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Journal articles on the topic 'Aluminium Nitride'

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1

Ryabov, A. V. "Medium-Carbon Free-Cutting Steel." Materials Science Forum 946 (February 2019): 47–52. http://dx.doi.org/10.4028/www.scientific.net/msf.946.47.

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The paper presents theoretical and experimental studies of the formation processes of boron nitride, aluminium nitride, aluminium oxide and manganese sulphide inclusions in a free-cutting steel. Fact Sage software was used to model the behaviour of non-metallic inclusions. Formation temperatures and the amount of key inclusions in steel were calculated. Formation order of inclusions is as follows: aluminium oxide > boron nitride > manganese sulphide > aluminium nitride. The object of study was the A45AR grade steel in 1.1–1.2 kg ingots. It was melted in an induction furnace, and alumi
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2

Uvarov, V. M., E. M. Rudenko, Yu V. Kudryavtsev, M. V. Uvarov, I. V. Korotash, and M. V. Dyakin. "Electronic Structure of Aluminium Nitride and Its Solid Solutions with Oxygen and Aluminium." METALLOFIZIKA I NOVEISHIE TEKHNOLOGII 46, no. 3 (May 13, 2024): 199–210. http://dx.doi.org/10.15407/mfint.46.03.0199.

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3

Wei, Jun Cong, and Jun Bo Tu. "Effect of Aluminium Powder on the Hot Mechanical Properties of Corundum-Silicon Nitride Composites." Advanced Materials Research 189-193 (February 2011): 3960–63. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.3960.

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Based on the Al-O-N phase stable diagram and adopting inverse reaction sintering process, corundum-silicon nitride composite refractories were prepared using corundum, silicon nitride, clay and aluminium powder as the main starting materials. The specimens were sintered at 1600 for 3 hours under air atmosphere with different oxygen partial pressure obtained by addition of different amount of aluminium powder. The effects of aluminium powder additions(0, 4wt.%, 8 wt.% and 12 wt.% respectively) on the hot modulus of rupture were investigated .The phase composition and microstructure were tested
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4

Hou, Qinghua, Raj Mutharasan, and Michael Koczak. "Feasibility of aluminium nitride formation in aluminum alloys." Materials Science and Engineering: A 195 (June 1995): 121–29. http://dx.doi.org/10.1016/0921-5093(94)06511-x.

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5

Tangen, Inger Lise, Tor Grande, Y. D. Yu, R. Høier, and M. A. Einarsrud. "Preparation and Mechanical Characterisation of Aluminium Nitride-Titanium Nitride and Aluminium Nitride-Silicon Carbide Composites." Key Engineering Materials 206-213 (December 2001): 1153–56. http://dx.doi.org/10.4028/www.scientific.net/kem.206-213.1153.

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6

Kent, Damon, Graham B. Schaffer, and John Drennan. "Novel Aluminium Nitride Surface Coatings Formed on Aluminium." Materials Science Forum 561-565 (October 2007): 571–75. http://dx.doi.org/10.4028/www.scientific.net/msf.561-565.571.

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A new nitriding method has been devised which requires only a simple vacuum furnace and enables direct nitridation of solid aluminium without any prior surface treatment. It can be used to produce thick aluminium nitride surface layers on aluminium, under nitrogen at atmospheric pressure. A critical element of the process is the use of a magnesium vapour source that reduces/disrupts the natural, protective oxide film on the aluminium surface and facilitates nitriding. The nitride surface layers form through two distinct modes, one growing outward from the aluminium plate surface and the other
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7

Iwanciw, J., D. Podorska, and J. Wypartowicz. "Simulation of Oxygen and Nitrogen Removal from Steel by Means of Titanium and Aluminum." Archives of Metallurgy and Materials 56, no. 3 (September 1, 2011): 635–44. http://dx.doi.org/10.2478/v10172-011-0069-x.

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Simulation of Oxygen and Nitrogen Removal from Steel by Means of Titanium and Aluminum Authors' computer program was employed in the simulation of the course of steel refining by means of simultaneously used aluminium and titanium. The mass and chemical composition of liquid steel and non-metallic precipitates, were calculated at constant or variable temperature. The influence of assumed nitrides form on the results of simulation was determined. Nitrides may be considered either as separate phases or as the components of non-metallic solution. The stoichiometry of titanium oxide obtained also
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8

Wilson, F. G., and T. Gladman. "Aluminium nitride in steel." International Materials Reviews 33, no. 1 (January 1988): 221–86. http://dx.doi.org/10.1179/imr.1988.33.1.221.

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9

Koryakin A.A., Kukushkin S. A., Osipov A. V., and Sharofidinov Sh. Sh. "Growth regimes of aluminium nitride films on hybrid SiC/Si(111) substrates." Physics of the Solid State 64, no. 1 (2022): 113. http://dx.doi.org/10.21883/pss.2022.01.52497.209.

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The nucleation mechanism of aluminum nitride films grown by the method ofhydride vapor phase epitaxy on hybrid substrates 3C-SiC/Si(111) istheoretically analyzed. The temperature regions and vapor pressure regionsof components are determined in which the island growth mechanism and thelayer-by-layer growth mechanism are realized. The theoretical conclusionsare compared with the experimental data. The morphology of aluminum nitridefilm on 3C-SiC/Si(111) at the initial growth stage is investigated by themethod of scanning electron microscopy. The methods of controlling thechange of the growth me
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10

Ichinose, Noboru. "Aluminium Nitride Ceramics for Substrates." Materials Science Forum 34-36 (January 1991): 663–67. http://dx.doi.org/10.4028/www.scientific.net/msf.34-36.663.

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11

Wildhack, S., and Fritz Aldinger. "Freeze Casting of Aluminium Nitride." Advances in Science and Technology 45 (October 2006): 407–12. http://dx.doi.org/10.4028/www.scientific.net/ast.45.407.

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Aqueous freeze casting is an alternative wet shaping technique where water-based ceramic suspensions containing a cryoprotectant are cast in molds, frozen and dried. The method can be applied to various ceramic systems depending mainly on the ability to produce high solid loading in aqueous ceramic slurries. Against this background, aqueous aluminum nitride (AlN) suspensions were developed for the application in freeze casting. The results show that the applied process additives are most effective not only in chemically protecting AlN against hydrolysis but also in obtaining colloidally stable
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12

Belmonte, T., J. Y. Poussardin, L. Lefèvre, and H. Michel. "Aluminium nitride synthesis by RPECVD." Le Journal de Physique IV 11, PR3 (August 2001): Pr3–755—Pr3–762. http://dx.doi.org/10.1051/jp4:2001395.

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13

Xuanhui, Qu. "Injection moulding of aluminium nitride." Metal Powder Report 57, no. 7-8 (July 2002): 87. http://dx.doi.org/10.1016/s0026-0657(02)80361-7.

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14

Bensalem, R., A. Abid, and B. J. Sealy. "Evaporated aluminium nitride encapsulating films." Thin Solid Films 143, no. 2 (October 1986): 141–53. http://dx.doi.org/10.1016/0040-6090(86)90382-2.

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15

Robinson, D., and R. Dieckmann. "Oxidation of aluminium nitride substrates." Journal of Materials Science 29, no. 7 (April 1994): 1949–57. http://dx.doi.org/10.1007/bf00351319.

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16

Hotza, D., O. Sahling, and P. Greil. "Hydrophobing of aluminium nitride powders." Journal of Materials Science 30, no. 1 (1995): 127–32. http://dx.doi.org/10.1007/bf00352141.

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17

KLOMP, J. T., A. J. C. VAN DE VEN, and M. MONNERAYE. "ALUMINIUM NITRIDE CERAMIC-METAL REACTIONS." Le Journal de Physique Colloques 51, no. C1 (January 1990): C1–745—C1–756. http://dx.doi.org/10.1051/jphyscol:19901118.

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18

Bachelard, R., and P. Joubert. "Aluminium nitride by carbothermal nitridation." Materials Science and Engineering: A 109 (March 1989): 247–51. http://dx.doi.org/10.1016/0921-5093(89)90595-9.

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19

Lavrenko, V. A., and A. F. Alexeev. "Oxidation of sintered aluminium nitride." Ceramics International 11, no. 4 (October 1985): 153. http://dx.doi.org/10.1016/0272-8842(85)90266-4.

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20

Nishimura, Toshiyasu, Xin Xu, Naoto Hirosaki, K. Kimoto, Yoo Yamamoto, and Hiroaki Tanaka. "Effect of Aluminium on High-Energy Ball Milling and Spark Plasma Sintering of Silicon Nitride." Key Engineering Materials 287 (June 2005): 156–59. http://dx.doi.org/10.4028/www.scientific.net/kem.287.156.

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A commercial silicon nitride powder with oxide sintering additives was ground with high-energy ball mill to obtain nano-sized powder. Metallic aluminium powder was added as a grinding additive. Effect of high-energy ball milling was evaluated by X-ray diffraction analysis. After milling, height of background increased and peak height of silicon nitride decreased in XRD chart, which suggested that vitrification and/or decrease in grain size of silicon nitride occurred. The milled powders were sintered by spark plasma sintering system. Aluminium nitride was formed during sintering by reaction of
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21

J. Lloyd, D. M. Tricker, Z. H. Barb, S. "Growth of niobium nitride/aluminium nitride trilayers and multilayers." Philosophical Magazine A 81, no. 10 (October 1, 2001): 2317–35. http://dx.doi.org/10.1080/01418610010030041.

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22

Lloyd, S. J., D. M. Tricker, Z. H. Barber, and M. G. Blamire. "Growth of niobium nitride/aluminium nitride trilayers and multilayers." Philosophical Magazine A 81, no. 10 (October 2001): 2317–35. http://dx.doi.org/10.1080/01418610108217151.

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23

Tangen, Inger-Lise, Yingda Yu, Tor Grande, Ragnvald Høier, and Mari-Ann Einarsrud. "Preparation and characterisation of aluminium nitride–titanium nitride composites." Journal of the European Ceramic Society 24, no. 7 (June 2004): 2169–79. http://dx.doi.org/10.1016/s0955-2219(03)00367-4.

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24

Wu, Kefeng, Siyu Huang, Wenliang Wang, and Guoqiang Li. "Recent progress in III-nitride nanosheets: properties, materials and applications." Semiconductor Science and Technology 36, no. 12 (October 27, 2021): 123002. http://dx.doi.org/10.1088/1361-6641/ac2c26.

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Abstract As compared with their bulk materials, III-nitride nanosheets, including gallium nitride, aluminium nitride, indium nitride, reveal wider bandgap, enhanced optical properties, anomalously temperature-dependent thermal conductivity, etc, which are more suitable for the fabrication of nano-photodetectors, nano-field electron transistors, etc, for the application in the fields of nano-optoelectronics and nano-electronics. Although the properties of III-nitrides have been predicted based on the first-principles calculation, the experimental realization of III-nitride nanosheets has been r
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25

Hisyam, Muhammad Iznul, Ahmad Shuhaimi, Rizuan Norhaniza, Marwan Mansor, Adam Williams, and Mohd Rofei Mat Hussin. "Study of AlN Epitaxial Growth on Si (111) Substrate Using Pulsed Metal–Organic Chemical Vapour Deposition." Crystals 14, no. 4 (April 16, 2024): 371. http://dx.doi.org/10.3390/cryst14040371.

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A dense and smooth aluminium nitride thin film grown on a silicon (111) substrates using pulsed metal–organic chemical vapor deposition is presented. The influence of the pulsed cycle numbers on the surface morphology and crystalline quality of the aluminium nitride films are discussed in detail. It was found that 70 cycle numbers produced the most optimized aluminium nitride films. Field emission scanning electron microscopy and atomic force microscopy images show a dense and smooth morphology with a root-mean-square-roughness of 2.13 nm. The narrowest FWHM of the X-ray rocking curve for the
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26

Barber, Z. H., and M. G. Blamire. "Niobium nitride/aluminium nitride superconductor/insulator multilayers and tunnel junctions." IEEE Transactions on Appiled Superconductivity 7, no. 2 (June 1997): 3609–12. http://dx.doi.org/10.1109/77.622186.

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27

Chen, Yuanming, Wei He, Guoyun Zhou, Yongsuan Hu, Shouxu Wang, and Zhihua Tao. "Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites." Polymer International 63, no. 3 (July 1, 2013): 546–51. http://dx.doi.org/10.1002/pi.4556.

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28

Zhao, Peng, Huang, Yang, Hu, and Wang. "Super Ductility of Nanoglass Aluminium Nitride." Nanomaterials 9, no. 11 (October 29, 2019): 1535. http://dx.doi.org/10.3390/nano9111535.

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Ceramics have been widely used in many fields because of their distinctive properties, however, brittle fracture usually limits their application. To solve this problem, nanoglass ceramics were developed. In this article, we numerically investigated the mechanical properties of nanoglass aluminium nitride (ng-AlN) with different glassy grain sizes under tension using molecular dynamics simulations. It was found that ng-AlN exhibits super ductility and tends to deform uniformly without the formation of voids as the glassy grain size decreases to about 1 nm, which was attributed to a large numbe
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29

SHIMOO, Toshio, Tsuyoshi KUROSAKA, and Kiyohito OKAMURA. "Compatibility between Aluminium Nitride and Nickel." Journal of the Ceramic Society of Japan 107, no. 1241 (1999): 78–83. http://dx.doi.org/10.2109/jcersj.107.78.

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30

Li, Nanxi, Chong Pei Ho, Shiyang Zhu, Yuan Hsing Fu, Yao Zhu, and Lennon Yao Ting Lee. "Aluminium nitride integrated photonics: a review." Nanophotonics 10, no. 9 (June 18, 2021): 2347–87. http://dx.doi.org/10.1515/nanoph-2021-0130.

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Abstract Integrated photonics based on silicon has drawn a lot of interests, since it is able to provide compact solution for functional devices, and its fabrication process is compatible with the mature complementary metal-oxide-semiconductor (CMOS) fabrication technology. In the meanwhile, silicon material itself has a few limitations, including an indirect bandgap of 1.1 eV, transparency wavelength of >1.1 μm, and insignificant second-order nonlinear optical property. Aluminum nitride (AlN), as a CMOS-compatible material, can overcome these limitations. It has a wide bandgap of 6.2 eV, a
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31

Ma, Ai Jie, Jun Wei Gu, and Wei Xing Chen. "Thermal Conductivity Polypropylene/Aluminium Nitride Composites." Advanced Materials Research 194-196 (February 2011): 1577–80. http://dx.doi.org/10.4028/www.scientific.net/amr.194-196.1577.

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The polypropylene/aluminum nitride (PP/AlN) thermal conductivity composites were prepared by compression moulding method. Results revealed that the thermal conductivity of the composites were increased with the increasing AlN, and the thermal conductivity of composites was 1.84W/mk filled with 50vol% modified AlN. Both the tensile and impact strength of the composites increased firstly, but decreased with excessive addition of AlN. For given AlN loading, the surface modification of AlN exhibited a positive effect on the thermal conductivity. Meantime, the grafting of PP could increase the ther
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32

Vail, J. M., D. K. Chevrier, R. Pandey, and M. A. Blanco. "The nitrogen vacancy in aluminium nitride." Journal of Physics: Condensed Matter 18, no. 7 (January 30, 2006): 2125–35. http://dx.doi.org/10.1088/0953-8984/18/7/002.

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33

Vyas, Vimal, Yogesh Chandra Sharma, Vinod Purvia, Narayan Lal Heda, Yamini Sharma, Babu Lal Ahuja, and Bal Krishna Sharma. "Compton Profile Study of Aluminium Nitride." Zeitschrift für Naturforschung A 62, no. 12 (December 1, 2007): 703–10. http://dx.doi.org/10.1515/zna-2007-1205.

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In this paper we report the ab-initio theoretical Compton profiles of aluminium nitride (AlN) in the framework of the Hartree-Fock, density functional theory and hybridization of Hartree-Fock to density functional theories using the CRYSTAL03 code. To compare our first ever theoretical data, we have also measured the isotropic Compton profile of AlN, using 59.54 keV γ -rays. The Hartree- Fock scheme-based Compton profile agrees better with the experiment than the other theories. The energy bands, density of states and Mulliken’s population analysis, using the CRYSTAL03 code, are also reported.
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34

Norton, M. G. "Characterisation of Aluminium Nitride Ceramic Substrates." Microelectronics International 6, no. 3 (March 1989): 18–22. http://dx.doi.org/10.1108/eb044384.

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35

Selvaduray, G., and L. Sheet. "Aluminium nitride: review of synthesis methods." Materials Science and Technology 9, no. 6 (June 1993): 463–73. http://dx.doi.org/10.1179/mst.1993.9.6.463.

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36

Radwan, M., and M. Bahgat. "Novel Growth of Aluminium Nitride Nanowires." Journal of Nanoscience and Nanotechnology 6, no. 2 (February 1, 2006): 558–61. http://dx.doi.org/10.1166/jnn.2006.102.

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37

Gang Zong, Deng, Chung Wo Ong †, Manju Aravind, Mei Po Tsang, Chung Loong Choy, Deren Lu, and Dejun Ma. "Tensile strength of aluminium nitride films." Philosophical Magazine 84, no. 31 (November 2004): 3353–73. http://dx.doi.org/10.1080/14786430412331283604.

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38

ZYMLA, ANNA, VICTOR ZYMLA, and JEAN-BERNARD GUILLOT. "The Combustion Synthesis of Aluminium Nitride." Journal of Materials Processing & Manufacturing Science 7, no. 1 (July 1, 1998): 67–73. http://dx.doi.org/10.1106/7hu2-v5fv-kqud-5v5t.

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39

Bellucci, S., C. Balasubramanian, A. Ivanov, A. Popov, and H. Schober. "Neutron characterization of aluminium nitride nanotubes." Journal of Neutron Research 14, no. 4 (December 2006): 287–91. http://dx.doi.org/10.1080/10238160601049054.

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40

Moreno, J. C., E. Frayssinet, F. Semond, M. Placidi, and P. Godignon. "Epitaxial aluminium nitride on patterned silicon." Materials Science in Semiconductor Processing 12, no. 1-2 (February 2009): 31–33. http://dx.doi.org/10.1016/j.mssp.2009.07.011.

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41

Lefort, Pierre, and Roland Queriaud. "Compatibility between molybdenum and aluminium nitride." Journal of the European Ceramic Society 13, no. 4 (January 1994): 329–33. http://dx.doi.org/10.1016/0955-2219(94)90007-8.

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42

Watanabe, Yoshihisa, Yoshikazu Nakamura, Shigekazu Hirayama, and Yuusaku Naota. "Characterization of aluminium nitride thin films." Ceramics International 22, no. 6 (January 1996): 509–13. http://dx.doi.org/10.1016/0272-8842(95)00127-1.

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43

Li, Y. Q., T. Qiu, J. Xu, and X. C. He. "Surface modification of aluminium nitride powder." Journal of Materials Science Letters 15, no. 20 (1996): 1758–61. http://dx.doi.org/10.1007/bf00275333.

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44

Bućko, Mirosław M., Jakub Domagała, and Radosław Lach. "Consolidation of Aluminium Oxynitride Powders Using Hydrolysis of Aluminium Nitride." Key Engineering Materials 602-603 (March 2014): 170–74. http://dx.doi.org/10.4028/www.scientific.net/kem.602-603.170.

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One of the materials with high potential for application as a refractory material is aluminum oxynitride with spinel-type structure, γ-alon. Alon materials, single-phase or composites, are characterized by good mechanical properties, high thermal shock resistance and a high corrosion and erosion resistance. Another advantage is possibility of usage of SHS method for producing of relatively good sinterable powders of γ-alon, however, are characterized by poor compressibility. This paper describes a method of compaction of SHS-derived γ-alon powder using the hydrolysis reaction of aluminum nitri
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45

Amigo, V. "Structure and properties of extruded aluminium alloy-aluminium nitride composite." Metal Powder Report 57, no. 6 (June 2002): 54. http://dx.doi.org/10.1016/s0026-0657(02)80265-x.

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46

Ting-Ge, Gao, Yi Jue-Min, Zhou Zi-Yao, and Hu Xiao-Dong. "First Principles Study of Aluminium Vacancy in Wurtzite Aluminium Nitride." Chinese Physics Letters 25, no. 8 (July 29, 2008): 2989–92. http://dx.doi.org/10.1088/0256-307x/25/8/069.

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47

Chedru, Vicens, Chermant, and Mordike. "Aluminium-aluminium nitride composites fabricated by melt infiltration under pressure." Journal of Microscopy 196, no. 2 (November 1999): 103–12. http://dx.doi.org/10.1046/j.1365-2818.1999.00615.x.

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48

Czepirski, L., J. F. Janik, E. Komorowska-Czepirska, and R. L. Wells. "Adsorption Characteristics of Powders of Nanometric Gallium Nitride and Aluminium Nitride." Adsorption Science & Technology 20, no. 8 (October 2002): 723–28. http://dx.doi.org/10.1260/026361702321104228.

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The results of studies on new precursors for the preparation of gallium nitride and aluminium nitride were presented. The samples obtained were characterised by argon adsorption at 77 K. The variation of the porous structure parameters with the pyrolysis temperature was discussed. The adsorption of water vapour and the selectivity of adsorption with respect to some gases at 298 K were also investigated.
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49

Esguerra-Arce, A., J. Esguerra-Arce, L. Yate, C. Amaya, L. E. Coy, Y. Aguilar, O. Gutiérrez, and S. Moya. "Influence of the Al content on the in vitro bioactivity and biocompatibility of PVD Ti1−xAlxN coatings for orthopaedic applications." RSC Advances 6, no. 65 (2016): 60756–64. http://dx.doi.org/10.1039/c6ra08081b.

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50

Chalker, P. R., T. B. Joyce, C. Johnston, J. A. A. Crossley, J. Huddlestone, M. D. Whitfield, and R. B. Jackman. "Fabrication of aluminium nitride/diamond and gallium nitride/diamond SAW devices." Diamond and Related Materials 8, no. 2-5 (March 1999): 309–13. http://dx.doi.org/10.1016/s0925-9635(98)00263-5.

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