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Journal articles on the topic 'Metal grain boundary diffusion'

Author: Grafiati

Published: 4 June 2021

Last updated: 9 February 2022

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1

Niu, Li Sha, and Ting Ting Dai. "Finite Element Study of the Creep Size-Effect in Thin Metal Films." Key Engineering Materials 353-358 (September 2007): 1858–62. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.1858.

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A 2-D Finite element simulation method was developed based on the kinetic law and the energy evolution during the whole process of deformation, which is used to investigate the creep size effects in polycrystalline thin metal film on substrates. Three diffusion paths (e.g. surface, grain boundary and lattice diffusion) are considered in the present model. The diffusion rate for these three processes was compared under different loading conditions with corresponding microstructure. It’s found that grain boundary diffusion is coupled with another diffusion channel. Creep size effects result from

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2

Poletaev, G. M., I. V. Zorya, R. Yu Rakitin, and M. D. Starostenkov. "Effect of light elements impurity atoms on grain boundary diffusion in FCC metals: a molecular dynamics simulation." Izvestiya. Ferrous Metallurgy 62, no. 12 (2020): 930–35. http://dx.doi.org/10.17073/0368-0797-2019-12-930-935.

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Effect of carbon and oxygen impurity atoms on diffusion along the tilt grain boundaries with <100> and <111> misorientation axis in metals with FCC lattice was studied by mean of molecular dynamics method. Ni, Ag, and Al were considered as metals. Interactions of metal atoms with each other were described by many-particle Clery-Rosato potentials constructed within the framework of tight binding model. To describe interactions of atoms of light elements impurities with metal atoms and atoms of impurities with each other, Morse pair potentials were used. According to obtained results

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3

Farzin, Mahmoud, Reza Jafari Nedoushan, and Mohammad Mashayekhi. "Simulation of Hot Sheet Metal Forming Processes Based on a Micro-Structural Constitutive Model." Key Engineering Materials 473 (March 2011): 556–63. http://dx.doi.org/10.4028/www.scientific.net/kem.473.556.

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A constitutive model is proposed for simulations of hot forming processes. Dominant mechanisms in hot forming including inter-granular deformation, grain boundary sliding and grain boundary diffusion are considered in the constitutive model. A Taylor type polycrystalline model is used to predict inter-granular deformation. Previous works on grain boundary sliding and grain boundary diffusion are extended to drive three dimensional macro stress-strain rate relationships for each mechanism. In these relationships, the effect of grain size is also taken into account. It is shown that for grain bo

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4

Kim, B. N., K. Hiraga, and K. Morita. "Viscous grain-boundary sliding and grain rotation accommodated by grain-boundary diffusion." Acta Materialia 53, no. 6 (2005): 1791–98. http://dx.doi.org/10.1016/j.actamat.2004.12.028.

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5

King, A. H. "Diffusion induced grain boundary migration." International Materials Reviews 32, no. 1 (1987): 173–89. http://dx.doi.org/10.1179/095066087790150304.

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6

Gao, H., L. Zhang, W. D. Nix, C. V. Thompson, and E. Arzt. "Crack-like grain-boundary diffusion wedges in thin metal films." Acta Materialia 47, no. 10 (1999): 2865–78. http://dx.doi.org/10.1016/s1359-6454(99)00178-0.

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7

Yang, Y., Tomonrori Kitashima, T. Hara, et al. "Effect of Grain Size on Oxidation Resistance of Unalloyed Titanium." Materials Science Forum 879 (November 2016): 2187–91. http://dx.doi.org/10.4028/www.scientific.net/msf.879.2187.

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The effect of the grain size on the high-temperature oxidation resistance of unalloyed titanium was experimentally investigated using titanium samples with two different grain sizes of 219 μm and 118 μm. The weight gain during oxidation and the penetration depth of oxygen from a metal surface were larger in the small-grain-size sample compared with the large-grain-size sample. In addition, oxygen diffusion was faster in the substrate of the small-grain-size sample. These results were attributed to the grain-boundary diffusion of oxygen. A steep change in the oxygen concentration was observed a

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8

Dolgopolov, Nikolai, A. Petelin, and S. Rakov. "Role of Diffusion as a Control Stage of a Grain Boundary Liquid Grooving." Defect and Diffusion Forum 249 (January 2006): 227–30. http://dx.doi.org/10.4028/www.scientific.net/ddf.249.227.

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The interaction of liquid metals with solid polycrystalline metal leads to the appearance of liquid grooves at grain boundaries. The shapes of these grooves may be of a very wide variety. In this paper the typical features of different liquid grooves are presented, classified and analyzed on the base of our experimental data. The developed models confirm the dominant role of diffusion mechanisms.

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9

Panigrahi, B. B., K. Das, and M. M. Godkhindi. "Dilatometry of ball milled nickel nano powder during non-isothermal sintering." Science of Sintering 39, no. 1 (2007): 25–29. http://dx.doi.org/10.2298/sos0701025p.

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This work attempts to evaluate the sintering mechanisms of ball milled nanocrystalline nickel during nonisothermal heating. Samples showed a sintered density of 91.2% (theoretical) and grain growth up to 414 nm at 1273K. The activation energies of 12.4, 32.0 and 51.6 kJ/mol were found for viscous flow, lattice diffusion and grain boundary diffusion mechanisms respectively. Sintering was found to be controlled by interface reactions involving surface and grain boundary diffusions.

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10

Apyhtina, Irina, Kseniia Kovaleva, Alexander Novikov, Darya Orelkina, Alexander Petelin, and Egor Yakushko. "Diffusion Controlled Grain Boundary and Triple Junction Wetting in Polycrystalline Solid Metal." Defect and Diffusion Forum 363 (May 2015): 127–29. http://dx.doi.org/10.4028/www.scientific.net/ddf.363.127.

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Grain boundary liquid grooving process takes place during the contact of solid phase with the melt. The liquid bismuth network formation along grain boundaries (GBs) and triple junctions (TJs) was investigated in copper polycrystalline samples. The in situ experimental observation technique of Bi penetration through the Cu plate was used. The temperature dependencies of GB and TJ effective penetration depths were determined. The effect of the GB and TJ diffusion on the liquid channels growth mechanism was discussed.

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11

Bokstein, Boris S., S. A. Gulevsky, A. L. Petelin, and A. O. Rodin. "Diffusion Controlled Grain Triple Junctions Wetting in Metals." Defect and Diffusion Forum 309-310 (March 2011): 231–38. http://dx.doi.org/10.4028/www.scientific.net/ddf.309-310.231.

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The interaction between liquid and solid metals where the liquid-solid interface contains three grain boundary lines which meet in triple junction point is considered. The assumption that the liquid grooves may be formed not only along grain boundaries but along triple junctions is presented. The variation of Gibbs energy during the formation of triangle pyramidal groove along triple junction is determined. The dependence of Gibbs energy variation from groove dimensions shows that the wetting of triple junctions occurs by lower temperatures than the wetting of grain boundaries. This result all

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12

He, Jiayi, Jiali Cao, Zhigao Yu, et al. "Grain Boundary Diffusion Sources and Their Coating Methods for Nd-Fe-B Permanent Magnets." Metals 11, no. 9 (2021): 1434. http://dx.doi.org/10.3390/met11091434.

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Nd-Fe-B magnets containing no heavy rare earth (HRE) elements exhibit insufficient coercivity to withstand the demagnetization field at elevated temperatures. The grain boundary diffusion (GBD) process provides the best route to fabricate high-coercive Nd-Fe-B magnets with low consumption of expensive HRE resources. Here we give a special review on the grain boundary diffusion sources and their coating methods. Up to now, various types of grain boundary sources have been developed, starting from the earliest Tb or Dy metal. The HRE-M eutectic alloys were firstly proposed for reducing the cost

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13

Popov, Vladimir V. "Emission Mössbauer Spectroscopy of Grain Boundaries in Poly- and Nanocrystalline Metals." Defect and Diffusion Forum 289-292 (April 2009): 633–40. http://dx.doi.org/10.4028/www.scientific.net/ddf.289-292.633.

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Capabilities of the emission nuclear gamma resonance (NGR) spectroscopy in studying grain boundaries in metals are considered. It is demonstrated that this method enables to evaluate grain-boundary segregation factors, to determine grain-boundary diffusion mechanisms, to estimate an effective diffusion coefficient in near-boundary areas, etc. Besides, this method permits to evaluate quantitatively differences in the properties of grain boundaries of polycrystalline and nanostructured materials.

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14

Tellier, C. R. "Thin Metal Film Sensors." Active and Passive Electronic Components 12, no. 1 (1985): 9–32. http://dx.doi.org/10.1155/1985/17659.

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During the last decade some progress have been made in the field of sensors using thin film techniques. In particular thin metal film strain gauges and thin film temperature sensors based on the temperature dependent resistivity of metal are now commonly used. But changes in other transport parameters with various measurands are also useful for the design of metal film sensors. Difficulty arises in thin film techniques when structural defects are frozen in films.Intensive theoretical investigations are carried out to explain the effect of grain-boundary and external surface scatterings on tran

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15

Popov, V. V., E. V. Osinnikov, S. A. Murzinova, A. V. Stolbovsky, and R. M. Falahutdinov. "Grain Boundary Diffusion of 57Co in Nickel." Journal of Phase Equilibria and Diffusion 41, no. 2 (2020): 132–37. http://dx.doi.org/10.1007/s11669-020-00794-5.

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16

Wang, W. L., Y. T. Chou, and Sanboh Lee. "Chemical stresses induced by grain-boundary diffusion." Metallurgical and Materials Transactions A 29, no. 8 (1998): 2121–25. http://dx.doi.org/10.1007/s11661-998-0037-x.

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17

Onaka, Susumu, Masaharu Kato, and T. Mori. "Reexamination of grain-boundary sliding by diffusion." Metallurgical Transactions A 17, no. 11 (1986): 1949–53. http://dx.doi.org/10.1007/bf02644992.

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18

Beke, Dezső L., A. Lakatos, G. Erdélyi, et al. "Investigation of Grain Boundary Diffusion in Thin Films by SNMS Technique." Defect and Diffusion Forum 312-315 (April 2011): 1208–15. http://dx.doi.org/10.4028/www.scientific.net/ddf.312-315.1208.

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It was shown more recently in our Laboratory [1,2,3] that having a substrate/diffusant/thin-film/cap-layer structure (the thin film was typically several 10 nm thick, with the same order of magnitude of grain size; the refractory metal cap layer was used just to avoid the oxidation), first the diffusant atoms migrated very fast across the thin film and segregated at the film/cap-layer interface. The accumulated atoms at the film/cap layer interface form a secondary diffusion reservoir and atoms diffuse back to the layer. Later on, the thin film was gradually filled up with the diffusing atoms

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19

Rajeshwari K., Sai, S. Sankaran, K. C. Hari Kumar, et al. "Grain boundary diffusion and grain boundary structures of a Ni-Cr-Fe- alloy: Evidences for grain boundary phase transitions." Acta Materialia 195 (August 2020): 501–18. http://dx.doi.org/10.1016/j.actamat.2020.05.051.

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20

Lei, Xianjun, Xiaopeng Wang, Fantao Kong, Haitao Zhou, and Yuyong Chen. "Self-Induced Internal Corrosion Stress Transgranular Cracking in Gradient-Structural Ploycrystalline Materials at High Temperature." Metals 11, no. 9 (2021): 1465. http://dx.doi.org/10.3390/met11091465.

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Self-induced internal corrosion stress transgranular cracking is investigated theoretically and experimentally linking grain boundary wetting (GBW) and grain boundary diffusion (GBD) to improve the ability to reveal the micro mechanism of crack in compositional gradient-structural intermetallic materials. Theoretical analysis shows that the grain boundary wetting and diffusion induce the diffusion-coupled dynamic internal stresses, and their interaction leads to crack nucleation. The experimental results show a stress concentration zone have been established at the grain boundary interface whe

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21

Koju, R. K., and Y. Mishin. "Atomistic study of grain-boundary segregation and grain-boundary diffusion in Al-Mg alloys." Acta Materialia 201 (December 2020): 596–603. http://dx.doi.org/10.1016/j.actamat.2020.10.029.

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22

Akano, U. G., D. A. Thompson, W. W. Smeltzer, and J. A. Davies. "Ion-beam mixing of Ni/Pd layers: II. Thermally assisted regime (>500K)." Journal of Materials Research 3, no. 6 (1988): 1063–71. http://dx.doi.org/10.1557/jmr.1988.1063.

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Atomic mixing in Ni/Pd bilayer films due to 120 keV Ar+ irradiation in the thermally assisted regime (523−673 K) has been measured, in situ, using Rutherford backscattering with 2.0 MeV 4He+ ions. The mean diameter of grains in these polycrystallinc films increased from 10 to 60 nm, following Ar+ bombardment at 573 K. Initial mixing was rapid due to grain boundary diffusion and incorporation of the metal solute into the solvent metal matrix by grain growth; this mixing stage was essentially complete within 10 min for annealed films or after an Ar+ dose of 4 × 1015 cm−2 in irradiated films (10

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23

Zhang, Jiarui, Fan Yang, Yaping Liu, Zheng Zhong, and Jinfeng Zhao. "On the deformation-induced grain rotations in gradient nano-grained copper based on molecular dynamics simulations." Nanotechnology Reviews 10, no. 1 (2021): 87–98. http://dx.doi.org/10.1515/ntrev-2021-0010.

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Abstract In this paper, the mechanical behavior of gradient nano-grained copper under uniaxial deformation was investigated using molecular dynamics simulations. The stress response was found to be different in the regions with different grain sizes, which was attributed to the different dislocation activities due to the dislocation-grain boundary synergies. The phenomenon of grain rotation was observed and a program was developed to accurately evaluate the grain rotation and explore its dependence on the grain size and the initial crystal orientation. It is found that all grains tend to rotat

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24

Dekhtyaruk, Leonid. "Influence of interdiffusion on the electrical conductivity of multilayered metal films." Open Physics 4, no. 1 (2006): 73–86. http://dx.doi.org/10.1007/s11534-005-0007-5.

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AbstractThe annealing-time dependence of the electrical conductivity of multilayered single-crystal and polycrystalline metal films has been analyzed theoretically within the frame of the semi-classical approach. It is demonstrated that changes in the electrical conductivity which are caused by the diffusion annealing allow for investigating the processes of the bulk and grain-boundary diffusion, and for estimating the coefficients of the diffusion. The electrical conductivity was calculated and the numerical analysis of the diffusion-annealing time dependence was performed at various paramete

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25

Aleshin, A. N. "Role of grain-boundary diffusion in the grain growth in nanocrystalline nickel." Russian Metallurgy (Metally) 2008, no. 4 (2008): 286–93. http://dx.doi.org/10.1134/s0036029508040034.

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26

Randjelovic, B., K. Shinagawa, and Z. S. Nikolic. "A mathematical approach to Ostwald ripening due to diffusion and deformation in liquid bridge." Science of Sintering 45, no. 3 (2013): 261–71. http://dx.doi.org/10.2298/sos1303261r.

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From many experiments with mixtures of small and large grains, it can be concluded that during liquid phase sintering, smaller grains partially dissolve and a solid phase precipitates on the larger grains and grain coarsening occurs. The growth rate can be controlled either by the solid-liquid phase boundary reaction or by diffusion through the liquid phase. The microstructure may change either by larger grains growing during the Ostwald ripening process or by shape accommodation. In this study, two-dimensional mathematical approach for simulation of grain coarsening by grain boundary migratio

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27

Novikov, A. A., A. L. Petelin, Boris S. Bokstein, S. N. Zhevnenko, and D. I. Orelkina. "The Formation of Liquid Metal Channels Network under Grain Boundary Wetting in the Cu-Bi System." Defect and Diffusion Forum 323-325 (April 2012): 177–81. http://dx.doi.org/10.4028/www.scientific.net/ddf.323-325.177.

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Grain boundary liquid grooving process takes place during the contact of solid metal phase with the metal melt. The liquid bismuth network formation along grain boundaries (GB) and triple junctions (TJ) was investigated in copper polycrystalline samples. The experimental observation in situ technique of Bi penetration through the Cu plate was used. Microscopic images of the liquid channels network were obtained. The temperature dependencies of GB and TJ effective penetration depths were determined. The effect of the GB and TJ diffusion on the liquid channels growth mechanism was discussed.

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28

Klinger, Leonid, and Eugen Rabkin. "Kirkendall Effect during Grain Boundary Interdiffusion in Polycrystalline Thin Films." Defect and Diffusion Forum 323-325 (April 2012): 49–54. http://dx.doi.org/10.4028/www.scientific.net/ddf.323-325.49.

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We consider the kinetics of chemical interdiffusion along the grain boundaries in stressed thin metal film attached to inert substrate. We show that the kinetics of stress relaxation in the film can be either accelerated or slowed down if compared with the same kinetics in a single-component film, depending on the difference of intrinsic GB diffusion coefficients of the two components. In the case of faster matrix atoms the tensile stress in the film significantly increases beyond its initial value at the beginning of interdiffusion process, while in the case of faster diffuser atoms the compr

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29

Qian, X. R., and Y. T. Chou. "Grain boundary diffusion of chromium in niobium bicrystals." Philosophical Magazine A 52, no. 2 (1985): L13—L18. http://dx.doi.org/10.1080/01418618508237612.

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30

Jahn, R. J., and A. H. King. "Vacancy deposition during diffusion-induced grain boundary migration." Philosophical Magazine A 54, no. 1 (1986): L3—L7. http://dx.doi.org/10.1080/01418618608242872.

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31

Mishin, Yuri. "Calculation of diffusion coefficients and correlation factors in grain-boundary diffusion." Philosophical Magazine A 72, no. 6 (1995): 1589–607. http://dx.doi.org/10.1080/01418619508243932.

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32

Rodin, Alexey, Nikolai Dolgopolov, and Sergei Kryukov. "Grain Boundary Diffusion. Effect of Segregation or Concentration Dependence of Diffusivity." Defect and Diffusion Forum 323-325 (April 2012): 165–70. http://dx.doi.org/10.4028/www.scientific.net/ddf.323-325.165.

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Effect of microalloying of Al by Ce on Cu grain boundary diffusion (GBD) in Al and other results of GBD study in metals with different purity were analyzed. It is shown that in dependence on the chemical composition of the matrix the triple product of GB diffusion can be higher or less than that for pure metals. The main concept used for description of the results is local ordering of the atoms (including atomic complex formation and appearance of «poisonous» places around atoms of the alloying element). The increasing of atom mobility at GB is discussed also in terms of solidus temperature ch

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33

Hashimoto, R. Y., E. S. K. Menon, and A. G. Fox. "Segregation of Silicon in Metal-Alumina Composites." Microscopy and Microanalysis 5, S2 (1999): 624–25. http://dx.doi.org/10.1017/s1431927600016445.

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A common impurity in polycrystalline commercial alumina is Si since silica is often added as a sintering aid. There have been several studies on impurities in alumina, and substantial degree of grain boundary segregation has been found to occur. Alumina-metal composites have found several applications especially in the electronic industry and consequently systems such as alumina-copper have been studied exhaustively. However, the role of impurities in metal-alumina composites has not been fully explored. Studies of Pt-alumina composites has shown that silicon is present at the interface of vac

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34

Zhang, Yuanheng, Kai Ding, Guanzhi Wu, et al. "Aging-induced formation of the nano-sized clustered carbides in the weld metal of Co-based alloy/AISI 410 stainless steel dissimilar welded joint." Metallurgical Research & Technology 117, no. 4 (2020): 402. http://dx.doi.org/10.1051/metal/2020033.

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The microstructure evolution in Co-based alloy/AISI 410 stainless steel dissimilar welded joints by aging at 566 °C for 200, 400, 600, and 800 h was systematically investigated. In particular, the specimen aging treated for 800 h was emphasized in the present study for its nano-sized clustered characteristic microstructure. The results showed that the microstructure of the weld metal (WM) was mainly γ-Co matrix with dendritic morphology. Before aging treatment, the elements Cr and W segregated slightly in the interdendritic regions. Nevertheless, a large amount of nano-sized clustered carbides

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35

Dohie, Jonathan S., J. R. Cahoon та W. F. Caley. "The Grain-Boundary Diffusion of Zn in α-Fe". Journal of Phase Equilibria and Diffusion 28, № 4 (2007): 322–27. http://dx.doi.org/10.1007/s11669-007-9093-y.

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36

Lee, M. W., K. H. Bae, S. R. Lee, H. J. Kim, and T. S. Jang. "Microstructure and Magnetic Properties of NdFeB Sintered Magnets Diffusion-Treated with Cu/Al Mixed Dyco Alloy-Powder." Archives of Metallurgy and Materials 62, no. 2 (2017): 1263–66. http://dx.doi.org/10.1515/amm-2017-0189.

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AbstractWe investigated the microstructural and magnetic property changes of DyCo, Cu + DyCo, and Al + DyCo diffusion-treated NdFeB sintered magnets. The coercivity of all diffusion treated magnet was increased at 880ºC of 1stpost annealing(PA), by 6.1 kOe in Cu and 7.0 kOe in Al mixed DyCo coated magnets, whereas this increment was found to be relatively low (3.9 kOe) in the magnet coated with DyCo only. The diffusivity and diffusion depth of Dy were increased in those magnets which were treated with Cu or Al mixed DyCo, mainly due to comparatively easy diffusion path provided by Cu and Al be

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37

Poletaev, G. M., I. V. Zorya, and M. D. Starostenkov. "Role of point defects in self-diffusion along low-angle twist boundaries in fcc metals: A molecular dynamics study." Journal of Micromechanics and Molecular Physics 03, no. 01n02 (2018): 1850001. http://dx.doi.org/10.1142/s2424913018500017.

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The interaction of point defects with low-angle (100), (110) and (111) twist boundaries in fcc metals Ni, Cu, Al and role of the point defects in self-diffusion along considered boundaries were studied by the molecular dynamics method. The binding energies of point defects with low-angle twist boundaries were calculated. It was found that the point defects are mainly fixed in the nodes of grain-boundary screw dislocations network. It was shown that the introduced vacancies play an important role in diffusion along twist grain boundaries. The contribution of introduced interstitial atoms to gra

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38

Geise, Jürgen, and Christian Herzig. "Lattice and Grain Boundary Diffusion of Niobium in Iron." International Journal of Materials Research 76, no. 9 (1985): 622–26. http://dx.doi.org/10.1515/ijmr-1985-760907.

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39

Zeng, H. X., Z. W. Liu, J. S. Zhang, X. F. Liao, and H. Y. Yu. "Towards the diffusion source cost reduction for NdFeB grain boundary diffusion process." Journal of Materials Science & Technology 36 (January 2020): 50–54. http://dx.doi.org/10.1016/j.jmst.2019.08.009.

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40

Divinski, Sergiy, Jens Ribbe, Guido Schmitz, and Christian Herzig. "Grain boundary diffusion and segregation of Ni in Cu." Acta Materialia 55, no. 10 (2007): 3337–46. http://dx.doi.org/10.1016/j.actamat.2007.01.032.

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41

Ribbe, Jens, Vladimir A. Esin, and Sergiy V. Divinski. "Grain boundary diffusion of 59Fe in high-purity copper." Acta Materialia 165 (February 2019): 431–43. http://dx.doi.org/10.1016/j.actamat.2018.11.060.

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42

Du, Ningning, Yue Qi, Paul E. Krajewski та Allan F. Bower. "Aluminum Σ3 grain boundary sliding enhanced by vacancy diffusion". Acta Materialia 58, № 12 (2010): 4245–52. http://dx.doi.org/10.1016/j.actamat.2010.04.016.

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43

Gao, Y., J. Jia, R. E. Loehman, and K. G. Ewsuk. "Transmission electron microscopy study of Al/Al2O3 composites fabricated by reactive metal infiltration." Journal of Materials Research 10, no. 5 (1995): 1216–25. http://dx.doi.org/10.1557/jmr.1995.1216.

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The microstructure of Al/α-Al2O3 composites made by infiltrating molten Al into dense mullite preforms has been characterized using transmission electron microscopy. The growth of the Al/Al2O3 composites was found to proceed through three stages. Initially, Al infiltrates into a dense mullite preform through grain boundary diffusion, and reacts with mullite at grain boundaries to form a partial reaction zone. Then, a complete reaction takes place in the reaction region between the partial reaction zone and the full reaction zone to convert the dense mullite preform to a composite of α-Al2O3 (m

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44

Alpe´rine, S., and L. Lelait. "Microstructural Investigations of Plasma-Sprayed Yttria Partially Stabilized Zirconia TBC (In Relation to Thermomechanical Resistance and High-Temperature Oxidation Mechanisms)." Journal of Engineering for Gas Turbines and Power 116, no. 1 (1994): 258–65. http://dx.doi.org/10.1115/1.2906802.

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This study deals with microstructural investigations of plasma-sprayed yttria partially stabilized zirconia thermal barrier coatings, performed by classical and analytical transmission electron microscopy. The aim of the study was to determine eventual relationships between coating microstructure and toughness. The ceramic/metal interface, which plays an important role during TBC thermomechanical solicitation, has also been studied. In the 6–8 wt. percent Y2O3 range, the metastable tetragonal t′ phase is observed, showing special faulted microstructural features, such as grain twinning and ant

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45

Erdélyi, Z., Christophe Girardeaux, Jean Bernardini, Dezső L. Beke, and Andree Rolland. "Experimental and Theoretical Study of Type-C Grain Boundary and Volume Diffusion by AES in Metal/Metal Structures." Defect and Diffusion Forum 194-199 (April 2001): 1161–66. http://dx.doi.org/10.4028/www.scientific.net/ddf.194-199.1161.

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46

Sabioni, A. C. S., A. M. Huntz, F. Millot, and C. Monty. "Self-diffusion in cr2o3III. Chromium and oxygen grain-boundary diffusion in polycrystals." Philosophical Magazine A 66, no. 3 (1992): 361–74. http://dx.doi.org/10.1080/01418619208201562.

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47

Istomina, A. Yu, and E. V. Osinnikov. "ANALYSIS USING ELECTROLYTIC LAYER STRIPPING TO DETERMINE THE PARAMETERS OF GRAIN-BOUNDARY DIFFUSION OF COBALT IN POLYCRYSTALLINE NICKEL." Bulletin of the South Ural State University series "Mathematics. Mechanics. Physics" 12, no. 4 (2020): 62–69. http://dx.doi.org/10.14529/mmph200407.

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A technique for layer-by-layer radiometric analysis using electrolytic layer stripping to determine the parameters of grain-boundary diffusion of cobalt in polycrystalline nickel has been developed. The aim of the work is to develop a complete technological cycle of layer-by-layer radiometric analysis, to select the optimal electrolyte composition for nickel and the conditions for conducting an experiment to remove metal layers with their thickness of 20–200 nm. The studies have been carried out on nickel of nominal purity of 99,98 %. The stabilizing heat treatment of the samples is carried ou

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Shveykin, Alexey, Peter Trusov, and Elvira Sharifullina. "Statistical Crystal Plasticity Model Advanced for Grain Boundary Sliding Description." Crystals 10, no. 9 (2020): 822. http://dx.doi.org/10.3390/cryst10090822.

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Grain boundary sliding is an important deformation mechanism, and therefore its description is essential for modeling different technological processes of thermomechanical treatment, in particular the superplasticity forming of metallic materials. For this purpose, we have developed a three-level statistical crystal plasticity constitutive model of polycrystalline metals and alloys, which takes into account intragranular dislocation sliding, crystallite lattice rotation and grain boundary sliding. A key advantage of our model over the classical Taylor-type models is that it also includes a con

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Haslam, A. J., V. Yamakov, D. Moldovan, D. Wolf, S. R. Phillpot, and H. Gleiter. "Effects of grain growth on grain-boundary diffusion creep by molecular-dynamics simulation." Acta Materialia 52, no. 7 (2004): 1971–87. http://dx.doi.org/10.1016/j.actamat.2003.12.048.

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Gignac, L. M., and K. P. Rodbell. "Metal Microstructures in Advanced CMOS Devices." Proceedings, annual meeting, Electron Microscopy Society of America 54 (August 11, 1996): 358–59. http://dx.doi.org/10.1017/s0424820100164258.

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As advanced semiconductor device features shrink, grain boundaries and interfaces become increasingly more important to the properties of thin metal films. With film thicknesses decreasing to the range of 10 nm and the corresponding features also decreasing to sub-micrometer sizes, interface and grain boundary properties become dominant. In this regime the details of the surfaces and grain boundaries dictate the interactions between film layers and the subsequent electrical properties. Therefore it is necessary to accurately characterize these materials on the proper length scale in order to f

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