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Relevant bibliographies by topics / Theory of thermal stresses

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Academic literature on the topic 'Theory of thermal stresses'

Author: Grafiati

Published: 28 May 2022

Last updated: 31 July 2025

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Journal articles on the topic "Theory of thermal stresses"

1

Ozakin, Arkadas, and Arash Yavari. "A geometric theory of thermal stresses." Journal of Mathematical Physics 51, no. 3 (2010): 032902. http://dx.doi.org/10.1063/1.3313537.

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Kushnir, Roman. "Thermal Stresses – Advanced Theory and Applications." Journal of Thermal Stresses 33, no. 1 (2009): 76–78. http://dx.doi.org/10.1080/01495730903538421.

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Loo, C. E., and J. Bridgwater. "Theory of thermal stresses and deposit removal." Powder Technology 42, no. 1 (1985): 55–65. http://dx.doi.org/10.1016/0032-5910(85)80038-3.

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Qiu, Yuanying, Xun Qiu, Xianghu Guo, Dian Wang, and Lijie Sun. "Thermal Analysis of Si/GaAs Bonding Wafers and Mitigation Strategies of the Bonding Stresses." Advances in Materials Science and Engineering 2017 (2017): 1–8. http://dx.doi.org/10.1155/2017/4903924.

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In order to effectively reduce the thermal stresses of Si/GaAs bonding wafers during their annealing process, first of all, based on E. Suhir’s bimaterial thermal stress theory, the thermal stresses in the wafer bonding interfaces are analyzed and the thermal stress distribution formulas are obtained. Then, the thermal stress distribution curves of Si/GaAs bonding interfaces are investigated by finite element method (FEM) and are compared with the results from E. Suhir’s bimaterial thermal stress theory. Finally, some effective strategies are proposed to reduce the thermal stresses in the bond

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Bogatov, N. M. "Gauge Field Theory of Dislocation Formation by Thermal Stresses." physica status solidi (b) 228, no. 3 (2001): 651–61. http://dx.doi.org/10.1002/1521-3951(200112)228:3<651::aid-pssb651>3.0.co;2-k.

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Xie, Weidong, and Suresh K. Sitaraman. "Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures." Journal of Electronic Packaging 122, no. 1 (1999): 61–66. http://dx.doi.org/10.1115/1.483133.

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The presence of dissimilar material systems and thermal gradients introduce thermal stresses in multi-layered electronic assemblies and packages during fabrication and operation. The high stress gradients near the free edge of bonding interfaces of such structures may cause cracking and delamination leading to the failure or malfunction of electronic assemblies and packages. A simple but accurate engineering approach for the calculation of interlaminar thermal stresses due to thermal mismatch in multi-layered structures is needed so that designers can determine interlaminar thermal stresses ea

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Jiang, Z. Q., Y. Huang, and A. Chandra. "Thermal Stresses in Layered Electronic Assemblies." Journal of Electronic Packaging 119, no. 2 (1997): 127–32. http://dx.doi.org/10.1115/1.2792218.

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Thermal stresses in layered electronic assemblies are one of the causes of the mechanical failure of electronic packages. A simple but accurate method of estimating these thermal stresses is needed for the design of these packages. A simple approach based on beam theory exists, but it suffers from nonequilibrium of the peeling stress distribution. An improved method that overcomes this drawback is proposed here. For layered electronics with thin adhesives, simple analytical expressions are obtained for interfacial shear stress and peeling stress, as well as for other stress components. The fin

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Thakare, S., Y. Panke, and K. Hadke. "Application of Fractional Order Theory of Thermoelasticity in an Elliptical Disk and Associated Thermal Stresses." International Journal of Applied Mechanics and Engineering 25, no. 3 (2020): 169–80. http://dx.doi.org/10.2478/ijame-2020-0041.

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AbstractIn this article, a time fractional-order theory of thermoelasticity is applied to an isotropic homogeneous elliptical disk. The lower and upper surfaces of the disk are maintained at zero temperature, whereas the sectional heat supply is applied on the outer curved surface. Thermal deflection and associated thermal stresses are obtained in terms of Mathieu function of the first kind of order 2n. Numerical evaluation is carried out for the temperature distribution, Thermal deflection and thermal stresses and results of the resulting quantities are depicted graphically.

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Bagdasaryan, Vazgen, Monika Wągrowska, and Olga Szlachetka. "Displacements Caused by the Temperature in Multicomponent, Multi-Layered Periodic Material Structures." Mechanics and Mechanical Engineering 22, no. 3 (2020): 809–20. http://dx.doi.org/10.2478/mme-2018-0063.

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AbstractThe present study aims to analyse a two-dimensional problem of displacements in theory of thermal stresses for multicomponent, multi-layered periodic composites. The model equations are obtained within the framework of the tolerance modelling procedure. These equations allow to determine the distribution of displacements caused by the temperature field in the theory of thermal stresses. The paper presents an example of a solution of a boundary value problem.

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Suhir, E. "Interfacial Stresses in Bimetal Thermostats." Journal of Applied Mechanics 56, no. 3 (1989): 595–600. http://dx.doi.org/10.1115/1.3176133.

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The magnitude and the distribution of the interfacial stresses in thermostat-like structures are determined on the basis of an elementary beam theory, with consideration of both the longitudinal and the transverse (“through-thickness”) interfacial compliances of the thermostat strips. The suggested approach is applicable, generally speaking, to any elongated lap shear assembly, subjected to thermal or external loading.

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Dissertations / Theses on the topic "Theory of thermal stresses"

1

Yee, Kuo-chung. "Process-induced residual stresses in a continuously-cured, hoop-wound thermoset composite cylinder : theory and experiments /." Digital version accessible at:, 1998. http://wwwlib.umi.com/cr/utexas/main.

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Ковальов, Юрій Дмитрович, Юрий Дмитриевич Ковалев, Yurii Dmytrovych Kovalov та Н. В. Бондарь. "Математическое моделирование термоупругого состояния изотропного цилиндра конечной длины". Thesis, Видавництво СумДУ, 2011. http://essuir.sumdu.edu.ua/handle/123456789/10498.

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Wikström, Adam. "Modeling of stresses and deformation in thin film and interconnect line structures." Doctoral thesis, KTH, Solid Mechanics, 2001. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3224.

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Teeuw, Dirk Herbert Johan. "Engineering ceramics and thermal stresses." [S.l. : [Groningen] : s.n.] ; [University Library Groningen] [Host], 1997. http://irs.ub.rug.nl/ppn/164402217.

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Keene, Frank W. "Thermal stresses in closed spherical shells /." Online version of thesis, 1991. http://hdl.handle.net/1850/11039.

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Greving, Daniel James. "Residual stresses and thermal spray coating performance /." Access abstract and link to full text, 1995. http://0-wwwlib.umi.com.library.utulsa.edu/dissertations/fullcit/9610608.

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Gill, Stephen Charles. "Residual stresses in plasma sprayed deposits." Thesis, University of Cambridge, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.386108.

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Sham, Man-Lung. "Underfill adhesion characteristics, residual stresses and analysis of thermal stresses in flip chip packages /." View Abstract or Full-Text, 2003. http://library.ust.hk/cgi/db/thesis.pl?MECH%202003%20SHAM.

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Tao, Jiyue, and Asnaf Aziz. "Simulation of thermal stresses in a disc brake." Thesis, Tekniska Högskolan, Högskolan i Jönköping, JTH. Forskningsmiljö Produktutveckling - Simulering och optimering, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-19163.

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The heat flux produced from the friction between a disc and pad system leads to a high temperature which causes thermal stresses in the disc and after a number of repeated braking cycles, cracks might be initiated. The finite element analysis (FEA) is performed to determine the temperatures profile in the disc and to analyze the stresses for the repeated braking, which could be used to calculate the fatigue life of a disc.Sequentially coupled approach is used for thermo-mechanical problem and the problem is divided into two parts, heat analysis and thermal stress analysis. The heat analysis is

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Obst, Andreas W. "Thermal stresses in coatings on carbon-carbon composites." Diss., Virginia Tech, 1995. http://hdl.handle.net/10919/39111.

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Books on the topic "Theory of thermal stresses"

1

Boley, Bruno A. Theory of thermal stresses. Dover Publications, 1997.

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Boley, Bruno A. Theory of thermal stresses. R.E. Krieger Pub. Co., 1985.

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Reza Eslami, M., Richard B. Hetnarski, Józef Ignaczak, Naotake Noda, Naobumi Sumi, and Yoshinobu Tanigawa. Theory of Elasticity and Thermal Stresses. Springer Netherlands, 2013. http://dx.doi.org/10.1007/978-94-007-6356-2.

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Hetnarski, Richard B., and M. Reza Eslami. Thermal Stresses—Advanced Theory and Applications. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-10436-8.

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Hetnarski, Richard B. Thermal stresses: Advanced theory and applications. Springer, 2009.

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United States. National Aeronautics and Space Administration., ed. A transversely isotropic thermoelastic theory. National Aeronautics and Space Administration, 1988.

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Sluzalec, Andrzej. Theory of thermomechanical processes in welding. Springer, 2005.

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Eslami, M. Reza. Theory of Elasticity and Thermal Stresses: Explanations, Problems and Solutions. Springer Netherlands, 2013.

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B, Hetnarski Richard, and Tanigawa Yoshinobu, eds. Thermal stresses. 2nd ed. Taylor & Francis, 2003.

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B, Hetnarski Richard, ed. Thermal stresses V. Lastran Corp., 1999.

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Book chapters on the topic "Theory of thermal stresses"

1

Tauchert, Theodore R. "Plates, Classical Theory." In Encyclopedia of Thermal Stresses. Springer Netherlands, 2014. http://dx.doi.org/10.1007/978-94-007-2739-7_189.

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Dökmeci, M. Cengiz, and Gülay Altay. "Piezothermoelasticity: Fundamental Theory." In Encyclopedia of Thermal Stresses. Springer Netherlands, 2014. http://dx.doi.org/10.1007/978-94-007-2739-7_343.

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Făciu, Cristian. "Thermoelastic Bar Theory." In Encyclopedia of Thermal Stresses. Springer Netherlands, 2014. http://dx.doi.org/10.1007/978-94-007-2739-7_889.

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Rossikhin, Yury A., and Marina V. Shitikova. "Ray Expansion Theory." In Encyclopedia of Thermal Stresses. Springer Netherlands, 2014. http://dx.doi.org/10.1007/978-94-007-2739-7_940.

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Svanadze, Merab. "Potentials in Thermoelasticity Theory." In Encyclopedia of Thermal Stresses. Springer Netherlands, 2000. http://dx.doi.org/10.1007/978-94-007-2739-7_537.

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Kant, Tarun, and Sandeep S. Pendhari. "High-Order Theory, Composite Plates." In Encyclopedia of Thermal Stresses. Springer Netherlands, 2014. http://dx.doi.org/10.1007/978-94-007-2739-7_168.

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Abd El-Latief, A. M. "Fractional-Order Theory of Thermoelasticity." In Encyclopedia of Thermal Stresses. Springer Netherlands, 2014. http://dx.doi.org/10.1007/978-94-007-2739-7_366.

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Svanadze, Merab. "Fundamental Solutions in Thermoelasticity Theory." In Encyclopedia of Thermal Stresses. Springer Netherlands, 1996. http://dx.doi.org/10.1007/978-94-007-2739-7_536.

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Barretta, Raffaele, and Annalisa Barretta. "Orthotropic Saint-Venant Beam Theory." In Encyclopedia of Thermal Stresses. Springer Netherlands, 2014. http://dx.doi.org/10.1007/978-94-007-2739-7_883.

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Zhen, Wu, and Chen Wanji. "High-Order Theory, Laminated Plate Buckling." In Encyclopedia of Thermal Stresses. Springer Netherlands, 2014. http://dx.doi.org/10.1007/978-94-007-2739-7_169.

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Conference papers on the topic "Theory of thermal stresses"

1

Luo, Yaping, and Ganesh Subbrayyan. "An improved estimate for thermal stresses in multi-layer assemblies." In 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM). IEEE, 2008. http://dx.doi.org/10.1109/itherm.2008.4544354.

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Andritschky, M., V. Teixeira, and D. Stöver. "Thermal Residual Stresses in Functionally Gradient Coatings." In ITSC 1997, edited by C. C. Berndt. ASM International, 1997. http://dx.doi.org/10.31399/asm.cp.itsc1997p0847.

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Abstract The present contribution concerns with a numerical modelling of the residual stress distribution within a multilayered coating system which consists of a functionally gradient material (FGM). The structure of the graded system is made of a ceramic layer and a metallic layer, where between them there is an interlayer which is a graded composite made of the metal and ceramic. The composition changes gradually from 0% ceramic to 100% ceramic. This graded interlayer was modelled as a serie of perfectly bonded finite thin layers, each having slightly different material properties. We analy

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Basavaraju, Chakrapani. "Thermal Stresses at Dissimilar Pipe-Stanchion Interfaces." In ASME/JSME 2004 Pressure Vessels and Piping Conference. ASMEDC, 2004. http://dx.doi.org/10.1115/pvp2004-2611.

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High temperature steam lines in power plant piping systems are often supported by the use of pipe support stanchions welded to the steam pipe. The end of the pipe stanchion has a steel plate welded to it, which typically slides on rack steel. The temperature of the stanchion drops from the process pipe interface along the length of the stanchion. The material for the process pipe carrying high temperature steam can be stainless steel, alloy steel, or carbon steel. The material for the stanchion can also be stainless steel, alloy steel, or carbon steel. It is of course cheaper to use carbon or

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He, Jin. "Valve Body Thermal Stress Control While Warming Up." In ASME Turbo Expo 2017: Turbomachinery Technical Conference and Exposition. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/gt2017-64126.

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Quasi-stationary theory is applied to a simplified one-dimensional solid to work out warm-up thermal stress [1]. This paper verifies the quasi-stationary state exits in the three-dimensional valve body warm-up process, and the relationship of the thermal stress and the temperature difference is similar. Dynamic analysis of warming-up at constant temperature increasing speed shows that: the ratio of the thermal stresses and the temperature difference gets the max value at the quasi-stationary state. The ratio is not influenced by the surface heat transfer coefficient, the material thermal diffu

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de Almeida, Sérgio Frascino Müller, and Jorn S. Hansen. "Free Vibration Analysis of Composite Plates With Tailored Thermal Residual-Stresses." In ASME 1997 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1997. http://dx.doi.org/10.1115/imece1997-0721.

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Abstract Thermal residual-stresses introduced during manufacture and their effect on the free vibration of stringer stiffened composite plates is investigated. The principal idea in the work is to include stiffeners on the perimeter of a composite plate in which the laminate for the stiffeners and the plate are different. Such an arrangement yields manufacturing induced thermal residual-stresses which result from the difference in manufacturing and operating temperatures as well as the difference in thermal expansion coefficients and elastic properties of the plate and the stiffeners. The anal

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Barsanescu, Paul, Raimond Grimberg, and Petru Carlescu. "Generation of Residual Stresses in Composites." In ASME 2008 9th Biennial Conference on Engineering Systems Design and Analysis. ASMEDC, 2008. http://dx.doi.org/10.1115/esda2008-59542.

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The paper presents a new mechanical modeling of thermal mismatch residual stresses in composites. Some equations which can be easy used in order to calculate the three-dimensional state of residual stresses in fibers and matrix, in a unidirectional composite lamina, are carried out or adopted on the basis of a composite cylinder model, developed in Theory of Elasticity. Using these equations, residual stresses developed due to differential thermal shrinkage as it cools down from the high processing temperature to the ambient temperature can be predicted.

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Berreth, K., M. Buchmann, R. Gadow, and J. Tabellion. "Evaluation of Residual Stresses in Thermal Sprayed Coatings." In ITSC 1999, edited by E. Lugscheider and P. A. Kammer. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 1999. http://dx.doi.org/10.31399/asm.cp.itsc1999p0670.

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Abstract Thermal spraying offers the possibility of applying functional metal, ceramic or cermet coatings to components with different geometries and materials and significantly improving their thermal, mechanical, and chemical properties. The performance in operation as well as failure due to deformation, cracks, and delamination are mostly determined by the internal stress state within the coated components. This paper reviews coating developments on light metal and glass substrates, sprayed with different atmospheric plasma spray process spray parameters are reviewed. The results show that

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Gerdeen, James C. "Analysis of Thermal Stresses in a Layered Circuit Board." In ASME 2001 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2001. http://dx.doi.org/10.1115/imece2001/epp-24734.

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Abstract When choosing materials for a printed circuit board (PCB), it appears that a common misconception is that the coefficients of thermal expansion should be matched as closely as possible to minimize the stresses. In this paper it is shown that this is not necessarily true. A one-dimensional thermal stress analysis is considered for a printed circuit board (PCB) with N layers. Bending is neglected and average axial normal stresses and shear stresses are accounted for. It is shown that the solution for the shear stresses between layers can be written in the form of a difference equation (

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Asadkarami, Ali, and Wolf Reinhardt. "Shakedown at Thermal Discontinuities Involving Thermal Membrane and Thermal Bending Stress." In ASME 2012 Pressure Vessels and Piping Conference. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/pvp2012-78660.

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The current ASME Code Section III NB-3200 rules on thermal stress ratchet require that the thermal stress must be less than the ratchet condition that Bree established for a cyclic pure thermal bending stress as a function of the level of primary membrane stress. It has been shown that this method can predict shakedown when elastic-perfectly plastic analysis shows ratcheting. However, there is also conservatism in the Code rules because the highest stresses that dominate the evaluation of a component are typically found at discontinuities, where there is a stress gradient at least in the axial

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Lin, Q., F. Jiang, X. Q. Wang, et al. "MEMS Thermal Shear-Stress Sensors: Experiments, Theory and Modeling." In 2000 Solid-State, Actuators, and Microsystems Workshop. Transducer Research Foundation, Inc., 2000. http://dx.doi.org/10.31438/trf.hh2000.74.

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Reports on the topic "Theory of thermal stresses"

1

Stumpf, Stacy, Laura Ploughe, Christopher Calvo, Laura Ploughe, Stacy Stumpf, and Christopher Calvo. Long-term trend in the aquatic macroinvertebrate community of the Mancos River at Mesa Verde National Park: Aquatic macroinvertebrate monitoring 2008-2019. National Park Service, 2024. http://dx.doi.org/10.36967/2306058.

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The Southern Colorado Plateau Inventory and Monitoring Network monitors status and long-term trends in the aquatic macroinvertebrate community and associated habitat in order to track changes in the ecological integrity of stream ecosystems. This report investigates changes in key aquatic macroinvertebrate community indices and physical habitat metrics collected from two long-term monitoring sites on the Mancos River in Mesa Verde National Park, Colorado. Results suggest that both monitoring sites have experienced periods of thermal and hydrologic stress. These stresses occur concurrently and

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Yahav, Shlomo, John McMurtry, and Isaac Plavnik. Thermotolerance Acquisition in Broiler Chickens by Temperature Conditioning Early in Life. United States Department of Agriculture, 1998. http://dx.doi.org/10.32747/1998.7580676.bard.

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The research on thermotolerance acquisition in broiler chickens by temperature conditioning early in life was focused on the following objectives: a. To determine the optimal timing and temperature for inducing the thermotolerance, conditioning processes and to define its duration during the first week of life in the broiler chick. b. To investigate the response of skeletal muscle tissue and the gastrointestinal tract to thermal conditioning. This objective was added during the research, to understand the mechanisms related to compensatory growth. c. To evaluate the effect of early thermo cond

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Trummer, D. J., and M. A. Gerhard. SCANS (Shipping Cask ANalysis System): A microcomputer based analysis system for shipping cask design review: Volume 5, Theory Manual: Thermal/pressure stress analysis. Office of Scientific and Technical Information (OSTI), 1989. http://dx.doi.org/10.2172/6303121.

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Duerr, Joachim. Finite element analysis of thermal stresses in semiconductor devices. Portland State University Library, 2000. http://dx.doi.org/10.15760/etd.6099.

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Rosenfeld, Hart, and Zulfiqar. L51994 Acceptance Criteria for Mild Ripples in Pipeline Field Bends. Pipeline Research Council International, Inc. (PRCI), 2003. http://dx.doi.org/10.55274/r0010395.

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Field bends in large diameter pipe are routinely used in the construction of oil and gas pipelines. Mild ripples along the intrados are often unavoidable where such bends have a high D/t or high yield strength. Present regulations and industry standards differ in their treatment of mild ripples, ranging from silence to prohibition, depending upon interpretation. Consequently, the application of acceptance standards for such features is inconsistent, leading to variable standards of inspection and probable scrapping of otherwise sound bends. Finite element analysis (FEA) was used to estimate th

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Underwood, J. H., A. P. Parker, E. Troiano, G. N. Vigilante, and M. D. Witherell. Fatigue and Hydrogen Cracking in Cannons With Mechanical and Thermal Residual Stresses. Defense Technical Information Center, 2003. http://dx.doi.org/10.21236/ada413678.

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Bezbaruah, R. Determination of cohesive and normal stresses and simulation of fluidization using kinetic theory. Office of Scientific and Technical Information (OSTI), 1991. http://dx.doi.org/10.2172/6127666.

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Neilsen, Michael K., Kevin N. Austin, Douglas Brian Adolf, Scott W. Spangler, Matthew Aaron Neidigk, and Robert S. Chambers. Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses. Office of Scientific and Technical Information (OSTI), 2011. http://dx.doi.org/10.2172/1022184.

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Guarino, V. Calculation of C5 stresses and deflections in C5 due to thermal and pressure loading. Office of Scientific and Technical Information (OSTI), 2008. http://dx.doi.org/10.2172/924697.

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Chambers, D. H., T. J. Karr, J. R. Morris, P. G. Cramer, J. A. Viecelli, and A. K. Gautesen. Linear theory of uncompensated thermal blooming in turbulence. Office of Scientific and Technical Information (OSTI), 1989. http://dx.doi.org/10.2172/6066251.

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