Relevant bibliographies by topics / Thermal field modeling

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Thermal field modeling'

Author: Grafiati
Published: 30 May 2022
Last updated: 31 May 2022

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Journal articles on the topic "Thermal field modeling"

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Liu, Xue-Ming, Han-Yi Zhang, Yi-Li Guo, Xiao-Ping Zheng, and Yan-He Li. "Modeling of Thermal/Electric-Field Poling." Japanese Journal of Applied Physics 40, Part 2, No. 8A (2001): L807—L809. http://dx.doi.org/10.1143/jjap.40.l807.

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Yushchenko, N. L. "CURRENT STATE OF DEVELOPMENT IN THE FIELD OF ECONOMIC AND MATHEMATICAL MODELING OF THERMAL POWER." SCIENTIFIC BULLETIN OF POLISSIA 2, no. 1(9) (2017): 24–31. http://dx.doi.org/10.25140/2410-9576-2017-2-1(9)-24-31.

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Jaffe, T. R. "Multiwavelength Magnetic Field Modeling." Proceedings of the International Astronomical Union 10, H16 (2012): 401. http://dx.doi.org/10.1017/s1743921314011703.

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AbstractWe model the large-scale Galactic magnetic fields, including a spiral arm compression to generate anisotropic turbulence, by comparing polarized synchrotron and thermal dust emission. Preliminary results show that in the outer Galaxy, the dust emission comes from regions where the fields are more ordered than average while the situation is reversed in the inner Galaxy. We will attempt in subsequent work to present a more complete picture of what the comparison of these observables tells us about the distribution of the components of the magnetized ISM and about the physics of spiral arm shocks and turbulence.
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Huang, Guang Yu, and Cher Ming Tan. "Device level electrical-thermal-stress coupled-field modeling." Microelectronics Reliability 46, no. 9-11 (2006): 1823–27. http://dx.doi.org/10.1016/j.microrel.2006.07.076.

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Ancona, M. G. "Modeling of thermal effects in silicon field emitters." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 14, no. 3 (1996): 1918. http://dx.doi.org/10.1116/1.588955.

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Litvinov, D. O., O. O. Shlyanin, Т. V. Bondarchuk, O. V. Stremydlovska, and Riham Matar. "SCHEME-FIELD MODELING OF THERMAL PROCESSES IN INDUCTION MOTORS." Electrical Engineering and Power Engineering, no. 1 (July 14, 2017): 71–78. http://dx.doi.org/10.15588/1607-6761-2017-1-9.

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Gilbert, K. M., W. B. Handler, and B. A. Chronik. "Thermal modeling of resistive magnets for field-cycled MRI." Concepts in Magnetic Resonance Part B: Magnetic Resonance Engineering 26B, no. 1 (2005): 56–66. http://dx.doi.org/10.1002/cmr.b.20035.

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Tarnawski, V. R., T. Momose, M. L. McCombie, and W. H. Leong. "Canadian Field Soils III. Thermal-Conductivity Data and Modeling." International Journal of Thermophysics 36, no. 1 (2014): 119–56. http://dx.doi.org/10.1007/s10765-014-1793-z.

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Herreinstein, A. V., E. A. Herreinstein, and N. Mashrabov. "Modeling a Rotating Circle Thermal Field with a Thermal Source on the Edge." Procedia Engineering 129 (2015): 317–20. http://dx.doi.org/10.1016/j.proeng.2015.12.068.

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Lu, Dawei, Ananda Das, and Wounjhang Park. "Direct modeling of near field thermal radiation in a metamaterial." Optics Express 25, no. 11 (2017): 12999. http://dx.doi.org/10.1364/oe.25.012999.

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Dissertations / Theses on the topic "Thermal field modeling"

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Donmezer, Fatma. "Multiscale electro-thermal modeling of AlGaN/GaN heterostructure field effect transistors." Diss., Georgia Institute of Technology, 2013. http://hdl.handle.net/1853/53139.

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Understanding the magnitude of the temperature in AlGaN/GaN heterostructure fi eld e ffect transistors(HFETs) is a critical aspect of understanding their reliability and providing proper thermal management. At present, most models used to determine the temperature rise in these devices are based on continuum based heat conduction. However, in such devices, the heat generation region can be on the order of or smaller than the phonon mean free path of the heat carriers, and thus, such models may under predict the temperature. The aim of this work is towards building a multiscale thermal model that will allow for the prediction of heat transport from ballistic-diffusive phonon transport near the heat generation region and diffusive transport outside of this zone. First, a study was performed to determine the appropriate numerical solution to the phonon Boltzmann transport equation followed by its integration into a multiscale thermal scheme. The model, which utilizes a Discrete Ordinates Solver, was developed for both gray and non-gray phonon transport. The scheme was applied to the solution of speci fic test problems and then finally to the electrothermal modeling of AlGaN/GaN HFETs under various electrical bias conditions.
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Christensen, Adam Paul. "Multiscale modeling of thermal transport in gallium nitride microelectronics." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31681.

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Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2010.<br>Committee Chair: Samuel Graham; Committee Member: Donald Dorsey; Committee Member: Douglas Yoder; Committee Member: Michael Leamy; Committee Member: Sankar Nair; Committee Member: Zhuomin Zhang. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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James, William Thomas. "Electro-thermal-mechanical modeling of GaN HFETs and MOSHFETs." Thesis, Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/41212.

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High power Gallium Nitride (GaN) based field effect transistors are used in many high power applications from RADARs to communications. These devices dissipate a large amount of power and sustain high electric fields during operation. High power dissipation occurs in the form of heat generation through Joule heating which also results in localized hot spot formation that induces thermal stresses. In addition, because GaN is strongly piezoelectric, high electric fields result in large inverse piezoelectric stresses. Combined with residual stresses due to growth conditions, these effects are believed to lead to device degradation and reliability issues. This work focuses on studying these effects in detail through modeling of Heterostructure Field Effect Transistors (HFETs) and metal oxide semiconductor hetero-structure field effect transistor (MOSHFETs) under various operational conditions. The goal is to develop a thorough understanding of device operation in order to better predict device failure and eventually aid in device design through modeling. The first portion of this work covers the development of a continuum scale model which couples temperature and thermal stress to find peak temperatures and stresses in the device. The second portion of this work focuses on development of a micro-scale model which captures phonon-interactions at the device scale and can resolve local perturbations in phonon population due to electron-phonon interactions combined with ballistic transport. This portion also includes development of phonon relaxation times for GaN. The model provides a framework to understand the ballistic diffusive phonon transport near the hotspot in GaN transistors which leads to thermally related degradation in these devices.
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Sen, Debamoy. "Coupled Field Modeling of Gas Tungsten Arc Welding." Diss., Virginia Tech, 2012. http://hdl.handle.net/10919/38820.

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Welding is used extensively in aerospace, automotive, chemical, manufacturing, electronic and power-generation industries. Thermally-induced residual stresses due to welding can significantly impair the performance and reliability of welded structures. Numerical simulation of weld pool dynamics is important as experimental measurements of velocities and temperature profiles are difficult due to the small size of the weld pool and the presence of the arc. From a structural integrity perspective of welded structures, it is necessary to have an accurate spatial and temporal thermal distribution in the welded structure before stress analysis is performed. Existing research on weld pool dynamics simulation has ignored the effect of fluid flow in the weld pool on the temperature field of the welded joint. Previous research has established that the weld pool depth/width (D/W) ratio and Heat Affected Zone (HAZ) are significantly altered by the weld pool dynamics. Hence, for a more accurate estimation of the thermally-induced stresses it is desired to incorporate the weld pool dynamics into the analysis. Moreover, the effects of microstructure evolution in the HAZ on the mechanical behavior of the structure need to be included in the analysis for better mechanical response prediction. In this study, a three-dimensional model for the thermo-mechanical analysis of Gas Tungsten Arc (GTA) welding of thin stainless steel butt-joint plates has been developed. The model incorporates the effects of thermal energy redistribution through weld pool dynamics into the structural behavior calculations. Through material modeling the effects of microstructure change/phase transformation are indirectly included in the model. The developed weld pool dynamics model includes the effects of current, arc length, and electrode angle on the heat flux and current density distributions. All the major weld pool driving forces are included, namely surface tension gradient, plasma drag force, electromagnetic force, and buoyancy. The weld D/W predictions are validated with experimental results. They agree well. The effects of welding parameters (like welding speed, current, arc length, etc.) on the weld D/W ratio are documented. The workpiece deformation and stress distributions are also highlighted. The transverse and longitudinal residual stress distribution plots across the weld bead and their variations with welding speed and current are also provided. The mathematical framework developed here serves as a robust tool for better prediction of weld D/W ratio and thermally-induced stress evolution and distribution in a welded structure by coupling the different fields in a welding process.<br>Ph. D.
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Sidney, Daniel Alan 1966. "Three-dimensional ultrasound power deposition modeling, thermal field visualzation, and clinical integration for hyperthermia therapy." Thesis, Massachusetts Institute of Technology, 1997. http://hdl.handle.net/1721.1/43464.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Whitaker College of Health Sciences and Technology, 1997.<br>Vita.<br>Includes bibliographical references (p. 257-264).<br>by Daniel Alan Sidney.<br>Ph.D.
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Spiegel, Colleen. "Mathematical modeling of polymer exchange membrane fuel cells." [Tampa, Fla] : University of South Florida, 2008. http://purl.fcla.edu/usf/dc/et/SFE0002730.

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Li, Jingran. "Integration of Physically-based and Data-driven Approaches for Thermal Field Prediction in Additive Manufacturing." Thesis, Virginia Tech, 2017. http://hdl.handle.net/10919/79620.

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A quantitative understanding of thermal field evolution is vital for quality control in additive manufacturing (AM). Because of the unknown material parameters, high computational costs, and imperfect understanding of the underlying science, physically-based approaches alone are insufficient for component-scale thermal field prediction. Here, I present a new framework that integrates physically-based and data-driven approaches with quasi in situ thermal imaging to address this problem. The framework consists of (i) thermal modeling using 3D finite element analysis (FEA), (ii) surrogate modeling using functional Gaussian process, and (iii) Bayesian calibration using the thermal imaging data. Based on heat transfer laws, I first investigate the transient thermal behavior during AM using 3D FEA. A functional Gaussian process-based surrogate model is then constructed to reduce the computational costs from the high-fidelity, physically-based model. I finally employ a Bayesian calibration method, which incorporates the surrogate model and thermal measurements, to enable layer-to-layer thermal field prediction across the whole component. A case study on fused deposition modeling is conducted for components with 7 to 16 layers. The cross-validation results show that the proposed framework allows for accurate and fast thermal field prediction for components with different process settings and geometric designs.<br>Master of Science<br>This paper aims to achieve the layer to layer temperature monitoring and consequently predict the temperature distribution for any new freeform geometry. An engineering statistical synergistic model is proposed to integrate the pure statistical methods and finite element modeling (FEM), which is physically meaningful as well as accurate for temperature prediction. Besides, this proposed synergistic model contains geometry information, which can be applied to any freeform geometry. This paper serves to enable a holistic cyber physical systems-based approach for the additive manufacturing (AM) not only restricted in fused deposition modeling (FDM) process but also can be extended to powder-based process like laser engineered net shaping (LENS) and selective laser sintering (SLS). This paper as well as the scheduled future works will make it affordable for customized AM including customized geometries and materials, which will greatly accelerate the transition from rapid prototyping to rapid manufacturing. This article demonstrates a first evaluation of engineering statistical synergistic model in AM technology, which gives a perspective on future researches about online quality monitoring and control of AM based data fusion principles.
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Dai, Wenhua. "Large signal electro-thermal LDMOSFET modeling and the thermal memory effects in RF power amplifiers." Connect to this title online, 2004. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1078935135.

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Thesis (Ph. D.)--Ohio State University, 2004.<br>Title from first page of PDF file. Document formatted into pages; contains xix, 156 p.; also includes graphics (some col.). Includes bibliographical references (p. 152-156).
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Thorsell, Thomas. "Advances in Thermal Insulation : Vacuum Insulation Panels and Thermal Efficiency to Reduce Energy Usage in Buildings." Doctoral thesis, KTH, Byggnadsteknik, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-90745.

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We are coming to realize that there is an urgent need to reduce energy usage in buildings and it has to be done in a sustainable way. This thesis focuses on the performance of the building envelope; more precisely thermal performance of walls and super insulation material in the form of vacuum insulation. However, the building envelope is just one part of the whole building system, and super insulators have one major flaw: they are easily adversely affected by other problems in the built environment.  Vacuum Insulation Panels are one fresh addition to the arsenal of insulation materials available to the building industry. They are composite material with a core and an enclosure which, as a composite, can reach thermal conductivities as low as 0.004 W/(mK). However, the exceptional performance relies on the barrier material preventing gas permeation, maintaining a near vacuum into the core and a minimized thermal bridge effect from the wrapping of barrier material round the edge of a panel. A serpentine edge is proposed to decrease the heat loss at the edge. Modeling and testing shows a reduction of 60% if a reasonable serpentine edge is used. A diffusion model of permeation through multilayered barrier films with metallization coatings was developed to predict ultimate service life. The model combines numerical calculations with analytical field theory allowing for more precise determination than current models. The results using the proposed model indicate that it is possible to manufacture panels with lifetimes exceeding 50 years with existing manufacturing. Switching from the component scale to the building scale; an approach of integrated testing and modeling is proposed. Four wall types have been tested in a large range of environments with the aim to assess the hygrothermal nature and significance of thermal bridges and air leakages. The test procedure was also examined as a means for a more representative performance indicator than R-value (in USA). The procedure incorporates specific steps exposing the wall to different climate conditions, ranging from cold and dry to hot and humid, with and without a pressure gradient. This study showed that air infiltration alone might decrease the thermal resistance of a residential wall by 15%, more for industrial walls. Results from the research underpin a discussion concerning the importance of a holistic approach to building design if we are to meet the challenge of energy savings and sustainability. Thermal insulation efficiency is a main concept used throughout, and since it measures utilization it is a partial measure of sustainability. It is therefore proposed as a necessary design parameter in addition to a performance indicator when designing building envelopes. The thermal insulation efficiency ranges from below 50% for a wood stud wall poorly designed with incorporated VIP, while an optimized design with VIP placed in an uninterrupted external layer shows an efficiency of 99%, almost perfect. Thermal insulation efficiency reflects the measured wall performance full scale test, thus indicating efficiency under varied environmental loads: heat, moisture and pressure. The building design must be as a system, integrating all the subsystems together to function in concert. New design methodologies must be created along with new, more reliable and comprehensive measuring, testing and integrating procedures. New super insulators are capable of reducing energy usage below zero energy in buildings. It would be a shame to waste them by not taking care of the rest of the system. This thesis details the steps that went into this study and shows how this can be done.<br>QC 20120228
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Hösthagen, Anders. "Thermal Crack Risk Estimation and Material Properties of Young Concrete." Licentiate thesis, Luleå tekniska universitet, Byggkonstruktion och brand, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-65495.

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This thesis presents how to establish a theoretical model to predict risk of thermal cracking in young concrete when cast on ground or an arbitrary construction. The crack risk in young concrete is determined in two steps: 1) calculation of temperature distribution within newly cast concrete and adjacent structure; 2) calculation of stresses caused by thermal and moisture (due to self-desiccation, if drying shrinkage not included) changes in the analyzed structure. If the stress reaches the tensile strength of the young concrete, one or several cracks will occur. The main focus of this work is how to establish a theoretical model denoted Equivalent Restraint Method model, ERM, and the correlation between ERM models and empirical experiences. A key factor in these kind of calculations is how to model the restraint from any adjacent construction part or adjoining restraining block of any type. The building of a road tunnel and a railway tunnel has been studied to collect temperature measurements and crack patterns from the first object, and temperature and thermal dilation measurements from the second object, respectively. These measurements and observed cracks were compared to the theoretical calculations to determine the level of agreement between empirical and theoretical results. Furthermore, this work describes how to obtain a set of fully tested material parameters at CompLAB (test laboratory at Luleå University of Technology, LTU) suitable to be incorporated into the calculation software used. It is of great importance that the obtained material parameters describe the thermal and mechanical properties of the young concrete accurately, in order to perform reliable crack risk calculations.  Therefore, analysis was performed that show how a variation in the evaluated laboratory tests will affect the obtained parameters and what effects it has on calculated thermal stresses.
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Books on the topic "Thermal field modeling"

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Cheng, Zhiguang, Norio Takahashi, and Behzad Forghani, eds. Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering. Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-0173-9.

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Takahashi, Norio, Zhiguang Cheng, and Behzad Forghani. Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering. Springer, 2019.

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Modeling And Numerics of Kinetic Dissipative Systems. Nova Science Publishers, 2006.

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Xue, Yongkang, Yaoming Ma, and Qian Li. Land–Climate Interaction Over the Tibetan Plateau. Oxford University Press, 2017. http://dx.doi.org/10.1093/acrefore/9780190228620.013.592.

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The Tibetan Plateau (TP) is the largest and highest plateau on Earth. Due to its elevation, it receives much more downward shortwave radiation than other areas, which results in very strong diurnal and seasonal changes of the surface energy components and other meteorological variables, such as surface temperature and the convective atmospheric boundary layer. With such unique land process conditions on a distinct geomorphic unit, the TP has been identified as having the strongest land/atmosphere interactions in the mid-latitudes.Three major TP land/atmosphere interaction issues are presented in this article: (1) Scientists have long been aware of the role of the TP in atmospheric circulation. The view that the TP’s thermal and dynamic forcing drives the Asian monsoon has been prevalent in the literature for decades. In addition to the TP’s topographic effect, diagnostic and modeling studies have shown that the TP provides a huge, elevated heat source to the middle troposphere, and that the sensible heat pump plays a major role in the regional climate and in the formation of the Asian monsoon. Recent modeling studies, however, suggest that the south and west slopes of the Himalayas produce a strong monsoon by insulating warm and moist tropical air from the cold and dry extratropics, so the TP heat source cannot be considered as a factor for driving the Indian monsoon. The climate models’ shortcomings have been speculated to cause the discrepancies/controversies in the modeling results in this aspect. (2) The TP snow cover and Asian monsoon relationship is considered as another hot topic in TP land/atmosphere interaction studies and was proposed as early as 1884. Using ground measurements and remote sensing data available since the 1970s, a number of studies have confirmed the empirical relationship between TP snow cover and the Asian monsoon, albeit sometimes with different signs. Sensitivity studies using numerical modeling have also demonstrated the effects of snow on the monsoon but were normally tested with specified extreme snow cover conditions. There are also controversies regarding the possible mechanisms through which snow affects the monsoon. Currently, snow is no longer a factor in the statistic prediction model for the Indian monsoon prediction in the Indian Meteorological Department. These controversial issues indicate the necessity of having measurements that are more comprehensive over the TP to better understand the nature of the TP land/atmosphere interactions and evaluate the model-produced results. (3) The TP is one of the major areas in China greatly affected by land degradation due to both natural processes and anthropogenic activities. Preliminary modeling studies have been conducted to assess its possible impact on climate and regional hydrology. Assessments using global and regional models with more realistic TP land degradation data are imperative.Due to high elevation and harsh climate conditions, measurements over the TP used to be sparse. Fortunately, since the 1990s, state-of-the-art observational long-term station networks in the TP and neighboring regions have been established. Four large field experiments since 1996, among many observational activities, are presented in this article. These experiments should greatly help further research on TP land/atmosphere interactions.
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Lorenzo, Pareschi, and Russo Giovanni, eds. Modelling and numerics of kinetic dissipative systems. Nova Science Publishers, 2005.

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Book chapters on the topic "Thermal field modeling"

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Takahashi, Norio. "Some Key Techniques in Electromagnetic and Thermal Field Modeling." In Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-15-0173-9_3.

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Takahashi, Norio. "Fundamentals of Magnetic Material Modeling." In Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-15-0173-9_7.

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Li, Yongjian. "Rotational Magnetic Properties Measurement and Modeling." In Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-15-0173-9_10.

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Liu, Lanrong, Jie Li, and Fulai Che. "Electromagnetic and Thermal Modeling Based on Large Power Transformers." In Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-15-0173-9_14.

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Cheng, Zhiguang. "General Survey of Engineering Electromagnetic and Thermal Field Problems." In Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-15-0173-9_1.

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Forghani, Behzad. "Solution of Coupled Electromagnetic and Thermal Fields." In Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-15-0173-9_4.

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Gentilal, Nichal, Ricardo Salvador, and Pedro Cavaleiro Miranda. "A Thermal Study of Tumor-Treating Fields for Glioblastoma Therapy." In Brain and Human Body Modeling 2020. Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-45623-8_3.

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AbstractTumor-treating fields (TTFields) is an antimitotic cancer treatment technique used for glioblastoma multiforme (GBM) and malignant pleural mesothelioma. Although the frequency used is not as high as in hyperthermia, temperature increases due to the Joule effect might be meaningful given the necessary time that these fields should be applied for. Post hoc analysis of the EF-11 clinical trial showed higher median overall survival in patients whose compliance was at least 18 h per day. To quantify these temperature increases and predict the thermal impact of TTFields delivery to the head, we used a realistic model created from MR images segmented in five tissues: scalp, skull, CSF, gray matter (GM), and white matter (WM). Through COMSOL Multiphysics, we solved Laplace’s equation for the electric field and Pennes’ equation for the temperature distribution. To mimic the therapy as realistically as possible, we also considered complete current shutdown whenever any transducer reached 41 °C to allow transducers and tissues’ temperature to decrease. Our results indicate an intermittent operation of Optune due to this necessary current shutdown. Localized temperature increases were seen, especially underneath the regions where the transducers were placed. Maximum temperature values were around 41.5 °C on the scalp and 38 °C on the brain. According to the literature, significant thermal impact is only predicted for the brain where the rise in temperature may lead to an increased BBB permeability and variation in the blood flow and neurotransmitter concentration. Additionally, our results showed that if the injected current is reduced by around 25% compared to Optune’s standard way of operating, then uninterrupted treatment might be attainable. These predictions might be used to improve TTFields delivery in real patients and to increase awareness regarding possible thermal effects not yet reported elsewhere.
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Liu, Tao. "Electromagnetic Property Modeling Based on Product-Level Core Models." In Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-15-0173-9_9.

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Guo, Mansheng. "Engineering-Oriented Modeling and Experimental Research on DC-Biased Transformers." In Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-15-0173-9_15.

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Du, Zhenbin, Meilin Lu, and Fulai Che. "Measurement and Prediction of Magnetic Property of GO Silicon Steel Under Non-standard Excitation Conditions." In Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-15-0173-9_11.

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Conference papers on the topic "Thermal field modeling"

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Rolando, David, Mehdi Abarham, Gokul Shankaran, and Viral Gandhi. "Performance and reliability of a 5G smartphone RF-antenna system: Influence of temperature field." In 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2018. http://dx.doi.org/10.1109/semi-therm.2018.8357357.

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Pill-Soo Kim and Yong Kim. "Part II-field modeling and thermal modeling of magnetizing fixture." In Proceedings of the IEEE 1999 International Conference on Power Electronics and Drive Systems. PEDS'99 (Cat. No.99TH8475). IEEE, 1999. http://dx.doi.org/10.1109/peds.1999.794622.

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Jia, Wangkun, Brian T. Helenbrook, and Ming-C. Cheng. "Thermal modeling of multi-gate field effect transistors based on a reduced order model." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892245.

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Wang, Nanqiao, and Like Li. "LATTICE BOLTZMANN - PHASE FIELD METHOD FOR DENDRITIC GROWTH MODELING." In 5-6th Thermal and Fluids Engineering Conference (TFEC). Begellhouse, 2021. http://dx.doi.org/10.1615/tfec2021.cmd.032032.

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Ababneh, Mohammed T., Pramod Chamarthy, Shakti Chauhan, Frank M. Gerner, Peter de Bock, and Tao Deng. "Thermal Modeling for High Thermal Conductivity Thermal Ground Planes." In ASME 2012 Heat Transfer Summer Conference collocated with the ASME 2012 Fluids Engineering Division Summer Meeting and the ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/ht2012-58115.

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Thermal ground planes (TGPs) are flat, thin (external thickness of 2 mm) heat pipes which utilize two-phase cooling. The goal is to utilize TGPs as thermal spreaders in a variety of microelectronic cooling applications. TGPs are novel high-performance, integrated systems able to operate at a high power density with a reduced weight and temperature gradient. In addition to being able to dissipate large amounts of heat, they have very high effective axial thermal conductivities and (because of nano-porous wicks) can operate in high adverse gravitational fields. A three-dimensional (3D) finite element model is used to predict the thermal performance of the TGP. The 3D thermal model predicts the temperature field in the TGP, the effective axial thermal conductivity, and the evaporation and the condensation rates. A key feature of this model is that it relies on empirical interfacial heat transfer coefficient data to very accurately model the interfacial energy balance at the vapor-liquid saturated wick interface. Wick samples for a TGP are tested in an experimental setup to measure the interfacial heat transfer coefficient. Then the experimental heat transfer coefficient data are used for the interfacial energy balance. Another key feature of this model is that it demonstrates that for the Jakob numbers of interest, the thermal and flow fields can be decoupled except at the vapor-liquid saturated wick interface. This model can be used to predict the performance of a TGP for different geometries and implementation structures. This paper will describe the model and how it incorporates empirical interfacial heat transfer coefficient data. It will then show theoretical predictions for the thermal performance of TGP’s, and compare with experimental results.
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Burgos, Arturo, Renata Rocha, Aldemir Ap Cavalini Jr, and Aristeu Silveira Neto. "THEORETICAL MODELING OF A MECHANICAL NEAR-FIELD ACOUSTIC LEVITATION SYSTEM." In 18th Brazilian Congress of Thermal Sciences and Engineering. ABCM, 2020. http://dx.doi.org/10.26678/abcm.encit2020.cit20-0386.

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Moore, Brandon J., Ella Atkins, and Dawn Tilbury. "Thermal Modeling for Temperature Aware Operations in Field Robots." In ASME 2012 5th Annual Dynamic Systems and Control Conference joint with the JSME 2012 11th Motion and Vibration Conference. ASME, 2012. http://dx.doi.org/10.1115/dscc2012-movic2012-8748.

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Akhtaruzzaman, Raisa, Ashfaq Ahmed, Md Quamrul Islam, Sumon Saha, and Mohammad Nasim Hasan. "Numerical modeling of Marangoni convection in the presence of external magnetic field." In 8TH BSME INTERNATIONAL CONFERENCE ON THERMAL ENGINEERING. AIP Publishing, 2019. http://dx.doi.org/10.1063/1.5115871.

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Rahmatinia, Sepideh, and Babak Fahimi. "Magneto-thermal modeling of biological tissues: A step towards breast cancer detection." In 2016 IEEE Conference on Electromagnetic Field Computation (CEFC). IEEE, 2016. http://dx.doi.org/10.1109/cefc.2016.7816017.

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Palosz, Witold, Samuel A. Lowry, and Anantha Krishnan. "Modeling of thermal field in contactless physical vapor transport system." In Optical Science, Engineering and Instrumentation '97, edited by Narayanan Ramachandran. SPIE, 1997. http://dx.doi.org/10.1117/12.277720.

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Reports on the topic "Thermal field modeling"

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Greenberg, H., M. Sharma, and M. Sutton. Investigations on Repository Near-Field Thermal Modeling. Office of Scientific and Technical Information (OSTI), 2012. http://dx.doi.org/10.2172/1058105.

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Greenberg, H., M. Sharma, and M. Sutton. Investigations on Repository Near-Field Thermal Modeling. Office of Scientific and Technical Information (OSTI), 2013. http://dx.doi.org/10.2172/1062213.

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Suffield, Sarah, James Fort, Philip Jensen, et al. Thermal and Deposition Modeling of the Canister Deposition Field Demonstration. Office of Scientific and Technical Information (OSTI), 2021. http://dx.doi.org/10.2172/1844301.

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Sutton, M., J. Blink, M. Fratoni, H. Greenberg, and A. Ross. Investigations on Repository Near-Field Thermal Modeling - Repository Science/Thermal Load Management & Design Concepts (M41UF033302). Office of Scientific and Technical Information (OSTI), 2011. http://dx.doi.org/10.2172/1031294.

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Clausen, Jay, Michael Musty, Anna Wagner, Susan Frankenstein, and Jason Dorvee. Modeling of a multi-month thermal IR study. Engineer Research and Development Center (U.S.), 2021. http://dx.doi.org/10.21079/11681/41060.

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Inconsistent and unacceptable probability of detection (PD) and false alarm rates (FAR) due to varying environmental conditions hamper buried object detection. A 4-month study evaluated the environmental parameters impacting standoff thermal infra-red(IR) detection of buried objects. Field observations were integrated into a model depicting the temporal and spatial thermal changes through a 1-week period utilizing a 15-minute time-step interval. The model illustrates the surface thermal observations obtained with a thermal IR camera contemporaneously with a 3-d presentation of subsurface soil temperatures obtained with 156 buried thermocouples. Precipitation events and subsequent soil moisture responses synchronized to the temperature data are also included in the model simulation. The simulation shows the temperature response of buried objects due to changes in incoming solar radiation, air/surface soil temperature changes, latent heat exchange between the objects and surrounding soil, and impacts due to precipitation/changes in soil moisture. Differences are noted between the thermal response of plastic and metal objects as well as depth of burial below the ground surface. Nearly identical environmental conditions on different days did not always elicit the same spatial thermal response.
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T. M. Harrison, G. B. Dalrymple, J. B. Hulen, M. A. Lanphere, M. Grove, and O. M. Lovera. Thermal History of the Felsite Unit, Geysers Geothermal Field, From Thermal Modeling of 40Ar/39Ar Incremental Heating Data. Office of Scientific and Technical Information (OSTI), 1999. http://dx.doi.org/10.2172/14680.

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Sutton, M., J. Blink, M. Fratoni, H. Greenberg, and A. Ross. Investigations on Repository Near-Field Thermal Modeling - Repository Science/Thermal Load Management & Design Concepts (M41UF033302) Rev.1. Office of Scientific and Technical Information (OSTI), 2011. http://dx.doi.org/10.2172/1034484.

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Greenberg, H., M. Sutton, M. Sharma, and A. Barnwell. REPOSITORY NEAR-FIELD THERMAL MODELING UPDATEINCLUDING ANALYSIS OF OPEN MODE DESIGN CONCEPTS - DRAFT REV. M. Office of Scientific and Technical Information (OSTI), 2012. http://dx.doi.org/10.2172/1056623.

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Liu, X., Z. Chen, and S. E. Grasby. Using shallow temperature measurements to evaluate thermal flux anomalies in the southern Mount Meager volcanic area, British Columbia, Canada. Natural Resources Canada/CMSS/Information Management, 2022. http://dx.doi.org/10.4095/330009.

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Geothermal is a clean and renewable energy resource. However, locating where elevated thermal gradient anomalies exist is a significant challenge when trying to assess potential resource volumes during early exploration of a prospective geothermal area. In this study, we deployed 22 temperature probes in the shallow subsurface along the south flank of the Mount Meager volcanic complex, to measure the transient temperature variation from September 2020 to August 2021. In our data analysis, a novel approach was developed to estimate the near-surface thermal distribution, and a workflow and code with python language have been completed for the thermal data pre-processing and analysis. The long-term temperature variation at different depths can be estimated by modelling, so that the relative difference of deducing deeper geothermal gradient anomalies can be assessed. Our proposed inversion and simulation methods were applied to calculating the temperature variation at 2.0 meters depth. The results identified a preferred high thermal flux anomalous zone in the south Mount Meager area. By combining with previous studies, the direct analysis and estimation of anomalous thermal fields based on the collected temperature data can provide a significant reference for interpretation of the regional thermal gradient variation.
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Stauffer, Philip H., Amy B. Jordan, Dylan Robert Harp, et al. Thermo-hydrological and chemical (THC) modeling to support Field Test Design. Office of Scientific and Technical Information (OSTI), 2014. http://dx.doi.org/10.2172/1171663.

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