNMO), which has the same spinel-type st
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Solid nickel's etching"

1

Laourine, Feriel. "Texturation de la surface d’aciers inoxydables par plasmas chlorés et compréhension des mécanismes mis en jeu par l’étude de la gravure du fer, du chrome et du nickel massifs." Electronic Thesis or Diss., Université de Lorraine, 2021. http://www.theses.fr/2021LORR0252.

Full text
Abstract:
La structuration à l’échelle submicronique de la surface des aciers inoxydables permet de leur apporter de nouvelles fonctionnalités, par exemple pour des applications tribologiques et optiques. Cette thèse s’inscrit dans le cadre du projet ANR SPOT qui a pour objectif de structurer à l’échelle submicronique la surface d’aciers austénitiques et martensitiques par gravure sèche. Dans ce travail, nous avons développé un procédé plasma avec un mélange de chlore et d’argon pour la gravure des aciers inoxydables. La mise au point de ce procédé a été réalisée en se basant sur l’étude de la gravure d
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Solid nickel's etching"

1

Pothula, Surya V., and Yong X. Gan. "Fabrication of Nickel/Zirconium Anode for Solid Oxide Fuel Cells by Electrochemical Method." In ASME 2010 International Manufacturing Science and Engineering Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/msec2010-34225.

Full text
Abstract:
In this work, preparation of discontinuous nickel films on zirconium by electrochemical deposition of Ni-Cu alloy followed by selective anodic etching of the more noble metal, copper, was performed in an aqueous solution at room temperature. Potential varying electrodeposition produces were applied to obtain Ni-Cu alloys on Zr substrate. It is found that the Ni content increases as the deposition potential becomes more negative. Cyclic voltam-metric data indicate that the anodic dissolution of nickel is retarded by passivation. By taking the advantage of nickel passivation, selective anodic et
APA, Harvard, Vancouver, ISO, and other styles
2

Hsueh, Tao-Hung, Hung-Wen Huang, Chih-Chiang Kao, et al. "InGaN/GaN Multi-Quantum-Well Nanorods Fabricated by Plasma Etching Using Self-assembled Nickel Nano-masks." In 2004 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2004. http://dx.doi.org/10.7567/ssdm.2004.g-7-3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Pan, Feng, and Adam Huang. "Investigation of Oxide-Removal of Various Metal Particles for Fabricating MEMS-Based Corrosion Sensor." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-12045.

Full text
Abstract:
Recently, our research group has proposed a MEMS-based solid state corrosion sensor, which is based on embedding metal particle into elastomeric polymers to form a composite-based sensing material. The chemical and dimensional properties of the metal particles and polymer matrix will provide the tailorability in sensor sensitivity, selectivity, time response, and operating life-span. However, the oxidization of metallic particles prior to embedding is adverse for electrical transduction of such sensor. This paper will be based on the investigation of chemical etching protocols used to remove t
APA, Harvard, Vancouver, ISO, and other styles
4

Velukkudi Santhanam, Senthil Kumar, Jeffrin Michael Gnana Anbalagan, Shanmuga Sundaram Karibeeran, Dhanashekar Manickam, and Ramaiyan Sankar. "Multi Response Optimization of Friction Stir Processing Parameters on Cryo-Rolled AZ31B Alloys." In ASME 2020 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/imece2020-23198.

Full text
Abstract:
Abstract Friction stir processing (FSP) method is a solid-state technique used for microstructural alteration and enhancing mechanical properties of sheet metals and as-cast materials. Aluminium, brass, copper, steel, tin, nickel, magnesium and titanium are the widely used materials in friction stir processing. Even though magnesium has low density compared to aluminium, only few reports are made on magnesium. Two stage of process was carried out on the experiment to obtain fine grain refinement and improved strength. First, Cryo-rolling processing on 6mm thickness AZ31B alloy at constant roll
APA, Harvard, Vancouver, ISO, and other styles
5

Pua, Lee M., and S. O. Rumbold. "Industrial Microchannel Devices: Where Are We Today?" In ASME 2003 1st International Conference on Microchannels and Minichannels. ASMEDC, 2003. http://dx.doi.org/10.1115/icmm2003-1101.

Full text
Abstract:
Heatric has been involved in the commercial design and manufacturing of “micro/milli” scale heat exchanger core matrices called Printed Circuit Heat Exchangers (PCHEs) since 1985. These core matrices are formed by diffusion bonding together plates into which fluid flow microchannels have (usually) been formed by photo-chemical machining. Complex fluid circuitry is readily implemented with this technique. Diffusion bonding is a ‘solid-state joining’ process creating a bond of parent metal strength and ductility. The complete microchannel heat exchangers are highly compact, typically comprising
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Solid nickel's etching' for particular source types:
Journal articles
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography