Relevant bibliographies by topics / TU Chemnitz

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'TU Chemnitz'

Author: Grafiati
Published: 4 June 2021
Last updated: 16 February 2022

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Journal articles on the topic "TU Chemnitz"

1

Thümer,, Ingrid, and Christoph Ziegler,. "MONARCH - das elektronische Volltextarchiv der TU Chemnitz." ABI-Technik 19, no. 4 (December 1999): 374–78. http://dx.doi.org/10.1515/abitech.1999.19.4.374.

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Petzoldt, Carolin, Sandra Gelbrich, Meike Röhrkohl, Christian Müller, Johannes Freund, and Lothar Kroll. "Textile Reinforced Lightweight Shells." Materials Science Forum 825-826 (July 2015): 319–27. http://dx.doi.org/10.4028/www.scientific.net/msf.825-826.319.

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Modern architecture is dominated by the tendency to design organically shaped filigree buildings. The resource and energy efficient construction of multifunctional buildings is as important as a broad variety of possible shapes. Multi-material support structures and shell constructions in lightweight design that also take over e. g. lighting and monitoring are needed for these purposes. Textile reinforced lightweight shell structures have been developed at Technische Universität Chemnitz within the scope of research projects. They consist of a hybrid material from carbon-fiber-reinforced concrete and glass-fiber-reinforced plastic. Thanks to the coupling of the positive material characteristics, the combination of two different composite materials results in a hybrid material with a total thickness of 15 mm, which has a high fatigue strength (XF4) and surface quality (exposed concrete). Furthermore, the hybrid is characterized by excellent compressive strength (120 MPa) and bending tensile strength (150 MPa), low susceptibility to corrosion and free formability. Therefore, it is highly suitable for thin-walled filigree lightweight shell structures. A research pavilion with a size of 4 x 4 x 3 m3 (l x w x h), made from textile reinforced lightweight shells, was built on the campus of TU Chemnitz, to test the theoretical investigations. Specially developed tensile sensors for the active lighting and determination of the elongations were integrated into the different layers. This aimed at an online-monitoring of the shell support structure.
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Haarig, Frederik, Denise Winkler, Marian Graubner, Linda Sipos, and Stephan Mühlig. "Achtsamkeit zur Stressbewältigung." Zeitschrift für Psychiatrie, Psychologie und Psychotherapie 64, no. 3 (June 2016): 187–97. http://dx.doi.org/10.1024/1661-4747/a000278.

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Zusammenfassung. Achtsamkeitsbasierte Verfahren wie Mindfulness-based Stress Reduction (MBSR) etablieren sich zunehmend in der Stressbewältigung, Förderung von Problemlösefähigkeiten, Prävention und begleitendenden Behandlung psychischer Störungen. Derzeit wird die Übertragbarkeit achtsamkeitsbasierter Verfahren auf die psychosoziale Beratung diskutiert. Welche Auswirkungen zeigt ein achtsamkeitsorientiertes Stressbewältigungstraining (AST) im Beratungssetting auf Achtsamkeitsniveau, Lebensqualität, Stress und depressive Symptomatik? In einer randomisiert-kontrollierten Pilotstudie (N = 28) wurde in der Psychosozialen Beratungsstelle (TU Chemnitz) ein Achtsamkeitsorientiertes Stressbewältigungstraining (6 wöchentliche Einheiten à 2 Stunden) im Warteliste-Kontrollgruppendesign (TAU) durchgeführt (Messzeitpunkte: Prä, Post, 3-Monats-Follow-Up). Trainingsteilnehmende wiesen gegenüber der Kontrollgruppe eine höhere Lebensqualität, weniger dysfunktionale und häufiger funktionale Stressbewältigungsstrategien und geringere depressive Symptome auf. Das Potential achtsamkeitsbasierter Verfahren kann erfolgreich in einer ökonomischen Kurzversion im Beratungssetting mit positiven Effekten auf Stresserleben, Lebensqualität und Depression umgesetzt werden. Der Einsatz achtsamkeitsorientierter Kurz-Trainings im Behandlungskontext sowie in der (psychosozialen) Beratung kann zur Überbrückung und Verringerung von Versorgungsengpässen beitragen.
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Timmel, Tristan, Alexander Hackert, Tomasz Osiecki, Colin Gerstenberger, and Lothar Kroll. "Structure integrated shape memory polymer composites for multidimensional forming." MATEC Web of Conferences 264 (2019): 01003. http://dx.doi.org/10.1051/matecconf/201926401003.

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Large-scale curved structures such as wind turbine wings usually require a special and cost intensive transport to the installation destination. These transport and installation costs can be reduced by a flat transport condition and the possibility of layering several structural components. For this reason, the focus at the Department of Lightweight Structures and Polymer Technology at TU Chemnitz was on a novel active material composite, which enables resource-efficient mass production and has a new component architecture. The large-volume multidimensional curvature of the active structure could be achieved by using a shape memory polymer (SMP). The associated reduction of the specific investment costs, the use of materials and the possibility of an integrative design, can contribute to the fact that, for example, the small wind turbines will become an economically viable investment in the future. The active structure influencing was represented by means of a finite element simulation (FEM) for different material composites and could be verified by generic demonstrators regarding its validity.
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Tautenhain, Florian, Roman Rinberg, and Lothar Kroll. "Novel Lightweight Semi-Finished Products Made of Poplar Veneer Plywood with Basalt Fibre Reinforcement." Key Engineering Materials 809 (June 2019): 645–49. http://dx.doi.org/10.4028/www.scientific.net/kem.809.645.

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Veneer plywood is established in building construction, interior finishing and vehicle construction. Particularly in automotive or ship interior applications, the requirements with regard to strength and stiffness properties are increasing. At the same time, the weight of the panel materials used is to be reduced. The development presented here is a new type of lightweight basalt fibre-reinforced poplar veneer plywood and at the same time rigid alternative to the established birch veneer plywood. By adapting the adhesive and the reinforcing semi-finished products, the material and manufacturing costs are comparatively low. The bonding of the fibre reinforcement to the carrier material is achieved by means of adapted wood adhesives (e.g. polyvinyl acetates), which are also used as matrix material for the fibre reinforcement. An application of the reinforcement layer is integrated into the coating process (e.g. with High Pressure Laminate HPL decorative fabrics) of the carrier material. Essential advantages compared to conventional board materials are shown in this paper. The research results were achieved at the Institute for Structural Lightweight Construction of the TU Chemnitz in cooperation with the company Toms Gerber GmbH within the ZiM cooperation project FuBa.
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Thieme, F., and M. Wobst. "TU Chemnitz-Zwickau - ein leistungsfähiger Physik-Fachbereich: Zu: „Physik-Fachbereiche in den neuen Ländern: Konsolidierung vor Neuaufbau”︁ Oktober-Heft 1992, S. 815." Physik Journal 49, no. 1 (January 1993): 54. http://dx.doi.org/10.1002/phbl.19930490120.

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Wallasch, Rainer, and Ramon Tirschmann. "Continuous Winding Technology for Specific Closed Structural Components." Materials Science Forum 825-826 (July 2015): 687–94. http://dx.doi.org/10.4028/www.scientific.net/msf.825-826.687.

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Since energy resources are limited, there is a strong need for efficient technologies, which are suitable for large scale production. Therefore, an innovative Continuous Orbital Winding Technology was developed within the Federal Cluster of Excellence EXC 1075 “MERGE Technologies for Multifunctional Lightweight Structures” at TU Chemnitz. This continuous orbital winding (COW) technology is aiming for mass-production-suited processing of special semi-finished fiber reinforced thermoplastic materials. The new process chain and modular concept allows the implementation of other technologies and special applications, e.g. sensor integration. The COW process is a combination of thermoplastic tape winding and automated thermoplastic tape laying technology.The technological aim is to produce structural components with variable closed cross sections having rotationally symmetric and asymmetric sections. In addition, the machine concept is specifically designed to realize flexible layer constructions. The experimental part geometry was determined and it is intended to carry out pilot studies in order to validate the functionality.The key challenge is the desired processing speed for mass production. Therefore, an exemplary cross-section contour has been derived and used for the realization of the demonstrative concept. In this special concept the number of discontinuous moved assembly units was reduced. Furthermore, the appropriate and effective drive system was dimensioned by using inverse kinematics.For the fundamental experiments unidirectional fiber reinforced thermoplastic tapes are used. These investigations imply the level of consolidation in critical areas. The achievable maximum processing speed is of prime importance. These results will be used for further optimizations and specifications.
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Ramm, Peter, Armin Klumpp, Alan Mathewson, Kafil M. Razeeb, and Reinhard Pufall. "The European 3D Heterogeneous Integration Platform (e-BRAINS) - a Particular Focus on Reliability and Low-Temperature Processes for 3D Integrated Sensor Systems." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (January 1, 2015): 001847–84. http://dx.doi.org/10.4071/2015dpc-tha11.

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The European 3D heterogeneous integration platform has been established by the consortium of the Integrated Project e-BRAINS [1], where technologies of the following relevant main categories of 3D integration are provided to enable future applications of smart sensor systems:3D System-on-Chip Integration - 3D-SOC: TSV technology for stacking of thinned devices or large IC blocks (global level),3D Wafer-Level-Packaging - 3D-WLP: embedding technology with through-polymer vias (TPV) for stacking of thinned ICs on wafer-level (no TSV), and3D System-in-Package - 3D-SIP: 3D stacking of packaged devices or substrates *definitions according to [2] Regarding TSV performance, the applications do not need ultra-high vertical interconnect densities as for 3D stacked Integrated Circuits – 3D-SIC*. Nevertheless, the lateral sizes of the TSVs are preferably minimized to allow for place and route for small “open” IC areas. Smaller TSVs are also preferred in order to reduce thermo-mechanical stress. e-BRAINS' focus is on how heterogeneous integration and sensor device technologies can be combined to bring new performance levels to targeted applications with high market potentials. The consortium, under coordination of Infineon and technical management by Fraunhofer EMFT, is composed of major European system manufacturers (Infineon, Siemens, SensoNor, 3D PLUS, Vermon and IQE), SMEs (DMCE, Magna Diagnostics, SORIN and eesy-ID), the large research institutions CEA Grenoble, Fraunhofer (EMFT Munich & IIS-EAS Dresden), imec, SINTEF, Tyndall and ITE Warsaw, and universities (EPFL Lausanne, TU Chemnitz and TU Graz). Target applications include automotive, ambient living and medical devices, with a specific focus on wireless sensor systems. Concerning the enabling 3D Heterogeneous Integration Platform, the e-BRAINS partners are working close together, where Infineon, Fraunhofer EMFT, imec and SINTEF are focusing mainly on 3D-SOC and 3D-WLP, and the French system manufacturer 3D PLUS and Tyndall on 3D-WLP and 3D-SIP technologies. The focus of this paper is on low-temperature bonding processes for highly reliable 3D integrated sensor systems. One of the key issues for heterogeneous systems production is the impact of 3D processes to the reliability of the product, i.e. the high built-in stresses caused by e.g. the CTE mismatch of complex layer structures (thin Si, ILDs, metals etc.) in combination with elevated bonding temperatures. As consequence, extensive project work was dedicated in the developments of reliable low-temperature bonding processes. Mainly intermetallic compound (IMC) bonding with Cu/Sn metal systems supported by ultrasonic agitation (Fraunhofer EMFT) was successfully introduced in 3D integration technology (see Fig. 2). A copper/tin solid-liquid interdiffusion (SLID) system was investigated using ultrasonic agitation to reduce the assembly temperature below the melting point of tin. Cleaning procedures are important shortly before joining the samples; dry cleaning has best results due to removal of thin oxide layers. Figure 2 shows a cross section of US supported Cu/Sn bonding at 150C. The intermetallic compounds Cu3Sn and Cu6Sn5 as well as pure tin easily can be identified. Due to low temperature assembly the most stable intermetallic compound (IMC) Cu3Sn has a minor share of the metal system. Most importantly there is no gap between top and bottom part of the joint despite the macroscopic assembly temperature is far away from the melting point of tin. But maybe the ultrasonic agitation brings enough energy to the interfaces, so locally melting can occur. In this way robust IMC bonding technology at 150C could be demonstrated with shear forces of 17 MPa and an alignment accuracy of 3 μm, well-suited for 3D integration. Figure 2: Low-temperature IMC bonding technology using ultrasonic agitation (Fraunhofer EMFT) Reliability for SLID contacts is certainly a very challenging objective especially looking for robust solutions in automotive applications. Thermally induced mechanical stress is the main reason for early fails during temperature cycling. Cross sectioned samples were investigated and methods like nanoindentation, Raman spectroscopy, fibDAC, and high local resolution x-ray scattering were applied to measure the intrinsic stresses. It can be shown that low temperature bonding is the right approach to avoid excessive stress cracking the interface or even fracturing the silicon. Also fatigue of metals can be reduced in a range that plastic deformation is no lifetime limiting factor.
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9

"Physik an der TU Chemnitz." Physik Journal 47, no. 1 (January 1991): 59–60. http://dx.doi.org/10.1002/phbl.19910470117.

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10

Handrock, Sybille. "4. Tagung deutscher Mathematikerinnen an der TU Chemnitz." Mitteilungen der Deutschen Mathematiker-Vereinigung 9, no. 2 (January 15, 2001). http://dx.doi.org/10.1515/dmvm-2001-0041.

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Dissertations / Theses on the topic "TU Chemnitz"

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Müller, Thomas. "Fileserving für die TU Chemnitz." Universitätsbibliothek Chemnitz, 1998. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-199800095.

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Vortrag zur Inbetriebnahme des File- und Archivserversystems im Universitätsrechenzentrum der TU Chemnitz. Ausgehend von der Entwicklung der Filesystem-Kapazitäten wird das Betriebskonzept der neu beschafften Technik vorgestellt. Dieses Konzept basiert auf Migrationsverfahren, die in den Filesystem-Implementationen MR-AFS und SAM-FS enthalten sind.
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2

Grunewald, Dietmar. "Identitäten an der TU Chemnitz." Universitätsbibliothek Chemnitz, 2004. http://nbn-resolving.de/urn:nbn:de:swb:ch1-200400416.

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Junghänel, Jens. "VOCAL-Einsatz an der TU Chemnitz." Universitätsbibliothek Chemnitz, 2003. http://nbn-resolving.de/urn:nbn:de:swb:ch1-200301347.

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Ziegler, Christoph. "AMANDA - Datensicherung an der TU Chemnitz." Universitätsbibliothek Chemnitz, 2001. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-200100102.

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Eibl, Maximilian, and Martin Gaedke. "Studierendensymposium Informatik 2016 der TU Chemnitz." Technische Universität Chemnitz, 2016. https://monarch.qucosa.de/id/qucosa%3A20434.

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Im Rahmen des 180jährigen Jubiläums der technischen Universität Chemnitz fand am 28. April 2016 das zweite Studierendensymposium der Fakultät Informatik statt. Das Studierendensymposium Informatik richtete sich inhaltlich an alle Themen rund um die Informatik und ihre Anwendungen: Ob Hardware oder Software, ob technische Lösungen oder Anwenderstudien, ob Programmierung oder Verwendung, ob Hardcore-Technik oder gesellschaftliche Fragestellungen – alles, was mit informatischen Lösungen zu tun hat, war willkommen. Das Studierendensymposium Informatik war dabei weder auf die Fakultät Informatik noch auf die TU Chemnitz begrenzt. Es wurden explizit Einreichungen aus thematisch angrenzenden Fächern beworben und Hochschulen der Region in die Planung und Organisation eingebunden. Der Tagungsband enthält die 21 Beitrage, die auf dem Symposium vorgestellt wurden.
In the course of the 180 year anniversary of the Technische Universität Chemnitz the Department of Computer Science held the second Students Symposium on April 18, 2016. The symposium addressed topics related to computer science and its applications: Whether hardware or software, whether technical solutions or user studies, whether programming or use, whether hardcore technology or social issues - everything concerned with computational solutions was welcomed. The Students Symposium included explicitly submissions from thematically adjacent departments and involved universities in the region in planning and organization. The proceedings contain the 21 papers (full and short), which were presented at the symposium.
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Fischer, Günther. "TUCWiki - TWiki-Einsatz an der TU Chemnitz." Universitätsbibliothek Chemnitz, 2003. http://nbn-resolving.de/urn:nbn:de:swb:ch1-200301059.

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TWiki bietet eine webbasierte Plattform zur interdisziplinären Zusammenarbeit. Als Nutzungsvoraussetzung wird nur ein Internetzugang und ein Webbrowser benötigt. Die einfache Erweiterbarkeit ermöglicht die Anpassung an die lokalen Erfordernisse. Die einfache Nutzerverwaltung erlaubt auch die Benutzung durch überregionale Arbeitsgruppen (gemeinsame Arbeit an Dokumenten und Datenaustausch).
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Ziegler, Christoph. "Administrationsdienst Windows XP an der TU Chemnitz." Universitätsbibliothek Chemnitz, 2004. http://nbn-resolving.de/urn:nbn:de:swb:ch1-200400040.

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Folien eines Vortrages im Rahmen des Seminars "Administration heterogener verteilter Rechnersysteme". Es wird der "Administrationsdienst Windows XP" der TU Chemnitz vorgestellt. Im Rahmen dieses Dienstes wird eine größere Zahl von Arbeitsplatz-PCs zentral installiert und administriert. Fokus dieses Vortrags sind die Prinzipien sowie die verwendeten Basistechnologien.
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Petersen, Karsten. "Eine Instant-Messenger-Infrastruktur für die TU Chemnitz." Universitätsbibliothek Chemnitz, 2004. http://nbn-resolving.de/urn:nbn:de:swb:ch1-200400366.

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Workshop "Netz- und Service-Infrastrukturen" Der Vortrag beleuchtete den Gedanken einer Instant-Messenger Infrastruktur für die Uni und den sich daraus ergebenden Möglichkeiten, Problemen sowie offenen Fragen.
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Steinmüller, Johannes, Holger Langner, Marc Ritter, and Jens Zeidler. "15 Jahre Künstliche Intelligenz an der TU Chemnitz." Universitätsbibliothek Chemnitz, 2008. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-200800898.

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Der vorliegende Band der Informatikberichte ist dem wissenschaftlichen Lebenswerk von Prof. Werner Dilger gewidmet. Seit Oktober 1993 hat er an der Fakultät für Informatik der TU Chemnitz hervorragende Arbeit in Forschung und Lehre geleistet. Dank der Mitarbeit zahlreicher Autoren beleuchtet der vorliegende Band eine große Vielfalt unterschiedlicher Aspekte der Künstlichen Intelligenz.
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Steinebach, Mario, Alexander Friebel, Christine Häckel-Riffler, Volker Tzschucke, Caroline Pollmer, Gabriela Horst, and Susanne Wiegner. "TU-Spektrum 1/2004, Magazin der Technischen Universität Chemnitz." Universitätsbibliothek Chemnitz, 2004. http://nbn-resolving.de/urn:nbn:de:swb:ch1-200400803.

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Books on the topic "TU Chemnitz"

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W, Fleischer, Nagel M, Ostermann R, and Bandemer Hans, eds. ISP '91, interaktive Datenanalyse mit ISP: Tagungsband des 2. ISP Workshops, TU Chemnitz. Essen: Westarp Wissenschaften, 1992.

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Zanger, Cornelia. Erfolg mit nachhaltigen Eventkonzepten: Tagungsband zur 2. Konferenz für Eventforschung an der TU Chemnitz. Wiesbaden: Gabler, 2011.

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Zanger, Cornelia. Erfolg mit nachhaltigen Eventkonzepten: Tagungsband zur 2. Konferenz für Eventforschung an der TU Chemnitz. Wiesbaden: Gabler Verlag / Springer Fachmedien Wiesbaden GmbH, 2012.

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Lichtzeichen: Stadt und Photographie ; [Termine: Mensa, TU Chemnitz, 21.01.2004-14.05.2004 ; Galerie Roter Turm, Chemnitz, 15.05.2004-21.05.2004 ; Usti nad Labem, 15.09.2004-31.10.2004]. Klingenthal: Grimm, 2004.

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ISP '91, interaktive Datenanalyse mit ISP: Tagungsband des 2. ISP Workshops, TU Chemnitz (Informatik). Westarp Wissenschaften, 1992.

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Beate, Neuss, Jurczek Peter, and Hilz Wolfram, eds. Europäische Integrationsbestrebungen auf politischer und regionaler Ebene: Tschechien und Polen : Beiträge zu einem politik- und regionalwissenschaftlichen Symposium an der TU Chemnitz. Tübingen: Europäisches Zentrum für Föderalismus-Forschung, 2002.

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Beate, Neuss, Jurczek Peter, and Hilz Wolfram, eds. Zwischenbilanz der EU-Osterweiterung: Slowenien, Slowakei und Tschechien als Beispiele : Beiträge zu einem politik- und regionalwissenschaftlichen Symposium an der TU Chemnitz. Tübingen: Europäisches Zentrum für Föderalismus-Forschung, 2001.

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Book chapters on the topic "TU Chemnitz"

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Müller, Burkhard. "Wissenschaftliches Schreiben: Ein Erfahrungsbericht von der TU Chemnitz." In Wissenschaftliches Schreiben in Natur- und Technikwissenschaften, 207–26. Wiesbaden: Springer Fachmedien Wiesbaden, 2016. http://dx.doi.org/10.1007/978-3-658-12211-9_12.

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Claudia, Bär, and Kebsch Karla. "Geschlechtergerechte Personalentwicklung an der TU Chemnitz: Best Practice Beispiel Verbundprojekt MENTOSA (Mentoring Netzwerk Sachsen)." In Geschlechtergerechte Personalentwicklung an Hochschulen, 127–30. Nomos, 2014. http://dx.doi.org/10.5771/9783845254173_127.

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Conference papers on the topic "TU Chemnitz"

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Bagshaw, Nick, Chris Punshon, and John Rothwell. "Development of Welding P92 Pipes Using the Reduced Pressure Electron Beam Welding Process for a Study of Creep Performance." In ASME 2014 Symposium on Elevated Temperature Application of Materials for Fossil, Nuclear, and Petrochemical Industries. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/etam2014-1010.

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Boiler and steam piping components in power plants are fabricated using creep strength enhanced ferritic (CSEF) steels, which often operate at temperatures above 550°C. Modification of alloy content within these steels has produced better creep performance and higher operating temperatures, which increases the process efficiency of power plants. The improved materials, however, are susceptible to type IV cracking at the welded regions. A better understanding of type IV cracking in these materials is required and is the basis of the Technology Strategy Board (TSB) UK funded VALID (Verified Approaches to Life Management & Improved Design of High Temperature Steels for Advanced Steam Plants) project. In order to study the relationship between creep performance and heat input during welding, several welds with varying amounts of heat input and resultant HAZ widths were produced using the electron beam welding process. The welding parameters were developed with the aid of weld process modeling using the finite element (FE) method, in which the welding parameters were optimized to produce low, medium and high heat input welds. In this paper, the modeling approach and the development of electron beam welds in ASTM A387 grade P92 pipe material are presented. Creep specimens were extracted from the welded pipes and testing is ongoing. The authors acknowledge the VALID project partners, contributors and funding body: Air Liquide, Metrode, Polysoude, E.ON New Build & Technology Ltd, UKE.ON, Doosan, Centrica Energy, SSE, Tenaris, TU Chemnitz, The University of Nottingham, The Open University and UK TSB. Paper published with permission.
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