Academic literature on the topic 'Thermoelectric tension'
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Journal articles on the topic "Thermoelectric tension"
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PLEVACHUK, YURIY, VASYL SKLYARCHUK, GERNOT POTTLACHER, THOMAS LEITNER, PETER ŠVEC SR., PETER ŠVEC, LUBOMIR OROVCIK, MARTA DUFANETS, and ANDRIY YAKYMOVYCH. "The liquid AlCu4TiMg alloy: thermophysical and thermodynamic properties." High Temperatures-High Pressures 49, no. 1-2 (2020): 61–73. http://dx.doi.org/10.32908/hthp.v49.847.
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In this study, some structure-sensitive thermophysical properties, namely, thermal conductivity, thermoelectric power, density and surface tension of liquid AlCu4TiMg alloy, as one of the most promising cast alloys to fabricate components for cars, aircraft and other complex engineering products, were investigated. Thermoelectric power was measured in a wide temperature range by the four-point contact method. Thermal conductivity was investigated by the steady-state concentric cylinder method. The oscillating drop technique combined with electromagnetic levitation was used for density and surface tension studies. The results obtained are compared with experimental and calculated data from literature for pure aluminum.
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Dobosz, A., Yu Plevachuk, V. Sklyarchuk, B. Sokoliuk, and T. Gancarz. "The influence of Li on the thermophysical properties of liquid Ga–Sn–Zn eutectic alloys." Journal of Materials Science: Materials in Electronics 30, no. 20 (September 27, 2019): 18970–80. http://dx.doi.org/10.1007/s10854-019-02254-4.
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Abstract The Ga–Li system is very attractive for the development of microelectronic and Li-ion cell applications as negative electrodes. In this study, thermophysical properties such as density, surface tension, viscosity, thermal and electrical conductivity, and thermoelectric power were investigated. Taking into account the intermetallic compounds occurring in Ga–Li, the measurements were conducted in a temperature range of 323–773 K. The experimentally obtained results revealed lower density and surface tension with increasing Li additions. The viscosity, electrical conductivity and thermoelectric power slightly reduced with the addition of Li content to eutectic Ga–Sn–Zn. The opposite was true of thermal conductivity, which increased slightly. The performed Nusselt number and Peclet number calculations for eutectic Ga–Sn–Zn with Li additions show similar dependency as found in literature data for Ga and Ga–In alloys.
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Li, Guodong, Qi An, Sergey I. Morozov, Bo Duan, Pengcheng Zhai, Qingjie Zhang, William A. Goddard III, and G. Jeffrey Snyder. "Determining ideal strength and failure mechanism of thermoelectric CuInTe2 through quantum mechanics." Journal of Materials Chemistry A 6, no. 25 (2018): 11743–50. http://dx.doi.org/10.1039/c8ta03837f.
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Kumar, Pawan, Meenu Gupta, and Vineet Kumar. "Microstructural analysis and multi response optimization of WEDM of Inconel 825 using RSM based desirability approach." Journal of the Mechanical Behavior of Materials 28, no. 1 (October 1, 2019): 39–61. http://dx.doi.org/10.1515/jmbm-2019-0006.
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AbstractIncreasing demand of aerospace industry for more heat resistant and tough material have open up the possibility of the use of Inconel 825 for making of combustor casing and turbine blades. Because of its robust nature, Inconel 825 is a difficult-to-cut material with conventional methods. Wire-cut electrical discharge machining (WEDM), a non traditional method uses thermoelectric erosion principle to produce intricate shape and profiles of such difficult-to-cut material. In this study, various operating parameters of WEDM are optimized using desirability approach and microstructural behavior at optimum combinations was studied. Input parameters viz. pulse-on time, pulse-off time, peak current, spark gap voltage, wire tension, wire feed and performance has been measured in term of material removal rate, surface roughness and wire wear ratio. It has been observed that at 110 machine unit pulse-on time (Ton), 35 machine unit pulse-off time (Toff), 46 volt gap voltage (SV), 120 ampere peak current (IP), 11 machine unit wire tension (WT) and 5 m/min wire feed (WF), the values obtained for material removal rate (MRR), surface roughness (SR) and wire wear ratio (WWR) were 27.691mm2/min, 2.721 μmand 0.117 respectively. Scanning electron microscopy, energy dispersive spectrograph and X-ray diffraction analysis has also been carried out to study the surface characterization. Comparatively less numbers of cracks, pockmarks, craters, and pulled out material were found on work specimen surface and wire electrode surface under standardized conditions, thus maintaining the surface integrity of the machined surface.
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Price, J. M., and F. R. Wilmoth. "Elevated body temperature and increased blood vessel sensitivity in spontaneously hypertensive rats." American Journal of Physiology-Heart and Circulatory Physiology 258, no. 4 (April 1, 1990): H946—H953. http://dx.doi.org/10.1152/ajpheart.1990.258.4.h946.
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Body temperature (BT) was significantly greater in spontaneously hypertensive rats (SHR) than in Wistar-Kyoto (WKY) rats regardless of the time of day, length of rectal probe, sex, age, or commercial vendor. Bath temperature (theta) for excised aortic rings was controlled by a thermoelectric Peltier module with an accuracy of 0.1 degree C. At peak force in individual contractions of norepinephrine (NE) dose-response experiments, theta was changed from 37 to 39 degrees C. Active and resting wall tension (Tw) were increased, and the mean effective dose (ED50) was decreased in the SHR aorta with and without endothelium. For the WKY aorta, active and resting Tw were increased, but ED50 was the same with and without endothelium. These results were supported by experiments where theta was decreased from 39 to 37 degrees C and by experiments on Sprague-Dawley rats. Potassium dose-response experiments with aorta from SHR and WKY rats show an increase in sensitivity at 39 degrees C, but active Tw is the same at 39 and 37 degrees C. When compared at the BT of each rat, the NE ED50 was lower and resting Tw was higher in the SHR aorta than in the WKY aorta, but active Tw was the same.(ABSTRACT TRUNCATED AT 250 WORDS)
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Zou, Chunpeng, Chihou Lei, Daifeng Zou, and Yunya Liu. "Uniaxial Tensile Strain Induced the Enhancement of Thermoelectric Properties in n-Type BiCuOCh (Ch = Se, S): A First Principles Study." Materials 13, no. 7 (April 9, 2020): 1755. http://dx.doi.org/10.3390/ma13071755.
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It is well known that the performance of thermoelectric measured by figure of merit ZT linearly depends on electrical conductivity, while it is quadratic related to the Seebeck coefficient, and the improvement of Seebeck coefficient may reduce electrical conductivity. As a promising thermoelectric material, BiCuOCh (Ch = Se, S) possesses intrinsically low thermal conductivity, and comparing with its p-type counterpart, n-type BiCuOCh has superior electrical conductivity. Thus, a strategy for increasing Seebeck coefficient while almost maintaining electrical conductivity for enhancing thermoelectric properties of n-type BiCuOCh is highly desired. In this work, the effects of uniaxial tensile strain on the electronic structures and thermoelectric properties of n-type BiCuOCh are examined by using first-principles calculations combined with semiclassical Boltzmann transport theory. The results indicate that the Seebeck coefficient can be enhanced under uniaxial tensile strain, and the reduction of electrical conductivity is negligible. The enhancement is attributed to the increase in the slope of total density of states and the effective mass of electron, accompanied with the conduction band near Fermi level flatter along the Γ to Z direction under strain. Comparing with the unstrained counterpart, the power factor can be improved by 54% for n-type BiCuOSe, and 74% for n-type BiCuOS under a strain of 6% at 800 K with electron concentration 3 × 1020 cm−3. Furthermore, the optimal carrier concentrations at different strains are determined. These insights point to an alternative strategy for superior thermoelectric properties.
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Takayama, Yoshimasa, T. Abe, T. Yashiro, Hideo Watanabe, and Hajime Kato. "Fabrication of Structural Composite Accompanied with a Function of Thermoelectric Conversion." Materials Science Forum 561-565 (October 2007): 743–46. http://dx.doi.org/10.4028/www.scientific.net/msf.561-565.743.
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The composite accompanied with a function of thermoelectric conversion has been fabricated. It was a fiber metal laminate (FML) consisting of two aluminum alloy sheets of 0.5mm thickness and a central layer of glass fiber reinforced plastic (GFRP). The central layer with a thickness of 1mm included thermoelectric elements of Bi-Te based alloys between glass fibers. The mechanical properties of FML with and without the thermoelectric elements were evaluated by tensile and bending test. The thermomechanical properties were measured by a potentiometer for a module with heated and cooled sides, and plotted a potential as a function of difference in temperature between both sides.
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Bera, Jayanta, and Satyajit Sahu. "Strain induced valley degeneracy: a route to the enhancement of thermoelectric properties of monolayer WS2." RSC Advances 9, no. 43 (2019): 25216–24. http://dx.doi.org/10.1039/c9ra04470a.
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Strain induced valley degeneracy results enhancement of thermoelectric properties of monolayer WS2. Electron valleys and hole valleys become degenerate by applying compressive and tensile strain, respectively.
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Lv, H. Y., W. J. Lu, D. F. Shao, H. Y. Lu, and Y. P. Sun. "Strain-induced enhancement in the thermoelectric performance of a ZrS2monolayer." Journal of Materials Chemistry C 4, no. 20 (2016): 4538–45. http://dx.doi.org/10.1039/c6tc01135g.
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The thermoelectric performance of the ZrS2monolayer is greatly enhanced by the biaxial tensile strain, due to the simultaneous increase of the Seebeck coefficient and decrease of the thermal conductivity.
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Konabe, Satoru, Shiro Kawabata, and Takahiro Yamamoto. "Thermoelectric properties of bilayer phosphorene under tensile strain." Surface and Interface Analysis 48, no. 11 (July 27, 2016): 1231–34. http://dx.doi.org/10.1002/sia.6094.
Full textDissertations / Theses on the topic "Thermoelectric tension"
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Tuckerman, James K. "Capillary Self-Assembly and its Application to Thermoelectric Coolers." Scholar Commons, 2010. http://scholarcommons.usf.edu/etd/3704.
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The thermoelectric effect was discovered well over a century ago, yet performance has not shown improvement until recent years. Prior work has shown that the thermoelectric effect can be enhanced by the use of microscale pieces of thermoelectric material. Conventional assembly techniques are inadequate to deal with parts of this size, making it necessary to find a suitable alternative before these devices can be made economically. Capillary self-assembly is a promising alternative to conventional techniques. This method employs the use of preparing substrates with areas of favorable surface tension to place and align parts. Still, many obstacles have to be overcome to adapt this process for use of constructing thermoelectric coolers. The goal of this work is to overcome these obstacles and assess the viability of self-assembly for fabricating these devices. In effort to make the method more effective a process for creating more uniform deposits of solder is also assessed. This work shows that microscale thermoelectric elements can be assembled into functional thermoelectric devices using self-assembly techniques through the assembly of coolers in experimental work.
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Fries, Lukáš. "Výzkum bezolovnatých pájecích slitin z pohledu termoelektrických napětí." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2019. http://www.nusl.cz/ntk/nusl-402136.
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The thesis deals with the theoretical investigation of the thermoelectric tensions in lead-free solder. The theory introduces the reader to the formation and composition of solder joints, thermoelectric properties and behavior in circuits. Part of the thesis is the design and optimization of the measuring tool for lead-free solder and product samples with measuring.
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Mhiaoui, Souad. "Physical properties of lead free solders in liquid and solid state." Doctoral thesis, Universitätsbibliothek Chemnitz, 2008. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-200800401.
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The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of “cotutelle” between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocristalline powder with lead free solders "to sow" the liquid bath in order to obtain "different" solids which were examined using optical and electron microscopyDie europäische Gesetzgebung verbietet die Benutzung von Lötmitteln, die Blei enthalten. Bleilose Lote haben aber einen höheren Schmelzpunkt (typisch 20%) und ihre mechanischen Eigenschaften sind schlechter. Zusätzliche Probleme sind das Alterungsverhalten und das Haftvermögen des Lots an den Leiterbahnen. Daher müssen sich Forschungsaktivitäten auf die Optimierung der Eigenschaften von bleifreien Sn-Ag-Cu (SAC) Loten konzentrieren, die von der Industrie gewählt wurden. Zwei Hauptgebiete werden in dieser Arbeit bearbeitet. Im Zentrum des Ersten stehen seltsame Hysterese-Effekte von metallischen Kadmium- Antimon Legierungen bei thermischen Zyklen, wobei Transporteigenschaften wie die thermoelektrische Kraft und der elektrische Widerstand untersucht werden. Die zweite Aktivität, die in einer Kooperation der Universitäten Metz und Chemnitz (cotutelle) bearbeitet und die durch COST531 unterstützt wird, besteht in der detaillierten Erforschung des Lötprozesses ohne Blei. Eine Lötverbindung muß den Strom gut führen und die Wärme gut ableiten. In Metz haben wir die elektrische Leitfähigkeit, die thermoelektrische Kraft und das Wärmeleitvermögen bestimmt für verschiedene bleilose Lote (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb), sowohl im flüssigen als auch festen Zustand. Die Ergebnisse wurden mit dem klassischen bleihaltigen Lötzinn (Sn-Pb) verglichen. In Chemnitz haben wir die Oberflächen- und Grenzflächenspannung und die Dichte bleifreier Lote gemessen. Ebenfalls wurde die Viskosität dieser Lote ohne und mit Zusätzen (insbesondere Nickel) gemessen. Diese Eigenschaften wurden in Beziehung gesetzt zu den industriellen Problemen der Benetzbarkeit und des Fließverhaltens. Schließlich haben wir Legierungen unter verschiedenen Bedingungen verfestigt. Wir haben Unterkühlung beobachtet. Wir haben eine Technik entwickelt, basierend auf einer Mischung von Lot mit Pulver. Durch "Einsäen" von Nanokristallen in das flüssige Bad erhielten wir "verschiedene" Festkörper, die mit optischer und Elektronenmikroskopie untersucht wurden
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Mhiaoui, Souad. "Physical properties of lead free solders in liquid and solid state." Doctoral thesis, 2007. https://monarch.qucosa.de/id/qucosa%3A18889.
Full textAbstract:
The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry.
Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of “cotutelle” between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocristalline powder with lead free solders "to sow" the liquid bath in order to obtain "different" solids which were examined using optical and electron microscopy.Die europäische Gesetzgebung verbietet die Benutzung von Lötmitteln, die Blei enthalten. Bleilose Lote haben aber einen höheren Schmelzpunkt (typisch 20%) und ihre mechanischen Eigenschaften sind schlechter. Zusätzliche Probleme sind das Alterungsverhalten und das Haftvermögen des Lots an den Leiterbahnen. Daher müssen sich Forschungsaktivitäten auf die Optimierung der Eigenschaften von bleifreien Sn-Ag-Cu (SAC) Loten konzentrieren, die von der Industrie gewählt wurden. Zwei Hauptgebiete werden in dieser Arbeit bearbeitet. Im Zentrum des Ersten stehen seltsame Hysterese-Effekte von metallischen Kadmium- Antimon Legierungen bei thermischen Zyklen, wobei Transporteigenschaften wie die thermoelektrische Kraft und der elektrische Widerstand untersucht werden. Die zweite Aktivität, die in einer Kooperation der Universitäten Metz und Chemnitz (cotutelle) bearbeitet und die durch COST531 unterstützt wird, besteht in der detaillierten Erforschung des Lötprozesses ohne Blei. Eine Lötverbindung muß den Strom gut führen und die Wärme gut ableiten. In Metz haben wir die elektrische Leitfähigkeit, die thermoelektrische Kraft und das Wärmeleitvermögen bestimmt für verschiedene bleilose Lote (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb), sowohl im flüssigen als auch festen Zustand. Die Ergebnisse wurden mit dem klassischen bleihaltigen Lötzinn (Sn-Pb) verglichen. In Chemnitz haben wir die Oberflächen- und Grenzflächenspannung und die Dichte bleifreier Lote gemessen. Ebenfalls wurde die Viskosität dieser Lote ohne und mit Zusätzen (insbesondere Nickel) gemessen. Diese Eigenschaften wurden in Beziehung gesetzt zu den industriellen Problemen der Benetzbarkeit und des Fließverhaltens. Schließlich haben wir Legierungen unter verschiedenen Bedingungen verfestigt. Wir haben Unterkühlung beobachtet. Wir haben eine Technik entwickelt, basierend auf einer Mischung von Lot mit Pulver. Durch "Einsäen" von Nanokristallen in das flüssige Bad erhielten wir "verschiedene" Festkörper, die mit optischer und Elektronenmikroskopie untersucht wurden.
Book chapters on the topic "Thermoelectric tension"
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Newnham, Robert E. "Galvanomagnetic and thermomagnetic phenomena." In Properties of Materials. Oxford University Press, 2004. http://dx.doi.org/10.1093/oso/9780198520757.003.0022.
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The Lorentz force that a magnetic field exerts on a moving charge carrier is perpendicular to the direction of motion and to the magnetic field. Since both electric and thermal currents are carried by mobile electrons and ions, a wide range of galvanomagnetic and thermomagnetic effects result. The effects that occur in an isotropic polycrystalline metal are illustrated in Fig. 20.1. As to be expected, many more cross-coupled effects occur in less symmetric solids. The galvanomagnetic experiments involve electric field, electric current, and magnetic field as variables. The Hall Effect, transverse magnetoresistance, and longitudinal magnetoresistance all describe the effects of magnetic fields on electrical resistance. Analogous experiments on thermal conductivity are referred to as thermomagnetic effects. In this case the variables are heat flow, temperature gradient, and magnetic field. The Righi–Leduc Effect is the thermal Hall Effect in which magnetic fields deflect heat flow rather than electric current. The transverse thermal magnetoresistance (the Maggi–Righi–Leduc Effect) and the longitudinal thermal magnetoresistance are analogous to the two galvanomagnetic magnetoresistance effects. Additional interaction phenomena related to the thermoelectric and piezoresistance effects will be discussed in the next two chapters. In tensor form Ohm’s Law is . . .Ei = ρijJj , . . . where Ei is electrical field, Jj electric current density, and ρij the electrical resistivity in Ωm. In describing the effect of magnetic field on electrical resistance, we expand the resistivity in a power series in magnetic flux density B. B is used rather than the magnetic field H because the Lorentz force acting on the charge carriers depends on B not H.
Conference papers on the topic "Thermoelectric tension"
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Wu, Yongjia, Lei Zuo, and Kan Sun. "Modeling the Selective Laser Melting of Multi-Component Thermoelectric Powders." In ASME 2018 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/detc2018-86072.
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Thermoelectrics enables thermal and electrical energy conversion or device cooling without any moving parts. It has remained a significant challenge to manufacture compact and high performance thermoelectric modules in a large volume using the conventional methods because of their drawbacks in practice, such as the long processing time and misalignment of individual thermoelectric elements. Selective laser melting (SLM) based additive manufacturing approach might offer a unique method to fabricate the low cost, reliable, highly efficient, scalable, and environmentally friendly thermoelectric modules. To understand the thermodynamic and hydrodynamic phenomenon during the SLM processing is of critical importance to ensure high quality products. In this paper, we developed a model which can be used to guide the SLM manufacturing of thermoelectric material with other nanoparticles embedded for higher thermoelectric performance. This physical model based on the continuous equations had the ability to analyze the fluid flow driven by buoyancy force and surface tension, which can be used to analyze the influence of the process parameters on the pool size, particle segregation, as well as temperature distribution within the powder bed. This information is very useful for developing robust SLM for thermoelectric device fabrication.
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Paul, Abhijeet, Kai Miao, Ganesh Hegde, Saumitra Mehrotra, Mathieu Luisier, and Gerhard Klimeck. "Enhancement of thermoelectric efficiency by uniaxial tensile stress in n-type GaAs nanowires." In 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO). IEEE, 2011. http://dx.doi.org/10.1109/nano.2011.6144525.
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Xu, Yaoyao, and Gang Li. "Modeling of Strain-Induced Phonon Thermal Conductivity Reduction in Thermoelectric Nanocomposites." In ASME 2008 International Mechanical Engineering Congress and Exposition. ASMEDC, 2008. http://dx.doi.org/10.1115/imece2008-66574.
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In this paper, we study strain effects on the phonon thermal conductivity of 2-D Si/Ge nanocomposites. Lattice dynamics is employed for the calculation of the phonon scattering properties as a function of strain. Cauchy-Born rule is used to model the deformed configuration of the atoms. The effective thermal conductivity of the nanocomposite material is modeled by using a modified effective medium approximation (EMA) approach. The strain effects are incorporated into the modified EMA through the strain dependent phonon mean free path. The effective thermal conductivity of the strained nanocomposite material is calculated for different characteristic lengths of the Si component. The results show that a 2% tensile strain can reduce the effective thermal conductivity by more than 10%.
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Unni, Vineet, and Joseph P. Feser. "Mode Resolved Continuum Mechanics Model of Phonon Scattering From Embedded Cylinders." In ASME 2016 Heat Transfer Summer Conference collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/ht2016-7219.
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Phonon scattering from media with embedded spherical nanoparticles has been studied extensively over the last decade due to its application to reducing the thermal conductivity of thermoelectric materials. However, similar studies of thermal transport in fiber-embedded media have received little attention. Calculating the thermal conductivity tensor from microscopic principles requires knowledge of the scattering cross section spanning all possible incident elastic wave orientations, polarizations and wavelengths including the transition from Rayleigh to geometric scattering regimes. In this paper, we use continuum mechanics to develop an analytic treatment of elastic wave scattering for an embedded cylinder and show that a classic treatise on the subject contains important errors for oblique angles of incidence, which we correct. We also develop missing equations for the scattering cross section at oblique angles and study the sensitivity of the scattering cross section as a function of elas-todynamic contrast mechanisms. In particular, we find that for oblique angles of incidence, both elastic and density contrast are important mechanisms by which scattering can be controlled, but that their effects can offset one another, similar to the theory of reflection at flat interfaces. The solution developed captures the scattering physics for all possible incident elastic wave orientations, polarizations and wavelengths including the transition from Rayleigh to geometric scattering regimes, so long as the continuum approximation holds. The method thus enables incorporation of coherent scattering models into calculations of the thermal conductivity tensor for media with nanofibers.
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Samvedi, Vikas, and Vikas Tomar. "Role of Interface Thermal Boundary Resistance, Straining and Morphology in Thermal Conductivity of a Set of Si-Ge Superlattices and Biomimetic Si-Ge Nanocomposites." In ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASMEDC, 2011. http://dx.doi.org/10.1115/ajtec2011-44644.
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Nanoscale engineered materials with tailored thermal properties are desirable for applications such as highly efficient thermoelectric, microelectronic and optoelectronic devices. It has been shown earlier that by judiciously varying interface thermal boundary resistance (TBR) thermal conductivity in nanostructures could be controlled. Two types of nanostructures that have gained significant attention owing to the presence of TBR are superlattices and nanocomposites. A systematic comparison of thermal behavior of superlattices and nanocomposites considering their characteristic structural factors such as periodicity and period length for superlattices, and morphology for nanocomposites, under different extents of straining at a range of temperatures remains to be performed. In this presented work, such analyses are performed for a set of Si-Ge superlattices and Si-Ge biomimetic nanocomposites using non-equilibrium molecular dynamics (NEMD) simulations at three different temperatures (400 K, 600 K, and 800 K) and at strain levels varying between −10% and 10%. The analysis of interface TBR contradicts the usual notion that each interface contributes equally to the heat transfer resistance in a layered structure. The dependence of thermal conductivity of superlattice on the direction of heat flow gives it a characteristic somewhat similar to a thermal diode as found in this study. The comparison of thermal behavior of superlattices and nanocomposites indicate that the nanoscale morphology differences between the superlattices and the nanocomposites lead to a striking contrast in the phonon spectral density, interfacial thermal boundary resistance, and thermal conductivity. Both compressive and tensile strains are observed to be important factors in tailoring the thermal conductivity of the analyzed superlattices, whereas have very insignificant influence on the thermal conductivity of the analyzed nanocomposites.
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Samvedi, Vikas, and Vikas Tomar. "Role of Interface Thermal Boundary Resistance, Straining, and Morphology in Thermal Conductivity of a Set of Si-Ge Superlattices and Biomimetic Si-Ge Nanocomposites." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52284.
Full textAbstract:
Nanoscale engineered materials with tailored thermal properties are desirable for applications such as highly efficient thermoelectric, microelectronic and optoelectronic devices. It has been shown earlier that by judiciously varying interface thermal boundary resistance (TBR) thermal conductivity in nanostructures could be controlled. Two types of nanostructures that have gained significant attention owing to the presence of TBR are superlattices and nanocomposites. A systematic comparison of thermal behavior of superlattices and nanocomposites considering their characteristic structural factors such as periodicity and period length for superlattices, and morphology for nanocomposites, under different extents of straining at a range of temperatures remains to be performed. In this presented work, such analyses are performed for a set of Si-Ge superlattices and Si-Ge biomimetic nanocomposites using non-equilibrium molecular dynamics (NEMD) simulations at three different temperatures (400 K, 600 K, and 800 K) and at strain levels varying between −10% and 10%. The analysis of interface TBR contradicts the usual notion that each interface contributes equally to the heat transfer resistance in a layered structure. The dependence of thermal conductivity of superlattice on the direction of heat flow gives it a characteristic somewhat similar to a thermal diode as found in this study. The comparison of thermal behavior of superlattices and nanocomposites indicate that the nanoscale morphology differences between the superlattices and the nanocomposites lead to a striking contrast in the phonon spectral density, interfacial thermal boundary resistance, and thermal conductivity. Both compressive and tensile strains are observed to be important factors in tailoring the thermal conductivity of the analyzed superlattices, whereas have very insignificant influence on the thermal conductivity of the analyzed nanocomposites.