Dissertations / Theses on the topic 'Transistor bipolaire à hétérojonction (TBH)'
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Alaeddine, Ali. "Le Transistor Bipolaire à Hétérojonction Si/SiGe sous contraintes électromagnétiques : des dégradations électriques à l'analyse structurale." Rouen, 2011. http://www.theses.fr/2011ROUES001.
Full textThis work proposes a new methodology for studying the reliability of the Heterojunction Bipolar Transistors (HBTs) in SiGe technology. The originality of this study comes from the use of a targeted electromagnetic field stress by using the near field bench. This type of stress has to degrade the performance of this component causing failure mechanisms. The DC characterizations showed the presence of leakage currents at Si/SiO2 interface, not only between the base and the emitter, but also between the base and the collector. This is attributed to a trapping phenomenon induced by hot carriers which have been generated during stress. This phenomenon has been addressed by the physical modeling, by studying the influence of interface traps on the drift of the HBT characteristics. To identify the failures that can be detected by microscopy, characterization of the structure before and after ageing was performed by Transmission Electron Microscopy (TEM) and energy dispersive spectroscopy (EDS). These analyses revealed the degradation of the titanium layers around the emitter, the base and the collector. The degradations are attributed to the gold (Au) migration into the titanium (Ti) due to the high current density induced by stress. Some of these Au–Ti reactions are known to increase the resistivity of the conducting layers which directly affects the HBTs‟ dynamic performances
Lopez, David. "Intégration dans un environnement de simulation circuit d'un modèle électrothermique de transistor bipolaire à hétérojonction issu de simulations thermiques tridimensionnelles." Limoges, 2002. http://www.theses.fr/2002LIMO0007.
Full textThe work presented here involves an integration into a circuit simulator of a HBT's thermal model from a 3D finite element method thermal simulation
Lijadi, Melania. "Transistors bipolaires à hétérojonction : développement d'une filière InP/GaAsSb pour applications ultra-rapides." Phd thesis, Université Pierre et Marie Curie - Paris VI, 2005. http://tel.archives-ouvertes.fr/tel-00010627.
Full texthétérojonctions de type II par électroluminescence, associée aux mesures électriques a permis de clarifier les conditions du transport électronique dans le système InP/GaAsSb et d'initier l'utilisation d'un émetteur en InGaAlAs. Deux briques technologiques spécifiques ont été développées : la gravure chimique sélective de InGaAlAs par rapport à GaAsSb et la réalisation de contacts ohmiques très faiblement résistifs sur p-GaAsSb. Ceci a permis l'assemblage d'un procédé de fabrication de TBH ultra-rapides dans cette filière. La faisabilité de ce procédé a été démontrée par la réalisation de TBH submicroniques ayant des fréquences ( fT ; fmax) de (155 ; 162) GHz. Son optimisation, protégée par deux brevets, montre des perspectives pour atteindre des fréquences ( fT ; fmax) de (380 ; 420) GHz.
Vu, Van Tuan. "Recherche et évaluation d'une nouvelle architecture de transistor bipolaire à hétérojonction Si/SiGe pour la prochaine génération de technologie BiCMOS." Thesis, Bordeaux, 2016. http://www.theses.fr/2016BORD0304/document.
Full textThe ultimate objective of this thesis is to propose and evaluate a novel SiGe HBT architec-ture overcoming the limitation of the conventional Double-Polysilicon Self-Aligned (DPSA) archi-tecture using Selective Epitaxial Growth (SEG). This architecture is designed to be compatible with the 28-nm Fully Depleted (FD) Silicon On Insulator (SOI) CMOS with a purpose to reach the objec-tive of 400 GHz fT and 600 GHz fMAX performance in this node. In order to achieve this ambitious objective, several studies, including the exploration and comparison of different SiGe HBT architec-tures, 55-nm Si/SiGe BiCMOS TCAD calibration, Si/SiGe BiCMOS thermal budget study, investi-gating a novel architecture and its optimization, have been carried out. Both, the fabrication process and physical device models (incl. band gap narrowing, saturation velocity, high-field mobility, SRH recombination, impact ionization, distributed emitter resistance, self-heating and trap-assisted tunnel-ing, as well as band-to-band tunneling), have been calibrated in the 55-nm Si/SiGe BiCMOS tech-nology. Furthermore, investigations done on process thermal budget reduction show that a 370 GHz fT SiGe HBT can be achieved in 55nm assuming the modification of few process steps and the tuning of the bipolar vertical profile. Finally, the Fully Self-Aligned (FSA) SiGe HBT architecture using Selective Epitaxial Growth (SEG) and featuring an Epitaxial eXtrinsic Base Isolated from the Collector (EXBIC) is chosen as the most promising candidate for the 28-nm FD-SOI BiCMOS genera-tion. The optimization of this architecture results in interesting electrical performances such as 470 GHz fT and 870 GHz fMAX in this technology node
Lefebvre, Eric. "Croissance métamorphique par Epitaxie par Jets Moléculaires et caractérisations physiques pour Transistor Bipolaire à Hétérojonction InP/InGaAs sur GaAs." Phd thesis, Université des Sciences et Technologie de Lille - Lille I, 2005. http://tel.archives-ouvertes.fr/tel-00070835.
Full textAbboun, Miloud. "Caractérisation et modélisation de transistor bipolaire à double hétérojonction (TBdH) sur InP pour la conception de circuits à haut débit." Paris 11, 2003. http://www.theses.fr/2003PA112112.
Full textThe progress in data processing communication systems require circuits with high data rate which are based on high speed transistors with high power. III-V Bipolar Heterojunction Transistors (HBTs) constitute a good trade-off, and more particularly InP based -HBTs. These device are well suited for the development of telecommunications systems with data rates higher than 60 Gbits/s, moreover this technology allows the integration of optoelectronic devices with wavelength ranging between 1,3 mM and 1,55 mM. The renewed interest for these technologies underlines the problems and the constraints related to compact modeling. The work was developed under the frame of a tight collaboration between the CNET Bagneux/OPTO+ and the IEF. The aim of this thesis is the experimental study and the electrical modeling of InP-DHBT. Four self-aligned technologies which differ by the nature of base doping (beryllium or carbon) and by the presence of an indium gradient in the base were studied. For each technology a large number of devices were analyzed and an important mass of experimental data made it possible to obtain the parameters of the model of Gummel-Poon for such devices. These models were then used by circuit designers at OPTO+ for the conception of logic circuits with high debit (multiplexer, circuit of decision, rock-D, driver. . . ). The large data base also made it possible to study the influence of self-heating effects in InP-HBT by an experimental point of view and then by a numerical modeling of Fourier equation. Simulation results allows to find the pathways to reduce self-heating effects in the studied devices. For a better understanding of the physics governing the HBT performance, an experimental analysis at variable temperature was carried out on one of four technologies. Finally, an analysis of sensitivity of the parameters of the model of Gummel-Poon at 300K over the switching time of the differential pairs (CML/ECL technology) was performed: -Delay time t(FF) and charge time R(BB),C(jC) are the two most important intrinsic contributions, -The extraction of many parameters of the model is inaccurate (C(jE), Rc amongst other) and they influences t(FF), then the need of developing reliable approaches to extract these elements is pointed out
Azakkour, Abdellatif. "Etude et conception d' une architecture ultra-large bande." Paris 6, 2005. http://www.theses.fr/2005PA066117.
Full textWithitsoonthorn, Suwimol. "Photodiode UTC et oscillateur différentiel commande en tension à base de TBdH InP pour récupération d'horloge dans un réseau de transmission optique à très haut débit." Paris 6, 2004. https://tel.archives-ouvertes.fr/tel-00006403v2.
Full textStein, Félix. "SPICE Modeling of TeraHertz Heterojunction bipolar transistors." Thesis, Bordeaux, 2014. http://www.theses.fr/2014BORD0281/document.
Full textThe aim of BiCMOS technology is to combine two different process technologies intoa single chip, reducing the number of external components and optimizing power consumptionfor RF, analog and digital parts in one single package. Given the respectivestrengths of HBT and CMOS devices, especially high speed applications benefit fromadvanced BiCMOS processes, that integrate two different technologies.For analog mixed-signal RF and microwave circuitry, the push towards lower powerand higher speed imposes requirements and presents challenges not faced by digitalcircuit designs. Accurate compact device models, predicting device behaviour undera variety of bias as well as ambient temperatures, are crucial for the development oflarge scale circuits and create advanced designs with first-pass success.As technology advances, these models have to cover an increasing number of physicaleffects and model equations have to be continuously re-evaluated and adapted. Likewiseprocess scaling has to be verified and reflected by scaling laws, which are closelyrelated to device physics.This thesis examines the suitability of the model formulation for applicability to production-ready SiGe HBT processes. A derivation of the most recent model formulationimplemented in HICUM version L2.3x, is followed by simulation studies, whichconfirm their agreement with electrical characteristics of high-speed devices. Thefundamental geometry scaling laws, as implemented in the custom-developed modellibrary, are described in detail with a strong link to the specific device architecture.In order to correctly determine the respective model parameters, newly developed andexisting extraction routines have been exercised with recent HBT technology generationsand benchmarked by means of numerical device simulation, where applicable.Especially the extraction of extrinsic elements such as series resistances and parasiticcapacitances were improved along with the substrate network.The extraction steps and methods required to obtain a fully scalable model library wereexercised and presented using measured data from a recent industry-leading 55nmSiGe BiCMOS process, reaching switching speeds in excess of 300GHz. Finally theextracted model card was verified for the respective technology
Dhondt, François. "Modélisation électrothermique des Transistors Bipolaires à Hétérojonction (TBH) pour les applications de puissance à haut rendement en bande X." Lille 1, 1997. http://www.theses.fr/1997LIL10100.
Full textAl-S'adi, Mahmoud. "TCAD based SiGe HBT advanced architecture exploration." Thesis, Bordeaux 1, 2011. http://www.theses.fr/2011BOR14239/document.
Full textThe Impact of strain engineering technology applied on Si BJT/SiGe HBT devices on the electrical properties and frequency response has been investigated. Strain technology can be used as an additional degree of freedom to enhance the carriers transport properties due to band structure changes and mobility enhancement. New concepts and novel device architectures that are based on strain engineering technology have been explored using TCAD modeling. Two approaches have been used in this study to generate the proper mechanical strain inside the device. The first approach was through introducing strain at the device’s base region using SiGe extrinsic stress layer. The second approach was through introducing strain at the device’s collector region using strain layers. The obtained results obviously show that strain engineering technology principle applied to BJT/HBT device can be a promising approach for further devices performance improvements
Boissenot, Philippe. "Etude et réalisation d'un transistor bipolaire à hétérojonction GaAlAs/GaAs." Paris 11, 1989. http://www.theses.fr/1989PA112184.
Full textThis work which is divided in three parts, covers a large field of microelectronics. Firstly, an analitical madel, starting from the general transport equationsis established. The compact analytical expressions which determine the transfer characteristics (Jc, VBE) and intrinsic current gain, are expressed as a function of the technological or geometrical parameters of the structure. Then, we developed a self-aligned technology for GaAlAs/GaAs HBT's which permits to decrease the base resistance and the collector capacitance. Finally, we present experimental results and show that for realizing excellent high speed performance HBT's, high quality crystals, as well as fine structure device fabrication processes, are very important. In spite of a base 1ayer which is too thick, cutoff frequency of FT = 24 GHz and Fmax = 24 GHz with emitter dimensions of 2 x 10 µm² are achieved with a yield greater than 80% on a 2 inches wafer
Berranger-Marinet, Elisabeth de. "Etude et fabrication de transistors bipolaires à hétérojonctions Si/SiGe (TBH) intégrés dans une filière BiCMOS industrielle 0. 5µ." Lyon, INSA, 1998. http://www.theses.fr/1998ISAL0026.
Full textThis work deals with Si/SiGe Hetero junction Bipolar Transistors (SiGe HBTs). We present our method for integrating HBTs into a Bi CM OS process from the CNET -SGS Thomson Joint Center. Firstly, the main parameters (Ge profile, Boron position with respect to SiGe layer) acting on HBT operation were identified in order to adapt device architecture to the technological context and take benefit from the SiGe base (this especially implied the set up of a simulation environment adapted to hetero structures). Technological constraints and their consequences were taken into account. The first results highlighted a few technological problems which were solved in the following batches. Electrical characterisation showed a clear improvement of the performance and pointed out the decisive advantages of SiGe in a BiCMOS technology. We also verified that MOS transistors were not perturbed. This work proves the feasibility of HBT integration into a BiCMOS process and presents future prospects for the evolution of the structure
Bourguiga, Ramzi. "Optimisation du transistor bipolaire à hétérojonction GaaS à fort dopage de base." Paris 11, 1994. http://www.theses.fr/1994PA112372.
Full textDupuy, Jean-Yves. "Théorie et Pratique de l'Amplificateur Distribué : Application aux Télécommunications Optiques à 100 Gbit/s." Thesis, Cergy-Pontoise, 2015. http://www.theses.fr/2015CERG0759/document.
Full textThe theory, design, optimisation and characterisation of distributed amplifiers in 0.7-µm InP DHBT technology, for 100-Gbit/s optical communication systems, are presented. We show how the appropriate implementation of the distributed amplifier concept in a bipolar transistors technology with high swing-speed product has enabled the realisation of an electro-optic modulator driver with 6.2- and 5.9-Vpp differential driving amplitude at 100 and 112 Gb/s, respectively, with a high signal quality. This circuit thus establishes the swing-speed product record at 660 Gb/s.V on wafer and at 575 Gb/s.V in a microwave module. In the frame of the European project POLYSYS, it has been co-packaged with a tunable laser and a modulator to realise a compact optoelectronic transmitter module, which has demonstrated performances advancing the state of the art of short reach 100-Gb/s optical communications
Kétata, Kaouther. "Transistor bipolaire à hétérojonction GaAlAs-GaAs en structure autoalignée pour application en hyperfréquences." Paris 11, 1987. http://www.theses.fr/1987PA112171.
Full textIn this thesis, an optimization of the elementary technolagical steps allowing the realization of self aligned GaAs/GaA1As heterojonction bipolar transistors (HBT's) for high frequency operation is presented. A study of p-type implantation to contact the GaAs base layer has been conducted and led to the integration of this technological step in the fabrication process of HBT's. High doping level using rapid thermal annealing of Mg implanted heterostructures has been obtained (p=4. 1019cm3). Emitter ohmic contact based on refractory metals as required for selfaligned technology has been investigated. This contact exhibits a low resistivity (10-6 Q. Cm2); it behaves also as a suitable implantation mask and presents a high temperature stability. Etching of the contact has also been investigated using reactive ion etching. Metallic films and particularly Platinum are found to be more convenient etching mask than photoresists. Both vertical edge and T-shape structures have been realized using this mask. Transistors processed with this new technology exhibit DC current gain of 25 showing the feasability of the process
Kahn, Mathias. "Transistor bipolaire à hétérojonction GaInAs/InP pour circuits ultra-rapides : structure, fabrication et catactérisation." Paris 11, 2004. https://tel.archives-ouvertes.fr/tel-00006792.
Full textThe developpement of optical networks in the last decade has made possible the strong increase in worlwide telecomunications. Processing of high-bitrates signals (above 40 gb/s) at fiber input and output requires numerical circuits working very high frequencies, and thus based on vary fast electronics devices with cutoff frequencies of 150 ghz or more. Iii-v semiconctor materials have remarkable physical properties, making inp base hbt one of the fastest transitor available at this time. This device allows design of circuits working at the very high frequencies required in optical communications applications. Fabrication of gainas/inp hbt involves a large number of design and processing steps (epitaxial growth, cleanroom processing, caracterisation,), and requiers understanding of various physical effects determining the device behavior. In this work, we study the main physical effects involved in hbt behavior, and we carry out optimisation of the device
Nodjiadjim, Virginie. "Transistor bipolaire à double hétérojonction submicronique InP/InGaAs pour circuits numériques ou mixtes ultra-rapides." Thesis, Lille 1, 2009. http://www.theses.fr/2009LIL10028/document.
Full textThis thesis is about the performance optimization of InP/InGaAs Double Heterojunction Bipolar Transistors (DHBT) with sub-micrometer dimensions. The development of an analytical model taking into account the specific features of the device in terms of geometry and process is first reported. This model, backed by results from S parameters measurements, is used to define a device geometry leading to high cut-off frequencies; it also helps identifying the main directions for further performance improvement. Several epi-layer structures for the base-collector junction are then investigated, aiming at improving the HBT transport properties and at pushing toward higher current densities the onset of Kirk effect. Since HBTs are operating at current densities as high as 800 kA/cm2 and beyond, they are sensitive to self-heating; this feature results in reduced frequency performance and faster characteristics degradation. This is why the impact of temperature on transistor performance is analyzed and ways to limit HBTs self-heating phenomena and to improve their reliability are indicated. This work allowed the validation of an HBT process characterized by cut-off frequencies in the 250-300 GHz range for both fT and fmax, together with a breakdown voltage of about 5 V. Such HBTs have been used in the fabrication of ICs for 100 Gbit/s transmission applications
Withitsoonthorn, Suwimol. "Photodiode UTC et oscillateur différentiel commandé en tension à base de TBdH InP pour récupération d'horloge dans un réseau de transmission optique à très haut débit." Phd thesis, Université Pierre et Marie Curie - Paris VI, 2004. http://tel.archives-ouvertes.fr/tel-00006403.
Full textBlayac, Sylvain. "Transistor bipolaire à double hétérojonction InP/GalnAs pour circuits de communications optiques à très haut débit." Montpellier 2, 2001. http://www.theses.fr/2001MON20039.
Full textGrandchamp, Brice. "Etude des mécanismes de dégradation dans les Transistors Bipolaires à Hétérojonction InP/GaAsSb/InP utilisés dans les circuits de commande des systèmes de communications optiques 40-80 Gbits/s." Bordeaux 1, 2007. http://www.theses.fr/2007BOR13535.
Full textOuld, Saad Hamady Sidi. "Étude d'hétérostructures par spectroscopie d'admittance et de photocourant : application aux photopiles à base de Cu(In, Ga)Se2 et aux transistors bipolaires à hétérojonction en InGaP/GaAs." Paris 6, 2001. http://www.theses.fr/2001PA066465.
Full textMichaillat, Marc. "Paramètres matériau pour la simulation de transistors bipolaires à hétérojonctions Si/SiGe et Si/SiGeC." Phd thesis, Université Paris Sud - Paris XI, 2010. http://tel.archives-ouvertes.fr/tel-00461914.
Full textAndrieux, Laurent. "Caractérisation du transistor bipolaire à hétérojonction GaAlAs/GaAs en vue de son utilisation en amplification hyperfréquence de puissance." Toulouse 3, 1995. http://www.theses.fr/1995TOU30134.
Full textPelouard, Jean-Luc. "Le transistor bipolaire à hétérojonction InGaAs : étude Monte-Carlo des phénomènes de transport non-stationnaires et réalisation technologique." Paris 11, 1987. http://www.theses.fr/1987PA112440.
Full textKahn, Mathias. "Transistor Bipolaire à Hététrojonction GaInAs/InP pour circuits ultra-rapides : structure, fabrication et caractérisation." Phd thesis, Université Paris Sud - Paris XI, 2004. http://tel.archives-ouvertes.fr/tel-00006792.
Full textLefebvre, Éric. "Croissance métamorphique par épitaxie par jets moléculaires et caractérisations physiques pour transistor bipolaire à hétérojonction InP/InGaAs sur GaAs." Lille 1, 2005. https://ori-nuxeo.univ-lille1.fr/nuxeo/site/esupversions/f605bbca-fcf9-41d7-b911-dd5afd32eff9.
Full textMairiaux, Estelle. "Développement d’une nouvelle filière de transistors bipolaires à hétérojonction AlIn(As)Sb/GaInSb en vue applications térahertz." Thesis, Lille 1, 2010. http://www.theses.fr/2010LIL10096/document.
Full textThe so-called ABCS (antimonide-based compound semiconductor) materials have a great potential for low power, high speed electronics as they have high electron and hole mobilities and provide a unique opportunity for bandgap engineering. The ternary material GaInSb has specifically recently emerged as a good candidate for the base layer of high performance heterojunction bipolar transistors (HBT). The purpose of this work is to demonstrate the feasibility and potentialities of a new antimonide-based HBT structure using AlIn(As)Sb/GaInSb heterojunctions. The fabrication of devices in this material system represents a new technological approach as compared to the conventional InP/GaInAs or InP/GaAsSb HBTs and has necessitated the development of various processing steps. In this study, we have investigated new selective chemical solutions to expose the base and the subcollector surface, as well as for achieving device isolation. High quality and reliable ohmic contacts has also been explored by investigating the factors that influence the specific contact resistivity, thermal stability, and shallowness of the ohmic contacts to n- and p-GaInSb. The fabricated devices demonstrated good microwave behaviour with a current gain cutoff frequency fT of 52 GHz and a maximum oscillation frequency fMAX of 48 GHz. Electrical analysis based on dc and RF measurements and a small signal equivalent circuit model enabled the determination of the limiting factors that need to be addressed for further improvement
Heckmann, Sylvain. "Contribution au développement d'une filière de transistors bipolaires à hétérojonction de très forte puissance en bandes L et S pour applications de télécommunications civiles et radar." Limoges, 2003. http://aurore.unilim.fr/theses/nxfile/default/a149f671-c136-482d-9b2e-893a745a0815/blobholder:0/2003LIMO0029.pdf.
Full textBarros, Oscar de. "Caractérisation électrique des défauts induits lors de l'intégration de la base d'un transistor bipolaire a hétérojonction SIGe en technologie BICMOS." Lyon, INSA, 1997. http://www.theses.fr/1997ISAL0106.
Full textEpitaxial growth improvements have allowed the elaboration of high quality SiGe strained layers on Si substrate and their application in heterojunction bipolar transistors, leading silicon based devices to high frequency performances. Nevertheless, the integration of the. SiGe alloy in an industrial process requires minimum process modification as well as a high final quality of epitaxial layers. This is the context of the SiGe HBTs integration into a BiCMOS process developed at the CNET Meylan. In this thesis work, we present a study of the quality of the emitter-base system of SiGe HBTs, by means of electrical measurements such as deep level transient spectroscopy and static currents. Experimental results on single polysilicon self-aligned transistors point out the presence of defects in the active zone of the devices, located at the emitter-base junction periphery along Si02 spacers. The apparent activation energy is 0. 6 eV, making these deep levels very active recombination centers. These defects have been shown to originate from the reactive ion etching of the polysilicon emitter, leading to the conclusion that the epitaxial layers do not suffer relaxation during the process. This result is a contribution to the choice of a quasi-self-aligned structure for further development, where the active zone is far from etch-induced damages. First results concerning the quasi self-aligned transistors have evidenced the presence of many deep levels in the SiGe base bandgap, corresponding to defects at the Si/SiGe interface and in the SiGe base, which dramatically degrade the device performances
Pérez, Marie Anne. "Modèle électrothermique distribué de transistor bipolaire à hétérojonction : application à la conception non linéaire d'amplificateurs de puissance optimisés en température." Limoges, 1998. http://www.theses.fr/1998LIMO0029.
Full textGauthier, Alexis. "Etude et développement d’une nouvelle architecture de transistor bipolaire à hétérojonction Si / SiGe compatible avec la technologie CMOS FD-SOI." Thesis, Lille 1, 2019. http://www.theses.fr/2019LIL1I081.
Full textThe studies presented in this thesis deal with the development and the optimization of bipolar transistors for next BiCMOS technologies generations. The BiCMOS055 technology is used as the reference with 320 GHz fT and 370 GHz fMAX performances. Firstly, it is showed that the vertical profile optimization, including thermal budget, base and collector profiles allows to reach 400 GHz fT HBT while keeping CMOS compatibility. In a second time, a fully implanted collector is presented. Phosphorous-carbon co-implantation leads to defect-free substrate, precise dopants profile control and promising electrical performances. A new 450 GHz fT record is set thanks to optimized design rules. A low-depth STI module (SSTI) is developed to limit the base / collector capacitance increase linked to this type of technology. In a third time, the silicon integration of a new bipolar transistor architecture is detailed with the aim of overcoming DPSA-SEG architecture limitations used in BiCMOS055 and first electrical results are discussed. This part shows the challenges of the integration of new-generation bipolar transistors in a CMOS platform. The functionality of the emitter / base architecture is demonstrated through dc measurements. Eventually, the feasibility of 28-nm integration is evaluated with specific experiments, especially about implantations through the SOI, and an overview of potential 3D-integrations is presented
Demichel, Sylvain. "Transistors bipolaires à hétérojonction à collecteur métallique (M. H. B. T. ) à base fine : réalisation technologique dans la filière InP/InGaAs et caractérisation." Paris 6, 2001. http://www.theses.fr/2001PA066545.
Full textAl, Hajjar Ahmad. "Caractérisation basse fréquence et simulation physique de transistors bipolaires hétérojonction en vue de l'analyse du bruit GR assisté par pièges." Thesis, Limoges, 2016. http://www.theses.fr/2016LIMO0045/document.
Full textThis work presents the development of a thermal test bench for I(V) characteristics, for low frequency impedance and for low frequency noise of semiconductor components. This thermal bench for low frequency noise measurement is composed of a low-noise voltage amplifier, a low-noise transimpedance amplifier, an FFT vector signal analyzer and a thermal chuck. This measurement bench has allowed to extract the current noise sources equivalent to the access transistor at different current densities and at different temperatures. In order to calculate the activation energy and the capture cross section of traps thanks to the localization of the cutoff frequency of GR noise in HBT InGaP / GaAs technology. Secondly, we studied the low frequency noise in the transistor InGaP / GaAs and the differents junctions: emitter base, collector base and the base represented by the TLM resistance using physical simulations and measurements of low-frequency noise power spectrum density. Using this measurements, we extract the controlled and not controlled local internal noise sources. The extraction has allowed us to calculate the activation energy, the capture cross sections and validate the physical simulation
Sicault, Delphine. "Physique du transport balistique dans le Transistor Bipolaire à Hétérojonction sur substrat InP : étude et application à des structures innovantes ultra-rapides." Paris 6, 2001. http://www.theses.fr/2001PA066226.
Full textSommet, Raphaël. "Intégration d'un modèle physique de transistor bipolaire à hétérojonction dans l'environnement de la C. A. O. Non linéaire des circuits monolithiques microondes." Limoges, 1996. http://www.theses.fr/1996LIMO0039.
Full textEl, Rafei Abdelkader. "Analyse des effets dispersifs dans les transistors radiofréquences par mesures électriques." Limoges, 2011. https://aurore.unilim.fr/theses/nxfile/default/381740cc-fba9-4386-9b9d-0e0dd1113527/blobholder:0/2011LIMO4037.pdf.
Full textPower amplifiers (PAs) are key elements of telecommunications and radar front ends at radio frequencies. The potential of the PA is limited by the phenomena of dispersion. In this context, we are interested in the characterization of thermal phenomena in the HBT transistors of different technology (GaAs, InP and SiGe) and characterization of thermal and traps effects in HEMT transistors based on GaN (AlGaN and AlInN) at low frequencies. A bench for low frequency S-parameters measurement [10 Hz, 40 GHz] is set up to enable us to study the behavior of the new components in the frequency range seat of nonlinear parasitic phenomena. A simple, yet accurate, method to experimentally characterize the thermal impedance of Hetero junction Bipolar Transistors (HBT) with different technologies proposed. This method relies on low frequency S-parameters measurements. A detailed study has been initiated to characterize the phenomena of low frequency dispersion in the HEMT transistors based on GaN. The thermal and traps effects are studied for both technologies (AlGaN/GaN and AlInN/GaN) with the method of admittance spectroscopy to quantify the levels of deep traps
Rodriguez, Mendez Manuel. "L'analyse du bruit basse fréquence dans les composants SiGe." Paris 11, 2005. http://www.theses.fr/2005PA112362.
Full textPresent work investigates the low frequency noise in microwave devices using SiGe technology (field effect transistors n-HFET, p-MOSFET, heterojunction bipolar transistors HBT and IMPATT diode). The low frequency noise can limit or degrade the performance of non-linear microwave circuits such as oscillators or mixers. The organisation of this memory is as follows. Part I describes the automated measurement set-up developed and used for noise characterisation. Part II deals with noise in Si strained channel n-HFET grown on different virtual SiGe substrate, versus size and temperature. Part III is oriented to p-MOSFET (SiGe quantum wells) in order to observe the benefit in lower hole scattering on surface roughness and on ionized impurities. Part IV presents the noise of SiGe HBT as function of base doping level and activation annealing condition. The last part gives the noise of IMPATT diode; this noise is observed for several intrinsic lengths and several germanium fractions. The noise components observed were 1/f noise, thermal noise, shot noise and sometimes generation-recombination noise. Analysis of these noise components in conjuntion with static characterization, had allowed identification of the different noise sources and their supposed origin
Diénot, Jean-Marc. "Caractérisation et modélisation électrique non-linéaire du transistor bipolaire à hétérojonction GaAlAs/GaAs. Application à la conception d'un oscillateur microondes contrôlé en tension." Toulouse 3, 1994. http://www.theses.fr/1994TOU30147.
Full textBoussetta, Hatem. "Étude et réalisation de transistors bipolaires à pseudo-hétérojonction dans le cadre d'une technologie microélectronique BiCMOS." Grenoble 1, 1995. http://www.theses.fr/1995GRE10024.
Full textBarbalat, Benoit. "Technologie et Physique de Transistors Bipolaires à Hétérojonction Si/SiGeC Auto-alignés très Hautes Fréquences." Phd thesis, Université Paris Sud - Paris XI, 2006. http://tel.archives-ouvertes.fr/tel-00139028.
Full textRaya, Christian. "Modélisation et optimisation de transistors bipolaires à hétérojonction Si/SiGeC ultra rapides pour applications millimétriques." Bordeaux 1, 2008. http://www.theses.fr/2008BOR13602.
Full textWith the recent improvement in silicon technologies, SiGeC bipolar transistors are now able to compete with III-V technologies for millimeter-wave applications (frequency-range 60GHz/80GHz). However to break into the millimeter-wave market, the circuit frequency will be close to the devices cut-off frequency. Therefore, the transistors work in extremely non-linear conditions and the high injection needs to be accurately modelled. First, a description of the bipolar transistors architecture allows introducing the device parasitic components. Extraction methods based on specific test structures are presented to identify the key parameters limiting the high frequency performances, and for process optimization. Secondly the hyper-frequency characterization method is discussed in the millimeter range. Finally, the last part of this thesis is a contribution to the extraction of the compact bipolar model HICUM high-injection parameters
MARTIN, Jean-Christophe. "Etude des mécanismes de dégradation des Transistors Bipolaires à Hétérojonction sur substrat InP destinés aux communications optiques." Phd thesis, Université Sciences et Technologies - Bordeaux I, 2004. http://tel.archives-ouvertes.fr/tel-00010886.
Full textCouret, Marine. "Failure mechanisms implementation into SiGe HBT compact model operating close to safe operating area edges." Thesis, Bordeaux, 2020. http://www.theses.fr/2020BORD0265.
Full textIn an ever-growing terahertz market, BiCMOS technologies have reached cut-off frequencies beyond 0.5 THz. These dynamic performances are achieved thanks to the current technological improvements in SiGe heterojunction bipolar transistors (HBTs). However, these increased performances lead to a shift of the transistors bias point closer to, or even beyond, the conventional safe-operating-area (SOA). As a consequence, several "parasitic" physical effects are encountered such as impact-ionization or self-heating which can potentially activate failure mechanisms, hence limiting the long-term reliability of the electric device. In the framework of this thesis, we develop an approach for the description and the modeling of hot-carrier degradation occurring in SiGe HBTs when operating near the SOA edges. The study aims to provide an in-depth characterization of transistors operating under static and dynamic operating conditions. Based on these measurements results, a compact model for the impact-ionization and the self-heating has been proposed, ultimately allowing to extend the validity domain of a commercially available compact model (HiCuM). Considering the operation as close as possible to the SOA, an aging campaign was conducted to figure out the physical origin behind such failure mechanism. As a result, it has been demonstrated that hot-carrier degradation leads to the creation of trap densities at the Si/SiO2interface of the emitter-base spacer which induces an additional recombination current in the base. A compact model integrating aging laws (HiCuM-AL) was developed to predict the evolution of the transistor/circuit electrical parameters through an accelerated aging factor. For ease of use in computer-aided design (CAD) tools, the aging laws have been scaled according to the geometry and architecture of the emitter-base spacer. The model has demonstrated its robustness and its accuracy for different SiGe HBT technologies under various aging conditions. In addition, a study on the reliability of several integrated circuits has been performed leading to a precise location of the most sensitive regions to the hot-carrier degradation mechanism. Thus, the HiCuM-AL model paves the way to perform circuit simulations optimizing the mm-wave circuit design not only in term of sheer performances but also in term of long-term reliability
Bhattacharyya, Arkaprava. "Non quasi-static effects investigation for compact bipolar transistor modeling." Thesis, Bordeaux 1, 2011. http://www.theses.fr/2011BOR14294/document.
Full textModern high speed (RF) transistors encounter certain delay while operated at high frequency or under fast transient condition. This effect is named as Non Quasi Static (NQS) effect. In the current work, NQS effect is analyzed in a concise manner so that it can be readily implemented in a compact model using the VerilogA description language. The basic physics behind this effect is investigated in small signal domain and the results are compared with the published work. In popular bipolar model HICUM lateral and vertical NQS are examined separately and uses the same model for both transient and AC operation which requires an additional minimum phase type sub circuit. Compact modeling with HICUM model is performed in both measurement and device simulated data. At last, an improved excess phase circuit is proposed to model the NQS effect
Delmotte, Franck. "Dépôts de films minces SiNx assistés par plasma de haute densité. Etudes corrélées de la phase gazeuse, de l'interface SiNx/InP et de la passivation du transistor bipolaire à hétérojonction InP." Phd thesis, Université Paris Sud - Paris XI, 1998. http://tel.archives-ouvertes.fr/tel-00430327.
Full textBlanchet, Floria. "Analyse et caractérisation des performances en puissance de transistors bipolaires à hétéro-jonction SiGe:C pour des applications de radiocommunications portables." Limoges, 2007. https://aurore.unilim.fr/theses/nxfile/default/f1bfd25b-e0f7-4e43-859b-0d7d3b984d33/blobholder:0/2007LIMO4018.pdf.
Full textThis work deals with the characterization of power hetero-junction bipolar transistors Si/SiGe:C produced by STMicroelectronics Crolles foundry, destined to mobile radio-communications applications. A historic of the main technological evolutions of the bipolar transistor is proposed. The CW simulations, using the HICUM model, highlighted the influence of the biasing and the charge impedances on the efficiency optimization. Next, an original resolution to test the transistors robustness is presented. Then, the measurements realized on the active load-pull bench of the Xlim laboratory showed a good consistency with the CW simulations. The 2-tons comparisons are promising. Finally, this thesis lets to identify a calibration problem on the passive load-pull bench of the STMicroelectronics laboratory. The proposed resolution has been approved by Focus Microwaves
Camps, Thierry. "Conception et realisation de transistors bipolaires hyperfrequences de puissance a heterojonction gaas/gaalas." Toulouse 3, 1991. http://www.theses.fr/1991TOU30080.
Full textGranier, Hugues. "Optimisation technologique des transistors bipolaires hyperfréquence de puissance à hétérojonction GaAs/GaAlAs." Phd thesis, Université Paul Sabatier - Toulouse III, 1995. http://tel.archives-ouvertes.fr/tel-00146678.
Full textBrossard, Florence. "Epitaxies Si/SiGe(C) pour transistors bipolaires avancés." Phd thesis, Université Joseph Fourier (Grenoble), 2007. http://tel.archives-ouvertes.fr/tel-00200095.
Full textCette chimie à base de silane permet d'augmenter significativement la vitesse de croissance par rapport au système SiCl2H2/GeH4/HCl/H2 utilisé classiquement, aussi bien pour un dépôt silicium sélectif que pour un film SiGe sélectif. Par exemple, pour un film Si0,75Ge0,25 la vitesse de croissance est multipliée par un facteur 8.
L'incorporation des atomes de carbone dans les sites substitutionnels est facilitée par cette hausse du taux de croissance. En effet, la teneur en carbone substitutionnel est plus élevée en utilisant le silane comme précurseur de silicium (jusqu'à un facteur 4). L'effet bloquant du carbone sur la diffusion du bore est alors meilleur et le dopant est mieux contenu dans la base Si/SiGeC:B. Cette meilleure incorporation du carbone se reflète dans les résultats électriques. Le courant IB n'augmente pas aux fortes concentrations de carbone, ce qui signifie qu'il n'y a pas de centres recombinants dans la base. Le courant IC et la fréquence fT augmentent aussi, ce qui suggère que la largeur de la base neutre est plus fine et donc que la diffusion du bore est ralentie.
Nous avons également mis en évidence l'existence d'une corrélation entre le courant IB et l'intensité du signal de photoluminescence à température ambiante. En effet, considérant que leurs mécanismes de recombinaison sont similaires, nous avons noté que la hausse de IB correspond à la chute de la photoluminescence.