Relevant bibliographies by topics / Thin film analysis

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Thin film analysis'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 February 2022

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Journal articles on the topic "Thin film analysis"

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Panday, K. M., P. L. Choudhury, and N. P. Kumar. "Numerical Unsteady Analysis of Thin Film Lubricated Journal Bearing." International Journal of Engineering and Technology 4, no. 2 (2012): 185–91. http://dx.doi.org/10.7763/ijet.2012.v4.346.

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Yongqiang Hou, Yongqiang Hou, Hongji Qi Hongji Qi, Kui Yi Kui Yi, and Jianda Shao Jianda Shao. "Analysis of angular-selective performances of obliquely deposited birefringent thin film." Chinese Optics Letters 11, no. 10 (2013): 103101–5. http://dx.doi.org/10.3788/col201311.103101.

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O., Olabisi, and Adegboyega O. "Optical and Microstructural Analysis of Chemically prepared Lead Sulphide PbS Thin Film." International Journal of Trend in Scientific Research and Development Volume-2, Issue-2 (2018): 1006–108. http://dx.doi.org/10.31142/ijtsrd9597.

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Setyanto, Taufiq Arif, Zheng Jinhua, Masahiko KATO, and Keijiro NAKASA. "Analysis of Cracking and Delamination of Sputtered Thin Film during Wear Process." Proceedings of Conference of Chugoku-Shikoku Branch 2004.42 (2004): 43–44. http://dx.doi.org/10.1299/jsmecs.2004.42.43.

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Showalter, R. E., and Hee Chul Pak. "Thin-film capacitance models." Applicable Analysis 78, no. 3-4 (2001): 415–51. http://dx.doi.org/10.1080/00036810108840944.

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Khaled, A. R. A., and K. Vafai. "Analysis of Thermally Expandable Flexible Fluidic Thin-Film Channels." Journal of Heat Transfer 129, no. 7 (2006): 813–18. http://dx.doi.org/10.1115/1.2712853.

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Heat transfer inside thermally expandable and flexible fluidic thin-film channels is analyzed in this work. Two categories are analyzed: the first category is when the upper plate of the thin film is mobile and flexible, and the second is when the side plates of the thin film are flexible and mobile. The expansion in the thin-film heights (category I) or widths (category II) are linearly related to the local fluid pressure and the local temperature of the heated plate based on the principles of linear elasticity and constant volumetric thermal expansion coefficient. The governing Reynolds, momentum, and energy equations are properly nondimensionalized and solved numerically using an implicit method. The Peclet number, stiffness parameter, thermal expansion parameter, and aspect ratio are found to be the main controlling parameters. It is found that thermally expandable flexible thin films that belong to category I can produce significant increase in cooling as the heating load increases, especially when operated at lower Peclet numbers, whereas the cooling effect for those that belong to category II is almost unaffected by the expansion. This work paves the way to practically utilize thermally expandable flexible thin films, especially in MEMS and electronic cooling applications.
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de Boer, Maarten P., John C. Nelson, and William W. Gerberich. "Thin film scratch testing in two dimensions—Experiments and analysis." Journal of Materials Research 13, no. 4 (1998): 1002–14. http://dx.doi.org/10.1557/jmr.1998.0141.

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We have modified the microscratch test to create a near plane strain loading condition. In the Microwedge Scratch Test (MWST), a wedge-shaped diamond indenter tip is drawn along a fine line (i.e., narrow strip of film), while simultaneously being driven into the line. We compare microwedge scratching of zone 1 (voided grain boundaries) and zone T (metallurgical grain boundaries) thin film specimens of sputtered tungsten on thermally grown SiO2. Symptomatic of its weak grain boundaries, the zone 1 film displays three separate crack systems. Because of its superior grain boundary strength, the zone T film displayed only one of these—an interfacial crack system. By correlating fracture phenomena to signature events in the load-displacement curve, we develop governing equations for propagating interfacial cracks, including expressions for strain energy release rate, bending strain, and mode mixity. Grain boundary fracture causes zone 1 films to spall before a stable crack is formed. Zone T films survive the bending strains, and hence adhesions may be inferred from stable crack growth mechanics. We conclude by contrasting and comparing experimental results for plane strain indentation versus plane strain scratching.
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Iwata, Nobuyuki, Takuji Kuroda, and Hiroshi Yamamoto. "Crystal Structure Analysis of the Cr2O3 thin films." MRS Proceedings 1454 (2012): 33–38. http://dx.doi.org/10.1557/opl.2012.1111.

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ABSTRACTUsing DC-RF magnetron sputtering method, the stress free c- and r-oriented Cr2O3 thin films were grown on c- and r-cut sapphire substrates, respectively. The c-oriented film grown at 580 ºC shows the smoothest surface with a surface average (Ra) of 0.17, although the c-surface energy is the highest. The origin of the smooth surface is expected that the presence of a twin grain due to a dislocation of Cr atoms, demonstrated by a reciprocal space mapping. The step height corresponding to that of the bulk is clearly observed. The r-oriented films epitaxially grow without twin grain. The Ra is 1.56 in the film grown at 580 ºC because of deep trenches due to a lattice mismatch and no dislocation like c-oriented films. Since the surface energy of the r-surface is the lowest, the terrace is quite smooth in one grain even at higher substrate temperature of 840 ºC.
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Shupenev, A. E., N. S. Pankova, I. S. Korshunov, and A. G. Grigoriyants. "An Analysis of Non-Destructive Methods for Thin Film Thickness Measurement." Proceedings of Higher Educational Institutions. Маchine Building, no. 4(709) (April 2019): 18–27. http://dx.doi.org/10.18698/0536-1044-2019-4-18-27.

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The thickness of thin films determines the films’ unique properties, due to which they are widely used in optics and electronics. To measure the thickness of films in the range of 1 nm — 1 mcm during film deposition or on a finished product, it is important that non-destructive measurement methods should be used. An analysis of the most commonly used non-destructive methods for measuring and controlling the thickness of thin films is performed, with a possibility of in situ control of the technological process as well as for testing of finished products. This work describes theoretical and practical considerations of using reflection high-energy electron diffraction, piezoelectricity, interferometry and gravimetric methods for thin film thickness measurements. The results of the study can be used for selecting an optimal method of obtaining thin films when conducting theoretical and applied research.
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Lieb, Klaus-Peter. "Thin film analysis with nuclear methods." Contemporary Physics 40, no. 6 (1999): 385–413. http://dx.doi.org/10.1080/001075199181297.

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Dissertations / Theses on the topic "Thin film analysis"

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Craib, Glenn R. G. "Thin film structural determination and surface analysis." Thesis, University of Aberdeen, 1996. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.320771.

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A combined approach to the use of surface analysis techniques and X-ray diffraction has been introduced. In particular the development of the microstructure of UHV evaporated thin metallic films has been investigated with a view to clarifying influences on microstructure (particularly texture). This study has shown the wide range of experimental parameters which affect the final film structure, such as temperature, oblique incidence and substrate roughness. An automated energy dispersive X-ray diffractometer has been developed for the study of thin film texture. The required corrections for loss of intensity due to sample positioning have been developed and verified. Pole figures have been collected for erbium and nickel thin films (thickness 200-1200 nm) grown on molybdenum or glass substrates. Results for the erbium films show a substantial effect on the texture of the film, contributed by the temperature of the substrate during deposition. The texture varies from mixed fiber at low temperature, to a strong single fiber orientation at around 663 K, to mixed fiber at higher temperatures. The strong orientation at 663 K has been shown to vary from either (002) to (101) depending on as yet unknown experimental conditions. The effect of substrate roughness appears to be only in the degree of orientation and it does not affect the overall nature of the texture of the film. The texture of the nickel films shows a form of "granular epitaxy" at substrate temperatures above 300 K. The presence of tensile stress within one of these nickel thin film samples has been determined and is interpreted to give support to a proposed mode of granular epitaxy.
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Severtson, Yuan C. "Stability analysis of thin film coating systems." Diss., Georgia Institute of Technology, 1996. http://hdl.handle.net/1853/17965.

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Parshall, Elaine Ruth 1962. "Phase-conjugate interferometry for thin film analysis." Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/291358.

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A phase-conjugate interferometric method of thin film analysis obtains three independent parameters with which to determine a film's refractive index n, absorption coefficient kappa, and thickness d. Because dimensionless intensity ratios are used, this method is self-calibrating except for light source polarization and incident angle. The use of self-pumped phase-conjugate reflectors makes the interferometer self-aligning and results in infinite spacing of fringes of equal thickness. A single layer thin film sample was analyzed by this technique, and the results compared to those of ellipsometry.
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Pottage, John Mark. "Analysis of thin-film photonic crystal microstructures." Thesis, University of Bath, 2003. https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.269994.

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Kumar, Shreyas. "Simulations of Surfactant Driven Thin Film Flow." Scholarship @ Claremont, 2013. http://scholarship.claremont.edu/hmc_theses/63.

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This thesis is intended to fulfill the requirements of the Math and Physics departments at Harvey Mudd College. We begin with a brief introduction to the study of surfactant dynamics followed by some background on the experimental framework our work is related to. We then go through a derivation of the model we use, and explore in depth the nature of the Equation of State (EoS), the relationship between the surface tension on a fluid and the surfactant concentration. We consider the effect of using an empirical equation of state on the results of the simulations and compare the new results against the results produced using a multilayer (EoS) as well as experimental observations. We find that the empirical EoS leads to two new behaviors - preserving of large gradients of surfactant concentration and the occurrence of dynamics in distinct regimes. These behaviors suggest that the empirical EoS improves the agreement of the model’s prediction with experiment.
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Krus, David Jr. "Finite element analysis of thin film mechanical properties." Case Western Reserve University School of Graduate Studies / OhioLINK, 1992. http://rave.ohiolink.edu/etdc/view?acc_num=case1059745475.

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Sriram, K. "A Finite Element Investigation Of Brittle Fracture During Spherical Nanoindentation Of Thin Hard Films." Thesis, Indian Institute of Science, 2001. http://hdl.handle.net/2005/252.

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Hard ceramic films of micrometric thickness deposited on a soft metallic substrate have ushered in a new era in the fabrication of structural, tribological, microelectronic and optical components. The mechanical performance of these components is however critically dependent on the strength and toughness of these films as well as on those of the film-substrate interface. Recent studies have shown that cylindrical and radial cracks can propagate through the film during nanoindentation tests with spherically tipped and pointed indenters, resulting in steps in the load versus displacement curve. In this thesis, the mechanics of fracture of thin hard films bonded to soft substrates, during nanoindentation is studied by carrying out finite element analyses. The role of plastic yielding in the substrate on the above issue is examined. Another important objective of this work is to propose a method by which finite element simulations can be employed to interpret nanoindentation test results and yield information related to the fracture behaviour of hard films. To this end, axisymmetric finite element analyses of spherical nanoindentation of a TiN film of thickness t = 1 //m, on a steel substrate are carried out. Numerical algorithms for large deformation, contact simulation and computation of energy release rate are employed in the analyses. The film is assumed to be linear elastic, whereas, an elastic-plastic constitutive model is used for the substrate. A nanoindentation analysis of the uncracked film is first carried out. The development of plastic yielding in the substrate and its influence on the load P versus penetration h characteristics is examined. The stress fields around the indenter for different depths of indentation are studied. The results show that the radial stress attains a tensile peak at the film surface, just outside the indented zone. However, it becomes compressive with increasing distance below the surface. Interestingly, a tensile radial stress prevails at the film-substrate interface at large indentation depth. The shear stress increases to a peak value at a distance of 0.052 to OAt below the film surface depending upon the radial location and then reduces. Next, circumferential cracks extending downwards from the film surface are introduced at different radial distances R from the axis of symmetry. Finite element analyses are carried out till the indented zone extends almost up to the crack surface. The energy release rate J is computed as a function of indentation depth for different crack lengths c (in the range from O.lt to 0.9t). The results show that shallow cracks are essentially under Mode II loading with closure of crack faces caused by compressive radial stresses. However, a mixed-mode state prevails if the crack length is large (c > 0.62), with crack faces opening out due to tensile radial stress near the film-substrate interface. The variation of J with c/t for cracks located at different radial distances R is examined. It is found that for small R, there is a decreasing branch in the J versus c variation between c = 0.2i to 0.75£ which indicates that crack extension in this range will be stable. On the other hand, for large R, J increases monotonically with c/t which implies that unstable fracture of the full film thickness will occur following crack initiation. A composite nomogram is generated in the P — h plane where constant J lines are plotted along with load-displacement curves for different crack lengths. If now a nanoindentation (experimental) load-displacement behaviour is superimposed on this nomogram, the initial crack length (of a pre-existing flaw), the final crack length and fracture energy of the film can be inferred. In the last part of the thesis, the effect of the substrate yield strength on the indentation mechanics is studied. It is found that upon decreasing the yield strength, the load at a given indentation depth decreases while the residual depth at unloading increases. Also, the energy release rate for a given radial location and crack length reduces considerably at large depths of indentation.
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Liyanage, Chinthaka. "Specific property analysis of thin-film semiconductors for effective optical logical operations." Connect to full text in OhioLINK ETD Center, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1217089206.

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Hamblin, Mark Noble. "Thin Film Microfluidic and Nanofluidic Devices." BYU ScholarsArchive, 2010. https://scholarsarchive.byu.edu/etd/2281.

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Lab-on-a-chip devices, also known as micro total analysis systems (μTAS), are implementations of chemical analysis systems on microchips. These systems can be fabricated using standard thin film processing techniques. Microfluidic and nanofluidic channels are fabricated in this work through sacrificial etching. Microchannels are fabricated utilizing cores made from AZ3330 and SU8 photoresist. Multi-channel electroosmotic (EO) pumps are evaluated and the accompanying channel zeta potentials are calculated. Capillary flow is studied as an effective filling mechanism for nanochannels. Experimental departure from the Washburn model is considered, where capillary flow rates lie within 10% to 70% of theoretical values. Nanochannels are fabricated utilizing cores made from aluminum, germanium, and chromium. Nanochannels are made with 5 μm thick top layers of oxide to prevent dynamic channel deformation. Nanochannel separation schemes are considered, including Ogston sieving, entropic trapping, reptation, electrostatic sieving, and immutable trapping. Immutable trapping is studied through dual-segment nanochannels that capture analytes that are too large to pass from one channel into a second, smaller channel. Polymer nanoparticles, Herpes simplex virus type 1 capsids, and hepatitis B virus capsids are trapped and detected. The signal-to-noise ratio of the fluorescently-detected signal is shown to be greater than 3 for all analyte concentrations considered.
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Canli, Sedat. "Thickness Analysis Of Thin Films By Energy Dispersive X-ray Spectroscopy." Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12612822/index.pdf.

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EDS is a tool for quantitative and qualitative analysis of the materials. In electron microscopy, the energy of the electrons determines the depth of the region where the X-rays come from. By varying the energy of the electrons, the depth of the region where the X-rays come from can be changed. If a thin film is used as a specimen, different quantitative ratios of the elements for different electron energies can be obtained. Unique thickness of a specific film on a specific substrate gives unique energy-ratio diagram so the thickness of a thin film can be calculated by analyzing the fingerprints of the energy-ratio diagram of the EDS data obtained from the film.
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Books on the topic "Thin film analysis"

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Friedbacher, Gernot, and Henning Bubert, eds. Surface and Thin Film Analysis. Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527636921.

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Linke, Felix. Development of ellipsometric microscopy as a quantitative high-resolution technique for the investigation of thin films at glass-water and silicon-air interfaces. Forschungszentrum Jülich, 2004.

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1930-, Mayer James W., ed. Fundamentals of surface and thin film analysis. North-Holland, 1986.

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In-situ characterization of thin film growth. Woodhead Publishing, 2011.

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Optical diagnostics for thin film processing. Academic Press, 1996.

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Friedbacher, Gernot, and H. Bubert. Surface and thin film analysis: A compendium of principles, instrumentation, and applications. Wiley-VCH, 2011.

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Friedbacher, Gernot, and H. Bubert. Surface and thin film analysis: A compendium of principles, instrumentation, and applications. 2nd ed. Wiley-VCH, 2011.

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Govier, R. D. X-ray fluorescence analysis of superalloy leach liquors using a thin-film technique. U.S. Dept. of the Interior, Bureau of Mines, 1989.

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Abraham, Thomas. Diamond, diamond-like carbon/CBN films and coated products: Technology analysis. Business Communications Co., 2002.

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Abraham, Thomas. Diamond, diamond-like, and CBN films and coated products: Market analysis. Business Communications Co., 2002.

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Book chapters on the topic "Thin film analysis"

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Morris, G. C. "Thin Film Analysis." In Springer Series in Surface Sciences. Springer Berlin Heidelberg, 2003. http://dx.doi.org/10.1007/978-3-662-05227-3_21.

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Morris, G. C. "Thin Film Analysis." In Springer Series in Surface Sciences. Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-662-02767-7_21.

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Hocquaux, Hubert. "Thin Film Analysis." In Glow Discharge Spectroscopies. Springer US, 1993. http://dx.doi.org/10.1007/978-1-4899-2394-3_8.

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Benka, Oswald. "Nuclear Reaction Analysis (NRA)." In Surface and Thin Film Analysis. Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527636921.ch14.

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Benka, Oswald. "Elastic Recoil Detection Analysis (ERDA)." In Surface and Thin Film Analysis. Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527636921.ch13.

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Hergenröder, Roland, and Michail Bolshov. "Surface Analysis by Laser Ablation." In Surface and Thin Film Analysis. Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527636921.ch21.

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Rupertus, Volker. "Ion Beam Spectrochemical Analysis (IBSCA)." In Surface and Thin Film Analysis. Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527636921.ch22.

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Palmetshofer, Leopold. "Rutherford Backscattering Spectroscopy (RBS)." In Surface and Thin Film Analysis. Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527636921.ch11.

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Friedbacher, Gernot. "Introduction." In Surface and Thin Film Analysis. Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527636921.ch28.

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Rivière, John C., and Henning Bubert. "Introduction." In Surface and Thin Film Analysis. Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527636921.ch1.

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Conference papers on the topic "Thin film analysis"

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Vemuru, Srivishnu M., Satish Nagarajaiah, and Pulickel M. Ajayan. "MWCNT Based Thin Film Strain Sensor." In 19th Analysis and Computation Specialty Conference. American Society of Civil Engineers, 2010. http://dx.doi.org/10.1061/41131(370)15.

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Tabacniks, M. H., A. J. Kellock, and J. E. E. Baglin. "PIXE for thin film analysis." In The fourteenth international conference on the application of accelerators in research and industry. AIP, 1997. http://dx.doi.org/10.1063/1.52493.

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Jiang, Zhihong, Chang-Lin Kuo, Rongfa Guo, Defang Shen, and Tian-Shen Shi. "X-ray reflectivity analysis of Pt/Co multilayered films." In Thin Film Physics and Applications: Second International Conference, edited by Shixun Zhou, Yongling Wang, Yi-Xin Chen, and Shuzheng Mao. SPIE, 1994. http://dx.doi.org/10.1117/12.190755.

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Belogorokhov, Alexander I., Lubov I. Belogorokhova, and V. A. Karavanskii. "Infrared spectroscopy analysis of porous silicon: a comparison of various preparation conditions." In Thin Film Physics and Applications: Second International Conference, edited by Shixun Zhou, Yongling Wang, Yi-Xin Chen, and Shuzheng Mao. SPIE, 1994. http://dx.doi.org/10.1117/12.190744.

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Lian, Jingyu, Yasuyuki Yamamoto, Hiroshi Chihara, and Akio Nakata. "Analysis of the composition and microstructure in lead zirconate titanate thin films." In Thin Film Physics and Applications: Second International Conference, edited by Shixun Zhou, Yongling Wang, Yi-Xin Chen, and Shuzheng Mao. SPIE, 1994. http://dx.doi.org/10.1117/12.190795.

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Tosic, Bratislav S., Ljiljana D. Maskovic, Radojica Maksimovic, and Stevan Pilipovic. "Applications of GGF method in analysis of ferromagnets." In 4th International Conference on Thin Film Physics and Applications, edited by Junhao Chu, Pulin Liu, and Yong Chang. SPIE, 2000. http://dx.doi.org/10.1117/12.408341.

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Maskovic, Ljiljana D., Ratko Vujovic, and Bratislav S. Tosic. "Mass-statistical analysis of the properties of concrete." In 4th International Conference on Thin Film Physics and Applications, edited by Junhao Chu, Pulin Liu, and Yong Chang. SPIE, 2000. http://dx.doi.org/10.1117/12.408372.

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Sakai, Kazunori, Kenji Mochida, Shinichi Nakamura, et al. "Novel thin film analysis to investigate actual film formation." In SPIE Advanced Lithography, edited by Thomas I. Wallow and Christoph K. Hohle. SPIE, 2015. http://dx.doi.org/10.1117/12.2085717.

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Fisch, D. E., N. E. Abt, F. N. Bens, et al. "Analysis of Thin Film Ferroelectric Aging." In 28th International Reliability Physics Symposium. IEEE, 1990. http://dx.doi.org/10.1109/irps.1990.363527.

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Haruki, Shota, Takahiro Fuchiya, Takayuki Kadonome, Takumi Tanaka, Tokiyoshi Matsuda, and Mutsumi Kimura. "Characteristic analysis of thin-film phototransistors." In 2015 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK). IEEE, 2015. http://dx.doi.org/10.1109/imfedk.2015.7158559.

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Reports on the topic "Thin film analysis"

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Stoffer, James, George D. Weddill, Thomas O'Keefe, Richard Brow, and Matt O'Keefe. Acquisition of Surface/Thin Film Analysis System. Defense Technical Information Center, 2002. http://dx.doi.org/10.21236/ada402919.

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Collins, W. E., and B. Rambabu. Experimental thin film deposition and surface analysis techniques. Office of Scientific and Technical Information (OSTI), 1986. http://dx.doi.org/10.2172/5705694.

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Nastasi, M. Ion beam analysis and modification of thin-film, high-temperature superconductors. Office of Scientific and Technical Information (OSTI), 1989. http://dx.doi.org/10.2172/5658129.

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Jones, L. Ruthenium-Platinum Thin Film Analysis Using Grazing Incidence X-ray Diffraction. Office of Scientific and Technical Information (OSTI), 2004. http://dx.doi.org/10.2172/833117.

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MacAlpine, Sara, Michael Deceglie, Sarah Kurtz, et al. Analysis of a Single Year of Performance Data for Thin Film Modules Deployed at NREL and NISE. Office of Scientific and Technical Information (OSTI), 2016. http://dx.doi.org/10.2172/1313608.

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Toney, Michael F., and Maikel F. A. M. van Hest. In-situ X-Ray Analysis of Rapid Thermal Processing for Thin-Film Solar Cells: Closing the Gap between Production and Laboratory Efficiency. Office of Scientific and Technical Information (OSTI), 2017. http://dx.doi.org/10.2172/1395583.

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Schmid, Ansgar. Micro-Raman Analysis of Dielectric Optical Thin Films. Defense Technical Information Center, 1988. http://dx.doi.org/10.21236/ada191228.

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Durbin, S. G., and R. W. Moir. One-Dimensional Heat Transfer Analysis For Thin Films With Applications In Inertial Fusion Energy. Office of Scientific and Technical Information (OSTI), 2001. http://dx.doi.org/10.2172/15006205.

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Baker, Michael Sean, Alex Lockwood Robinson, and Hy D. Tran. Finite-element analysis of the deformation of thin Mylar films due to measurement forces. Office of Scientific and Technical Information (OSTI), 2012. http://dx.doi.org/10.2172/1034880.

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10

Leyderman, Alexander, and M. Antipin. Electrooptical Effects on Thin Organic Films and X-Ray Diffraction Analysis of 3-Nitroaniline and 2-Cyclo-Octylamino-5-Nitropyridine. Defense Technical Information Center, 2000. http://dx.doi.org/10.21236/ada379414.

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