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Relevant bibliographies by topics / Power Electronics Reliability

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Academic literature on the topic 'Power Electronics Reliability'

Author: Grafiati

Published: 14 March 2023

Last updated: 31 July 2025

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Journal articles on the topic "Power Electronics Reliability"

1

Iannuzzo, Francesco, and Mauro Ciappa. "Reliability issues in power electronics." Microelectronics Reliability 58 (March 2016): 1–2. http://dx.doi.org/10.1016/j.microrel.2016.01.012.

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Zhdanov, I. Y., and M. A. Ostapchuk. "Stand for passive thermal cycling tests of power semiconductor components in complex temperature." Superconductivity: Fundamental and Applied Research 6, no. 1 (2025): 74–81. https://doi.org/10.62539/2949-5644-2024-6-1-74-81.

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Cryogenic cooling of power electronics is a promising direction, which in the future can become an alternative to other types of cooling in systems with superconducting devices. At the same time, the increase in the specific power and efficiency of power electronic converters is associated with unexplored reliability. This manuscript contains approaches for studying the reliability of power electronics, as well as experimental data from passive thermal cycling tests.

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White, Robert V. "Advancing Power Electronics Reliability [White Hot]." IEEE Power Electronics Magazine 8, no. 2 (2021): 100–99. http://dx.doi.org/10.1109/mpel.2021.3075786.

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Scheuermann, U. "Reliability challenges of automotive power electronics." Microelectronics Reliability 49, no. 9-11 (2009): 1319–25. http://dx.doi.org/10.1016/j.microrel.2009.06.045.

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Jiao, Chaoqun, Juan Zhang, Zhibin Zhao, Zuoming Zhang, and Yuanliang Fan. "Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices." Sensors 19, no. 19 (2019): 4176. http://dx.doi.org/10.3390/s19194176.

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With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of th

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Pires, Igor Amariz, Rafael Atila Silva, Anderson Vagner Rocha, Matheus Pereira Porto, Thales Alexandre Carvalho Maia, and Braz de Jesus Cardoso Filho. "Oil Immersed Power Electronics and Reliability Enhancement." IEEE Transactions on Industry Applications 55, no. 4 (2019): 4407–16. http://dx.doi.org/10.1109/tia.2019.2915276.

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Lu, Hua, Chris Bailey, and Chunyan Yin. "Design for reliability of power electronics modules." Microelectronics Reliability 49, no. 9-11 (2009): 1250–55. http://dx.doi.org/10.1016/j.microrel.2009.07.055.

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Zeng, Jia Si, Yi Bo Gao, Feng Yang, et al. "Reliability Evaluation of Mid-Voltage DC Distribution Network with Multiple Topologies." Applied Mechanics and Materials 666 (October 2014): 112–18. http://dx.doi.org/10.4028/www.scientific.net/amm.666.112.

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With the development of power electronics, DC distribution network has advantages in power supplying for DC loads, saving transmission loss of reactive power and improving power quality, when compared with traditional AC distribution network. Since DC distribution network has several multiple topologies, lots of power electronic components and DGs, the traditional reliability evaluation methods aren’t applicable any more. Hence, the reliability models of power electronics and DGs are built in this paper, and a hybrid method combining minimum-cut with non-sequential Monte Carlo is presented. Mo

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Hossein Rahimighazvini, Zeyad Khashroum, Maryam Bahrami, and Milad Hadizadeh Masali. "Power electronics anomaly detection and diagnosis with machine learning and deep learning methods: A survey." International Journal of Science and Research Archive 11, no. 2 (2024): 730–39. http://dx.doi.org/10.30574/ijsra.2024.11.2.0428.

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Power electronics pertains to the conception, regulation, and utilization of electronic power circuits to proficiently administer and transform electrical energy. Power electronics play a crucial role in maintaining the reliability, efficiency, and security of complex production systems. Also, increasingly important in various applications such as renewable energy systems, electric vehicles, and industrial automation. However, modern power electronics systems are vulnerable to both cyber and physical anomalies due to the integration of information and communication technologies. So far, differ

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Zacharias, Peter. "Design and Applications of Controllable Magnetic Devices in Power Electronic Circuits and Power Systems." Journal of Electronics and Advanced Electrical Engineering 1, no. 2 (2021): 6–14. http://dx.doi.org/10.47890/jeaee/2020/peterzacharias/11120007.

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Magnetic components are characterized by high robustness and reliability. Controllable magnetic components, which used to dominate, have been out of fashion for about 50 years. However, they have great advantages in terms of longevity, radiation resistance and overload capacity and become smaller and smaller with increasing operating frequency. This makes them interesting in modern power electronics applications with the increasing use of WGB semiconductors. The article shows how the performance of power electronic converters can be improved with modern power electronics and with field-control

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Dissertations / Theses on the topic "Power Electronics Reliability"

1

PIUMATTI, DAVIDE. "Reliability in Power Electronics and Power Systems." Doctoral thesis, Politecnico di Torino, 2021. http://hdl.handle.net/11583/2918006.

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Sadik, Diane-Perle. "On Reliability of SiC Power Devices in Power Electronics." Doctoral thesis, KTH, Elkraftteknik, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-207763.

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Silicon Carbide (SiC) is a wide-bandgap (WBG) semiconductor materialwhich has several advantages such as higher maximum electric field, lowerON-state resistance, higher switching speeds, and higher maximum allowablejunction operation temperature compared to Silicon (Si). In the 1.2 kV - 1.7kV voltage range, power devices in SiC are foreseen to replace Si Insulatedgatebipolar transistors (IGBTs) for applications targeting high efficiency,high operation temperatures and/or volume reductions. In particular, theSiC Metal-oxide semiconductor field-effect transistor (MOSFET) – which isvoltage contro

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Wang, Yun. "Characterization and reliability of Ag nanoparticle sintered joint for power electronics modules." Thesis, University of Nottingham, 2016. http://eprints.nottingham.ac.uk/37296/.

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Nowadays, numerous power electronics application requires operation at high temperatures. In order to address increasing change of reliability problems in power die attachments for high temperature and high reliability applications, sintering Ag nanoparticles has been used as bonding material for this work. Firstly, quantitative microstructure characterization of as-sintered Ag joints has been carried out. The resulting normalized thickness, pore size and porosity decreased, and grain size increased with increasing the sintering time. A time dependence of the form t1/n with n close to 2 or 3 c

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Liu, Xingsheng. "Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips." Diss., Virginia Tech, 2001. http://hdl.handle.net/10919/26691.

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Circuit assembly and packaging technologies for power electronics have not kept pace with those for digital electronics. Inside those packaged power devices as well as the state-of-the-art power modules, interconnection of power chips is accomplished with wirebonds. Wirebonds in power devices and modules are prone to resistance, noise, parasitic oscillations, fatigue and eventual failure. Furthermore, there has been an increase demand for higher power density and better efficiency for power converters. Power semiconductor suppliers have been concentrating on improving device structure, den

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Bonyadi, Roozbeh. "Reliability assessment and modelling of power electronic devices for automotive application and design." Thesis, University of Warwick, 2016. http://wrap.warwick.ac.uk/90139/.

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The emergence of the hybrid electric vehicle and electric vehicles (HEV and EV) requires the reliability assessment of power electronic devices used in the inverters. This includes the electro-thermal reliability of bipolar devices such as IGBTs and PiN diodes and more recently, the SiC MOSFETs since the SiC technology is not as mature as their bipolar counterparts. This research, in its own capacity, through the use of accurate compact models, investigates the switching performance and characteristics of silicon IGBTs, PiN diodes and SiC MOSFETs. The need for higher power densities and fast d

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Colmenares, Juan. "Extreme Implementations of Wide-Bandgap Semiconductors in Power Electronics." Doctoral thesis, KTH, Elkraftteknik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-192626.

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Wide-bandgap (WBG) semiconductor materials such as silicon carbide (SiC) and gallium-nitride (GaN) allow higher voltage ratings, lower on-state voltage drops, higher switching frequencies, and higher maximum temperatures. All these advantages make them an attractive choice when high-power density and high-efficiency converters are targeted. Two different gate-driver designs for SiC power devices are presented. First, a dual-function gate-driver for a power module populated with SiC junction field-effect transistors that finds a trade-off between fast switching speeds and a low oscillative perf

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Soon, John Long. "Fault-Tolerant Design and Implementation for Non-Isolated Reconfigurable DC/DC Converters." Thesis, The University of Sydney, 2019. http://hdl.handle.net/2123/20266.

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This thesis mainly focuses on improving the conventional DC-DC converter topology by utilizing the redundancy concept (N+1) and fault-tolerant design to maintain an uninterrupted output operation even on primary switch failure. The proposed fault-tolerant converter (FTC) involves merging three configurations namely buck, boost and buck-boost to derive a new converter structure along with bidirectional capabilities. The proposed FTC is equipped with a single redundant switch and shared with one coupled inductor and one capacitor (1L-1C) to be capable of achieving the step-up and step-down opera

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Adderly, Shawn. "Reviewing Power Outage Trends, Electric Reliability Indices and Smart Grid Funding." ScholarWorks @ UVM, 2016. http://scholarworks.uvm.edu/graddis/531.

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As our electric power distribution infrastructure has aged, considerable investment has been applied to modernizing the electrical power grid through weatherization and in deployment of real-time monitoring systems. A key question is whether or not these investments are reducing the number and duration of power outages, leading to improved reliability. Statistical methods are applied to analyze electrical disturbance data (from the Department of Energy, DOE) and reliability index data (from state utility public service commission regulators) to detect signs of improvement. The number of instal

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Farhadi, Mustafa. "Hybrid Energy Storage Implementation in DC and AC Power System for Efficiency, Power Quality and Reliability Improvements." FIU Digital Commons, 2016. http://digitalcommons.fiu.edu/etd/2471.

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Battery storage devices have been widely utilized for different applications. However, for high power applications, battery storage systems come with several challenges, such as the thermal issue, low power density, low life span and high cost. Compared with batteries, supercapacitors have a lower energy density but their power density is very high, and they offer higher cyclic life and efficiency even during fast charge and discharge processes. In this dissertation, new techniques for the control and energy management of the hybrid battery-supercapacitor storage system are developed to improv

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De, Santi Carlo. "Degradation mechanisms of devices for optoelectronics and power electronics based on Gallium Nitride heterostructures." Doctoral thesis, Università degli studi di Padova, 2014. http://hdl.handle.net/11577/3423670.

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Gallium Nitride is rapidly emerging as a promising material for electronic devices in various fields. Since it is a direct bandgap semiconductor it can be used for highly efficient light emitting devices (Light Emitting Diodes and Laser Diodes) and the possibility of growing alloys containing Aluminum and Indium allow for the selection of the peak wavelength along the whole UV-green part of the radiation spectrum. Moreover, the high electron mobility, the ability of withstand high electric fields and the good thermal dissipation make GaN-based diodes and transistors devices with a good potenti

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Books on the topic "Power Electronics Reliability"

1

Yong, Liu. Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. Springer US, 2012.

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Kaboli, Shahriyar. Reliability in power electronics and electrical machines: Industrial applications and performance models. Engineering Science Reference, 2016.

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3

International Conference on Power Quality (2nd 1992 Atlanta). Proceedings: Second International Conference on Power Quality : end-use applications and perspectives-PQA'92. The Institute, 1994.

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Benysek, Grzegorz. Power Theories for Improved Power Quality. Springer London, 2012.

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5

Zuev, Sergey, Ruslan Maleev, and Viktor Venevcev. Reliability of electrical and electronic equipment of modern vehicles. INFRA-M Academic Publishing LLC., 2025. https://doi.org/10.12737/2130171.

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The textbook contains information on the reliability of electrical and electronic equipment of vehicles, provides basic terms and definitions, provides information on the reliability of non-removable products, and on the operating conditions of transport electronics products. Information on statistical process management is provided. The types, purpose, and organization of testing, methods for evaluating reliability indicators, and ways to improve reliability (redundancy) are described. The analysis of technological processes by the method of histograms is given. The concept of "reliability" i

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Ding, Steven X. Model-Based Fault Diagnosis Techniques: Design Schemes, Algorithms and Tools. 2nd ed. Springer London, 2013.

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7

L, Edson Jerald, U.S. Nuclear Regulatory Commission. Office of Nuclear Regulatory Research. Division of Engineering Safety., and EG & G Idaho., eds. Nuclear plant aging research: The 1E power system. Division of Engineering Safety, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1990.

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8

Jacobus, Mark J. Aging of cables, connections, and electrical penetration assemblies used in nuclear power plants. Division of Engineering, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1990.

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M, Villaran, Subudhi M, U.S. Nuclear Regulatory Commission. Office of Nuclear Regulatory Research. Division of Engineering., and Brookhaven National Laboratory, eds. Aging assessment of bistables and switches in nuclear power plants. Division of Engineering, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1993.

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P, Samanta, Brookhaven National Laboratory, and U.S. Nuclear Regulatory Commission. Office of Nuclear Regulatory Research. Division of Systems Research., eds. Emergency diesel generator: Maintenance and failure unavailability, and their risk impacts. U.S. Nuclear Regulatory Commission, 1994.

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Book chapters on the topic "Power Electronics Reliability"

1

Sheblé, Gerald B. "Renewable Resource Reliability and Availability." In Power Electronics and Power Systems. Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-17190-6_4.

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2

Ang, Simon S., and H. Alan Mantooth. "Reliability of power electronics packaging." In Reliability of Power Electronic Converter Systems, 2nd ed. The Institution of Engineering and Technology, 2024. https://doi.org/10.1049/pbpo261e_ch6.

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Moens, Peter, Aurore Constant, and Abhishek Banerjee. "Reliability Aspects of 650-V-Rated GaN Power Devices." In Power Electronics and Power Systems. Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-43199-4_14.

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Junlakarn, Siripha, and Marija Ilić. "Toward Reconfigurable Smart Distribution Systems for Differentiated Reliability of Service." In Power Electronics and Power Systems. Springer US, 2013. http://dx.doi.org/10.1007/978-0-387-09736-7_18.

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Parikh, Primit. "Cascode Gallium Nitride HEMTs on Silicon: Structure, Performance, Manufacturing, and Reliability." In Power Electronics and Power Systems. Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-43199-4_10.

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Zhang, Hongming. "Experiences of Oscillation Detection and Mitigation in Grid Operations at PEAK Reliability." In Power Electronics and Power Systems. Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-89378-5_9.

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A. Martin, Henry, Edsger C. P. Smits, R. H. Poelma, Willem D. van Driel, and G. Q. Zhang. "An Outlook on Power Electronics Reliability and Reliability Monitoring." In Recent Advances in Microelectronics Reliability. Springer International Publishing, 2024. http://dx.doi.org/10.1007/978-3-031-59361-1_10.

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Lu, Chang, and Michael Pecht. "Anomaly detection and prognostics for power electronics." In Reliability of Power Electronic Converter Systems, 2nd ed. The Institution of Engineering and Technology, 2024. https://doi.org/10.1049/pbpo261e_ch2.

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Xia, Shihao, Ke Ma, Zian Qin, and Dao Zhou. "Active thermal control for improved reliability of power electronics systems." In Reliability of Power Electronic Converter Systems, 2nd ed. The Institution of Engineering and Technology, 2024. https://doi.org/10.1049/pbpo261e_ch8.

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Ma, Ke, Yongheng Yang, Huai Wang, and Frede Blaabjerg. "Design for Reliability of Power Electronics in Renewable Energy Systems." In Use, Operation and Maintenance of Renewable Energy Systems. Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-03224-5_9.

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Conference papers on the topic "Power Electronics Reliability"

1

Debreceni, Tibor, Bence Dániel Darázs, Christian Freitag, and Bálint Garai. "Automatized Multi-objective Optimization for Reliability of Power Electronics." In 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). IEEE, 2024. http://dx.doi.org/10.1109/estc60143.2024.10712033.

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Zhang, Min, Yongxing Yang, Yukai Wen, Wei Jiang, Dan Zhao, and Ke Shen. "A Survey of Lifetime Extension Techniques for High-Reliability Power Electronics." In 2024 27th International Conference on Electrical Machines and Systems (ICEMS). IEEE, 2024. https://doi.org/10.23919/icems60997.2024.10921451.

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Li, Ming, Zhaojun Yang, Gang Li, and Yingqin Wang. "Reliability Analysis of Transformer Busbar Considering Atmospheric Corrosion Effects." In 2024 International Conference on New Power System and Power Electronics (NPSPE). IEEE, 2024. https://doi.org/10.1109/npspe62515.2024.00036.

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Kozak, Joseph P., Juan Ramirez, Jesse Lin, Allison Orr, Alexander Martin, and Hala Tomey. "Active Gate Driver Power Supply for High-Reliability Applications." In 2025 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2025. https://doi.org/10.1109/apec48143.2025.10977269.

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Bailey, C., T. Tilford, and H. Lu. "Reliability Analysis for Power Electronics Modules." In 2007 30th International Spring Seminar on Electronics Technology. IEEE, 2007. http://dx.doi.org/10.1109/isse.2007.4432813.

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Bailey, Chris, Hua Lu, and Chunyan Yin. "Modelling Reliability of Power Electronics Packaging." In ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89430.

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Power Electronics uses semiconductor technology to convert and control electrical power. Demands for efficient energy management, conversion and conservation, and the increasing take up of electronics in transport systems (i.e. all electric car) there has been tremendous growth in the use of power electronics semiconductor devices such as Insulated Gate Bipolar Transistors (IGBT’s). The packaging of the power electronics devices involves a number of challenges for design engineers in terms of reliability and thermal management. For example IGBT modules will contain a number of semiconductor di

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Avery, C. R. "Power electronics reliability in rail traction." In IEE Colloquium on Power Electronics Reliability - Promise and Practice (Does it Deliver?). IEE, 1998. http://dx.doi.org/10.1049/ic:19980075.

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McCluskey, F. P., and A. Bar-Cohen. "Power electronics thermal packaging and reliability." In 2013 IEEE Transportation Electrification Conference and Expo (ITEC). IEEE, 2013. http://dx.doi.org/10.1109/itec.2013.6573464.

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DeVoto, Douglas, and Patrick McCluskey. "Reliable Power Electronics for Wind Turbines." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-11776.

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Power electronics are used in wind turbines to convert variable voltages and frequencies produced by the generator to fixed voltages and frequencies compliant with an electrical grid with minimal losses. The power electronic system is based on a series of three-phase pulse width modulated (PWM) power modules consisting of insulated-gate bipolar transistor (IGBT) power switches and associated diodes that are soldered to a ceramic substrate and interconnected with wirebonds. Power electronics can generate thermal loads in the hundreds of watts/cm2, therefore the design of the packaging and cooli

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Lu, H., W. S. Loh, T. Tilford, M. Johnson, and C. Bailey. "Reliability of Power Electronic Modules." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33817.

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The electric car, the all electric aircraft and requirements for renewable energy are examples of potential technologies needed to address the world problem of global warming/carbon emission etc. Power electronics and packaged modules are fundamental for the underpinning of these technologies and with the diverse requirements for electrical configurations and the range of environmental conditions, time to market is paramount for module manufacturers and systems designers alike. This paper details some of the results from a major UK project into the reliability of power electronic modules using

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Reports on the topic "Power Electronics Reliability"

1

Smith, Mark A., and Stanley Atcitty. Power electronics reliability analysis. Office of Scientific and Technical Information (OSTI), 2009. http://dx.doi.org/10.2172/986591.

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Erickson, Robert, Dragan Maksimovic, Yucheng Gao, et al. A High-Voltage High-Reliability Scalable Architecture for Electric Vehicle Power Electronics - Final Report. Office of Scientific and Technical Information (OSTI), 2022. http://dx.doi.org/10.2172/1973830.

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