Academic literature on the topic 'Pre amorphization'

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Pre amorphization.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Pre amorphization"

1

Yunin, P. A., M. N. Drozdov, A. V. Novikov, et al. "Complex Diagnostics of Silicon-on-Insulator Layers after Ion Implantation and Annealing." Поверхность. Рентгеновские, синхротронные и нейтронные исследования, no. 5 (September 22, 2024): 61–68. http://dx.doi.org/10.31857/s1028096024050094.

Full text
Abstract:
A technology was developed for activating ion-implanted dopants in silicon-on-insulator layers at a low annealing temperature (600°C) using the pre-amorphization technique of a silicon device layer. In the case of phosphorus implantation, silicon was amorphized directly by dopant ions. In the case of boron implantation for pre-amorphization, the layers were preliminary irradiated with argon or fluorine ions. Complex diagnostics of the implanted layers was carried out using secondary ion mass spectrometry, X-ray diffractometry and small-angle X-ray reflectometry. The combination of methods made
APA, Harvard, Vancouver, ISO, and other styles
2

Andrzejewski, M., N. Casati, and A. Katrusiak. "Reversible pressure pre-amorphization of a piezochromic metal–organic framework." Dalton Transactions 46, no. 43 (2017): 14795–803. http://dx.doi.org/10.1039/c7dt02511d.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Wen, D. S., J. Liu, C. M. Osburn, and J. J. Wortman. "Interface Traps Caused by Ge Pre‐Amorphization." Journal of The Electrochemical Society 132, no. 10 (1985): 2514–16. http://dx.doi.org/10.1149/1.2113613.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Schreutelkamp, R. J., J. S. Custer, J. R. Liefting, W. X. Lu, and F. W. Saris. "Pre-amorphization damage in ion-implanted silicon." Materials Science Reports 6, no. 7-8 (1991): 275–366. http://dx.doi.org/10.1016/0920-2307(91)90001-4.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Cellini, C., A. Carnera, M. Berti, et al. "Pre-amorphization damage study in as-implanted silicon." Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 96, no. 1-2 (1995): 227–31. http://dx.doi.org/10.1016/0168-583x(94)00488-9.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Hempel, Nele-Johanna, Matthias M. Knopp, Ragna Berthelsen, and Korbinian Löbmann. "Convection-Induced vs. Microwave Radiation-Induced in situ Drug Amorphization." Molecules 25, no. 5 (2020): 1068. http://dx.doi.org/10.3390/molecules25051068.

Full text
Abstract:
The aim of the study was to investigate the suitability of a convection oven to induce in situ amorphization. The study was conducted using microwave radiation-induced in situ amorphization as reference, as it has recently been shown to enable the preparation of a fully (100%) amorphous solid dispersion of celecoxib (CCX) in polyvinylpyrrolidone (PVP) after 10 min of continuous microwaving. For comparison, the experimental setup of the microwave-induced method was mimicked for the convection-induced method. Compacts containing crystalline CCX and PVP were prepared and either pre-conditioned at
APA, Harvard, Vancouver, ISO, and other styles
7

Murakami, Y., I. Tsunoda, H. Kido та ін. "Enhanced solid-phase growth of β-FeSi2 by pre-amorphization". Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 206 (травень 2003): 304–7. http://dx.doi.org/10.1016/s0168-583x(03)00750-x.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Azarov, A. Yu, A. I. Titov, and S. O. Kucheyev. "Effect of pre-existing disorder on surface amorphization in GaN." Journal of Applied Physics 108, no. 3 (2010): 033505. http://dx.doi.org/10.1063/1.3462380.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Li, Hong-Jyh, Peter Zeitzoff, Larry Larson, and Sanjay Banerjee. "B diffusion in Si with pre-amorphization of different species." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 22, no. 5 (2004): 2380. http://dx.doi.org/10.1116/1.1795250.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Delwail, C., S. Joblot, F. Mazen, et al. "Impact of the pre amorphization by Ge implantation on Ni0.9Pt0.1 silicide." Microelectronic Engineering 254 (February 2022): 111705. http://dx.doi.org/10.1016/j.mee.2021.111705.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Pre amorphization"

1

Delwail, Clara. "Etude de l'impact de la pré-amorphisation par implantation ionique pour l'optimisation des contacts siliciurés." Electronic Thesis or Diss., Aix-Marseille, 2022. http://theses.univ-amu.fr.lama.univ-amu.fr/220601_DELWAIL_838bz740xvto337mo443f_TH.pdf.

Full text
Abstract:
Le siliciure de Ni(10%Pt) est utilisé pour former les contacts des transistors MOS des nœuds technologiques avancés. Le siliciure de Ni(10%Pt) présente de nombreux avantages, cependant, les stabilités morphologique et thermique de la phase NiSi(Pt) posent des problèmes pour la fiabilité des composants. De plus, une diminution de la résistivité du siliciure est requise pour améliorer les performances électriques. Dans ce travail, l’influence de la PAI Ge sur la siliciuration et sur les propriétés du NiSi(Pt) est étudiée. Les conditions d’implantation ont été choisies pour faire varier la positi
APA, Harvard, Vancouver, ISO, and other styles
2

Lin, Yu-Chang, and 林裕章. "Shallow Junction Doping Formation on PMOSFET by Germanium Pre-Amorphization Implantation." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/49791559263956147738.

Full text
Abstract:
碩士<br>長庚大學<br>電子工程研究所<br>94<br>The main challenges for PMOSFET shallow junction formation remains the worst short channel effect (SCE) and high sheet resistance of source / drain. Ion implantation is the commonly used and best controlled technique in complementary metal-oxide-semiconductor (CMOS) technology to dope the source/drain extension (SDE) region of the device. It has been demonstrated that a method of forming low sheet resistance, shallow P+ junctions for improved PMOSFET short-channel performance on fabricated products. Shallow Si1-xGex self-aligned to the gate electrode is form by G
APA, Harvard, Vancouver, ISO, and other styles
3

Lee, Chao-Chung, and 李肇中. "Schottky Barrier Height Tuning of NiSi Using Yb Interlayer With Pre-Amorphization Implantation." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/78910484661778617482.

Full text
Abstract:
碩士<br>國立交通大學<br>電子研究所<br>99<br>The metal silicide source/drain (S/D) Schottky barrier (SB) MOSFETs are considered one of the most promising candidates for sub-22nm devices because of small series resistance of S/D, easy processing, low thermal budget, and excellent short channel effect immunity. However, SB MOSFETs usually suffer from a large leakage current at the drain in the off state and poor saturation drive current due to undesired high SB height (SBH). Ni silicide is the most promising silicide material because it has greater advantages than Ti silicide and Co silicide. Owing to the Fer
APA, Harvard, Vancouver, ISO, and other styles
4

Chen, Chin Yu, and 陳慶育. "Improvement of Contact Resistance and Leakage Current for FinFETs by Adopting Ge Pre-Amorphization Implantation." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/92197321391993049667.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Pre amorphization"

1

Aneesh, Mathew, Adukkadukkam Dineshan, and Lee King Suen. "Study of Pre-Amorphization Implant Species Impact on PNP Performance." In 2025 36th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). IEEE, 2025. https://doi.org/10.1109/asmc64512.2025.11010373.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Liu, Chang, Xu Chen, Jinbiao Liu, et al. "Reduction of Specific Contact Resistivity by Employing Pre-Amorphization Implantation and In-Situ Steam Generation Oxidation." In 2024 IEEE 17th International Conference on Solid-State & Integrated Circuit Technology (ICSICT). IEEE, 2024. https://doi.org/10.1109/icsict62049.2024.10831274.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Johnson, Gregory M., Cheryl Hartfield, Andreas Rummel, Heiko Stegmann, and Lorenz Lechner. "Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-Node SRAMs." In ISTFA 2024. ASM International, 2024. http://dx.doi.org/10.31399/asm.cp.istfa2024p0478.

Full text
Abstract:
Abstract The effects of sample prep with a Ga+-ion Focused Ion Beam (Ga-FIB) on measurements of electron beam induced current (EBIC) were studied. Concerns have been occasionally raised about amorphization from the beam, or even Ga+ implantation ruining the ability to make useful measurements for purposes of either failure analysis or device tailoring. To understand the magnitude of any deleterious effects, two different lamellae from a 5 nm SRAM sample were prepared with different areas of increasingly improved polish, as indicated by decreasing, cumulative, FIB beam energy, followed by EBIC
APA, Harvard, Vancouver, ISO, and other styles
4

Chen, Pin Hong, Chia Chang Hsu, Jerander Lai, et al. "Investigation pre-amorphization implantation on nickel silicide formation." In 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC). IEEE, 2014. http://dx.doi.org/10.1109/iitc.2014.6831887.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Surdeanu, Radu, Bartek J. Pawlak, Richard Lindsay, et al. "Pre-amorphization and co-implantation suitability for advanced PMOS devices integration." In 2003 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2003. http://dx.doi.org/10.7567/ssdm.2003.b-8-2.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Park, Soon-Yeol, Bum-Goo Cho, and Taeyoung Won. "Atomistic modeling on carbon co-implant with silicon pre-amorphization implant technique." In 2008 IEEE Silicon Nanoelectronics Workshop (SNW). IEEE, 2008. http://dx.doi.org/10.1109/snw.2008.5418405.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Xu, Peng, Xiangbiao Zhou, Na Zhao, Dan Zhao, and Dongping Wu. "Formation of ultra-shallow junctions with pre-amorphization implant and microwave annealing." In 2013 13th International Workshop on Junction Technology (IWJT). IEEE, 2013. http://dx.doi.org/10.1109/iwjt.2013.6644513.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Yoshifumi Nishi, Yoshinori Tsuchiya, Atsuhiro Kinoshita, Akira Hokazono, and Junji Koga. "Successful enhancement of metal segregation at NiSi/Si junction through pre-amorphization technique." In 2008 Symposium on VLSI Technology. IEEE, 2008. http://dx.doi.org/10.1109/vlsit.2008.4588615.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Yu, H., M. Schaekers, A. Hikavyy, et al. "Ultralow-resistivity CMOS contact scheme with pre-contact amorphization plus Ti (germano-)silicidation." In 2016 IEEE Symposium on VLSI Technology. IEEE, 2016. http://dx.doi.org/10.1109/vlsit.2016.7573381.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Hsiao, T. C., P. Liu, and J. C. S. Woo. "A novel salicide technology for thin film SOI MOSFETs using Ge pre-amorphization." In 1996 IEEE International SOI Conference Proceedings. IEEE, 1996. http://dx.doi.org/10.1109/soi.1996.552526.

Full text
APA, Harvard, Vancouver, ISO, and other styles
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!