Log in

Relevant bibliographies by topics / Sputtering / Journal articles

To see the other types of publications on this topic, follow the link: Sputtering.

Journal articles on the topic 'Sputtering'

Author: Grafiati

Published: 4 June 2021

Last updated: 26 July 2025

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 journal articles for your research on the topic 'Sputtering.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

Kozlova, M. V., V. N. Fateev, O. K. Alekseeva, N. A. Ivanova, V. V. Tishkin, and A. Sh Aliyev. "MAGNETRON SPUTTERING SYNTHESIS OF ELECTROCATALYSTS." Chemical Problems 22, no. 1 (2024): 7–19. http://dx.doi.org/10.32737/2221-8688-2024-1-7-19.

Full text

Abstract:

Magnetron sputtering is a well-known method of obtaining various coatings and surface modifications, but nowadays it is successfully used for the synthesis of electrocatalysts. One of the main advantages of the method is the possibility to vary the parameters during the process, such as the mode (direct current sputtering, pulsed medium-frequency sputtering, high radio frequency sputtering), potential supply to the sputtered substrate or catalyst carrier, pressure in the vacuum chamber, atmosphere composition, which allows to change the composition and structure of the obtained coatings and ca

APA, Harvard, Vancouver, ISO, and other styles

2

Zhang, Jin Min, Quan Xie, Vesna Borjanović, et al. "Preparation of the Kondo Insulators FeSi by Magnetron Sputtering." Materials Science Forum 663-665 (November 2010): 1129–32. http://dx.doi.org/10.4028/www.scientific.net/msf.663-665.1129.

Full text

Abstract:

The Kondo insulator FeSi was prepared by DC magnetron sputtering and the effects of sputtering parameters on the formation of FeSi were investigated in detail. The formation of monosilicide FeSi was clarified using X-ray diffraction (XRD) and its microstructure was characterized by scanning electron microscopy (SEM). The results indicate that the sputtering gas pressure, the sputtering power and the Ar flux all have significantly effects on formation of FeSi and the crystalline of the film. The sputtering gas pressure has effects on sputtering yields, depositing rate and the energy of sputteri

APA, Harvard, Vancouver, ISO, and other styles

3

Ji, Xiao Lin, Hai Dong Ju, Tao Yu Zou, et al. "Effects of Sputtering Pressure on Cu₃N Thin Films by Reactive Radio Frequency Magnetron Sputtering." Advanced Materials Research 1105 (May 2015): 74–77. http://dx.doi.org/10.4028/www.scientific.net/amr.1105.74.

Full text

Abstract:

Copper nitride thin films were prepared by reactive radio frequency magnetron sputtering at different sputtering pressures with fixed nitrogen to argon ratio. The influences of sputtering pressure on the structure, optical band gap, and surface morphology of films were investigated. The results show that the preferential orientation of polycrystalline Cu3N thin films changes from [111] to [100] when the sputtering pressure increases. Meanwhile, the optical band gap (Eg) of Cu3N thin films increases with the sputtering pressure. The surface morphology of Cu3N thin film deposited at high sputter

APA, Harvard, Vancouver, ISO, and other styles

4

Manukhi V.V. "Sputtering of carbide films from the surface of the metal by helium ions bombardment." Technical Physics 67, no. 11 (2022): 1500. http://dx.doi.org/10.21883/tp.2022.11.55182.48-22.

Full text

Abstract:

The paper investigates the dependence of the sputtering yields by light ions bombardment of the surface layers of titanium and tungsten, modified with carbon, on the thickness of the layer. The theoretical study was conducted on the basis of a sputtering model (previously adapted to describe the sputtering of two-component targets and layered-inhomogeneous surfaces), based on two sputtering mechanisms, which allows to analyze the obtained dependencies. Theoretical calculations of the total yields sputtering by helium ions bombardment of the surface layers of titanium and tungsten modified with

APA, Harvard, Vancouver, ISO, and other styles

5

Yan, Li, Ping-Yang Wang, Yang-Hua Ou, and Xiao-Lu Kang. "Numerical Study of Hall Thruster Plume and Sputtering Erosion." Journal of Applied Mathematics 2012 (2012): 1–16. http://dx.doi.org/10.1155/2012/327021.

Full text

Abstract:

Potential sputtering erosion caused by the interactions between spacecraft and plasma plume of Hall thrusters is a concern for electric propulsion. In this study, calculation model of Hall thruster’s plume and sputtering erosion is presented. The model is based on three dimensional hybrid particle-in-cell and direct simulation Monte Carlo method (PIC/DSMC method) which is integrated with plume-wall sputtering yield model. For low-energy heavy-ion sputtering in Hall thruster plume, the Matsunami formula for the normal incidence sputtering yield and the Yamamura angular dependence of sputtering

APA, Harvard, Vancouver, ISO, and other styles

6

Aumayr, Friedrich, and Hannspeter Winter. "Potential sputtering." Philosophical Transactions of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences 362, no. 1814 (2003): 77–102. http://dx.doi.org/10.1098/rsta.2003.1300.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Rossnagel, Stephen M. "Magnetron sputtering." Journal of Vacuum Science & Technology A 38, no. 6 (2020): 060805. http://dx.doi.org/10.1116/6.0000594.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Eckstein, W. "Sputtering yields." Vacuum 82, no. 9 (2008): 930–34. http://dx.doi.org/10.1016/j.vacuum.2007.12.004.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

Shimizu, Ryuichi. "Preferential sputtering." Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 18, no. 1-6 (1986): 486–95. http://dx.doi.org/10.1016/s0168-583x(86)80074-x.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

"Sputtering." Metal Finishing 93, no. 12 (1995): 71. http://dx.doi.org/10.1016/0026-0576(95)92473-6.

Full text

APA, Harvard, Vancouver, ISO, and other styles

11

Hoshi, Y., and M. Naoe. "Differences between Sputtering Methods in The Formation of Amorphous Magnetic Alloy Films." MRS Proceedings 58 (1985). http://dx.doi.org/10.1557/proc-58-75.

Full text

Abstract:

ABSTRACTFe-Si, Co-Ta and Co-Zr amorphous films have been deposited by using various sputtering methods (conventional rf diode sputtering, rf triode sputtering, dc Targets Facing type sputtering (dc TF sputtering) and dual ion beam sputtering (DIB sputtering)). The lower limit of the Si and Ta content to form amorphous Fe-Si and Co-Ta films changes significantly with the sputtering method. These differences between the sputtering methods are mainly caused by the differences in the plasma potential which affects the amount of ion bombardment to the film surface during sputtering,and the minimum

APA, Harvard, Vancouver, ISO, and other styles

12

Liu, Shuangjie, Xingwang Li, Yongping Hao, Xing Li, and Fengli Liu. "Effect of magnetron sputtering process parameters on the conductivity of thin metal film." AIP Advances 13, no. 9 (2023). http://dx.doi.org/10.1063/5.0170746.

Full text

Abstract:

This paper focuses on the effect of magnetron sputtering process parameters on the performance of thin metal film. Copper–tin alloy metal film was deposited on both sides of the PVDF film using direct current magnetron sputtering technology, and the effects of different working pressures, sputtering powers, sputtering times, and argon flow rates on the uniformity, deposition rate, and electrical conductivity of the metal film were studied separately. The main and minor factors affecting the conductivity of the metal film were determined by multiple linear regression, and the process parameters

APA, Harvard, Vancouver, ISO, and other styles

13

"Sputtering targeted." Materials Today 9, no. 12 (2006): 69. http://dx.doi.org/10.1016/s1369-7021(06)71765-5.

Full text

APA, Harvard, Vancouver, ISO, and other styles

14

"Sputtering targets." Metal Finishing 97, no. 7 (1999): 66. http://dx.doi.org/10.1016/s0026-0576(00)80648-0.

Full text

APA, Harvard, Vancouver, ISO, and other styles

15

"Sputtering system." Metal Finishing 97, no. 7 (1999): 66. http://dx.doi.org/10.1016/s0026-0576(00)80655-8.

Full text

APA, Harvard, Vancouver, ISO, and other styles

16

"Sputtering material." Metal Finishing 97, no. 7 (1999): 67. http://dx.doi.org/10.1016/s0026-0576(00)80657-1.

Full text

APA, Harvard, Vancouver, ISO, and other styles

17

"Sputtering device." Metal Finishing 97, no. 7 (1999): 70–71. http://dx.doi.org/10.1016/s0026-0576(00)80669-8.

Full text

APA, Harvard, Vancouver, ISO, and other styles

18

"Sputtering apparatus." Metal Finishing 97, no. 10 (1999): 72. http://dx.doi.org/10.1016/s0026-0576(00)81044-2.

Full text

APA, Harvard, Vancouver, ISO, and other styles

19

"Sputtering target." Metal Finishing 97, no. 12 (1999): 81. http://dx.doi.org/10.1016/s0026-0576(00)81225-8.

Full text

APA, Harvard, Vancouver, ISO, and other styles

20

"Sputtering target." Metal Finishing 98, no. 3 (2000): 86. http://dx.doi.org/10.1016/s0026-0576(00)81571-8.

Full text

APA, Harvard, Vancouver, ISO, and other styles

21

"Sputtering target." Metal Finishing 98, no. 4 (2000): 88. http://dx.doi.org/10.1016/s0026-0576(00)81682-7.

Full text

APA, Harvard, Vancouver, ISO, and other styles

22

"Sputtering apparatus." Metal Finishing 98, no. 4 (2000): 88. http://dx.doi.org/10.1016/s0026-0576(00)81683-9.

Full text

APA, Harvard, Vancouver, ISO, and other styles

23

"Sputtering cathodes." Metal Finishing 97, no. 11 (1999): 76–77. http://dx.doi.org/10.1016/s0026-0576(00)82181-9.

Full text

APA, Harvard, Vancouver, ISO, and other styles

24

"Sputtering apparatus." Metal Finishing 97, no. 11 (1999): 90. http://dx.doi.org/10.1016/s0026-0576(00)82239-4.

Full text

APA, Harvard, Vancouver, ISO, and other styles

25

"Sputtering apparatus." Metal Finishing 97, no. 11 (1999): 110. http://dx.doi.org/10.1016/s0026-0576(00)82306-5.

Full text

APA, Harvard, Vancouver, ISO, and other styles

26

"Sputtering apparatus." Metal Finishing 97, no. 11 (1999): 110–11. http://dx.doi.org/10.1016/s0026-0576(00)82308-9.

Full text

APA, Harvard, Vancouver, ISO, and other styles

27

"Sputtering process." Metal Finishing 98, no. 7 (2000): 73. http://dx.doi.org/10.1016/s0026-0576(00)82410-1.

Full text

APA, Harvard, Vancouver, ISO, and other styles

28

"Sputtering apparatus." Metal Finishing 98, no. 7 (2000): 75. http://dx.doi.org/10.1016/s0026-0576(00)82418-6.

Full text

APA, Harvard, Vancouver, ISO, and other styles

29

"Sputtering apparatus." Metal Finishing 98, no. 7 (2000): 78. http://dx.doi.org/10.1016/s0026-0576(00)82433-2.

Full text

APA, Harvard, Vancouver, ISO, and other styles

30

"Sputtering cathodes." Metal Finishing 98, no. 11 (2000): 85. http://dx.doi.org/10.1016/s0026-0576(00)83582-5.

Full text

APA, Harvard, Vancouver, ISO, and other styles

31

"Sputtering targets." Metal Finishing 98, no. 11 (2000): 109. http://dx.doi.org/10.1016/s0026-0576(00)83672-7.

Full text

APA, Harvard, Vancouver, ISO, and other styles

32

"Sputtering apparatus." Metal Finishing 97, no. 6 (1999): 165. http://dx.doi.org/10.1016/s0026-0576(00)84006-4.

Full text

APA, Harvard, Vancouver, ISO, and other styles

33

"Sputtering target." Metal Finishing 98, no. 12 (2000): 82. http://dx.doi.org/10.1016/s0026-0576(01)80102-1.

Full text

APA, Harvard, Vancouver, ISO, and other styles

34

"Sputtering system." Metal Finishing 97, no. 9 (1999): 119. http://dx.doi.org/10.1016/s0026-0576(01)80493-1.

Full text

APA, Harvard, Vancouver, ISO, and other styles

35

"Sputtering device." Metal Finishing 99, no. 1 (2001): 108. http://dx.doi.org/10.1016/s0026-0576(01)80649-8.

Full text

APA, Harvard, Vancouver, ISO, and other styles

36

"Sputtering apparatus." Metal Finishing 99, no. 1 (2001): 108–9. http://dx.doi.org/10.1016/s0026-0576(01)80650-4.

Full text

APA, Harvard, Vancouver, ISO, and other styles

37

"Sputtering device." Metal Finishing 99, no. 1 (2001): 118. http://dx.doi.org/10.1016/s0026-0576(01)80705-4.

Full text

APA, Harvard, Vancouver, ISO, and other styles

38

"Sputtering apparatus." Metal Finishing 99, no. 1 (2001): 118. http://dx.doi.org/10.1016/s0026-0576(01)80707-8.

Full text

APA, Harvard, Vancouver, ISO, and other styles

39

"Sputtering apparatus." Metal Finishing 99, no. 5 (2001): 87. http://dx.doi.org/10.1016/s0026-0576(01)80890-4.

Full text

APA, Harvard, Vancouver, ISO, and other styles

40

"Sputtering target." Metal Finishing 99, no. 3 (2001): 87. http://dx.doi.org/10.1016/s0026-0576(01)80967-3.

Full text

APA, Harvard, Vancouver, ISO, and other styles

41

"Sputtering apparatus." Metal Finishing 99, no. 2 (2001): 120–21. http://dx.doi.org/10.1016/s0026-0576(01)81075-8.

Full text

APA, Harvard, Vancouver, ISO, and other styles

42

"Sputtering apparatus." Metal Finishing 99, no. 2 (2001): 121. http://dx.doi.org/10.1016/s0026-0576(01)81080-1.

Full text

APA, Harvard, Vancouver, ISO, and other styles

43

"Sputtering apparatus." Metal Finishing 99, no. 9 (2001): 109. http://dx.doi.org/10.1016/s0026-0576(01)81537-3.

Full text

APA, Harvard, Vancouver, ISO, and other styles

44

"Sputtering apparatus." Metal Finishing 99, no. 9 (2001): 114. http://dx.doi.org/10.1016/s0026-0576(01)81557-9.

Full text

APA, Harvard, Vancouver, ISO, and other styles

45

"Sputtering target." Metal Finishing 99, no. 9 (2001): 114. http://dx.doi.org/10.1016/s0026-0576(01)81558-0.

Full text

APA, Harvard, Vancouver, ISO, and other styles

46

"Sputtering cathode." Metal Finishing 99, no. 11 (2001): 94. http://dx.doi.org/10.1016/s0026-0576(01)81673-1.

Full text

APA, Harvard, Vancouver, ISO, and other styles

47

"Sputtering device." Metal Finishing 99, no. 12 (2001): 59–60. http://dx.doi.org/10.1016/s0026-0576(01)81776-1.

Full text

APA, Harvard, Vancouver, ISO, and other styles

48

"Sputtering method." Metal Finishing 99, no. 12 (2001): 63. http://dx.doi.org/10.1016/s0026-0576(01)81798-0.

Full text

APA, Harvard, Vancouver, ISO, and other styles

49

"Sputtering targets." Metal Finishing 94, no. 5 (1996): 38. http://dx.doi.org/10.1016/s0026-0576(96)80014-6.

Full text

APA, Harvard, Vancouver, ISO, and other styles

50

"Sputtering target." Metal Finishing 94, no. 10 (1996): 80–81. http://dx.doi.org/10.1016/s0026-0576(96)91183-6.

Full text

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!