Relevant bibliographies by topics / Two-Phase Immersion cooling

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  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Two-Phase Immersion cooling'

Author: Grafiati
Published: 4 June 2021
Last updated: 8 February 2022

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Journal articles on the topic "Two-Phase Immersion cooling"

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Bar-Cohen, Avram, and Karl J. L. Geisler. "Cooling the Electronic Brain." Mechanical Engineering 133, no. 04 (2011): 38–41. http://dx.doi.org/10.1115/1.2011-apr-3.

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This article discusses findings of some immersion cooling studies carried out to define the potential of direct liquid cooling of three-dimensional chip stacks. Four possible immersion cooling strategies were assessed. These included two active cooling strategies and two passive cooling strategies. The cooling densities for all four immersion cooling techniques were determined assuming the use of Fluorinert FC-72, a commonly used perfluorinated dielectric liquid. For passive systems, the cooling densities ranged from 25 W/cm3 for natural convection to 200–400 W/cm3 for pool boiling. For active
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Yuki, Kazuhisa. "Two-Phase Immersion Cooling for Power Electronics with High Heat Flux Generation." Journal of The Japan Institute of Electronics Packaging 21, no. 2 (2018): 122–25. http://dx.doi.org/10.5104/jiep.21.122.

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Saylor, J., A. Bar-Cohen, Tien-Yu Lee, T. Simon, Wei Tong, and Pey-Shey Wu. "Fluid Selection and Property Effects in Single-and Two-Phase Immersion Cooling." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 11, no. 4 (1988): 557–65. http://dx.doi.org/10.1109/tchmt.1988.1134923.

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Kanbur, Baris Burak, Chenlong Wu, Simiao Fan, Wei Tong, and Fei Duan. "Two-phase liquid-immersion data center cooling system: Experimental performance and thermoeconomic analysis." International Journal of Refrigeration 118 (October 2020): 290–301. http://dx.doi.org/10.1016/j.ijrefrig.2020.05.026.

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Liu, Cheng, and Hang Yu. "Evaluation and Optimization of a Two-Phase Liquid-Immersion Cooling System for Data Centers." Energies 14, no. 5 (2021): 1395. http://dx.doi.org/10.3390/en14051395.

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An efficient cooling system for data centers can boost the working efficiency of servers and promote energy savings. In this study, a laboratory experiment and computational fluid dynamics (CFD) simulation were performed to explore the performance of a two-phase cooling system. The coefficient of performance (COP) and partial power usage effectiveness (pPUE) of the proposed system was evaluated under various IT (Information Technology) loads. The relationship between the interval of the two submerged servers and their surface temperatures was evaluated by CFD analysis, and the minimum interval
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Saylor, J. R., A. Bar-Cohen, Lee Tien-Yu, T. W. Simon, Tong Wei, and Wu Pey-Shey. "Fluid selection and property effects in single- and two-phase immersion cooling (of electronic components)." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 11, no. 4 (1988): 557–65. http://dx.doi.org/10.1109/33.16697.

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Pérez, Sergio, Patricia Arroba, and José M. Moya. "Energy-conscious optimization of Edge Computing through Deep Reinforcement Learning and two-phase immersion cooling." Future Generation Computer Systems 125 (December 2021): 891–907. http://dx.doi.org/10.1016/j.future.2021.07.031.

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Knight, Roy W., Seth Fincher, Sushil H. Bhavnani, Daniel K. Harris, and R. Wayne Johnson. "A Numerical Study of Single Phase Dielectric Fluid Immersion Cooling of Multichip Modules." International Symposium on Microelectronics 2012, no. 1 (2012): 000581–90. http://dx.doi.org/10.4071/isom-2012-wa22.

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Immersion, single phase free convection cooling of multichip modules on a printed circuit board in a pool of dielectric fluid was examined numerically, with experimental verification of baseline cases. A multi-chip module with multiple thermal test cells with temperature sensing capability was simulated. The commercially available computational fluid dynamics program from ANSYS, Fluent, was used with the electronics packaging front end, Icepak, employed to create the models and compact conduction modules. Simulations were first performed of an experimental test vehicle which had five 18 mm by
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Ren, Linyuan, Yanan Wang, Zihao Yang, and Weidong Ding. "High power and high repetition frequency sub-nanosecond pulse generator with two-phase immersion cooling technique." Review of Scientific Instruments 92, no. 3 (2021): 034716. http://dx.doi.org/10.1063/5.0046770.

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Kanbur, Baris Burak, Chenlong Wu, and Fei Duan. "Multi‐criteria thermoeconomic and thermodynamic assessments of the desalination‐integrated two‐phase liquid‐immersion data center cooling system." International Journal of Energy Research 44, no. 13 (2020): 10453–70. http://dx.doi.org/10.1002/er.5677.

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Dissertations / Theses on the topic "Two-Phase Immersion cooling"

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Mohammed, Awaizulla Shareef. "Investigation of Immersion Cooled ARM-Based Computer Clusters for Low-Cost, High-Performance Computing." Thesis, University of North Texas, 2017. https://digital.library.unt.edu/ark:/67531/metadc1011866/.

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This study aimed to investigate performance of ARM-based computer clusters using two-phase immersion cooling approach, and demonstrate its potential benefits over the air-based natural and forced convection approaches. ARM-based clusters were created using Raspberry Pi model 2 and 3, a commodity-level, single-board computer. Immersion cooling mode utilized two types of dielectric liquids, HFE-7000 and HFE-7100. Experiments involved running benchmarking tests Sysbench high performance linpack (HPL), and the combination of both in order to quantify the key parameters of device junction temperatu
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Book chapters on the topic "Two-Phase Immersion cooling"

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Yuki, Kazuhisa. "Heat Transfer Enhancement Using Unidirectional Porous Media under High Heat Flux Conditions." In Porous Fluids - Advances in Fluid Flow and Transport Phenomena in Porous Media. IntechOpen, 2021. http://dx.doi.org/10.5772/intechopen.96594.

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In this chapter, new heat transfer enhancement technologies with unidirectional porous metal called “EVAPORON” and “Lotus’ Breathing” are introduced to remove and manage heat from high heat flux equipment. The unidirectional porous metals introduced here can be easily fabricated by unique techniques such as mold casting technique, explosive welding technique, and 3D printing technique. First of all, many kinds of porous media, which have been introduced by the author so far as a heat transfer promoter, are compared each other to clarify what kind of porous metal is more suitable for high heat flux removal and cooling by focusing on the permeability and the effective thermal conductivity. For the practical use of the unidirectional porous copper with high permeability and high thermal conductivity, at first, heat transfer performance of two-phase flow cooling using a heat removal device called “EVAPORON” is reviewed aiming at extremely high heat flux removal beyond 10 MW/m2. We have been proposing this device with the unidirectional porous copper fabricated by 3D printing technique as the heat sink of a nuclear fusion divertor and a continuous casting mold. Second, two-phase immersion cooling technique called “Lotus’ Breathing” utilizing “Breathing Phenomenon” is introduced targeting at thermal management of various electronics such as power electronics and high performance computers. The level of the heat flux is 0.1 MW/m2 to 5 MW/m2. In addition, as the other heat transfer enhancing technology with unidirectional porous metals, unidirectional porous copper pipes fabricated by explosive welding technique are also introduced for heat transfer enhancement of single-phase flow.
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Conference papers on the topic "Two-Phase Immersion cooling"

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Wada, Mizuki, Arihiro Matsunaga, Mahiro Hachiya, Masaki Chiba, Kunihiko Ishihara, and Minoru Yoshikawa. "Feasibility study of two-phase immersion cooling in closed electronic device." In 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2017. http://dx.doi.org/10.1109/itherm.2017.7992581.

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An, Xudong, Manish Arora, Wei Huang, William C. Brantley, and Joseph L. Greathouse. "3D Numerical Analysis of Two-Phase Immersion Cooling for Electronic Components." In 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2018. http://dx.doi.org/10.1109/itherm.2018.8419528.

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Niazmand, Amirreza, Tushar Chauhan, Satyam Saini, Pardeep Shahi, Pratik Vithoba Bansode, and Dereje Agonafer. "CFD Simulation of Two-Phase Immersion Cooling Using FC-72 Dielectric Fluid." In ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/ipack2020-2595.

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Abstract With more development in electronics system capable of having larger functional densities, power density is increasing. Immersion cooling demonstrates the highest power usage efficiency (PUE) among all cooling techniques for data centers and there is still interest in optimizing immersion cooling to use it to its full potential. The aim of this paper is to present the effect of inclination and thermal shadowing on two-phase immersion cooling using FC-72. For simulation of boiling, the RPI (Rensselaer Polytechnic Institute) wall boiling model has been used. Also, two empirical models w
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Cengiz, Ceren, Ahmet Mete Muslu, Mehmet Arik, and Baris Dogruoz. "Enhanced Thermal Performance of High Flux LED Systems with Two-Phase Immersion Cooling." In 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2020. http://dx.doi.org/10.1109/itherm45881.2020.9190428.

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Sayed, Chady Al, Omidreza Ghaffari, Yaser Nabavi Larimi, et al. "Two-Phase Immersion Cooling of Microprocessors with Electroplated Porous Heat Spreaders: Thermal Performance and Reliability." In 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm). IEEE, 2021. http://dx.doi.org/10.1109/itherm51669.2021.9503279.

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Srinivasan, Vedanth, Kil-min Moon, David Greif, DeMing Wang, and Myung-hwan Kim. "Numerical Simulation of Immersion Quench Cooling Process: Part I." In ASME 2008 International Mechanical Engineering Congress and Exposition. ASMEDC, 2008. http://dx.doi.org/10.1115/imece2008-69280.

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In this article, we describe a newly developed modeling procedure to simulate the immersion quench cooling process using the commercial code AVL-FIRE. The boiling phase change process, triggered by the dipping hot solid part into a subcooled liquid bath and the ensuing two-phase flow is handled using an Eulerian two-fluid method. Mass transfer effects are modeled based on different boiling modes such as film or nucleate boiling regime prevalent in the system. Separate computational domains constructed for the quenched solid part and the liquid (quenchant) domain are numerically coupled at the
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Geisler, Karl J. L., and Avram Bar-Cohen. "Passive Immersion Cooling of 3-D Stacked Dies." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33619.

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Three-dimensional die stacking increases integrated circuit (IC) density, providing increased capabilities and improved electrical performance on a smaller printed circuit board (PCB) footprint area. However, these advantages come at the expense of higher volumetric heat generation rates and decreased thermal and mechanical access to the die areas. Passive immersion cooling, allowing for buoyancy-driven fluid flow between stacked dies, can provide high heat transfer coefficients directly on the die surfaces, can easily accommodate a wide variety of interconnect schemes, and is scalable to any
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Barnes, Cindy M., and Phil E. Tuma. "Immersion Cooling of Power Electronics in Segregated Hydrofluoroether Liquids." In ASME 2008 Heat Transfer Summer Conference collocated with the Fluids Engineering, Energy Sustainability, and 3rd Energy Nanotechnology Conferences. ASMEDC, 2008. http://dx.doi.org/10.1115/ht2008-56230.

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Passive two-phase immersion cooling with dielectric liquids is a well established method of cooling thyristor type power semiconductors. However, the capabilities of this method for cooling high heat flux power semiconductor devices such as insulated gate bipolar transistors (IGBTs) have not been thoroughly explored. This work quantifies the junction-to-fluid thermal resistance of IGBTs soldered to boilers and immersed in the segregated hydrofluoroether liquid C3F7OCH3, one of a class of new dielectric liquids with a low Global Warming Potential. The boilers were square copper heat spreaders w
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Sarangi, Suchismita, Will A. Kuhn, Scott Rider, Claude Wright, and Shankar Krishnan. "Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48640.

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Efficient and compact cooling technologies play a pivotal role in determining the performance of high performance computing devices when used with highly parallel workloads in supercomputers. The present work deals with evaluation of different cooling technologies and elucidating their impact on the power, performance, and thermal management of Intel® Xeon Phi™ coprocessors. The scope of the study is to demonstrate enhanced cooling capabilities beyond today’s fan-driven air-cooling for use in high performance computing (HPC) technology, thereby improving the overall Performance per Watt in dat
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Pal, Aniruddha, and Yogendra Joshi. "Boiling of Water at Sub-Atmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-16146.

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Liquid cooling with phase change has been demonstrated to be a very efficient technique for thermal management of electronics because it has the potential to achieve high heat transfer coefficients compared to single phase liquid cooling. Previous studies on liquid immersion cooling with fluorocarbons have shown the effectiveness of boiling enhancement structures in lowering boiling incipience, raising the critical heat flux and reducing evaporator size. Two-phase thermosyphons are an alternative to liquid immersion cooling, where phase change liquid cooling can be implemented within a closed
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