Journal articles on the topic 'Electroplating'
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Wang, Yi Wen, Yi Zhi Liu, Xian Li Liu, Guo Bin Wang, and Hong Cai Deng. "Technology Improvement and Parameter Optimization on the Electroplating Superhard Grinding Material." Key Engineering Materials 359-360 (November 2007): 559–63. http://dx.doi.org/10.4028/www.scientific.net/kem.359-360.559.
Full textZhang, Le, Ying Chen, Huan Zhang, Yabin Jin, Zhe Shen, and Gending Duan. "Application of Membrane Separation Technology in Electroplating Wastewater Treatment and Resource Recovery: A Review." Nature Environment and Pollution Technology 23, no. 2 (2024): 649–65. http://dx.doi.org/10.46488/nept.2024.v23i02.005.
Full textPakpahan, Binsar Maruli Tua, Muhammad Nuh Hudawi Pasaribu, Lisnawaty Simatupang, and Robert Silaban. "Influence of Diamond-Like Carbon and Electroplating Ni-Cr on hardness and surface roughness of implant material AISI 316LN." Journal of Physics: Conference Series 2908, no. 1 (2024): 012015. https://doi.org/10.1088/1742-6596/2908/1/012015.
Full textMorrow, Hugh. "Cadmium electroplating." Metal Finishing 98, no. 1 (2000): 210–14. http://dx.doi.org/10.1016/s0026-0576(00)80327-x.
Full textMorrow, Hugh. "Cadmium electroplating." Metal Finishing 97, no. 1 (1999): 210–14. http://dx.doi.org/10.1016/s0026-0576(00)83078-0.
Full textMorrow, Hugh. "Cadmium electroplating." Metal Finishing 105, no. 10 (2007): 168–72. http://dx.doi.org/10.1016/s0026-0576(07)80331-x.
Full textMorrow, Hugh. "Cadmium electroplating." Metal Finishing 100 (January 2002): 199–211. http://dx.doi.org/10.1016/s0026-0576(02)82021-9.
Full textMorrow, Hugh. "Cadmium electroplating." Metal Finishing 97, no. 1 (1999): 214–18. http://dx.doi.org/10.1016/s0026-0576(99)80020-8.
Full textCelis, J. P., M. De Bonte, and J. R. Roos. "Electroplating Technology." Transactions of the IMF 72, no. 2 (1994): 89–93. http://dx.doi.org/10.1080/00202967.1994.11871029.
Full textZhang, Qingdong, Mingyang Yu, Boyang Zhang, and Hao Li. "Effect of surface roughness of electroplating chromium coated steel on bonding strength of polymer coated steel." Polymers and Polymer Composites 30 (January 2022): 096739112211021. http://dx.doi.org/10.1177/09673911221102128.
Full textRamya Y. A and Krupanidhi Y. G. "Enhancing aesthetics: Advances in electroplating for decorative applications." World Journal of Advanced Research and Reviews 1, no. 1 (2019): 089–98. https://doi.org/10.30574/wjarr.2019.1.1.0005.1.
Full textSungkowo, Aming, Trikolas Trikolas, Rosyid Ridlo Al Hakim, Slamet Riyadi, Yanuar Zulardiansyah Arief, and Ariep Jaenul. "Material Test Comparison of Pure Aluminum (Al) and Pure Aluminum-Coated (Al) with Silver (Ag) Substrat Using Electroplating Method." ARRUS Journal of Engineering and Technology 1, no. 2 (2021): 40–46. http://dx.doi.org/10.35877/jetech562.
Full textYan, Han Dong. "The Experimental Analyses on the Solidified Effect of Heavy Metals in the Ceramsite Calcined by the Composite Materials of Electroplating Sludge and Seabeach Sludge." Key Engineering Materials 477 (April 2011): 42–48. http://dx.doi.org/10.4028/www.scientific.net/kem.477.42.
Full textPakanna, Adi Aprians, Hendro Maxwell Sumual, Moh Fikri Pomalingo, and Zuldesmi Mansjur. "Karakterisasi Tebal Lapisan Dan Ketahanan Korosi Mild Steel SS400 JIS G3101 Dengan Metode Elektroplating Ni-Cr." Jurnal Mesin Nusantara 7, no. 1 (2024): 63–74. http://dx.doi.org/10.29407/jmn.v7i1.21779.
Full textFauzan Fikrat Winata, Agus Fikri, and M Mujirudin. "Pengaruh Electroplating Krom Terhadap Ketebalan Dan Kekerasan Lapisan Pada Jari-Jari Sepeda Motor Yang Telah Di-Electroplating Nikel." METALIK : Jurnal Manufaktur, Energi, Material Teknik 1, no. 1 (2022): 22–30. http://dx.doi.org/10.22236/metalik.v1i1.8459.
Full textWu, Hai Xia, Chen Lu, Kai Kang, and Yan Hua Xu. "Electroplating Sludge Metal Recovery Technology Resources Research." Applied Mechanics and Materials 443 (October 2013): 684–88. http://dx.doi.org/10.4028/www.scientific.net/amm.443.684.
Full textLiu, Yanwen, Asghar Khan, Zhihua Wang, et al. "Upcycling of Electroplating Sludge to Prepare Erdite-Bearing Nanorods for the Adsorption of Heavy Metals from Electroplating Wastewater Effluent." Water 12, no. 4 (2020): 1027. http://dx.doi.org/10.3390/w12041027.
Full textPutri, Sela Angela, Eko Pujiyanto, and Joko Triyono. "Optimization of Electroplating Thickness Quality at Hip Joint Implant Using the Taguchi Method." Jurnal Teknik Industri 20, no. 1 (2019): 45. http://dx.doi.org/10.22219/jtiumm.vol20.no1.45-52.
Full textLi, Ganglong, Zhiyi Li, Junjie Li, and Houya Wu. "Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating." Nanomaterials 12, no. 10 (2022): 1699. http://dx.doi.org/10.3390/nano12101699.
Full textAlphanoda, Abid Fahreza. "Pengaruh Jarak Anoda-Katoda dan Durasi Pelapisan Terhadap Laju Korosi pada Hasil Electroplating Hard Chrome." Jurnal Teknologi Rekayasa 1, no. 1 (2017): 1. http://dx.doi.org/10.31544/jtera.v1.i1.2016.1-6.
Full textDietrich, D., W. Förster, C. Eßbach, P. Neumann, and D. Nickel. "Selection of carbon particles with different shape, size and concentration as additives in a stereolithographic resin." Materialwissenschaft und Werkstofftechnik 56, no. 1 (2025): 8–16. https://doi.org/10.1002/mawe.202300370.
Full textJiang, Tao, and Huiyong Hu. "Review of Evolution and Rising Significance of Wafer-Level Electroplating Equipment in Semiconductor Manufacturing." Electronics 14, no. 5 (2025): 894. https://doi.org/10.3390/electronics14050894.
Full textSalman, S., I. M. A. Sayoga, I. D. K. Okariawan, S. Sinarep, R. Sutanto, and A. Wiranata. "Pengaruh waktu dan jarak electroplating nikel pada baja karbon rendah terhadap kekerasan permukaan." Dinamika Teknik Mesin 9, no. 1 (2019): 39. http://dx.doi.org/10.29303/dtm.v0i0.251.
Full textLifanteva, Anna, Alsu Yusupova, and Galina Medvedeva. "Air purification from process emissions from electroplating baths." E3S Web of Conferences 274 (2021): 08011. http://dx.doi.org/10.1051/e3sconf/202127408011.
Full textHu, Sheng, Wei Yu, Xiang Gong, and Yuhong Liu. "A Method for Preparing Gallium-nickel Alloy Solid Targets by Alternating Current Plating." Academic Journal of Science and Technology 13, no. 3 (2024): 276–80. https://doi.org/10.54097/n0w8h748.
Full textSchweigmann, Michael, Frank Kirchhoff, and Klaus P. Koch. "Comparative study of platinum electroplating to improve micro gold electrode arrays with LCP laminate." Biomedical Engineering / Biomedizinische Technik 67, no. 1 (2022): 33–42. http://dx.doi.org/10.1515/bmt-2021-0020.
Full textAl Farisi, Muhammad, Silvia Hertel, Maik Wiemer, and Thomas Otto. "Aluminum Patterned Electroplating from AlCl3–[EMIm]Cl Ionic Liquid towards Microsystems Application." Micromachines 9, no. 11 (2018): 589. http://dx.doi.org/10.3390/mi9110589.
Full textSato, Atsushi, and Wataru Natsu. "Theoretical Verification of Film Forming in Local Electroplating Process with Electrolyte Suction Tool." International Journal of Automation Technology 14, no. 6 (2020): 1051–61. http://dx.doi.org/10.20965/ijat.2020.p1051.
Full textZhao, Fei. "Improvement on Fully Filled Through Silicon Vias by Optimized Sputtering and Electroplating Conditions." Materials 12, no. 22 (2019): 3713. http://dx.doi.org/10.3390/ma12223713.
Full textSAITO, Ihoe. "Pretreatment for electroplating." Jitsumu Hyomen Gijutsu 33, no. 8 (1986): 286–93. http://dx.doi.org/10.4139/sfj1970.33.286.
Full textNAKAO, Seiichiro. "AuSn Alloy Electroplating." Journal of The Surface Finishing Society of Japan 69, no. 3 (2018): 112–13. http://dx.doi.org/10.4139/sfj.69.112.
Full textMaeng, Sung-Lyul. "Ancient Electroplating Technology." Asia-pacific Journal of Multimedia services convergent with Art, Humanities, and Sociology 7, no. 7 (2017): 831–38. http://dx.doi.org/10.14257/ajmahs.2017.07.73.
Full textVogt, Holger, Wolfgang Heiermann, and Jennifer Hess. "Electroplating in microsystems." ATZelektronik worldwide 8, no. 2 (2013): 4–8. http://dx.doi.org/10.1365/s38314-013-0153-2.
Full textHirsch, Stanley. "Deionization for electroplating." Metal Finishing 98, no. 1 (2000): 149–53. http://dx.doi.org/10.1016/s0026-0576(00)80320-7.
Full textHirsch, Stanley. "Deionization for electroplating." Metal Finishing 97, no. 1 (1999): 149–53. http://dx.doi.org/10.1016/s0026-0576(00)83071-8.
Full textScott, K. "ELECTROPLATING." A-to-Z Guide to Thermodynamics, Heat and Mass Transfer, and Fluids Engineering e (2006). http://dx.doi.org/10.1615/atoz.e.electrp.
Full textKang, Hyungseok, Joo Sung Kim, Seok-Ryul Choi, et al. "Electroplated core–shell nanowire network electrodes for highly efficient organic light-emitting diodes." Nano Convergence 9, no. 1 (2022). http://dx.doi.org/10.1186/s40580-021-00295-2.
Full text"Electroplating apparatus." Metal Finishing 97, no. 5 (1999): 89–90. http://dx.doi.org/10.1016/s0026-0576(00)80085-9.
Full text"Electroplating process." Metal Finishing 97, no. 10 (1999): 78–79. http://dx.doi.org/10.1016/s0026-0576(00)81069-7.
Full text"Electroplating process." Metal Finishing 97, no. 12 (1999): 81–82. http://dx.doi.org/10.1016/s0026-0576(00)81226-x.
Full text"Electroplating process." Metal Finishing 97, no. 11 (1999): 107–8. http://dx.doi.org/10.1016/s0026-0576(00)82293-x.
Full text"Electroplating process." Metal Finishing 98, no. 8 (2000): 82. http://dx.doi.org/10.1016/s0026-0576(00)82802-0.
Full text"Electroplating barrel." Metal Finishing 97, no. 6 (1999): 157. http://dx.doi.org/10.1016/s0026-0576(00)83968-9.
Full text"Electroplating apparatus." Metal Finishing 97, no. 9 (1999): 125. http://dx.doi.org/10.1016/s0026-0576(01)80513-4.
Full text"Electroplating process." Metal Finishing 99, no. 1 (2001): 115. http://dx.doi.org/10.1016/s0026-0576(01)80683-8.
Full text"Electroplating processes." Metal Finishing 99, no. 5 (2001): 80. http://dx.doi.org/10.1016/s0026-0576(01)80861-8.
Full text"Electroplating machine." Metal Finishing 99, no. 9 (2001): 116. http://dx.doi.org/10.1016/s0026-0576(01)81571-3.
Full text"Electroplating system." Metal Finishing 99, no. 11 (2001): 96. http://dx.doi.org/10.1016/s0026-0576(01)81694-9.
Full text"Electroplating system." Metal Finishing 99, no. 12 (2001): 61. http://dx.doi.org/10.1016/s0026-0576(01)81781-5.
Full text"Electroplating apparatus." Metal Finishing 99, no. 12 (2001): 63. http://dx.doi.org/10.1016/s0026-0576(01)81802-x.
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