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Relevant bibliographies by topics / Package materials / Dissertations / Theses

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Dissertations / Theses on the topic 'Package materials'

Author: Grafiati

Published: 30 May 2022

Last updated: 31 July 2025

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1

Miranda, Michael Angelo. "Bio Based Active Barrier Materials and Package Development." University of Toledo / OhioLINK, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1483450387453053.

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2

Simonson, Scott A. "Modeling of radiation effects on nuclear waste package materials." Thesis, Massachusetts Institute of Technology, 1988. http://hdl.handle.net/1721.1/36921.

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3

Abdi, Fatwa Firdaus. "Technology and market analysis of standard electronic photonic package." Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/37686.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006.<br>Includes bibliographical references (leaves 65-66).<br>Electronic industry will suffer a major turn around in the near future. The current infrastructure will no longer be able to support the increasing data rates. All the disadvantages of copper as current legacy are amplified with the level of bandwidth we are going to experience soon. On the other hand, photonic industry is in the need of finding a new demand source to be able to bring back the state of industry to the "boom" era. W

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4

Hara, Débora Harumi Suzuki. "Seleção de materiais para embalado de transporte de Mo-99." Universidade de São Paulo, 2015. http://www.teses.usp.br/teses/disponiveis/85/85134/tde-18082015-092143/.

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O transporte de materiais radioativos deve ser realizado em embalados capazes de suportar tanto condições normais, quanto acidentais de transporte. O objetivo deste trabalho foi a seleção de materiais que possam viabilizar a fabricação de um embalado para o transporte de substâncias que sejam fontes de alta radioatividade, em especial o Mo-99, cujo produto do decaimento radioativo é o Tc-99m, utilizado para fins diagnósticos na medicina nuclear. Para tanto, foi realizada a seleção dos possíveis materiais que podem ser utilizados para a fabricação de um embalado, com o auxílio do programa CES E

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5

Cole, David Andrew. "Towards the rational design of materials : the development of an integrated software package." Thesis, University of Surrey, 1992. http://epubs.surrey.ac.uk/843606/.

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6

Koh, Sau W. "Fatigue modeling of nano-structured chip-to-package interconnections." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/28263.

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Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2009.<br>Committee Chair: Rao R. Tummala; Committee Co-Chair: Ashok Saxena; Committee Member: Karl Jacob; Committee Member: Suresh Sitaraman; Committee Member: Thomas H. Sanders, Jr.

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7

Liu, Jin. "Zno nanowires for sensing and power generation for system-on-package technology." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26638.

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Thesis (Ph.D)--Electrical and Computer Engineering, Georgia Institute of Technology, 2009.<br>Committee Chair: Tummala, Rao; Committee Co-Chair: Wang, Zhong Lin; Committee Member: Brand, Oliver; Committee Member: Chang, Gee-Kung; Committee Member: Ghovanloo, Maysam; Committee Member: Wong, Ching-Ping. Part of the SMARTech Electronic Thesis and Dissertation Collection.

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8

Ray, Atris A. III. "Analytical and experimental analysis of heat transfer from current microelectronics package designs." Diss., Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/19147.

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9

Paydenkar, Chetan S. "Flip chip assembly process development, process characterization, and reliability assessment of polymer stud grid array-chip scaled package." Thesis, Georgia Institute of Technology, 2001. http://hdl.handle.net/1853/19141.

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10

Dalmia, Sidharth. "Design and implementation of high-Q passive devices for wireless applications using System-On-Package (SOP) based organic technologies." Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/15689.

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11

Norman, Susan K. "Design of a simulation package for automated guided vehicle systems." Ohio : Ohio University, 1985. http://www.ohiolink.edu/etd/view.cgi?ohiou1184071588.

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12

Aggarwal, Ankur. "Chip-Package Nano-Structured Copper and Nickel Interconnections with Metallic and Polymeric Bonding Interfaces." Diss., Georgia Institute of Technology, 2006. http://hdl.handle.net/1853/14096.

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With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnect

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13

Malík, Jiří. "Design kapotáže studentské formule." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2014. http://www.nusl.cz/ntk/nusl-231733.

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Diplomová práce pojednává o návrhu kapotáže vozidla Formula Student. Vozy této kategorie se každoročně učástní série mezinárodních závodů všech zůčastněných studentských týmů. Úroveň návrhu se posuzuje jak v dynamických tak ve statických disciplínách. Tato práce popisuje proces návrhu tří koncepčních variant společně s rozpracováním finální varianty pro fázi výroby. Navíc je zde prezentován koncept obsahující aerodynamický paket, který slouží jako výhledová studie možného vývoje vozidla.

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14

Islam, Md Shafiqul. "Shear Fracture and Delamination in Packaging Materials : A study of Experimental Methods and Simulation Techniques." Licentiate thesis, Blekinge Institute of Technology, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:bth-13340.

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Packages are the means of preservation, distribution and convenience of use for food, medicine and other consumer products. Package opening is becoming complicated in many cases because of cutting cost in design and production of opening techniques. Introduction of new package opening technique, material or geometry for better opening experience, forces new design measurements which require a large number of prototype developments and physical testing. In order to achieve more rapid and accurate design, Finite Element Method (FEM) Simulations are widely used in packaging industries to complime

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15

Барковська, Тетяна, та Ганна Рибковська. "Особливості дизайн-проектування засобів захисту рук". Thesis, Київський національний університет технологій та дизайну, 2018. https://er.knutd.edu.ua/handle/123456789/10393.

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Запропоновано підходи до дизайн-проектування засобів захисту рук – рукавичок спеціальних для пожежників трьох рівнів захисту.<br>Approaches to the design of personal protective equipment for hands - gloves special for firefighters of three levels of protection are suggested.

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16

Margaritis, Georgios. "Thermomechanical effects in electronic packages." Thesis, Massachusetts Institute of Technology, 1994. http://hdl.handle.net/1721.1/12250.

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17

Li, Liangliang. "Nanogranular soft magnetic material and on-package integrated inductors /." May be available electronically:, 2007. http://proquest.umi.com/login?COPT=REJTPTU1MTUmSU5UPTAmVkVSPTI=&clientId=12498.

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18

Maccaferri, Cristian. "Valorization and recycling of raw materials through a waste management system, case of study Koinonia Community, Lusaka, Zambia." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2017. http://amslaurea.unibo.it/13571/.

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This thesis presents the implementation and the optimization of a waste management system (WMS) in the Koinonia community (that is sited in the Chilanga district near Lusaka), showing the challenges that must be faced, implementing a WMS in a developing country. In the first part of the thesis it will be contextualized the waste management in the Zambian economy showing how a diversification involving the it could fit with the needs of the Nation. In the second part it will be treated the waste management hierarchy through the illustration of some European policies (like Circular Economy Packa

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19

Chong, Iok Tong. "Steam driven delamination in electronics packages /." View Abstract or Full-Text, 2002. http://library.ust.hk/cgi/db/thesis.pl?MECH%202002%20CHONG.

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20

Liu, Lilin. "Materials science in pre-plated leadframes for electronic packages /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20LIUL.

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21

Allgulander, Jenny. "Consumer benefits of mechano-active packages." Thesis, Malmö högskola, Teknik och samhälle, 2010. http://urn.kb.se/resolve?urn=urn:nbn:se:mau:diva-20412.

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Genom sin forskning har Innventia lyckats uppfinna ett mekano-aktivt (rörligt) papper. Syftet med mitt arbete var att göra en studie av konsumentfördelarna med mekano-aktiva förpackningar, vilket skulle leda till framtagning av koncept eller prototyper baserade på konsumentfördelarna. Studien är utförd åt Innventia, för att bistå dem i deras fortsatta arbete med att ta fram mekano-aktiva förpackningar baserade på verkliga konsumentbehov.Studien genomfördes med hjälp av att tre fokusgrupper svarade på en enkät och deltog i workshops. Fokusgrupperna var indelade i följande kategorier: ungdomar,

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22

Harries, Richard. "Process modeling and interfacial delamination in peripheral array packages." Thesis, Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/16622.

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23

Guzek, John S. (John Stephen). "Fatigue crack propagation along polymer-metal interfaces in microelectronic packages." Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/41401.

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24

Moosa, Naina Mohamed Lebbai. "Improvement of interfacial adhesion in plastic packages--dimples, metallic coatings and black oxide /." View Abstract or Full-Text, 2002. http://library.ust.hk/cgi/db/thesis.pl?MECH%202002%20MOOSA.

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25

Fan, Haibo. "A multi-scale method for the prediction of delamination in electronic packages /." View abstract or full-text, 2005. http://library.ust.hk/cgi/db/thesis.pl?MECH%202005%20FAN.

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26

Tang, Chi Wang. "Properties and selection of materials for flip chip packages with low-K die /." View abstract or full-text, 2007. http://library.ust.hk/cgi/db/thesis.pl?MECH%202007%20TANG.

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27

Batra, Ashish. "Stress relieving technique for plastic packages in a high volume manufacturing environment." Diss., Online access via UMI:, 2009.

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Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009.<br>Includes bibliographical references.

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28

Seyis, Onder. "Development Of An Algorithm For Material Selection." Master's thesis, METU, 2005. http://etd.lib.metu.edu.tr/upload/12606020/index.pdf.

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Material selection is one of the major points that should be taken into account seriously in the engineering design stage. Each material has various properties such as mechanical, thermal, electrical, physical, environmental, optical and biological properties. However, it is a well known fact that only a limited number of design engineers have a thorough knowledge on all these properties of a specific material, which is planned to be used in the manufacturing of the product. Therefore, the design engineer should be guided in selecting the most suitable material. In the scope of this thesis, th

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29

Slade, J. Morgan. "Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction." Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/40221.

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30

Zhang, Kai. "Carbon nanotube thermal interface material and its application in high brightness LED packages /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?MECH%202008%20ZHANG.

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31

Yeo, Hyunwook. "Stress Analysis for Chip Scale Packages with Embedded Active Devices under Thermal Cycling." PDXScholar, 2014. http://pdxscholar.library.pdx.edu/open_access_etds/1782.

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One of the main challenges in the electronics manufacturing and packaging development is how to integrate more functions inside the same or even smaller size. To meet the demand for higher integration, the interest toward passive and active component embedding has been increasing during the past few years. One of the main reasons for the growing interest toward embedded active components, in addition to demand for higher packaging density, is the need for better electrical performance of the component assemblies. However, it is little known how embedded IC and passives affect the reliability o

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32

Krist, Michael S. "The Design and Manufacture of a Light Emitting Diode Package for General Lighting." DigitalCommons@CalPoly, 2010. https://digitalcommons.calpoly.edu/theses/255.

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Lighting technologies have evolved over the years to become higher quality, more efficient sources of light. LEDs are poised to become the market standard for general lighting because they are the most power efficient form of lighting and do not contain hazardous materials. Unfortunately, LEDs pose unique problems because advanced thermal management is required to remove the high heat fluxes generated by such relatively small devices. These problems have already been overcome with complex packaging and exotic materials, but high costs are preventing this technology from displacing current l

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33

Kay, Norman R. "A combined experimental and analytical approach for interface fracture parameters between dissimilar materials in electronic packages." Diss., The University of Arizona, 2003. http://hdl.handle.net/10150/289886.

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Failure of materials and interfaces are commonly linked to the fracture parameters such as the stress intensity factors and the energy release rate. However, there exists no experimental procedure for the direct measurement of these fracture parameters. This dissertation reports on the development of a new technique to obtain these parameters by testing specimens created from post-production electronic packages. The results from the experimental testing are then used as the input for an analytical model which computes the desired parameters. The specimens are thin strips of post production ele

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34

Altunyurt, Nevin. "Integration and miniaturization of antennas for system-on-package applications." Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/33903.

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Wireless communications have been an indispensable aspect of everyday life, and there is an increasing consumer demand for accessing several wireless communication technologies from a single, compact, mobile device. System-on-package (SOP) technology is an advanced packaging technology that has been proven to realize the convergence of multiple functions into miniaturized, high-performance systems to meet this demand. With the advancements in the SOP technology, the miniaturization of the front-end module has been achieved using embedded passives in multilayer packages. However, the integratio

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35

Gao, Jie, Zhibo Pang, Qiang Chen, and Li-Rong Zheng. "Interactive Packaging Solutions Based on RFIDTechnology and Controlled Delamination Material." KTH, Elektroniksystem, 2010. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-50193.

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Interactive packaging is an emerging research area in recent years. It brings people convenient and smart lives, reduces consumption of traditional packaging materials and direct or indirect labor costs as well. Being integrated in interactive packaging, Radio Frequency Identification (RFID) technology becomes one of the most proactive development enablers. In this paper, an interactive and intelligent packaging solution integrating passive RFID system and Controlled Delamination Material (CDM) is given at first. Package opening action is electrically controlled by the RFID system. CDM is prim

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36

Borges, Daliana Gomes. "Aproveitamento de embalagens cartonadas em compósito de polietileno de baixa densidade." Universidade de São Paulo, 2007. http://www.teses.usp.br/teses/disponiveis/3/3133/tde-08012008-110235/.

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A produção de materiais plásticos tem se elevado para 169 milhões de toneladas no mundo, no ano de 2003. Uma parte considerável destes polímeros sintéticos, 36% na Europa são destinados ao setor de embalagens. Estas matérias primas são utilizadas por um período de tempo bastante curto e geram um volume de descartes importante. Mesmo com um desenvolvimento considerável de linhas de gestão dos descartes, seu tratamento e sua eliminação colocam ainda problemas provenientes da dificuldade em reutilizar tais embalagens na forma em que são geradas, seja pelo estado de limpeza em que são descartadas,

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37

Otiaba, Kenny C. "Thermal and thermo-mechanical performance of voided lead-free solder thermal interface materials for chip-scale packaged power device." Thesis, University of Greenwich, 2013. http://gala.gre.ac.uk/11391/.

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The need to maximise thermal performance of electronic devices coupled with the continuing trends on miniaturization of electronic packages require innovative package designs for power devices and modules such as Electronic Control Unit (ECU). Chip scale packaging (CSP) technology offer promising solution for packaging power electronics. This is as a result of the technologyÃ¢â‚¬â„¢s relatively improved thermal performance and inherent size advantage. In CSP technology, heat removal from the device could be enhanced through the backside of the chip. Heat dissipating units such as heat spreader

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Stephenson, Edward. "Stephenson enterprises: a business plan." Thesis, Kansas State University, 2008. http://hdl.handle.net/2097/4604.

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Master of Agribusiness<br>Department of Agricultural Economics<br>Michael W. Woolverton<br>A business plan serves two main functions: One is to provide a set of guidelines and expectations for running the business and the other would be to request funding from either a traditional or non-traditional lending source. Most business plans consist of the executive summary, business description, market analyses, management team, operations, and financial projections. Stephenson Enterprises is in the process of obtaining funding for a start-up business that will manufacture a biodegradable low cost

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Brum, Tarcisio Costa. "Sistema de Engenharia Kansei para seleção de alternativas de embalagens com critérios sustentáveis de materiais." Universidade Federal de Juiz de Fora, 2016. https://repositorio.ufjf.br/jspui/handle/ufjf/2228.

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Submitted by Renata Lopes (renatasil82@gmail.com) on 2016-07-26T15:25:25Z No. of bitstreams: 1 tarcisiocostabrum.pdf: 3061080 bytes, checksum: 786015eb55b5406d7b4371d7929b36c7 (MD5)<br>Approved for entry into archive by Adriana Oliveira (adriana.oliveira@ufjf.edu.br) on 2016-07-27T11:29:55Z (GMT) No. of bitstreams: 1 tarcisiocostabrum.pdf: 3061080 bytes, checksum: 786015eb55b5406d7b4371d7929b36c7 (MD5)<br>Made available in DSpace on 2016-07-27T11:29:55Z (GMT). No. of bitstreams: 1 tarcisiocostabrum.pdf: 3061080 bytes, checksum: 786015eb55b5406d7b4371d7929b36c7 (MD5) Previous issue date:

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Stöhr, Neda, and Benjamin Baudrit. "Einflüsse der Materialzusammensetzung auf die Schweißeignung von PLA-Folien." Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2015. http://nbn-resolving.de/urn:nbn:de:bsz:14-qucosa-163696.

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Verpackungen sind aus unserem täglichen Leben nicht mehr wegzudenken. Sie tragen durch ihre Schutzfunktion zum Erhalt der Produktqualität bei, ermöglichen eine effektive Logistik und minimieren die Kosten in der Lieferkette. Der aktuell am weitesten verbreitete Kunststoff aus nachwachsenden Rohstoffen (Biokunststoff) ist Polymilchsäure (PLA, englisch polylactic acid).

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41

Onggar, Toty, Gosbert Amrhein, Anwar Abdkader, Rolf-Dieter Hund, and Chokri Cherif. "Wet-chemical method for the metallization of a para-aramid filament yarn wound on a cylindrical dyeing package." Sage, 2017. https://tud.qucosa.de/id/qucosa%3A35530.

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High-performance yarns such as aramid fibers are nowadays used to reinforce composite materials due to their advantageous physico-chemical properties and their low weight. They are also resistant to heat and fire. Para-aramid filament yarns (p-AFs) wound on a cylindrical dyeing package have been silvered successfully by means of a newly developed wetchemical filament yarn metallization process on a laboratory scale. The surface morphology of untreated and silvered p-AF was determined by means of scanning electron microscopy. The chemical structure of the surfaces (contents of carbon, oxygen, n

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Hamdani, Hamid. "Métamodèles pour l’étude fiabiliste des systèmes mécatroniques Métamodélisation pour une conception robuste des systèmes mécatroniques Reliability analysis of tape based chip-scale packages based metamodel Optimization of solder joints in embedded mechatronic systemsvia Kriging-assisted CMA-ES algorithm Metamodel assisted evolution strategies for global optimization of solder joints reliability in embedded mechatronic devices." Thesis, Normandie, 2019. http://www.theses.fr/2019NORMIR12.

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Les défaillances des systèmes mécatroniques sont souvent causées par la rupture par fatigue des joints de brasure de ses composants électroniques. Avec la miniaturisation croissante des boîtiers électroniques, la sollicitation des joints de brasure, qui assurent la liaison entre les sorties du composant et la carte, peut devenir problématique. En effet, les joints de brasures peuvent accepter des taux de déformation importants, mais une accumulation des sollicitations répétées provoquent leur vieillissement prématuré pouvant conduire à la rupture de joints brasés (phénomène de fatigue thermomé

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Pinto, Lilian Antunes. "Compósitos de PEBD com fibras de papel reciclado de embalagens cartonadas longa vida." UNIVERSIDADE ESTADUAL DE PONTA GROSSA, 2013. http://tede2.uepg.br/jspui/handle/prefix/1447.

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Made available in DSpace on 2017-07-21T20:42:44Z (GMT). No. of bitstreams: 1 Lilian Antunes Pinto.pdf: 4311313 bytes, checksum: 37bf9ac00a3449c626d1f5d990c0a36a (MD5) Previous issue date: 2013-07-30<br>Search new recycling ways and new materials from the mixture of materials that have been used it is important to ensure the sustainability and continuity of the product chain. This study was conducted in order to find alternatives to recycle the paper from the long life carton packages, through the incorporation of fibers in a matrix of recycled polyethylene. For this research was added 5%, 10

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Мойсеєнко, Сергій. "Новітній підхід до проектування спальних засобів для туризму". Thesis, Київський національний університет технологій та дизайну, 2018. https://er.knutd.edu.ua/handle/123456789/10553.

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Робота присвячена розробці спального засобу з покращеними теплозахисними властивостями за рахунок використання пружних полімерних матеріалів та спеціальної конструкції пакету матеріалів. Запропоновано нову конструкцію пакету матеріалів спального засобу, в якому розділено верхню та нижню частину. Верхню пропонується виготовляти у вигляді ковдри, нижня частина має шар з прокладкою комірчастого типу та дугоподібними вкладками та шару прошитого синтепону. Така конструкція дасть змогу підвищити теплозахисні характеристики пакету за рахунок збільшення повітряних прошарків.<br>The work is devoted to

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Hassan, Nazir Ahmed. "An investigative study on the affect and concerns of mathematics student teachers with special reference to social-context based learning packages / Nazir Ahmed Hassan." Thesis, North-West University, 2013. http://hdl.handle.net/10394/8698.

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This investigative study was undertaken against the background of the recent calls for back to basics by the Schooling 2025 initiative, as well as to address the 2000 and 2009 Review Committees’ reports on the training and development of teachers and on the variable quality of learning support materials. The act of systemic transformation has led to two curriculum revisions taking place within the South African education sector and has inevitably culminated in the identification of shortcomings in teacher development and learning materials. This study has positioned itself to address these sho

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Halléhn, Lisa. "Alternativ till plast i storkök : Nuläge och utbytesförslag för kommunala storkök inom Eskilstuna kommun." Thesis, Mälardalens högskola, Akademin för ekonomi, samhälle och teknik, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:mdh:diva-28438.

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The aim of this degree project was to study the use and presence of plastic in municipal large-scale catering establishments from preschool to high school and in geriatric care. It was also to get a deeper knowledge about the substance BPA and the plastic PVC and their connection with food. The third aim was to lay forward some suggestions for Eskilstuna about continued work and substitution in their municipal large-scale kitchens. The means for data gathering was databases, websites, scientific reports, on site visits, interviews, online survey and communication by phone and email. The result

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Kerkeni, Dhia. "Développement d'un traitement acoustique basses-fréquences pour application aérospatiale." Mémoire, Université de Sherbrooke, 2015. http://hdl.handle.net/11143/7702.

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Résumé : Tout comme l’aéronautique, l’industrie aérospatiale s’est tournée progressivement vers l’emploi des coques à base des matériaux composites. Cette transition a permis d’alléger considérablement les structures aéronautiques et aérospatiales, et par conséquent, a réduit la consommation de carburants ainsi que l’impact écologique des aéronefs et des lanceurs. Toutefois, la loi de masse stipule que cela ne peut être sans conséquence sur la perte par transmission acoustique des panneaux, surtout sur les basses fréquences. Que ce soit pour la conformité aux exigences des normes aéronautiques

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Wang, Wen-Ting, and 王玟婷. "Effect of package materials on warpage of IC package." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/49y5em.

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碩士<br>國立交通大學<br>機械工程系所<br>103<br>This research investigated the effects of IC package materials on the package warpage after fabrication using finite element analysis. Two kinds of overmold and four kinds of underfill were taken into account and results indicated that higher coefficient of thermal expansion (CTE) of substrate would faciliate the convex deformation of package warpage. From the eight groups of IC packages, two IC packages contraining the substrates with significant differences in thickness and CTE were selected and then optimized in the study. The IC package materials considere

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Tsai, Hao-Yin, and 蔡豪殷. "Green Package with Environment Conscious Materials Study." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/nak6v9.

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碩士<br>國立成功大學<br>化學系專班<br>92<br>This study was performed to investigate the green package raw materials and the materials interworked. There are two sections in this study, the conventional package and chip scale package (CSP). And results are as follows. Current surface finished applied was Sn85Pb5 to lead frame surface, this study we surveyed pure Sn, Sn/Bi and Sn/Cu three kinds of electrolyte for lead-free plating. After plating we verify quality related issue by visual inspection, plating thickness composition and adhesion, solderability, wettability, on board test and whisker monitorin

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Tsai, Fang-chang, and 蔡芳昌. "Preparation and Investigation of Active plastic Package Materials." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/16248136105972648363.

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博士<br>國立臺灣科技大學<br>高分子系<br>95<br>Investigation of the gasoline permeation resistance of the as-blow-molded polypropylene, polypropylene / ethylene vinyl alcohol (PP/EVOH), polypropylene / modified polyamide (PP/MPA) and polypropylene / blends of modified polyamide and ethylene vinyl alcohol (PP/MPAEVOH) bottles. Investigation of the oxygen barrier and blending properties of the modified polyamide (MPA) and nylon 6 clay (NYC) blends (MPANYC) were also carried out in this study. Last but not least, the tensile and oxygen depletion properties of EVA resins blended with varying compositions of iro

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