Relevant bibliographies by topics / Printed electronic coating

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Printed electronic coating'

Author: Grafiati
Published: 7 July 2024
Last updated: 31 July 2025

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Journal articles on the topic "Printed electronic coating"

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Lu, Taofeng, Gregory Reimonn, Gregory Morose, Evan Yu, and Wan-Ting Chen. "Removing Acrylic Conformal Coating with Safer Solvents for Re-Manufacturing Electronics." Polymers 13, no. 6 (2021): 937. http://dx.doi.org/10.3390/polym13060937.

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Conformal coating is typically composed of polymeric film and is used to protect delicate electronic components such as printed-circuit boards. Without removing conformal coating, it would be difficult to repair these complicated electronics. Methylene chloride, also called dichloromethane (DCM), has a widespread usage in conformal coating stripper products. The high toxicity of DCM increases human health risk when workers are exposed to DCM during the conformal coating removal processes. Therefore, the replacement of DCM would be beneficial to greatly improve the overall safety profile for wo
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Rajendran, Mohana, and Marto Giftlin. "Novel Development of Corrosion Resistant Paint Using Printed Circuit Board from Modern Electronic Wastes." Trends in Sciences 19, no. 6 (2022): 2901. http://dx.doi.org/10.48048/tis.2022.2901.

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The growth in the industrial technology and communication sectors has enhanced the usage of electronic gadgets exponentially. Thus, it becomes highly essential to find new solution to utilize or dispose these e-wastes, in order to reduce the e-waste generation. Various reports mentioned that the major component of these e-wastes is their Printed Circuit Boards. Therefore, a new ideology is proposed to use these boards to produce a new coating with good corrosion resistance. At first the boards were separated from the discarded electronic appliances and various electrical elements were separate
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Szocinski, Michal. "AFM-assisted investigation of conformal coatings in electronics." Anti-Corrosion Methods and Materials 63, no. 4 (2016): 289–94. http://dx.doi.org/10.1108/acmm-09-2014-1426.

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Purpose This paper aims to presents a new method of investigation of local properties of conformal coatings utilized in microelectronics. Design/methodology/approach It is based on atomic force microscopy (AFM) technique supplemented with the ability of local electrical measurements, which apart from topography acquisition allows recording of local impedance spectra, impedance imaging and dc current mapping. Potentialities of the proposed AFM-assisted approach have been demonstrated on commercially available epoxy-coated electronic printed boards in as-received state and after six-year service
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Lee, Sang, and Sangyoon Lee. "Fabrication and Characterization of Roll-to-Roll Printed Air-Gap Touch Sensors." Polymers 11, no. 2 (2019): 245. http://dx.doi.org/10.3390/polym11020245.

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Although printed electronics technology has been recently employed in the production of various devices, its use for the fabrication of electronic devices with air-gap structures remains challenging. This paper presents a productive roll-to-roll printed electronics method for the fabrication of capacitive touch sensors with air-gap structures. Each layer of the sensor was fabricated by printing or coating. The bottom electrode, and the dielectric and sacrificial layers were roll-to-roll slot-die coated on a flexible substrate. The top electrode was formed by roll-to-roll gravure printing, whil
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Pfeiffenberger, Neal T., and Saeid Biria. "Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit Boards." International Symposium on Microelectronics 2021, no. 1 (2021): 000281–85. http://dx.doi.org/10.4071/1085-8024-2021.1.000281.

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Abstract Conformal coatings are thin polymeric layers applied on (RF)/microwave printed circuit boards, chips, dies and other electronic components to protect them from moisture and corrosion. Despite this protection, exposure to excessive humidity can cause delamination, increase dissipation factors and dielectric constants of the coating, and changing circuit switching-speed. In this paper, we will discuss dielectric performance of UVA LED-curable resin formulations with enhanced flexibility and adhesion as a new approach compared to traditional mercury UV curable conformal coatings. These a
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Tantrairatn, Suradet, Paphakorn Pitayachaval, Sirisak Rangklang, and Jiraphon Srisertpol. "A Comparison of Cover Coat Methods for Electronic Flexible Printed Circuit (E-FPC) Based on Peeling Strength." Advanced Materials Research 421 (December 2011): 489–92. http://dx.doi.org/10.4028/www.scientific.net/amr.421.489.

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In electronic flexible printed circuit (E-FPC) manufacturing procedure, the cover laminating process in which the line circuit (copper wire) is covered with hot cover layer on the printed circuits is importance process. This process will help to increase elasticity, strength and corrosion protection to the product therefore this process can affect directly to quality of the printed circuit. The process for laminating printed circuits can be classified into two methods by coating with industry iron and hot bar machine. This article compares the quality of the electrical circuit between industry
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Kellomäki, Tiiti, Johanna Virkki, Sari Merilampi, and Leena Ukkonen. "Towards Washable Wearable Antennas: A Comparison of Coating Materials for Screen-Printed Textile-Based UHF RFID Tags." International Journal of Antennas and Propagation 2012 (2012): 1–11. http://dx.doi.org/10.1155/2012/476570.

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(Radio frequency identification) RFID tags integrated into clothing enable monitoring of people without their conscious effort. This requires tags to be an unnoticeable part of clothing and comfortable to wear. In this study, RFID antennas were screen printed on two different fabrics, six different coating materials for the (integrated circuits) ICs were applied, and the reliability of these RFID tags was tested with moisture and laundry tests. Generally, glue-type coating materials were easier to handle and could be spread precisely. All the tags were operational immediately after the coating
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Park, Won-Tae, and Yong-Young Noh. "A self-aligned high resolution patterning process for large area printed electronics." Journal of Materials Chemistry C 5, no. 26 (2017): 6467–70. http://dx.doi.org/10.1039/c7tc01590a.

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Stephan, Harkema, A. Rensing Peter, M.D.C. Domensino Sanne, M. Vermeijlen Joris, E. Godoi Bizarro Diana, and van Schaik Antoinette. "Disassembly of in-plastic embedded printed electronics." Journal of Cleaner Production 450 (March 21, 2024): 141837. https://doi.org/10.1016/j.jclepro.2024.141837.

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We explored a novel design-for-recycling method for encapsulated printed electronics in an injection-moldedpackage that improves disassembly at End-of-Life (EoL). To this end, a non-adhering disassembly layer(NADL) was applied onto the printed circuitry and light-emitting diodes prior to injection molding. Surprisingly,the devices with a disassembly layer remained fully functional after injection molding, despite exposure to highshear forces and elevated temperatures. Facilitating the disassembly of an encapsulated electronic device using aweak link in the adhesion strength of the overmolded e
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Senophiyah-Mary, J., R. Loganath, and T. Meenambal. "A novel method for the removal of epoxy coating from waste printed circuit board." Waste Management & Research: The Journal for a Sustainable Circular Economy 36, no. 7 (2018): 645–52. http://dx.doi.org/10.1177/0734242x18782392.

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The printed circuit board, which is the heart of all electronic devices, is a rich source of metal, which could act as a future resource. Bioleaching, a biological treatment, would be an appropriate method for the environmentally sound management of e-waste. Various strippers are used to remove the epoxy coating and it is harmful to remove the epoxy coating with those solvents and salts in the open because of the presence of brominated flame retardants on the surface of the printed circuit board, which leads to serious health issues. An alternate process is required to remove the epoxy coating
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Dissertations / Theses on the topic "Printed electronic coating"

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Mustonen, T. (Tero). "Inkjet printing of carbon nanotubes for electronic applications." Doctoral thesis, University of Oulu, 2009. http://urn.fi/urn:isbn:9789514293092.

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Abstract In this thesis, preparation of carbon nanotube (CNT) inks and inkjet printing of aqueous dispersions of CNTs for certain electrical applications are studied. The nanotube inks prepared in this work are based on chemically oxidized CNTs whose polar side groups enable dispersion in polar solvents. Subsequent centrifugation and decanting processes are used to obtain stable dispersions suitable for inkjet printing. The inks are based on either carboxyl functionalized multi-walled carbon nanotubes (MWCNTs), carboxyl functionalized single wall carbon nanotubes (SWCNTs) or SWCNT-polymer comp
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Bent, Westin R. "Evaluating the effect of conformal coatings in reducing the rate of conductive anodic filament." Thesis, Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/20128.

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Öhlund, Thomas. "Metal Films for Printed Electronics : Ink-substrate Interactions and Sintering." Doctoral thesis, Mittuniversitetet, Avdelningen för naturvetenskap, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-23420.

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A new manufacturing paradigm may lower the cost and environmental impact of existing products, as well as enable completely new products. Large scale, roll-to-roll manufacturing of flexible electronics and other functionality has great potential. However, a commercial breakthrough depends on a lower consumption of materials and energy compared with competing alternatives, and that sufficiently high performance and reliability of the products can be maintained. The substrate constitutes a large part of the product, and therefore its cost and environmental sustainability are important. Electrica
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Åkerfeldt, Maria. "Electrically conductive textile coatings with PEDOT:PSS." Doctoral thesis, Högskolan i Borås, Akademin för textil, teknik och ekonomi, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:hb:diva-19.

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In smart textiles, electrical conductivity is often required for several functions, especially contacting (electroding) and interconnecting. This thesis explores electrically conductive textile surfaces made by combining conventional textile coating methods with the intrinsically conductive polymer complex poly(3,4-ethylene dioxythiophene)-poly(styrene sulfonate) (PEDOT:PSS). PEDOT:PSS was used in textile coating formulations including polymer binder, ethylene glycol (EG) and rheology modifier. Shear viscometry was used to identify suitable viscosities of the formulations for each coating meth
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Leopold, Diatezo. "Multifunctional materials for intelligent textile : Toward automotive applications." Electronic Thesis or Diss., Lyon, INSA, 2023. http://www.theses.fr/2023ISAL0114.

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Ce projet de recherche de doctorant concerne l’élaboration et l’utilisation de matériaux multifonctionnels imprimable, en mettant l’accent sur les compromis entre propriétés matériaux et spécification applicative, avec un focus autour des fonctions de chauffage par effet joule et d’électroluminescence. L’originalité des travaux repose sur une approche couplée entre matériaux multifonctionnels et intégration textile. Le premier point de l’étude concerne la sélection des matériaux multifonctionnels jugés comme potentiellement intéressants pour la création de textiles intelligents adaptés aux sec
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Books on the topic "Printed electronic coating"

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Dunn, Barrie D. Evaluation of conformal coatings for future spacecraft applications. European Space Agency, 1994.

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Book chapters on the topic "Printed electronic coating"

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Tan, Loon-Seng. "Poly(amide imide)." In Polymer Data Handbook. Oxford University PressNew York, NY, 2009. http://dx.doi.org/10.1093/oso/9780195181012.003.0056.

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Abstract Major Applications A wide variety of injection-molded automotive parts such as housings, connectors, switches, relays, thrust washers, spline liners, valve seats, bushings, piston rings and seals, wear rings, ball bearings, rollers, thermal insulators etc.; laminated parts such as printed circuit boards, honeycomb core, radomes, etc.; coating for magnet wires; mechanical parts for business machines; aerospace applications such as jet-engine components, compressor and generator parts, and electronic devices; hydraulic/pneumatic parts such as bushings, seals, vanes, and flow-control par
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Tiancheng Wei, Wei, Yu Sun, and Eunkyoung Shim. "Progress of Recycled Polyester in Rheological Performance in Molding, and Economic Analysis of Recycled Fibers in Fashion and Textile Industry." In Next-Generation Textiles [Working Title]. IntechOpen, 2022. http://dx.doi.org/10.5772/intechopen.103864.

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In textiles, in particular wearable technology structured, battery-illuminated electronic fabrics are moving toward to both electrical and esthetic aspects of printed LED (PLED) textiles. It is on one dimension that have had questioned an economic resolution of extensional methods as for battery-charged interior materials, and also has gained a more general questions on how to develop its recycle both yarn and fiber as traditional raw goods in together with any recyclable electronic parts or graphene, carbon nanotube contained components with that textile materials. Furthermore, recyclable ass
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Shelley, Mee Y., and Jennifer L. Braun. "Epoxy Resins." In Polymer Data Handbook. Oxford University PressNew York, NY, 2009. http://dx.doi.org/10.1093/oso/9780195181012.003.0023.

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Abstract Trade Names Araldite, DER, Epi-Cure, Epi-Res, Epikote, Epon, Epotuf, etc. Class Thermoset polymers, after curing (the uncured base resins are thermoplastic) Major Resin Types DGEBA (diglycidyl ether of bisphenol A), novolacs, peracid resins, hydantoin resins, etc. Other Ingredients in Epoxy Formulation Diluents, resinuous modifiers (to affect flexibility, toughness, peel strength, adhesion, etc.), fillers, colorants and dyes, other additives (e.g., rheological additives, flame retardants). Major Applications Protective coatings (for appliance, automotive primers, pipes, etc.). Encapsu
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Conference papers on the topic "Printed electronic coating"

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Horton, Ira D., and Allen N. Budge. "Electronic Corrosion in Aerospace Equipment." In CORROSION 1985. NACE International, 1985. https://doi.org/10.5006/c1985-85330.

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Abstract Corrosion of electronics, especially on printed circuit boards (PCBs) in the missile and aircraft industries have been a major problem for years. The causes and treatment of this corrosion is much the same as for many other types of corrosion on other systems. Some environments in certain locations, cause unique kinds corrosion. The corrosion of electronics found in launch facilities (LF), launch control facilities (LCF) and sealed components of many types of aircrafts is a major problem in the Air Force. Some require special treatment. Conformal coatings as a means of protection of t
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Gorges, Roger, William Bisgrove, Ryan Curtis, et al. "Integration of Printed Sensors in Plain Engine Bearings." In ASME 2018 Internal Combustion Engine Division Fall Technical Conference. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/icef2018-9545.

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The integration of sensors in engine components has been a long-standing wish of engine manufacturers and researchers. Conventional probes are particularly difficult to mount in moving engine parts and require time-intensive and costly preparation, while often still not reaching the site of interest close enough. The advances recently made in the field of printed electronics enable new possibilities for sensor integration that previously were not possible. Particularly, crankshaft engine bearings are an interesting component to apply those new sensors to. An important enabling factor for the s
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Glassmaker, Nicholas, Ye Mi, Mukerrem Cakmak, and Ali Shakouri. "Roll to Roll Manufacturing and In-Line Imaging and Characterization of Functional Films." In ASME 2022 17th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/msec2022-85553.

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Abstract Roll-to-roll manufacturing is a promising platform to produce low cost, high quality electrical components and sensors for Internet of Things (IoT) applications. Within the roll-to-roll laboratories at Purdue University, a range of processes and machines have been developed to: 1) print patterns of conductive and sensing materials for use in electronic sensors, 2) cast films precisely with integrated functional materials, and 3) monitor quality of the printing and casting processes in-line in real time. A major development is the custom-designed and built Maxwell coating machine, whic
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Huang, Mengyu, Lan Li, Chao Yuan, Bin Xie, Xingjian Yu, and Xiaobing Luo. "Simulation of stamp-printed coating process in light-emitting diodes packaging by Lattice Boltzmann method." In 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2015. http://dx.doi.org/10.1109/icept.2015.7236764.

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Singh, Prabjit. "Arcing and Spacing Requirements for High Voltage Printed Circuit Boards." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48180.

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The electronic hardware miniaturization trend continues unabated. The reduced feature spacing expose the high voltage power supply circuits to arcing. The power MOSFET gate to drain and the drain to source lead gaps are narrow enough for zinc whiskers emanating from under the raised floor zinc plated tiles to arc across the MOSFET leads. Arcing can also occur because of paper cellulose fibers and dust in high relative humidity environments. The physics of arcing will be presented. Paschen’s law of arcing will be described; it will be shown how the law led to a novel way of testing power suppli
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Fenger, H. S., and T. E. Wong. "COTS BGA Thermal Fatigue Test for Avionics Applications." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35017.

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The objectives of the present studies are to design and test representative commercial off-the-shelf plastic encapsulated microcircuits, including various types of ball grid array (BGA) components, chip scale package, and flip chip over military thermal environment. The approach is to demonstrate the solder joint reliability performance of these components through the design of an electrical daisy-chain pattern printed wiring board (PWB) assembly test vehicle (TV), in which the design and manufacturing variables are included. The variables, including the types of PWBs, conformal coating, and B
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Furuta, Atsuhiro, Kazuki Honjo, and Jun Taniguchi. "Fabrication of Flexible Interposer Using Printing Method." In JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/lemp2020-8524.

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Abstract In recent years, flexible electronic devices such as printed electronics are gathering attention. To make flexible connect between one circuit device and another circuit device, interposer is necessary. However, most of conventional interposers are not flexible, because there are made of silicon or glass substrate. To solve this problem, we have been developed fabrication process of flexible interposer. Master mold was fabricated by photolithography process. First, SU-8 resist was coated on silicon substrate with 5μm thickness. Then, photolithography process was carried out to SU-8 re
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Wong, T. E., C. Y. Lau, L. A. Kachatorian, H. S. Fenger, and I. C. Chen. "Design of Experiments in Ball Grid Array Thermal Fatigue Life Tests." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-32827.

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The objective of the present study is to evaluate the impact of electronic packaging design/manufacturing process parameters on the thermal fatigue life of ball grid array (BGA) solder joints. The four selected parameters are BGA under-fill materials, conformal coating, solder pad sizes on printed wiring board, and BGA rework, with each having either two or three levels of variation. A test vehicle (TV), on which various sizes of BGA daisy-chained packages are soldered, is first designed and fabricated, and then subjected to temperature cycling (−55°C to +125°C) with continuous monitoring of s
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Cho, Sungdong, Jin-Gul Hyun, and Kuyng-Wook Paik. "Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic Substrate Applications." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35149.

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Embedded capacitor technology is one of the effective packaging technologies for further miniaturization and higher performance of electronic package systems. High dielectric constant epoxy/ceramic composites have been of great interest as embedded capacitor materials, because they have good process compatibility with multilayer organic substrates applications such as printed circuit boards (PCBs). In this work, it was demonstrated that low (less than ±5%) tolerance epoxy/BaTiO3 composite capacitors were successfully fabricated on PCBs using newly developed embedded capacitor films (ECFs), whi
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Beyler Çiğil, Aslı, Hatice Birtane, and Okan Esentürk. "Preparation of conductive and flame-retardant PU/GO/DOPO printed films." In 11th International Symposium on Graphic Engineering and Design. University of Novi Sad, Faculty of technical sciences, Department of graphic engineering and design, 2022. http://dx.doi.org/10.24867/grid-2022-p13.

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Printed electronics are emerging technology products that we use in every moment of our daily lives. It is used in many fields from health, textile, electronics to communication. Inks with nanometal or organic content can be used in printed electronics. The ability of printed electronics to withstand temperature makes its use widespread in the electronics industry. Main aim of the study is to combine surface modified graphene oxide-based conductive inks with flame retardant materials. In this study, an effective and simple approach for the preparation of polyurethane acrylate (PUA) screen prin
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Reports on the topic "Printed electronic coating"

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Delwiche, Michael, Boaz Zion, Robert BonDurant, Judith Rishpon, Ephraim Maltz, and Miriam Rosenberg. Biosensors for On-Line Measurement of Reproductive Hormones and Milk Proteins to Improve Dairy Herd Management. United States Department of Agriculture, 2001. http://dx.doi.org/10.32747/2001.7573998.bard.

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The original objectives of this research project were to: (1) develop immunoassays, photometric sensors, and electrochemical sensors for real-time measurement of progesterone and estradiol in milk, (2) develop biosensors for measurement of caseins in milk, and (3) integrate and adapt these sensor technologies to create an automated electronic sensing system for operation in dairy parlors during milking. The overall direction of research was not changed, although the work was expanded to include other milk components such as urea and lactose. A second generation biosensor for on-line measuremen
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