Academic literature on the topic 'Semiconductor Manufacturer'

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Journal articles on the topic "Semiconductor Manufacturer"

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Jun, Hannah, Wonseok Woo, and Hyoung-goo Kang. "Hynix Semiconductor: Global Pioneer." Asian Case Research Journal 17, no. 01 (2013): 145–60. http://dx.doi.org/10.1142/s0218927513500065.

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This case reviews Korean memory manufacturer Hynix Semiconductor, Inc. within the context of the global semiconductor memory industry between 1999 and 2006. Against many odds, Hynix recovered from near-collapse in the early 2000s to become the global number two memory manufacturer by 2005. Of the reasons behind the company's success, this case examines the internal and external factors which led to the pioneering of overseas partnerships by Hynix in the early 2000s, as well as the mechanisms with which the company used such partnerships to manage crisis.
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Street, Alan. "The Integrated Fabless Manufacturer." EDFA Technical Articles 10, no. 3 (2008): 46–48. http://dx.doi.org/10.31399/asm.edfa.2008-3.p046.

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Abstract This column reflects on the emergence of integrated fabless manufacturers (IFMs) in the semiconductor industry and the effect it will have on failure analysis. In the IFM environment, FA will likely play the same roles, as in design debug, qualification, yield, and customer returns, but with new challenges and expectations as explained in this guest column.
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Han, Guang Hua, and Ming Dong. "Semiconductor Manufacturer’s Capacity Reservation with Substitution." Applied Mechanics and Materials 182-183 (June 2012): 571–75. http://dx.doi.org/10.4028/www.scientific.net/amm.182-183.571.

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When the products are withdrawn from the market, some capacity is reserved for a certain time because the manufacturer is responsible for providing after-sale service during the entire quality guarantee period. We consider a capacity reservation problem of a semiconductor manufacturer with two kinds of products and the corresponding demands are random. The demands can be substituted when one type of capacity has been depleted. The optimization goal is to determine the reserved capacity for each type of product. The problem is formulated by a stochastic programming model in which the objective
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Liu, J. C., and C. Y. Lien. "Dissolved air flotation of polishing wastewater from semiconductor manufacturer." Water Science and Technology 53, no. 7 (2006): 133–40. http://dx.doi.org/10.2166/wst.2006.217.

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The feasibility of the dissolved air flotation (DAF) process in treating chemical mechanical polishing (CMP) wastewater was evaluated in this study. Wastewater from a local semiconductor manufacturer was sampled and characterised. Nano-sized silica (77.6 nm) with turbidity of 130±3 NTU was found in the slightly alkaline wastewater with traces of other pollutants. Experimental results indicated removal efficiency of particles, measured as suspended particle or turbidity, increased with increasing concentration of cationic collector cetyltrimethyl ammonium bromide (CTAB). When CTAB concentration
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Yang, Yi-Hsuan, and Chen-Yang Cheng. "Tool Planning Model with Calibration for Semiconductor Equipment Manufacturer." Procedia Manufacturing 11 (2017): 2001–8. http://dx.doi.org/10.1016/j.promfg.2017.07.351.

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Huang, C. "Precipitate flotation of fluoride-containing wastewater from a semiconductor manufacturer." Water Research 33, no. 16 (1999): 3403–12. http://dx.doi.org/10.1016/s0043-1354(99)00065-2.

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CHIANG, Min-Hua. "Taiwan Semiconductor Manufacturing Company: A Key Chip in the Global Political Economy." East Asian Policy 15, no. 01 (2023): 36–46. http://dx.doi.org/10.1142/s179393052300003x.

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Taiwan Semiconductor Manufacturing Company (TSMC) has become the world’s most important semiconductor chip manufacturer, thanks to greater trade and investment liberalisation, Taiwan’s pool of high-quality engineers and TSMC’s unique and dedicated model of chipmaking. As TSMC’s dominance is unlikely to be replaced anytime soon, the world’s heavy reliance on “Made in Taiwan” chips will continue to place the democratic island at the centre of the global political economy in the foreseeable future.
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Frieske, Benjamin, and Sylvia Stieler. "The “Semiconductor Crisis” as a Result of the COVID-19 Pandemic and Impacts on the Automotive Industry and Its Supply Chains." World Electric Vehicle Journal 13, no. 10 (2022): 189. http://dx.doi.org/10.3390/wevj13100189.

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In the first half of 2020, the coronavirus pandemic led to a drastic slump in the automotive industry, which was replaced by a surprisingly rapid growth in demand in the fall of 2020, and consequently led to the current shortages in microelectronic products. The prospect of an equally rapid economic recovery in the automotive industry is still threatened by supply bottlenecks for raw materials and key components, foremost for semiconductors. The so-called ‘semiconductor crises’ show exemplarily the overlapping of short-term supply chain disruptions with long-term structural features of the sem
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Gall, Harald, Martin Knaipp, Georg Roehrer, and Wolfgang Reinprecht. "14/48 V Vehicle Electronic System Perspective of a semiconductor manufacturer." ATZelektronik worldwide 8, no. 6 (2013): 40–44. http://dx.doi.org/10.1365/s38314-013-0211-9.

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Lien, C. Y., and J. C. Liu. "Treatment of Polishing Wastewater from Semiconductor Manufacturer by Dispersed Air Flotation." Journal of Environmental Engineering 132, no. 1 (2006): 51–57. http://dx.doi.org/10.1061/(asce)0733-9372(2006)132:1(51).

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Dissertations / Theses on the topic "Semiconductor Manufacturer"

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Graban, Mark R. (Mark Robert) 1973. "An inventory planning methodology for a semiconductor manufacturer with significant sources of variability." Thesis, Massachusetts Institute of Technology, 1999. http://hdl.handle.net/1721.1/9779.

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Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1999.<br>Includes bibliographical references (p. 77).<br>The research and thesis focus on the development and implementation of a data-driven inventory and production planning methodology for the Eastman Kodak Company's Microelectronics Technology Division (MID). The thesis gives an introduction to MID's products, processes, and customers, as well as the current business conditions, recent improvements, and challenges present a
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Williams, Howard R. "Compound semiconductor material manufacture, process improvement." Thesis, University of South Wales, 2002. https://pure.southwales.ac.uk/en/studentthesis/compound-semiconductor-material-manufacture-process-improvement(d0373158-08d9-4332-9278-f5353203dcd0).html.

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IQE (Europe) Ltd. manufactures group III/V compound semiconductor material structures, using the Metal Organic Vapour Phase Epitaxy process. The manufactured ranges of semi-conducting materials are relative to discrete or multi-compound use of Gallium Arsenide or Indium Phosphide [III/V]. For MOVPE to compete in large-scale markets, the manufacturing process requires transformation into a reliable, repeatable production process. This need is identified within the process scrap percentage of the process when benchmarked against the more mature Si-CVD process. With this wide-ranging product base
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Khaleque, Ferdouse. "E-beam lithography and dry processing for submicron fabrication." Thesis, Imperial College London, 1990. http://hdl.handle.net/10044/1/46389.

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Morgan, Fearghal John. "A investigation of the manufacture and characterisation of enhancement-type buried channel M.O.S. transistors." Thesis, Queen's University Belfast, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.254322.

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Lopez, Parra Marcelo. "The design, manufacture and testing of a low-cost cleanroom robot for handling silicon wafers." Thesis, Cranfield University, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.260098.

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Kakkar, Paraj 1971 Carleton University Dissertation Management Studies. "Determinants of successful semiconductor design and manufacture for a captive facility." Ottawa.:, 1996.

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Pieczulewski, Charles N. (Charles Nicholas). "Benchmarking semiconductor lithography equipment development & sourcing practices among leading-edge U.S. manufacturers." Thesis, Massachusetts Institute of Technology, 1995. http://hdl.handle.net/1721.1/32171.

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Hollis, Tom. "Manufacture and testing of nanometre scale supramolecular interconnect technology using DNA templated semiconductor nanowires." Thesis, University of Newcastle Upon Tyne, 2008. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.499332.

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This work describes the production and testing of nano-scale supramolecular interconnects or nanowires. That is, wire-like strands buih from individual molecules with a diameter in the range of 2 - 50nm. The nanowires used in this work are made up of semiconductor materials templated to a DNA backbone. Experiments have been designed to create contiguous, conductive nanowires by bonding Polypyrrole and Cadmium Sulphide to the negatively charged backbone of DNA molecules; the use of DNA is based on its one dimensional shape, conformational flexibility and its ability to create ionic bonds. Atomi
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Vock, Stefan R. "An approach for addressing challenges and quality robustness in test engineering for semiconductor manufacture." Thesis, Ulster University, 2015. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.648021.

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Ashouei, Maryam. "Algorithms and Methodology for Post-Manufacture Adaptation to Process Variations and Induced Noise in Deeply Scaled CMOS Technologies." Diss., Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/19859.

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In the last two decades, VLSI technology scaling has spurred a rapid growth in the semiconductor industry. With CMOS device dimensions falling below 100 nm, achieving higher performance and packing more complex functionalities into digital integrated circuits have become easier. However, the scaling trend poses new challenges to design and process engineers. First, larger process parameter variations in the current technologies cause larger spread in the delay and power distribution of circuits and result in the parametric yield loss. In addition, ensuring the reliability of deep sub-micron (D
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Books on the topic "Semiconductor Manufacturer"

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Prince, Betty. Semiconductor memories: A handbook of design manufacture and application. 2nd ed. Wiley, 1995.

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Prince, Betty. Semiconductor memories: A handbook of design, manufacture, and application. 2nd ed. Wiley, 1991.

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P, Colino Ronald, ed. Power electronic modules: Design and manufacture. CRC Press, 2005.

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United Nations Environment Programme. Industry & Environment Office. and United Nations Industrial Development Organization., eds. Environmental management in the electronics industry: Semiconductor manufacture and assembly. United Nations Industrial Development Organization, 1994.

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Ulbrecht, Alan. Waste reduction activities and options for a manufacturer of systems to produce semiconductors. U.S. Environmental Protection Agency, Risk Reduction Engineering Laboratory, 1992.

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Blair, Peter Hugh. A study of gold-silicon chip attachment in the manufacture of discrete silicon semiconductor components. University of Salford, 1987.

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Bakker, Anton. High-accuracy CMOS smart temperature sensors. Kluwer Academic Publishers, 2000.

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Prince, Betty. Semiconductor Memories: A Handbook of Design, Manufacture and Application. 2nd ed. Wiley, 1996.

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Prince, Betty. Semiconductor Memories: A Handbook of Design, Manufacture and Application. John Wiley & Sons, 1992.

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Naimpally. Semiconductors and Manufacture Components. Taylor & Francis Inc, 1999.

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Book chapters on the topic "Semiconductor Manufacturer"

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Chen, Zhenfang, Jianwu Chen, Xiaotong Chen, Yanqiu Shun, Bin Yang, and Weijiang Liu. "Noise Hazard Analysis and Sound Insulation Research of a Semiconductor Manufacturer." In Man-Machine-Environment System Engineering. Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-4786-5_57.

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de Souza, Jorge M., Giovanni M. de Holanda, Fabrício Cristófani, Luana A. Sartor, and Paulo C. Sardinha. "A Data-Driven Methodology for Analyzing Field Nonconformities in Semiconductor Production Applied to a Brazilian Manufacturer." In Proceedings of the 8th Brazilian Technology Symposium (BTSym’22). Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-31007-2_40.

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Edwards, Phillip R. "Semiconductor device manufacture." In Manufacturing Technology in the Electronics Industry. Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-3130-8_4.

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Li, Y. E. David, Joseph E. Paganessi, and Denis Rufin. "Emission Reduction of Perfluorocompounds in Semiconductor Manufacturers via Capture and Recycle." In ACS Symposium Series. American Chemical Society, 2000. http://dx.doi.org/10.1021/bk-2001-0766.ch006.

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Liu, Yuming, Tao Jiang, Zhikun Yang, Yonghang Tai, and Chao Zhang. "Design and Manufacture of a Pulse Driving Circuit for Semiconductor Laser." In Advances in Intelligent Systems and Computing. Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-1843-7_51.

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Kuo, Tony Sowang. "From the US-Taiwan Economic Relationship to Sustainable Global Economic Development." In OBIC book series. Budapest Business School, University of Applied Sciences, Oriental Business and Innovation Center (OBIC), 2022. http://dx.doi.org/10.29180/9786156342393_4.

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Taiwan performed an economic miracle from the 1960s to the 1990s, which made it into one of the Four Asian Tigers, along with Hong Kong, Singapore, and South Korea. Taiwan specifically transformed itself from an agricultural society into an industrial society and became a leading manufacturer of high technology goods, especially electronics, information communications technology, semiconductors, petrochemicals, textiles, etc. Taiwan’s manufacturing sector comprises more than 36 percent of the country’s gross domestic product (GDP) and provides jobs to 35 percent of the workforce. The country is one of the largest suppliers of semiconductors, computers, mobile phones, and monitors to the world market. The nominal GDP ranks twentieth in the world and is the seventh largest economy in Asia. While the country is known for its semiconductor and electronics industries, Taiwan’s economy is still dominated by the services industry. The services sector accounted for 62.7 percent of Taiwan’s GDP in 2020, employing 59.7 percent of the labor force. Taiwan’s economy is highly export-oriented and reliant on international trade. Although its economic performance seems to make Taiwan a major global economic actor, the future development of its economy is dependent on its foreign relations, especially the relationship with major economic powers, like the United States and China. China continuously attempts to isolate Taiwan diplomatically and its ability to maintain its presence in global markets, restrain Taiwan’s economic stability and the wills of other countries to maintain a stable economic relationship with Taiwan.
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Nagai, Akihiko, and Koji Tanabe. "The Role of Semiconductor Distributors in the Japanese Semiconductor Market." In E-Activity and Intelligent Web Construction. IGI Global, 2011. http://dx.doi.org/10.4018/978-1-61520-871-5.ch010.

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In 2009, the global semiconductor market was worth $219.6 billion. Japan has the third largest semiconductor market at $38.3 billion, behind America and China. Japan has a unique semiconductor distribution system based on close relations between semiconductor distributors and major IDMs (integrated device manufacturers), electronics manufacturers, and automobile manufacturers. Because of this, it is difficult for overseas semiconductor manufacturers and fabless semiconductor companies to enter the market. Semiconductor distributors play a significant role in Japan’s semiconductor distribution system. The semiconductor market here has four main characteristics. These characteristics are the reason why Japan’s semiconductor distribution system has developed the way it has.
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Mathur, SB, Sudhakar Bokephode, and DD Balsaraf. "A Small Chip Puts the Global Economy on the Block." In Indian Business Case Studies Volume VI. Oxford University PressOxford, 2022. http://dx.doi.org/10.1093/oso/9780192869425.003.0016.

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Abstract As Covid-19 swept the world last year, and people struggled to cope with the impact on their lives, elsewhere a different story brewed. The semiconductor market saw a never before scenario leading to chaos, confusion, delays, losses to many, and profits for others. This was the world of semiconductor shortage. The small chip made its presence felt, when electronics became dearer, and your favourite car delivery was delayed. The situation became critical when chip prices rose, and businesses faced huge shortages, forcing all stakeholders to take notice. Surprisingly, though the Covid-19 saw surging demand for remote working, home entertainment, and online education products and services led to a run-on consumer electronics like smartphones, PCs, and TVs, one of the worst hit markets has been the automobile sector that is heavily reliant on the semiconductor manufacturers. Indian as well as the global automotive industry is losing money in the billions. Reason? Not enough semiconductors to go around satiating the demands of both automakers and the consumer-electronics industry. Automakers are digging in to overcome the global shortage.
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Goldsmith, C., I. Noyàm, Patrick De Haven, and T. Nunes. "Semiconductors: Integrated Circuit Manufacture." In Industrial Applications of X-Ray Diffraction. CRC Press, 1999. http://dx.doi.org/10.1201/b16940-7.

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"Semiconductors: Integrated Circuit Manufacture." In Industrial Applications of X-Ray Diffraction. CRC Press, 1999. http://dx.doi.org/10.1201/b16940-8.

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Conference papers on the topic "Semiconductor Manufacturer"

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Ng, K. C., K. E. Chong, and G. G. G. Goh. "Total productive maintenance strategy in a semiconductor manufacturer: A case study." In 2013 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM). IEEE, 2013. http://dx.doi.org/10.1109/ieem.2013.6962598.

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Todorov, Vencislav, and Philipp Philippov. "Analysis of typical semiconductor manufacturer layout recommendations in respect of EMC behavior of DCDC converter." In 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE, 2017. http://dx.doi.org/10.1109/isse.2017.8000974.

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Hwang, Bang-Ning. "Critical Consideration Factors Analysis for Open Innovation Implementation: An Empirical Study in a Semiconductor Manufacturer." In 2019 Portland International Conference on Management of Engineering and Technology (PICMET). IEEE, 2019. http://dx.doi.org/10.23919/picmet.2019.8893865.

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Liu, Shilin, Qiang Yu, and Michael Pecht. "Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52111.

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Semiconductor component manufacturers supply to different product manufacturers in a wide range of market segments, for different end use applications. The goal of electronic component qualification is to demonstrate component reliability under operating conditions in the end product configuration. While a manufacturer may have successfully qualified an individual component, operating stresses due to surrounding components or the system can decrease individual component reliability. Not accounting for these operating stresses resulting from other components or the system will lead to lower lif
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Jay Anderson, D., Mustafa Kansiz, Michael Lo, Eoghan Dillon, and Curtis Marcott. "Enhanced Failure Analysis (FA) of Organic Contamination Using Submicron Simultaneous IR and Raman Spectroscopy: Breakthrough Developments of Optical Photothermal IR (O-PTIR)." In ISTFA 2020. ASM International, 2020. http://dx.doi.org/10.31399/asm.cp.istfa2020p0075.

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Abstract Rapid identification of organic contamination in the semi and semi related industry is a major concern for research and manufacturing. Organic contamination can affect a system or subsystem’s performance and cause premature failure of the product. As an example, in February 2019 the Taiwan Semiconductor Manufacturing Company (TMSC), a major semiconductor manufacturer, reported that a photoresist it used included a specific element which was abnormally treated, creating a foreign polymer in the photoresist resulting in an estimated loss of $550M [1].
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Hong, Yong. "Detection of a Counterfeit OTA Device and Certification of a Replacement Source." In ISTFA 2011. ASM International, 2011. http://dx.doi.org/10.31399/asm.cp.istfa2011p0234.

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Abstract The counterfeiting of semiconductor devices has become an important contributor as more components are used in the increasingly sophisticated audio and navigation systems while more suppliers are moving manufacturing plants off-shore. This paper presents a case study on how the authors were able to identify a counterfeit device and certify a replacement source. In this study, failed devices with Intersil CA3080 Operational Transductance Amplifier IC from factory testing and field returns in suspect lot codes were purchased from a second source, due to the unavailability of the obsolet
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Fu, Lianfeng, Lifan Chen, and Haifeng Wang. "High Throughput Phase Mapping for Metrology Using Low-Loss EELS." In ISTFA 2017. ASM International, 2017. http://dx.doi.org/10.31399/asm.cp.istfa2017p0362.

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Abstract The plasmon-loss region of the low-loss electron energy loss spectroscopy (EELS) contains chemical information similar to core-loss EELS; therefore it can be utilized as finger-printing elements. A high throughput phase mapping technique based on plasmon energy (Ep) is proposed. We have successfully applied this phase mapping technique into two case studies in our magnetic head manufacturer processes. This Ep phase mapping can be applied to not only the data storage but also semiconductor industries.
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Chong, K. E., K. C. Ng, and G. G. G. Goh. "Improving Overall Equipment Effectiveness (OEE) through integration of Maintenance Failure Mode and Effect Analysis (maintenance-FMEA) in a semiconductor manufacturer: A case study." In 2015 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM). IEEE, 2015. http://dx.doi.org/10.1109/ieem.2015.7385883.

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Bleakie, Alexander, and Dragan Djurdjanovic. "Dynamic Feature Monitoring Technique Applied to Thin Film Deposition Processes in an Industrial PECVD Tool." In ASME 2011 International Manufacturing Science and Engineering Conference. ASMEDC, 2011. http://dx.doi.org/10.1115/msec2011-50041.

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In semiconductor fabrication processes, reliable feature extraction and condition monitoring is critical to understanding equipment degradation and implementing the proper maintenance decisions. This paper presents an integrated feature extraction and equipment monitoring approach based on standard built-in sensors from a modern 300mm-technology industrial Plasma Enhanced Chemical Vapor Deposition (PECVD) tool. Linear Discriminant Analysis was utilized to determine the set of dynamic features that are the most sensitive to different tool conditions brought about by chamber cleaning. Gaussian M
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Wu, Jei-Zheng, Chen-Fu Chien, Yung-Shang Huang, and Hung-Ya Huang. "A multi-period inventory model to incorporate with inventory age, accounting principle, and product structure: A case study in a make-to-stock semiconductor integrated device manufacturer." In Industrial Engineering (CIE-40). IEEE, 2010. http://dx.doi.org/10.1109/iccie.2010.5668429.

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Reports on the topic "Semiconductor Manufacturer"

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King, William P. Feasibility Study of Nanoscale Semiconductor Manufacture Using Thermal Dip Pen Nanolithography. Defense Technical Information Center, 2006. http://dx.doi.org/10.21236/ada463608.

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Strategic Opportunities for U.S. Semiconductor Manufacturing. National Institute of Standards and Technology (U.S.), 2022. http://dx.doi.org/10.6028/nist.chips.1000.

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Semiconductors are critical to our Nation’s economic growth, national security, and public health and safety. Revolutionary advances in microelectronics continue to drive innovations in communications, information technology, health care, military systems, transportation, energy, and infrastructure. The potential for microelectronics to create transformational change is growing exponentially as they become smaller, faster, and more sophisticated—delivering unprecedented performance. Next-generation systems, devices, and related technologies are critical to addressing society’s most urgent need
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