Relevant bibliographies by topics / Wafer-Scale mapping

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  1. Journal articles
  2. Dissertations / Theses
  3. Conference papers

Academic literature on the topic 'Wafer-Scale mapping'

Author: Grafiati
Published: 22 June 2024
Last updated: 31 July 2025

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Journal articles on the topic "Wafer-Scale mapping"

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Tajima, Michio, E. Higashi, Toshihiko Hayashi, Hiroyuki Kinoshita, and Hiromu Shiomi. "Characterization of SiC Wafers by Photoluminescence Mapping." Materials Science Forum 527-529 (October 2006): 711–16. http://dx.doi.org/10.4028/www.scientific.net/msf.527-529.711.

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The effectiveness of room-temperature photoluminescence (PL) mapping was demonstrated for nondestructive detection of structural defects, such as dislocations, micropipes and stacking faults, in SiC wafers. PL spectra of bulk wafers were dominated by deep-level emissions due to Si vacancies, vanadium and undefined centers like UD-1 at room temperature, while those from epitaxial wafers involved near band-edge emission. We developed a whole-wafer PL intensity mapping system with a capability of zooming in on the area of interest with a spatial resolution as high as 1 μm, and showed that the map
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Mackenzie, David M. A., Kristoffer G. Kalhauge, Patrick R. Whelan, et al. "Wafer-scale graphene quality assessment using micro four-point probe mapping." Nanotechnology 31, no. 22 (2020): 225709. http://dx.doi.org/10.1088/1361-6528/ab7677.

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Miner, C. J. "Wafer-scale temperature mapping for molecular beam epitaxy and chemical beam epitaxy." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 11, no. 3 (1993): 998. http://dx.doi.org/10.1116/1.586910.

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Buron, Jonas D., David M. A. Mackenzie, Dirch H. Petersen, et al. "Terahertz wafer-scale mobility mapping of graphene on insulating substrates without a gate." Optics Express 23, no. 24 (2015): 30721. http://dx.doi.org/10.1364/oe.23.030721.

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Crovetto, Andrea, Patrick Rebsdorf Whelan, Ruizhi Wang, Miriam Galbiati, Stephan Hofmann, and Luca Camilli. "Nondestructive Thickness Mapping of Wafer-Scale Hexagonal Boron Nitride Down to a Monolayer." ACS Applied Materials & Interfaces 10, no. 30 (2018): 25804–10. http://dx.doi.org/10.1021/acsami.8b08609.

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Meshot, Eric R., Sei Jin Park, Steven F. Buchsbaum, et al. "High-yield growth kinetics and spatial mapping of single-walled carbon nanotube forests at wafer scale." Carbon 159 (April 2020): 236–46. http://dx.doi.org/10.1016/j.carbon.2019.12.023.

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Tian, Mengchuan, Ben Hu, Haifang Yang, et al. "Wafer Scale Mapping and Statistical Analysis of Radio Frequency Characteristics in Highly Uniform CVD Graphene Transistors." Advanced Electronic Materials 5, no. 4 (2019): 1800711. http://dx.doi.org/10.1002/aelm.201800711.

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Yao, Yong Zhao, Yukari Ishikawa, Koji Sato, et al. "Large-Area Mapping of Dislocations in 4H-SiC from Carbon-Face (000-1) by Using Vaporized KOH Etching near 1000 °C." Materials Science Forum 740-742 (January 2013): 829–32. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.829.

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To solve the problem that no preferential chemical etching is available for dislocation revelation from the carbon-face (C-face) of 4H-SiC, a novel etching technique using vaporized KOH has been developed. It was found that this etching technique can reveal the three commonly found dislocation types, i.e., threading screw dislocations (TSDs), threading edge dislocations (TEDs) and basal plane dislocations (BPDs) as large hexagonal, small hexagonal and triangular, respectively. Centimeter-scale dislocation mapping has been obtained, and the pit positions on the C-face were compared with those o
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Shih, Po-Chou, Chun-Chin Hsu, and Fang-Chih Tien. "Automatic Reclaimed Wafer Classification Using Deep Learning Neural Networks." Symmetry 12, no. 5 (2020): 705. http://dx.doi.org/10.3390/sym12050705.

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Silicon wafer is the most crucial material in the semiconductor manufacturing industry. Owing to limited resources, the reclamation of monitor and dummy wafers for reuse can dramatically lower the cost, and become a competitive edge in this industry. However, defects such as void, scratches, particles, and contamination are found on the surfaces of the reclaimed wafers. Most of the reclaimed wafers with the asymmetric distribution of the defects, known as the “good (G)” reclaimed wafers, can be re-polished if their defects are not irreversible and if their thicknesses are sufficient for re-pol
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Lang, Simon, Alexandra Schewski, Ignaz Eisele, Christoph Kutter, and Wilfried Lerch. "(Best Paper Award) Aluminum Josephson Junction Formation on 200mm Wafers Using Different Oxidation Techniques." ECS Meeting Abstracts MA2023-01, no. 29 (2023): 1791. http://dx.doi.org/10.1149/ma2023-01291791mtgabs.

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For superconducting quantum circuits with a large number of Qubits, reproducible components are crucial for reducing entanglement decoherence. Particularly for reliable industrial manufacturing on full-scale 200 mm' wafers, a very high uniformity level is required to ensure sufficient coherence times. In the present work the special focus was put on manufacturing Al/AlOx/Al Josephson junctions (JJ), which are the most important component of many quantum circuit. Fully Al-based CMOS-compatible JJ’s were produced using a double dry etch process. After patterning the first Al metallization severa
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Dissertations / Theses on the topic "Wafer-Scale mapping"

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Jrondi, Aiman. "Optimisation de couches minces de nitrures de métaux de transition pour application micro-supercondensateurs." Electronic Thesis or Diss., Université de Lille (2022-....), 2023. https://pepite-depot.univ-lille.fr/ToutIDP/EDSMRE/2023/2023ULILR074.pdf.

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Répondant à la demande croissante de l'Internet des objets pour des solutions énergétiques compactes, notre recherche a optimisé les micro-supercondensateurs en nitrure de vanadium (VN) et de molybdène (Mo2Ny), élaborés par pulvérisation cathodique magnétron en atmosphère réactive, en mettant l'accent sur le rôle crucial de la concentration d'azote dans le plasma. Pour VN, nous obtenons grâce à l'optimisation des paramètres de dépôt, une capacité surfacique exceptionnelle d'environ 1,4 F.cm⁻² (pour un film de 32 µm d'épaisseur), et une stabilité de cyclage sans précédent, résistant à une dégra
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Conference papers on the topic "Wafer-Scale mapping"

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Lin, Yishuang, Rongjian Liang, Yaguang Li, Hailiang Hu, and Jiang Hu. "Mapping Large Scale Finite Element Computing on to Wafer-Scale Engines." In 2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC). IEEE, 2022. http://dx.doi.org/10.1109/asp-dac52403.2022.9712538.

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Rahman, Anis. "T-ray Profile Mapping for Wafer-scale Die Sorting and Yield Improvement." In 3D Image Acquisition and Display: Technology, Perception and Applications. Optica Publishing Group, 2023. http://dx.doi.org/10.1364/3d.2023.dm4a.3.

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Wu, Zon-Ru, Tzu-Chieh Kao, Chia-Wei Kao, Ping-Chien Chang, Wei Lin, and Yung-Jr Hung. "Wafer-scale grating mapping system for rapid pitch and diffraction efficiency measurement." In 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC). IEEE, 2019. http://dx.doi.org/10.23919/ps.2019.8817627.

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"A Software Framework for Mapping Neural Networks to a Wafer-scale Neuromorphic Hardware System." In 6th International Workshop on Artificial Neural Networks and Intelligent Information Processing. SciTePress - Science and and Technology Publications, 2010. http://dx.doi.org/10.5220/0003024200430052.

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James, Michael, Marvin Tom, Patrick Groeneveld, and Vladimir Kibardin. "ISPD 2020 Physical Mapping of Neural Networks on a Wafer-Scale Deep Learning Accelerator." In ISPD '20: International Symposium on Physical Design. ACM, 2020. http://dx.doi.org/10.1145/3372780.3380846.

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Warn, Colin, Andriy Sherehiy, Moath Alqatamin, et al. "Machine Vision Tracking and Automation of a Microrobot (sAFAM)." In ASME 2022 17th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/msec2022-85424.

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Abstract In this paper, we propose a method for tracking a microrobot’s three-dimensional position using microscope machine vision. The microrobot, theSolid Articulated Four Axis Microrobot (sAFAM), is being developed to enable the assembly and manipulation of micro and nanoscale objects. In the future, arrays of sAFAMS working together can be integrated into a wafer-scale nanofactory, Prior to use, microrobots in this microfactory need calibration, which can be achieved using the proposed measurement technique. Our approach enables faster and more accurate mapping of microrobot translations a
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