Relevant bibliographies by topics / Wafer and biscuit market

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Wafer and biscuit market'

Author: Grafiati
Published: 4 June 2021
Last updated: 10 February 2022

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Journal articles on the topic "Wafer and biscuit market"

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Chowdhury, K., S. Khan, R. Karim, M. Obaid, and GMMA Hasan. "Quality and Shelf-Life Evaluation of Packaged Biscuits Marketed in Bangladesh." Bangladesh Journal of Scientific and Industrial Research 47, no. 1 (2012): 29–42. http://dx.doi.org/10.3329/bjsir.v47i1.10717.

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Five different brands of locally produced biscuits and five brands of foreign biscuits were collected from the market. All these biscuits were stored at ambient condition (30 ºC, and 60 % RH) for 3 months. The changes in water activity, moisture and their consequences on sensory qualities like texture, color, flavor and overall acceptance were investigated in every month. Test of packaging materials were also carried out for each brand of packed biscuits. Moisture and water activity values have been increased with time for all the samples whereas sensory scores decreased. However, all the fore
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Muhammad, Usman Lawan, Ibrahim Muhammad Shamsuddin, Aliyu Abubakar Shehu, Kurfi Muhammad Yahaya, and Ma’aruf Nuhu. "Environmental Impacts of Waste Disposal: An Overview on the Disposal of Polyethylene Bags in Gusau City Zamfara State." Budapest International Research in Exact Sciences (BirEx) Journal 1, no. 4 (2019): 93–102. http://dx.doi.org/10.33258/birex.v1i4.482.

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The environmental impacts of waste disposal of polyethylene bags and seasonal variation of polyethylene disposal in Gusau City of Zamfara state, Nigeria was investigated. General public waste disposals from homes, schools and daily markets, were randomly selected for data collection. The data showed that polyethylene waste is generated more in the dry season than the wet season. The result also showed that table water sachet has 75% disposal. This is because, sachet water is cheap and consumed throughout the year with very little seasonal variation while at homes and markets also, displayed a
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Bandeira, Zaqueu Rocha, Virlane Kelly Lima Hunaldo, Adriana Crispim de Freitas, et al. "Elaboration and physical-chemical, microbiological and sensorial characterization of sweet gluten-free cookies prepared with babassu mesocarp flour and rice flour." Research, Society and Development 9, no. 8 (2020): e178985646. http://dx.doi.org/10.33448/rsd-v9i8.5646.

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Cookies, in general, are well accepted by all audiences, and research and investments in this type of product are of great importance to meet market demands. There are few product options for people with gluten intolerance on the market, and rice flour and babassu fruit mesocarp flour are good options for the development of new products for this audience. The objective of the present work was to prepare a gluten-free sweet biscuit with high nutritional value, based on babassu mesocarp flour with partial replacement by rice flour, to carry out the physical-chemical, microbiological characteriza
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&NA;. "Wafer formulation of famotidine takes the biscuit." Inpharma Weekly &NA;, no. 989 (1995): 20. http://dx.doi.org/10.2165/00128413-199509890-00041.

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Ismayana, A., O. A. Ibrahim, and M. Yani. "Life cycle assessment of wafer biscuit production." IOP Conference Series: Earth and Environmental Science 472 (June 23, 2020): 012065. http://dx.doi.org/10.1088/1755-1315/472/1/012065.

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Widodo, Slamet, and Saifuddin Sirajuddin. "BISCUIT FORMULATION WITH SUBSTITUTION OF BROWN RICE FLOUR." Journal of Business on Hospitality and Tourism 5, no. 2 (2019): 159. http://dx.doi.org/10.22334/jbhost.v5i2.132.

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Focus of this study was formulation of biscuit with substitutionof brown rice flour which were widely accepted by the community. The objective of the study was to formulate biscuit subtitution by brown rice flour. The experiment was conducted in Maret-July 2017 in Family Welfare Education Laboratory. Data collected was quality of biscuit (color, flavor, texture, taste, and overall) and the preference. Data was analyzed by Mean and ANOVA. Result: 18g wheat flour, 6g cornstarch, 4g tapioca starch, 19g brown rice flour, 12g margarine, 29g eggs yolk, and 12g refined sugar. Nutrition contents the b
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Cherăţoiu, Cosmina-Mădălina, Mihai Ognean, Claudia Felicia Ognean, and Ioan Danciu. "Gluten Free Biscuits in Local Market from Sibiu." Management of Sustainable Development 10, no. 1 (2018): 13–16. http://dx.doi.org/10.2478/msd-2018-0002.

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Abstract The study was undertaken to assess the quality and sensory properties of gluten free biscuits (GFB) offered in local market in Sibiu. The chemical, physico-chemical parameters and sensory qualities of biscuits were studied. The result revealed that moisture of GFB is normal (<5-6%), the water activity is under 0.3 for 6 of the samples, the breaking point is 0.878 (B7) and 1.564 (B1) as a result of different ingredient used (mix flour-corn, soya, rice for sample B1, rice-chickpeas flour for sample B7). Sensory qualities were determinate by using the hedonic test and showed that the
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Kleiner, Leslie. "Brazil: largest LATAM biscuit market, by volume." INFORM International News on Fats, Oils, and Related Materials 28, no. 10 (2017): 34–35. http://dx.doi.org/10.21748/inform.10.2017.34.

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Kleiner, Leslie. "Brazil: largest LATAM biscuit market, by volume." INFORM International News on Fats, Oils, and Related Materials 28, no. 10 (2017): 34–35. http://dx.doi.org/10.21748/inform.11.2017.34.

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Dogmus, E., and Hong Lin. "InP Wafer & EPI Wafer Market – ​Photonic & RF." Photonics Russia 13, no. 2 (2019): 214–17. http://dx.doi.org/10.22184/fros.2019.13.2.214.217.

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Dissertations / Theses on the topic "Wafer and biscuit market"

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Poledňáková, Lucia. "Marketingová stratégia vybranej spoločnosti pri uvedení nového výrobku na trh." Master's thesis, Vysoká škola ekonomická v Praze, 2009. http://www.nusl.cz/ntk/nusl-16578.

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The thesis focuses on marketing strategy of Storck when launching a new product to the Czech and Slovak market. At the beginning the parent company and its Czech subsidiary are introduced together with their production capacities and products. In the next part, there is an analysis of Czech confectionary market and wafer and biscuit market as well as comparison of Czech and Slovak wafer market. In the practical part, there is description of marketing strategy of Storck and application of particular elements of the marketing mix. At the end the marketing strategy is evaluated and suggestions fo
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Malecká, Eva. "Segmentace trhu sušenek a oplatek ve vztahu k vnímání značky Kolonáda mladými." Master's thesis, Vysoká škola ekonomická v Praze, 2011. http://www.nusl.cz/ntk/nusl-151519.

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The main objective of the diploma thesis is to determine the perception of the Kolonáda brand by young people and how to become relevant for them. This would not be possible without specific knowledge of the whole market and without knowledge regarding the segments of biscuits and wafers consumers. The market segmentation is based on MML-TGI data collected by the research agency Median, five segments are revealed. I have also implemented my own questionnaire research on a sample of 480 respondents aged up to 34 years including. Based on the results of the practical part, recommendations for th
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Lira, Rosa Cavalcante. "Caracterização nutricional e utilização de resíduos da Indústria alimentícia na dieta de frangos de corte." Universidade Federal de Alagoas, 2018. http://www.repositorio.ufal.br/handle/riufal/3163.

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Three experiments had been carried out in which the first one was a metabolism test, by the traditional method, to evaluate the nutritional value of the passion fruit residue in different substitution levels in diet and in two broiler chicken ages. There was a significant difference between ages within all residue replacement levels. For AME, AMEn, CAMDM, MCCP and CAMGE the mean of chicken aged between 10 to 17 days was higher than those with age between 1 to 8 days within all levels of residue replacement. The second and third experiments aimed to evaluate the nutritional value of the biscuit
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Huang, Chao-Wei, and 黃兆偉. "Improving the Effectiveness of Demand-Pull Replenishment Policy using Market Demand Forecasts for Wafer Fabrication." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/06650240450710930677.

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Su, Yi-Lun, and 蘇羿綸. "A business model of the niche market and analysis of the competitive strategy on wafer foundry company." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/13972176577721335805.

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碩士<br>元智大學<br>管理研究所<br>98<br>Taiwan Semiconductor Manufacturing Company and United Microelectronics Company are the largest dedicated wafer foundries in the world. Since the 1980’s, they have progressed from six-inch wafer fabrications to twelve-inch wafer fabrications. Small- and medium-sized wafer foundries in Taiwan with well-developed technologies preferentially adopt a business model of the original equipment manufacturer (OEM). This business model puts the wafer foundries of Taiwan in a critical survival situation. Taiwan Semiconductor Manufacturing Company and United Microelectronics
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孫煒筌. "Adjusting Inventory Buffer of Demand-Pull Replenishment Policy with Market Demand Forecasts - An Application in Wafer Fabrication." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/58246119798393166992.

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碩士<br>國立交通大學<br>工業工程與管理學系<br>99<br>Theory of Constraint suggests the use of demand-pull replenishment policy with buffer management to ménage inventory. This policy has been demonstrated to be more effective in practice than those traditional replenishment policies such as (s, S), (s, Q), (R, S), (R, s, S). Since the replenishment lead time of semiconductor products is long and their demand changes rapidly, customers are willing to share their demand forecasts with upstream partners, such as wafer foundries, to reduce their inventory. This study proposed a method to incorporate demand forecas
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Wang, Ya-Chun, and 王雅群. "Integrating Historical Demand and Market Forecasts in DDMRP Buffer Management to Improve Inventory Management in Wafer Foundry." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/vqwth3.

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碩士<br>國立交通大學<br>工業工程與管理系所<br>103<br>The demand-pull replenishment policy and buffer management (shorted as DPBM) method proposed by the theory of constraints (TOC) is simple and easy to implement. Man successful applications have been reported in practice. There are some studies developed different methods to improve traditional DPBM so that it can apply to management the inventory of the product with large demand variation, long production lead times and short product life cycle. All the existing DPBM-based method evenly divide the target buffer into three zones and adjusting the size of targ
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Huang, Shih-Feng, and 黃世豐. "The Market Analysis and Future Development of Fan-Out Wafer Level Packaging (FOWLP) in Advanced Packaging Technology." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/rf7484.

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碩士<br>輔仁大學<br>科技管理學程碩士在職專班<br>105<br>Semiconductor Industry has been developed in Taiwan for more than 40 years. It’s one of the major industries which makes Taiwan the second-largest semiconductor supplier in the world. Moreover, Taiwan IC packaging industry takes more than 50% market share all over the world. In 2016, TSMC launched the integrated Fan-Out process that break through the bottleneck in Moore’s Law and make the foundries moving into IC packaging field. The advantages of new fan-out technology are made by non-substrate process with smaller package. For smartphone application
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Liu, Wei-Chiu, and 劉緯球. "An Exploratory Study of Critical Factors in Business Transactions on Industrial Products from the Customer-Value Perspective — The Case of Consumable Suppliers of Semiconductor Wafer Manufacturing Market Use in Taiwan." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/21163246509705452158.

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碩士<br>國立臺灣科技大學<br>管理研究所<br>92<br>Abstract Date: Jun. 2004. Degree conferred: Master Student: Wei-Chiu Liu. (Also Known as Andy Liu) Advisor: Dr. Meng-Yen Lin Student Number: M9016913 Total pages: 55 Semiconductor wafer fabrication is highly capital and technical intensive. Control of manufacturing process is critical. To this industry, the vital and irrecoverable consequence caused by process mistake or defect during the manufacturing is far more significant than that is to consumer industry. Hence, requirements from this industry to its upstream
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Books on the topic "Wafer and biscuit market"

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Erskine, Alan. The UK biscuit market. Edited by Guest James, Nichols Charles, and Centre for Business Research. Manchester Business School, 1985.

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The worldwide IC wafer fabrication foundry market. Electronic Trend Publications, 1993.

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International, TechSearch. Flip chip and wafer level packaging trends and market forecasts. TechSearch International, 2004.

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Group, Nabisco, ed. View of the biscuit market. Nabisco, 1985.

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Division, Nabisco Group Grocery, ed. View of the biscuit market. Nabisco Group, Grocery Division, 1986.

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Frost & Sullivan., ed. The U.S. semiconductor wafer processing equipment market. Frost & Sullivan, 1989.

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Nabisco: View of the biscuit market. Nabisco, 1986.

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Parker, Philip M. The 2007 Import and Export Market for Sweet Biscuits, Waffles, Wafers, and Gingerbread in India. ICON Group International, Inc., 2006.

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The World Market for Sweet Biscuits, Waffles, Wafers, and Gingerbread: A 2004 Global Trade Perspective. Icon Group International, Inc., 2005.

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Parker, Philip M. The 2007 Import and Export Market for Sweet Biscuits, Waffles, Wafers, and Gingerbread in China. ICON Group International, Inc., 2006.

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Book chapters on the topic "Wafer and biscuit market"

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Vardaman, E. Jan. "FO-WLP Market and Technology Trends." In Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies. John Wiley & Sons, Inc., 2019. http://dx.doi.org/10.1002/9781119313991.ch2.

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Yoon, Jung-In, Chang-Hyo Son, Sung-Hoon Seol, and Ji-Hoon Yoon. "Ultra-Low Temperature Chillers for Semiconductor Manufacturing Process." In Advancements Towards Sustainability of HVAC & R Systems [Working Title]. IntechOpen, 2021. http://dx.doi.org/10.5772/intechopen.98547.

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The growth of the semiconductor market and advancement of manufacturing technology have led to an increase in wafer size and highly integrated semiconductor devices. The temperature of the supplied cooling medium from the chiller that removes the heat produced in the semiconductor manufacturing process is required to be at a lower level because of the high integration. The Joule-Thomson cooling cycle, which uses a mixed refrigerant (MR) to produce the cooling medium at a level of −100°C required for the semiconductor process, has recently gained attention. When a MR is used, the chiller’s performance is heavily influenced by the composition and proportions of the refrigerant charged to the chiller system. Therefore, this paper introduces a cooling cycle that uses an MR to achieve the required low temperature of −100°C in the semiconductor manufacturing process and provides the results of simple experiments to determine the effects of different MR compositions.
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Conference papers on the topic "Wafer and biscuit market"

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Kim, Jong-Seong, Chang Wook Ahn, Tae-Woo Kim, Hyun-Jin Lee, and Jong-Bae Lee. "A market-oriented wafer map optimization methodology using differential evolution to maximize wafer productivity." In 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). IEEE, 2017. http://dx.doi.org/10.1109/asmc.2017.7969268.

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Kim, Jong-Seong, Chang Wook Ahn, Tae-Woo Kim, Hyun-Jin Lee, and Jong-Bae Lee. "A market-oriented wafer map optimization methodology using Differential Evolution to maximize wafer productivity." In 2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO). IEEE, 2017. http://dx.doi.org/10.23919/mipro.2017.7966615.

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Mounier, Eric, Jerome Baron, and Amandine Pizzagalli. "Permanent & temporary wafer bonding for 3DICs: Market & applications overview." In 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2012. http://dx.doi.org/10.1109/ltb-3d.2012.6238041.

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Wang, Mu-Chun, Zhen-Ying Hsieh, Kuo-Shu Huang, Shuang-Yuan Chen, and Heng-Sheng Huang. "Back-Side Wafer Grinding Quality Affecting Back-End Assembly Process for LCD Driver ICs." In 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2008. http://dx.doi.org/10.1115/micronano2008-70014.

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Die size and thickness of IC substrate typically vary as a result of the various market demands while the semiconductor process and the product applications develop fast. In order to satisfy the market concerns, the improvement of wafer grinding and dicing saw technology is necessary to provide lighter, thinner and more reliable ICs. Generally, most of previous commercial ICs almost demonstrate the square profile, but some special applications such as liquid-crystal-display (LCD) driver ICs request approximate rectangle shape. Furthermore, the ratios of length / width of these drivers are near
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Wei, Frank. "Attributes of Advanced Thinning and Planarization Processes in 2.5D and 3D Packaging Recognized by Market Demands." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48387.

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During the fabrications of 2.5D and 3D advanced packages, the needs for intermediate thinning and planarization processes persistently exit. This paper highlights the attributes of successful implementations, i.e., increased performances and yields for these processes, which have been identified by the market requirements for a variety of applications. Different packages with different materials systems and product goals lead to different requirements. This paper includes the thinning and polishing of TSV wafers in bonded wafer pairs for Si IC devicess or interposers, the thinning of overmolde
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Tumne, Pushkraj, Vikram Venkatadri, Santosh Kudtarkar, et al. "Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52078.

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Today’s consumer market demands electronics that are smaller, faster and cheaper. To cater to these demands, novel materials, new designs, and new packaging technologies are introduced frequently. Wafer Level Chip Scale Package (WLCSP) is one of the emerging package technologies that have the key advantages of reduced cost and smaller footprint. The portable consumer electronics are frequently dropped; hence the emphasis of reliability is shifting towards study of effects of mechanical shock loading increasingly. Mechanical loading typically induces brittle fractures (also known as intermetall
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Lakhkar, Nikhil, Puligandla Viswanadham, and Dereje Agonafer. "Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength and Their Influence on Accelerated Thermal Cycling Reliability." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-11832.

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Ball shear testing is typically conducted in Wafer level chip scale package (WLCSP) fabrication to estimate the strength of the solder ball attachment. Generally, the solder ball shear strength is dependent on the solder ball size, pad size, solder/pad interface treatment, reflow temperature and time. Solder ball strength is also a function of ram speed and height at which the ball is sheared with respect to the wafer. Recent investigations suggest that ball shear test is being used as an indicator for board level reliability of assemblies. In current market lead time for launching a new produ
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Liu, Shuai-Lin, Ward Ye, Yu-Po Wang, Long-Yuan Wang, and Fred Lin. "Advanced Packaging Solution for High Density FCCSP Molding Warpage." In ASME 2019 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/imece2019-10563.

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Abstract In recent years, the IC industry continues to drive demand in the consumer market, and more global sales of smart-phones, smart-watches and tablets have continued to grow. In order to continuously enhance high performance computing, the consumer products pursued began to integrate HBM (High Bandwidth Memory) and AI (Artificial Intelligence) to strong and powerful mainstream market. With the shrinking use space pursued by consumer products, it is necessary to continuously develop lighter and thinner products, and under such product conditions, it seems that the risks and difficulties o
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Pfeffer, Markus, Richard Oechsner, Lothar Pfitzner, Heiner Ryssel, Berthold Ocker, and Patrick Verdonck. "Performance Optimization of Semiconductor Manufacturing Equipment by the Application of Discrete Event Simulation." In ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. ASMEDC, 2008. http://dx.doi.org/10.1115/detc2008-49274.

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Semiconductor wafer fabrication facilities (wafer fabs) are amongst the most complex production facilities. State-of-the-art wafer fabs comprise a large product variety, hundreds of processing steps per product, almost hundreds of machines of different types, and automated transportation systems combined with reentrant flows throughout the fab. In addition to the high complexity, wafer fabs require very high capital investment and an undisturbed operation. Semiconductor manufacturers are facing fierce competition as more global capacity is being added. Through this intense competition, semicon
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Lu, Mei-Chien. "Enabling Packaging Architectures and Interconnect Technologies for Image Sensors." In ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/ipack2020-2526.

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Abstract Image sensors have become a crucial technology platform for many applications in the past decades. Market demands continue to grow at a fast pace accelerated by innovations, performance improvement, and new applications. Efficient package architectures and advanced interconnect technologies are among the enablers for the commercialization of image sensors. This study examines how image sensor pixel electronics design and form factor drives innovations in chip stacking and high-density interconnects. 3D chip stacking architectures for CMOS image sensors are analyzed. Cases of image sen
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