Relevant bibliographies by topics / Pre-silicon evaluation

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Pre-silicon evaluation'

Author: Grafiati
Published: 1 June 2024
Last updated: 31 July 2025

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Journal articles on the topic "Pre-silicon evaluation"

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Radue, C., and E. E. van Dyk. "Pre-deployment evaluation of amorphous silicon photovoltaic modules." Solar Energy Materials and Solar Cells 91, no. 2-3 (2007): 129–36. http://dx.doi.org/10.1016/j.solmat.2006.07.007.

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Latukhina, N. V., D. A. Pisarenko, A. V. Volkov, and V. A. Kitaeva. "PHOTOSENSITIVE MATRIX BASED ON POROUS MICROCRYSTALLINE SILICON." Vestnik of Samara University. Natural Science Series 17, no. 5 (2017): 115–21. http://dx.doi.org/10.18287/2541-7525-2011-17-5-115-121.

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The article presents the results of experimental researches of optoelectric properties of porous silicon. Layers of porous silicon were formed using electrochemical etching process in water-alcohol solutions of hydrofluoric acid on plates with a pre-established microrelief surface. Evaluation of possibility of using of created structure as the artificial retina component was performed based on the results of the research.
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Ankit Chandankhede. "Firmware based Bug Finding Mechanisms in Pre-Silicon Environment." International Journal of Science and Research Archive 1, no. 1 (2020): 133–40. https://doi.org/10.30574/ijsra.2020.1.1.0030.

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In continuous progression of Moore’s Law, modern architectures in CPU , GPU and custom chips have introduced different features based on the modern application of datacenters, gaming consoles and edge computing. This has significantly increased the complexity of design space and exponentially increased the verification space. With increasing competition, it is pivotal to reduce the verification cycles as well as meet the bug finding techniques tap-out milestone. Quality of the verification can be easily achieved with the bug finding techniques proposed in this paper. These techniques not only
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Kim, Gyu Hyun, Geun Min Choi, and Young Wook Song. "Evaluation of Wafer Drying Methods for GIGA-LEVEL Device Fabrication." Solid State Phenomena 103-104 (April 2005): 67–70. http://dx.doi.org/10.4028/www.scientific.net/ssp.103-104.67.

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This study deals with drying induced water marks dependency on the last cleaning methods, substrate conditions, and drying pre-step delaying times, which are supposed to become a big issue with down scaling of device geometry. The data show that water marks induced by drying failure increase with increasing contact angle on the various surfaces. They are mainly composed of either silicon oxide only or silicon oxide with organic compounds. The former is removed by a dilute HF and/or hot SC-1 treatment and the latter is removed by organic removal cleaning followed by dilute HF etching.
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Guilley, Sylvain, Khaled Karray, Thomas Perianin, Ritu-Ranjan Shrivastwa, Youssef Souissi, and Sofiane Takarabt. "Side-Channel Evaluation Methodology on Software." Cryptography 4, no. 4 (2020): 27. http://dx.doi.org/10.3390/cryptography4040027.

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Cryptographic implementations need to be robust amidst the widespread use of crypto-libraries and attacks targeting their implementation, such as side-channel attacks (SCA). Many certification schemes, such as Common Criteria and FIPS 140, continue without addressing side-channel flaws. Research works mostly tackle sophisticated attacks with simple use-cases, which is not the reality where end-to-end evaluation is not trivial. In this study we used all due diligence to assess the invulnerability of a given implementation from the shoes of an evaluator. In this work we underline that there are
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Willems, Geert, and Herman Maes. "Evaluation of a Pre-Objective Scan System for the Laser Recrystallization of Silicon on Insulator Material." Japanese Journal of Applied Physics 31, Part 1, No. 8 (1992): 2631–39. http://dx.doi.org/10.1143/jjap.31.2631.

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Hossain, Sk Saddam, Soumya Sarkar, Naresh Kr Oraon, and Ashok Ranjan. "Pre-ceramic polymer-derived open/closed cell silicon carbide foam: microstructure, phase evaluation, and thermal properties." Journal of Materials Science 51, no. 21 (2016): 9865–78. http://dx.doi.org/10.1007/s10853-016-0220-1.

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Zaman, Muhammad Yousuf, Denis Perrone, Sergio Ferrero, Luciano Scaltrito, and Marco Naretto. "Evaluation of Correct Value of Richardson's Constant by Analyzing the Electrical Behavior of Three Different Diodes at Different Temperatures." Materials Science Forum 711 (January 2012): 174–78. http://dx.doi.org/10.4028/www.scientific.net/msf.711.174.

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Various attempts have been made to evaluate the correct value (A*=146 A/cm2.K2) ofRichardson's constant. In 2005 S. Ferrero et al. published their research in which they performedan analysis of electrical characterizations of twenty Ti/4H-SiC(titanium on silicon carbide) Schottkydiodes with the help of thermionic emission theory and evaluated the value of Richardson's constantto be 17±8 A/cm2.K2; which is very low as compared to the theoretical value of 146 A/cm2.K2.Wehave tried in this paper to evaluate the Richardson's constant's value by nearly same experimental tech-niques followed by S. F
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Radun, V., R. P. von Metzen, T. Stieglitz, V. Bucher, and A. Stett. "Evaluation of adhesion promoters for Parylene C on gold metallization." Current Directions in Biomedical Engineering 1, no. 1 (2015): 493–97. http://dx.doi.org/10.1515/cdbme-2015-0118.

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AbstractDelamination of thin film polymeric coatings from metallization layers is a common cause of failure in biomedical implants. To address the problem, different adhesion promotion techniques can be applied which include surface pre-treatment with oxygen and argon plasma and the use of different adhesion promoters. In this paper the applicability of titanium (Ti), silicon oxide (SiOx), diamond-like carbon (DLC), tetramethylsilane (TMS) and aluminium oxide (AlOx) as adhesion promoters is evaluated. A cross cut, peel and scratch test are used to qualify and quantify the adhesion before and a
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Shibata, Satoshi, Fumitoshi Kawase, Akihiko Kitada, Takashi Kouzaki, and Akira Kitamura. "Evaluation of Pre-Amorphized Layer Thickness and Interface Quality of High-Dose Shallow Implanted Silicon by Spectroscopic Ellipsometry." IEEE Transactions on Semiconductor Manufacturing 23, no. 4 (2010): 545–52. http://dx.doi.org/10.1109/tsm.2010.2072450.

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Dissertations / Theses on the topic "Pre-silicon evaluation"

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Yao, Yuan. "Towards Comprehensive Side-channel Resistant Embedded Systems." Diss., Virginia Tech, 2021. http://hdl.handle.net/10919/104662.

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Embedded devices almost involve every part of our lives, such as health condition monitoring, communicating with other people, traveling, financial transactions, etc. Within the embedded devices, our private information is utilized, collected and stored. Cryptography is the security mechanism within the embedded devices for protecting this secret information. However, cryptography algorithms can still be analyzed and attacked by malicious adversaries to steal secret data. There are different categories of attacks towards embedded devices, and the side-channel attack is one of the powerful at
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Takarabt, Sofiane. "Évaluation pré-silicium de circuits sécurisés face aux attaques par canal auxiliaire." Electronic Thesis or Diss., Institut polytechnique de Paris, 2021. http://www.theses.fr/2021IPPAT015.

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Les systèmes embarqués sont constamment menacés par diverses attaques, notamment les attaques side-channel. Pour garantir un certain niveau de sécurité, les implémentations cryptographiques doivent valider des tests d’évaluation recommandés par les standards de certifications, et ainsi répondre aux besoins du marché. Pour cette raison, il est nécessaire d’implémenter des contremesures fiables pour contrer ce type d’attaques. Néanmoins, une fois ces contremesures implémentées, les tests de vérification et de validation peuvent s’avérer très coûteux en temps et en argent. Ainsi, minimiser le nom
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Wu, Yu-hsin, and 吳育星. "Optimization of Signal Integrity by Using Amplitude Adjustment in a Pre-Silicon Full-Transmission Evaluation." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/63144969227910399384.

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碩士<br>國立中央大學<br>電機工程研究所碩士在職專班<br>99<br>In the recent years, as the High definition video and bulk size format data transfer became popular, the Gb/s level high speed differential transmission signals like HDMI, SATA and USB3.0 are instead of the traditional style became more popular in 3C market. The newest generation transmission interface had been developed for this requirement In the Gb/s high speed, these loadings became the major factors for signal integrity. How to estimate the signal integrity of high speed differential pairs is more important for real product in Pre-silicon full-transm
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Book chapters on the topic "Pre-silicon evaluation"

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Rahman, Ismail Abdul, and Frank L. Riley. "High quality silicon nitride powder derived from Malaysian rice husks." In Chemistry and Technology of Silicon and Tin. Oxford University PressOxford, 1992. http://dx.doi.org/10.1093/oso/9780198555803.003.0029.

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Abstract a-Silicon nitride powder has been prepared by nitriding pyrolysed rice husks incorporated with 4 per cent pre-formed silicon nitride at a temperature of about 1450°C and under a 95 per cent N/5 per cent H atmosphere. The silicon nitride powder is obtained in the form of equiaxed, sub-micrometer, and uniformly distributed particles. A material evaluation based on its powder characteristics, hot-pressing behaviour, and other properties shows that this silicon nitride is of a good quality compared to that of the best currently available commercial powders. Thus, rice husks are a good, ch
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Conference papers on the topic "Pre-silicon evaluation"

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Sarker, Pantha Protim, Tianze Kan, Jingchen Liang, et al. "ML-EMFI: A Machine Learning-Driven Pre-Silicon Electromagnetic Fault Injection Security Evaluation for Robust IC Design." In 2025 IEEE International Symposium on Hardware Oriented Security and Trust (HOST). IEEE, 2025. https://doi.org/10.1109/host64725.2025.11050050.

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Perdomo, Elias, Alexander Kropotov, Francelly Katherine Cano Ladino, et al. "Makinote: An FPGA-Based HW/SW Platform for Pre-Silicon Emulation of RISC-V Designs." In RAPIDO '24: Rapid Simulation and Performance Evaluation for Design. ACM, 2024. http://dx.doi.org/10.1145/3642921.3642928.

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Takarabt, Sofiane, Kais Chibani, Adrien Facon, et al. "Pre-silicon Embedded System Evaluation as New EDA Tool for Security Verification." In 2018 IEEE 3rd International Verification and Security Workshop (IVSW). IEEE, 2018. http://dx.doi.org/10.1109/ivsw.2018.8494881.

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Esposito, C., C. De Martino, S. Lehmann, Zhixing Zhao, M. Schroter, and M. Spirito. "Pre-Silicon direct Calibration/De-embedding Evaluation and Device Parameters Uncertainty Estimation." In 2021 97th ARFTG Microwave Measurement Conference (ARFTG). IEEE, 2021. http://dx.doi.org/10.1109/arftg52261.2021.9640156.

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Rusu, Alecsandra, Emilian David, Marina Țopa, Vasile Grosu, Andi Buzo, and Georg Pelz. "Improvement and Performance Evaluation of an Adaptive Method for Integrated Circuits Pre-silicon Verification." In 2023 International Symposium on Signals, Circuits and Systems (ISSCS). IEEE, 2023. http://dx.doi.org/10.1109/isscs58449.2023.10190850.

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Nikiforov, Dima, Shengjun Chris Dong, Chengyi Lux Zhang, Seah Kim, Borivoje Nikolic, and Yakun Sophia Shao. "RoSÉ: A Hardware-Software Co-Simulation Infrastructure Enabling Pre-Silicon Full-Stack Robotics SoC Evaluation." In ISCA '23: 50th Annual International Symposium on Computer Architecture. ACM, 2023. http://dx.doi.org/10.1145/3579371.3589099.

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Tiwari, Santosh K., and Brian K. Paul. "Fabrication of TiO2 and SiO2 Thin Films by Room Temperature Liquid Phase Deposition." In ASME 2007 International Manufacturing Science and Engineering Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/msec2007-31093.

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Mesoporous and dense titanium dioxide (TiO2) and silicon dioxide (SiO2) films were deposited directly from nanoparticle colloidal suspensions on quartz using a liquid phase deposition technique. The quartz surface was pre-treated with an -OH group to activate the deposition surface for crack-free adhesion. The deposited films were characterized with the help of scanning electron microscope for microstructural evaluation. An optical profilometer was used to measure the optical properties of the SiO2 film. The reflectance and transmittance patterns of the film were analyzed to determine the inde
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Newton, Christopher D., Steven P. Jordan, Martin R. Bache, and Louise Gale. "High Temperature Fatigue Assessment of a SiCf/SiC Ceramic Matrix Composite Using Advanced Monitoring Techniques." In ASME Turbo Expo 2019: Turbomachinery Technical Conference and Exposition. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/gt2019-90355.

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Abstract Laboratory based experiments to assess the “damage tolerance” of any new material system are a pre-requisite to engineering design, especially for aerospace components. In the case of CMCs, macro-scale specimens are preferred containing representative fibre-matrix architectures that support the definition of mechanical properties under service representative stress states. The combination of complex internal structure and inevitable processing artefacts within CMCs provides numerous sites for damage initiation. Damage then progresses in an inhomogeneous manner prior to ultimate failur
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Presby, Michael J., Jamesa L. Stokes, Bryan J. Harder, John A. Setlock, and Jeffrey R. Hammel. "Effects of CMAS Application on the Isothermal and Gradient Thermal Cycling Behavior of a Yb2Si2O7 EBC." In ASME Turbo Expo 2024: Turbomachinery Technical Conference and Exposition. American Society of Mechanical Engineers, 2024. http://dx.doi.org/10.1115/gt2024-121782.

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Abstract Environmental barrier coatings (EBCs) are critical to the continued advancement of gas turbine hot section materials technology. EBCs are required to protect Si-based ceramics such as silicon carbide fiber-reinforced silicon carbide (SiC/SiC) ceramic matrix composites (CMCs) from oxidation and corrosion in the combustion environment. One of the current challenges concerning EBC lifetime is the thermochemical reactions between calcium-magnesium-aluminosilicate (CMAS) deposits and the EBC that leads to changes in both composition and stress state. These changes can severely reduce the i
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Tedesco, Sarah, Ming Shi, Jason Coryell, Qi Lu, and Jianfeng Wang. "New Generation Press Hardening Steels with Tensile Strength of 1.7-2.0 GPa and Enhanced Bendability." In HT2021. ASM International, 2021. http://dx.doi.org/10.31399/asm.cp.ht2021p0180.

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Abstract Press hardening steel (PHS) applications predominately use 22MnB5 AlSi coated in the automotive industry. This material has a limited supply chain. Increasing the tensile strength and bendability of the PHS material will enable light-weighting while maintaining crash protection. In this paper, a novel PHS is introduced, and properties are compared to 22MnB5. The new Coating Free PHS (CFPHS) steel, 25MnCr, has increased carbon, with chromium and silicon additions for oxidation resistance. Its ultimate tensile strength (UTS) of 1.7 GPa with bending angle above 55° at 1.4mm thickness imp
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