Dissertations / Theses on the topic 'Technology integration'
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Carter, Keith L. "Technology Strategy Integration." Thesis, Monterey, California. Naval Postgraduate School, 2012. http://hdl.handle.net/10945/7317.
Full textHawman, Michael W. (Michael William). "Strategies for successful technology integration." Thesis, Massachusetts Institute of Technology, 1997. http://hdl.handle.net/1721.1/10546.
Full textNoonan, Andrea. "Middle School Teachers' Technology Integration." ScholarWorks, 2018. https://scholarworks.waldenu.edu/dissertations/5916.
Full textCarter, Joshua James. "Technology Integration and English Language Learners." Thesis, Lindenwood University, 2018. http://pqdtopen.proquest.com/#viewpdf?dispub=10748305.
Full textThe purpose of this study was to examine teachers’ levels of mobile device implementation and any measured differences in English Language Learners’ (ELLs’) performance in each modality of the ACCESS test. Researchers often support the use of mobile devices in the classroom, but this study was unique because of a combination of how it was focused solely on language development in ELLs, how classrooms were placed on the SAMR spectrum, and how student performance was analyzed in each modality measured by the ACCESS test (Budiman, 2014; Donahue, 2014; Marek, 2014; Mulcahy, 2017). Included in this study were 37 classrooms and corresponding teachers of grades kindergarten through four. For the 2016-2017 school year, participants taught in a district with both a one-to-one mobile device ratio and a high ELL population. Based on survey results, teachers’ reported instructional methods led to understanding of what levels of the SAMR spectrum students in each classroom were experiencing. The SAMR instructional levels were then compared to student ACCESS scores in each modality using an ANOVA as well as an additional TUKEY test when needed. The study yielded just one statistically significant ANOVA result. In third grade listening, SAMR level one classrooms were statistically different from SAMR level three classrooms but not level four classrooms (SAMR level zero and level two classrooms were not present in the particular data set). No other data set yielded statistically significant results between a SAMR instructional level and ACCESS scores in reading, speaking, listening, or writing modalities as well as students’ overall performance.
Hiebert, Patricia. "Supporting technology integration, a case study." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 2000. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape3/PQDD_0020/MQ49223.pdf.
Full textLewis, Dietrick. "The Principal as Technology Integration Leader." NSUWorks, 2011. http://nsuworks.nova.edu/gscis_etd/213.
Full textSoderquist, Geraldine Lee. "Teacher professional development in technology integration." CSUSB ScholarWorks, 2003. https://scholarworks.lib.csusb.edu/etd-project/2402.
Full textMunding, Andreas. "Interconnect technology for three-dimensional chip integration." Göttingen Cuvillier, 2007. http://d-nb.info/986311502/04.
Full textKozloski, Kristen C. Haslam Elizabeth L. "Principal leadership for technology integration : a study of principal technology leadership /." Philadelphia, Pa. : Drexel University, 2006. http://dspace.library.drexel.edu/handle/1860%20/886.
Full textFrance, Robert J. "The relationship between technology training and technology integration by technology education teachers in Wisconsin." Menomonie, WI : University of Wisconsin--Stout, 2004. http://www.uwstout.edu/lib/thesis/2004/2004francer.pdf.
Full textLindh, Cecilia. "Business Relationships and Integration of Information Technology." Doctoral thesis, Mälardalen University, School of Business, 2006. http://urn.kb.se/resolve?urn=urn:nbn:se:mdh:diva-143.
Full textIt is a well-established view that, over time, companies in a business-to-business setting develop long-lasting business relationships. The business relationship between two companies involves a wide range of exchanges on products, technical and economic issues. It also has a social content as it engages people in both companies. Business relationships are, therefore, argued to be founded on a varying extent of exchanges and content of behaviour. This thesis deals with the current and complex issue of the integration of information technology in such business relationships.
Integration in this thesis refers to when information technology is purposefully used and inseparable from the business relationship. A special standardized questionnaire was used to collect extensive empirical data on 353 business relationships between suppliers and one of their important customers. The results of the analysis of the data in the thesis show that high information technology integration, in terms of exchanges and behaviour, increases the efficiency of information exchanges in business relationships. Integration is also connected to the importance of business relationships for the development of information technology and increases a company’s knowledge on this technology. Furthermore, the results show that what is fundamental for the integration of information technology is its combination with the strength of the business relationship. Thereby, the integration of information technology has a wider impact on business relationships than simply facilitating higher efficiency under certain circumstances. It affects the general competence in using information technology, and allows new opportunities for the business relationship and the companies.
Through its rich empirical content, theoretical approach and proximity to current business situations, this thesis is of interest to researchers and students who wish to understand the employment of information technology in business relationships, or for business professionals who want to further understand their situation regarding information technology in order to make decisions about further employment.
Lo, Chi-lik Eric, and 盧至力. "Bridging data integration technology and e-commerce." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2003. http://hub.hku.hk/bib/B29360705.
Full textFan, Andy 1976. "An evaluation of three dimensional integration technology." Thesis, Massachusetts Institute of Technology, 1999. http://hdl.handle.net/1721.1/80085.
Full textFarmakidis, Constantine G. "Implications of Using a Technology Integration Model." University of Akron / OhioLINK, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=akron1384366122.
Full textMoody, Brendon Dean. "Educator Preparation Provider Training and Technology Integration." University of Findlay / OhioLINK, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=findlay1565163638160558.
Full textTaylor, Alan J. "Using a Moodle to leverage technology integration." Access to citation, abstract and download form provided by ProQuest Information and Learning Company; downloadable PDF file, 97 p, 2009. http://proquest.umi.com/pqdweb?did=1654492831&sid=4&Fmt=2&clientId=8331&RQT=309&VName=PQD.
Full textJames, M. Lovetta Wildemuth Barbara M. "Middle school teachers' understanding of technology integration." Chapel Hill, N.C. : University of North Carolina at Chapel Hill, 2009. http://dc.lib.unc.edu/u?/etd,2778.
Full textTitle from electronic title page (viewed Mar. 10, 2010). "... in partial fulfillment of the requirements for the degree of Doctor of Philosophy in the School of Information and Library Science." Discipline: Information and Library Science; Department/School: Information and Library Science, School of.
Yemothy, Nicole Elizabeth. "Improving Educational Technology Integration in the Classroom." ScholarWorks, 2015. https://scholarworks.waldenu.edu/dissertations/902.
Full textStokes, Nina C. "Technology Integration For Preservice Science Teacher Educators." Scholar Commons, 2010. https://scholarcommons.usf.edu/etd/1782.
Full textDe, Jong Stephanie Lyn. "Practicing teacher perceptions of technology and technology integration in K-12 education." CSUSB ScholarWorks, 2004. https://scholarworks.lib.csusb.edu/etd-project/2680.
Full textPine-Thomas, Joy Anne. "Educator's Technology Integration Barriers and Student Technology Preparedness as 21st Century Professionals." ScholarWorks, 2017. https://scholarworks.waldenu.edu/dissertations/3465.
Full textWang, Li. "Investigating How Participation In a Techonology-Based Project Has Influenced Education Faculty Members' Beliefs and Practices with Technology Integration: Factors That Influence Faculty Technology Integration and Implications for Faculty's Integration of Technology." ScholarWorks@UNO, 2002. http://scholarworks.uno.edu/td/5.
Full textMiller, Daniel R. Day Roger P. "Exploring the integration of technology in collegiate mathematics." Normal, Ill. Illinois State University, 1999. http://wwwlib.umi.com/cr/ilstu/fullcit?p9927772.
Full textTitle from title page screen, viewed July 19, 2006. Dissertation Committee: Roger Day (chair), Beverly S. Rich, Michael Plantholt, Sherry Meier, Patricia Klass. Includes bibliographical references (leaves 99-107) and abstract. Also available in print.
Tisell, Claes. "Integration of database technology and multibody system analysis." Doctoral thesis, Stockholm, 2000. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3041.
Full textLindmark, Johan. "Developing the anaerobic digestion process through technology integration." Doctoral thesis, Mälardalens högskola, Akademin för ekonomi, samhälle och teknik, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:mdh:diva-26081.
Full textHuang, Tzung-Shi. "Integration of III-nitride semiconductors with silicon technology." Thesis, University of Liverpool, 2003. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.400229.
Full textChristofi, Stelios. "Dynamic application integration using peer to peer technology." Thesis, City University London, 2003. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.397928.
Full textFuentes, J. A. "Transnational enterprises, technology and Central American economic integration." Thesis, University of Sussex, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.381570.
Full textFan, Andy 1976. "Three dimensional integration technology using copper wafer bonding." Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/37915.
Full textIncludes bibliographical references (p. 216-219).
With 3-D integration, the added vertical component could theoretically increase the device density per footprint ratio of a given chip by n-fold, provide a means of heterogeneous integration of devices fabricated from different technologies, and reduce the global RC delay to a non-factor in circuits by using smarter 3-D CAD tools for optimizing device placement. This thesis work will focus primarily on the development and realization of a viable 3-D flow fabricated within MTL. Specifically, the presentation will attempt on answering these questions in regards to 3-D: 1. What enabling technologies were needed for 3-D to work ? 2. Does it really work ? 3. Will the "3-D heat dissipation problem" prevent it from working ? 4. What applications is it good for ? Referring to the first item, a viable 3-D integration flow has been developed on both the wafer-and-die-level, and the enabling technologies were the following: Low temperature Cu-Cu thermocompression bonding, an aluminum-Cu based temporary laminate structure used stabilizing the handle wafer - SOI wafer bond, and tooling optimization of the die-die bonder setup in TRL.
(cont.,) Next, nominal feasibility of the 3-D flow was demonstrated by fabricating a 21-stage and 43-stage CMOS ring oscillators, where each single CMOS inverter / buffer stage was constructed by connecting NMOS-only devices from one substrate with PMOS-only devices from a separate substrate. Proof-of-concept was accomplished when all 92 Cu-Cu bonds, 204 thru-SOI Cu damascene vias, and 56 pairs of MOSFETs communicated simultaneously to produce a 2.75 MHz (43-stage) and 5.5 MHz (21-stage) oscillators, ringing rail-to-rail at 5 V Vdd under proper Vt adjustments on the SOI-PMOS using integrated backgates. Furthermore, to combat the perceived heat dissipation problem in 3-D, this work focused on using the Cu-Cu interlayer bond as heat dissipators, with Cu planes working as flux spreaders and Cu vias as direct heat conduits. Finally, 3-D RF passive integration onto existing chips can be made feasible, under certain device performance trade-offs, by using cobalt magnetic shielding, which offers at least a -10 dB throughout 0-20 GHz, with a max isolation of -24 dB at 13 GHz, at +4 dBm reference input power.
by Andy Fan.
Ph.D.
Fitzgerald, Andrew T. "Supporting teachers' integration of technology with e-learning." Thesis, California State University, Long Beach, 2015. http://pqdtopen.proquest.com/#viewpdf?dispub=1603340.
Full textTeachers need training to integrate technology into classroom curriculum, activities, and pedagogy. The adoption of the Common Core State Standards and statewide computer based assessments, coupled with technology’s rapid rate of innovation and change, has only increased the need to help support teachers’ development of these necessary skills. The purpose of this project was to create an online-based e-learning professional development training module for teachers to develop their technological, pedagogical, and content knowledge (TPACK) and skills. The design of the training module incorporated e-learning design principles, adult learning principles, and current research on developing teachers’ TPACK. To provide feedback on the design, teachers from two middle schools in Southern California were invited to use the training module, and were surveyed regarding their experiences. Results of the survey indicate participants gained knowledge and skills for using their school computer lab, integrating technology into their classroom instruction, and overall, were pleased with the e-learning training module.
Solé, Carulla Àurea. "Biochar production integration into Phoenix BioPower BTC technology." Thesis, KTH, Energiteknik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-246129.
Full textPhoenix BioPower technology BTC (Biomass fired TopCycle) integrates biomass gasification as a prior step to a TopCycle high pressure gas turbine. Additionally, steam is injected together with the product gas into the combustor, achieving high efficiencies and reducing overall costs while offering controllable and reliable renewable power. Heat recovery is implemented within the system by means of steam as a heat carrier, making optimised heat integration an added asset of the plant. The company has been funded to do a carbon negative power project, which aims to verify if the BTC technology can become the first scalable commercially viable technology offering carbon negative power, by generating a new separate revenue stream from biochar. By operating the BTC plant under different conditions, biochar can be produced along with the required fuel to run the gas turbine. This thesis presents a feasibility assessment of the integration of biochar production into the BTC 30MWe plant. Therefore, the integration of pyrolysis and gasification steps before the power island will be studied and analysed thermodynamically and further optimised to obtain the conditions under which high quality biochar is produced while ensuring power generation and heat recovery. A computational model using Aspen Plus® was built to validate the feasibility of the system from the technical point of view. The results of the simulation show an overall plant efficiency as high as 89-91%, and electrical efficiencies of 52-55%. While the model reveals that the system is slightly sensible to gasification temperature, pyrolysis temperature has a significant impact at the overall performance.
Schwiebert, Erin Lynn. "TECHNOLOGY INTEGRATION IN PRIMARY CLASSROOMS IN NORTHWEST OHIO." Bowling Green State University / OhioLINK, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=bgsu1288383598.
Full textDunlap, Craig G. "Effective Technology Integration: A Plan for Professional Development." Cedarville University / OhioLINK, 2002. http://rave.ohiolink.edu/etdc/view?acc_num=cedar1033055123.
Full textMADDIN, ELLEN A. "FACTORS THAT INFLUENCE TECHNOLOGY INTEGRATION IN ELEMENTARY INSTRUCTION." University of Cincinnati / OhioLINK, 2002. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1021931835.
Full textMaltez, Megan M. "Effects of technology integration in K-12 settings." View electronic thesis, 2008. http://dl.uncw.edu/etd/2008-2/maltezm/meganmaltez.pdf.
Full textBenkart, Peter. "3-dimensional chip integration technology and critical issues." Norderstedt BoD, Books on Demand, 2009. http://d-nb.info/998933112/04.
Full textMarkee, Lois J. "Technology Integration in Tennessee Twenty-first Century Classrooms." Digital Commons @ East Tennessee State University, 1998. https://dc.etsu.edu/etd/2945.
Full textMoran, Renee Rice, and Monica Billen. "Screencasts: The Integration of Reading, Writing, and Technology." Digital Commons @ East Tennessee State University, 2014. https://dc.etsu.edu/etsu-works/3592.
Full textZhu, Mingjie, and Qinghua Liu. "XAP Integration." Thesis, Växjö University, School of Mathematics and Systems Engineering, 2006. http://urn.kb.se/resolve?urn=urn:nbn:se:vxu:diva-996.
Full textAbstract
This bachelor thesis will present the XAP tool integration project. Apart from presenting the survey of
integration techniques that includes integration models and case tool models, we have conducted a
comparison of these models. Then we reason about their applicability in the XAP setting. We apply this
survey into the XAP tool integration project – integrate three tools in one IDE on data level. In this IDE,
the user can create a new project and use these three tools freely in the new created project. The
database among them is shared.
Jones, A. H. "Integration of multiple sensor systems." Thesis, University of Cambridge, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.383191.
Full textAl-Ghazo, Ali M. "Technology integration in university teachers' education programs in Jordan : comparisons of competencies, attitudes and perceptions toward integrating technology in the classroom /." Available to subscribers only, 2008. http://proquest.umi.com/pqdweb?did=1559858801&sid=12&Fmt=2&clientId=1509&RQT=309&VName=PQD.
Full textLuo, Jun. "Integration of metallic source/drain contacts in MOSFET technology." Doctoral thesis, KTH, Integrerade komponenter och kretsar, 2010. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-13136.
Full textQC20100708
NEMO, NANOSIL, SINANO
Hedberg, Henry E. "Technology integration professional development for teachers strategies for action /." [Denver, Colo.] : Regis University, 2008. http://165.236.235.140/lib/HHedberg2008.pdf.
Full textPuttaswamy, Kiran. "Designing high-performance microprocessors in 3-dimensional integration technology." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/19759.
Full textCommittee Chair: Loh, Gabriel H.; Committee Co-Chair: Lee, Hsien-Hsin S.; Committee Member: Lim, Sung Kyu; Committee Member: Prvulovic, Milos; Committee Member: Yalamanchili, Sudhakar; Committee Member: Yoder, Douglas.
Mills, John Barry. "The role of information technology in cross-functional integration." Thesis, University of the West of England, Bristol, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.283597.
Full textWang, Kai. "Novel process integration schemes for Cu/LOW-k technology." Thesis, University of Newcastle Upon Tyne, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.446189.
Full textLee, Thomas Y. (Thomas Yupoo). "Attribution principles for data integration : technology and policy perspectives." Thesis, Massachusetts Institute of Technology, 2002. http://hdl.handle.net/1721.1/29251.
Full textIncludes bibliographical references (p. [229]-250).
This thesis addresses problems of attribution that arise from the data integration that is exemplified by data re-use and re-distribution on the Web. We present two different perspectives. We begin with a simple definition of attribution, asking what data are we interested in and where does it come from? A formal model and its properties are defined, implementation in an extended relational algebra is described, and application to semistructured data on the Web is discussed. However, because the problem is more than simply what and where, we then expand the scope of our analysis. From the perspective of intellectual property policies, we adopt a broader view of the attribution problem space. A policy analysis that surveys the status quo policy landscape and stakeholder interests is followed by specific policy recommendations. Informed by our technology perspective, we offer two new arguments to support misappropriation as a policy approach to the attribution problem space. Our formal model of attribution is developed in the established foundation of the Domain Relational Calculus (DRC). Three distinct types of attribution are identified: comprehensive, source, and relevant. For each type, we consider the attribution of equivalent DRC expressions, attribution for composed queries, and granularity. An algebra is presented to implement the model. The extended algebra is closed, reduces to the standard relational algebra, and is a consistent extension of the standard algebra.
(cont.) The policy perspective encompasses not only what and where but also integration architectures and the relationships between data providers and users. Information technologies separate the processes and products of data gathering from data selection and presentation. Where the latter is addressed by copyright, the former is not addressed at all. Based upon two traditional, legal-economic frameworks, the asymmetric Prisoner's Dilemma and Entitlement Theory, we argue for a policy of misappropriation to support integration and attribution for data.
by Thomas Y. Lee.
Ph.D.
Moral, Cejudo Alberto Jose del. "Integration of vertical Single Electron Transistor into CMOS technology." Doctoral thesis, Universitat Autònoma de Barcelona, 2021. http://hdl.handle.net/10803/673762.
Full textEsta tesis presenta las investigaciones realizadas hacia la integración de transistores verticales de un solo electrón (SET) en tecnología metal-óxido-semiconductor complementario (CMOS). Dos de las principales motivaciones de la industria de semiconductores son la miniaturización de dispositivos y la reducción de consumo de energía. En los nodos más avanzados, las arquitecturas tridimensionales han ganado una importancia significativa para aumentar la densidad de integración, siendo los dispositivos dispuestos verticalmente los candidatos más adecuados para las generaciones más recientes. Por otro lado, los dispositivos de un solo electrón son ejemplos de circuitos de bajo consumo energético. En este trabajo, se aborda la fabricación de un SET basado en un nanohilo vertical y su co-integración con tecnología CMOS. El punto de partida es un nanopilar de Si/SiO/Si con nanopuntos de Si en la capa intermedia de SiO2, que actúan como puntos cuánticos del sistema. Los electrodos de puerta y drenador se sitúan alrededor del óxido intermedio y en contacto con la parte superior del pilar, respectivamente. La integridad del pilar y el contacto de sus electrodos se validan mediante caracterización estructural. Aunque la integración SET en producción a gran escala es todavía un reto, su combinación con tecnología CMOS se beneficia de la madurez tecnológica del procesamiento de circuitos integrados, superando al mismo tiempo los inconvenientes intrínsecos del SET como ruido de fondo o la inestabilidad del dispositivo. Este trabajo también presenta la fabricación monolítica y compatible con CMOS de un transistor planar convencional co-integrado con un SET vertical. La fabricación del proceso se adapta para cumplir las restricciones impuestas por el SET prefabricado, como presupuesto térmico reducido, capas de protección o dopaje modificado. Se demuestra la fabricación monolítica de SET vertical y transistores planares convencionales; se preserva la integridad del pilar y los transistores fabricados funcionan en condiciones óptimas para la compatibilidad SET.
This thesis presents the investigations performed towards the integration of Single Electron Transistor (SET) into Complementary Metal-Oxide-Semiconductor (CMOS) technologies. Two of the main drives in semiconductor industry are device miniaturization and power consumption reduction. In the most advanced nodes, three-dimensional architectures have gained significant importance to increase the integration density, being vertically arranged devices the most suitable candidates for the ultimate generations. On the other hand, single electron devices are examples of ultra-low power consumption circuits. In this work, the fabrication of a SET based on a vertical nanowire and its co-integration with CMOS technology is addressed. The starting point is a Si/SiO2/Si nanopillar with Si nanodots in the intermediate SiO2 layer, acting as quantum dot of the system. The subsequent gate and drain electrodes are placed all-around the embedded oxide and on contact with the pillar cap, respectively. Pillar integrity and its electrodes contacting are validated by structural characterization. While SET integration in large-scale production is still challenging, its combination with CMOS technology benefits from the technological maturity of integrated circuits processing, overtaking SET intrinsic drawbacks as background noise or device instability. This work also reports the CMOS compatible and monolithic fabrication of a conventional planar transistor co-integrated with a vertical SET. The process fabrication is adapted to fulfil the restrictions imposed by the pre-fabricated SET, such as reduced thermal budget, protective layers and modified doping. The monolithic fabrication of vertical SET and planar transistors is demonstrated; the pillar integrity is preserved, and the fabricated transistors operate at optimum conditions for SET compatibility.
Universitat Autònoma de Barcelona. Programa de Doctorat en Enginyeria Electrònica i de Telecomunicació
Kennedy, Tyler Douglas. "Tech. is More: Holistic Integration of Technology into Housing." University of Cincinnati / OhioLINK, 2021. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1623250571183889.
Full textGiammarco, Kristin. "Data centric integration and analysis of information technology architectures." Thesis, Monterey, California. Naval Postgraduate School, 2007. http://hdl.handle.net/10945/2989.
Full textwith specific recommendations for the Army Architecture Integration Process. A key recommendation is the implementation of a collaborative environment for net-centric architecture integration and analysis, to provide a rich and agile data foundation for systems engineering and System of Systems engineering analyses, which are required to optimize the DoD Enterprise Architecture as a whole. Other conclusions, recommendations, and areas for future work are also presented.
US Army (USA) author.