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Journal articles on the topic 'Squeegee'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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1

Krammer, Oliver, László Jakab, Balazs Illes, David Bušek, and Ivana Beshajová Pelikánová. "Investigating the attack angle of squeegees with different geometries." Soldering & Surface Mount Technology 30, no. 2 (April 3, 2018): 112–17. http://dx.doi.org/10.1108/ssmt-09-2017-0023.

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Purpose The attack angle of stencil printing squeegees with different geometries was analysed using finite element modelling. Design/methodology/approach A finite element model (FEM) was developed to determine the attack angle during the stencil printing. The material properties of the squeegee were included in the model according to the parameters of steel AISI 4340, and the model was validated by experimental measurements. Two geometric parameters were investigated; two different unloaded angles (45° and 60°) and four overhang sizes of the squeegee (6, 15, 20 and 25 mm). Findings It was found that the deflection of the blade is nearly homogenous along the length of the squeegee. This implies that the attack angle does not change significantly along the squeegee length. The results showed significant differences between the initial and the attack angle. For example, the angle of the squeegee with 15 mm overhang size and with 60° initial angle decreased by more than 5° for a specific squeegee force of 0.3 N/mm; resulting in an attack angle of 53.4°. Originality/value The attack angle during the printing is considerably lower than the initial angle as a result of the printing force. The papers, which were dealing with the numerical modelling of the stencil printing presumed that the squeegees were having their initial angle. This could have led to invalid numerical results. Therefore, we decided to investigate the attack angle during stencil printing for squeegees with different initial geometries to enhance the numerical modelling of stencil printing.

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2

Denis, Véronique. "Pour comprendre la pratique du « squeegee » à Montréal1." Criminologie 36, no. 2 (April 5, 2004): 89–104. http://dx.doi.org/10.7202/007868ar.

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Résumé La pratique du « squeegee »2, relativement récente à Montréal et rendue illégale, a été l’objet d’une importante couverture médiatique mais n’a que très peu été étudiée. Même si les adeptes du « squeegee », communément appelés les « squeegees », sont souvent considérés comme des « jeunes de la rue », cet article met en évidence l’hétérogénéité de leurs expériences de vie ainsi que de leur rapport à cette pratique, rendant réductrice cette catégorisation. En outre, la méthodologie qualitative, incluant des observations sur le terrain et des entretiens non directifs auprès de jeunes qui pratiquaient le « squeegee » en 1999, permet d’esquisser le contexte social entourant la pratique du « squeegee » à Montréal. Enfin, à partir des sens que cette pratique revêt pour les jeunes qui l’exercent, l’article examine en quoi la pratique du « squeegee », socialement vue comme « hors normes », pourrait s’avérer pour eux un agent d’insertion sociale marginalisée.

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3

Whitmore, Mark, and Jeff Schake. "The Impact of Stencil Printing Upon Assembly & Reliability Of 0.3mm Pitch CSP Components." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000667–74. http://dx.doi.org/10.4071/isom-2016-thp55.

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Abstract With the continual shrinking of electronic assembly form factors, designers are being forced towards smaller, more complex components with decreasing interconnection pitches. As a consequence, the Surface Mount assembly process is becoming increasingly challenged. For the stencil printing process, this means that historically accepted stencil aperture area ratio design rules, (which dictate what can or cannot be printed), need to be significantly pushed to extend the printing process for next generation ultra -fine pitch components. As a result, a major study has been undertaken looking at several different aspects of the stencil printing process, and their impact upon the assembly and reliability of 0.3mm pitch CSP components. In a preliminary test, stencil printing factors such as stencil aperture size and printing technology (standard squeegees vs ultrasonically aided active squeegees) were investigated. Data showed that the active squeegees provided a significantly larger process window. Subsequently, components were assembled using a range of solder paste volumes printed with both standard and active squeegee technology. The components assembled using an active squeegee process exhibited higher assembly yield, and also extended reliability when subjected to thermal cycling.

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4

Wang, Zhan Zhong, Lin Zhang Cheng, Wei Zhang, and Wei Jie Wang. "Design and Simulation of the Drill Groove Squeegee Roller's Profile." Advanced Materials Research 421 (December 2011): 493–98. http://dx.doi.org/10.4028/www.scientific.net/amr.421.493.

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Based on the method of vector analysis, the mathematical model of squeegee roller for twist drill groove was setup. At the same time, the parameter design and simulation software for the profile curve of drill groove squeegee roller was developed with Visual C++ Language. The simulation results showed that the mathematical model of squeegee roller was right, and the design accuracy and efficiency of the twist drill squeegee roller was improved greatly.

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5

Jong-Kai Lin, Treliant Fang, and R. Bajaj. "Squeegee bump technology." IEEE Transactions on Components and Packaging Technologies 25, no. 1 (March 2002): 38–44. http://dx.doi.org/10.1109/6144.991173.

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6

MARTINEZ, BISMARCK A., ANDREIA BIANCHINI, JAYNE STRATTON, ORIANA RAABE, and STEVEN SWANSON. "Condensation Removal Practices and Their Potential for Contributing to Environmental Pathogen Contamination in Food Processing Facilities." Journal of Food Protection 84, no. 6 (January 19, 2021): 1047–54. http://dx.doi.org/10.4315/jfp-20-337.

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ABSTRACT Food manufacturers often use squeegees as a tool to remove condensation from overhead surfaces. This practice is done to reduce the likelihood of environmental pathogen contamination by eliminating condensed-water droplets that could fall from overhead surfaces during production. However, this practice may actually spread environmental pathogens across these surfaces, defeating its purpose and further increasing the risk for contamination in the processing area. To understand the risk associated with this common practice, test pipes inoculated with Listeria innocua ATCC 33090 were exposed to steam to produce condensation, which was then removed by squeegees. The pipe surfaces, droplets, and squeegees were subsequently analyzed for Listeria to determine the distance the organism spread across the pipe and how many organisms were transferred to the droplets and the squeegees. Results showed that Listeria traveled as far as 16 in. across the surface of the pipe, and bacterial transfer to the droplets decreased as the squeegee traveled further from the contaminated area. Sanitizers alone were able to remove about 1 to 2 log CFU of Listeria per in2 from the squeegee blades when materials were contaminated with Listeria (>6 log CFU/in2). Among the cleaning protocols evaluated, an extensive cleaning regimen was able to remove 3 to 4 log CFU/in2, which would be recommended to reduce the risk associated with environmental pathogen transfer. This study provides evidence that supports recommendations for minimizing the cross-contamination risk associated with condensation management practices. HIGHLIGHTS

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7

Ђорђевић, Драгољуб Б. "ЈОШ СОЦИОЛОШКИХ ЦРТИЦА О ШОФЕРШАЈБНОВЦИМА." ГОДИШЊАК ЗА СОЦИОЛОГИЈУ 25, no. 1 (November 13, 2020): 33–58. http://dx.doi.org/10.46630/gsoc.25.2020.02.

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This study is one of the results of investigating the habits of Tomislav Asanović, a Roma squeegee man working on the crossroad near the Mladost Bridge in Niš, whom we renamed Toma the Traffic Light Man. The empirical part of this study was conducted in 2018 by Jelena Dinić, Dragan Todorović, and Mladen Mitrović, while the author of this text has nearly every day observed and collected data on the working habits of this squeegee man, which can be seen as an ideal representative of his guild. We are extensively using the documented material to present the attitude towards the Roma squeegee man, the so-called urban miners, whereas the category of urban miners also includes: carriers, the homeless, waste collectors, people who collect leftovers on graveyards and from dustbins, collectors of old paper and boxes, shoeshiners, sellers of small artefacts (costers), beggars, old iron collectors, collectors of plastic bottles and all sorts of plastic, landfill scavengers, cart drivers, buskers. Even though they are barely touched upon in this sociological portrait, it is expected that our study into squeegee men will incite more scrupulous empirical research into Romani urban miners, other marginalized people and losers – let us not forget – those who provide life with more beautiful nuances, and establish the sociology of misery and pauperization or the sociology of marginalized groups, a special discipline currently emerging in Serbian sociology. Key words: Squeegee men, urban miners, Serbian Roma, Roma-related stereotypes

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8

Sayers, William. "Etymology of Squiligee and Squeegee." Mariner's Mirror 102, no. 4 (October 2016): 447–51. http://dx.doi.org/10.1080/00253359.2016.1240981.

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9

Ali, Muhammad, Long Lin, Saira Faisal, Iftikhar Ali Sahito, and Syed Imran Ali. "Optimisation of screen printing process for functional printing." Pigment & Resin Technology 48, no. 5 (September 2, 2019): 456–63. http://dx.doi.org/10.1108/prt-05-2019-0043.

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Purpose The purpose of this study is to explain the effects of screen printing parameters on the quantity of ink deposited and the print quality in the context of printing of functional inks. Both these aspects of printing are crucial in the case of conventional and functional printing. This is because, in the case of conventional printing, the quantity of ink deposit affects the color strength while in the case of functional printing, it directly affects the resulting functionality of the ink layer. Design/methodology/approach In this work, an automatic lab-scale screen printer was used to print functional inks on a paper board substrate. The printing parameters, i.e. printing pressure and squeegee angle were altered and the resulting effects on the quantity of ink that was deposited were recorded. The quantity of ink deposit was related to its surface resistivity. In addition, the quality of the print was also assessed by examining the design registration quality. Findings The authors found that altering the squeegee angle has a significant effect on the properties of the resulting ink deposit. More importantly, the authors found that the deflection in the rubber blade squeegee was greatly dependent on the initial angle of the squeegee at the start of the printing stroke. For each set value of the squeegee angle that was considered, the actual angle during printing was recorded and used in the analysis. A printing pressure of three bars and squeegee angle of 20° resulted in the maximum weight of ink deposit with a correspondingly lowest surface resistivity. Practical implications This study is envisaged to have considerable practical implications in the rapidly growing field of functional printing of flexible substrates including, but not limited to, textiles. This is because, the study provides an insight into the effects of printing parameters on the characteristics of a functional ink deposit. Originality/value Screen printing of flexible substrates is a well-developed and arguably the most widely used printing technique, particularly for textiles. Numerous studies report on the analysis of various aspects of screen printing. However, to the best of the knowledge, the effects of printing parameters on the characteristics of functional inks, such as electrically conductive inks, have not been studied in this manner.

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10

Jou, Yung-Tsan, Wen-Tsann Lin, Wei-Cheng Lee, and Tsu-Ming Yeh. "Integrating the TRIZ and Taguchi's Method in the Optimization of Processes Parameters for SMT." Advances in Materials Science and Engineering 2013 (2013): 1–10. http://dx.doi.org/10.1155/2013/830891.

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SMT is an assembly technology for core circuit board parts. Unless process parameters are effectively controlled, poor solderability may result in a decline in product quality. This study looks at an SMT manufacturing process in a multinational company. First, the TRIZ contradiction matrix is revised to investigate the association between the 39 parameters in the contradiction matrix and 13 parameters that influence the unevenness of solder paste in the solder paste printing process. Expert verification is then used to screen the key factors affecting the quality of SMT, which are then combined with Taguchi's method to identify the optimal parameter set influencing the thickness of SMT solder paste.Results. TRIZ identifies squeegee pressure, ejection speed, squeegee speed, and squeegee angle as the four parameters with the greatest influence on SMT solder paste thickness. Taguchi's method is used to identify the optimum levels set for the experimental factors and carry out confirmation experiments. TheS/Nratio improved from 21.732 db to 26.632 db, while the mean also improved from the current 0.163 mm to 0.155 mm, close to the target value of 0.15 mm. The results show that applying TRIZ and Taguchi's method for the purpose of product improvement is feasible.

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11

Dachner, Naomi, and Valerie Tarasuk. "Homeless “squeegee kids”: Food insecurity and daily survival." Social Science & Medicine 54, no. 7 (April 2002): 1039–49. http://dx.doi.org/10.1016/s0277-9536(01)00079-x.

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12

Al-Ma'aiteh, Tareq Ibrahim, Oliver Krammer, and Balázs Illés. "Transient Numerical Modelling of the Pin-in-Paste Technology." Applied Sciences 11, no. 10 (May 19, 2021): 4670. http://dx.doi.org/10.3390/app11104670.

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The pin-in-paste technology is an advancing soldering technology for assembling complex electronic products, which include both surface-mounted and through-hole components. A computational fluid dynamics model was established to investigate the stencil printing step of this technology, where the hole-filling by the solder pastes is the most critical factor for acquiring reliable solder joints. The geometry of the transient numeric model included the printing squeegee, the stencil, and the through-holes of a printed circuit board with different geometries and arrangements. A two-phase fluid model (solder paste + air) was applied, utilizing the Volume of Fluid method (VoF). The rheological properties of the solder paste were addressed by an exhaustive viscosity model. It was found that the set of through-holes affected the flow-field and yielded a decrease in the hole-filling if they were arranged in parallel with the travelling direction of the printing squeegee. Similar disturbance on the flow-field was found for oblong-shaped through-holes if they were arranged in parallel with the squeegee movement. The findings imply that the arrangement of a set of through-holes and the orientation of oblong-shaped through-holes should be optimized even in the early design phase of electronic products and during the set of assembly processes. The soldering failures in pin-in-paste technology can be reduced by these early design-phase considerations, and the first-pass yield of electronic soldering technologies can be enhanced.

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13

Shapee, Sabrina Mohd, Rosidah Alias, Ibrahim Azmi, Zulkifli Ambak, Zulfadli Mohamed Yusoff, and Muhammad Redzuan Saad. "Screen Printing Parameter Effect on the Surface Roughness Measurement of Printed Gold Paste on LTCC Tape." Key Engineering Materials 421-422 (December 2009): 485–89. http://dx.doi.org/10.4028/www.scientific.net/kem.421-422.485.

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Effect of screen printing parameter such as squeegee speed was studied in this paper for the surface roughness of gold paste on the Ferro A6M LTCC tape. Roughness measurement was evaluated by 3D profilometer of the Ferro A6M LTCC tape co-fired with Au conductor paste.

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14

Parnaby, Patrick. "Disaster through Dirty Windshields Law, Order and Toronto's Squeegee Kids." Canadian Journal of Sociology / Cahiers canadiens de sociologie 28, no. 3 (2003): 281. http://dx.doi.org/10.2307/3341925.

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15

Rosenberger, Matthew R., Hsun-Jen Chuang, Kathleen M. McCreary, Aubrey T. Hanbicki, Saujan V. Sivaram, and Berend T. Jonker. "Nano-“Squeegee” for the Creation of Clean 2D Material Interfaces." ACS Applied Materials & Interfaces 10, no. 12 (March 6, 2018): 10379–87. http://dx.doi.org/10.1021/acsami.8b01224.

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16

Mannan, S. H., N. N. Ekere, I. Ismail, and E. K. Lo. "Squeegee deformation study in the stencil printing of solder pastes." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 17, no. 3 (1994): 470–76. http://dx.doi.org/10.1109/95.311758.

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17

Ishak, M. H. H., M. S. Abdul Aziz, M. H. S. Abdul Samad, Farzad Ismail, and M. A. A. Mohd Salleh. "Influence of squeegee impact on stencil printing process: CFD approach." IOP Conference Series: Materials Science and Engineering 957 (November 25, 2020): 012065. http://dx.doi.org/10.1088/1757-899x/957/1/012065.

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18

Pan, Jianbiao, Malcolm Keif, Joshua Ledgerwood, Xiaoying Rong, and Xuan Wang. "Screen Printing Fine Pitch Stretchable Silver Inks onto a Flexible Substrate for Wearable Applications." Journal of Microelectronics and Electronic Packaging 15, no. 4 (October 1, 2018): 179–86. http://dx.doi.org/10.4071/imaps.734384.

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Abstract This article presents the development and optimization of the screen printing process for printing stretchable silver ink onto a stretchable thermoplastic polyurethane substrate. A test vehicle was designed including 50 μm/5 mm (line width/line length) to 350 μm/35 mm lines (at four biases). A two-level factorial design with three replicates was selected to investigate the effect of process parameters on the quality of prints. We proposed calculated sheet resistance based on the measured resistance value, trace width, and trace length, which can replace trace height measurements on rough profile substrates. We found that squeegee pressure and emulsion thickness have statistically significant effects on calculated sheet resistance of print traces, whereas print speed does not have statistically significant effects. In our experiment setting levels, the lower the squeegee pressure, the lower the calculated sheet resistance that is achieved. The emulsion with higher emulsion over mesh (EOM) is better than the emulsion with lower EOM because it can achieve lower sheet resistance. After optimizing the screen printing process, we were able to print 100 μm (4 mils) trace width and spacing with high consistency.

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19

Soon, Chin Fhong, Zai Peng Goh, Lee Chin Ku, Ten Ten Lee, and Kian Sek Tee. "A Squeegee Coating Apparatus for Producing a Liquid Crystal Based Bio-Transducer." Applied Mechanics and Materials 465-466 (December 2013): 759–63. http://dx.doi.org/10.4028/www.scientific.net/amm.465-466.759.

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Cholesteryl ester liquid crystals were discovered with a new application in sensing traction forces of single cells. The liquid crystal bio-transducer is produced by manual scraping of liquid crystals onto the petri dish, in which the technique is highly subjective to the skill of the user to produce homogeneously spread liquid crystal substrates. This paper describes the development of an apparatus used to produce a liquid crystal substrate using squeegee coating technique. It consists of a biaxial mechatronic system which is synchronously controlled in vertical and horizontal directions scraping the liquid crystal substrates evenly on the surface of a petri dish. The thickness of the liquid crystal was profiled using laser diffraction technique and the homogeneity of the liquid crystal films produced was examined in a crossed-polarizing microscope. At an angular speed of 1500 rpm and under a shear stress of 1.46 ± 0.72 kPa, the squeegee coating was found producing liquid crystal films at a thickness of 132 ± 23 μm on the surface of petri dishes. With the application of this apparatus, evenly spread liquid crystal coatings with control thickness in petri dishes were consistently produced. This has overcome the major problem of manually coating the liquid crystal substrates using a cell scraper.

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20

He, Da, N. N. Ekere, and M. A. Currie. "The behavior of solder pastes in stencil printing with vibrating squeegee." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C 21, no. 4 (October 1998): 317–24. http://dx.doi.org/10.1109/tcpmc.1998.7102530.

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21

Costantino, Santiago, Christopher G. McQuinn, Timothy E. Kennedy, and Paul W. Wiseman. "Fabrication of protein gradients for cell culture using a miniature squeegee." Journal of Biochemical and Biophysical Methods 70, no. 6 (April 2008): 1192–95. http://dx.doi.org/10.1016/j.jbbm.2007.05.013.

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22

Jewell, E. H., T. C. Claypole, and D. T. Gethin. "The effect of exposure to inks and solvents on squeegee performance." Surface Coatings International Part B: Coatings Transactions 87, no. 4 (December 2004): 253–60. http://dx.doi.org/10.1007/bf02699673.

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23

Asghar, Rafiq, Faisal Rehman, Ali Aman, Kashif Iqbal, and Agha Ali Nawaz. "Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study." Soldering & Surface Mount Technology 32, no. 1 (September 19, 2019): 1–9. http://dx.doi.org/10.1108/ssmt-05-2019-0019.

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Purpose The purpose of this paper is to investigate and minimize the printing-related defects in the surface mount assembly (SMA) process. Design/methodology/approach This paper uses an experimental approach to explore process parameter and printing defects during the SMA process. Increasing printing performance, various practices of solder paste (Ag3.0/Cu0.5/Sn) storage and handling are suggested. Lopsided paste problem is studied by varying squeegee pressure and the results are presented. Unfilled pads problems are observed for ball grid array (BGA) and quad flat package (QFP) which is mitigated by proper force tuning. In this paper, a comparative study is conducted which evaluates the manifestation of printing offset due to low-grade stencil. The input/output (I/O) boards were oxidized when the relative humidity was maintained beyond 70 per cent for more than 8 h. This pad oxidation problem is overcome by proper printed circuit board (PCB) handling procedures. When the unoptimized line is used, the paste wedged in the stencil and influences the performance of the screen printer, for this reason, an optimized line is proposed that minimize the printing defects. Findings The key findings are as follows: in the SMA process, printing quality is directly associated with solder paste quality. Experimentally, it is observed that a considerable variance in solder deposition occurred when the front and rear squeegee have different configurations. High-grade and unsoiled stencil results in superior paste deposition and less distinction. Insufficient solder paste and bridge problems also occur in printing when PCB pads are oxidized. Optimized line resolves solder paste clog issues, associated with stencil’s aperture. The cooling arrangement on the conveyor, after reflow, explicates hot jig problem. Control environmental conditions minimized static charges and printing defects. Originality/value The preceding studies emphasis mostly on the squeegee pressure, while other important parameters are not completely investigated. Moreover, it is very imperative to concurrently measure all parameters while varying the environmental conditions. This study highlights and provides an experimental approach to various PCB printing defects, and a comparative study has been conducted that concurrently measure all process parameters.

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24

EKERE, N. N., and D. HE. "THE PERFORMANCE OF VIBRATING SQUEEGEE IN THE STENCIL PRINTING OF SOLDER PASTES." Journal of Electronics Manufacturing 06, no. 04 (December 1996): 261–70. http://dx.doi.org/10.1142/s0960313196000238.

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25

Rusdi, M. S., M. Z. Abdullah, M. S. Abdul Aziz, M. K. Abdullah, A. A. Bakar, M. H. S. Abd Samad, P. Rethinasamy, Sivakumar Veerasamy, and C. Y. Khor. "Numerical Investigation on the Effect of Squeegee Angle during Stencil Printing Process." Journal of Physics: Conference Series 1082 (August 2018): 012057. http://dx.doi.org/10.1088/1742-6596/1082/1/012057.

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26

Pan, Jianbiao, Malcolm Keif, Joshua Ledgerwood, Xiaoying Rong, and Xuan Wang. "Screen Printing Fine Pitch Stretchable Silver Inks onto a Flexible Substrate for Wearable Applications." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000665–71. http://dx.doi.org/10.4071/2380-4505-2018.1.000665.

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Abstract The lightweight and bendable features of printed flexible electronics are increasingly attractive. Currently stretchable silver inks are formulated for wide traces, typically larger than 2 mm. To attach ultra-thin silicon chips that have fine pitch onto printed organic substrate, it is necessary to print fine trace width/space that matches the pitch of the chips, which may be less than 200 microns. This paper presents the development and optimization of the screen printing process for printing stretchable silver ink onto stretchable thermoplastic polyurethane (TPU) substrate. A test vehicle was designed including 50 μm/5 mm (line width/line length) to 350 μm/35 mm lines (at 4 biases). The stretchable ink selected was DuPont PE 873 and Dupont's PE 5025 ink (non-stretchable conductive flake silver) was used as a “control” to baseline the printing process. The substrate used was Bemis TPU ST604. The experiment was done on a DEK Horizon 03i printer. A DEK squeegee 200 (Blue) and a DEK 265 flood bar (200 mm) were used. A 2-level factorial design with three replicates was selected to investigate the effect of process parameters on the quality of prints. The quality of the prints is characterized by 1) resistance of traces, 2) sheet resistance, 3) z-axis height, and 4) trace width/spacing. We observed significant noise in the z-axis printed silver ink height measured by profilometry and concluded z-axis height is not a good response variable for characterizing screen printing stretchable silver ink onto TPU substrate, mainly due to high roughness of the TPU substrate. We proposed calculated sheet resistance based on the measured resistance value, trace width, and trace length, which can replace trace height measurements on rough profile substrates. We found that squeegee pressure and emulsion thickness have statistically significant effects on calculated sheet resistance of print traces while print speed does not have statistically significant effects. In our experiment setting levels, the lower the squeegee pressure, the lower the calculated sheet resistance that is achieved. The emulsion with higher emulsion over mesh (EOM) is better than the emulsion with lower EOM since it can achieve lower sheet resistance. After optimizing the screen printing process, we were able to print 100 μm (4 mils) trace width and spacing with high consistency.

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27

Ninsonti, Hathaithip, Weerasak Chomkitichai, Akira Baba, Natda Wetchakun, Wiyong Kangwansupamonkon, Sukon Phanichphant, Kazunari Shinbo, Keizo Kato, and Futao Kaneko. "Au-Loaded Titanium Dioxide Nanoparticles Synthesized by Modified Sol-Gel/Impregnation Methods and Their Application to Dye-Sensitized Solar Cells." International Journal of Photoenergy 2014 (2014): 1–8. http://dx.doi.org/10.1155/2014/865423.

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Au-loaded TiO2nanoparticles were synthesized by the modified sol-gel method together with the impregnation method. Anatase phase of TiO2was obtained in all samples with an average particle size of 20 nm. For the enhancement of DSSCs, the dye-sensitized solar cells composed of the ITO/Au-loaded TiO2/N-719/electrolyte/Pt were fabricated. Au-loaded TiO2films were deposited by using squeegee method. Finally, the fabricated cells were studied upon an irradiation of solar light to study the performance. The fabricated cell with up to 1.0 mol% Au-loaded TiO2could enhance the performance by localized surface plasmon effect and scattering property.

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28

Mohamad Zin, R., Fauziahanim Che Seman, and Chin Fhong Soon. "Critical Surface Tension of HSF54 Carbon Composite Electrodes on Paper Substrate." Advanced Materials Research 1109 (June 2015): 214–18. http://dx.doi.org/10.4028/www.scientific.net/amr.1109.214.

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The wettability of the carbon composite electrode on paper substrate was studied using contact angle measurement. Y-Shield HSF54 carbon composite material were coated on paper substrates with a mask using squeegee coating technique. Contact angles of the ten polar probe liquids with the HSF54 electrodes were measured using a customed-built image acquisition system. With the contact angles obtained for each probe liquid placed on the electrodes, the surface tension of the electrodes was determined using Fox-Zisman theory. The result showed that the critical surface tension of HSF54 carbon composite electrodes was 37.2 mN/m which is considered to be moderately hydrophobic.

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29

Whitmore, Mark, and Clive Ashmore. "Developments in Stencil Printing Technology for 0.3mm Pitch CSP Assembly." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000502–8. http://dx.doi.org/10.4071/isom-2011-wa2-paper2.

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As electronics assemblies continue to shrink in form factor, forcing designers towards smaller components with decreasing pitches, the Surface Mount assembly process is becoming increasingly challenged. A new “active” squeegee printing process has been developed to assist in the stencil printing of solder pastes for next generation ultra fine pitch components such as 0.3mm pitch CSP’s. Results indicate that today’s accepted stencil area ratio rules, which govern solder paste transfer efficiency can be significantly pushed to extend stencil printing process capabilities to stencil apertures having area ratios as low as 0.4. Such a breakthrough will allow the printing of ultra fine pitch components and additionally will assist with heterogeneous assembly concerns, to satisfy up and coming mixed technology demands.

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Hosokawa, Yuji, Hajime Shiki, Yuichiro Shinohara, Masashi Yokota, Hirofumi Takikawa, Takashi Ina, Fumio Okada, et al. "Preparation of Powdery Carbon Nanotwist and Application to Printed Field Emitter." Research Letters in Materials Science 2007 (2007): 1–5. http://dx.doi.org/10.1155/2007/59167.

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In the present study, an automatic production system with sequencer control for the synthesis of carbon nanofibriform based on catalytic CVD using a substrate was developed. The carbon nanotwist (CNTw), which is one of the helical carbon nanofibers, was then synthesized in powdery form with anNi–SnO2-composed catalyst. The production rate was 5 400 times that of the conventional CVD system andNi–Cu–In2O3catalyst. The powdery CNTw was easily scraped off the substrate, then pasted with organic binder, and printed by a squeegee method on ITO glass substrate for an electron field emitter. The field emission performance was found to be better than that of the directly grown CNTw film in conventional CVD with Ni–Cu catalyst.

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Shi, Hui Bei, Yong Zhu Cui, Chun Yan Wei, and Xiao Wang. "Research on Tussah Dye-Free Printed Fabric Added Tryptophan." Advanced Materials Research 1048 (October 2014): 104–8. http://dx.doi.org/10.4028/www.scientific.net/amr.1048.104.

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In this experiment, tussah fabric was dye-free printed by using tryptophan-added method. The physical and chemical properties of printed fabrics were tested and measured. The optimal process for tussah fabric dye-free printing tryptophan added has got, which was tryptophan mass fraction of 7.5 %, PHBA of 8 %, HCl of 15 %, HEC of 2.5 %, and H2O2 of 2 %. The tussah silk fabric squeegee performed twice and then dried at 80°C for 30 min showed best printing result. Its printing pattern and outline were clear, and it had deep and uniform color. Meanwhile, the breaking strength of the fabric, color fastness and breathability, softness performs were well. What’s more, a short process was used, which it’s more environment-friendly and more economical.

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Fox, I. J., T. C. Claypole, and D. T. Gethin. "An experimental investigation into ink transfer using a roller squeegee in high-speed screen printing." Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering 217, no. 4 (November 2003): 307–21. http://dx.doi.org/10.1243/095440803322611679.

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Krammer, Oliver, and Karel Dušek. "Numerical investigation on the effect of the printing force and squeegee geometry on stencil printing." Journal of Manufacturing Processes 45 (September 2019): 188–93. http://dx.doi.org/10.1016/j.jmapro.2019.06.021.

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MEHTA, MITUL C., ROBERT E. FOSTER, MICHAEL R. PETERSON, DANIEL M. MILLER, and CHRISTOPHER D. RIEMANN. "The Hydraulic Squeegee: A Novel and Simple Method for Removing Silicone Oil From an Intraocular Lens." Retina 29, no. 10 (November 2009): 1536–37. http://dx.doi.org/10.1097/iae.0b013e3181bd2f5e.

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Fu, Weixin, Tatsushi Kaneda, Akiko Okada, Kaori Matsunaga, Shuichi Shoji, Mikiko Saito, Hiroshi Nishikawa, and Jun Mizuno. "Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O3 Treatment." Journal of Electronic Materials 47, no. 10 (July 5, 2018): 5952–58. http://dx.doi.org/10.1007/s11664-018-6462-8.

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Kakiage, Kenji, Emi Fujimura, Masayuki Abe, Hajime Shinoda, Toru Kyomen, and Minoru Hanaya. "Application of Micro-Metal Textile for Flexible Dye-Sensitized Solar Cell." Key Engineering Materials 459 (December 2010): 92–99. http://dx.doi.org/10.4028/www.scientific.net/kem.459.92.

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As a means to make a flexible dye-sensitized solar cell (DSSC), we prepared a TiO2 electrode by using a micro-metal textile made from Sn-plated Cu wires, and examined applicability of the micro-metal textile as a substrate for the electrode. The TiO2 electrodes were prepared successfully by painting a TiO2 paste to the textile using a squeegee method followed by sintering at 500 °C, and the electrodes showed no exfoliation of the TiO2 layer from the textile even when the electrode was bent to a cylindrical shape with 10-mm diameter. The solar cells constructed with these electrodes, on which N3 dye was adsorbed as a sensitizer, exhibited actually a photovoltaic performance. The results indicated the applicability of the micro-metal textile as the flexible substrate for the TiO2 electrode producing an efficient flexible DSSC.

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OKE, Shinichiro, Yuuki IZUMI, Takashi IKEDA, Hikaru URUNO, Yoshiyuki SUDA, Hirofumi TAKIKAWA, Sigeo ITOH, et al. "DMFC Catalyst Layer Prepared Using Arc-Soot Nano-Carbon by Dry-Squeegee Method and Its Impedance Analysis." Electrochemistry 77, no. 3 (2009): 210–13. http://dx.doi.org/10.5796/electrochemistry.77.210.

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Anizar, Anizar, Rahmi M. Sari, Khalida Syahputri, Indah Rizkya, and Nurul Atikah. "Effect of work posture on operator complaints: Choice between sitting and standing work." MATEC Web of Conferences 197 (2018): 14001. http://dx.doi.org/10.1051/matecconf/201819714001.

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Workers perform manual handling activities with sitting and standing work postures. In sitting work posture, this activity is performed using a 15-cm-long spade, so the workers must bend both their bodies and feet, meanwhile in standing work posture, workers use stainless steel squeegee. Workers on both postures complain of pain but on different parts of the body. Limited work facilities cause this handling activity uses body muscle repetitively. The aim of this study is to obtain an ergonomic work facility so that workers can use standing work posture with minimal pain complaints. The methods used are arterial pulse measurement, pain complaints measurement, anthropometry measurement, and designing handling device using QFD method. The subjects in this study are 6 male workers in a steel company producing threaded steel. The handling device stands 77.9 cm tall with a 15° slope so that silicomanganese can move down by taking advantage of the vibration. Workers only direct silicomanganese into the sack in standing work posture, so that performance can increase.

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39

Huang, Chien-Yi. "Applying the Taguchi parametric design to optimize the solder paste printing process and the quality loss function to define the specifications." Soldering & Surface Mount Technology 30, no. 4 (September 3, 2018): 217–26. http://dx.doi.org/10.1108/ssmt-03-2017-0010.

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Purpose This research aims to study the stencil printing process of the quad flat package (QFP) component with a pin pitch of 0.4 mm. After the optimization of the printing process, the desired inspection specification is determined to reduce the expected total process loss. Design/methodology/approach Static Taguchi parametric design is applied while considering the noise factors possibly affecting the printing quality in the production environment. The Taguchi quality loss function model is then proposed to evaluate the two types of inspection strategies. Findings The optimal parameter-level treatment for the solder paste printing process includes a squeegee pressure of 11 kg, a stencil snap-off of 0.14 mm, a cleaning frequency of the stencil once per printing and using an air gun after stencil wiping. The optimal upper and lower specification limits are 119.8 µm and 110.3 µm, respectively. Originality/value Noise factors in the production environment are considered to determine the optimal printing process. For specific components, the specification is established as a basis for subsequent processes or reworks.

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POPESCU, V. A. "SECOND-ORDER CORRELATION FUNCTION FOR SUCCESSIVE SQUEEZED STATES." Modern Physics Letters B 13, no. 29n30 (December 30, 1999): 1063–73. http://dx.doi.org/10.1142/s0217984999001317.

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By successive application of the squeeze operator, we obtain different quantum statistical properties for the squeezed number, the squeezed thermal, the squeezed coherent and the displaced squeezed thermal states. We compare our enhanced squeezing method with other procedures for superposition of two squeezed coherent states.

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Abdulla-Al-Mamun, M., Y. Kusumoto, and G. J. Islam. "A Comparative Performance Study of Plasmon-induced Charge Separation of Au@TiO₂, Au@Fe₂O₃, and Au@ZnO Photocell Thin-films." Journal of Scientific Research 5, no. 2 (April 21, 2013): 245–54. http://dx.doi.org/10.3329/jsr.v5i2.13391.

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The gold colloidal nanoparticles was prepared by citrate reduction from chloroauric acid (HAuCl4·4H2O). An ITO glass was coated with nanoporous TiO2, Fe2O3 and ZnO by squeegee method. The squeezing coated films were loaded with Au-nanoparticles by depositing technique. The film was characterized by UV-visible transmittance absorption spectroscopy, SEM, XRD, XPS, and EDX techniques. The Pt counter electrode was prepared by a magnetron sputter method on an ITO glass. The semiconductor with Au-loaded film was used as a working electrode whereas Pt film was used as a counter electrode in a solar cell. The charge was separated by short circuit current and an open circuit voltage and the cell efficiency was measured by IPCE analyzer. The comparative photocurrent-performance of different semiconductors loaded with Au-nanoparticles was analysed. Au@TiO2, Au@Fe2O3, Au@ZnO were found to be suitable films for photo-current production having a good efficiency with Au@TiO2 as the best of the three.© 2013 JSR Publications. ISSN: 2070-0237 (Print); 2070-0245 (Online). All rights reserved.doi: http://dx.doi.org/10.3329/jsr.v5i2.13391 J. Sci. Res. 5 (2), 245-254 (2013)

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Paganoni, Eloisa. "Epigraphic Squeezes: Digitisation, Publication, and Enhancement." Studia Universitatis Babeș-Bolyai Digitalia 65, no. 1 (December 8, 2020): 5–16. http://dx.doi.org/10.24193/subbdigitalia.2020.1.01.

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"Epigraphic squeezes are a key tool for research and teaching. They also have historical and documentary value. They are reliable copies of inscribed text and become the only evidence that remains if inscriptions are lost or destroyed. This paper describes the Venice Squeeze Project for the preservation and enhancement of epigraphic squeezes in the Department of Humanities at Ca’ Foscari University of Venice. For the initial phase of the project, the Ca’ Foscari University collection of epigraphic squeezes was published in the digital ektypotheke E-stampages. The current phase involves developing a web application to digitise epigraphic squeezes according to the metadata architecture of E-stampages. The first part of this paper describes the background of the Venice Squeeze Project and methodological issues, which fostered the partnership with E-stampages. The second part describes the relational database that was set up to digitise the Ca’ Foscari collection. The third part introduces the project initiatives to promote a network of Italian institutions interested in digitizing their collections of epigraphic squeezes. Keywords: Greek epigraphy, squeezes, database architecture"

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Zin, Rosliza Mohamad, Chin Fhong Soon, Syalina Ghadafi, Riyaz Ahmad Mohamad Ali, and Nayan Nafarizal. "Fabrication and Characterisation of the Electrical and Physical Properties of the Mask Printed Graphite Paste Electrodes on Paper Substrates." Advanced Materials Research 925 (April 2014): 510–13. http://dx.doi.org/10.4028/www.scientific.net/amr.925.510.

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Heavy metal contamination in waste water is a problem of paramount concern. Instant measurement of the degree of contamination is the long term aim of this work. This project proposed the fabrication of mask printed graphite paste electrodes based on natural graphite and micronized graphite powder which has potential for sensing heavy metal in water. The graphite paste were prepared by mixing paraffin oil and graphite powder at certain ratios and they were coated via a mask on a paper substrate using squeegee method. A two-probe station was used to characterize the I-V curve of the mask printed electrodes, in which the result was used for determining the resistivity of the graphite paste electrodes. A field emission scanning electron microscope (FE-SEM) and energy dispersive X-ray spectroscopy (EDS) was used to investigate the surface structure of the graphite paste electrode and determining the purity of the carbon in the electrode. The result shows that natural and micronized graphite paste electrode has a mean resistivity of 1.69 x 10-3 Ωm and 1.25 x 10-3 Ωm, respectively. The slight difference found in the conductivity of both electrodes is associated with the particle gap size, density and dimension of graphite electrodes which are associated with the percolation theory.

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Glinski, G. P., C. Bailey, and K. A. Pericleous. "A non-Newtonian computational fluid dynamics study of the stencil printing process." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 215, no. 4 (April 1, 2001): 437–46. http://dx.doi.org/10.1243/0954406011520869.

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This paper describes the application of computational fluid dynamics (CFD) to simulate the macroscopic bulk motion of solder paste ahead of a moving squeegee blade in the stencil printing process during the manufacture of electronic components. The successful outcome of the stencil printing process is dependent on the interaction of numerous process parameters. A better understanding of these parameters is required to determine their relation to print quality and improve guidelines for process optimization. Various modelling techniques have arisen to analyse the flow behaviour of solder paste, including macroscopic studies of the whole mass of paste as well as microstructural analyses of the motion of individual solder particles suspended in the carrier fluid. This work builds on the knowledge gained to date from earlier analytical models and CFD investigations by considering the important non-Newtonian rheological properties of solder pastes which have been neglected in previous macroscopic studies. Pressure and velocity distributions are obtained from both Newtonian and non-Newtonian CFD simulations and evaluated against each other as well as existing established analytical models. Significant differences between the results are observed, which demonstrate the importance of modelling non-Newtonian properties for realistic representation of the flow behaviour of solder paste.

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Potts, Sarah-Jane, Chris Phillips, Eifion Jewell, Ben Clifford, Yin Cheung Lau, and Tim Claypole. "High-speed imaging the effect of snap-off distance and squeegee speed on the ink transfer mechanism of screen-printed carbon pastes." Journal of Coatings Technology and Research 17, no. 2 (December 10, 2019): 447–59. http://dx.doi.org/10.1007/s11998-019-00291-6.

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AbstractScreen printing is the most widely used process in the production of printed electronics due to its ability to consistently transfer inks containing a wide range of functional materials onto a range of substrates. However, despite its extensive use, the mechanism by which the ink is transferred through the mesh and onto the substrate is not fully understood. Existing theories are contradictory and lack experimental validation. Therefore, high-speed imaging was used in combination with a screen-printing simulation rig that was designed to provide good optical access to study ink deposition during the screen-printing process. The variation in the four stages of ink flow through the screen, described in the theory by Messerschmitt, has been quantified with respect to changes in snap-off distance and squeegee speed. Analyses of the images were compared with measurements of the ink properties and corroborated with analyses of the prints. This has provided a better understanding of the mechanism by which the ink transfers from the mesh to the substrate and subsequently separates in screen printing. This could be used as the basis for the development of predictive algorithms, as well as to improve the understanding of how to optimize print quality and performance.

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Ma, Xin, and William Rhodes. "Multimode squeeze operators and squeezed states." Physical Review A 41, no. 9 (May 1, 1990): 4625–31. http://dx.doi.org/10.1103/physreva.41.4625.

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Machel, H. G., and B. E. Buschkuehle. "Diagenesis of the Devonian Southesk-Cairn Carbonate Complex, Alberta, Canada: Marine Cementation, Burial Dolomitization, Thermochemical Sulfate Reduction, Anhydritization, and Squeegee Fluid Flow." Journal of Sedimentary Research 78, no. 5 (May 1, 2008): 366–89. http://dx.doi.org/10.2110/jsr.2008.037.

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POPESCU, V. A. "HIGHER-ORDER SUCCESSIVE SQUEEZED NUMBER AND COHERENT STATES." Modern Physics Letters B 14, no. 16 (July 10, 2000): 599–608. http://dx.doi.org/10.1142/s0217984900000781.

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The statistical properties of the higher-order squeezed thermal states [V. A. Popescu, Mod. Phys. Lett. B14, 203 (2000)] and of the higher-order squeezed number and coherent states (this paper) can be improved by successive application of the squeeze operator. We compare our method with the usual procedure for higher-order squeezing and with another way for superposition of two squeezed coherent states.

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Guraieb, Paula, Ross Tomson, Anna Courville, Vaibhav Nikam, John Kennedy, Robby Nelson, and Brad Sears. "Novel Scale Inhibitor Extends Treatment Lifetimes in Permian EOR." Journal of Petroleum Technology 73, no. 08 (August 1, 2021): 38–40. http://dx.doi.org/10.2118/0821-0038-jpt.

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Background A new extended-release (ER) scale-inhibitor technology showing significantly increased lifetimes has been applied in the Permian Basin. Tomson Technologies and Group 2 Technologies, in partnership with Occidental Petroleum (Oxy), implemented a scale-squeeze program for this carrier system. It allows for fewer squeeze treatments, which results in lower chemical usage, decreased plugging risk, and reduced environmental impact. Squeeze programs are an effective field treatment strategy to prevent scale formation in wells for extended periods of time. However, in some cases, squeeze lifetimes can be short, leading to frequent re-squeezing and production decreases, lowering overall economic recoveries. The ER phosphonate-based chemistry (SI1313) was used in selected wells where incumbent (previous chemical provider) treatment lifetimes were shorter than expected. The incumbent squeeze volumes and additives were used, and the scale-inhibitor (SI) chemistry was replaced with SI1313 to obtain directly comparable results. The wells selected are vertical wells, with predominantly carbonate mineralogy and 14–18% porosity and 9–16 mD permeability. Bottomhole temperature is 105°F (40°C). These wells are under continuous CO2 flooding operations, and the scales of interest are calcium carbonate and calcium sulfate predominantly. The selected wells were targeted to have a good squeeze history for comparison and stable water production. Pre-Job Validation Work Coreflood laboratory experiments were performed to simulate the adsorption and desorption under these specific Oxy Permian conditions. The coreflood showed over 10,000 pore volume (PV) of flow with inhibitor concentration remaining above the minimum effective concentration (MEC) during the entire run. Once greater than two times incumbent performance was reached, the coreflood was stopped, although the return concentration was still above MEC. For reference, corefloods with incumbent phosphonate chemistry under the same conditions usually drop below MEC around approximately 3,000–5,000 PVs. The adsorption of SI1313 to core material was measured during the coreflood experiment and the results show 12.5 mg of inhibitor adsorbed per gram of core material. As a comparison, a typical incumbent phosphonate scale inhibitor adsorbs 1–2 mg of inhibitor per gram of core material. This increase in adsorption is considered a large improvement over traditional chemistry. The carrier platform’s superior adsorption, when combined with controlled desorption, is the basis for extending the lifetimes of scale- inhibitor treatments. The corefloods results validate the ER characteristics expected from SI1313 and allowed for field squeezes to be conducted. Field Application Group 2 Technologies provided SI1313 to be squeezed for Oxy in January 2020, into five vertical conventional wells. The selected wells are in one area where CO2 flooding is in place and there is risk of calcium carbonate (CaCO3) and calcium sulfate (CaSO4) scaling. These wells have had many scale squeezes performed on them, yielding an excellent data set to compare against. The goal of this trial was to show significant lifetime extension compared to previous incumbent squeeze lifetimes.

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Jones, Alison. "Identifying an Unlawful Margin Squeeze: The Recent Judgments of the Court of Justice in Deutsche Telekom and TeliaSonera." Cambridge Yearbook of European Legal Studies 13 (2011): 161–93. http://dx.doi.org/10.5235/152888712801752942.

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AbstractThe chapter will consider what a margin squeeze is, whether it is appropriate for a competition authority to try and prevent margin squeezes using competition law rules and, if so, what tests can be used to identify an unlawful margin squeeze and to distinguish it from legitimate competition on the merits.

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