Relevant bibliographies by topics / ThicK substrate

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'ThicK substrate'

Author: Grafiati
Published: 4 June 2025
Last updated: 1 August 2025

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Journal articles on the topic "ThicK substrate"

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Uršič, Hana, Janez Holc, Marina Santo Zarnik, Marko Hrovat, and Marija Kosec. "Large Strain Actuation of 0.65PMN–0.35PT/Pt Thick-Film Bimorphs." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (2012): 000597–602. http://dx.doi.org/10.4071/cicmt-2012-tha23.

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The effect of clamping a piezoelectric layer to a relatively stiff substrate results in smaller displacements in comparison to substrate-free structures. To ensure a sufficient amount of the bending of actuators, it is important to reduce the thickness of the substrate. For this reason an approach to preparing “substrate-free”, large-displacement actuators using the screen-printing method was developed. The “substrate-free” 0.65PMN–0.35PT/Pt actuators were prepared by screen-printing the 0.65PMN–0.35PT and Pt pastes on alumina substrates. After the screen printing and the subsequent firing the
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Kokkomäki, T., A. Uusimäki, R. Rautioaho, J. Levoska, T. Murtoniemi, and S. Leppävuori. "Screen-Printed Superconducting Y-Ba-Cu-O Thick Films on Various Substrates." Active and Passive Electronic Components 13, no. 3 (1989): 197–209. http://dx.doi.org/10.1155/1989/82586.

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Superconducting thick films of the Y-Ba-Cu-O system prepared by screen-printing and sintering on different substrates were investigated to study the effect of the substrate material on the superconducting properties of the films. These properties were determined by carrying out structural studies using SEM, EPMA and XRD and by determining the electrical resistivity. The effect of diffusion barrier layers between the film and the substrate on the superconducting properties of the film was also studied. The onset temperature of superconductivity inYBa2Cu3O7−δ(123) superconducting thick film was
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Andreev V.G., Vdovin V. A., Glazunov P. S., Pyataikin I. I, and Pinaev Yu. V. "Effect of Thickness of the Dielectric Substrate on Absorbing and Antireflective Properties of Ultrathin Copper Films." Optics and Spectroscopy 130, no. 9 (2022): 1134. http://dx.doi.org/10.21883/eos.2022.09.54834.3539-22.

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The dependence of optical coefficients of ultrathin copper films 2-30 nm thick on the substrate thickness has been studied. Films were fabricated on quartz substrates 4 mm thick, and the thickness of the substrates (6 and 8 mm) was varied by tightly pressing clean substrates with thicknesses of 2 and 4 mm to a 4 mm substrate with a film. The measurements were carried out in a waveguide in the frequency range 8.5-12.5 GHz in the TE10 mode for two film orientations with respect to direction of the incident wave. The dependences of the optical coefficients measured when the wave was incident from
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Андреев, В. Г., В. А. Вдовин, П. С. Глазунов, И. И. Пятайкин та Ю. В. Пинаев. "Влияние толщины диэлектрической подложки на поглощающие и просветляющие свойства ультратонких пленок меди". Оптика и спектроскопия 130, № 9 (2022): 1410. http://dx.doi.org/10.21883/os.2022.09.53304.3539-22.

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The dependence of optical coefficients of ultrathin copper films 2 – 30 nm thick on the substrate thickness has been studied. Films were fabricated on quartz substrates 4 mm thick, and the thickness of the substrates (6 and 8 mm) was varied by tightly pressing clean substrates with thicknesses of 2 and 4 mm to a 4 mm substrate with a film. The measurements were carried out in a waveguide in the frequency range 8.5 – 12.5 GHz on the TE10 mode for two film orientations with respect to direction of the incident wave. The dependences of the optical coefficients measured when the wave was incident
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Kumar, Arun, and Anandh Subramaniam. "Finite Substrate Effects on Critical Thickness in Epitaxial Systems." Advanced Materials Research 585 (November 2012): 39–43. http://dx.doi.org/10.4028/www.scientific.net/amr.585.39.

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During the growth of an epitaxial overlayer on a thick substrate (GeSi on Si), an interfacial misfit dislocation becomes energetically favourable on exceeding the critical thickness. In substrates of finite thickness, the value of critical thickness is altered with respect to thick substrates. Thin substrates can bend and partially relax the coherency stresses, thus contributing to the altered value of the critical thickness. The current work aims at simulating the stress state of a growing finite epitaxial overlayer on a substrate of finite thickness, using finite element method. The numerica
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Li, Xin Mei, Xiao Feng Dong, Tu Erxun Si Dike, Kai Jie Li, and Dong Yu. "Characterization of Pure Titanium and Ti6Al4V Alloy Modified by Plasma Electrolytic Carbonitriding Process." Key Engineering Materials 522 (August 2012): 152–55. http://dx.doi.org/10.4028/www.scientific.net/kem.522.152.

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Porous nanocrystalline thick Ti (CxN1-x) films which bond firmly to the substrate are obtained on commercially pure titanium and Ti6Al4V alloy by plasma electrolytic carbonitriding (PECN) treatment. The microstructures and compositions of the modified layer on different substrates were compared. The results showed that the modified layer is composed of the outer Ti (CxN1-x) film and the diffusion layer. When discharge-treated for 150 min, the thickness of the Ti (CxN1-x) film is ~15μm, irrespective of the different substrate. The TiH2 riched diffusion layer which is 40-45μm thick is located be
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Maeder, Thomas, Caroline Jacq, Stefane Caseiro, and Peter Ryser. "Fabrication, response and stability of miniature piezoresistive force-sensing thick-film cantilevers." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (2016): 000024–31. http://dx.doi.org/10.4071/2016cicmt-tp1a3.

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Abstract Miniature ceramic cantilevers have been successfully applied to the fabrication of simple and low-cost piezoresistive thick-film force-sensing cells, using different thick-film and LTCC (low-temperature co-fired ceramic) substrates. The availability of thin substrates for some materials allows much improved sensitivity compared to classical thick-film technology, with LTCC also featuring rather low substrate elastic modulus and fine structurability. However, practical applicability may be hindered by processing difficulties, such as printing and handling very thin fired substrates, or
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Matsumae, Takashi, Hitoshi Umezawa, Yuichi Kurashima, and Hideki Takagi. "(Invited, Digital Presentation) Low-Temperature Direct Bonding of Wide-Bandgap Semiconductor Substrates." ECS Transactions 111, no. 2 (2023): 53–60. http://dx.doi.org/10.1149/11102.0053ecst.

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For the next-generation semiconductor devices, our research group has developed direct bonding techniques of wide-bandgap materials, including SiC, Ga2O3, and diamond. It is known that the semiconductor substrates activated by oxygen plasma can form atomic bonds at low temperatures. In this case, a thick oxide layer, which may become a thermal and electrical barrier, is formed at the bonding interface. Meanwhile, our research group demonstrated that the OH-terminated Ga2O3 and diamond substrates were directly bonded without an oxide intermediate layer. In addition, the SiC substrate dipped int
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Immovilli, Simona, Bruno Morten, Maria Prudenziati, Alessandro Gualtieri, and Massimo Bersani. "Interactions between bismuth oxide and ceramic substrates for thick film technology." Journal of Materials Research 13, no. 7 (1998): 1865–74. http://dx.doi.org/10.1557/jmr.1998.0265.

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We investigated the interactions between screen printed and fired layers of Bi2O3 and ceramic substrates of alumina and beryllia. It was found that the reaction products are invariably crystalline in nature. Several transitions of Bi2O3 in its polymorphic phases were found to occur on BeO substrates, while newly formed compounds have been observed to grow on alumina substrates, i.e., Al4Bi2O9 on 99.9% Al2O3 and Bi12SiO20 on 96% Al2O3. Bismuth deeply penetrates in the ceramic interstices in all the cases. Until Bi2O3 is not completely reacted, this penetration is diffusion limited (penetration
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Syväjärvi, Mikael, Rositza Yakimova, Gholam Reza Yazdi, Arul Arjunan, Eugene Toupitsyn, and Tangali S. Sudarshan. "Stability of Thick Layers Grown on (1-100) and (11-20) Orientations of 4H-SiC." Materials Science Forum 527-529 (October 2006): 227–30. http://dx.doi.org/10.4028/www.scientific.net/msf.527-529.227.

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Thick layers have been grown on (1120) and (1 1 00)6H-SiC substrates. The thicknesses are up to 90 #m obtained with growth rate of 180 #m/h. Even in such thick layers the surfaces are smooth and only disturbed by polishing scratches. The surfaces contain steps which facilitate reproduction of the substrate polytype.
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Dissertations / Theses on the topic "ThicK substrate"

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Stephens, D. "Millimeter-wave substrate integrated waveguides and components in thick-film technology." Thesis, University of Surrey, 2005. http://epubs.surrey.ac.uk/958/.

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Schulz, Noel Nunnally. "The Role of residual stresses in ceramic substrate materials for hybrid thick film applications." Thesis, This resource online, 1990. http://scholar.lib.vt.edu/theses/available/etd-05092009-040342/.

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Tick, T. (Timo). "Fabrication of advanced LTCC structures for microwave devices." Doctoral thesis, University of Oulu, 2009. http://urn.fi/urn:isbn:9789514292507.

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Abstract The main objective of this thesis was to research the integration of novel materials and fabrication processes into Low Temperature Co-fired Ceramic (LTCC) technology; enabling fabrication of Radio Frequency (RF) and microwave components with advanced performance. The research focuses on two specific integration cases, which divide the thesis into two sections: the integration of tunable dielectric structures and the integration of air filled waveguides. The first section of the thesis describes the development and characterization of low sintering temperature Barium Strontium Titan
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Lacika, Marek. "Tlustovrstvá topná deska s regulací výkonu." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2020. http://www.nusl.cz/ntk/nusl-413223.

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This thesis deals with issues of used hot plates and thick-film technology. The theoretical part of diploma thesis contains a theoretical analysis and description of corresponding technology and usage of materials. The practical part of the thesis focuses on the design of the resulting device, which forms design of the test and optimized hot element, the initial design of the device and the design of models for temperature simulations. Then follows description of the practical realization of the motifs and testing of the created thick-film structure on a ceramic substrate. In the last part are
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Pettersson, Elin. "Vilken preferens har tjockskalig målarmussla (Unio crassus) för bottensubstrat och vattenhastighet i Storån, Östergötland?" Thesis, Linköpings universitet, Biologi, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-78999.

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The thick shelled river mussel (Unio crassus) has a fragmented distribution in southern Sweden. It is a threatened and protected species. In both the Swedish red list and the IUCN Red List of Threatened Species Unio crassus is classified as Endangered (EN). Causes for this classification are for instance differentiated bottom substrate and deterioration in water quality. In this study, habitat preferences of Unio crassus were investigated to assist in future restoration work. The environmental parameters that were used to characterize the habitat in sites with or without Unio crassus were wate
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Norton, Murray Grant. "Characterisation and thick film metallisation of aluminium nitride substrates." Thesis, Imperial College London, 1989. http://hdl.handle.net/10044/1/47594.

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Cole, Robert Lawrence. "Precision Excimer Laser Lithography for Cylindrical Substrates With Thick Photoresists." University of Cincinnati / OhioLINK, 2004. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1093033859.

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Barlow, Fred D. III. "Thick film Y₁Ba₂Cu₃Ox on buffered ceramic substrates." Thesis, Virginia Tech, 1994. http://hdl.handle.net/10919/46096.

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High Temperature Superconductors (HTS) materials are ideal for many electrical applications. These applications include high speed interconnects, microwave structures and transmission lines, as well as electronic devices that utilize the unique electrical and magnetic properties of these materials. To date, the use of high temperature superconductors has been limited to a narrow range of substrate materials, due to the reactive nature of these superconductors. Chemical reactions between the substrate and the superconductor cause decomposition of the superconductor into an insulator. The
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Barlow, Fred D. "Thick film Y₁Ba₂Cu₃Ox on buffered ceramic substrates /." This resource online, 1994. http://scholar.lib.vt.edu/theses/available/etd-12042009-020146/.

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Cole, Robert C. "Precision excimer laser lithography for cylincrical substrates with thick photoresists." Cincinnati, Ohio : University of Cincinnati, 2004. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=ucin1093033859.

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Books on the topic "ThicK substrate"

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United States. National Aeronautics and Space Administration., ed. High-Tc fluorine-doped YBaCuOy films on ceramic substrates by screen printing. National Aeronautics and Space Administration, 1991.

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United States. National Aeronautics and Space Administration., ed. High-Tc fluorine-doped YBaCuOy films on ceramic substrates by screen printing. National Aeronautics and Space Administration, 1991.

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Hooker, Matthew W. Preparation and properties of high-Tc Bi-Pb-Sr-Ca-Cu-O thick film superconductors on YSZ substrates. National Aeronautics and Space Administration, Langley Research Center, 1996.

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Kulawski, Martin. Advanced CMP processes for special substrates and for device manufacturing in MEMS applications. VTT Technical Research Centre of Finland, 2006.

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Hickey, Michael A. Reduced surface-wave twin arc-slot antennas on electrically thick dielectric substrates. National Library of Canada, 2001.

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Center, Langley Research, ed. Preparation and properties of high-T(sub c) Bi-Pb-Sr-Ca-Cu-O thick film superconductors on YSZ substrates: Under contract NAS1-96014. National Aeronautics and Space Administration, Langley Research Center, 1996.

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Simcoe, Michael K. The design of high-gain slot arrays on electrically thick substrates for millimeter-wave applications. National Library of Canada, 2001.

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Moussa, Mohamed A. A. Fabrication and characterisation of Nd-123 high-temperature superconducting thick films on yttria stabilized zirconia substrates. University of Birmingham, 2003.

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Köbel, Stefan. Bi₂Sr₂CaCu₂Ox Superconducting thick films on MgO substrates. 2001.

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Book chapters on the topic "ThicK substrate"

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Yoshiara, Kiichi, Kenji Kagata, Tsutomu Hiroki, and Kiyotaka Nakahigashi. "Multi-Layered Superconducting YBa2Cu3Oy Thick Films on Y2BaCuO5 Substrate." In Advances in Superconductivity. Springer Japan, 1989. http://dx.doi.org/10.1007/978-4-431-68084-0_53.

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Zargar, Rayees Ahmad, and Manju Arora. "Screen Printed Thick Films on Glass Substrate for Optoelectronic Applications." In Photoenergy and Thin Film Materials. John Wiley & Sons, Inc., 2019. http://dx.doi.org/10.1002/9781119580546.ch6.

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Kim, Young Ha, Tae Hyun Sung, Sang Chul Han, et al. "Effect of Substrate Texture on Superconducting Properties of YBCO Thick Films." In Solid State Phenomena. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/3-908451-31-0.283.

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Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, and Gaetano Sequenzia. "Analysis of Warpage Induced by Thick Copper Metal on Semiconductor Device." In Lecture Notes in Mechanical Engineering. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-70566-4_10.

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AbstractElectrochemical deposited (ECD) thick film copper on silicon substrate is one of the most challenging technological brick for semiconductor industry representing a relevant improvement from the state of art because of its excellent electrical and thermal conductivity compared with traditional compound such as aluminum. The main technological factor that makes challenging the industrial implementation of thick copper layer is the severe wafer warpage induced by Cu annealing process, which negatively impacts the wafer manufacturability. The aim of presented work is the understanding of w
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Li, Junjun, Li Liu, Itsunari Minami, Shigeru Miyagawa, and Yoshiki Sawa. "Fabrication of Thick and Anisotropic on Nanofibrous Substrate for Repairing Infarcted Myocardium." In Methods in Molecular Biology. Springer US, 2021. http://dx.doi.org/10.1007/978-1-0716-1484-6_7.

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Song, Yang, Yong Huang, and Zheng He Han. "Texture Development of Dip-Coated Bi-2223 Thick Films on Ag Substrate." In High-Performance Ceramics III. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-959-8.557.

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Taniguchi, Satoshi, Tasuku Kitamura, Yuh Shiohara, et al. "Preparation of YBa2Cu3O7-y thick film on YSZ substrate by Liquid Phase Epitaxy." In Advances in Superconductivity VIII. Springer Japan, 1996. http://dx.doi.org/10.1007/978-4-431-66871-8_173.

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Hu, Yung-Haw, and Charles L. Booth. "High Tc Y-Ba-Cu-O Superconducting Thick Films Fabrication and Film/Substrate Interactions." In Advances in Superconductivity. Springer Japan, 1989. http://dx.doi.org/10.1007/978-4-431-68084-0_109.

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Matsui, K., R. Katsutani, M. Tagami, and Y. Nakanishi. "Forming of Y1Ba2Cu3O7-y Superconductive Thick Film on Metal Substrate with Sprayed YSZ Buffer Layer." In Advances in Superconductivity IV. Springer Japan, 1992. http://dx.doi.org/10.1007/978-4-431-68195-3_115.

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Chow, Khoon-Keat, T. K. Woo, Swee Leong Kok, Kok-Tee Lau, and Ali Mohammed Abdal Kadhim. "Piezoelectric P(VDF-TrFE) Thick Film Based Micro-power Generator Using Flexible Substrate for Wearable Applications." In Lecture Notes in Mechanical Engineering. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-15-0002-2_12.

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Conference papers on the topic "ThicK substrate"

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Hendershot, Lucas, Matt Hodek, Prem Chahal, John Albrecht, and John Papapolymerou. "Ku-Band Patch Antenna on Thick, Aerosol Jet Printed Substrate." In 2024 IEEE International Symposium on Antennas and Propagation and INC/USNC‐URSI Radio Science Meeting (AP-S/INC-USNC-URSI). IEEE, 2024. http://dx.doi.org/10.1109/ap-s/inc-usnc-ursi52054.2024.10687178.

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Han, Ying, Yulong Fang, Bo Wang, Nan Gao, and Zhirong Zhang. "Growth of Thick GaN Epitaxial Materials on 150mm Engineered Substrate." In 2024 21st China International Forum on Solid State Lighting & 2024 10th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS). IEEE, 2024. https://doi.org/10.1109/sslchinaifws64644.2024.10835353.

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Shirayanagi, Yusuke, Shingo Tomohisa, Keiji Kasamura та ін. "Preparation of GaN-HEMTs Devices Bonded to 150μ m Thick Diamond Substrate". У 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2024. https://doi.org/10.1109/ltb-3d64053.2024.10774112.

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Kovarik, O., M. Baryshnikova, R. Singh, et al. "Cold Sprayed Bell Metal: Improving Adhesion by Substrate Laser Surface Texturing." In ITSC 2025. ASM International, 2025. https://doi.org/10.31399/asm.cp.itsc2025p0391.

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Abstract This study investigates improving the adhesion of bell metal repairs using substrate surface treatment. Copper-tin alloy (Cu20Sn) powder was deposited onto Cu20Sn substrates with various surface treatments, including ground, polished, cold spray (CS)-blasted, and laser-textured surfaces. Adhesion was tested using a bending method adapted for thick CS deposits. Results showed that CS-blasting achieved approximately 70 MPa adhesion, while laser texturing yielded up to 120 MPa.The adhesion strength was partially related to the adhesion area ratio, and fractographic analysis revealed the
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Chen, Yinching Iris, Ilknur Ay, Hernan Millan, and Giorgio Bonmassar. "A Polymer Thick Film on an organic substrate Grid Electrode for UHF MRI." In 2024 46th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC). IEEE, 2024. https://doi.org/10.1109/embc53108.2024.10781664.

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Pérez, Manuel, Sergio Rojas, David Rojas, German Yamhure, Arturo Fajardo, and Carlos-Iván Páez-Rueda. "Elliptical Loaded Substrate Integrated Waveguide Thick H-Plane Horn Antenna in the K Band." In 2024 IEEE International Symposium on Antennas and Propagation and INC/USNC‐URSI Radio Science Meeting (AP-S/INC-USNC-URSI). IEEE, 2024. http://dx.doi.org/10.1109/ap-s/inc-usnc-ursi52054.2024.10685901.

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Delait, L., Z. Tian, M. Rack, et al. "Planar Leaky-Wave Antenna Design on Thick Substrate by Radiating Surface Waves Using Strip Rings." In 2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). IEEE, 2024. http://dx.doi.org/10.1109/irmmw-thz60956.2024.10697743.

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Lin, Kaijun, Manjuan Huang, Xiaowei Feng, Zhenming Li, Wei Liu, and Huicong Liu. "Impact-Induced Frequency Up-Conversion Vibration Energy Harvester Based On Metal-Substrate Piezoelectric Thick Film." In 2024 IEEE 23rd International Conference on Micro and Miniature Power Systems, Self-Powered Sensors and Energy Autonomous Devices (PowerMEMS). IEEE, 2024. https://doi.org/10.1109/powermems63147.2024.10814213.

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Lee, Seunghyun, Sri Harsha Kodati, Bingtian Guo, et al. "Thick Al0.85Ga0.15As0.56Sb0.44 avalanche photodiodes on InP substrate." In Infrared Technology and Applications XLVII, edited by Gabor F. Fulop, Masafumi Kimata, Lucy Zheng, Bjørn F. Andresen, and John Lester Miller. SPIE, 2021. http://dx.doi.org/10.1117/12.2585831.

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Manteghi, M. "Wideband microstrip patch antenna on a thick substrate." In 2008 IEEE Antennas and Propagation Society International Symposium and USNC/URSI National Radio Science Meeting. IEEE, 2008. http://dx.doi.org/10.1109/aps.2008.4619868.

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Reports on the topic "ThicK substrate"

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Chow, R., G. E. Loomis, and P. Biltoft. Determining the refractive index of a {lambda}/4 thin film on a thick substrate from a transmittance measurement. Office of Scientific and Technical Information (OSTI), 1993. http://dx.doi.org/10.2172/10181163.

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Lever, James, Emily Asenath-Smith, Susan Taylor, and Austin Lines. Assessing the mechanisms thought to govern ice and snow friction and their interplay with substrate brittle behavior. Engineer Research and Development Center (U.S.), 2021. http://dx.doi.org/10.21079/1168142742.

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Sliding friction on ice and snow is characteristically low at temperatures common on Earth’s surface. This slipperiness underlies efficient sleds, winter sports, and the need for specialized tires. Friction can also play micro-mechanical role affecting ice compressive and crushing strengths. Researchers have proposed several mechanisms thought to govern ice and snow friction, but directly validating the underlying mechanics has been difficult. This may be changing, as instruments capable of micro-scale measurements and imaging are now being brought to bear on friction studies. Nevertheless, gi
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L. H. Perdieu. Evaluation of Cadmium-Free Thick Film Materials on Alumina Substrates. Office of Scientific and Technical Information (OSTI), 2009. http://dx.doi.org/10.2172/1054755.

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Uribe, Fernando R., Alice C. Kilgo, John Mark Grazier, et al. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates. Office of Scientific and Technical Information (OSTI), 2008. http://dx.doi.org/10.2172/942186.

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