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Journal articles on the topic 'Thin film analysis'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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1

Panday, K. M., P. L. Choudhury, and N. P. Kumar. "Numerical Unsteady Analysis of Thin Film Lubricated Journal Bearing." International Journal of Engineering and Technology 4, no. 2 (2012): 185–91. http://dx.doi.org/10.7763/ijet.2012.v4.346.

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2

Yongqiang Hou, Yongqiang Hou, Hongji Qi Hongji Qi, Kui Yi Kui Yi, and Jianda Shao Jianda Shao. "Analysis of angular-selective performances of obliquely deposited birefringent thin film." Chinese Optics Letters 11, no. 10 (2013): 103101–5. http://dx.doi.org/10.3788/col201311.103101.

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3

O., Olabisi, and Adegboyega O. "Optical and Microstructural Analysis of Chemically prepared Lead Sulphide PbS Thin Film." International Journal of Trend in Scientific Research and Development Volume-2, Issue-2 (2018): 1006–108. http://dx.doi.org/10.31142/ijtsrd9597.

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4

Setyanto, Taufiq Arif, Zheng Jinhua, Masahiko KATO, and Keijiro NAKASA. "Analysis of Cracking and Delamination of Sputtered Thin Film during Wear Process." Proceedings of Conference of Chugoku-Shikoku Branch 2004.42 (2004): 43–44. http://dx.doi.org/10.1299/jsmecs.2004.42.43.

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5

Showalter, R. E., and Hee Chul Pak. "Thin-film capacitance models." Applicable Analysis 78, no. 3-4 (2001): 415–51. http://dx.doi.org/10.1080/00036810108840944.

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6

Khaled, A. R. A., and K. Vafai. "Analysis of Thermally Expandable Flexible Fluidic Thin-Film Channels." Journal of Heat Transfer 129, no. 7 (2006): 813–18. http://dx.doi.org/10.1115/1.2712853.

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Heat transfer inside thermally expandable and flexible fluidic thin-film channels is analyzed in this work. Two categories are analyzed: the first category is when the upper plate of the thin film is mobile and flexible, and the second is when the side plates of the thin film are flexible and mobile. The expansion in the thin-film heights (category I) or widths (category II) are linearly related to the local fluid pressure and the local temperature of the heated plate based on the principles of linear elasticity and constant volumetric thermal expansion coefficient. The governing Reynolds, momentum, and energy equations are properly nondimensionalized and solved numerically using an implicit method. The Peclet number, stiffness parameter, thermal expansion parameter, and aspect ratio are found to be the main controlling parameters. It is found that thermally expandable flexible thin films that belong to category I can produce significant increase in cooling as the heating load increases, especially when operated at lower Peclet numbers, whereas the cooling effect for those that belong to category II is almost unaffected by the expansion. This work paves the way to practically utilize thermally expandable flexible thin films, especially in MEMS and electronic cooling applications.

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7

de Boer, Maarten P., John C. Nelson, and William W. Gerberich. "Thin film scratch testing in two dimensions—Experiments and analysis." Journal of Materials Research 13, no. 4 (1998): 1002–14. http://dx.doi.org/10.1557/jmr.1998.0141.

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We have modified the microscratch test to create a near plane strain loading condition. In the Microwedge Scratch Test (MWST), a wedge-shaped diamond indenter tip is drawn along a fine line (i.e., narrow strip of film), while simultaneously being driven into the line. We compare microwedge scratching of zone 1 (voided grain boundaries) and zone T (metallurgical grain boundaries) thin film specimens of sputtered tungsten on thermally grown SiO2. Symptomatic of its weak grain boundaries, the zone 1 film displays three separate crack systems. Because of its superior grain boundary strength, the zone T film displayed only one of these—an interfacial crack system. By correlating fracture phenomena to signature events in the load-displacement curve, we develop governing equations for propagating interfacial cracks, including expressions for strain energy release rate, bending strain, and mode mixity. Grain boundary fracture causes zone 1 films to spall before a stable crack is formed. Zone T films survive the bending strains, and hence adhesions may be inferred from stable crack growth mechanics. We conclude by contrasting and comparing experimental results for plane strain indentation versus plane strain scratching.

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8

Iwata, Nobuyuki, Takuji Kuroda, and Hiroshi Yamamoto. "Crystal Structure Analysis of the Cr2O3 thin films." MRS Proceedings 1454 (2012): 33–38. http://dx.doi.org/10.1557/opl.2012.1111.

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ABSTRACTUsing DC-RF magnetron sputtering method, the stress free c- and r-oriented Cr2O3 thin films were grown on c- and r-cut sapphire substrates, respectively. The c-oriented film grown at 580 ºC shows the smoothest surface with a surface average (Ra) of 0.17, although the c-surface energy is the highest. The origin of the smooth surface is expected that the presence of a twin grain due to a dislocation of Cr atoms, demonstrated by a reciprocal space mapping. The step height corresponding to that of the bulk is clearly observed. The r-oriented films epitaxially grow without twin grain. The Ra is 1.56 in the film grown at 580 ºC because of deep trenches due to a lattice mismatch and no dislocation like c-oriented films. Since the surface energy of the r-surface is the lowest, the terrace is quite smooth in one grain even at higher substrate temperature of 840 ºC.

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9

Shupenev, A. E., N. S. Pankova, I. S. Korshunov, and A. G. Grigoriyants. "An Analysis of Non-Destructive Methods for Thin Film Thickness Measurement." Proceedings of Higher Educational Institutions. Маchine Building, no. 4(709) (April 2019): 18–27. http://dx.doi.org/10.18698/0536-1044-2019-4-18-27.

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The thickness of thin films determines the films’ unique properties, due to which they are widely used in optics and electronics. To measure the thickness of films in the range of 1 nm — 1 mcm during film deposition or on a finished product, it is important that non-destructive measurement methods should be used. An analysis of the most commonly used non-destructive methods for measuring and controlling the thickness of thin films is performed, with a possibility of in situ control of the technological process as well as for testing of finished products. This work describes theoretical and practical considerations of using reflection high-energy electron diffraction, piezoelectricity, interferometry and gravimetric methods for thin film thickness measurements. The results of the study can be used for selecting an optimal method of obtaining thin films when conducting theoretical and applied research.

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10

Lieb, Klaus-Peter. "Thin film analysis with nuclear methods." Contemporary Physics 40, no. 6 (1999): 385–413. http://dx.doi.org/10.1080/001075199181297.

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11

Wiryanto, L. H. "Stability analysis of thin film model." Journal of Physics: Conference Series 983 (March 2018): 012072. http://dx.doi.org/10.1088/1742-6596/983/1/012072.

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12

Bauer, H. D., and W. Scholz. "Quantitative thin film analysis by EELS." Vacuum 37, no. 1-2 (1987): 193–94. http://dx.doi.org/10.1016/0042-207x(87)90140-0.

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13

Dollinger, G., M. Boulouednine, T. Faestermann, and P. Maier-Komor. "Depth microscopy for thin film analysis." Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 334, no. 1 (1993): 187–90. http://dx.doi.org/10.1016/0168-9002(93)90549-w.

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14

Huang, T. C., A. Segmuller, W. Lee, V. Lee, D. Bullock, and R. Karimi. "X-ray Diffraction Analysis of High Tc Superconducting Thin Films." Advances in X-ray Analysis 32 (1988): 269–78. http://dx.doi.org/10.1154/s0376030800020577.

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AbstractX-ray diffraction techniques have been used for the structure characterization of Y-Ba-Cu-O and Tl-Ca-Ba-Cu-O thin films. A powder diffraction analysis of Y-Ba-Cu-O films showed that the films deposited at 650°C on Si are polycrystalline and have an orthorhambic structure similar to that of the YBa2Cu3O7 bulk superconductors. In addition to the conventional powder diffraction technique, both the rocking curve and the grazing incidence diffraction methods were used to characterize a YBa2Cu3O7 film on (110) SrTiO3 substrate. Results showed that the film was epitaxially grown and aligned with its substrate in a true epitaxy. Phase identification and line broadening analyses of Tl-Ca-Ba-Cu-O films showed that the films are comprised of one or more superconducting phases and probably contain stacking faults.

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15

Zaitz, M. A. "Small Area X-Ray Fluorescence Analysis of Multilayer Thin Metal Films." Advances in X-ray Analysis 37 (1993): 219–27. http://dx.doi.org/10.1154/s037603080001572x.

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AbstractThin film technology has become an integral part of semiconductor multichip ceramic packages. Characterizing the thickness of multimetal multilayer thin film structures that combine both thin and thick films is an important parameter for manufacturing process control and development. Accuracies in the range of 3-5% and precisions of 1.3% were attained on multilayer metal films ranging from a few hundred angstroms to tens of thousands of angstroms.

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16

Al-Etewi, Rotina, and Zena Al-Nuamy. "Stability Analysis in Thin Liquid Film (Immobile Soap Film)." AL-Rafidain Journal of Computer Sciences and Mathematics 8, no. 2 (2011): 13–21. http://dx.doi.org/10.33899/csmj.2011.163648.

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17

Patil, G. E., D. D. Kajale, V. B. Gaikwad, and G. H. Jain. "Spray Pyrolysis Deposition of Nanostructured Tin Oxide Thin Films." ISRN Nanotechnology 2012 (July 31, 2012): 1–5. http://dx.doi.org/10.5402/2012/275872.

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Nanostructured SnO2 thin films were grown by the chemical spray pyrolysis (CSP) method. Homemade spray pyrolysis technique is employed to prepare thin films. SnO2 is wide bandgap semiconductor material whose film is deposited on glass substrate using aqueous solution of SnCl4·5H2O as a precursor. XRD (X-ray diffraction), UV (ultraviolet visible spectroscopy), FESEM (field emission scanning electron microscopy), and EDS (energy dispersive spectroscopy) analysis are done for structural, optical, surface morphological, and compositional analysis. XRD analysis shows polycrystalline nature of samples with pure phase formation. Crystallite size calculated from diffraction peaks is 29.92 nm showing nanostructured thin films. FESEM analysis shows that SnO2 thin film contains voids with nanoparticles. EDS analysis confirms the composition of deposited thin film on glass substrate. UV-visible absorption spectra show that the bandgap of SnO2 thin film is 3.54 eV. Bandgap of SnO2 thin film can be tuned that it can be used in optical devices.

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18

Chidambara Kumar, K. N., S. K. Khadeer Pasha, Kalim Deshmukh, K. Chidambaram, and G. Shakil Muhammad. "Optical Analysis of Iron-Doped Lead Sulfide Thin Films for Opto-Electronic Applications." International Journal of Nanoscience 17, no. 01n02 (2017): 1760004. http://dx.doi.org/10.1142/s0219581x17600043.

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Iron-doped lead sulfide thin films were deposited on glass substrates using successive ionic layer adsorption and reaction method (SILAR) at room temperature. The X-ray diffraction pattern of the film shows a well formed crystalline thin film with face-centered cubic structure along the preferential orientation (1 1 1). The lattice constant is determined using Nelson Riley plots. Using X-ray broadening, the crystallite size is determined by Scherrer formula. Morphology of the thin film was studied using a scanning electron microscope. The optical properties of the film were investigated using a UV–vis spectrophotometer. We observed an increase in the optical band gap from 2.45 to 3.03[Formula: see text]eV after doping iron in the lead sulfide thin film. The cutoff wavelength lies in the visible region, and hence the grown thin films can be used for optoelectronic and sensor applications. The results from the photoluminescence study show the emission at 500–720[Formula: see text]nm. The vibrating sample magnetometer measurements confirmed that the lead sulfide thin film becomes weakly ferromagnetic material after doping with iron.

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19

Zhou, Bo, and Barton C. Prorok. "A new paradigm in thin film indentation." Journal of Materials Research 25, no. 9 (2010): 1671–78. http://dx.doi.org/10.1557/jmr.2010.0228.

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A new method to accurately and reliably extract the actual Young's modulus of a thin film on a substrate by indentation was developed. The method involved modifying the discontinuous elastic interface transfer model to account for substrate effects that were found to influence behavior a few nanometers into a film several hundred nanometers thick. The method was shown to work exceptionally well for all 25 different combinations of five films on five substrates that encompassed a wide range of compliant films on stiff substrates to stiff films on compliant substrates. A predictive formula was determined that enables the film modulus to be calculated as long as one knows the film thickness, substrate modulus, and bulk Poisson's ratio of the film and the substrate. The calculated values of the film modulus were verified with prior results that used the membrane deflection experiment and resonance-based methods. The greatest advantages of the method are that the standard Oliver and Pharr analysis can be used, and that it does not require the continuous stiffness method, enabling any indenter to be used. The film modulus then can be accurately determined by simply averaging a handful of indents on a film/substrate composite.

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20

Wajer, S. D., and H. K. Charles. "A SEM analysis of thin indium films for immunoassay applications." Proceedings, annual meeting, Electron Microscopy Society of America 45 (August 1987): 938–39. http://dx.doi.org/10.1017/s0424820100128973.

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Indium metal films have been used as host substrate materials for biological immunoassays. Indium film immunoassays involve the optical detection of specific antibody-antigen reactions using either transmitted or reflected white light. In the immunoassay process, drops of a purified antibody solution are placed on 5 to 25 nm thick indium films supported on a glass substrate (i.e., indium slide). After incubation, the antibody solution is washed off, leaving visible spots of reactive antibody. The slide is then coated with an unrelated protein which covers any non-antibody areas thus making the whole slide appear optically uniform. Placing the indium slide in an appropriate antigen solution will cause a visible response, since the antibody-antigen reaction complex will contain two layers of protein and will be darker than the surrounding background. In addition to the biological reaction sensitivities, the indium film immunoassay response is critically dependent on the bulk and surface properties of the indium film.

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21

Price, C. W., and E. F. Lindsey. "Analysis of electroless nickel thin films." Proceedings, annual meeting, Electron Microscopy Society of America 49 (August 1991): 510–11. http://dx.doi.org/10.1017/s0424820100086854.

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Thickness measurements of thin films are performed by both energy-dispersive x-ray spectroscopy (EDS) and x-ray fluorescence (XRF). XRF can measure thicker films than EDS, and XRF measurements also have somewhat greater precision than EDS measurements. However, small components with curved or irregular shapes that are used for various applications in the the Inertial Confinement Fusion program at LLNL present geometrical problems that are not conducive to XRF analyses but may have only a minimal effect on EDS analyses. This work describes the development of an EDS technique to measure the thickness of electroless nickel deposits on gold substrates. Although elaborate correction techniques have been developed for thin-film measurements by x-ray analysis, the thickness of electroless nickel films can be dependent on the plating bath used. Therefore, standard calibration curves were established by correlating EDS data with thickness measurements that were obtained by contact profilometry.

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22

Genzel, Christoph. "Thin film stress and microstructure analysis by energy-dispersive diffraction." Acta Crystallographica Section A Foundations and Advances 70, a1 (2014): C724. http://dx.doi.org/10.1107/s2053273314092754.

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The most important advantage of energy dispersive (ED) diffraction compared with angle dispersive methods is that the former provides complete diffraction patterns in fixed but arbitrarily selectable scattering directions. Furthermore, in experiments that are carried out in reflection geometry, the different photon energies E(hkl) of the diffraction lines in an ED diffraction pattern can be taken as an additional parameter to analyze depth gradients of structural properties in the materials near surface region. For data evaluation advantageous use can be made of whole pattern methods such as the Rietveld method, which allows for line profile analysis to study size and strain broadening [1] or for the refinement of models that describe the residual stress depth distribution [2]. Concerning polycrystalline thin films, the features of ED diffraction mentioned above can be applied to study residual stresses, texture and the microstructure either in ex-situ experiments or in-situ to monitor, for example, the chemical reaction pathway during film growth [3]. The main objective of this talk is to demonstrate that (contrary to a widespread opinion) high energy synchrotron radiation and thin film analysis may fit together. The corresponding experiments were performed on the materials science beamline EDDI at BESSY II which is one of the very few instruments worldwide that is especially dedicated to ED diffraction. On the basis of selected examples it will be shown that specially tailored experimental setups allow for residual stress depth profiling even in thin films and multilayer coatings as well as for fast in situ studies of film stress and microstructure evolution during film growth.

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23

ZORGATI, HAMDI. "MODELING THIN CURVED FERROMAGNETIC FILMS." Analysis and Applications 03, no. 04 (2005): 373–96. http://dx.doi.org/10.1142/s0219530505000637.

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The behavior of a thin film made of a ferromagnetic material in the absence of an external magnetic field is described by an energy depending on the magnetization of the film verifying the saturation constraint. The free energy consists of an induced magnetostatic energy and an energy term with density including the exchange energy and the anisotropic energy. We study the behavior of this energy when the thickness of the curved film goes to zero. We show that the minimizers of the free energy converge to the minimizers of a local energy depending on a two-dimensional magnetization by Γ-convergence arguments.

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24

Bruchhaus, R., D. Pitzer, R. Primig, M. Schreiter, and W. Wersing. "PZT thin films grown by multi-target sputtering: Analysis of thin film stress." Integrated Ferroelectrics 21, no. 1-4 (1998): 461–67. http://dx.doi.org/10.1080/10584589808202086.

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25

Kadhim, Bahjat B., and Ali Zamil Manshad. "Optical Properties of Perovskite Thin Film." Al-Mustansiriyah Journal of Science 30, no. 1 (2019): 174. http://dx.doi.org/10.23851/mjs.v30i1.564.

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Methyl-ammonium lead tri iodide (CH3NH3PbI3) perovskite thin films have been prepared by solution processing. Thin film after deposited in the laboratory ambient conditions by drop casting, it prepared by two step method PbI2 and CH3NH3I at the glass substrate. The analysis provides: the absorption coefficient, extinction coefficient, refractive indices, real and imaginary components of the dielectric constant of the CH3 NH3 PbI3 films, energy gap. Energy gap of perovskite thin films is reached 1.8 that is very important for solar cell application.

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26

Yamamoto, Hiroshi, Kohei Idehara, Ryota Kimura, et al. "Structural Analysis of ZnO Thin Films Grown in Room Temperature on PET Film." Materials Science Forum 778-780 (February 2014): 1201–5. http://dx.doi.org/10.4028/www.scientific.net/msf.778-780.1201.

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The structure of ZnO thin films grown in room temperature by reactive DC sputter technique on polyethylene terephthalate film were evaluated by SEM and TEM. The quality of ZnO thin films grown in room temperature were observed to vary widely. ZnO crystals grow without uniform orientation in early stage of growth, and then ZnO crystallinity improves as the ZnO thin films grow up. And ZnO crystallinity is influenced by roughened surface of PET film.

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27

Lee, Sang Hyuk, Bo Hyun Seo, and Jong Hyun Seo. "Micro-Scratch Analysis on Adhesion between Thin Films and PES Substrate." Advanced Materials Research 26-28 (October 2007): 1153–56. http://dx.doi.org/10.4028/www.scientific.net/amr.26-28.1153.

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In flexible display, reliability of the thin film/polymer interface is an important issue because adhesion strength dissimilar materials is often inherently poor, and residual stresses arising from thermal mismatches or pressure exerted by vaporized moisture often lead to delaminations of interfaces. In the present study we deposited various thin films such as silicon nitride (SiNx), aluminum metal layer, and indium tin oxide on polyether sulphone (PES) substrate. The film adhesion was determined by micro-scratch test. The adhesion strength, presented by the critical load, Lc, when the film starts to delaminate, was determined as a function of plasma pretreated on PES substrate.

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28

Fan, Xuanqing, Yi Wang, Yuhang Li, and Haoran Fu. "Vibration Analysis of Post-Buckled Thin Film on Compliant Substrates." Sensors 20, no. 18 (2020): 5425. http://dx.doi.org/10.3390/s20185425.

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Buckling stability of thin films on compliant substrates is universal and essential in stretchable electronics. The dynamic behaviors of this special system are unavoidable when the stretchable electronics are in real applications. In this paper, an analytical model is established to investigate the vibration of post-buckled thin films on a compliant substrate by accounting for the substrate as an elastic foundation. The analytical predictions of natural frequencies and vibration modes of the system are systematically investigated. The results may serve as guidance for the dynamic design of the thin film on compliant substrates to avoid resonance in the noise environment.

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29

Bruell, Gabriele, and Rafael Granero-Belinchón. "On a thin film model with insoluble surfactant." Journal of Differential Equations 268, no. 12 (2020): 7582–608. http://dx.doi.org/10.1016/j.jde.2019.11.080.

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30

Li, Dong, Zhonghua Qiao, and Tao Tang. "Gradient bounds for a thin film epitaxy equation." Journal of Differential Equations 262, no. 3 (2017): 1720–46. http://dx.doi.org/10.1016/j.jde.2016.10.025.

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31

Cho, Chong Du, Heung Shik Lee, Chang Boo Kim, and Hyeon Gyu Beom. "A Finite Element Analysis for Magnetostrictive Thin Film Structures and Its Experimental Verification." Key Engineering Materials 306-308 (March 2006): 1151–56. http://dx.doi.org/10.4028/www.scientific.net/kem.306-308.1151.

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In this paper, a finite element code especially for micro-magnetostrictive actuators was developed. Two significant characteristics of the presented finite element code are: (1) the magnetostrictive hysteresis phenomenon is effectively taken into account; (2) intrinsic geometric feature of typical thin film structures of large length to thickness ratio, which makes it very difficult to construct finite element mesh in the region of the thin film, is considered reasonably in modeling micro-magneostrictive actuators. For verification purpose, magnetostrictive thin films were fabricated and tested in the form of a cantilevered actuator. The Tb-Fe film and Sm-Fe film are sputtered on the Si and Polyimide substrates individually. The magnetic and magnetostrictive properties of the sputtered magnetostrictive films are measured. The measured magnetostrictive coefficients are compared with the numerically calculated ones.

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32

Chen, Long Long, Xi Feng Li, Ji Feng Shi, Hao Zhang, Chun Ya Li, and Jian Hua Zhang. "Analysis of Wet Etching Characteristics of a-IGZO Thin Film." Advanced Materials Research 476-478 (February 2012): 2339–43. http://dx.doi.org/10.4028/www.scientific.net/amr.476-478.2339.

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Amorphous InGaZnO (a-IGZO) films are deposited on the glass substrate by RF sputtering and the influence of wet etching of a-IGZO films, etching rate, over etching features and TFT structure chose are investigated. The results show that Oxalic acid is best chose for IGZO film etching for side etching is about 0.1um , etching rate is 7.42 A/s which is easy to control and taper angle is acute. The traditional G-I-D type structure has been confirmed is not fit for the condition where the IGZO based TFT manufacture. G-D-I structure is tested and can be used in the TFT array manufacture.

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Popova, L., G. Gromyko, and S. Tabakova. "NUMERICAL MODELLING OF FREE THIN FILM DYNAMICS." Mathematical Modelling and Analysis 8, no. 1 (2003): 51–62. http://dx.doi.org/10.3846/13926292.2003.9637210.

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The dynamics of a free thin film attached to a rectangular frame surrounded by an ambient gas is studied theoretically. The mathematical model is described by evolutionary nonlinear system for the longitudinal velocity components and film thickness. The 1D form of the nonstationary problem is solved by a finite difference scheme. The film shape evolution in time is tracked at different Reynolds numbers, Re. The steady state solutions are reached asymptotically in time for a large range of Re.

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34

Shupenev, A. E., N. S. Pankova, I. S. Korshunov, and A. G. Grigoriyants. "An Analysis of Destructive Methods of Thin Films Thickness Measurement." Proceedings of Higher Educational Institutions. Маchine Building, no. 3 (708) (March 12, 2019): 31–39. http://dx.doi.org/10.18698/0536-1044-2019-3-31-39.

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Thin film technologies are widely used in science and industry and have a critical value for optics and electronics. Special properties of thin films are related to their thickness, usually ranging between 1 nm and 1 um. Measuring such a thickness is a challenging task, always concomitant with the stage of technology development. When using witness samples and specimen control groups, destructive methods can be employed to measure the thickness of the deposited layers. An analysis of the most commonly used destructive methods of measuring the thickness of thin films is conducted, the results of which can be used for selecting a suitable method when planning corresponding experiments. This work describes theoretical and practical considerations of using bevel cut method, spherical cut method, atomic force microscopy and stylus profilometry for measuring thin film thickness.

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35

Mishnaevsky, Leon L., and Dietmar Gross. "Deformation and Failure in Thin Films/Substrate Systems: Methods of Theoretical Analysis." Applied Mechanics Reviews 58, no. 5 (2005): 338–53. http://dx.doi.org/10.1115/1.1995717.

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This paper reviews the theoretical models and methods of analysis of deformation, damage and fracture in thin film/substrate systems. The mechanisms and models of the plastic deformation of thin films, as well as the effects of the dislocation formation and movement on the strength and deformation of thin films are reviewed. The concepts and methods of the theoretical and numerical analysis of the crack propagation in thin films are discussed. The mechanisms and models of cracking, decohesion and delamination, the effects of the substrate properties, as well as of cracking in a thin film between two substrates are analyzed. Continuum mechanical, probabilistic, and lattice models of damage evolution in brittle thin films, the fragmentation of thin films on a substrate, and the formation of the crack patterns are reviewed as well. Numerical models of nanoindentation are discussed. This review article contains 106 references.

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36

Kong, Yeo Lee, S. V. Muniandy, M. S. Fakir, and K. Sulaiman. "Fractal Analysis of Morphological Image of Organic Phthalocyanine Tetrasulfonic Acid Tetrasodium (TsNiPc) Film." Advanced Materials Research 895 (February 2014): 407–10. http://dx.doi.org/10.4028/www.scientific.net/amr.895.407.

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Surface morphology of thin films can be efficiently characterized using power spectral density method. Spectral based parameters from surface models can then be linked to electrical conductivity of thin films used for fabricating organic photovoltaic devices. In this study, the surface morphologies of the organic thin films phthalocyanine tetrasulfonic acid tetrasodium (TsNiPc) are investigated using atomic force microscopy. The thin film samples are imaged at 40-minutes and 120-minutes after the solvent treatment. The spectral exponent β is determined from the slope of PSD log-log plot and the fractal dimension D of each film is calculated based on fractal relation β = 8 2D. The relationship between surface roughness and fractal dimension with respect to electrical properties of thin film is discussed.

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37

Gnann, Manuel V., and Mircea Petrache. "The Navier-slip thin-film equation for 3D fluid films: Existence and uniqueness." Journal of Differential Equations 265, no. 11 (2018): 5832–958. http://dx.doi.org/10.1016/j.jde.2018.07.015.

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38

Seis, Christian. "The thin-film equation close to self-similarity." Analysis & PDE 11, no. 5 (2018): 1303–42. http://dx.doi.org/10.2140/apde.2018.11.1303.

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KONDO, Hirofumi. "Surface analysis of magnetic thin film media." Bunseki kagaku 51, no. 8 (2002): 569–96. http://dx.doi.org/10.2116/bunsekikagaku.51.569.

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Feldman, Leonard C., James W. Mayer, and F. Adams. "Fundamentals of surface and thin film analysis." Analytica Chimica Acta 222, no. 1 (1989): 396. http://dx.doi.org/10.1016/s0003-2670(00)81920-0.

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Malhotra, S. G., Z. U. Rek, S. M. Yalisove, and J. C. Bilello. "Analysis of thin film stress measurement techniques." Thin Solid Films 301, no. 1-2 (1997): 45–54. http://dx.doi.org/10.1016/s0040-6090(96)09569-7.

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Collins, Robert W., and Yeon Taik Kim. "Ellipsometry for thin-film and surface analysis." Analytical Chemistry 62, no. 17 (1990): 887A—890A. http://dx.doi.org/10.1021/ac00216a001.

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Collins, Robert W., and Yeon-Taik Kim. "Ellipsometry for Thin-Film and Surface Analysis." Analytical Chemistry 62, no. 17 (1990): 887A—900A. http://dx.doi.org/10.1021/ac00216a721.

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Radue, C., and E. E. van Dyk. "Degradation analysis of thin film photovoltaic modules." Physica B: Condensed Matter 404, no. 22 (2009): 4449–51. http://dx.doi.org/10.1016/j.physb.2009.09.011.

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Slesarenko, V. N. "Thermal analysis of thin film desalination systems." Desalination 139, no. 1-3 (2001): 399–404. http://dx.doi.org/10.1016/s0011-9164(01)00340-x.

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Hofmann, S. "Sputter-depth profiling for thin-film analysis." Philosophical Transactions of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences 362, no. 1814 (2003): 55–75. http://dx.doi.org/10.1098/rsta.2003.1304.

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Casci Ceccacci, Andrea, Alberto Cagliani, Paolo Marizza, Silvan Schmid, and Anja Boisen. "Thin Film Analysis by Nanomechanical Infrared Spectroscopy." ACS Omega 4, no. 4 (2019): 7628–35. http://dx.doi.org/10.1021/acsomega.9b00276.

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Leake, John. "Thin film analysis by X-ray scattering." Materials Characterization 58, no. 3 (2007): 318. http://dx.doi.org/10.1016/j.matchar.2006.04.026.

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