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Dissertations / Theses on the topic 'Electroplating'

Author: Grafiati

Published: 4 June 2021

Last updated: 25 July 2025

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1

Howarth, J. N. "Microelectrode studies of Electroplating systems." Thesis, University of Southampton, 1987. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.380601.

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2

Santos, Bruno Alexandre Quistorp. "Continuous bioremediation of electroplating effluent." Thesis, Cape Peninsula University of Technology, 2013. http://hdl.handle.net/20.500.11838/865.

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Thesis submitted in fulfilment of the requirements for the degree Magister Technologiae: Chemical Engineering in the Faculty of Engineering at the Cape Peninsula University of Technology 2013<br>There are significant quantities of free cyanide (F-CN) and heavy metal contaminated effluent being discharged from electroplating operations globally. However, there is an overwhelming tendency in the industry to use physical and/or chemical treatment methods for cyanides (CNs) and heavy metals in effluent. Although these methods may be effective for certain CNs and heavy metals, they produce toxic by

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3

Sun, Wenzhen. "Electroplating of gold-tin eutectic solder." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape11/PQDD_0016/MQ47158.pdf.

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4

Kadari, Kishore Kumar. "Electroplating on 3D Printed Conductive Track." Scholar Commons, 2017. https://scholarcommons.usf.edu/etd/7412.

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There are substantial advances in Additive Manufacturing (AM) technologies. The simplest and advantageous technique of AM in terms of cost and scaling of the substrate is Fused Deposition Modeling(FDM). Currently, integration of electronics to a 3D printed structure is done manually after fabrication of the structure. To print electronic circuits directly on a 3D printed structure, copper electroplating process has been studied in this work. To electroplate on the 3D printed insulating substrate, various materials were studied to make substrate conductive. By using conductive Po

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5

Sochacki, Adam. "Electroplating wastewater polishing in constructed wetland systems." Phd thesis, Saint-Etienne, EMSE, 2013. http://tel.archives-ouvertes.fr/tel-00937076.

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This thesis presents various aspects of polishing the electroplating wastewater in constructed wetlands: analysis of the performance, study on the operation and configuration effects, effects of various carbon sources, analysis of the substrate (bed media), analysis of plants, and design issues.The goals of the experiment were to: (i) study the feasibility of polishing electroplating effluent, (ii) study the effect of operating schemes, plants, bed media and wastewater strength, (iii) to elucidate metal removal mechanisms in the CW microcosms.This study furnished new information and expanded t

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6

Sochacki, Adam. "Electroplating wastewater polishing in constructed wetland systems." Rozprawa doktorska, Saint-Etienne, EMSE, 2013. https://repolis.bg.polsl.pl/dlibra/docmetadata?showContent=true&id=9641.

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This thesis presents various aspects of polishing the electroplating wastewater in constructed wetlands: analysis of the performance, study on the operation and configuration effects, effects of various carbon sources, analysis of the substrate (bed media), analysis of plants, and design issues.The goals of the experiment were to: (i) study the feasibility of polishing electroplating effluent, (ii) study the effect of operating schemes, plants, bed media and wastewater strength, (iii) to elucidate metal removal mechanisms in the CW microcosms.This study furnished new information and expanded t

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7

Brown, Neil J. "A multiattribute evaluation model for environmental compliance of existing metal hydroxide precipitation systems in the electroplating industry." Master's thesis, This resource online, 1991. http://scholar.lib.vt.edu/theses/available/etd-01202010-020209/.

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8

Poole, Martin. "Progress towards the development and implementation of an unambiguous copper wire fingerprinting system." Thesis, Rhodes University, 2003. http://eprints.ru.ac.za/214/.

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9

Eckles, Andrew Jackson IV. "Electrodeposition of crackfree ruthenium without a gold underlayer." Thesis, Georgia Institute of Technology, 1986. http://hdl.handle.net/1853/20026.

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10

Miu, Wah-sing, and 苗華昇. "The electrodeposition of rhodium by pulse current." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 1985. http://hub.hku.hk/bib/B31207030.

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11

Basirun, Wan Jefrey. "Studies of platinum electrodeposition." Thesis, University of Southampton, 1997. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.242254.

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12

Miu, Wah-sing. "The electrodeposition of rhodium by pulse current /." [Hong Kong : University of Hong Kong], 1985. http://sunzi.lib.hku.hk/hkuto/record.jsp?B12315394.

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13

Gilkes, Daniele. "Copper seed aging effects on post electroplating defects." [Gainesville, Fla.]: University of Florida, 2002. http://purl.fcla.edu/fcla/etd/UFE0000536.

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14

Hadian, Seyed E. "Developments in platinum electroplating for aero-engine applications." Thesis, Loughborough University, 1993. https://dspace.lboro.ac.uk/2134/28176.

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The electro-deposition of platinum on mild steel and nimonic alloys substrates using more than twenty baths have been investigated. It has been shown that the cell efficiency can be improved markedly with lower current density, pH value and plating temperature. Distinct differences between direct and pulsed processes revealed themselves in the cathode current efficiency data. Implications of using pulse plating to control the quality of electrodeposits have been considered.

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15

Rezai-Kalantary, Mehrdad. "Pulse electroplating of copper for printed circuit technology." Thesis, Loughborough University, 1990. https://dspace.lboro.ac.uk/2134/7417.

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This thesis is concerned with the study of square wave unipolar pulse and bipolar pulse reverse electroplating of copper for printed circuit board(PCB) production. The aim of this research programme was to develop an acid copper electrolyte, preferably with additives under certain pulse conditions for electroplating of PCBs having hole diameters as small as 0.3mm. The aim was to obtain a surface to hole thickness ratio of 1:1. The use of additives in the electrolyte is preferred for commercial purposes. The literature review comprises an examination of the technology of copper electroplating,

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16

Yee, Kenneth W. (Kenneth Wee-Koon). "Gold-electroplating technology for X-ray-mask fabrication." Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/40601.

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17

Boran, Ahmad Mosa. "Prevalence of occupational asthma in the electroplating industry." Thesis, University of Birmingham, 1993. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.694753.

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18

Zäll, Erik. "Electroplating of selective surfaces for concentrating solar collectors." Thesis, Umeå universitet, Institutionen för tillämpad fysik och elektronik, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:umu:diva-136425.

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The optical properties of the absorber pipe in a parabolic trough collector isessential for the performance of the solar collector. The desirable propertiesare high absorptance (α) of solar radiation and low emittance (ε) of thermalradiation. A surface with these properties is known as a solar selective surface. There are several techniques used to produce selective surfaces, but one of the most common ones is electroplating. Research done by Vargas, indicates that optical properties of α = 0.98 and ε = 0.03 [1], which is superior to the best commercial alternatives (α = 0.95 and ε = 0.04 [2])

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19

Chan, Yiu-wing. "Impact of the water pollution control ordinance on small electroplating factories /." [Hong Kong : University of Hong Kong], 1993. http://sunzi.lib.hku.hk/hkuto/record.jsp?B13498538.

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20

Rajasekharan, Vishnu V. "New strategies for electrodepositing yttrium oxide." Laramie, Wyo. : University of Wyoming, 2005. http://proquest.umi.com/pqdweb?did=888860291&sid=1&Fmt=2&clientId=18949&RQT=309&VName=PQD.

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21

Poon, Ka-Kwai. "Modelling and control of variability in PCB copper electroplating." Thesis, Loughborough University, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.263678.

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22

Gregory, Adrian John. "The understanding and development of novel platinum electroplating baths." Thesis, University of Southampton, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.261556.

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23

Le, Penven Roselyne. "The study of some platinum and palladium electroplating baths." Thesis, University of Southampton, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.303092.

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24

Sjödin, Saron Anteneh. "Indium Bump Fabrication using Electroplating for Flip Chip Bonding." Thesis, Mittuniversitetet, Avdelningen för elektronikkonstruktion, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-27939.

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Hybrid pixel detectors are widely used in many fields, including military, environment, industry and medical treatment. When integrating such a detector, a vertical connection technique called flip-chip bonding is almost the only way to realize the high-density interconnection between each pixel detector to the read-out chip. Such bonding can offer high-density I/O and a short interconnect distance, which can make the resulting device show excellent performance. Electro deposition is a promising approach to enable a low cost and high yield bump bonding process, compared with conventional sputt

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25

Lima, Frederico Goncalves De Cerqueira [Verfasser], Bastian E. [Akademischer Betreuer] Rapp, Thomas [Akademischer Betreuer] Hanemann, and Ulrich [Akademischer Betreuer] Mescheder. "Seedless electroplating: adhesion and charge transfer in galvanic processes." Freiburg : Universität, 2019. http://d-nb.info/1218464062/34.

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26

Nordenström, Andreas. "Investigating an electroplating method of Co-Cr alloys : A design of experiment approach to determine the impact of key factors on the electroplating process." Thesis, Umeå universitet, Institutionen för tillämpad fysik och elektronik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:umu:diva-148512.

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Solar energy is increasingly being considered a promising solution to reduce the emissions of CO2 and green house gas. The performance of solar collectors largely depends on the ability to absorb incoming solar radiation with minimal thermal radiation losses. To weigh the potential absorbed energy to thermal losses, the performance criterion (PC) can be used, calculated as PC =α−xε, where α is absorptance, ε is emittance and x is a scaling factor < 1. It has been shown by G. Vargas et al. that Co-Cr alloys excibit great potential (α = 0.98 and ε = 0.03) for use in solar concentrators. The m

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27

Fu, Sheng-Feng, and 傅聖峰. "Vitrification of Electroplating Sludge." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/51612334221794950018.

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碩士<br>國立成功大學<br>環境工程學系碩博士班<br>92<br>Electroplating technique is used worldwide because it can prevent materials from wear and corrosion, etc. Although electroplating technique is cheaper than others, it usually causes serious pollution to environment. Electroplating sludge contains high concentrations of heavy metals which are hazardous to environment. Therefore it is necessary to develop a good technique to treat electroplating sludge, even to made it a reusable material. This study is focused on the treatment of electroplating sludge by melting process, and the effluence of melting process f

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28

Huang, Han-Fan, and 黃瀚範. "Studies on copper electroplating." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/6dbjs3.

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碩士<br>國立中山大學<br>化學系研究所<br>106<br>Compounds of Bis(sodium sulfopropyl)disulfide (SPS) and Polyethylene Glycol (PEG) were investigated for Copper electroplating as accelerator and inhibitors, respectively. In this study, a series of experiments of copper planting were studied by adding different concentrations of SPS with PEG different molecular weights. Each experiment was analyzed by Cyclic Voltammetry (CV) for reduction potentials and by scanning electron microscope (SEM) for the morphology of copper deposition, and the compactness of the copper film. In addition, a tensile test was also appl

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29

Chen, Shi Wei, and 陳世偉. "Toxicty reduction study of electroplating wastwater." Thesis, 1995. http://ndltd.ncl.edu.tw/handle/78391753235405190984.

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30

Chen, Wei-yu, and 陳威宇. "The Loading Effect of the Electroplating." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/45958008015946644047.

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碩士<br>逢甲大學<br>自動控制工程所<br>97<br>Micro Electro Mechanical Systems is one of the most development systems in recent years. With a mature semiconductor technology can be developed many micro-actuators and sensors The technology of micro-electroplating has wildly used in MEMS and IC packaging. Because of the structure and the chemical properties, the large area and wafer level often caused by uneven thickness on electroplating. It could influence on the unity of the structure and the yield rate after packaging. In this research, we investigate the effect of the current distribution in different siz

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31

Lien, Chin-Chuan, and 連金傳. "Micro Optical Apertures Made by Electroplating." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/67806665554295508293.

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碩士<br>國立交通大學<br>機械工程系<br>89<br>An optical aperture made by electroplating is proposed. The aperture is applied in the optical data storage technique, provides small data pits beyond the limit of the light wavelength. Electroplating is a simple, low cost and safe approach, and is suitable to batch production. Combined with semiconductor lithography process, production of sub-micron apertures is realized, and the aperture can be as small as a diameter of 360 nm.

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32

Liou, Jheng-Hong, and 劉政鋐. "Treatment of Electroplating Wastewater for Reuse." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/63531822179111995663.

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碩士<br>高苑科技大學<br>化工與生化工程研究所<br>101<br>In this study, real electroplating wastewater were samples from an electroplating factory located in Gangshan section, Kaohsiung. There are two streams of wastewater in this factory. One is passivation wastewater (chromium wastewater), the other is general wastewater (pre-treatment washing water and electroplating rinse wastewater). The investigation of water quality included pH, DOC, COD, conductivity, turbidity, SS, TS, heavy metals, where the item of heavy of metals contain copper, iron, chromium, nickel and zinc. The water quality of 15 days’ monitor wa

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33

方建添. "The New Design of Electroplating Module." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/87111057647427445240.

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碩士<br>建國科技大學<br>自動化工程系暨機電光系統研究所<br>104<br>The purpose of this paper is to improve the way conventional electroplating; plating process is indispensable to modern products support important programs, so to enhance and improve plating equipment plating technology is the traditional metal manufactures industry important part. So how to continue past the basis of technological innovation ability to cope with future competition in mainland Europe and manufacturers, while improving our plating technology and equipment improvements to reduce costs, in fact, imperative. In this thesis, the improved el

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34

Hsieh, Ping-Yu, and 謝秉諭. "Effects of Polyethyleneimine on Electroplating Copper." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/16563401198112987201.

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碩士<br>明新科技大學<br>化學工程與材料科技系碩士班<br>103<br>The improvement of traditional electroplating technology hopes nothing but plating technology to be better and a more perfect plating result. In order to smooth the plating surface, lower the resistivity, the "additive" will be added into the plating liquid to achieve such better result. This paper described first depositing palladium film on FR-4 substrate by chemical plating, and addition of Polyethyleneimine on electroplating copper at the plating solution during electroplating. The images of Scanning Electron Microscope (SEM) of samples fabricated wi

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35

Berdos, Richard. "Electroplating of Copper on Tungsten Powder." 2018. https://scholarworks.umass.edu/masters_theses_2/727.

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Strengthening, resistant and shielding properties, to name a few, can be achieved by implementing a surface material coating onto an engineering component. Various elements of these compounded parts can augment the functionality of the part, such as, increased life time and more interactive surfaces. Tungsten has proven to be a challenge to plate with other metals, but if done correctly, the results can allow for the cold spray of tungsten. Cold spraying tungsten particles alone provides a challenge because the powder is too hard and instead of adhering, it erodes the surface it is attempting

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36

Cheng, MIng-Yuan, and 鄭明圓. "Method for Purifying Copper Electroplating Solution." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/31095830812497328525.

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碩士<br>義守大學<br>生物技術與化學工程研究所碩士在職專班<br>101<br>The replacement of the additives from electroplating liquid in a copper sulfate plating production site is commonly met. Prior to the replacement, it is normally needed to remove the old additives. This study is to find a cost-effective and simple method to remove the additives from the old plating liquid. In this study, current used technologies was applied and rearranged to try to finish the refreshment of plating liquid, and the treated liquids were testified by both chemical analysis and Hull cell test to examine the effect of the refreshment. Th

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37

Lakra, Sanjeeb, and Krishnam Singh Chauhan. "Effect of Substrate Texture on Electroplating." Thesis, 2010. http://ethesis.nitrkl.ac.in/1642/1/Project_Krishnam_Singh_Chauhan.pdf.

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Electroplating studies have been conducted extensively in the past due to their lower cost and fastness. Mechanical and functional properties of such coatings depend highly on the chemistry and the structure of the same. Deviation from random orientation in the crystallographic directions is known as preferred orientation or texturing in materials. Depending upon the texture, material property may be highly anisotropic. So, texture study of coating is of prime importance and moreover how the texturing phenomenon is occurring in coatings is also to be examined. The influence of substrate textur

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38

JEN-YU, LEE, and 李仁佑. "Analyzing The Effectiveness of Knowledge Transfer in Electroplating Industry–A Case Study of an Electroplating Company in Taiwan." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/pd4w8g.

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39

LIN, JYUN-MIAO, and 林雋淼. "The Study on Copper Electroplating by One-step and Two-step Process with Different Additives and Electroplating Conditions." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/efv484.

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碩士<br>國立聯合大學<br>化學工程學系碩士班<br>106<br>This experiment uses a cyanide-free formulation and additives for copper plating on stainless steel plates. It is expected that the surface of the stainless steel plate is coated with a film with copper metallic luster. Electrochemical analyses are investigated by cyclic linear sweep voltammetry (CLSV) and galvanostatic plating operation. The cyclic linear sweep voltammetry analysis shows that the inhibitory effect of the cupric electroplating bath have chlorine ion (Cl-), 2-MP (leveler), PEG (suppressor) and MPSA (accelerator) is better than that have o

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40

Chen, Whun Jen, and 陳煌仁. "The Directed Electroplating on Teflon Laminated Plate." Thesis, 1995. http://ndltd.ncl.edu.tw/handle/04700193847899785096.

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41

Yeh, Po-Ching, and 葉柏青. "Microanode Guided Electroplating (MAGE) and its Monitoring." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/40457208919763492156.

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碩士<br>國立中央大學<br>機械工程研究所<br>91<br>Microanode guided electroplating (MAGE) has been used to fabricate a three-dimensional microscale nickel column in nickel-containing baths. A Pt wire (125μm in diameter) was mounted with epoxy resin to expose a tip to act as a microanode that was moved to guide localized electroplating on a polished copper surface. Parameters, such as the dc-voltage bias, the waveforms of the bias and the gap between the electrodes were explored. In this work, the morphology on the top-view and cross-section of the microclumn was examined using scanning electron microscope (S

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42

Huang, Ching Jeng, and 黃敬任. "Electroplating of Nano Ni-Fe-TiO2 Composite." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/16082889493398367985.

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碩士<br>國立交通大學<br>材料科學與工程系<br>90<br>This research aims to fabricate Ni-Fe-TiO2 composite coating by adding inert nano particle ,TiO2, into Ni-Fe plating bath and electroplated with puls current . Items studied included the distribution of nano TiO2 in Ni-Fe-TiO2 composite coating the mechanial property、crystallization orientation and electrochemiscal property of the composite coating to obtain the optimum electroplating parameters for manufacturing micro-mold. Taguchi method was employed high-aspect-ratio using in UV-LIGA process . The dispersion of nano TiO2 in the coating could be i

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43

Sochacki, Adam. "Electroplating wastewater polishing in constructed wetland systems." Rozprawa doktorska, 2013. https://delibra.bg.polsl.pl/dlibra/docmetadata?showContent=true&id=9641.

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44

游大慶. "The Study of the Electroplating Cobalt Sulfide." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/75159307894102281968.

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45

Chen, Nai-Chia, and 陳乃嘉. "Electroplating Ru-W as a diffusion barrier." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/t6v8p3.

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碩士<br>國立雲林科技大學<br>材料科技研究所<br>107<br>It was estimated to be > 130 GWp at the end of 2017 for the global photovoltaic module production capacity; The crystalline silicon solar cells share the above 90% market. Currently, screen printing is the dominant technology in the contact form of silicon-based photovoltaic industry. Due to the screen printing process is fast and straightforward. However, screen printing has a disadvantage in having a lower aspect ratio and higher contact resistance, high cost, limiting solar cell efficiency. The Ni/Cu plating techniques have low contact resistance which is

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46

Seragadam, Padma. "Bio-removal of nickel from electroplating industry." Thesis, 2008. http://ethesis.nitrkl.ac.in/4166/1/%E2%80%9CBio-removal_of_Nickel_from_electroplating_industry.pdf.

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Ni (II) has been designated as a priority pollutant by the US Environmental Protection Agency (USEPA) due to its ability to cause mutations and cancer in humans. The risk associated with soil and groundwater contamination of nickel waste generated by many industries is high, and therefore Ni (II) remediation is of critical importance. It is discharged into the environment through the disposal of wastes from industries like Electroplating industry, metallurgical and metal finishing, textiles and ceramics, pigment and wood preservatives, photographic sensitizer manufacturing, etc. In the envi

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47

Hou, Guan Zheng, and 侯冠正. "The study of a hydrodynamic electroplating test cell." Thesis, 1994. http://ndltd.ncl.edu.tw/handle/60750504104466781732.

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48

Chao, Chien-Yao, and 趙健堯. "Preparation of Zinc-TiO2 Coating Films by Electroplating." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/scaw2z.

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碩士<br>國立高雄海洋科技大學<br>微電子工程研究所<br>102<br>Steel structures were deteriorated by rust every day. A common way to prevent rust is to galvanize the steel. Electroplating or hot-dip galvanization was used to coat the material in a layer of zinc. This study focuses on zinc-titanium dioxide thin-films (Zn-TiO2) research and development. Zinc is a low-cost, non-toxic and easy to obtain source material, making it a prospective material for use in rust prevention. This study is based on the concept of electroplating zinc-titanium dioxide thin films (Zinc-TiO2 film), which has the benefits of being low-cos

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49

Lin, Yi-hung, and 林奕宏. "Preparation of the electroplating resist for NTC thermistors." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/19116520137648605194.

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碩士<br>國立成功大學<br>資源工程學系碩博士班<br>96<br>Owing to the prevalence of portable electronic device in recent years, the development of electronic components trends towards thinner, smaller and much surface adherent. It turns out to ferment the demand for NTC thermistor. When producing NTC termination electrodes, in order to enhance the solder property, we have to 1) attach silver electrodes to components about 40~50μm thickness, 2) co-fire in 600℃∼650℃, and finally 3)coat Ni-layer with 2∼4μm thickness and Sn- or Sn-Pb layer with 5∼10μm thickness. However, NTC thermistor is of semiconducting ceramics, r

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50

Tseng, J. S., and 曾壬伸. "The effects of electroplating on R-chip process." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/62653290457312995366.

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碩士<br>義守大學<br>材料科學與工程學系<br>92<br>The thesis is to investigate how electroplating affects R-Chip process. The method is to analysis the plating bath problems by using barrel plating equipment and Hull-Cell device. The research shows that all of lead-free (non-lead) chemical will bring Sn4+, but the difference between each other is the growing rate. The Sn4+ will affect the deposit thickness and change the grain structure. This can lead to worse solder ability of R-chip, and then affects the product quality. Those parameters could be the very good reference for electroplating engi

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