Log in

Relevant bibliographies by topics / Package materials / Journal articles

To see the other types of publications on this topic, follow the link: Package materials.

Journal articles on the topic 'Package materials'

Author: Grafiati

Published: 30 May 2022

Last updated: 31 July 2025

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 journal articles for your research on the topic 'Package materials.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

De Kerpel, Laura, Barbara Kobuszewski Volles, and Anneleen Van Kerckhove. "Fats are Glossy but Does Glossiness Imply Fatness? The Influence of Packaging Glossiness on Food Perceptions." Foods 9, no. 1 (2020): 90. http://dx.doi.org/10.3390/foods9010090.

Full text

Abstract:

This research brings together two research streams, one focusing on the influence of a diverse set of packaging attributes (e.g., shape, size, color, etc.) on perceptions of packaged food and the second one on the up- and downsides of using glossy materials, which are often studied in a non-food context. The current research deals with the influence of glossy (versus matte) food packages on consumers’ perceptions of the food inside the package. With one online survey and one quasi-experiment, we show that consumers draw inferences on the food’s fat level from the package surface, in that gloss

APA, Harvard, Vancouver, ISO, and other styles

2

Fabis, Philip M., and Henry Windischmann. "Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package Environment." Journal of Electronic Packaging 122, no. 2 (1999): 92–97. http://dx.doi.org/10.1115/1.483139.

Full text

Abstract:

Long term package reliability is becoming an increasing concern as IC clock speeds and power densities increase while simultaneously the package foot print decreases. Significant contributors to increasing the reliability and performance of plastic packages are reducing the package/junction temperature Tj and improving the integrity of the interfaces between the encapsulating polymer and the constituent package materials. CVD diamond, with its superior thermal conductivity, low density and high electrical resistivity offers an attractive alternative to traditional metal heat spreader materials

APA, Harvard, Vancouver, ISO, and other styles

3

Aihara, Takashi, Shingo Ito, Hideaki Sasajima, and Ken Oota. "Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials." Journal of Electronic Packaging 123, no. 1 (2000): 88–94. http://dx.doi.org/10.1115/1.1329129.

Full text

Abstract:

The market for BGA packages is expanding all over the world, owing to the ease of its mounting onto the PC boards. On the other hand, BGA packages possess certain shortcomings compared to QFPs. Anti-solder crack performance on Fine Pitch BGA (=FPBGA) and warpage on Mold Array Package-BGA(=MAP-BGA) are significant disadvantages. To improve the performance of BGA packages, we studied various combinations of materials used for BGA package including molding compounds, die attach pastes, and substrates.

APA, Harvard, Vancouver, ISO, and other styles

4

SUZUKI, OSAMU. "Recent Advances in Underfill Materials." International Symposium on Microelectronics 2019, S2 (2019): S1—S15. http://dx.doi.org/10.4071/2380-4505-2019.1.invitedaihardware000014.

Full text

Abstract:

Abstract Invited Session on FUTURE SEMICONDUCTOR PACKAGES FOR AI HARDWARE. Outline: Applications for Advanced Packaging; Global AI Computing Hardware Total Available Market (TAM); Die partitions; Defect Density; FC-BGA Families Trends; Technical Challenges of CUF; Underfills for Advanced Packaging; Severe KOZ on MCM; Bleed Out; Formulation Technique; Concerns during penetration; Chip package interaction (CPI) Challenges; and summary.

APA, Harvard, Vancouver, ISO, and other styles

5

Jen, Yi-Ming, Hsi Hsin Chien, Tsung-Shu Lin, and Shih Hsiang Huang. "Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages." Key Engineering Materials 306-308 (March 2006): 1043–48. http://dx.doi.org/10.4028/www.scientific.net/kem.306-308.1043.

Full text

Abstract:

This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array (FC-PBGA) packages with different lid materials under thermal cycling tests. Three FC-PBGA packages with different lid materials, i.e., Al, AlSiC, and Cu, were utilized to examine the lid material effect on solder ball reliability. The cyclic stress/strain behavior for the packages was estimated by using the nonlinear finite element method. The eutectic solder was assumed to be elastic-plastic-creep. The stable stress/strain results obtained from FEM analysis were ut

APA, Harvard, Vancouver, ISO, and other styles

6

Arshad, Khairul Mohd, Muhamad Mat Noor, Asrulnizam Abd Manaf, Hiroshi Kawarada, Shaili Falina, and Mohd Syamsul. "A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties." Micromachines 13, no. 9 (2022): 1513. http://dx.doi.org/10.3390/mi13091513.

Full text

Abstract:

Face recognition is one of the most sophisticated disciplines of biometric systems. The use of VCSEL in automotive applications is one of the most recent advances. The existing VCSEL package with a diffuser on top of a lens intended for automotive applications could not satisfy the criteria of the automotive TS16949: 2009 specification because the package was harmed and developed a lens fracture during 100 thermal cycle tests. In order to complete a cycle, the temperature rises from −40 °C to 150 °C and then rises again from 150 °C to 260 °C. The package then needs to be tested 500 times to en

APA, Harvard, Vancouver, ISO, and other styles

7

Verma, Ankita, Baqar Tabrez, Lam Duong, and Martin Wuest. "Manufacturability trade-offs of bare-die FCBGA package using thin or core-less substrate." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–26. http://dx.doi.org/10.4071/2017dpc-tha2_presentation3.

Full text

Abstract:

With the increasing demand for thinner packages and higher electrical & thermal performance requirement bare-die packaging is an inevitable trend that is growing. The assembly process for manufacturing of bare die in thin or core-less substrate FCBGA packages can be challenging especially considering the effects of substrate warpage during flip chip bonding and the excessive warpage of the flip chip package. We are evaluating the manufacturing risks during bare-die FCBGA package assembly to eliminate package warpage failures using experimental techniques and improve the functional performa

APA, Harvard, Vancouver, ISO, and other styles

8

Usturoi, Alexandru, Cristina Simeanu, Marius Giorgi Usturoi, Marius Gheorghe Dolis, Roxana Nicoleta Ratu, and Daniel Simeanu. "Influence of Packaging Type on the Dynamics of Powdered Eggs Chemical Composition." Materiale Plastice 54, no. 2 (2017): 380–85. http://dx.doi.org/10.37358/mp.17.2.4855.

Full text

Abstract:

The aim of the study was to investigate the dynamics of the main chemical compounds in the powdered eggs stored under constant environmental conditions (temperature=10�0.5oC; relative humidity=65�1%) and packaged in bags made of different plastic fabric (Lc group = high density polyethylene - HDPE; Lexp group = low density polyethylene - LDPE). The assessments were run to measure the inner water and dry matter contents, as well as the ash, proteins, lipids and nitrogen free extract levels. The analysis of data gathered throughout 90 days of storage suggested that the product packaged in low de

APA, Harvard, Vancouver, ISO, and other styles

9

Enomoto, Tetsuya, Mika Kobune, Kazutoshi Furuzono, Masahiro Matsunaga, Naoki Takahara, and Takashi Kawamori. "Highly Functional Materials for Advanced Package." Journal of Photopolymer Science and Technology 37, no. 3 (2024): 335–40. http://dx.doi.org/10.2494/photopolymer.37.335.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Seok, Seonho. "Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation." Micromachines 12, no. 9 (2021): 1020. http://dx.doi.org/10.3390/mi12091020.

Full text

Abstract:

Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant. One of the most advanced implantable devices is neural prosthesis device, which consists of polymeric neural electrode and silicon neural signal processing integrated circuit (IC). The overall neural interface system should be packaged in a biocompatible way to be implanted in a patient. The biocompatible packaging is being mainly achieved in two approaches; (1) pol

APA, Harvard, Vancouver, ISO, and other styles

11

Kim, Hee-Ju, and Su-In Kim. "A study on the color analysis of Korean sauce package: focused on the Korean sauce with Sempio ‘Semine Kitchen’." Table and Food Coordinate Society of Korea 19, no. 1 (2024): 1–22. http://dx.doi.org/10.26433/tfck.2024.19.1.1.

Full text

Abstract:

The purpose of this study is that as the demand for sauces increases, various types of sauce products that meet the needs of consumers are being released. Packages with designs that mislead consumers are also being introduced in various ways. Therefore, the purpose of this study is to analyze the color of Sampyo's 'Sammine Kitchen' product package, and through this, it is intended to provide primary data necessary to propose colors that can effectively express its products to consumers in product packages or advertisements and to help establish marketing strategies. A Korean sauce package post

APA, Harvard, Vancouver, ISO, and other styles

12

Chiriac, Victor Adrian, Tien-Yu Tom Lee, and Vern Hause. "Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication." Journal of Electronic Packaging 126, no. 4 (2004): 429–34. http://dx.doi.org/10.1115/1.1827257.

Full text

Abstract:

The increasing trend in power levels and associated densities leads to the need of design thermal optimization, either at the module level or at the system (module-board stack-up) level. The wireless communication industry is facing multiple challenges as it tries to promote smaller, faster and cost-effective packages, yet trying to cope with potential thermal bottlenecks. The present study investigates a family of packages, whose thermal and electrical performances are far superior to the classic (standard) packages. A three-dimensional conjugate numerical study was conducted to evaluate the

APA, Harvard, Vancouver, ISO, and other styles

13

Kolesnikov, N. V., M. V. Ariskin, D. O. Martyshkin, and A. V. Merkushov. "Improved calculations of joints in anisotropic structural materials." Bulletin of Science and Research Center of Construction 41, no. 2 (2024): 69–78. http://dx.doi.org/10.37538/2224-9494-2024-2(41)-69-78.

Full text

Abstract:

Introduction. Contemporary methods for the design and calculation of building structures are often limited to the elastic stage of the material work. In order to analyze the stress-strain state of joints, it is necessary to take into account the properties of the material, as well as its operation under the load, including both elastic and non-linear stages. In this case, anisotropic materials, e.g. wood, represent a particular interest. Therefore, the paper presents a theoretical and practical study of the work, performed by wooden samples.Aim. To perform tests and numerical simulations for a

APA, Harvard, Vancouver, ISO, and other styles

14

Kościelski, Marek, Janusz Sitek, Wojciech Stęplewski, Grazyna Kozioł, Piotr Ciszewski, and Tomasz Krzaczek. "Materials and soldering challenges in lead-free Package-on-Package (PoP) technology." Soldering & Surface Mount Technology 27, no. 3 (2015): 103–7. http://dx.doi.org/10.1108/ssmt-03-2015-0012.

Full text

Abstract:

Purpose – The purpose of this paper is to present challenges met during package-on-package (PoP) technology implementation in real surface-mount technology assembly processes. Design/methodology/approach – The properties and behavior of different combinations of soldering materials, PoP components and soldering profiles were investigated, both in the laboratory and during production trials. The purpose of such an approach was identification of existing problems and challenges in lead-free PoP systems assembly as well as checking which soldering material designed to PoP is more suitable for thi

APA, Harvard, Vancouver, ISO, and other styles

15

LÜ, JIANHUA, and DAN MA. "Effect of Wheat Flour Packaging Materials on Infestation by Lasioderma serricorne (F.)." Journal of Food Protection 78, no. 5 (2015): 1052–55. http://dx.doi.org/10.4315/0362-028x.jfp-14-438.

Full text

Abstract:

The ability of the cigarette beetle, Lasioderma serricorne (F.) (Coleoptera: Anobiidae), to infest wheat flour under packaged and unpackaged conditions was investigated in the laboratory at 27 ± 2°C and 75% ± 5% relative humidity. Five common packaging materials, namely, vacuum plastic bags, kraft paper bags, nonwoven cloth bags, aluminum foil bags, and woven plastic bags, were investigated. Adults and eggs of L. serricorne were released on different packaged wheat flour or on unpackaged wheat flour, and infestation levels (number of live adults and larvae) were determined after 45 days. When

APA, Harvard, Vancouver, ISO, and other styles

16

Banijamali, Bahareh, Liam Madden, Suresh Ramalingam, and Ephrem Wu. "Quality and Reliability of 3D High-Performance Heterogeneous Integration through Die Stacking." International Symposium on Microelectronics 2012, no. 1 (2012): 000249–53. http://dx.doi.org/10.4071/isom-2012-tp14.

Full text

Abstract:

This paper studies package reliability for the industry's first heterogeneous Stacked Silicon Interconnect (SSI) FPGA family (3D integration) delivering up to 2.78 Tb/s transceiver bandwidth. Each device is packaged on a low-temperature co-fired ceramic (LTCC) package for optimal signal integrity. 3D thermal-mechanical simulations are built to analyze package warpage, low-k stresses, microbumps and C4 bumps fatigue as well as BGA ball reliability. Different substrate sizes and designs, lid designs, lid materials and C4 bump underfill materials are investigated in order to optimize package reli

APA, Harvard, Vancouver, ISO, and other styles

17

Zawadzka, Kinga, Marcin Barburski, and Jacek Rutkowski. "Analysis of the Impact Resistance Capacity of 3D Spacer Fabrics Based on Impact Tests." Fibres and Textiles in Eastern Europe 28, no. 6(144) (2020): 53–57. http://dx.doi.org/10.5604/01.3001.0014.3798.

Full text

Abstract:

The article presents the structure influence of distance spacer fabric on the ability to protect against impact based on impact test results of selected packages made of spacer fabrics. The aim of testing these materials was to check their ability to suppress the impact force and absorb the energy in anti-impact vests. The purpose of using these textile materials in protective clothing would be to reduce the weight of the final product, and thus also to reduce heat stress during use. The article contains test results of the force received under an anvil and of the energy absorbed for each of t

APA, Harvard, Vancouver, ISO, and other styles

18

Snycerski, Marek, and Izabela Frontczak-Wasiak. "INFLUENCE OF FURNITURE COVERING TEXTILES ON MOISTURE TRANSPORT IN A CAR SEAT UPHOLSTERY PACKAGE." AUTEX Research Journal 2, no. 3 (2002): 126–31. http://dx.doi.org/10.1515/aut-2002-020303.

Full text

Abstract:

Abstract The conditions of heat and moisture transport in a car-seat upholstery package are briefly presented, and the necessity of investigation especially of moisture transport is stressed. Three upholstery packages of different furniture covering textiles have been tested with the use of a measuring system for assessing moisture transport through flat textiles. The factor of absolute humidity changes over time determined on the boundary between the user and the upholstery package is described, and its usability for estimating a package application presented. An analysis of the curves of abs

APA, Harvard, Vancouver, ISO, and other styles

19

Li, Ping, Shi Qiao Gao, Lei Jin, Hai Peng Liu, and Yun Bo Shi. "Influence of Package on Micro-Accelerometer Sensitivity." Key Engineering Materials 562-565 (July 2013): 1367–72. http://dx.doi.org/10.4028/www.scientific.net/kem.562-565.1367.

Full text

Abstract:

Package is one of the key technologies for micro-accelerometer. This paper researched the influence of package on the sensitivity of self-designed piezoresistive accelerometer. Based on the designed package method, the effect of thickness and elastic modulus of die adhesive, package shell materials and signal connection wires on the sensitivity of the sensor were studied by theory analysis, simulation and experimental test. According to results, the sensitivity of micro-accelerometer would be increased with the increasing thickness of die adhesive and decreased with increasing elastic modulus

APA, Harvard, Vancouver, ISO, and other styles

20

HARANINA, Olha, Yana REDвЂ™KO, Serhiy KAMENETS, and Raisa VATAN. "DETERMINATION OF THE EFFICIENCY OF APPLICATION OF PACKAGES OF TEXTILE MATERIALS FOR THE PRODUCTION OF A SPECIAL PURPOSE JACKET." Herald of Khmelnytskyi National University. Technical sciences 315, no. 6(1) (2022): 61–65. http://dx.doi.org/10.31891/2307-5732-2022-315-6-61-65.

Full text

Abstract:

The results of research into the properties of modern textile materials, in particular, insulating materials, are presented for choosing a package of textile materials that will be the most effective in terms of quality for the production of a special-purpose jacket that will be used in low-temperature conditions. As insulating materials for the study of consumer properties of textile material packages, the material вЂњTinsuletвЂќ, batting and sintepon, upper fabric вЂњOxfordвЂќ, lining fabric вЂњNylonвЂќ were used. Both the materials themselves and the packages of textile materials from the t

APA, Harvard, Vancouver, ISO, and other styles

21

Ray, Urmi. "Chip Package Interaction Considerations in Fan-out Wafer Level Packaging." International Symposium on Microelectronics 2016, S2 (2016): S1—S13. http://dx.doi.org/10.4071/isom-2016-slide-7.

Full text

Abstract:

With the advent of thinner die/packages, new materials and more complex packages Chip Package Interaction has become a larger concern for the industry. Wafer Level Packages and variants such as Fan Out Wafer Level Packages (FOWLP) have an additional risk which we refer to as Chip Board Interaction. This talk will discuss some of the basics of the CPI and CBI risks to FOWLP which include both mechanical and electrical risks to products. These mechanisms span the Design, Process and Package domains and as such requires a collaborative efforts to manage the risks and trade-offs.

APA, Harvard, Vancouver, ISO, and other styles

22

Becker, K. F., D. Joklitschke, T. Braun, et al. "Transfer Molding Technology for Smart Power Electronics Modules: Materials and Processes." Journal of Microelectronics and Electronic Packaging 9, no. 2 (2012): 78–86. http://dx.doi.org/10.4071/imaps.320.

Full text

Abstract:

In recent years, within power electronics packaging, there has been a trend toward compact power electronics modules for automotive and industrial applications, where a smart integrated control unit for motor drives is replacing bulky substrates with discrete control logic and power electronics. Most recent modules combine control and power electronics, yielding maximum miniaturization. Transfer molding is the method of choice for cost-effective encapsulation of such modules due to robustness of the molded modules and moderate cost of packaging. But there are challenges with this type of packa

APA, Harvard, Vancouver, ISO, and other styles

23

Becker, K. F., D. Joklitschke, T. Braun, et al. "Transfer molding technology for smart power electronics modules - materials and processes." International Symposium on Microelectronics 2011, no. 1 (2011): 000083–89. http://dx.doi.org/10.4071/isom-2011-ta3-paper2.

Full text

Abstract:

During the last years within power electronics packaging a trend towards compact power electronics modules for automotive and industrial applications could be observed, where a smart integrated control unit for motor drives is replacing bulky substrates with discrete control logic and power electronics. Most recent modules combine control and power electronics yielding maximum miniaturization. Transfer molding is the method of choice for cost effective encapsulation of such modules due to robustness of the molded modules and moderate cost of packaging. But there are challenges with this type o

APA, Harvard, Vancouver, ISO, and other styles

24

Sun, Mei Jiao. "Natural Packaging Materials and Green Package Design." Advanced Materials Research 580 (October 2012): 497–500. http://dx.doi.org/10.4028/www.scientific.net/amr.580.497.

Full text

Abstract:

This paper focuses on the natural packaging materials. Based on the research and exploration of natural packaging materials and green packaging design, t describes some Ideas such as "unity of heaven and man","the isomorphism", combining with the idea of the traditional packaging design. The concept of nationality and the green design are blended in packaging design so as that it has unique chinese flavour and embodies the spirit of primitive art, Then the design make full use of the advantages of natural materials at the same times.

APA, Harvard, Vancouver, ISO, and other styles

25

Passmore, B. S., J. Stabach, S. Storkov, et al. "A High Temperature (> 250 °C) SiC Schottky Diode Bridge Rectifier for Extreme Environment Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (2014): 000018–21. http://dx.doi.org/10.4071/hitec-ta15.

Full text

Abstract:

A high temperature, 1200 V / 5 A SiC Schottky diode bridge rectifier packaged in a 4 pin TO-254 hermetically sealed package is presented. The package consists of high temperature (&gt; 250 °C) assembly processes and materials, including the seals, baseplate, power substrate, die attach, and passivation. The forward voltage as well as the reverse leakage characteristics as a function of temperature is presented. In addition, rectification in a 275 °C environment is demonstrated using the bridge TO-254 style package.

APA, Harvard, Vancouver, ISO, and other styles

26

Capilheira, André F., Jerffeson A. Cavalcante, Gizele I. Gadotti, Bruna R. Bezerra, Nander F. Hornke, and Francisco A. Villela. "Storage of soybean seeds: Packaging and modified atmosphere technology." Revista Brasileira de Engenharia Agrícola e Ambiental 23, no. 11 (2019): 876–82. http://dx.doi.org/10.1590/1807-1929/agriambi.v23n11p876-882.

Full text

Abstract:

ABSTRACT The characteristics of materials used in packages for seed storage may have a negative influence in the deterioration process, causing future problems during the period of storage and in emergence in the field. In this study, the objective was to evaluate the physiological quality of soybean seeds, stored in different packages with and without the addition of CO2 (modified atmosphere), for different periods of storage and in uncontrolled environmental conditions. In order to carry out the experiment, a completely randomized design was used in a split-plot scheme, with three types of p

APA, Harvard, Vancouver, ISO, and other styles

27

Kiselev, Evgeniy, Kirill Savelev, and Oleg Krupennikov. "Efficiency Estimation of Energy Introduction of a Ultrasound Field Into the Zone of Drilling of Complex Packages From Composite Materials and Titanium." MATEC Web of Conferences 297 (2019): 04003. http://dx.doi.org/10.1051/matecconf/201929704003.

Full text

Abstract:

The possibility of improving the quality of holes in complex packages made of composite materials and titanium alloys in the drilling operation by using the energy of ultrasonic vibrations introduced into the treatment zone is considered. The construction of complex packages and the problems arising from their processing with an axial tool are described. The rational design of the experimental setup for testing the technology of ultrasonic drilling of small-diameter holes was chosen. The unit is based on the KUKA KR 16 R2100 robotic complex. In addition to the industrial robot, it contains a s

APA, Harvard, Vancouver, ISO, and other styles

28

Sukantharat, Anan, Kessararat Ugsornrat, and Chalermsak Sumithpibul. "Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices." ECTI Transactions on Electrical Engineering, Electronics, and Communications 18, no. 2 (2020): 179–88. http://dx.doi.org/10.37936/ecti-eec.2020182.240488.

Full text

Abstract:

This research studied about an effect of epoxy molding compound material and roughness leadframe of integrated circuit package for automotive device. In manufacturing process, the epoxy molding compound material and leadframe roughness are main factors that effect to coefficient of thermal expansion (CTE) and reliability for automotive device package with no delamination in high temperature application. In experiment, two types of epoxy molding compound materials were studied and compared between standard and roughened leadframe for quad flat non lead (QFN) package. For reliability test, the e

APA, Harvard, Vancouver, ISO, and other styles

29

Metcalfe, M. P., W. Koch, and G. Turner. "Break-up testing of waste-form materials." Mineralogical Magazine 76, no. 8 (2012): 2975–83. http://dx.doi.org/10.1180/minmag.2012.076.8.13.

Full text

Abstract:

AbstractThe Nuclear Decommissioning Authority (NDA) is developing a safety case for the long-term management of higher activity wastes. This includes safety assessments of transport to and operations at the repository. One of the main faults and hazards to be considered is waste package response to impact accidents.The criteria of impact performance for waste packages are based upon activity release of particulates generated from the break up of the waste form during impact. The NDA approach to impact performance is based upon waste package response from finite element modelling in combination

APA, Harvard, Vancouver, ISO, and other styles

30

Furusawa, Takeshi, Naomi Kawamura, Toshiki Furutani, and Takashi Kariya. "Control of Package Warpage by Package Substrate Design for Low Profile Package-on-Package Structure." International Symposium on Microelectronics 2012, no. 1 (2012): 000491–96. http://dx.doi.org/10.4071/isom-2012-tp65.

Full text

Abstract:

In recent years, with increasing demand for high-density assembly in mobile electronics products, a package-on-package (PoP) structure has been standardized. The demand for lowering the PoP profile is getting stronger as consumers demand thinner mobile devices. To assemble a low profile PoP and mount it on a mother board, it is necessary to have a precise warpage control of PoP components, including its bottom package. It is expected that a flip-chip chip-scale-package (FCCSP) with thin mold cap will be used as the bottom package of the PoP in the next 2–3 years. In order to control the packag

APA, Harvard, Vancouver, ISO, and other styles

31

Wells, Brendan C., Wei Lin, and HyunJin Park. "Effect of Substrate Layer Variation on Package Warpage." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 001086–105. http://dx.doi.org/10.4071/2013dpc-wa21.

Full text

Abstract:

As requirements for thinner packages continue to be driven by increased device functionality, warpage has become more and more of a concern in package design and processing. Designers are limited by available materials whose properties are not always capable of achieving low warpage targets. Outside of materials development, techniques in the fabrication processing of organic substrates have served as an important secondary approach to reducing package-level warpage. This is becoming more and more important as the substrate thickness is reduced. For a thin substrate, each layer has a marked im

APA, Harvard, Vancouver, ISO, and other styles

32

Chang, K.-C., M.-K. Yeh, and K.-N. Chiang. "Hygrothermal stress analysis of a plastic ball grid array package during solder reflow." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 218, no. 9 (2004): 957–70. http://dx.doi.org/10.1243/0954406041991260.

Full text

Abstract:

This study investigated how the internal temperature and moisture of a plastic ball grid array (PBGA) package affect interfacial hygrothermal stresses (primarily peeling and shear stresses) during solder reflow. Two-dimensional finite element analysis was applied to evaluate temperature distribution, moisture diffusion and hygrothermal stresses inside the PBGA package. A series of popcorn experiments on PBGA packages was carried out to verify the accuracy of the finite element model. The design parameters of the PBGA package were varied to assess their effect on hygrothermal stresses at the in

APA, Harvard, Vancouver, ISO, and other styles

33

Hassan, Nik Mohd Kamel Nik, Nik Abdullah Mu'az Nik Mohd Kamel, Muhammad Fauzan Pauzi, and Hee Min Teh. "Construction Technology Used for the Reclamation of Seri Tanjung Pinang (Phase 2)." MATEC Web of Conferences 203 (2018): 01016. http://dx.doi.org/10.1051/matecconf/201820301016.

Full text

Abstract:

The second phase of Seri Tanjung Pinang (STP2) aims to be an exemplar water front development that encapsulates the best of island living in Penang, Malaysia. STP2 offers a range of residential, commercial and leisure facilities to both local and international investors. Based on the geographical area, STP2 is divided into three packages, which are Package 2A (foreshore of Gurney Drive and the western region of the sand island), Package 2B (the southeast region of the sand island) and Package 2C (the northeast region of the sand island). It is an extension of the fully developed STP1 (Phase I)

APA, Harvard, Vancouver, ISO, and other styles

34

Joo, J. W. "Thermo‐mechanical behavior of ball grid packages with different solder ball grid patterns investigated through moiré interferometry." Materialwissenschaft und Werkstofftechnik 55, no. 5 (2024): 598–609. http://dx.doi.org/10.1002/mawe.202400029.

Full text

Abstract:

AbstractPlastic ball‐grid array (PBGA) package assembly comprises various materials with different thermo‐mechanical properties, and the solder ball‐grid patterns can significantly influence the package deformation and solder ball stress. This study utilizes moiré interferometry to investigate the deformation behavior of wire bonded plastic ball‐grid array (WB‐PBGA) packages under varying temperatures. Real‐time moiré interferometry experiments were conducted to capture fringe patterns representing package deformation at different temperature stages. Experiments were conducted for three differ

APA, Harvard, Vancouver, ISO, and other styles

35

HORIASHCHENKO, Serhiy, Ievgeniia HOLINKA, Georhiy DRAPAK, Kostyantun HORIASHCHENKO, and Oleg POLISHCHUK. "RESEARCH OF TRANSVERSE GLUING OG LIGTHINDASTRY PARTS WITH POLIMERIC MATERIALS." Herald of Khmelnytskyi National University. Technical sciences 313, no. 5 (2022): 274–78. http://dx.doi.org/10.31891/2307-5732-2022-313-5-274-278.

Full text

Abstract:

The paper presents the results of research on the preliminary gluing of parts of light industry, namely parts made of leather and artificial leather into a package. Zonal application of polymer adhesive material and a defined strength value for different types of packages are proposed. The relative displacement of the parts will lead to a violation of the integrity of the package and the destruction of the adhesive bond between them. That is, any relative displacement of the parts must lead to the destruction of their previously set position and is considered unacceptable. Therefore, determini

APA, Harvard, Vancouver, ISO, and other styles

36

McPherson, B., B. Passmore, P. Killeen, D. Martin, A. Barkley, and T. McNutt. "Package design and development of a low cost high temperature (250°C), high current (50+A), low inductance discrete power package for advanced Silicon Carbide (SiC) and Gallium Nitride (GaN) devices." International Symposium on Microelectronics 2013, no. 1 (2013): 000592–97. http://dx.doi.org/10.4071/isom-2013-wa63.

Full text

Abstract:

The demands for high-performance power electronics systems are rapidly surpassing the power density, efficiency, and reliability limitations defined by the intrinsic properties of silicon-based semiconductors. The advantages of post silicon materials, including Silicon Carbide (SiC) and Gallium Nitride (GaN), are numerous, including: high temperature operation, high voltage blocking capability, extremely fast switching, and superior energy efficiency. These advantages, however, are severely limited by conventional power packages, particularly at temperatures higher than 175°C and &gt;100 k

APA, Harvard, Vancouver, ISO, and other styles

37

Jamal, M., M. Bilal, Iftikhar Ahmad, and S. Jalali-Asadabadi. "IRelast package." Journal of Alloys and Compounds 735 (February 2018): 569–79. http://dx.doi.org/10.1016/j.jallcom.2017.10.139.

Full text

APA, Harvard, Vancouver, ISO, and other styles

38

He, Yu Ting, Hong Peng Li, Rong Hong Cui, and Chao Hua Fan. "Influence of Delamination of Epoxy/Dielectric Interfaces on Pattern Shift and Passivation Cracking under Aeronautical Conditions." Materials Science Forum 575-578 (April 2008): 919–23. http://dx.doi.org/10.4028/www.scientific.net/msf.575-578.919.

Full text

Abstract:

Interfacial delamination is a recognized failure mode in Integrated circuits (ICs). A major cause for this failure is the mismatch of Thermal Expansion Coefficients, Young’s modulus, and Poisson’s ratios of the package materials. Here, the influence of delamination between epoxy and dielectric layers on pattern shift and passivation cracking in IC package under aeronautical conditions, mainly temperature and load cycles, is studied by maximum plastic strain and maximum principal stresses theory using a certain 2D FEM model with different delamination length “L_c.right”. Delaminations are easy

APA, Harvard, Vancouver, ISO, and other styles

39

Usenbekov, Zh, S. K. Nurbay, and B. Kh Seitov. "Calculation of heat protective parameters of clothing packages by method simulation modeling (Monte Carlo method)." Journal of Almaty Technological University 144, no. 2 (2024): 197–206. http://dx.doi.org/10.48184/2304-568x-2024-2-197-206.

Full text

Abstract:

The heat-protective properties of clothing have been studied taking into account the influence of deterministic factors, and the influence of random factors on the heat-protective properties of clothing has not been studied. In this regard, to obtain objective values of indicators of the heat-protective properties of clothing, taking into account the nature of the distribution of factors for a batch of products that are random. Knowing the laws of distribution of random factors effectively, it is possible to carry out calculations of the thermal insulation properties of clothing material packa

APA, Harvard, Vancouver, ISO, and other styles

40

Dittman, Timothy. "The True Cost of Hermeticity in Microelectronic Packaging." International Symposium on Microelectronics 2016, no. 1 (2016): 000644–47. http://dx.doi.org/10.4071/isom-2016-thp45.

Full text

Abstract:

Abstract Reliability in microelectronic packaging has been, and will continue to be, a major concern that must be taken into account early in the design of a package. Decisions made relative to packaging materials and the methods for achieving environmental protection drive many other aspects of the design, such as component selection and next higher assembly interfaces. A better understanding of current methods for achieving reliability allows the design community to determine the most appropriate packaging solution for use in a given application. Environmental protection in microelectronic p

APA, Harvard, Vancouver, ISO, and other styles

41

Kim, Mi-Song, Won Sik Hong, Yong-Jun Kim, Chi-Hun In, and Jeong Tak Moon. "Materials and Evaluation Methodology of Pogo Pin for Semiconductor Package Testing." Journal of Welding and Joining 43, no. 2 (2025): 134–44. https://doi.org/10.5781/jwj.2025.43.2.3.

Full text

Abstract:

Advancements in semiconductor packaging technology have increased the demand for precise testing equipment. Pogo pins play a crucial role in semiconductor package inspection systems by providing reliable electrical connectivity during testing. However, as semiconductor circuits become increasingly fine-pitched, pogo pins must be reduced in size and diameter. This reduction makes it challenging to balance mechanical durability with electrical performance. Particularly with the rise of high-frequency components, developing pogo pins that minimize interference with high-frequency measurements is

APA, Harvard, Vancouver, ISO, and other styles

42

Xia, Hua, Nelson Settles, and David DeWire. "Hydrophobic sealing materials for harsh environmental electrical connector package applications." International Symposium on Microelectronics 2019, no. 1 (2019): 000078–84. http://dx.doi.org/10.4071/2380-4505-2019.1.000078.

Full text

Abstract:

Abstract A highly hydrophobic sealing material system has been developed using high-temperature melt-quenching and sintering technologies for harsh environmental electrical connector package sealing applications. The sealing material properties can be varied by its phase structures, such as amorphous glass, crystalline monoclinic and tetragonal mixed phase, and covalent bond tetragonal phase, which are determined by a two-stage synthesizing process. The dilatometer measurements have found that the ambient coefficient of thermal expansion varies from ~5.8 to 7.1 ppm/°C while the coefficient of

APA, Harvard, Vancouver, ISO, and other styles

43

Lou, Feng, X. Y. Li, J. Y. Ji, et al. "PASP: Property analysis and simulation package for materials." Journal of Chemical Physics 154, no. 11 (2021): 114103. http://dx.doi.org/10.1063/5.0043703.

Full text

APA, Harvard, Vancouver, ISO, and other styles

44

Qian, Yong Fang, Lai Jiu Zheng, Ruo Yuan Song, and Bing Du. "Electrospinning of Pullulan Nanofibers for Food Package Materials." Advanced Materials Research 821-822 (September 2013): 1321–25. http://dx.doi.org/10.4028/www.scientific.net/amr.821-822.1321.

Full text

Abstract:

Electrospinning is a process that fabricates continuous fibers with diameters in the nanoto micron range. Pullulan with different concentrations were successfully electrospun into nanofibers with water as solvent in this study. We have evaluated the effects of solution concentration on the morphology of the fibers. The morphologies of the nanofibrous mats were examined by Scanning Electron Microscopy (SEM). With increasing the solution concentration, the electrospun nanofibers changed from beaded nanofibers to smooth nanofibers, meanwhile, the average diameters of electrospun pullulan nanofibe

APA, Harvard, Vancouver, ISO, and other styles

45

Talley, Kevin R., Sage R. Bauers, Celeste L. Melamed, et al. "COMBIgor: Data-Analysis Package for Combinatorial Materials Science." ACS Combinatorial Science 21, no. 7 (2019): 537–47. http://dx.doi.org/10.1021/acscombsci.9b00077.

Full text

APA, Harvard, Vancouver, ISO, and other styles

46

Chemezov, Denis Alexandrovich. "DESCRIPTION OF LIBRARY MATERIALS SOFTWARE PACKAGE ANSYS AUTODYN." Theoretical & Applied Science 16, no. 08 (2014): 4–23. http://dx.doi.org/10.15863/tas.2014.08.16.2.

Full text

APA, Harvard, Vancouver, ISO, and other styles

47

Wan, Guolin, Yuhui Li, Ting Lai, et al. "Sym4state.jl: An efficient computation package for magnetic materials." Computer Physics Communications 303 (October 2024): 109283. http://dx.doi.org/10.1016/j.cpc.2024.109283.

Full text

APA, Harvard, Vancouver, ISO, and other styles

48

Lundén, H., L. Murphy, A. Määttänen, and T. Kumpulainen. "Hermetic package for optical devices using room temperature welding technology and transparent lid, for space applications." International Symposium on Microelectronics 2015, no. 1 (2015): 000598–602. http://dx.doi.org/10.4071/isom-2015-tha31.

Full text

Abstract:

The objective of the study was to develop a hermetic package for optical devices, with a transparent lid. A novel room temperature glass welding technology was used for the construction of the packages. The design solution and technology must be robust enough for use in space flight applications. Environmental and hermeticity tests were performed to evaluate the package capability & quality. Whilst initially targeted on a specific requirement, there are several industrial sectors that require hermetic encapsulation including; space, military, biotechnology, and telecoms etc. It is common f

APA, Harvard, Vancouver, ISO, and other styles

49

Abdullah, I., Azman Jalar, Shahrum Abdullah, M. F. Rosle, and Mohd Faridz Mod Yunoh. "Stress Distribution Effect on a Stacked-Die QFN Package Manufacturing Processes." Key Engineering Materials 462-463 (January 2011): 1273–78. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.1273.

Full text

Abstract:

In the last decade, failure of microelectronic devices has become a prominent field of research all across the world. The results of this of failure analysis allow an engineer to choose package geometries and materials which reduce the risk of failure. This paper is meant to relate the stress effect on material properties during Quad Flat No-Leads (QFN) stacked-die packages manufacturing processes. To achieve the study, the finite element technique was used to perform an extensive structural analysis on a QFN package design once it was verified by related experiments. A QFN unit was developed

APA, Harvard, Vancouver, ISO, and other styles

50

Спиридонов, V. Spiridonov, Девисилов, Vladimir Devisilov, Крыловский, and A. Krylovskiy. "Aerosol Particles Capture by Filters Made of Porous Mesh Metals." Safety in Technosphere 5, no. 2 (2016): 63–68. http://dx.doi.org/10.12737/20796.

Full text

Abstract:

Results of experimental investigations related to filtration efficiency of aerosol particles from a dusty air flow by filtering baffles made of porous mesh materials by multiply packages of wire meshes hot rolling in vacuum have been represented. It has been found that capture of aerosol particles in these materials is mainly carried out by mechanisms of inertial capture and contact. The functional connection for particles’ fractional breakthrough coefficient from number of mesh layers in the package and its material porosity has been obtained. The analytical relation b

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!