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Journal articles on the topic 'Wire-plane'

Author: Grafiati

Published: 3 June 2025

Last updated: 31 July 2025

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1

Matsui, Ryosuke, Hisaaki Tobushi, and Yoshiyasu Makino. "Influence of Strain Ratio on Bending Fatigue Life in TiNi Shape Memory Thin Wire." Key Engineering Materials 340-341 (June 2007): 1193–98. http://dx.doi.org/10.4028/www.scientific.net/kem.340-341.1193.

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In this study, we performed the bending fatigue test and investigated the influence of strain ratio on fatigue life in TiNi shape memory thin wire. The pulsating plane bending, alternating plane bending and rotating bending fatigue tests were carried. Additionally, we carried out the observation of the fatigue fracture surface by a scanning electron microscope. The behavior of fatigue crack was investigated. The results obtained are summarized as follows. (1) The martensitic transformation (MT) stress of the superelastic thin wire (SE-NT) is higher than that of the SMA thin wire (SME-NT) and t

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2

Carreno, F., and E. Bernabeu. "On wire-to-plane positive corona discharge." Journal of Physics D: Applied Physics 27, no. 10 (1994): 2136–44. http://dx.doi.org/10.1088/0022-3727/27/10/022.

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3

Vacek, Daniel J., and Ira M. Cohen. "Model of wire‐to‐plane electric arc." Journal of Applied Physics 65, no. 3 (1989): 1005–8. http://dx.doi.org/10.1063/1.343085.

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4

Wang, Ke-yi, Li-xun Zhang, and Hao Meng. "Driving properties of plane wire-driven robot." Journal of Central South University 20, no. 1 (2013): 56–61. http://dx.doi.org/10.1007/s11771-013-1459-1.

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5

Xue, Jia, Yu Li, Xiang Li, et al. "Real-time icing load monitoring method on overhead transmission lines based on weighing theory." Journal of Physics: Conference Series 2935, no. 1 (2025): 012028. https://doi.org/10.1088/1742-6596/2935/1/012028.

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Abstract When icing load on overhead transmission lines is calculated, the wire stress is usually calculated based on the length of the wire. In practical engineering applications, the wire length data is usually unknown or missing in the production management system, so wire stress is impossible to calculate based on wire length. In this situation, it is urgent to study the method of wire length calculation, and the authors proposed a method to solve the problem. First, by analyzing the change rate of wire length, wire length is calculated based on the change of wire length between adjacent t

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6

Yang, Zixing, Hui Huang, Xinjiang Liao, Zhiyuan Lai, Zhiteng Xu, and Yanjun Zhao. "Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire." Materials 17, no. 9 (2024): 2134. http://dx.doi.org/10.3390/ma17092134.

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Electroplated diamond wire sawing is widely used as a processing method to cut hard and brittle difficult-to-machine materials. Currently, obtaining the sawing capability of diamond wire saw through the wire bow is still difficult. In this paper, a method for calculating the sawing capability of diamond wire saw in real-time based on the wire bow is proposed. The influence of the renewed length per round trip, crystal orientation of sapphire, wire speed, and feed rate on the wire sawing capability has been revealed via slicing experiments. The results indicate that renewing the diamond wire sa

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7

Ruth, P. Okeke. "Compact Single Band Modified CPW-Fed UWB Antenna For Applications of WLAN And WiMAX." Journal of Optical Communication Electronics 6, no. 1 (2020): 15–18. https://doi.org/10.5281/zenodo.3779860.

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<strong>Right now U-Shaped Coplanar waveguide took care of receiving wire with the changed ground plane structure for WIMAX and WLAN applications are introduced. The radio wire is reverberating at various frequencies 3.5/5.2 GHz which is spread 3.1GHz to 5.9 GHz Ultra Wide Band run. Radio wire has a straightforward planer structure of 23x16x1.6 mm3 utilizing FR4 epoxy substrate dielectric steady 4.4 and misfortune digression of 0.002 with a space on the ground plane [1]. The proposed reception apparatus accomplished return misfortune - 10 dB and it stretched around - 37 dB which covers the tra

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8

Platov, Sergei I., V. A. Nekit, and Nikolay N. Ogarkov. "Comparative Evaluation of Analytical Methods for the Determination of Coefficients of Friction and Stresses when Wire Rod Drawing." Solid State Phenomena 284 (October 2018): 247–52. http://dx.doi.org/10.4028/www.scientific.net/ssp.284.247.

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The article discusses the process of wire drawing of circular cross-section. The study of stresses of wire drawing in conditions of plane plastic flow was held. As theoretical framework the study was adopted the method of characteristics, a special case, having the definitive decision. Stresses during wire drawing are defined by decomposing the decision into two components of plane strain and the superposition of these decisions. The results of theoretical solution of the problem of wire drawing were used to determine the coefficients of friction on the surface of contact of the tool and the w

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9

Jog, M. A., I. M. Cohen, and P. S. Ayyaswamy. "Electrode heating in a wire‐to‐plane arc." Physics of Fluids B: Plasma Physics 4, no. 2 (1992): 465–72. http://dx.doi.org/10.1063/1.860297.

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10

Wintle, H. I. "Unipolar wire-to-plane corona-a definitive computation." IEEE Transactions on Electrical Insulation 27, no. 2 (1992): 298–308. http://dx.doi.org/10.1109/14.135601.

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11

Hsiao, Fei-Bin, and Jiann-Min Huang. "On the Dynamics of Flow Structure Development in an Excited Plane Jet." Journal of Fluids Engineering 116, no. 4 (1994): 714–20. http://dx.doi.org/10.1115/1.2911840.

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Coherent structure dynamics in the developing region of a plane jet under acoustic excitation is studied experimentally by means of hot-wire measurements and smoke-wire flow visualization. The mean and fluctuation velocity properties, such as mean and fluctuation intensities in both streamwise and transverse directions, turbulent shear stress variations, and the turbulent energy production and energy convection phenomena, are carefully investigated. The results indicate that flow property behavior is closely related to vortex formation and the merging processes, which are the dominant mechanis

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12

Mowete, Ike, Ayotunde Ayorinde, and Adeniyi Adehola. "The Logarithmically-non-uniform Helix Antenna Mounted Above a Finite Ground Plane." ELEKTRIKA- Journal of Electrical Engineering 21, no. 1 (2022): 25–34. http://dx.doi.org/10.11113/elektrika.v21n1.341.

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In this paper the influence of ground plane size on the performance characteristics of a thin-wire helical antenna characterized by a logarithmically varying turns spacing, and mounted above a circular ground plane of finite extent, is systematically investigated. The moment-method formulation utilized in the paper involves a wire-grid model for the ground plane as well as explicit expressions, deriving from a vector potential approach, for the radiation fields of this ‘loghelix’. Subsequent computational results obtained for a candidate 8-turn ‘loghelix’ axial-mode ˀantenna using various comb

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13

Mowete, Ike, Ayotunde Ayorinde, and Adeniyi Adehola. "The Logarithmically-non-uniform Helix Antenna Mounted Above a Finite Ground Plane." ELEKTRIKA- Journal of Electrical Engineering 21, no. 1 (2022): 25–34. http://dx.doi.org/10.11113/elektrika.v21n1.341.

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In this paper the influence of ground plane size on the performance characteristics of a thin-wire helical antenna characterized by a logarithmically varying turns spacing, and mounted above a circular ground plane of finite extent, is systematically investigated. The moment-method formulation utilized in the paper involves a wire-grid model for the ground plane as well as explicit expressions, deriving from a vector potential approach, for the radiation fields of this ‘loghelix’. Subsequent computational results obtained for a candidate 8-turn ‘loghelix’ axial-mode ˀantenna using various comb

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14

Mowete, Ike, Ayotunde Ayorinde, and Adeniyi Adehola. "The Logarithmically-non-uniform Helix Antenna Mounted Above a Finite Ground Plane." ELEKTRIKA- Journal of Electrical Engineering 21, no. 1 (2022): 25–34. http://dx.doi.org/10.11113/elektrika.v21n1.341.

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In this paper the influence of ground plane size on the performance characteristics of a thin-wire helical antenna characterized by a logarithmically varying turns spacing, and mounted above a circular ground plane of finite extent, is systematically investigated. The moment-method formulation utilized in the paper involves a wire-grid model for the ground plane as well as explicit expressions, deriving from a vector potential approach, for the radiation fields of this ‘loghelix’. Subsequent computational results obtained for a candidate 8-turn ‘loghelix’ axial-mode ˀantenna using various comb

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15

Berthonnaud, E., R. Hilmi, and J. Dimnet. "Geometric Structure of 3D Spinal Curves: Plane Regions and Connecting Zones." ISRN Orthopedics 2012 (March 12, 2012): 1–10. http://dx.doi.org/10.5402/2012/840426.

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This paper presents a new study of the geometric structure of 3D spinal curves. The spine is considered as an heterogeneous beam, compound of vertebrae and intervertebral discs. The spine is modeled as a deformable wire along which vertebrae are beads rotating about the wire. 3D spinal curves are compound of plane regions connected together by zones of transition. The 3D spinal curve is uniquely flexed along the plane regions. The angular offsets between adjacent regions are concentrated at level of the middle zones of transition, so illustrating the heterogeneity of the spinal geometric struc

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16

Doley, Dhrubajyoti, V. Satheeshkumar, and R. Ganesh Narayanan. "Influence of Wire Reinforcement on the Forming Behaviour of Adhesive Bonded Steel Sheets." Advanced Materials Research 939 (May 2014): 336–41. http://dx.doi.org/10.4028/www.scientific.net/amr.939.336.

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A method for modifying the properties of adhesives is by the addition of metallic wire strand in fibre form to improve the thermal conductivity for use in electrical applications. Clearly any advantage gained as far as thermal conductivity is concerned should not be counteracted by deficiencies in mechanical properties. In this work, the influence of copper wire reinforcements on the tensile behaviour of adhesive bonded steel sheets will be presented. The adhesive used is a two-part epoxy resin with a mix ratio of 1:1 parts by weight of resin to hardener. Wire strands used are copper wires hav

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17

Buyanov, A. V., and Yu K. Stishkov. "Kinematic structure of electrohydrodynamic flow in “wire-wire” and “wire over plane” electrode systems placed in a liquid." Technical Physics 48, no. 8 (2003): 972–77. http://dx.doi.org/10.1134/1.1607492.

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18

Šesnić, Silvestar, Sébastien Lalléchère, Dragan Poljak, Pierre Bonnet, and Khalil El Khamlichi Drissi. "A Stochastic Analysis of the Transient Current Induced along the Thin Wire Scatterer Buried in a Lossy Medium." International Journal of Antennas and Propagation 2016 (2016): 1–12. http://dx.doi.org/10.1155/2016/5095242.

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The paper deals with the stochastic collocation analysis of a time domain response of a straight thin wire scatterer buried in a lossy half-space. The wire is excited either by a plane wave transmitted through the air-ground interface or by an equivalent current source representing direct lightning strike pulse. Transient current induced at the center of the wire, governed by corresponding Pocklington integrodifferential equation, is determined analytically. This antenna configuration suffers from uncertainties in various parameters, such as ground properties, wire dimensions, and position. Th

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19

Zhang, Wu, Jingliang Wu, Yishan Liu, Shishan Sun, and Yanping Jia. "Research on the Elastic Properties of Discontinuous Contact Wire Rope for WR-CVT." Advances in Materials Science and Engineering 2021 (May 29, 2021): 1–11. http://dx.doi.org/10.1155/2021/6624615.

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This study mainly conducts the research on the discontinuous contact elastic properties of wire rope based on WR-CVT. The geometry model and finite element model of continuous contact and discontinuous contact of 2/3 lay pitch wire rope are established. And the contact stress distribution of the steel wire is analyzed through 5 sections and 5 contact points. The results show that on the C-C plane, the contact stress of the discontinuous contact model is 229.4 MPa higher than that of the continuous contact, but this difference is not obvious on the D-D plane. The contact stress nephogram is ell

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20

Suhir, E., and L. T. Manzione. "Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Molding." Journal of Electronic Packaging 113, no. 1 (1991): 16–20. http://dx.doi.org/10.1115/1.2905359.

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An analytical stress model is developed for the evaluation of flow induced stresses in wire bonds of plastic packages during molding. We limit our analysis to the stresses acting in the plane of a wire bond. These stresses can possibly result in liftoff of the ball bond from the bonding pad of the integrated circuit. The main purpose of the analysis is to evaluate the effect of the wire bond configuration. It is shown that the stresses in wire bonds are proportional to the square of the ratio of the wire-bond span to the diameter of the wire. This explains the difficulty in molding assemblies

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21

Jog, M. A., I. M. Cohen, and P. S. Ayyaswamy. "Heat Transfer in Wire Bonding Process." Journal of Electronic Packaging 116, no. 1 (1994): 44–48. http://dx.doi.org/10.1115/1.2905492.

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We have analyzed an electric discharge between wire and planar electrodes with wire diameter and current densities that are typically used in upscaled experimental simulations of the wire bonding process employed in microelectronic manufacturing. A set of continuum conservation equations has been solved to obtain the variation of electric potential, temperature distributions, and the electrode heat fluxes. Results indicate that the main body of the discharge is quasineutral bounded by space charge sheaths at both electrodes. Strong electric fields are concentrated in the electrode sheaths. The

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22

Thuy, Vu Tran Thanh, Nguyen Thanh Tung, JinWoo Park, YoungPak Lee, Vu Dinh Lam, and Joo Yull Rhee. "In-plane Interactions in Supercells of Cut-wire Pairs." Journal of the Korean Physical Society 58, no. 1 (2011): 87–93. http://dx.doi.org/10.3938/jkps.58.87.

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23

GRASSI, Flavia, Giordano SPADACINI, Keliang YUAN, and Sergio A. PIGNARI. "Relating Crosstalk to Plane-Wave Field-to-Wire Coupling." IEICE Transactions on Communications E99.B, no. 11 (2016): 2406–13. http://dx.doi.org/10.1587/transcom.2016ebp3027.

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24

Jog, M. A., I. M. Cohen, and P. S. Ayyaswamy. "Breakdown of a wire‐to‐plane discharge: Transient effects." Physics of Fluids B: Plasma Physics 3, no. 12 (1991): 3532–36. http://dx.doi.org/10.1063/1.859732.

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25

Rich, A. J., J. L. Sproston, and G. Walker. "Electro-Convection in Cells with Plane and Wire Electrodes." IEEE Transactions on Electrical Insulation EI-20, no. 2 (1985): 401–4. http://dx.doi.org/10.1109/tei.1985.348861.

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26

Dautova, Yulia N., Andrey V. Shytov, Ian R. Hooper, J. Roy Sambles, and Alastair P. Hibbins. "Mimicking graphene physics with a plane hexagonal wire mesh." Applied Physics Letters 112, no. 19 (2018): 191601. http://dx.doi.org/10.1063/1.5026355.

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27

Wintle, H. J. "Unipolar wire-to-plane corona: accuracy of simple approximations." Journal of Electrostatics 28, no. 2 (1992): 149–59. http://dx.doi.org/10.1016/0304-3886(92)90067-4.

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28

Hamdalla, Mohamed, Anthony Caruso, and Ahmed Hassan. "Predicting Electromagnetic Interference to a Terminated Wire Using Characteristic Mode Analysis." Applied Computational Electromagnetics Society 35, no. 11 (2021): 1318–19. http://dx.doi.org/10.47037/2020.aces.j.351128.

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Electromagnetic coupling to realistic wire configurations exhibit large variations with respect to the frequency, incident angle, and polarization of the interfering signal. In this work, Characteristic Mode Analysis (CMA) is used to calculate the fundamental modes of a terminated wire above an infinite ground plane. Using the properties of the modes, the coupled currents to the wire’s loads are predicted for different incident excitations. Using this simple but practical wire configuration, we show the versatility of CMA in practical electromagnetic interference and coupling applications.

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29

Ding, Yong, Jang Kyo Kim, and Rong Yue Zheng. "Molecular Dynamic Simulation on Mechanism of Ultrasonic Wire Bonding in Electronic Package." Advanced Materials Research 97-101 (March 2010): 2639–43. http://dx.doi.org/10.4028/www.scientific.net/amr.97-101.2639.

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The microscopic mechanism of ultrasonic wire bonding is investigated by molecular dynamics simulation on the interfacial contact and adhesion. Considering that the real bonding area is in the state of plane strain, a two-dimensional atomic model is presented. Sutton-Chen potential is adopted for the interaction between gold atoms. Computational results indicate that a strong adhesion generates at the interface after intimate contact between the wire and the bond pad, and the adhesive force should be the mechanism of ultrasonic wire bonding. Combining the real contact area from finite element a

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30

Han, Sejin, and K. K. Wang. "A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments." Journal of Electronic Packaging 117, no. 3 (1995): 178–84. http://dx.doi.org/10.1115/1.2792089.

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An effort has been made in this study to develop a model which can predict wire sweep during semiconductor chip encapsulation with transfer molding. The calculation of wire sweep during encapsulation depends on many factors. In this study, a step-by-step approach has been used considering one factor at a time. As the first step, the wire deformation has been measured and calculated under a known dead-weight loading. The next step has been to measure and calculate the deformation of a single straight wire attached to the mid-plane of a rectangular cavity due to the flow of a clear and homogeneo

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31

Zouzou, Noureddine, Boni Dramane, Eric Moreau, and Gérard Touchard. "EHD Flow and Collection Efficiency of a DBD ESP in Wire-to-Plane and Plane-to-Plane Configurations." IEEE Transactions on Industry Applications 47, no. 1 (2011): 336–43. http://dx.doi.org/10.1109/tia.2010.2091473.

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32

Bahrami, Mohammad Reza. "Mechanics of diagnostic machine on electrical transmission lines conductors." MATEC Web of Conferences 224 (2018): 02021. http://dx.doi.org/10.1051/matecconf/201822402021.

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The article deals with the dynamics of wire transmission line while the robot-inspector is moving on it. To ensure proper and safe operation of the machine, mathematical modeling based on the Lagrangian mechanics has been conducted. The wire is considered as a stretched string with additional bending stiffness, and the robot-inspector as moving mass and pendulum. As the result, saw-tooth oscillations have been observed in the vertical plane and they cause parametric oscillations in the perpendicular plane. Advanced method of mathematical modeling of inspection robot motion on conductors allows

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33

Ramaprian, B. R., and M. S. Chandrasekhara. "LDA Measurements in Plane Turbulent Jets." Journal of Fluids Engineering 107, no. 2 (1985): 264–71. http://dx.doi.org/10.1115/1.3242472.

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Measurements on the mean and most of the significant turbulent properties of plane isothermal and heated (but essentially “nonbouyant”) jets are reported. The velocity measurements were made using two-component, frequency-shifted Laser Doppler Anemometry (LDA) and the temperature measurements were made using fast-response resistance thermometry. A simple but effective technique was developed for obtaining accurate velocity measurements from the LDA in a nonisothermal environment. These measurements, some of which are the first of their kind, provide an independent data base with which to compa

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34

Pan, Steven. "An Application of New 3D MCP Packaging Process for Al Wire Power Devices." Applied Science and Innovative Research 8, no. 4 (2024): p189. http://dx.doi.org/10.22158/asir.v8n4p189.

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Traditional power devices packaging have been low package ratio, and difficult highly about the characteristic of the integrated, can't to adapt to the high integration and high density development trend in the semiconductor packaging industry; In this paper, a new design of Al wire cleaver face, can form a plane on the surface of Al wire or ribbon, realize the second die bond or wire bond on the surface of point. Through the process to achieve the idea that it can be applied to power devices of MCP packaging technology.

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35

Ali, Shirook M., Huanhuan Gu, Kelce Wilson, and James Warden. "Improved Handset Antenna Performance via an Electrically Extended Ground Plane." ISRN Communications and Networking 2012 (March 25, 2012): 1–7. http://dx.doi.org/10.5402/2012/621526.

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A novel and practical approach is presented providing improved antenna performance without enlarging the antenna or the ground plane. The approach electrically extends the ground plane using wire(s) that behave as surface metal extensions of the ground plane. The wire extensions can be accommodated within typical handset housing or as part of the stylish metal used on the handset’s exterior perimeter; hence don’t require enlargement of the device. Consequently, this approach avoids the costs and limitations traditionally associated with physically lengthening of a ground plane. Eight variation

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36

Kraftmakher, G., and V. Butylkin. ""Cut wires grating – single longitudinal wire" planar metastructure to achieve microwave magnetic resonance in a single wire." Advanced Electromagnetics 1, no. 2 (2012): 16. http://dx.doi.org/10.7716/aem.v1i2.14.

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Here we present metastructures containing cut-wire grating and a single longitudinal cut-wire orthogonal to grating’s wires. Experimental investigations at microwaves show these structures can provide strong magnetic resonant response of a single nonmagnetic cut-wire in dependence on configuration and sizes in the case when metastructures are oriented along the direction of wave propagation and cut-wires of grating are parallel to the electric field of a plane electromagnetic wave. It is suggested a concept of magnetic response based on antiparallel resonant currents excited by magnetic field

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37

Zhu, Meng, Dave Yee Han Lee, and Andy Williams. "Safe Femoral Fixation Depth and Orientation for Lateral Extra-Articular Tenodesis in Anterior Cruciate Ligament Reconstruction." Orthopaedic Journal of Sports Medicine 9, no. 1 (2021): 232596712097659. http://dx.doi.org/10.1177/2325967120976591.

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Background: Patients who undergo anterior cruciate ligament (ACL) reconstruction (ACLR) can have a persistent postoperative pivot shift. Performing lateral extra-articular tenodesis (LET) concurrently has been proposed to address this; however, LET femoral fixation may interfere with the ACLR femoral tunnel, which could damage the ACL graft or its fixation. Purpose: To evaluate the safe maximum implant or tunnel depth for a modified Lemaire LET when combined with ACLR anteromedial portal femoral tunnel drilling and to validate the safe LET drilling angles to avoid conflict with the ACLR femora

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38

Franklin She, Tsang Tsang, and Raymond Lop Keung Chow. "Aggravation of Gummy Smile by Straight-Wire Mechanics and its Management with or without Orthognathic Surgery Up to 10-Year Follow-Up." APOS Trends in Orthodontics 8 (June 1, 2018): 96–109. http://dx.doi.org/10.4103/apos.apos_24_18.

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Two female patients presented with gummy smile, maxillary dentoalveolar protrusion and total vertical maxillary excess, retroclined incisors, and increased overbite received orthodontic camouflage with straight-wire mechanics by general dentists. The treatments caused severe bowing of upper occlusal plane which aggravated the gummy smile and had led them to seek specialist care. They were successfully managed by orthodontic camouflage and combined surgical-orthodontic treatment, respectively, in conjunction with the application of miniscrews on straight-wire mechanics. Aggravation of gummy smi

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39

Shreyas, S. Nayak, Prabhu Panchami, K. S. Ashwini, and Amit Swetha. "Miniaturised Rectangular Patch Antenna Using Defected Ground Plane." Journal of Signal Processing 5, no. 3 (2019): 30–34. https://doi.org/10.5281/zenodo.3547143.

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<em>This paper displays an exceptionally scaled down fix radio wire with defected ground structure (DGS). Etching a slot on the ground plane is called defected ground structure. This helps in enhancing the gain of the antenna and suppressing higher order harmonics. A U slot is made on the ground plane to obtain this DGS. Shorting pin techniques are used for the perfect impedance matching. The resonant frequency of the proposed patch antenna is 5 GHz with a return loss of -18 dB. The gain increased from 1.3 by a regular ground plane to 3.351 when used a defected ground plane.</em>

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40

Thompson, Luke M., Michael R. Maughan, Karl K. Rink, Donald M. Blackketter, and Robert R. Stephens. "Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals." Journal of Electronic Packaging 129, no. 3 (2006): 300–306. http://dx.doi.org/10.1115/1.2753920.

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Cracks have been observed in the insulating glass of bridge-wire initiators that may allow moisture to penetrate the assembly, potentially leading to the corrosion and degradation of the bridge wire and the pyrotechnic material. Degradation of the pyrotechnic or the bridge wire may result in initiator failure or diminished performance. The goal of this research is to determine if the manufacturing processes could produce thermal stresses great enough to crack the glass. A parametric plane stress closed-form solution was used to determine the effects of changing material properties and dimensio

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41

Xue, Yuhua, Yong Ding, Jianbing Niu, et al. "Rationally designed graphene-nanotube 3D architectures with a seamless nodal junction for efficient energy conversion and storage." Science Advances 1, no. 8 (2015): e1400198. http://dx.doi.org/10.1126/sciadv.1400198.

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One-dimensional (1D) carbon nanotubes (CNTs) and 2D single-atomic layer graphene have superior thermal, electrical, and mechanical properties. However, these nanomaterials exhibit poor out-of-plane properties due to the weak van der Waals interaction in the transverse direction between graphitic layers. Recent theoretical studies indicate that rationally designed 3D architectures could have desirable out-of-plane properties while maintaining in-plane properties by growing CNTs and graphene into 3D architectures with a seamless nodal junction. However, the experimental realization of seamlessly

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42

L.Mangrulkar, Amol. "Investigation of WEDM parameters on Material Removal Rate and Plane Roughness of AISI4130 steel." EDXJL International Journal on Innovations and Advanced Research 01, no. 02 (2023): 37–42. http://dx.doi.org/10.59599/edxjl-ijiar.2022.1205.

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Wire electrical discharge machine is a unconventional machining process. In WEDM Process more or less conductive materials only able to machined it. In WEDM material is removal from the work piece by continuous release of spark linking the work piece and the wire electrode. AISI 4130 low alloy steel is in recent times developed advanced materials having excellent material properties which will be used for aerospace and oil gas industry applications. In this paper the Experiments are conducted by using Tanguchi’s L18 orthogonal array and five input parameter voltage, current, pulse off time, pu

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43

HUNG, L. K., W. S. SO, and P. C. LEUNG. "Combined Intramedullary Kirschner Wire and Intra-Osseous Wire Loop for Fixation of Finger Fractures." Journal of Hand Surgery 14, no. 2 (1989): 171–76. http://dx.doi.org/10.1016/0266-7681_89_90121-6.

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An intramedullary Kirschner wire was combined with an intra-osseous wire loop for fixing finger fractures. The mechanical stability of this technique to resist a bending moment in the sagittal plane was compared with four other conventional methods: single loop, loop and an oblique Kirschner wire, crossed Kirschner wires and dorsal plating. It was found that when the applied force was small, the technique was much more stable than the crossed Kirschner wires and was similar to the others. The ability to withstand mechanical failure was much better than most of the methods except the dorsal pla

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Xie, Sheng, Wanli Han, Xufan Xu, Guojun Jiang, and Baoqing Shentu. "Lateral Diffusion of a Free Air Jet in Slot-Die Melt Blowing for Microfiber Whipping." Polymers 11, no. 5 (2019): 788. http://dx.doi.org/10.3390/polym11050788.

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In melt blowing, microfibrous nonwoven material is manufactured by using high-speed air to attenuate polymer melt. The melt-blown air jet determines the process of polymer attenuation and fiber formation. In this work, the importance of lateral velocity on the fiber was first theoretical verified. The lateral diffused characteristic of the air flow field in slot-die melt blowing was researched by measuring the velocity direction using a dual-wire probe hot-wire anemometer. Meanwhile, the fiber path was captured by high-speed photography. Results showed that there existed a critical boundary of

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Thuy, Vu Tran Thanh, Nguyen Thanh Tung, JinWoo Park, YoungPak Lee, Vu Dinh Lam, and Joo Yull Rhee. "Erratum: In-plane Interactions in Supercells of Cut-wire Pairs." Journal of the Korean Physical Society 58, no. 6 (2011): 1715. http://dx.doi.org/10.3938/jkps.58.1715.

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Zaid, L., and R. Staraj. "Miniature circular GSM wire-patch antenna on small ground plane." Electronics Letters 38, no. 4 (2002): 153. http://dx.doi.org/10.1049/el:20020141.

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Koh, B. P., C. J. Railton, and I. J. Craddock. "Wire above ground plane transmission line formulation in FDTD algorithm." IEE Proceedings - Microwaves, Antennas and Propagation 151, no. 3 (2004): 249. http://dx.doi.org/10.1049/ip-map:20040266.

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Herraiz-Martínez, Francisco Javier, P. S. Hall, Qing Liu, and D. Segovia-Vargas. "Left-Handed Wire Antennas Over Ground Plane With Wideband Tuning." IEEE Transactions on Antennas and Propagation 59, no. 5 (2011): 1460–71. http://dx.doi.org/10.1109/tap.2011.2128851.

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Takagaki, Y., and K. Ploog. "Quantum transmission in an out-of-plane crossed-wire junction." Physical Review B 48, no. 15 (1993): 11508–11. http://dx.doi.org/10.1103/physrevb.48.11508.

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Takagaki, Y., and K. Ploog. "Ballistic electron transmission in out-of-plane crossed wire junctions." Journal of Physics: Condensed Matter 6, no. 9 (1994): 1731–38. http://dx.doi.org/10.1088/0953-8984/6/9/014.

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