Academic literature on the topic 'Via holes'

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Journal articles on the topic "Via holes"

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Laermans, E., J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, and D. Morlion. "Modeling differential via holes." IEEE Transactions on Advanced Packaging 24, no. 3 (2001): 357–63. http://dx.doi.org/10.1109/6040.938303.

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Yan, Qiubai, and Wenliang Chen. "Automatic Modification of Local Drilling Holes via Double Pre-Assembly Holes." World Journal of Engineering and Technology 03, no. 03 (2015): 191–96. http://dx.doi.org/10.4236/wjet.2015.33c028.

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Chamblin, Andrew, and G. W. Gibbons. "Nucleating black holes via nonorientable instantons." Physical Review D 55, no. 4 (February 15, 1997): 2177–85. http://dx.doi.org/10.1103/physrevd.55.2177.

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Swanson, D. G. "Grounding microstrip lines with via holes." IEEE Transactions on Microwave Theory and Techniques 40, no. 8 (1992): 1719–21. http://dx.doi.org/10.1109/22.149532.

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Shoemaker, Deirdre, Kenneth Smith, Ulrich Sperhake, Pablo Laguna, Erik Schnetter, and David Fiske. "Moving black holes via singularity excision." Classical and Quantum Gravity 20, no. 16 (July 31, 2003): 3729–43. http://dx.doi.org/10.1088/0264-9381/20/16/313.

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Kim, S., B. S. Bang, F. Ren, J. D’entremont, W. Blumenfeld, T. Cordock, and S. J. Pearton. "SiC via holes by laser drilling." Journal of Electronic Materials 33, no. 5 (May 2004): 477–80. http://dx.doi.org/10.1007/s11664-004-0206-7.

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BANERJEE, SOUVIK, SAYAN K. CHAKRABARTI, SUDIPTA MUKHERJI, and BINATA PANDA. "BLACK HOLE PHASE TRANSITIONS VIA BRAGG–WILLIAMS." International Journal of Modern Physics A 26, no. 20 (August 10, 2011): 3469–89. http://dx.doi.org/10.1142/s0217751x11053845.

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We argue that a convenient way to analyze instabilities of black holes in AdS space is via Bragg–Williams construction of a free energy function. Starting with a pedagogical review of this construction in condensed matter systems and also its implementation to Hawking–Page transition, we study instabilities associated with hairy black holes and also with the R-charged black holes. For the hairy black holes, an analysis of thermal quench is presented.
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LIU, CHENG-ZHOU. "SPECTROSCOPY OF ROTATING BLACK HOLES VIA AN ACTION INVARIANCE." Modern Physics Letters A 27, no. 24 (July 31, 2012): 1250139. http://dx.doi.org/10.1142/s0217732312501398.

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The spectroscopy of rotating black holes are investigated via an action invariance of black holes. Without using the quasinormal modes of black holes, the area and entropy spectrum for Kerr and Kerr–Newman black holes are calculated, respectively. For these rotating black holes, the same result of the equally spaced area and entropy spectrum is derived by utilizing the action invariance and with the help of Bohr–Sommerfield quantization rule. The present black hole spectroscopy is consistent not only to the result of other researches by the action invariance but also the original Bekenstein's spectra.
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LIU, CHENG-ZHOU. "HAWKING RADIATION VIA TUNNELING OF MASSIVE PARTICLES FROM A GRAVITY'S RAINBOW." Modern Physics Letters A 25, no. 38 (December 14, 2010): 3229–40. http://dx.doi.org/10.1142/s0217732310034341.

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In the tunneling framework of Hawking radiation, the quantum tunneling of massive particles in the modified Schwarzschild black holes from gravity's rainbow is investigated. While the massive particle tunneling from the event horizon, the metric fluctuation is taken into account, not only due to energy conservation but also to the Planck scale effect of spacetime. The obtained results show that, the emission rate is related to changes of the black hole's quantum corrected entropies before and after the emission. This implies that, considering the quantum effect of spacetime, information conservation of black holes is probable. Meanwhile, the quantum corrected entropy of the modified black hole is obtained and the leading correction behave as log-area type. And that, the emission spectrum with Planck scale correction is obtained and it deviates from the thermal spectrum.
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Król, Jerzy, and Paweł Klimasara. "Black Holes and Complexity via Constructible Universe." Universe 6, no. 11 (October 27, 2020): 198. http://dx.doi.org/10.3390/universe6110198.

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The relation of randomness and classical algorithmic computational complexity is a vast and deep subject by itself. However, already, 1-randomness sequences call for quantum mechanics in their realization. Thus, we propose to approach black hole’s quantum computational complexity by classical computational classes and randomness classes. The model of a general black hole is proposed based on formal tools from Zermelo–Fraenkel set theory like random forcing or minimal countable constructible model Lα. The Bekenstein–Hawking proportionality rule is shown to hold up to a multiplicative constant. Higher degrees of randomness and algorithmic computational complexity are derived in the model. Directions for further studies are also formulated. The model is designed for exploring deep quantum regime of spacetime.
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Dissertations / Theses on the topic "Via holes"

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Zhang, Yan. "Inkjet etching of micro-via holes in thin polymer layers." Thesis, Loughborough University, 2014. https://dspace.lboro.ac.uk/2134/14201.

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Facilitated by the development of various direct-write techniques and functional polymeric materials including polymer based conductors and semiconductors, printed electronics are flourishing both commercially and as a research topic. This is not only because of their simpler manufacturing routes and lower cost, but also as a result of lower processing temperatures and better compatibility with flexible substrates, compared with conventional electronics. The development of conventional electronics has been guided by Moore s Law, the driver for which lies in the demand for electronic devices with better performance and portability at lower prices. Therefore, one can expect a similar trend for printed electronics to guide its development. Multi-layered printing can be adopted in printed electronics to achieve higher density integration, so that this development trend can be maintained. In such circumstances, creation of electrical connections between multiple layers emerges as an important issue for printed electronics. Inkjet-etched via holes are one potential solution to providing such electrical interconnections, and which can provide good integration with other inkjet-printed features simply by switching nozzles. This thesis aims to elicit a better understanding of the physics involved in inkjet etching and investigate the capability of the inkjet etching technique. In the thesis, the factors that can affect the size of via holes produced by inkjet etching are evaluated, which is significant for evaluating the capability of this technique to deliver industrially relevant features. Identified factors include droplet ejection frequency, droplet diameter, solvent properties and substrate temperature. Droplet ejection frequency, i.e. the reciprocal of the time interval between drops, determines the extent of evaporation of the solvent between two consecutive drop impacts. Droplet diameter determines the radius of the wetted area after the droplet I impacts on the surface and spreads into a sessile drop. Solvents with different evaporation properties result in different size evolution with the number of drops dispensed, as does droplet ejection frequency. Higher substrate temperatures can reduce the drop diameter during flight and decrease the evaporation time on polymer surfaces, which can shrink the size of via holes. Another important issue is achieving complete polymer penetration as residual polymer creates an electrical conduction barrier after such holes are subsequently filled with conductive materials or act as a barrier to filling by electroplating. Experiments have been carried out to test the effect of outer diameter and polymer thickness on polymer penetration. Electroplating is utilised to test the completeness of via hole penetration. A mechanism using the Marangoni effect to explain the protrusion drying pattern other than a hole in the polymer layer is proposed.
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Bouman, Katherine L. (Katherine Louise). "Extreme imaging via physical model inversion : seeing around corners and imaging black holes." Thesis, Massachusetts Institute of Technology, 2017. http://hdl.handle.net/1721.1/113998.

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Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2017.
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 235-249).
Imaging often plays a critical role in advancing fundamental science. However, as science continues to push the boundaries of knowledge, imaging systems are reaching the limits of what can be measured using traditional-direct approaches. By designing systems that tightly integrate novel sensor and algorithm design, it may be possible to develop imaging systems that exceed fundamental theoretical limitations to observe things previously impossible to see. However, these non-traditional imaging systems generally come with a trade-off; they produce increasingly sparse and/or noisy measurements that require incorporating additional structure to extract anything meaningful. The focus of this thesis is on using computational methods that exploit structure in our universe to move past these obstacles and reveal the invisible. In this thesis, we focus on two imaging problems that explicitly leverage structure in our universe: reconstructing images and video from a computational telescope the size of the Earth, and seeing around corners. For the first imaging problem, this thesis investigates ways to reconstruct images and video from a sparse telescope array distributed around the globe. Additionally, it presents a number of evaluation techniques developed to rigorously evaluate imaging methods in order to establish confidence in reconstructions done with real scientific data. The methods and evaluation techniques developed in this thesis will hopefully aid in ongoing work to take the first picture of a black hole. Next, this thesis presents methods developed for using the subtle spatio-temporal radiance variations that arise on the ground at the base of an edge to construct a one-dimensional video of a hidden scene. These methods may be especially valuable in remotely sensing occupants in a room during search and rescue operations, or in detecting hidden, oncoming vehicles and/or pedestrians for collision avoidance systems.
by Katherine L. Bouman.
Ph. D.
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Schumann, Wiebke. "Ätzung und Charakterisierung von Strukturen mit hohem Aspektverhältnis in Silizium am Beispiel von Through-Wafer-Via-Holes." Ilmenau Universitätsbibliothek Ilmenau, 2010. http://d-nb.info/1000955222/34.

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Wood, Matthew. "Analysis of near fields and radiation of a printed circuit via hole." University of Western Australia. School of Electrical, Electronic and Computer Engineering, 2008. http://theses.library.uwa.edu.au/adt-WU2009.0053.

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Electromagnetic compatibility remains an important topic in the design and manufacturing of printed circuit boards (PCBs). Compatibility of these devices with their surroundings is becoming increasingly difficult as a modern PCB can have hundreds or thousands of parts, operating on many layers, and all at high speed. One such part is a via and its clearance, or via hole, commonly required in multilayer circuits where vertical connections between layers are used. The via hole may be exposed to large electromagnetic fields within the PCB. Although electrically small, the via hole provides a pathway for the fields to excite the exterior, either directly or through coupling to adjacent structures. To quantify this process, the near fields and radiation of an excited via hole are analysed, and are the focus of this thesis. The near fields of the via hole are first decoupled into electric and magnetic fields of the 'static' type. In both cases a series solution for two regions, one outside, and one inside the layers is constructed. The coefficients of the terms of the series are chosen to best satisfy the boundary behaviour of the fields on the conducting surfaces and across the hole. The criteria for assessing quality of the solution is based on the least squares method (LSM). Linear equation systems for both models are derived, and as no numerical integration or discretisation is required, an efficient and robust implementation to find the near fields is developed. Transformation into the far field is then achieved through surface integration of relevant field quantities close to the via hole. The far fields are best viewed as that due to two dipoles, of the magnetic and electric type, with strength and orientation depending on how the via hole is excited. It is shown that the two dipole model is sufficient to find the radiation from a 1mm diameter via hole at a frequency up to 8 GHz. Of further interest is how the choice of via hole dimensions affects the dipole moments and the near fields solved earlier are a key to this understanding.
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Day, Stephen. "Controlling charge carrier injection in organic electroluminescent devices via ITO substrate modification." Thesis, University of Nottingham, 2001. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.368243.

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Garcia, Rosmond. "Contribution à l'étude de circuits planaires par une méthode itérative basée sur le concept d'onde (F. W. C. I. P)." Toulouse, INPT, 2001. http://www.theses.fr/2001INPT046H.

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Le travail présenté dans ce mémoire, a été dans un premier temps de formuler une nouvelle méthode itérative basée sur le concept d'onde (la FWCIP) pour modéliser tout type de dispositifs micro-ondes planaires sans aucune contrainte géométrique, puis à l'améliorer au fur et à mesure que les difficultés sont survenues. L'objectif de cette méthode est de déterminer une relation simple et efficace permettant de mettre en relation les ondes incidentes et réfléchies dans les différents milieux environnant la discontinuité en exprimant la réflexion dans le domaine modal et la diffraction, définie à partir des conditions aux limites et de continuité, dans le domaine spatial. Le processus itératif s'appuie sur la transformée de Fourier rapide en modes (FFTM) pour passer rapidement d'un domaine à l'autre et pour s'affranchir des fonctions d'essai. En sus, la FFTM permet de diminuer considérablement le temps de calcul. L'algorithme de la moyenne mobile a été appliqué à la méthode afin d'accroître les performances de celle-ci, en permettant l'accélération de la convergence de l'impédance vue par la source. Ce simulateur, après quelques comparaisons avec la littérature, se prête aussi bien à l'étude de structures en guide d'ondes classique (iris), des structures microrubans (antennes, coupleurs), qu'à des dispositifs coplanaires (filtres) en simple ou multicouches. Ensuite, la formulation de la méthode a été révisée pour permettre l'analyse de structures imprimées sur des matériaux artificiels réalisés soit à partir de plots métalliques (via-holes) disposés périodiquement dans le substrat diélectrique d'un circuit microruban ou à partir de gravures périodiques dans le plan de masse d'une ligne microruban. La FWCIP combinée avec la méthode des éléments de frontière a permis de définir les principales caractéristiques des filtres à gap photonique. Pour terminer, une étude comparative a été faite entre la simulation et les mesures.
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Carson, Zachary Lee. "A Study of Black Hole Formation and Evaporation via the D1D5 CFT Dual." The Ohio State University, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=osu1469022251.

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Nordkvist, Anton, Anton Lundqvist, Dane Hana, Emil Ireståhl, and Magnus Lundmark. "Utveckling av kabelkanalsopmaskin : Projektarbete vid Holms Industri i Motala." Thesis, Linköpings universitet, Maskinkonstruktion, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-146131.

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This report presents two concepts for a product that is used for cable excavation. The first concept consists of a brush that is integrated with a collection container and the second concept consists of a brush that is integrated with a digging bucket. A test plan was also created to determine which dimension and material would yield the best results during excavation. The main purpose of this project was to increase the product range of Holm's industry in Motala by developing a concept that would minimize the risk of damaging cables during excavation. The product would also fit into the existing product range at Holms. The goal was to present two concepts for a brush that can directly be designed in a CAD program. To understand how the brush will operate, a study on existing products on the market was conducted. Then a study on the excavator attachments was made which resulted in OilQuick being a good solution because of its fast-hydraulic attachment. Customer needs were identified through interviews, which gave the impression that a brush that simultaneously collects soil would be a good solution. The result of the study was used to write the product specification. The product's many functions were divided into several parts to determine different solutions for each function. Thirteen concepts were prepared and a decision matrix was used as a tool to eliminate the concepts that would not be used. Several iterations of the concept development process were conducted where the results for each iteration were discussed to preserve the purpose of the project.
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Rodrigues, Rodrigues Margarita. "Improving performance and rotordynamic characteristics of injection compressors via much longer balance-piston and division-wall seals." Thesis, [College Station, Tex. : Texas A&M University, 2006. http://hdl.handle.net/1969.1/ETD-TAMU-1154.

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Sukumaran, Vijay. "Through-package-via hole formation, metallization and characterization for ultra-thin 3D glass interposer packages." Diss., Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/52250.

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here is an increasing demand for higher bandwidth (BW) between logic and memory ICs for future smart mobile systems. Such high BW are proposed to be achieved using 3D interposers that have ultra-small through-package-via (TPVs) interconnections to connect the logic device on one side of the interposer to the memory on the other side. The current approach is primarily based on organic or silicon interposers. However, organic interposers face several challenges due to their poor dimensional stability, and coefficient of thermal expansion (CTE) mismatch to silicon ICs. Silicon interposers made with back-end-of-line (BEOL) wafer processes can achieve the required wiring and I/O density, but are not cost effective, and in addition exhibit higher electrical loss due to the semiconducting nature of the Si substrate. In this research, ultra-thin 3D Glass Interposers are studied as a superior alternative to organic and silicon interposers. The fundamental focus of this research is to achieve ultra-small TPVs in thin glass with dimensions similar to that of through-silicon-vias (TSVs) in silicon. The objective of this research is to study and demonstrate ultra-small pitch (30µm) TPV hole formation (10µm diameter), metallization and electrical characterization in ultra-thin (30µm) glass substrates. To meet these objectives, this study focusses on four main research tasks: a) electrical modeling and design of ultra-small TPVs in glass, b) small diameter TPV hole formation with minimum defects, c) copper metallization of TPVs with reliable adhesion, and d) electrical characterization of TPVs. This research reports the first demonstration of ultra-small TPVs (10-15µm in diameter) in ultra-thin glass interposer substrates (30µm). A thin-glass handling method is developed using polymer surface layers to achieve defect-free handling of glass even at thicknesses as low as 30µm. Several TPV formation methods are explored including excimer laser ablation using 193nm (ArF) lasers to form TPVs with smallest diameter and pitch. A brief study on the through-put capabilities of these excimer lasers is also discussed. The fundamental approach to TPV metallization involves a semi-additive-plating process (SAP) using electroless and electrolytic copper deposition techniques. The resulting side-wall surfaces of TPVs after metallization are analyzed through SEM imaging of TPV cross-sections, and are further characterized using nano-indentation tests. Additionally, thermo-mechanical reliability tests and failure analysis are performed to study the reliability of TPVs that are metallized with Cu. This research culminates in design, fabrication and electrical characterization of small pitch TPVs in ultra-thin glass interposers (30µm).
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Books on the topic "Via holes"

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Benocci, Carla. Le ville storiche di via Aurelia Antica. Roma: Fratelli Palombi, 1995.

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Novak, David W. Final report on the project: Transferring fire safety knowledge to the elderly via local authorities. Quincy, MA: The Association, 1987.

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Novak, David W. Final report on the project: Transferring fire safety knowledge to the elderly via local authorities. Quincy, MA: The Association, 1987.

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La reggia di Genova: Quando i Savoia abitavano in via Balbi. Genova: De Ferrari, 2008.

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Novak, David W. Final report on the project: Transferring fire safety knowledge to the elderly via local authorities. Quincy, MA: The Association, 1987.

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J, Devine E. Fireside messages: Adapted for reading in Catholic homes. Montreal: Canadian Messenger, 1995.

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Homes of the West. New York: Crabtree Pub., 1999.

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Martinelli, Maurizio. Al tempo di Lorenzo: Viaggio nella Firenze dei Medici dal Palazzo di Via Larga al contado e nella Toscana del'400. Firenze: FMG, 1992.

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Yudelson, Jerry. Choosing green: The homebuyer's guide to good green homes. Gabriola Island, BC: New Society Publishers, 2008.

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Malian, Francesc Farrés i. Història de la fotografia a la ciutat de Vic: Homes, tècniques i màquines, 1849-1930. [Barcelona]: Editorial AUSA (Sabadell), 1991.

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Book chapters on the topic "Via holes"

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Fatibene, L., M. Ferraris, M. Francaviglia, and M. Raiteri. "The Entropy of Black Holes via Noether’s Theorem." In Recent Developments in General Relativity, 105–17. Milano: Springer Milan, 2000. http://dx.doi.org/10.1007/978-88-470-2113-6_10.

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Narayan, Ramesh, Jeffrey E. McClintock, and Alexander Tchekhovskoy. "Energy Extraction from Spinning Black Holes Via Relativistic Jets." In General Relativity, Cosmology and Astrophysics, 523–35. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-06349-2_25.

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McClintock, Jeffrey E., Ramesh Narayan, and James F. Steiner. "Black Hole Spin via Continuum Fitting and the Role of Spin in Powering Transient Jets." In The Physics of Accretion onto Black Holes, 295–322. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4939-2227-7_15.

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Schneider, F., B. Kirsch, M. Gurka, T. Hermann, J. A. L’huiller, and J. C. Aurich. "Improved Quality of Drilled Holes in Laminated Carbon Fiber Reinforced Plastics via Laser-Preprocessing." In Lecture Notes in Production Engineering, 27–31. Cham: Springer International Publishing, 2013. http://dx.doi.org/10.1007/978-3-319-01964-2_4.

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Suzuki, Hiroshi, Hiroyoshi Sekine, Shigeru Koibuchi, Hidetaka Sato, and Daisuke Makino. "Patterning of Fine Via Holes in Polyimide by an Oxygen Reactive Ion Etching Method." In Polymers for High Technology, 547–56. Washington, DC: American Chemical Society, 1987. http://dx.doi.org/10.1021/bk-1987-0346.ch046.

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Shapiro, Stuart L. "The Birth of AGNs and Quasars via the Collapse of Dense Star Clusters to Supermassive Black Holes." In Structure and Evolution of Active Galactic Nuclei, 129–47. Dordrecht: Springer Netherlands, 1986. http://dx.doi.org/10.1007/978-94-009-4562-3_9.

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Al Akhrass, Samer, Laurent Vonna, and Günter Reiter. "From Holes to Drops to Toroids: Conditions for the Transcription of Surface Patterns into Three-Dimensional Morphologies via Rim Instabilities in the Course of Dewetting." In Polymer Surfaces in Motion, 23–42. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-17431-0_2.

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Shane, Amber M., Christopher L. Reeves, and Francesca Zappasodi. "PIPJ Arthrodesis via Peg and Hole Technique." In Hammertoes, 75–84. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-319-16552-3_6.

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Hönerlage, B. "CuCl, gamma modification: electron-hole plasma." In New Data and Updates for I-VII, III-V, III-VI and IV-VI Compounds, 131. Berlin, Heidelberg: Springer Berlin Heidelberg, 2008. http://dx.doi.org/10.1007/978-3-540-48529-2_38.

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Fernandes da Silva, E. C. "AlxGayIn1–x–yAs: hole mobility." In New Data and Updates for III-V, II-VI and I-VII Compounds, 74. Berlin, Heidelberg: Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-540-92140-0_59.

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Conference papers on the topic "Via holes"

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Brewitt-Taylor, C. R. "Radiation from Via-Holes in MMICs." In 17th European Microwave Conference, 1987. IEEE, 1987. http://dx.doi.org/10.1109/euma.1987.333773.

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Zhang, Yao-Jiang, Shenhui Jing, and Jun Fan. "Studies of TEM mode assumption on via holes in via modelings." In 2012 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC). IEEE, 2012. http://dx.doi.org/10.1109/apemc.2012.6237873.

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Ogawa, Keiji, Toshiki Hirogaki, Eiichi Aoyama, and Heisaburo Nakagawa. "Circuit Connection Reliability Analysis of Laser-Drilled Blind Via Holes Using Data-Mining Method." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33077.

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The purpose of the present study is to analyze the circuit connection reliability of printed wiring boards (PWBs) with respect to thermal stresses on drilled hole walls. Micro-via drilling using laser technology has become the predominant method of machining smaller blind via holes. Moreover, a technique that uses copper foil in forming the circuit has been considered as a means of limiting the hole depth more accurately. After forming the blind via holes, copper plating must be used in order to maintain high reliability in circuit interconnectivity. In the present study, using the finite element method (FEM), we evaluated the effects of both the shape of the holes and the thickness of the copper plating on thermal stress occurring at the hole bottom. However, numerous factors are associated with the thermal stress, making the proper material composition and hole shape design difficult to determine. FEM must be applied to large amounts of data in order to identify quantitative tendencies. In addition, we applied a data-mining method to the thermal stress data, in an attempt to elucidate the factors that influence the reliability of blind via holes. The data-mining method revealed new factors that were hidden in the data; notably, the coefficient of thermal expansion in the thickness direction, despite the presence of other complex factors.
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Seksinsky, J. J., P. P. Lu, J. H. Koestner, and T. J. Jung. "Laser drilling of via holes in green ceramic." In Conference on Lasers and Electro-Optics. Washington, D.C.: OSA, 1986. http://dx.doi.org/10.1364/cleo.1986.wj4.

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John, Anslyn, and Chris Stevens. "Accretion onto deformed black holes via pseudo–Newtonian potentials." In High Energy Astrophysics in Southern Africa. Trieste, Italy: Sissa Medialab, 2019. http://dx.doi.org/10.22323/1.338.0001.

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Pisano, Roberto, Marco Bazzano, Luigi Carlo Capozzi, Ada Ferri, and Marco Sangermano. "Controlled release of ethylene via polymeric films for food packaging." In THE SECOND ICRANET CÉSAR LATTES MEETING: Supernovae, Neutron Stars and Black Holes. AIP Publishing LLC, 2015. http://dx.doi.org/10.1063/1.4937287.

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Di Girolamo, Rocco, Finizia Auriemma, Claudio De Rosa, and Anna Malafronte. "Tailoring the properties of polymers via formation of a mesophase." In THE SECOND ICRANET CÉSAR LATTES MEETING: Supernovae, Neutron Stars and Black Holes. AIP Publishing LLC, 2015. http://dx.doi.org/10.1063/1.4937315.

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8

Jia, Yonghao, Yuehang Xu, Yunqiu Wu, and Ruimin Xu. "Thermal analysis of the via holes in AlGaN/GaN HEMTs." In 2017 IEEE Asia Pacific Microwave Conference (APMC). IEEE, 2017. http://dx.doi.org/10.1109/apmc.2017.8251655.

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Cappellari, Michele, Richard M. McDermid, R. Bacon, Roger L. Davies, P. T. de Zeeuw, Eric Emsellem, Jesús Falcón-Barroso, et al. "Testing Mass Determinations of Supermassive Black Holes via Stellar Kinematics." In HUNTING FOR THE DARK: THE HIDDEN SIDE OF GALAXY FORMATION. AIP, 2010. http://dx.doi.org/10.1063/1.3458489.

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Haydt, Shane, Stephen Lynch, and Scott Lewis. "The Effect of Area Ratio Change via Increased Hole Length for Shaped Film Cooling Holes With Constant Expansion Angles." In ASME Turbo Expo 2017: Turbomachinery Technical Conference and Exposition. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/gt2017-63692.

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Shaped film cooling holes are used as a cooling technology in gas turbines to reduce metal temperatures and improve durability, and they generally consist of a small metering section connected to a diffuser that expands in one or more directions. The area ratio of these holes is defined as the area at the exit of the diffuser, divided by the area at the metering section. A larger area ratio increases the diffusion of the coolant momentum, leading to lower average momentum of the coolant jet at the exit of the hole and generally better cooling performance. Cooling holes with larger area ratios are also more tolerant of high blowing ratio conditions, and the increased coolant diffusion typically better prevents jet liftoff from occurring. Higher area ratios have traditionally been accomplished by increasing the expansion angle of the diffuser while keeping the overall length of the hole constant. The present study maintains the diffuser expansion angles and instead increases the length of the diffuser, which results in longer holes. Various area ratios have been examined for two shaped holes: one with forward and lateral expansion angles of 7° (7-7-7 hole) and one with forward and lateral expansion angles of 12° (12-12-12 hole). Each hole shape was tested at numerous blowing ratios to capture trends across various flow rates. Adiabatic effectiveness measurements indicate that for the baseline 7-7-7 hole, a larger area ratio provides higher effectiveness, especially at higher blowing ratios. Measurements also indicate that for the 12-12-12 hole, a larger area ratio performs better at high blowing ratios but the hole experiences ingestion at low blowing ratios. Steady RANS simulations did not accurately predict the levels of adiabatic effectiveness, but did predict the trend of improving effectiveness with increasing area ratio for both hole shapes. Flowfield measurements with PIV were also performed at one downstream plane for a low and high area ratio case, and the results indicate an expected decrease in jet velocity due to a larger diffuser.
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Reports on the topic "Via holes"

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DiGrande, Laura, Sue Pedrazzani, Elizabeth Kinyara, Melanie Hymes, Shawn Karns, Donna Rhodes, and Alanna Moshfegh. Field Interviewer– Administered Dietary Recalls in Participants’ Homes: A Feasibility Study Using the US Department of Agriculture’s Automated Multiple-Pass Method. RTI Press, May 2021. http://dx.doi.org/10.3768/rtipress.2021.mr.0045.2105.

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Objective: The purpose of this study was to assess the feasibility of administering the Automated Multiple-Pass Method (AMPM), a widely used tool for collecting 24-hour dietary recalls, in participants’ homes by field interviewers. Design: The design included computer-assisted personal interviews led by either a nutritionist (standard) or field interviewer. Portion estimators tested were a set of three-dimensional food models (standard), a two-dimensional food model booklet, or a tablet with digital images rendered via augmented reality. Setting: Residences in central North Carolina. Participants: English-speaking adults. Pregnant women and individuals who were fasting were excluded. Results: Among 133 interviews, most took place in living rooms (52%) or kitchens (22%). Mean interview time was 40 minutes (range 13–90), with no difference by interviewer type or portion estimator, although timing for nutritionist-led interviews declined significantly over the study period. Forty-five percent of participants referenced items from their homes to facilitate recall and portion estimation. Data entry and post-interview coding was evaluated and determined to be consistent with requirements for the National Health and Nutrition Examination Survey. Values for the number of food items consumed, food groups, energy intake (average of 3,011 kcal for men and 2,105 kcal for women), and key nutrients were determined to be plausible and within reasonably expected ranges regardless of interviewer type or portion estimator used. Conclusions: AMPM dietary recall interviews conducted in the home are feasible and may be preferable to clinical administration because of comfort and the opportunity for participants to access home items for recall. AMPMs administered by field interviewers using the food model booklet produced credible nutrition data that was comparable to AMPMs administered by nutritionists. Training field interviewers in dietary recall and conducting home interviews may be sensible choices for nutrition studies when response rates and cost are concerns.
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Plueddemann, Albert, Benjamin Pietro, and Emerson Hasbrouck. The Northwest Tropical Atlantic Station (NTAS): NTAS-19 Mooring Turnaround Cruise Report Cruise On Board RV Ronald H. Brown October 14 - November 1, 2020. Woods Hole Oceanographic Institution, January 2021. http://dx.doi.org/10.1575/1912/27012.

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The Northwest Tropical Atlantic Station (NTAS) was established to address the need for accurate air-sea flux estimates and upper ocean measurements in a region with strong sea surface temperature anomalies and the likelihood of significant local air–sea interaction on interannual to decadal timescales. The approach is to maintain a surface mooring outfitted for meteorological and oceanographic measurements at a site near 15°N, 51°W by successive mooring turnarounds. These observations will be used to investigate air–sea interaction processes related to climate variability. This report documents recovery of the NTAS-18 mooring and deployment of the NTAS-19 mooring at the same site. Both moorings used Surlyn foam buoys as the surface element. These buoys were outfitted with two Air–Sea Interaction Meteorology (ASIMET) systems. Each system measures, records, and transmits via Argos satellite the surface meteorological variables necessary to compute air–sea fluxes of heat, moisture and momentum. The upper 160 m of the mooring line were outfitted with oceanographic sensors for the measurement of temperature, salinity and velocity. Deep ocean temperature and salinity are measured at approximately 38 m above the bottom. The mooring turnaround was done on the National Oceanic and Atmospheric Administration (NOAA) Ship Ronald H. Brown, Cruise RB-20-06, by the Upper Ocean Processes Group of the Woods Hole Oceanographic Institution. The cruise took place between 14 October and 1 November 2020. The NTAS-19 mooring was deployed on 22 October, with an anchor position of about 14° 49.48° N, 51° 00.96° W in 4985 m of water. A 31-hour intercomparison period followed, during which satellite telemetry data from the NTAS-19 buoy and the ship’s meteorological sensors were monitored. The NTAS-18 buoy, which had gone adrift on 28 April 2020, was recovered on 20 October near 13° 41.96° N, 58° 38.67° W. This report describes these operations, as well as other work done on the cruise and some of the pre-cruise buoy preparations.
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