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Journal articles on the topic 'WP11'

Author: Grafiati

Published: 2 June 2025

Last updated: 31 July 2025

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1

Baardseth, Pernille. "Food for life: innovation network including the stakeholders in the value chain input to WP11 nutrigenomics and society and WP12 commercialisation." Genes & Nutrition 2, no. 1 (2007): 91–92. http://dx.doi.org/10.1007/s12263-007-0023-8.

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Kaplar, R. J., D. R. Hughart, S. Atcitty, J. D. Flicker, S. DasGupta, and M. J. Marinella. "Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs at High Temperatures." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, HITEN (2013): 000275–80. http://dx.doi.org/10.4071/hiten-wp11.

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Commercially available, 1200 V SiC power MOSFETs have been characterized under bias-temperature stress conditions. Two generations of devices from a single manufacturer were tested. For the first-generation MOSFETs, both plastic- and metal-packaged devices were evaluated, whereas for the second-generation MOSFETs, only plastic-packaged devices were tested. Threshold voltage was observed to decrease with increasing temperature in the absence of gate bias stress, as expected. Drain leakage current increased with increasing temperature above the rated temperature of 125°C for first-generation pla

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Kwon, Woon-Seong, Suresh Ramalingam, Xin Wu, et al. "Cost Effective and High Performance 28nm FPGA with New Disruptive Silicon-Less Interconnect Technology (SLIT)." International Symposium on Microelectronics 2014, no. 1 (2014): 000599–605. http://dx.doi.org/10.4071/isom-wp11.

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This paper introduces the first comprehensive demonstration of new disruptive innovation technology comprising multiple Xilinx patent-pending innovations for highly cost effective and high performance Xilinx FPGA, which is so called stack silicon-less interconnect technology (SLIT) that provides the equivalent high-bandwidth connectivity and routing design-rule as stack silicon interconnect (SSI) technology at a cost-effective manner. We have successfully demonstrated the overall process integration and functions of our new SLIT-employed package using Virtex® -7 2000T FPGA product. Chip-to-Waf

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4

Sovinsky, John. "3D Modeling of Complex Combinations of Dies, Packages, Lead Frames, Sockets and Test Boards for Electrical, Thermal and Manufacturing Verification of Advanced Semiconductor Devices." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (2010): 001656–95. http://dx.doi.org/10.4071/2010dpc-wp11.

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The software process described permits putting unlimited layers of dies and substrates in the same CAD database where many advanced optimizations and tunings can be accomplished on the entire electronic system simultaneously. Gates and swappable memory and FPGA pins may be optimally selected to reduce wire length and the number of routing layers. Die placement may also be optimized across multiple subtrates for the same purpose. Interposers between substrates or side routing can be implemented and I/O locations optimized for maximum performance. Native scripts may be used to generate composite

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Hooper, Andy, Daragh Finn, Shane Noel, Gregg Anderson, Jim O'Brien, and Chi-Cheng Lin. "Laser Technology for Through-Silicon Via and Microvia Drilling in Silicon for 3D Packaging Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (2011): 001515–34. http://dx.doi.org/10.4071/2011dpc-wp11.

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Presented here are laser processes for drilling debris-free and recast-free vias in silicon that are suitable for subsequent process integration. The process strategy consists of an integrated laser via drill system combined with an isotropic dry etch system. By careful selection of both the laser and etch process parameters it is possible to control the via depth, diameter, sidewall slope/taper, and to eliminate the damaged Si material in the laser heat affected zone. Because the etch process is highly selective to Si, this is a mask-free and cost-effective process. Two different laser proces

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Mauer, Laura, John Taddei, and Ramey Youssef. "Silicon Wafer Thinning to Reveal Cu TSV." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (2012): 001673–700. http://dx.doi.org/10.4071/2012dpc-wp11.

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3D Integration is becoming a reality in device manufacturing. The TSV Middle process is becoming the dominant integration scenario. For this process flow the silicon wafer needs to be thinned to reveal the Cu TSV. Grinding is used to remove the bulk of the silicon wafer. Currently a multistep sequence of processes that includes CMP and plasma have been used to complete the final thinning of the silicon. This paper will describe a simple, cost effective method to wet etch the remaining silicon to reveal the Cu TSVs. KOH is selected as the etchant since it will not attack the TSV materials and h

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7

Keech, John T., Garret Piech, and Scott Pollard. "Fabrication of 3D-IC Interposers." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 001295–321. http://dx.doi.org/10.4071/2013dpc-wp11.

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Interposer fabrication has gained a lot of attention in the area of three-dimensional integrated circuit (3D-IC) integration. Glass has many properties that make it well suited for interposer substrates, such as adjustable coefficient of thermal expansion, advantaged electrical properties and unique forming processes. Furthermore, glass based solutions can also provide significant cost advantages in substrate material, via formation, and subsequent processing. In this paper, we will cover how fusion formed glass provides cost-effective solutions for the manufacturing of interposer substrates.

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Ahmad, Syed Sajid, Fred Haring, Aaron Reinholz, and Nathan Schneck. "Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Daisy Chain Chip." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (2014): 001422–34. http://dx.doi.org/10.4071/2014dpc-wp11.

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With increasing need for electronic systems miniaturization to provide greater functionality in hand-held devices, through-sapphire via paves a way for the greater densification of silicon-on-sapphire devices and systems. Evaluations of two laser systems for via drilling in blank and device sapphire are outlined. Designed experiments were conducted to optimize the process and to minimize sapphire-via parasites (debris and heat-affected zone). Optical and electron microscope observations and measurements were conducted. Effects of varying via drilling techniques were evaluated for via shape and

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9

Shorey, Aric, Rachel Lu, Scott Pollard, Ekatarina Kuksenkova, and Gene Smith. "Advancements in Through Glass Via (TGV) Technology." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (2015): 001343–63. http://dx.doi.org/10.4071/2015dpc-wp11.

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Glass provides many opportunities for advanced packaging. The material properties give many opportunities. As an insulator, glass provides advantages in providing low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks. Forming processes allow the potential to both form in panel format as well as to form at thicknesses as low as 100 um, giving opportunities to provide cost-effective solutions for the industry. Via fabrication technology

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10

Sugimoto, Yasutaka, Tsuyoshi Katsube, Machiko Motoya, et al. "Novel Glass-free LTCC Material co-fired with Cupper-Electrodes." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (2016): 000130–35. http://dx.doi.org/10.4071/2016cicmt-wp11.

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Abstract Low Temperature Co-fired Ceramics (LTCC) have excellent high-frequency characteristics and have widely been used for microwave electronic components. By lowering the sintering temperature of the ceramics used as insulating layers, LTCC was co-fired with a high-conductivity wiring conductor, such as Cu or Ag. LTCC substrate has been expected as one of the most promising technologies to realize miniaturization of RF circuits in the field of wireless communications. There is no limitation to demand for further downsizing of RF circuits, suppression of electric loss and high mechanical st

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Beyer, Gerald, Kenneth Rebibis, Arnita Podpod, et al. "Packaging and Assembly Challenges for 2.5D/3D Devices." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, DPC (2016): 001161–91. http://dx.doi.org/10.4071/2016dpc-wp11.

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The continuous development of 2.5D/3D packaging and stack assembly technologies has enabled different ways of producing advanced packages for the said devices. Advancement in D2D, D2W and W2W bonding have allowed these devices to be a step closer to being fully manufactured in volume. Thermo-compression bonding (TCB) process in combination with a pre-applied underfill material (WLUF/NUF) have been developed and investigated for assembling 2.5D and 3D devices with fine pitch (10μm - 40 μm) μbumps. This assembly step though developed, is not without challenges. There is a need to select the righ

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Koppert, Ralf. "NiC: a highly sensitive functional layer based on a nickel/graphene thin film for pressure and force sensors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (2015): 000208–12. http://dx.doi.org/10.4071/cicmt-wp11.

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A functional layer based on nickel and graphene called NiC was developed with the goal of a high strain sensitivity in combination with an adjustable temperature coefficient of resistance (TCR). A gauge factor up to 30 and TCR values of approximately 0±25 ppm/K can be achieved by variation of the film composition. Based on the increased sensitivity the important pressure range of below 2.5 bar is opened up for steel membrane pressure sensors without the need of a sophisticated technical effort. First pressure and force sensors with NiC functional layers were realized in order to demonstrate th

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13

Perrin, Rémi, Dominique Bergogne, Christian Martin, and Bruno Allard. "GaN Power Module with High Temperature Gate Driver and Insulated Power Supply." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (2014): 000198–205. http://dx.doi.org/10.4071/hitec-wp11.

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Emerging GaN power switches show advantages for integration in power modules at high temperature and/or high efficiency. These modules are good candidates for embedded power converters in harsh environment such as three phase inverters for Electro-Mechanical Actuators (EMA) in the vicinity of internal combustion engines. The power range is usually within 1 to 5 kW, extending sometimes up to 50 kW, using a high voltage DC bus (HVDC) that is usually comprised between 200 V and 600 V. For aeronautical applications, GaN power switches could challenge SiC transistors for their high switching speed,

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Chawłowska, Ewelina, Michał Nowicki, and Agnieszka Lipiak. "SS25-03 LABOUR PARTICIPATION IN JACARDI: INCREASING THE SKILLS AND KNOWLEDGE OF OCCUPATIONAL PHYSICIANS IN PATIENT EDUCATION." Occupational Medicine 74, Supplement_1 (2024): 0. http://dx.doi.org/10.1093/occmed/kqae023.0174.

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Abstract Introduction The EU’s JACARDI project encompasses 11 Work Packages (WPs) addressing various aspects of health and everyday functioning of people living with non-communicable diseases, in particular with cardiovascular disease (CVD) and diabetes (DM). WP11 aims to support such people’s labour participation by mapping factors which affect it and testing solutions to improve it. As health literacy was found to be among the factors influencing labour participation, a pilot activity was proposed within WP11 to increase: (i) health literacy among working-age patients diagnosed with CVD/DM o

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15

Shorey, Aric, John Keech, and Windsor Thomas. "Glass Wafers as Support Carriers for Wafer Thinning Processes." International Symposium on Microelectronics 2012, no. 1 (2012): 000760–64. http://dx.doi.org/10.4071/isom-2012-wp11.

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Chien, Heng-Chieh, Chun-Hsien Chien, Ming-Ji Dai, Ra-Min Tain, Wei-Chung Lo, and Yung-Jean Rachel Lu. "Thermal Characteristic and Performance of the Glass Interposer with TGVs (Through-Glass Via)." International Symposium on Microelectronics 2013, no. 1 (2013): 000611–17. http://dx.doi.org/10.4071/isom-2013-wp11.

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In this study, we used simulation technique to analyze the thermal characteristics of solo TGV (through-glass via) structure and solo TSV (through-silicon via) structure. The analysis showed, no matter in in-plane direction or in cross-plane direction, the thermal conductivity of a TGV structure is much lower than that of a TSV structure. Also, using simulation, we chose a typical 2.5D IC SiP (system in package) to compare the thermal performances between the SiP with TGV interposer and TSV interposer by using simulation. The specific via structures of 30μm in diameter and 60μm in pitch were a

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17

Zhang, Wenli, Zhengyang Liu, Fred Lee, Shuojie She, Xiucheng Huang, and Qiang Li. "A Gallium Nitride-Based Power Module for Totem-Pole Bridgeless Power Factor Correction Rectifier." International Symposium on Microelectronics 2015, no. 1 (2015): 000324–29. http://dx.doi.org/10.4071/isom-2015-wp11.

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The totem-pole bridgeless power factor correction (PFC) rectifier has recently gained popularity for ac-dc power conversion. The emerging gallium nitride (GaN) high-electron-mobility transistor (HEMT), having a small body diode reverse recovery effect and low switching loss, is a promising device for use in the totem-pole approach. The design, fabrication, and thermal analysis of a GaN-based full-bridge multi-chip module (MCM) for totem-pole bridgeless PFC rectifier are introduced in this work. Four cascode GaN devices using the same pair of high-voltage GaN HEMT and low-voltage silicon (Si) p

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18

Deffenbaugh, Paul I., Danielle M. Stramel, and Kenneth H. Church. "Increasing the Reliability of 3D Printing a Wi-Fi Sensor Device." International Symposium on Microelectronics 2016, no. 1 (2016): 000240–44. http://dx.doi.org/10.4071/isom-2016-wp11.

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Abstract Printed electronics and 3D printing have proved their viability for manufacturing functional devices. The state of the art is now at a crossroads where yield, reliability, survivability, and longevity improvements will govern its continued success in manufacturing. Currently, 3D printed electronics demonstration parts are either grossly oversized or are meticulously fabricated and involve significant human interaction and repair and ultimately have low manufacturing yield. Presented here are techniques for improving manufacturing yield. Coefficient of thermal expansion (CTE) mismatch

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19

Kulkarni, Srikanth, Shams Arifeen, Brian Patterson, Gabriel Potirniche, Aicha Elshabini, and Fred Barlow. "Evaluation of Ceramic Substrates for High Power and High Temperature Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (2011): 000199–206. http://dx.doi.org/10.4071/cicmt-2011-wp11.

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Ceramic substrates with thin film and thick film conductor traces are widely used in microelectronic packages for high temperature operation. In high power applications where the maximum current in the package may be hundreds of amperes, much thicker conductive traces are normally required. For such applications, Direct Bonded Copper (DBC), Direct Bonded Aluminum (DBA) or Active Metal Bonded (AMB) substrates are good candidates. These substrates provide low electrical resistance and high ampacity, thereby enable the design of high power circuits for high temperature operation. The most commonl

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20

Rentsch, Sven, Jens Müller, and Matthias Hein. "Tunability, Frequency and Temperature Behavior of Cofired LTCC-Integrated Barium-Strontium-Titanate up to 8 GHz." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (2012): 000447–54. http://dx.doi.org/10.4071/cicmt-2012-wp11.

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A new approach towards embedding barium-strontium-titanate (BST) patches into a commercial low temperature co-fired ceramic (LTCC) is described, using a tape transfer technique. Pressure-assisted sintering is successfully employed to achieve flat multi-layer multi-material modules without internal cracks or delaminations. Beside the description of the processing technology, the paper presents also a specific procedure of determining the microwave properties of embedded thick BST films, which is based on using the experimental evaluation of a shunt capacitor. The permittivity of the embedded BS

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Czok, Mateusz, Kalina Czajkowska, Karol Malecha, and Leszek Golonka. "Electromagnetic valve made in LTCC." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, CICMT (2013): 000105–9. http://dx.doi.org/10.4071/cicmt-2013-wp11.

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This paper describes technology of the electromagnetic valve made in the LTCC (Low Temperature Co-fired Ceramics). The actuation is supplied by mutual reaction between a 3D coil and a neodymium magnet bonded to flexible membrane. Such solution has many advantages like short reaction time, small power consumption and relatively great attractive forces. The valve is built in a hybrid PDMS-LTCC technology. The microfluidics and coil parts are fabricated in the LTCC technology. The flexible section is manufactured using a PDMS (poly(dimethylsiloxane)) membrane bonded to the ceramic part by plasma

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Ohme, Bruce W., and Mark R. Larson. "Analog Component Development for 300°C Sensor Interface Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (2012): 000199–206. http://dx.doi.org/10.4071/hitec-2012-wp11.

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The development of Enhanced Geothermal Systems (EGS) for base-load electrical power generation will require electronics for sensing and control during exploration and drilling and also during production. The operating temperature environments for these applications will generally be more extreme than those encountered by electronics currently deployed for oil and gas development and production monitoring. To address this requirement, electronic components have been designed and fabricated for operation at temperatures of 300°C. These integrated circuits use silicon-on-insulator (SOI) fabricati

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Nies, Craig, Scott Harris, and Stanley Cygan. "A Comparison of Multilayer Ceramic Capacitor Technologies for High Temperature Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (2010): 000244–50. http://dx.doi.org/10.4071/hitec-cnies-wp11.

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Multilayer ceramic capacitors remain an important component in high temperature circuitry due to the general robustness of ceramics at application temperatures greater than 200°C. However, standard MLCC dielectric compositions either exhibit very low dielectric constants at high temperatures or show excessive capacitance loss with increasing temperature in this regime. Many also see a significant degradation in insulation resistance, leading to very low RC products for the materials. Stability of properties with dielectric field is also a critical factor in many applications, both for improved

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Knuuti, Tobias, Alexandru Tatomir, Astrid Göbel, et al. "Capturing the state-of-knowledge in EURAD knowledge management." EPJ Nuclear Sciences & Technologies 8 (2022): 37. http://dx.doi.org/10.1051/epjn/2022030.

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Knowledge about a wide variety of aspects is fundamental for the safe management and disposal of radioactive waste. This importance of Knowledge Management (KM) is also recognised by EURAD, the European Joint Programme on Radioactive Waste Management (RWM), which brings together over 100 organisations from different countries and backgrounds (Waste Management Organisations, Technical Support Organisations, and Research Entities). This vast resource of expertise and experience feeds into several dedicated EURAD KM programme activities. One of these activities, led by Work Package 11 State-of-Kn

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Mbani, Chaldam Jespère, Magloire Pandoua Nekoua, Donatien Moukassa, and Didier Hober. "The Fight against Poliovirus Is Not Over." Microorganisms 11, no. 5 (2023): 1323. http://dx.doi.org/10.3390/microorganisms11051323.

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Poliovirus (PV), the virus that causes both acute poliomyelitis and post-polio syndrome, is classified within the Enterovirus C species, and there are three wild PV serotypes: WPV1, WPV2 and WPV3. The launch of the Global Polio Eradication Initiative (GPEI) in 1988 eradicated two of the three serotypes of WPV (WPV2 and WPV3). However, the endemic transmission of WPV1 persists in Afghanistan and Pakistan in 2022. There are cases of paralytic polio due to the loss of viral attenuation in the oral poliovirus vaccine (OPV), known as vaccine-derived poliovirus (VDPV). Between January 2021 and May 2

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26

Bene, M. C., and J. S. Kaeda. "How and why minimal residual disease studies are necessary in leukemia: a review from WP10 and WP12 of the European LeukaemiaNet." Haematologica 94, no. 8 (2009): 1135–50. http://dx.doi.org/10.3324/haematol.2008.004267.

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27

Mendes, Amalia, Ari Whiteman, Kelley Bullard, et al. "Spatial analysis of genetic clusters and epidemiologic factors related to wild poliovirus type 1 persistence in Afghanistan and Pakistan." PLOS Global Public Health 2, no. 6 (2022): e0000251. http://dx.doi.org/10.1371/journal.pgph.0000251.

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Following the certification of the World Health Organization Region of Africa as free of serotype 1 wild poliovirus (WPV1) in 2020, Afghanistan and Pakistan represent the last remaining WPV1 reservoirs. As efforts continue in these countries to progress to eradication, there is an opportunity for a deeper understanding of the spatiotemporal characteristics and epidemiological risk factors associated with continual WPV1 circulation in the region. Using poliovirus surveillance data from 2017–2019, we used pairwise comparisons of VP1 nucleotide sequences to illustrate the spatiotemporal WPV1 disp

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Christian, Danielle L., Kathryn Berzins, Jo C. Weldon, et al. "Connected Communities | Learning lessons from person-centred community-based support services’ implementation: a mixed-methods study protocol." NIHR Open Research 3 (November 12, 2024): 66. http://dx.doi.org/10.3310/nihropenres.13494.2.

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Background Person-centred community-based support services (PCCBSS) are an array of non-clinical services provided by organisations such as NHS Trusts, voluntary sector organisations, or local authorities. All PCCBSS involve an individual (variously known as a 'social prescriber’, ‘link worker’, ‘signposter’, ‘navigator’, ‘connector’ or ‘neighbourhood coach’) who talks with a service user before directing them to a range of relevant community sources of social, emotional, and practical support. Despite much recent investment in social prescribing, and its increased prominence within the policy

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Noble, Adam J., Suzanne M. Mason, Laura J. Bonnett, et al. "Supporting the ambulance service to safely convey fewer patients to hospital by developing a risk prediction tool: Risk of Adverse Outcomes after a Suspected Seizure (RADOSS)—protocol for the mixed-methods observational RADOSS project." BMJ Open 12, no. 11 (2022): e069156. http://dx.doi.org/10.1136/bmjopen-2022-069156.

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IntroductionAmbulances services are asked to further reduce avoidable conveyances to emergency departments (EDs). Risk of Adverse Outcomes after a Suspected Seizure seeks to support this by: (1) clarifying the risks of conveyance and non-conveyance, and (2) developing a risk prediction tool for clinicians to use ‘on scene’ to estimate the benefits an individual would receive if conveyed to ED and risks if not.Methods and analysisMixed-methods, multi-work package (WP) project. For WP1 and WP2 we shall use an existing linked data set that tracks urgent and emergency care (UEC) use of persons ser

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Christian, Danielle L., Kathryn Berzins, Jo C. Weldon, et al. "Connected communities | Learning lessons from person-centred community-based support services’ implementation." NIHR Open Research 3 (November 27, 2023): 66. http://dx.doi.org/10.3310/nihropenres.13494.1.

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Background Person-centred community-based support services (PCCBSS) are an array of non-clinical services provided by organisations such as NHS Trusts, voluntary sector organisations, or local authorities. All PCCBSS involve an individual (variously known as a 'social prescriber’, ‘link worker’, ‘signposter’, ‘navigator’, ‘connector’ or ‘neighbourhood coach’) who talks with a service user before directing them to a range of relevant community sources of social, emotional, and practical support. Despite much recent investment in social prescribing, and its increased prominence within the policy

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Capanema, Luciana Xavier de Lemos, and Virgínia Sampaio Teixeira Ciminelli. "An investigation of Acid Rock Drainage (ARD) occurrence in a gold mine located in a Southeastern Brazil region." Rem: Revista Escola de Minas 56, no. 3 (2003): 201–6. http://dx.doi.org/10.1590/s0370-44672003000300010.

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This work is aimed at evaluating the potential of Acid Rock Drainage (ARD) from two Brazilian gold sulfidic ore samples, by means of using three of the most traditional ARD prediction techniques: Standard Acid Base Accounting and Modified Acid Base Accounting, as static methods, and humidity cells, as a kinetic method. Samples were submitted to chemical and mineralogical characterization that indicated the presence of traces of sulfide minerals, such as pyrite, arsenopyrite, pyrrhotite and of carbonates, calcite and dolomite. While the Standard ABA results were inconclusive, the Modified ABA N

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Guacci, Vincent, Jeremiah Stricklin, Michelle S. Bloom, Xuánzōng Guō, Meghna Bhatter, and Douglas Koshland. "A novel mechanism for the establishment of sister chromatid cohesion by the ECO1 acetyltransferase." Molecular Biology of the Cell 26, no. 1 (2015): 117–33. http://dx.doi.org/10.1091/mbc.e14-08-1268.

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Cohesin complex mediates cohesion between sister chromatids, which promotes high-fidelity chromosome segregation. Eco1p acetylates the cohesin subunit Smc3p during S phase to establish cohesion. The current model posits that this Eco1p-mediated acetylation promotes establishment by abrogating the ability of Wpl1p to destabilize cohesin binding to chromosomes. Here we present data from budding yeast that is incompatible with this Wpl1p-centric model. Two independent in vivo assays show that a wpl1∆ fails to suppress cohesion defects of eco1∆ cells. Moreover, a wpl1∆ also fails to suppress cohes

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Brouwer, Andrew F., Joseph N. S. Eisenberg, Connor D. Pomeroy, et al. "Epidemiology of the silent polio outbreak in Rahat, Israel, based on modeling of environmental surveillance data." Proceedings of the National Academy of Sciences 115, no. 45 (2018): E10625—E10633. http://dx.doi.org/10.1073/pnas.1808798115.

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Israel experienced an outbreak of wild poliovirus type 1 (WPV1) in 2013–2014, detected through environmental surveillance of the sewage system. No cases of acute flaccid paralysis were reported, and the epidemic subsided after a bivalent oral polio vaccination (bOPV) campaign. As we approach global eradication, polio will increasingly be detected only through environmental surveillance. We developed a framework to convert quantitative polymerase chain reaction (qPCR) cycle threshold data into scaled WPV1 and OPV1 concentrations for inference within a deterministic, compartmental infectious dis

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Yongmei, Zhao, and Wu Panpan. "Screening and Preliminary Identification of Soil Potassium and Phosphorus-hydrolyzing Bacteria WP1-3." E3S Web of Conferences 293 (2021): 02026. http://dx.doi.org/10.1051/e3sconf/202129302026.

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In order to screen the strains with Potassium and phosphorus-releasing bacteria from the soil, the potassium-dissolving medium was used for preliminary screening, and the transparent circle method was used for re-screening. The content of soluble potassium was determined by sodium tetraphenylborate method, and the content of phosphorus was determined by anticolorimetric method of molybdenum and antimony. The strains were identified by morphological, biochemical and molecular biology. The results showed that ten strains with potassium-solubilizing function were obtained by preliminary screening

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Lv, Tian, Jing Chun Wu, Fang Shi, and Yang Zhao. "Screening of Polymer-Producing Bacteria for Microbial Combination Flooding in Thick Oilfield." Applied Mechanics and Materials 733 (February 2015): 27–30. http://dx.doi.org/10.4028/www.scientific.net/amm.733.27.

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Through the cultivation of two polymer-producing strains of WP1, SP1, determined the suitable growth temperature of bacteria, followed by fermented, we research the growth of the strains and metabolite changes on viscosity and pH values. Results show that at 80 r/min, 120 r/min training conditions, viscosity of strain WP1 is all more than 100mPa•s, the strains of experimental works better than SP1. Therefore, selected strain WP1 identified as strains of microorganisms in thick oilfield combination flooding produced polymers, this strain is identified at last.

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36

Bricks, Lucia F., Denis Macina, and Juan C. Vargas-Zambrano. "Polio Epidemiology: Strategies and Challenges for Polio Eradication Post the COVID-19 Pandemic." Vaccines 12, no. 12 (2024): 1323. http://dx.doi.org/10.3390/vaccines12121323.

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The Global Polio Eradication Initiative (GPEI), launched in 1988, has successfully reduced wild poliovirus (WPV) cases by over 99.9%, with WPV type 2 and WPV3 declared eradicated in 2015 and 2019, respectively. However, as of 2024, WPV1 remains endemic in Afghanistan and Pakistan. Since 2000, outbreaks of circulating virus derived of polio vaccines (cVDPVs) have emerged in multiple regions, primary driven by low vaccine coverage rates (VCRs). The COVID-19 pandemic disrupted routine immunization, resulting in millions of unvaccinated children, and leaving many countries vulnerable to both WPV1

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37

Leader, S., and P. Muhuri. "WPE1: MODELING FOR POLICY-MAKERS THE EXPECTED BENEFITS OF PREVENTION." Value in Health 2, no. 3 (1999): 226. http://dx.doi.org/10.1046/j.1524-4733.1999.00305.x.

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Chatterjee, Avradip, Silva Zakian, Xiao-Wen Hu, and Martin R. Singleton. "Structural insights into the regulation of cohesion establishment by Wpl1." EMBO Journal 32, no. 5 (2013): 677–87. http://dx.doi.org/10.1038/emboj.2013.16.

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39

Saltbones, Jørgen. "Real-time dispersion model calculations as part of NORMEM-WP19." Safety Science 20, no. 1 (1995): 51–59. http://dx.doi.org/10.1016/0925-7535(94)00066-c.

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40

Prus, Patryk, Miroslaw Firlej, Tomasz Fiutowski, Marek Idzik, Jakub Moron, and Krzysztof Swientek. "Development of a 10-bit ultra-low power SAR ADC with programmable threshold in 130 nm CMOS technology." IOPScience, January 10, 2025. https://doi.org/10.1088/1748-0221/20/01/C01009.

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The design and simulation results of an ultra-low power, fast 10-bit Successive Approximation Register (SAR) Analog-to-Digital Converter (ADC) in CMOS 130 nm technology are presented. This ADC is an extension of an experimentally verified 10-bit SAR ADC (INL, DNL < 0.5 LSB, ENOB > 9.5), working up to 50 MSps and consuming 680 μW at 40 MSps. The goal of the present work was to add a programmable threshold for the processed input signal, to stop the conversion and thus greatly reduce power consumption in case the signal is below the threshold. The new ADC works up to around 40 MSps and

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Firlej, Miroslaw, Tomasz Fiutowski, Marek Idzik, Aleksandra Molenda, Jakub Moron, and Krzysztof Swientek. "Development of a TAC-based TDC in 130 nm CMOS technology." ResearchGate, January 14, 2025. https://doi.org/10.1088/1748-0221/20/01/C01013.

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The design and measurement results of a prototype Time-to-Digital Converter (TDC)fabricated in 130 nm CMOS technology are presented. The TDC architecture with analog interpolatorswas chosen, which was motivated by previous experience in Analog-to-Digital Converter (ADC)design [1]. The measured time difference between the event and the trigger signal is converted tothe amplitude and then digitised by a 10-bit ADC. The TDC prototype is functional and achievedgood Differential Non-Linearity (DNL) and jitter (below 1 LSB), slightly dependent of the selectedtime precision. The obtained Integral Non

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Firlej, Miroslaw, Tomasz Fiutowski, Marek Idzik, Jakub Moron, and Krzysztof Swientek. "Ultra-low power 10-bit 50–90 MSps SAR ADCs in 65 nm CMOS for multi-channel ASICs." IOP Science, January 31, 2024. https://doi.org/10.1088/1748-0221/19/01/P01029.

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The design and measurement results of ultra-low power, fast 10-bit Successive Approximation Register (SAR) Analog-to-Digital Converter (ADC) prototypes in 65 nm CMOS technology are presented. Eight prototype ADCs were designed using two different switching schemes of capacitive Digital-to-Analog Converter (DAC), based on MIM or MOM capacitors, and controlled by standard or low-power SAR logic. The layout of each ADC prototype is drawn in 60 μm pitch to make it ready for multi-channel implementation. A series of measurements have been made confirming that all prototypes are fully functional,

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Moreira, Paulo, Szymon Kulis, Sophie Baron, et al. "lpGBT: Low-Power Radiation-Hard Multipurpose High-Speed Transceiver ASIC for High-Energy Physics Experiments." INSPIRE HEP, January 1, 2025. https://doi.org/10.1109/TNS.2024.3506753.

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Commissioning of detector systems for the high-luminosity large Hadron collider (HL-LHC) is scheduled to take place between 2026 and 2028 at CERN. Application-specific integrated circuits (ASICs) for those systems have been in intense development over the past ten years. Some of those ASICs, as is the case of the low-power gigabit transceiver (lpGBT) described in this work, have now been produced in industrial quantities and have been fully qualified for operation in the HL-LHC environments that require, where the innermost detectors are concerned, radiation hardness over 1 MGy. The lpGBT is a

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Albuquerque, E., M. Araújo, A. Benaglia, et al. "TOFHIR2: The readout ASIC of the CMS Barrel MIP Timing Detector." arXivLabs, April 1, 2024. https://doi.org/10.48550/arXiv.2404.01208.

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The CMS detector will be upgraded for the HL-LHC to include a MIP Timing  Detector (MTD). The MTD will consist of barrel and endcap timing layers, BTL and ETL respectively, providing precision timing of charged particles. The BTL sensors are based on  LYSO:Ce scintillation crystals coupled to SiPMs with TOFHIR2 ASICs for the front-end readout. A resolution of 30-60 ps for MIP signals at a rate of 2.5 Mhit/s per channel is expected along the HL-LHC lifetime. We present an overview of the TOFHIR2 requirements and design, simulation results and measurements with TOFHIR2 ASICs. The

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Wang, Fang, Jiangtao Cai, Haitao Zhang, Han Gao, and Jie Jin. "Analysis on atomization characteristics of fuel slinger from turbojet engine WP11." Atomization and Sprays, 2022. http://dx.doi.org/10.1615/atomizspr.2022042681.

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wang, fang, Haitao Zhang, Jiangtao Cai, and Jie Jin. "Influence of Fuel Properties on Atomization Characteristics of Turbojet Engine Wp11." SSRN Electronic Journal, 2022. http://dx.doi.org/10.2139/ssrn.4172052.

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Kimmel, Alexandra C., Andrew Silverman, Sreeja Kodali, et al. "Abstract WP11: Timing of Blood Pressure Decreases During Mechanical Thrombectomy for Ischemic Stroke." Stroke 51, Suppl_1 (2020). http://dx.doi.org/10.1161/str.51.suppl_1.wp11.

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Introduction: Decreases in blood pressure (BP) during endovascular therapy (EVT) are associated with infarct progression and poor outcome. The largest BP reductions are thought to occur during induction. The frequency and clinical relevance of late BP decreases after partial reperfusion has been achieved remain unknown. In this study, we aimed to characterize the timing of BP reductions during EVT and to assess their association with functional outcome. Methods: We retrospectively studied patients with LVO stroke who underwent EVT at two comprehensive stroke centers. BP was continuously monito

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Prasetya, Haryadi, Lucas A. Ramos, Thabiso Epema, et al. "Abstract WP11: Semi-automated Quantitative Assessment of Reperfusion in Acute Ischemic Stroke Patients." Stroke 50, Suppl_1 (2019). http://dx.doi.org/10.1161/str.50.suppl_1.wp11.

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Hawkins, Angela, Karin Olds, Marc Larsen, Coleman Martin, Naveed Akhtar, and William Holloway. "Abstract WP11: Tiered Triage Approach Improves Stroke Treatment Times and Reduces Activation Fatigue in Stroke Centers." Stroke 48, suppl_1 (2017). http://dx.doi.org/10.1161/str.48.suppl_1.wp11.

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Background: Time critical care in the Emergency Department is important for a patient’s survival and recovery. Reductions in disability are attributed to rapid triage and treatment for patients with both small and large vessel strokes. Current guidelines provide recommendations in clinical practice but do not delineate which type of stroke patients should receive heightened levels of triage when they arrive in the ED simultaneously. Purpose: To decrease unintentional care delays by classifying patients who are in need of intravenous tPA, endovascular therapy, or patients receiving no therapy i

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Vranic, Justin, Pablo Harker, Christopher Stapleton, et al. "Abstract WP11: The Impact Of Dual Antiplatelet Therapy Duration On Unruptured Aneurysm Occlusion Following Flow Diversion." Stroke 53, Suppl_1 (2022). http://dx.doi.org/10.1161/str.53.suppl_1.wp11.

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Objective: The objective of this study is to assess the impact that the type and duration of DAPT has on aneurysm occlusion rates and iatrogenic complications following endoluminal flow diversion with a single flow diverting stent. Methods: A retrospective review of a multicenter aneurysm database was performed from 2012 to 2020 to identify unruptured intracranial aneurysms treated with single device flow diversion and >12-month follow-up. Clinical and radiologic data were analyzed with aneurysm occlusion as a function of DAPT duration serving as a primary outcome measure. Results: A total

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