Relevant bibliographies by topics / Thermocouples

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Thermocouples'

Author: Grafiati
Published: 4 June 2021
Last updated: 27 July 2024

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Journal articles on the topic "Thermocouples"

1

Cai, Mengyin, Qinghuang Huang, Lingling Yue, and Peiyong Wang. "Emissivity Influence on Thermocouple Correction." Advances in Engineering Technology Research 4, no. 1 (March 20, 2023): 194. http://dx.doi.org/10.56028/aetr.4.1.194.2023.

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The reading of a thermocouple is not equal to the gas temperature because of the complicated heat transfer process among the thermocouple, the gas, and the environment. So the corrections for thermocouple measurements are necessary to obtain the real gas temperature. The current correction methods using multiple thermocouples assume that the thermocouples have the same surface emissivity. However, the emissivity of a thermocouple depends on its surface condition, and the emissivity of the thermocouples normally are different. CFD simulations are carried out to study the influence of emissivity difference on the correction accuracy. For the extrapolation method, the correction accuracy could be improved or weakened depending on the emissivity variation of the thermocouples. For the equation methods by De, the correction accuracy is poor for the low speed flow and good for the high speed flow. However, the correction accuracy for the high speed flow is weakened if the emissivity of the thermocouples have large difference. For the equation method by Brohez, the overall correction accuracy is good but the accuracy degrades greatly with the large emissivity difference of the thermocouples.
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Fang, Cong Fu, Hui Huang, and Xi Peng Xu. "The Influence of Thermocouples on the Measurement of Grinding Temperatures." Key Engineering Materials 375-376 (March 2008): 549–52. http://dx.doi.org/10.4028/www.scientific.net/kem.375-376.549.

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An experimental investigation was conducted to reveal the influence of thermocouples on the measurement of grinding temperatures. The temperatures at the wheel-workpiece interface were measured in dry grinding using two types of foil thermocouples. It is shown that the temperatures measured by the different types or geometric parameters of thermocouples were rather different. For a specific thermocouple, the temperatures generally decreased with the reduced end-surface area of the thermocouple, which is possibly related to the reduced number of abrasives at the wheel-thermocouple interface.
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Wu, Baoyuan, and Ge Liu. "Platinum: Platinum-Rhodium Thermocouple Wire." Platinum Metals Review 41, no. 2 (April 1, 1997): 81–85. http://dx.doi.org/10.1595/003214097x4128185.

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A new type of platinum:platinum-rhodium thermocouple wire which incorporates traces of yttrium in the platinum limb has been developed and tested in some typical working environments. This thermocouple possesses good thermal stability and mechanical strength at high temperatures, and a long service life, compared with conventional platinum:platinum-rhodium thermocouples. The thermocouple meets the output requirements of the Type S standard for thermocouples — those made of Pt:Pt-10%Rh — whose manufacturing tolerances are prescribed by the International Electrotechnical Commission (I.E.C.)(l). The life of thermocouples made from this wire is increased by around 1.5 to 2 times and they display a greater resistance to contamination.
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Tillmann, Kokalj, Stangier, Schöppner, and Malatyali. "Effects of AlN and BCN Thin Film Multilayer Design on the Reaction Time of Ni/Ni-20Cr Thin Film Thermocouples on Thermally Sprayed Al2O3." Sensors 19, no. 15 (August 3, 2019): 3414. http://dx.doi.org/10.3390/s19153414.

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Thin film thermocouples are widely used for local temperature determinations of surfaces. However, depending on the environment in which they are used, thin film thermocouples need to be covered by a wear or oxidation resistant top layer. With regard to the utilization in wide-slit nozzles for plastic extrusion, Ni/Ni-20Cr thin film thermocouples were manufactured using direct-current (DC) magnetron sputtering combined with Aluminiumnitride (AlN) and Boron-Carbonitride (BCN) thin films. On the one hand, the deposition parameters of the nitride layers were varied to affect the chemical composition and morphology of the AlN and BCN thin films. On the other hand, the position of the nitride layers (below the thermocouple, above the thermocouple, around the thermocouple) was changed. Both factors were investigated concerning the influence on the Seebeck coefficient and the reaction behaviour of the thermocouples. Therefore, the impact of the nitride thin films on the morphology, physical structure, crystallite size, electrical resistance and hardness of the Ni and Ni-20Cr thin films is analysed. The investigations reveal that the Seebeck coefficient is not affected by the different architectures of the thermocouples. Nevertheless, the reaction time of the thermocouples can be significantly improved by adding a thermal conductive top coat over the thin films, whereas the top coat should have a coarse structure and low nitrogen content.
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Yasser Abdelaziz, Mahmoud Hammam, Faten Megahed, and Ebtesam Qamar. "Characterizing Drift Behavior in Type K and N Thermocouples After High Temperature Thermal Exposures." Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 97, no. 1 (August 13, 2022): 62–74. http://dx.doi.org/10.37934/arfmts.97.1.6274.

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Although of the widespread use of base metal thermocouples in the industry, many previous relevant researches have shown that the accuracy and stability of thermocouples are clearly influenced by any physical or chemical changes in their thermoelements. Among the most important of these changes are the inhomogeneity, pollution, oxidation and microstructure changes of the thermoelements, all of these changes and more leads to thermocouples drift after a prolonged thermal exposure. To study how these changes affect the drift and thermoelectric properties of thermocouples, in this work we subjected the base metal thermocouples of types K and N to successive thermal exposure periods at their maximum temperatures. Scanning electron microscopy (SEM) and Energy Dispersive X-ray (EDX) systems were used to monitor the change in the crystal structure and chemical composition of the thermocouple wires after each stage of the thermal heating, and then we studied the changes in the thermoelectric properties of thermocouple wires. The results showed type N thermocouples are more stable at high temperatures (up to 1050 ͦ C), even if used for long periods (for more than 1200 hours) at those temperatures, but K type thermocouples showed a rapid drift with first exposure to high temperatures and completely failed after 600 hours due to devastating corrosion.
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Hatmoko, Sumantri Hatmoko, Kussigit Santosa Santosa, Giarno Giarno Giarno, Dedy Haryanto Haryanto, Mulya Juarsa Juarsa, M. Hadi Kusuma, Anhar Riza Antariksawan, and Surip Widodo Widodo. "KARAKTERISASI TERMOKOPEL TIPE K PADA FASILITAS SIMULASI SISTEM FASSIP-02." POROS 16, no. 2 (August 27, 2021): 127. http://dx.doi.org/10.24912/poros.v16i2.11651.

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In the activities of the Pratama Insinas, Ministry of Higher Education technology research in 2018, PTKRN BATAN built a testing facility that simulates a passive cooling system on the reactor core when there is a loss of outside power. The test facility is the Passive-02 System Simulation Facility (FASSIP02).In FASSIP-02 there are several parameters that need to be measured, one of which is temperature. In the measurement of temperature using a K type Thermocouple Connected to the National Instrument 9178 and 9213 modules that use computer programming with LabVIEW software. Temperature measurements need to be characterized.Characterization of type K thermocouples was carried out using thermobaths, 30 type K thermocouples, standard thermocouples,National Instrument modules 9178 and 9213 with computer programming displays using LabVIEW software. The method used for characterization oftype K thermocouples is a fixed temperature comparison method where the results of the temperature control of thermobath is 30-90 ͦC compared with the results of measurements from the type Kthermocouple and standard thermocouple. From the difference of the copper-wrapped junction tip thermocouple without the copper-wrapped and standard thermocouple produces a small error value, so the use of copper as a thermocouple junction end wrapper can be used as a temperature measurement FASSIP-02.
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Krille, Tobias, Rico Poser, Markus Diel, and Jens von Wolfersdorf. "Conduction and Inertia Correction for Transient Thermocouple Measurements. Part II: Experimental Validation and Application." E3S Web of Conferences 345 (2022): 01003. http://dx.doi.org/10.1051/e3sconf/202234501003.

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Thermocouples are often used for temperature measurements. Under transient conditions, measurement errors can occur due to capacitive inertia and heat conduction along the stem of the thermocouples. To correct such errors, a method is presented in Part I [1] of this paper, which uses a simplified analytical approach and a numerical solution. In the present work, this method is applied to temperature measurements. Several experiments with different thermocouple designs were performed to investigate different conditions such as installation depth, thermocouple type and transient temperature rises. In all cases, two thermocouples were placed so that they are exposed to the same fluid temperature. They are installed with short or long immersion length, respectively. It is shown that only the short thermocouple experiences a thermal conduction error, but both are subject to thermal inertia. The importance of compensating for these effects is shown by quantifying the errors in a typical heat transfer experiment when they are neglected. It is shown, which parameters are necessary for a re-calculation of fluid temperatures when two thermocouples are present at the same measuring position. Furthermore, a simplified method is described, which can be applied if the instrumentation of only one thermocouple is possible.
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Jutte, Lisa S., Kenneth L. Knight, and Blaine C. Long. "Reliability and Validity of Electrothermometers and Associated Thermocouples." Journal of Sport Rehabilitation 17, no. 1 (February 2008): 50–59. http://dx.doi.org/10.1123/jsr.17.1.50.

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Objective:Examine thermocouple model uncertainty (reliability + validity).Design:First, a 3 × 3 repeated measures design with independent variables electrothermometers and thermocouple model. Second, a 1 × 3 repeated measures design with independent variable subprobe.Intervention:Three electrothermometers, 3 thermocouple models, a multi-sensor probe and a mercury thermometer measured a stable water bath.Main Outcome Measures:Temperature and absolute temperature differences between thermocouples and a mercury thermometer.Results:Thermocouple uncertainty was greater than manufactures’ claims. For all thermocouple models, validity and reliability were better in the Iso-Themex than the Datalogger, but there were no practical differences between models within an electrothermometers. Validity of multi-sensor probes and thermocouples within a probe were not different but were greater than manufacturers’ claims. Reliability of multiprobes and thermocouples within a probe were within manufacturers claims.Conclusion:Thermocouple models vary in reliability and validity. Scientists should test and report the uncertainty of their equipment rather than depending on manufactures’ claims.
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Tszeng, T. C., and V. Saraf. "A Study of Fin Effects in the Measurement of Temperature Using Surface-Mounted Thermocouples." Journal of Heat Transfer 125, no. 5 (September 23, 2003): 926–35. http://dx.doi.org/10.1115/1.1597622.

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The present study addresses the effects of thermocouples on the measured temperature when such thermocouples are mounted directly on the surface of the object. A surface-mounted thermocouple is a very convenient way of measuring the surface temperature. However, the heat conduction into/from the thermocouple wire changes the local temperature at the thermocouple junctions along with the immediate vicinity of the thermocouple. As a consequence, the emf appearing at the thermocouple terminals does not correspond to the actual surface temperature. In this paper, we first discuss the general characteristics of the enhanced heating/cooling due to the so-called “fin effects” associated with the surface-mounted thermocouples. An embedded computational model is then developed so that the model can be used in conjunction with a regular FEM model for the multidimensional calculation of the heating or cooling of a part. The embedded computational model is shown to offer very accurate calculation of the temperature at the junction of thermocouple wire. The developed computational model is further used in the inverse heat transfer calculation for a Jominy end quench experiment.
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Shen, Yi-Xuan, Yao-Chuan Tsai, Chi-Yuan Lee, Chyan-Chyi Wu, and Ching-Liang Dai. "Thermoelectric Energy Micro Harvesters with Temperature Sensors Manufactured Utilizing the CMOS-MEMS Technique." Micromachines 13, no. 8 (August 5, 2022): 1258. http://dx.doi.org/10.3390/mi13081258.

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This study develops a TEMH (thermoelectric energy micro harvester) chip utilizing a commercial 0.18 μm CMOS (complementary metal oxide semiconductor) process. The chip contains a TEMH and temperature sensors. The TEMH is established using a series of 54 thermocouples. The use of the temperature sensors monitors the temperature of the thermocouples. One temperature sensor is set near the cold part of the thermocouples, and the other is set near the hot part of the thermocouples. The performance of the TEMH relies on the TD (temperature difference) at the CHP (cold and hot parts) of the thermocouples. The more the TD at the CHP of the thermocouples increases, the higher the output voltage and output power of the TEMH become. To obtain a higher TD, the cold part of the thermocouples is designed as a suspended structure and is combined with cooling sheets to increase heat dissipation. The cooling sheet is constructed of a stack of aluminum layers and is mounted above the cold part of the thermocouple. A finite element method software, ANSYS, is utilized to compute the temperature distribution of the TEMH. The TEMH requires a post-process to obtain the suspended thermocouple structure. The post-process utilizes an RIE (reactive ion etch) to etch the two sacrificial materials, which are silicon dioxide and silicon substrate. The results reveal that the structure of the thermocouples is completely suspended and does not show any injury. The measured results reveal that the output voltage of the TEMH is 32.5 mV when the TD between the CHP of the thermocouples is 4 K. The TEMH has a voltage factor of 8.93 mV/mm2K. When the TD between the CHP of the thermocouples is 4 K, the maximum output power of the TEMH is 4.67 nW. The TEMH has a power factor of 0.31 nW/mm2K2.
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Dissertations / Theses on the topic "Thermocouples"

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Scervini, Michele. "Materials for thermocouples." Thesis, University of Cambridge, 2012. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.610862.

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Boily, Pascal. "Application des capteurs thermiques implantés pour la détection du profil de gelée dans la cuve d'électrolyse /." Thèse, Chicoutimi : Université du Québec à Chicoutimi, 2001. http://theses.uqac.ca.

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Scattergood, Thomas R. "A dual-junction thermocouple probe for compensated temperature measurement in reacting flows." Thesis, This resource online, 1992. http://scholar.lib.vt.edu/theses/available/etd-09122009-040304/.

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Kulkarni, Rohan A. "The correlation length of temperature fluctuations measured in air using thermocouples." Diss., Online access via UMI:, 2005.

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Tomčáková, Anna. "Měření teplotních profilů BGA pouzder u pájení přetavením." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2008. http://www.nusl.cz/ntk/nusl-217626.

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This graduation thesis addresses questions to thermal profile measurement of PBGA package during solder reflow process. The first part of thesis deals with problem of reflow process and reliability factors of solder joint connection. Next part analyses operation principles of thermocouples that are commonly used for temperature measurement. The experimental part deals with methods of thermocouples fixation during tests and measurements of dummy PBGA package. There was realized a method of dummy PBGA thermal profiles measurement and sample testing with and without simulated thermal load on PBGA package. The end of thesis concerns on possibilities of thermal profiles evaluation by using PWI method and thermal profile optimization of reflow process.
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Wong, Yu Sang. "Temperature measurement of moving metal surfaces." access abstract and table of contents access full-text, 2006. http://libweb.cityu.edu.hk/cgi-bin/ezdb/dissert.pl?msc-ap-b21456288a.pdf.

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Thesis (M.Sc.)--City University of Hong Kong, 2006.
"Master of Science in Materials Engineering & Nanotechnology dissertation." Title from title screen (viewed on Nov. 21, 2006) Includes bibliographical references.
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Serio, Bruno. "Modélisation, élaboration et caractérisation de reseaux de microthermocouples or-palladium en couches minces." Besançon, 2000. http://www.theses.fr/2000BESA2077.

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La détection précise et rapide des changements de température de surface est crucialepour l'étude de nombreux phénomènes physiques ou processus industriels (par ex. Usinage laser, projection thermique). Si la température mesurée à l'aide d'un thermocoupleou d'une résistance thermométrique placés en contact direct avec la surface est touhours celle du capteur, le plus souvent elle s'éloigne de celle de la surface elle même. La présence du capteur engendre en effet des erreurs liées à la perturbation qu'il provoque sur le champ des températures à mesurer. La solution développée dans cette thèse pour réduire ces perturbations consiste à déposer le capteur directement sur la surface à caractériser. La technologie développée dans le domaine des microtechniques permet l'élaboration de tels capteurs sous forme de réseaux de thermocouples AU-PD en couches minces pour la mesure avec une grande précision du profil énergétique des flux lasers focalisés ou encore pour mesurer le champ de température au sein d'un matériau composite. Après une phase de mise au point et d'étalonnage des capteurs en régime statique et dynamique, les comportements statique et dynamique ont été modélisés. De très bons résultats ont été obtenus dans le domaine de la profilométrie énergétique des faisceaux lasers. Des perspectives sont attendues à court terme pour la mesure des températures durant le cyclage thermique de revêtements de surface élaborés par projection thermique
Precise and rapid detection of surface temperature changes are crucial for studying numerous physical phenomena or industrial processes (E. G. Laser processing, thermal spraying). If the temperature measured with a thermocouple or with a thermometric resistance put in direct contact with the surface is always the sensor temperature, in most cases, it differs from the surface temperature. The presence of the sensor induces errors due to its interference with the temperature field to be measured. The solution developed in this thesis to reduce this interference consists of depositing the sensor material onto the surface to be characterized. The technology developed in the microtechnic field enables the realisation of such sensors as an array of thin film thermocouples. In that case, the sensor inertia is nearly zero and the bond with the substrate is excellent. AU-PD thin film thermocouple arrays were realized to measure with high precision focused laser energy profiles or to measure the temperature field within a composite material. After the sensors adjustement and calibration in steady and dynamic condition, the steady and dynamic behaviours were modelled. Very good results were obtained in the field of laser beam profiles determination. Prospects are short-term awaited for measuring of temperatures during thermal cycling of thermally sprayed coatings
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Hanna, Ghassan Faraj 1957. "DESIGN AND DEVELOPMENT OF HIGHLY ACCURATE TEMPERATURE MEASUREMENT INSTRUMENTATION FOR USE IN HOSTILE ENVIRONMENT." Thesis, The University of Arizona, 1986. http://hdl.handle.net/10150/276351.

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Sinha, Nipun. "Design, fabrication, packaging and testing of thin film thermocouples for boiling studies." [College Station, Tex. : Texas A&M University, 2006. http://hdl.handle.net/1969.1/ETD-TAMU-1824.

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Powers, Sean W. "Analysis of Stresses in Metal Sheathed Thermocouples in High-Temperature, Hypersonic Flows." Thesis, Virginia Tech, 2020. http://hdl.handle.net/10919/98000.

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Flow temperature sensing remains important for many hypersonic aerodynamics and propulsion applications. Flight test applications, in particular, demand robust and accurate sensing, making thermocouple sensors attractive. Even for these extremely well-developed sensors, the prediction of stresses (hoop, radial, and axial) within thermocouple sheaths for custom-configured probes remains a topic of great concern for ensuring adequate lifetime of sensors. In contemporary practice, high-fidelity simulations must be run to prove if a new design will work at all, albeit at significant time and expense. Given the time and money it takes to run high-fidelity simulations, rapid optimization of sensor configurations is often impossible, or at a minimum, impractical. The developments presented in this Thesis address the need for hypersonic flow temperature sensor structural predictions which are compatible with rapid design iteration. The derivation and implementation of a new analytical, low-order model to predict stresses (hoop, radial, and axial) within the sheath of a thermocouple are provided. The analytical model is compared to high-fidelity ANSYS mechanical simulations as well as simplified experimental data. The predictions using the newly developed structural low-order model are in excellent agreement with the numerically simulated results and experimental results with an absolute maximum percent error of approximately 4% and 9.5%, respectively, thus validating the model. A MATLAB GUI composed of the combination of a thermal low-order model outlined in additional references [1] through [6] and the new structural low-order model for thermocouples was developed. This code is capable of solving a highly generalized version of the 1-D pin fin equation, allowing for the solution of the temperature distribution in a sensor taking into account conduction, convection, and radiation heat transfer which is not possible with other existing analytical solutions. This temperature distribution is then used in the analytical structural low-order model. This combination allows for the thermal and structural performance of a thermocouple to be found analytically and compared quickly with other designs.
M.S.
Thermocouples are a device for measuring temperature, consisting of two wires of different metals connected at two different points. This configuration produces a temperature-dependent voltage as a result of the thermoelectric effect. Preexisting curves are used to relate the voltage to temperature. Thermocouples are extensively used in high-temperature high-stress environments such as in rockets, jet engines, or any high-corrosive environment. Accurately predicting the stresses within the sheath of a metal-clad thermocouple in extreme conditions is required for many research areas including hypersonic aerodynamics and various propulsion applications. Even for these extremely well-developed and widely used sensors, the accurate prediction of stresses within the metal sheath remains a topic of great concern for ensuring the sensor’s survivability in these extreme conditions. Current engineering practice is to use high-fidelity numerical simulations (Finite Element Analysis) to predict the stresses within the sheath. Perhaps the biggest drawback to this approach is the time it takes to model, mesh, and set-up these simulations. Comparative studies between different designs using numerical simulations are almost impossible due to the time requirement. This Thesis will present an analytically derived quasi-3D solution to find the stresses within the sheath. These equations were implemented into a low-order model that can handle varying temperature, geometry, and material inputs. This model was validated against both high-fidelity numerical simulations (ANSYS Mechanical) and a simplified experiment. The predictions using this newly developed structural low-order model are in excellent agreement with the numerically simulated results and experimental results.
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Books on the topic "Thermocouples"

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Burns, G. W. The calibration of thermocouples and thermocouple materials. Gaithersburg, MD: U.S. Dept. of Commerce, National Institute of Standards and Technology, 1989.

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Burns, G. W. NIST measurement services: The calibration of thermocouples and thermocouple materials. Washington, D.C: National Institute of Standards and Technology, 1989.

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C, Fralick G., and United States. National Aeronautics and Space Administration., eds. Multiwire thermocouples: Frequency response. [Atlanta, GA]: Georgia Institute of Technology, 1994.

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Thermocouples: Theory and properties. Boca Raton, Fla: CRC Press, 1991.

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C, Fralick Gustave, and United States. National Aeronautics and Space Administration., eds. Multiwire thermocouples in reversing flow. [Washington, DC: National Aeronautics and Space Administration, 1995.

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1975-, Johnson Mitchell, ed. Practical thermocouple thermometry. Research Triangle Park, NC: ISA, 2012.

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C, Anderson Robert, Liebert Curt H, and United States. National Aeronautics and Space Administration., eds. Heat flux measurements on ceramics with thin film thermocouples. [Washington, DC]: National Aeronautics and Space Administration, 1993.

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C, Fralick Gustave, and United States. National Aeronautics and Space Administration., eds. Frequency response of a thermocouple wire: Effects of axial conduction : progress report, April 1990-September 1990. Atlanta, Ga: Georgia Institute of Technology, 1990.

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United States. National Aeronautics and Space Administration., ed. Development of thin film thermocouples on ceramic materials for advanced propulsion system applications. [Washington, DC]: National Aeronautics and Space Administration, 1993.

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C, Fralick Gustave, and United States. National Aeronautics and Space Administration., eds. Frequency response of a thermocouple wire: Effects of axial conduction : progress report, April 1990-September 1990. Atlanta, Ga: Georgia Institute of Technology, 1990.

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Book chapters on the topic "Thermocouples"

1

Vanvor, Herbert. "Thermocouples." In Sensors, 119–62. Weinheim, Germany: Wiley-VCH Verlag GmbH, 2008. http://dx.doi.org/10.1002/9783527620159.ch4.

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Claggett, T. J., R. W. Worrall, and B. G. Lipták. "Thermocouples." In Temperature Measurement, 95–118. Boca Raton: CRC Press, 2022. http://dx.doi.org/10.1201/9781003063919-16.

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Vajc, Viktor, and Martin Dostál. "Fixation of Thermocouples and Insulation for Heated Block." In Advances in Heat Transfer and Thermal Engineering, 71–77. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4765-6_13.

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Khadouri, Saleh H., Gerard C. M. Meijer, and Frank M. L. Van Der Goes. "A CMOS Interface for Thermocouples with Reference-Junction Compensation." In Smart Sensor Interfaces, 73–86. Boston, MA: Springer US, 1997. http://dx.doi.org/10.1007/978-1-4615-6061-6_7.

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Yates, John T. "Tungsten-Rhenium Thermocouples—Calibration Over a Wide Temperature Range." In Experimental Innovations in Surface Science, 580–83. New York, NY: Springer New York, 1998. http://dx.doi.org/10.1007/978-1-4612-2304-7_171.

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Béreyziat, Antoine, Maxime Audebert, Sebastien Durif, and Abdelhamid Bouchair. "Temperature Measurements in Timber Exposed to Fire Using Thermocouples." In Wood & Fire Safety 2024, 341–48. Cham: Springer Nature Switzerland, 2024. http://dx.doi.org/10.1007/978-3-031-59177-8_40.

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Taysom, Brandon Scott, WoongJo Choi, and Kenneth Ross. "Removing Rotational Variations from Shoulder Thermocouples in Friction Stir Welding." In The Minerals, Metals & Materials Series, 105–11. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-65265-4_10.

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Adamčík, František, Rudolf Andoga, Ladislav Madarász, and Peter Krajňák. "Elimination of Dynamic Errors of Thermocouples in Aircraft Engines Using Neural Networks." In Aspects of Computational Intelligence: Theory and Applications, 185–94. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013. http://dx.doi.org/10.1007/978-3-642-30668-6_12.

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Fan, Chao, Xiao-Chen Zhang, Chuang Sun, and Xin-Lin Xia. "On the Measurement Error of Temperature in Nanocomposite Thermal Insulation by Thermocouples." In Advances in Heat Transfer and Thermal Engineering, 303–7. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4765-6_53.

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Thomas, B. G., M. A. Wells, and D. Li. "Monitoring of Meniscus Thermal Phenomena with Thermocouples in Continuous Casting of Steel." In Sensors, Sampling, and Simulation for Process Control, 119–26. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9781118061800.ch14.

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Conference papers on the topic "Thermocouples"

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Wang, T. P. "Accuracy and Reproducibility of Temperature Measurement by Thermocouples." In ASME 1989 International Gas Turbine and Aeroengine Congress and Exposition. American Society of Mechanical Engineers, 1989. http://dx.doi.org/10.1115/89-gt-44.

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The accuracy of base metal thermocouples in initial condition and after service is reviewed in conjunction with the accuracy and reproducibility of measurement and factors affecting calibration. Lot calibration data on insulated thermocouple wire and metal sheathed thermocouples are examined on a statistical basis. Some stability test data on K, J, T and E thermocouples in air atmosphere are presented. Calibration data by standard methods are compared with those obtained by data acquisition and freeze point measurements. Round-robin calibration of J and K thermocouples is included for the determination of the uncertainty of calibration by J and K thermocouples. By integrating the information on initial calibration and stability of the thermocouple with the accuracy of measurement, one is in a position to select the best system for close temperature control throughout a process.
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Liu, Xiaoliang, Xuedong Chen, Zhichao Fan, and Huifeng Jiang. "Preparation and Properties of Au/SnO2 Thermocouples for Material Testing Apparatus of Pressure Equipment." In ASME 2019 Pressure Vessels & Piping Conference. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/pvp2019-93346.

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Abstract Thermocouples are the most common temperature measuring components in petrochemical, metallurgical, aerospace and other fields. However, due to the influence of working environment and its own structural characteristics, the thermocouple is highly susceptible to electromagnetic interference in the environment during its work, which seriously affects its temperature measurement accuracy. In this paper, three different shapes of Au/SnO2 thermocouples were prepared by screen printing technology, and their microstructure, thermoelectric properties and anti-electromagnetic interference were studied. The results show that the Au/SnO2 thermocouples with different shapes can crystallize well after sintering at 750 °C and above. When temperature difference is from 50 to 300 °C, thermocouples with different shapes can produce stable thermoelectric potential, and the shape has no effect on the output thermoelectric potential. The Au/SnO2 thermocouple after 850 °C sintering has the best thermoelectric performance. Au/SnO2 thermocouples can work normally in electromagnetic fields of 3 V/m or less, while standard PtRh10-Pt thermocouples can not work normally in electromagnetic field of 3 V/m. The Au/SnO2 thermocouple obtained in this study has the advantages of simple preparation method, small size, stable output thermoelectric potential and strong anti-electromagnetic interference ability.
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Ergut, A., and Y. Levendis. "An Investigation on Thermocouple-Based Temperature Measurements in Sooting Flames." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-82332.

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Temperature is an important parameter in flame chemical structure calculations. However, accurate temperature measurements are challenging to obtain. This manuscript reports on temperature measurements in sooting ethyl-benzene flames. Measurements were conducted with an array of four decreasing size thermocouples. However, to minimize disturbance of the flame by the insertion of the insulated multi-thermocouple array, the four thermocouples were also inserted bare one at a time, and results were contrasted. In both cases, radiative heat transfer was accounted for by using the well-known Nichols method [1]. This method was somewhat modified, as the extrapolation to zero thermocouple bead size was done using third-order polynomials. Furthermore, as soot accumulates on the thermocouple beads, upon their insertion in sooting flames, the obtained signals were scrutinized to determine the point in their time-history that is appropriate for this analysis. The zero time extrapolation technique, as suggested by McEnally et al. [2], was used to correct for soot accumulation at the tip of the thermocouples. Other methods were also explored, where theoretical expressions were used with corrections applied for the radiative heat losses from the thermocouples either prior or after the accumulation of soot on the thermocouple bead. Results showed that higher temperatures were recorded when single bare thermocouples were inserted into the flame as compared to inserting four thermocouples together. The difference was attributed to the disturbance of the flow-and temperature-fields in the flame, especially by the ceramic sheath that holds thermocouples together, and the thermal interaction of the thermocouples when they were inserted into the flame simultaneously. Results also showed that a combination of modified Nichols’ method with McEnallys’ corrections for sooting flames is a preferred technique as it nearly eliminates assumptions. Resulting temperature values are supported by theoretical calculations with judicious assumptions on important parameters.
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Petrie, Charles, and Harold Beattie. "Hermetically Sealed Thermocouples." In ASME 1993 International Gas Turbine and Aeroengine Congress and Exposition. American Society of Mechanical Engineers, 1993. http://dx.doi.org/10.1115/93-gt-036.

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This paper presents the results of a certification test to incorporate hermetic glass seals into thermocouple sensors utilized for Power Turbine Inlet Temperature sensing in a gas turbine engine in commuter aircraft service. Failure modes found in field service returns are characterized and the general procedure for installing a glass compression seal are outlined.
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Scervini, Michele. "Progress in the Development of Low Drift Nickel Based Thermocouples for High Temperature Applications." In ASME Turbo Expo 2015: Turbine Technical Conference and Exposition. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/gt2015-42652.

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Recent progresses on the new Nickel based thermocouples for high temperature applications developed at the Department of Materials Science and Metallurgy of the University of Cambridge are described in this paper. Isothermal drift at temperatures above 1000°C as a function of the thermocouple diameter has been studied for both conventional Nickel based thermocouples and the new Nickel based thermocouple. The new Nickel based thermocouple experiences a much reduced drift compared to conventional sensors. Tests in thermal cyclic conditions have been undertaken on conventional and new Nickel based thermocouples, showing a clear improvement for the new sensors at temperatures both higher and lower than 1000°C. The improvements achievable with the new Nickel based thermocouple in both isothermal and thermal cycling conditions suggest that the new sensor can be used at high temperatures, where current conventional sensors are not reliable, as well as at temperatures lower than 1000°C with improved performance compared to conventional sensors.
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Van Den Andel, J. "Limitations of Thermocouples Used in Hot Zones in Gas Turbines." In ASME 1986 International Gas Turbine Conference and Exhibit. American Society of Mechanical Engineers, 1986. http://dx.doi.org/10.1115/86-gt-205.

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Thermocouples are extensively used for controlling as well as safeguarding gas turbines. Some thermocouples have found their way into environments where their life expectancy could not be fulfilled. The literature provides very little information on thermocouple used beyond 3000 hours and yet in gas turbines, 30 000 h expectancy is not uncommon. In the hottest zones, deterioration takes place in spite of special precautions in shielding. A test was developed to find troubles which could not be revealed by calibration or other means of testing. Thermocouples thus identified had lives of less than half the design value and restrictions have been placed on the time span a thermocouple is considered useful. The paper follows a practical approach to a practical problem.
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Braun, James, Shengqi Lu, and Guillermo Paniagua. "Development of High Frequency Virtual Thermocouples." In ASME Turbo Expo 2017: Turbomachinery Technical Conference and Exposition. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/gt2017-64669.

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This paper presents a numerical procedure to enhance the frequency response of temperature probes equipped with two thermocouple junctions of different diameter. The output of the two thermocouples exposed to the same flow transient can be used to predict the output of a virtual smaller thermocouple, which cannot be physically realized. The approach is demonstrated numerically, with the aid of conjugate heat transfer simulations performed with 3D Unsteady Reynolds Averaged Navier-Stokes. The dual junction thermocouple with wire diameters of 50 μm, 25 μm were exposed to several inlet temperatures and pressures to analyze the overall recovery factor. Then multiple unsteady tests were performed. The analysis of those transient tests was used to determine the transfer function in the time domain between the two wires and to perform a digital compensation to predict the performance of a much thinner wire thermocouple. This method was assessed by recovering the theoretical response of the 12.5 μm thermocouple with our dual-junction thermocouple probe for several pressures and wall temperatures. Finally, the procedure was applied to a virtual fine wire thermocouple of 6 μm and a frequency response around 700 Hz.
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Ahn, H. S., N. Sinha, and D. Banerjee. "Micro-Machined Temperature Sensor Arrays for Studying Micro-Scale Features in Film Boiling." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-81869.

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In this study we report the design, fabrication and testing of a surface micro-machined array of temperature sensors for studying micro-scale features in film boiling. The fabrication steps involved deposition by metal evaporation and “lift-off” process. The thermocouple junction sizes were less than 50μm wide and 100-250nm thick. Wire bonding techniques were explored for packaging. An apparatus for boiling experiments was constructed to test the micro-machined temperature sensors. The apparatus consists of a viewing chamber containing a metal block (copper block covered with a steel jacket) in which cartridge heaters and thermocouples are embedded. A silicon wafer with the surface micro-machined thermocouple arrays was clamped on top of this metal block. Surface temperatures were measured, during boiling experiments with PF-5060 as the working liquid, using the surface micro-machined thermocouple. Since the micro-machined thermocouples have very low characteristic time constant, temperature measurements can be performed with better accuracy, spatial resolution and temporal precision, than standard thermocouples.
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Russer, Johannes A., Christian Jirauschek, Gergo P. Szakmany, Alexei O. Orlov, Gary H. Bernstein, Wolfgang Porod, Paolo Lugli, and Peter Russer. "Antenna-coupled terahertz thermocouples." In 2015 IEEE MTT-S International Microwave Symposium (IMS2015). IEEE, 2015. http://dx.doi.org/10.1109/mwsym.2015.7166943.

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Kalcik, Jan, Karel Sima, and Radek Soukup. "Textile Hybrid Thread Thermocouples." In 2021 44th International Spring Seminar on Electronics Technology (ISSE). IEEE, 2021. http://dx.doi.org/10.1109/isse51996.2021.9467514.

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Reports on the topic "Thermocouples"

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Burns, G. W., and M. G. Scroger. The Calibration of thermocouples and thermocouple materials. Gaithersburg, MD: National Institute of Standards and Technology, 1989. http://dx.doi.org/10.6028/nist.sp.250-35.

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Kreider, Kenneth G., and Stephen Samancik. Internal combustion engine thin film thermocouples. Gaithersburg, MD: National Bureau of Standards, January 1985. http://dx.doi.org/10.6028/nbs.ir.85-3110.

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Kreider, Kenneth G. Thin film thermocouples for high temperature measurement. Gaithersburg, MD: National Institute of Standards and Technology, 1989. http://dx.doi.org/10.6028/nist.ir.89-4087.

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Johra, Hicham. Assembling temperature sensors: thermocouples and resistance temperature detectors RTD (Pt100). Department of the Built Environment, Aalborg University, December 2020. http://dx.doi.org/10.54337/aau449755797.

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Temperature is one of the most common physical quantities (measurand) to be measured in experimental investigations, monitoring and control of building indoor environment, thermal comfort and building energy performance. The most common temperature sensors are the thermocouples and the resistance temperature detectors (RTDs). These analog sensors are cheap, accurate, durable and easy to replace or to repair. The cable of these sensors can easily be shortened or extended. These sensors have a simple, monotonic and stable correlation between the sensor’s temperature and their resistance/voltage output, which makes them ideal for temperature measurement with electronic logging equipment. This technical report aims at providing clear guidelines about how to assemble and mount type-K thermocouples and Pt100 RTDs. These are the most common temperature sensors used in the Laboratory of Building Energy and Indoor Environment at the Department of the Built Environment of Aalborg University.
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Askew, N. M., and B. J. Hardy. The effect of inoperative thermocouples on K reactor limits. Office of Scientific and Technical Information (OSTI), July 1991. http://dx.doi.org/10.2172/5051061.

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Askew, N. M., and B. J. Hardy. The effect of inoperative thermocouples on K reactor limits. Office of Scientific and Technical Information (OSTI), July 1991. http://dx.doi.org/10.2172/10163892.

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Blevins, Linda G., and William M. Pitts. Modeling of bare and aspirated thermocouples in compartment fires. Gaithersburg, MD: National Institute of Standards and Technology, 1999. http://dx.doi.org/10.6028/nist.ir.6310.

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Kreider, K. G., D. P. DeWitt, B. K. Tsai, and B. Lojek. Workshop on temperature measurement of semiconductor wafers using thermocouples. Gaithersburg, MD: National Institute of Standards and Technology, 2001. http://dx.doi.org/10.6028/nist.ir.6566.

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Nakos, James T. Transient Adjustments for Metal-Sheathed Thermocouples on Metal Plates (Shrouds). Office of Scientific and Technical Information (OSTI), November 2018. http://dx.doi.org/10.2172/1483462.

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Joy L. Rempe, Darrell L. Knudson, J. E. Daw, and S. C. Wilkins. Long Duration Testing of Type C Thermocouples at 1500 ?C. Office of Scientific and Technical Information (OSTI), April 2008. http://dx.doi.org/10.2172/936619.

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