Log in

Relevant bibliographies by topics / Semiconductor Manufacturer / Journal articles

To see the other types of publications on this topic, follow the link: Semiconductor Manufacturer.

Journal articles on the topic 'Semiconductor Manufacturer'

Author: Grafiati

Published: 4 June 2021

Last updated: 6 September 2023

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 journal articles for your research on the topic 'Semiconductor Manufacturer.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

Jun, Hannah, Wonseok Woo, and Hyoung-goo Kang. "Hynix Semiconductor: Global Pioneer." Asian Case Research Journal 17, no. 01 (2013): 145–60. http://dx.doi.org/10.1142/s0218927513500065.

Full text

Abstract:

This case reviews Korean memory manufacturer Hynix Semiconductor, Inc. within the context of the global semiconductor memory industry between 1999 and 2006. Against many odds, Hynix recovered from near-collapse in the early 2000s to become the global number two memory manufacturer by 2005. Of the reasons behind the company's success, this case examines the internal and external factors which led to the pioneering of overseas partnerships by Hynix in the early 2000s, as well as the mechanisms with which the company used such partnerships to manage crisis.

APA, Harvard, Vancouver, ISO, and other styles

2

Street, Alan. "The Integrated Fabless Manufacturer." EDFA Technical Articles 10, no. 3 (2008): 46–48. http://dx.doi.org/10.31399/asm.edfa.2008-3.p046.

Full text

Abstract:

Abstract This column reflects on the emergence of integrated fabless manufacturers (IFMs) in the semiconductor industry and the effect it will have on failure analysis. In the IFM environment, FA will likely play the same roles, as in design debug, qualification, yield, and customer returns, but with new challenges and expectations as explained in this guest column.

APA, Harvard, Vancouver, ISO, and other styles

3

Han, Guang Hua, and Ming Dong. "Semiconductor Manufacturer’s Capacity Reservation with Substitution." Applied Mechanics and Materials 182-183 (June 2012): 571–75. http://dx.doi.org/10.4028/www.scientific.net/amm.182-183.571.

Full text

Abstract:

When the products are withdrawn from the market, some capacity is reserved for a certain time because the manufacturer is responsible for providing after-sale service during the entire quality guarantee period. We consider a capacity reservation problem of a semiconductor manufacturer with two kinds of products and the corresponding demands are random. The demands can be substituted when one type of capacity has been depleted. The optimization goal is to determine the reserved capacity for each type of product. The problem is formulated by a stochastic programming model in which the objective

APA, Harvard, Vancouver, ISO, and other styles

4

Liu, J. C., and C. Y. Lien. "Dissolved air flotation of polishing wastewater from semiconductor manufacturer." Water Science and Technology 53, no. 7 (2006): 133–40. http://dx.doi.org/10.2166/wst.2006.217.

Full text

Abstract:

The feasibility of the dissolved air flotation (DAF) process in treating chemical mechanical polishing (CMP) wastewater was evaluated in this study. Wastewater from a local semiconductor manufacturer was sampled and characterised. Nano-sized silica (77.6 nm) with turbidity of 130±3 NTU was found in the slightly alkaline wastewater with traces of other pollutants. Experimental results indicated removal efficiency of particles, measured as suspended particle or turbidity, increased with increasing concentration of cationic collector cetyltrimethyl ammonium bromide (CTAB). When CTAB concentration

APA, Harvard, Vancouver, ISO, and other styles

5

Yang, Yi-Hsuan, and Chen-Yang Cheng. "Tool Planning Model with Calibration for Semiconductor Equipment Manufacturer." Procedia Manufacturing 11 (2017): 2001–8. http://dx.doi.org/10.1016/j.promfg.2017.07.351.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Huang, C. "Precipitate flotation of fluoride-containing wastewater from a semiconductor manufacturer." Water Research 33, no. 16 (1999): 3403–12. http://dx.doi.org/10.1016/s0043-1354(99)00065-2.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

CHIANG, Min-Hua. "Taiwan Semiconductor Manufacturing Company: A Key Chip in the Global Political Economy." East Asian Policy 15, no. 01 (2023): 36–46. http://dx.doi.org/10.1142/s179393052300003x.

Full text

Abstract:

Taiwan Semiconductor Manufacturing Company (TSMC) has become the world’s most important semiconductor chip manufacturer, thanks to greater trade and investment liberalisation, Taiwan’s pool of high-quality engineers and TSMC’s unique and dedicated model of chipmaking. As TSMC’s dominance is unlikely to be replaced anytime soon, the world’s heavy reliance on “Made in Taiwan” chips will continue to place the democratic island at the centre of the global political economy in the foreseeable future.

APA, Harvard, Vancouver, ISO, and other styles

8

Frieske, Benjamin, and Sylvia Stieler. "The “Semiconductor Crisis” as a Result of the COVID-19 Pandemic and Impacts on the Automotive Industry and Its Supply Chains." World Electric Vehicle Journal 13, no. 10 (2022): 189. http://dx.doi.org/10.3390/wevj13100189.

Full text

Abstract:

In the first half of 2020, the coronavirus pandemic led to a drastic slump in the automotive industry, which was replaced by a surprisingly rapid growth in demand in the fall of 2020, and consequently led to the current shortages in microelectronic products. The prospect of an equally rapid economic recovery in the automotive industry is still threatened by supply bottlenecks for raw materials and key components, foremost for semiconductors. The so-called ‘semiconductor crises’ show exemplarily the overlapping of short-term supply chain disruptions with long-term structural features of the sem

APA, Harvard, Vancouver, ISO, and other styles

9

Gall, Harald, Martin Knaipp, Georg Roehrer, and Wolfgang Reinprecht. "14/48 V Vehicle Electronic System Perspective of a semiconductor manufacturer." ATZelektronik worldwide 8, no. 6 (2013): 40–44. http://dx.doi.org/10.1365/s38314-013-0211-9.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Lien, C. Y., and J. C. Liu. "Treatment of Polishing Wastewater from Semiconductor Manufacturer by Dispersed Air Flotation." Journal of Environmental Engineering 132, no. 1 (2006): 51–57. http://dx.doi.org/10.1061/(asce)0733-9372(2006)132:1(51).

Full text

APA, Harvard, Vancouver, ISO, and other styles

11

Wang, Yaqiang, Qunfang Wu, Qin Wang, et al. "An analytical switching model of SiC MOSFET considering the junction temperature characteristics." Digital Twin 2 (December 16, 2022): 19. http://dx.doi.org/10.12688/digitaltwin.17774.1.

Full text

Abstract:

In order to provide convenience in the design work as the manufacturer-supplied models of silicon carbide (SiC) metal oxide semiconductor field effect transistor (MOSFET) are generally only applicable to specific software, an analytical switching model of SiC MOSFET considering the junction temperature characteristics based on MATLAB is proposed in this article. The junction temperature characteristics of the parameters required for the switching process, including threshold voltage, on-resistance and transfer characteristics of SiC MOSFET, threshold voltage and output characteristics of body

APA, Harvard, Vancouver, ISO, and other styles

12

Lingkai, Kong, Shu Runyang, Lu Hao, Xiong Qiaozhi, Wu Peng, and Xue Rui. "The Fleeting Possibility of Merging the World’s Largest Chip Manufacturer in 2017: The Pain of Chinese Chip Industry." American Journal of Economics and Business Innovation 1, no. 3 (2022): 24–35. http://dx.doi.org/10.54536/ajebi.v1i3.561.

Full text

Abstract:

This article examines a possible Chinese semiconductor industry’s merger and acquisition in 2017, the year before the Sino-US trade war and US high-tech sanctions against China. The feasibility of a merger between Tsinghua Unigroup and Taiwan Semiconductor Manufacturing Company is thoroughly examined as well as their development history and the current financial standing. The financial data collected form the two companies’ annual report was analyzed using multiple corporate valuating models. We discovered that the industrial policy and financial reports in 2017 favored the merger, but the com

APA, Harvard, Vancouver, ISO, and other styles

13

Chen, Toly. "Strengthening the Competitiveness and Sustainability of a Semiconductor Manufacturer with Cloud Manufacturing." Sustainability 6, no. 1 (2014): 251–66. http://dx.doi.org/10.3390/su6010251.

Full text

APA, Harvard, Vancouver, ISO, and other styles

14

He, Min, Allan Chasey, and Sachin Patel. "Benchmarking Time and Cost of Semiconductor Fabrication Facilities." Journal of the IEST 45, no. 1 (2002): 61–64. http://dx.doi.org/10.17764/jiet.45.1.b34587k473744743.

Full text

Abstract:

The semiconductor industry is a high capital investment industry with the cost of a single completely equipped semiconductor manufacturing facility reaching $2.0 billion. A delay in the operation of the facility can cause the manufacturer a loss of millions of dollars worth of opportunity cost and a share of the market. Thus, semiconductor facility owners want their facilities built quicker, at lower cost, and with higher quality standards. However, the exchangeable knowledge of the project cost and project delivery time associated with the construction of semiconductor facilities nationwide i

APA, Harvard, Vancouver, ISO, and other styles

15

Zabloudilová, P., J. Pecen, and M. Češpiva. "Some causes of differences in the NH₃ concentration measured with the semiconductor sensors by one manufacturer." Research in Agricultural Engineering 62, No. 4 (2016): 190–97. http://dx.doi.org/10.17221/80/2015-rae.

Full text

Abstract:

The paper deals with continuous monitoring of NH<sub>3</sub> desorption from material used as bedding in animal breeding establishments, using five semiconductor sensors SP-53 (FIS Inc.). In lab experiments, two groups of sensors from two categories, to which the manufacturer divided the sensors based on the value of their resistance R<sub>S</sub>, were used. Also the influence of air humidity over the values of NH<sub>3</sub> concentrations measured by individual sensors was monitored. The study ascertained statistically relevant differences between NH<s

APA, Harvard, Vancouver, ISO, and other styles

16

Li, Zhe, and Feng Hai. "Virtual Operation Strategy and IFOT Model Based on TSMC." Applied Mechanics and Materials 401-403 (September 2013): 2333–36. http://dx.doi.org/10.4028/www.scientific.net/amm.401-403.2333.

Full text

Abstract:

Virtual Operating is a mode of operation which makes enterprises well adapt to the economic atmosphere of globalization, networking and financial crisis. This paper discussed the typical case of virtual operation strategy through a case from Taiwan semiconductor manufacturer and then built an IFOT model by induction with specific examples. Through this model, this paper focused on empirical research based on TSMC.

APA, Harvard, Vancouver, ISO, and other styles

17

Rodriguez, Jose A., Tsz Tsoi, David Graves, and Stephen B. Bayne. "Evaluation of GaN HEMTs in H3TRB Reliability Testing." Electronics 11, no. 10 (2022): 1532. http://dx.doi.org/10.3390/electronics11101532.

Full text

Abstract:

Gallium Nitride (GaN) power devices can offer better switching performance and higher efficiency than Silicon Carbide (SiC) and Silicon (Si) devices in power electronics applications. GaN has extensively been incorporated in electric vehicle charging stations and power supplies, subjected to harsh environmental conditions. Many reliability studies evaluate GaN power devices through thermal stresses during current conduction or pulsing, with a few focusing on high blocking voltage and high humidity. This paper compares GaN-on-Si High-Electron-Mobility Transistors (HEMT) device characteristics u

APA, Harvard, Vancouver, ISO, and other styles

18

Sánchez-Vergara, Guevara-Martínez, Arreola-Castillo, and Mendoza-Sevilla. "Fabrication of Hybrid Membranes Containing Nylon-11 and Organic Semiconductor Particles with Potential Applications in Molecular Electronics." Polymers 12, no. 1 (2019): 9. http://dx.doi.org/10.3390/polym12010009.

Full text

Abstract:

Chemical degradation is a major disadvantage in the development of organic semiconductors. This work proposes the manufacture and characterization of organic semiconductor membranes in order to prevent semiconductor properties decreasing. Semiconductor membranes consisting of Nylon-11 and particles of π-conjugated molecular semiconductors were manufactured by high-vacuum evaporation followed by thermal relaxation. Initially, and with the aim of obtaining semiconductor particles, bulk heterojunction (BHJ) was carried out using green chemistry techniques between the zinc phthalocyanine (ZnPc) an

APA, Harvard, Vancouver, ISO, and other styles

19

de Luna, Mark Daniel G., Warmadewanthi, and J. C. Liu. "Combined treatment of polishing wastewater and fluoride-containing wastewater from a semiconductor manufacturer." Colloids and Surfaces A: Physicochemical and Engineering Aspects 347, no. 1-3 (2009): 64–68. http://dx.doi.org/10.1016/j.colsurfa.2008.12.006.

Full text

APA, Harvard, Vancouver, ISO, and other styles

20

Joy, David C. "Electron Beam Testing and Characterization – Past, Present, and Future." EDFA Technical Articles 2, no. 2 (2000): 4–6. http://dx.doi.org/10.31399/asm.edfa.2000-2.p004.

Full text

Abstract:

Abstract Scanning electron microscopes (SEMs) are the dominant tool for electronic device testing, failure analysis, and characterization. This status was not apparent, however, when the first commercial SEM, the Cambridge Stereoscan, appeared in 1963. A market survey by the manufacturer at that time predicted total sales of six to ten units worldwide. For the last four decades, SEMs have sold at an average rate of one unit every 24 hours, with two out of every three instruments destined for the semiconductor industry.

APA, Harvard, Vancouver, ISO, and other styles

21

Cheong, Hee-Woon. "Management of Technology Strategies Required for Major Semiconductor Manufacturer to Survive in Future Market." Procedia Computer Science 91 (2016): 1116–18. http://dx.doi.org/10.1016/j.procs.2016.07.163.

Full text

APA, Harvard, Vancouver, ISO, and other styles

22

Lingitz, Lukas, Viola Gallina, Fazel Ansari, et al. "Lead time prediction using machine learning algorithms: A case study by a semiconductor manufacturer." Procedia CIRP 72 (2018): 1051–56. http://dx.doi.org/10.1016/j.procir.2018.03.148.

Full text

APA, Harvard, Vancouver, ISO, and other styles

23

Grgić, Ivan, Dinko Vukadinović, Mateo Bašić, and Matija Bubalo. "Semiconductor Losses Calculation of a Quasi-Z-Source Inverter with Dead-Time." International journal of electrical and computer engineering systems 13, no. 6 (2022): 467–75. http://dx.doi.org/10.32985/ijeces.13.6.6.

Full text

Abstract:

A quasi-Z-source inverter (qZSI) belongs to the group of single-stage boost inverters. The input dc voltage is boosted by utilizing an impedance network and so called shoot-through (ST) states. In pulse-width modulations utilized for the qZSI, the dead-time is commonly omitted. However, unintended ST states inevitably occur as a result of this action, due to the non-ideality of the switching devices, causing the unintended voltage boost of the inverter and an increase in the switching losses. Hence, the implementation of the dead-time is desirable with regard to both the controllability and ef

APA, Harvard, Vancouver, ISO, and other styles

24

Corea, Rick, Dean Kashiwagi, Dhaval Gajjar, and Sylvia Romero. "Use of Best Value Model to Achieve Sustainability: A Case Study on a Semiconductor Manufacturer." Procedia Engineering 145 (2016): 746–51. http://dx.doi.org/10.1016/j.proeng.2016.04.096.

Full text

APA, Harvard, Vancouver, ISO, and other styles

25

Pavelek, Miroslav, Michal Frivaldsky, Peter Sojka, and Jan Morgos. "Electro-Thermal Modelling and Experimental Verification of Power Semiconductor Diode." Elektronika ir Elektrotechnika 26, no. 2 (2020): 48–53. http://dx.doi.org/10.5755/j01.eie.26.2.25783.

Full text

Abstract:

The aim of the proposed paper is discussing problematics related to the thermal modelling of power electronic components. More in detail, the electro-thermal relationship is investigated for the selected power diode, while analysis shall serve for system optimization considering thermal performance with the use of highly accurate 3D simulation model. The presented approach describes the procedure of the simulation model development, whereby the main part is discussing necessities relevant for material property identification through the indirect procedure, i.e, material properties are not know

APA, Harvard, Vancouver, ISO, and other styles

26

Chen, Toly. "A Systematic Cycle Time Reduction Procedure for Enhancing the Competitiveness and Sustainability of a Semiconductor Manufacturer." Sustainability 5, no. 11 (2013): 4637–52. http://dx.doi.org/10.3390/su5114637.

Full text

APA, Harvard, Vancouver, ISO, and other styles

27

Keum, Yeonwook, and Euiseok Kim. "A Study on Innovation Attributes and Impact of Technological Knowledge by Type of Semiconductor Equipment Manufacturer." Journal of the Korea Academia-Industrial cooperation Society 24, no. 7 (2023): 176–88. http://dx.doi.org/10.5762/kais.2023.24.7.176.

Full text

APA, Harvard, Vancouver, ISO, and other styles

28

Zygmanowski, Marcin. "Detailed Power Loss Analysis of T-Type Neutral Point Clamped Converter for Reactive Power Compensation." Electronics 11, no. 14 (2022): 2129. http://dx.doi.org/10.3390/electronics11142129.

Full text

Abstract:

The paper presents an analysis of power losses in a three-phase T-type neutral point clamped converter with insulated gate bipolar transistors. The paper’s main aim is to perform a detailed analysis of power losses in the converter operating as an active power filter. The study is based on the use of characteristics of semiconductor devices provided by the manufacturer in the module datasheet. Thanks to the analysis, it is possible to recognise the value of power losses, which facilitates the design of the converter cooling system. Identifying how power losses are distributed between the modul

APA, Harvard, Vancouver, ISO, and other styles

29

Chen, Toly. "A PCA-FBPN Approach for Job Cycle Time Estimation in a Wafer Fabrication Factory." International Journal of Fuzzy System Applications 2, no. 2 (2012): 50–67. http://dx.doi.org/10.4018/ijfsa.2012040103.

Full text

Abstract:

Variable replacement is a well-known technique to improve the forecasting performance, but has not been applied to the job cycle time forecasting, which is a critical task to a semiconductor manufacturer. To this end, in this study, principal component analysis (PCA) is applied to enhance the forecasting performance of the fuzzy back propagation network (FBPN) approach. First, to replace the original variables, PCA is applied to form variables that are independent of each other, and become new inputs to the FBPN. Subsequently, a FBPN is constructed to estimate the cycle times of jobs. Accordin

APA, Harvard, Vancouver, ISO, and other styles

30

Turner, D. Clark. "More Than One Ever Wanted To Know About X-Ray Detectors Part VIII: If I Know It's There, Why Can't I See it?" Microscopy Today 3, no. 7 (1995): 18–19. http://dx.doi.org/10.1017/s1551929500062775.

Full text

Abstract:

This month we are going to deviate from Mark Lund's normal discussion and talk about one of the practical problems that must be considered when using an x-ray detector on a scanning electron microscope to solve real-world problems.Several years ago I worked in the analytical laboratory of a major semiconductor manufacturer. One day a process engineer came into the lab and asked us to develop an analytical method to determine the amount of copper in an aluminum film on a silicon wafer. The levels of copper would be somewhere between 0.5% and 1.0%. He gave me a sample, saying that he didn't know

APA, Harvard, Vancouver, ISO, and other styles

31

Park, Jun, Sang Kook, Hyeonu Im, Soomin Eum, and Chulung Lee. "Fabless Semiconductor Firms’ Financial Performance Determinant Factors: Product Platform Efficiency and Technological Capability." Sustainability 10, no. 10 (2018): 3373. http://dx.doi.org/10.3390/su10103373.

Full text

Abstract:

The semiconductor industry is experiencing a rapid change since new markets and new technologies have emerged to give insights to product innovation. The semiconductor industry is now specializing into the integrated device manufacturer (IDM), fabless, and foundry sectors. We investigated the determinant factors that affect the financial performance of firms in the fabless sector, which is the most technology-intensive and product-oriented sector among the three sectors. The correlation among technological capability, product platform, and financial performance is analyzed by structural equati

APA, Harvard, Vancouver, ISO, and other styles

32

Chaturvedi, Mayank, Sima Dimitrijev, Daniel Haasmann, Hamid Amini Moghadam, Peyush Pande, and Utkarsh Jadli. "Comparison of the Performance-Degrading Near-Interface Traps in Commercial SiC MOSFETs." Materials Science Forum 1091 (June 5, 2023): 25–29. http://dx.doi.org/10.4028/p-258768.

Full text

Abstract:

This paper presents a comparison of the density of performance-degrading near-interface traps (NITs) in the most commonly available 1200 V commercial N-channel SiC power metal–oxide–semiconductor field-effect transistors (MOSFETs). A recently developed integrated-charge technique was used to measure the density of NITs with energy levels aligned to the conduction band, which degrade MOSFET’s performance by capturing and releasing electrons from the channel biased in the strong-inversion condition. Trench MOSFETs of one manufacturer have lower densities of these NITs in comparison to MOSFETs wi

APA, Harvard, Vancouver, ISO, and other styles

33

Amirul, Abdullah Rashid, Saad Nor Hayati, and Bulan Abdullah. "Assessment on Copper C194 Mechanical Properties Variations in Typical Semiconductor Assembly Production Line." Advanced Materials Research 576 (October 2012): 523–26. http://dx.doi.org/10.4028/www.scientific.net/amr.576.523.

Full text

Abstract:

Process variation is inevitable for any production line regardless of the industry. The trend for smaller, lighter yet multifunctional devices has created high expectation for the semiconductor manufacturer to produce more robust and highly reliable devices. One way to achieve this is by assessing the variance performance of the assembly production. In this study, the mechanical properties of copper alloy C194 used as the lead frame for particular IC device have been investigated. Samples from control and defect groups been subjected to hardness (Rockwell test) and tensile (Instron test) while

APA, Harvard, Vancouver, ISO, and other styles

34

Contreras, Jorge L. "Is Biopharma Ready for the Standard Wars?" Texas A&M Journal of Property Law 7, no. 1 (2021): 43–80. http://dx.doi.org/10.37419/jpl.v7.i1.2.

Full text

Abstract:

This symposium contribution sheds new light on Momenta v. Amphastar, a case in which issues relating to standardization and patent disclosure that have previously been observed in the semiconductor, computing, and telecommunications sectors found their way into a dispute between two biosimilar manufacturers. One such manufacturer, Momenta, participated in the development of a standard for testing the purity of generic enoxaparin under the auspices of the United States Pharmacopeial Convention but failed to disclose that it had applied for a patent on the testing method. When Momenta later sued

APA, Harvard, Vancouver, ISO, and other styles

35

Grgić, Ivan, Dinko Vukadinović, Mateo Bašić, and Matija Bubalo. "Calculation of Semiconductor Power Losses of a Three-Phase Quasi-Z-Source Inverter." Electronics 9, no. 10 (2020): 1642. http://dx.doi.org/10.3390/electronics9101642.

Full text

Abstract:

This paper presents two novel algorithms for the calculation of semiconductor losses of a three-phase quasi-Z-source inverter (qZSI). The conduction and switching losses are calculated based on the output current-voltage characteristics and switching characteristics, respectively, which are provided by the semiconductor device manufacturer. The considered inverter has been operated in a stand-alone operation mode, whereby the sinusoidal pulse width modulation (SPWM) with injected 3rd harmonic has been implemented. The proposed algorithms calculate the losses of the insulated gate bipolar trans

APA, Harvard, Vancouver, ISO, and other styles

36

Rastayesh, Sima, Sajjad Bahrebar, Amir Sajjad Bahman, John Dalsgaard Sørensen, and Frede Blaabjerg. "Lifetime Estimation and Failure Risk Analysis in a Power Stage Used in Wind-Fuel Cell Hybrid Energy Systems." Electronics 8, no. 12 (2019): 1412. http://dx.doi.org/10.3390/electronics8121412.

Full text

Abstract:

This paper presents a methodology based on the failure mode and effect analysis (FMEA) to analyze the failures in the power stage of wind-fuel cell hybrid energy systems. Besides, fault tree analysis (FTA) is applied to describe the probabilistic failures in the vital subcomponents. Finally, the reliability assessment of the system is carried out for a five-year operation that is guaranteed by the manufacturer. So, as the result, the reliability analysis proves that the metal oxide semiconductor field effect transistor (MOSFET) and electrolytic capacitor are the most critical components that i

APA, Harvard, Vancouver, ISO, and other styles

37

Tengku Putri Nurain, Marwan Abdullah Hasan Al-Kubati, and Nur Azaliah Abu Bakar. "Enterprise Architecture for Equipment Performance Analysis Based on Internet of Things (IoT) Technology in the Semiconductor Manufacturing Industry." Open International Journal of Informatics 11, no. 1 (2023): 53–66. http://dx.doi.org/10.11113/oiji2023.11n1.247.

Full text

Abstract:

This study proposes a concept for establishing an Enterprise Architecture in the semiconductor manufacturing industry for equipment performance analysis using Internet of Things (IoT) technology. The plan is to implement The Open Group Framework approach as Enterprise Architecture in the manufacturing analytics department. The TOGAF approach improves data governance in the business process and analytics department. Manufacturing focuses on providing excellent and high-quality products to customers. As a result, the manufacturer must use a data analytics application to monitor the performance o

APA, Harvard, Vancouver, ISO, and other styles

38

Shade, Gary F., and Brian Wilson. "Response to Counterfeit Integrated Circuit Components in the Supply Chain: Part I." EDFA Technical Articles 10, no. 4 (2008): 16–22. http://dx.doi.org/10.31399/asm.edfa.2008-4.p016.

Full text

Abstract:

Abstract This article is the first of a two-part series on counterfeiting in the IC supply chain. The focus is primarily on semiconductor components that are not available directly from the manufacturer due to quantity or discontinued status. Part I discusses the factors contributing to the rise of such counterfeiting and some of the measures in place to deal with the growing problem. It presents and examines several counterfeit ICs found in the supply chain and describes procurement practices and failure analysis techniques that can help determine whether a product is counterfeit or authentic

APA, Harvard, Vancouver, ISO, and other styles

39

Chandani, Himansh, Mayank Tyagi, Rajiv Chaudhary, and Ranganath Singari. "Predicting Production Cycle Time in a Real Disposable Medical Device Manufacturing System Using Semi-Supervised Deep Learning." INTERNATIONAL JOURNAL OF ADVANCED PRODUCTION AND INDUSTRIAL ENGINEERING 5, no. 3 (2020): 01–10. http://dx.doi.org/10.35121/ijapie202007341.

Full text

Abstract:

Manufacturing lot cycle time is the period required by a manufacturer for completion of a production process. It is an essential factor for determining the success of most manufacturing organizations, yet most research is based on studies made almost exclusively in the semiconductor industry and does not attempt to utilize the complete potential of recent breakthroughs in computational learning. Using real data collected from a medical device manufacturing company, this paper demonstrates the applicability of a semi-supervised deep learning framework for highly accurate cycle time prediction,

APA, Harvard, Vancouver, ISO, and other styles

40

Chen, Siyuan, Mingyu Zhang, Yihua Zhang, et al. "Influence of relationship conflicts with leaders and coworkers on employees' voice." Social Behavior and Personality: an international journal 48, no. 11 (2020): 1–16. http://dx.doi.org/10.2224/sbp.9120.

Full text

Abstract:

Building on self-determination theory and relational attribution theory, in this study we examined how relationship conflicts with leaders and coworkers simultaneously affect employee voice behaviors. We expanded relational attribution theory by developing two new constructs we labeled leader-relational attribution orientation and coworker-relational attribution orientation to describe employees' different responses to relationship conflicts with leaders and coworkers via psychological needs satisfaction. We surveyed 328 employee–leader dyads who were employed at a semiconductor manufacturer t

APA, Harvard, Vancouver, ISO, and other styles

41

Kim, Dongil, and Seokho Kang. "Effect of Irrelevant Variables on Faulty Wafer Detection in Semiconductor Manufacturing." Energies 12, no. 13 (2019): 2530. http://dx.doi.org/10.3390/en12132530.

Full text

Abstract:

Machine learning has been applied successfully for faulty wafer detection tasks in semiconductor manufacturing. For the tasks, prediction models are built with prior data to predict the quality of future wafers as a function of their precedent process parameters and measurements. In real-world problems, it is common for the data to have a portion of input variables that are irrelevant to the prediction of an output variable. The inclusion of many irrelevant variables negatively affects the performance of prediction models. Typically, prediction models learned by different learning algorithms e

APA, Harvard, Vancouver, ISO, and other styles

42

Kempf, Tristan, Vito Bobek, and Tatjana Horvat. "The Impacts of the American-Chinese Trade War and COVID-19 Pandemic on Taiwan’s Sales in Semiconductor Industry." International Journal of Economics and Finance 13, no. 4 (2021): 62. http://dx.doi.org/10.5539/ijef.v13n4p62.

Full text

Abstract:

The following paper deals with the American Chinese trade war and its impacts on Taiwan&rsquo;s economy, particularly sales in Taiwan&rsquo;s semiconductor industry. Indeed, trade tensions impact global supply chains, especially in the semiconductor industry, since its supply chain is highly globalized and dependent on many companies in various countries. Hence, the industry is susceptible to trade disruptions. With the largest microchip manufacturer TSMC, Taiwan is one of the key players in the fabrication of microchips. It has strong cultural, geographical, and economic ties to China

APA, Harvard, Vancouver, ISO, and other styles

43

Irmansyah, Muhammad. "PENGIMPLEMENTASIAN TEKNOLOGI PROGRAMMABLE LOGIC DEVICE (PLD) SEBAGAI BINER CODE DECIMAL (BCD) UNTUK SCANNING KEYPAD." Elektron : Jurnal Ilmiah 5, no. 1 (2018): 9–18. http://dx.doi.org/10.30630/eji.5.1.38.

Full text

Abstract:

Industrial of electronics developed in many fields in the middle of 1990s. Base on this situation, the manufacturer produce the product by increased the function, display, low cost, low power consumption and small size. This kind of product must be supported by complex system, small number of integrated circuit and tiny printed circuit board (PCB). Many integrated technologies such as submicron semiconductor, PCB technology, and the using of PCB surface maximal. The market situation push the producer used modern technology in design and testing for example Programmable Logic Device (PLD). It i

APA, Harvard, Vancouver, ISO, and other styles

44

Woltmann, Lucas, Peter Volk, Michael Dinzinger, et al. "Data Science Meets High-Tech Manufacturing – The BTW 2021 Data Science Challenge." Datenbank-Spektrum 22, no. 1 (2021): 5–10. http://dx.doi.org/10.1007/s13222-021-00398-4.

Full text

Abstract:

AbstractFor its third installment, the Data Science Challenge of the 19th symposium “Database Systems for Business, Technology and Web” (BTW) of the Gesellschaft für Informatik (GI) tackled the problem of predictive energy management in large production facilities. For the first time, this year’s challenge was organized as a cooperation between Technische Universität Dresden, GlobalFoundries, and ScaDS.AI Dresden/Leipzig. The Challenge’s participants were given real-world production and energy data from the semiconductor manufacturer GlobalFoundries and had to solve the problem of predicting t

APA, Harvard, Vancouver, ISO, and other styles

45

Zaluzec, Nestor. "Plasma Cleaning EM Stages, Specimens, and Columns." Microscopy Today 5, no. 4 (1997): 8–9. http://dx.doi.org/10.1017/s1551929500061356.

Full text

Abstract:

In my 20 plus years of experience, I have found that nearly every specimen contaminates to some degree (some slower, some faster) in an electron microscope regardless of the manufacturer. Most of this contamination comes from the specimen, and it's magnitude is a function of the sample (metallic, semiconductor, organic, etc.), the method of preparation (electrochemical chemical, microtoming, ion milling, etc.), the microscope conditions, the probe and probe current - plus a number of less well controlled factors. Reactive gas plasmas can fortunately be used to mitigate the contamination proces

APA, Harvard, Vancouver, ISO, and other styles

46

Kumar, Anoop. "PRESENT STATUS OF SEMICONDUCTOR INDUSTRY IN INDIA and IT’S FUTURE PROSPECTS." SCHOLARLY RESEARCH JOURNAL FOR INTERDISCIPLINARY STUDIES 9, no. 68 (2021): 16095–100. http://dx.doi.org/10.21922/srjis.v9i68.10004.

Full text

Abstract:

Semiconductor is now an inseparable part of almost all sectors. Nowadays semiconductors or chips / integrated circuits (ICs) are the lifeblood of all digital Products. Industry estimates are that India’s demand for semi - conductor goods will reach US $ 400 billion by FY 2025. Taiwan’s TSMC and South Korea’s Samsung manufacture as much as 70% of the world’s semiconductors. America only makes about 10% of the chips it uses. According to Global data, the semiconductor industry is facing an unprecedentad supply shortage since the end of the year 2019 due to unprecedented demand growth. The govern

APA, Harvard, Vancouver, ISO, and other styles

47

Kulchitsky, Nikolay A., Arkady V. Naumov, and Vadim V. Startsev. "Photonic and Terahertz applications as the next gallium arsenide market driver." Modern Electronic Materials 6, no. 3 (2020): 77–84. http://dx.doi.org/10.3897/j.moem.6.3.63224.

Full text

Abstract:

Analysis of current GaAs and related device market initiated in a number of earlier works has been continued. Binary semiconductor GaAs compound is a conventional MW electronics material. Until recently GaAs based HF ICs for mobile phones were among the most rapidly growing segments of GaAs market. However the GaAs market development trend is changing. Photonics and Terahertz engineering are becoming the new world GaAs market drivers. This means that the current emphasize of GaAs single crystal technologies will shift toward vertical directional crystallization of “optoelectronic quality” crys

APA, Harvard, Vancouver, ISO, and other styles

48

Kulchitskiy, N. A., A. V. Naumov, and V. V. Startsev. "Photonic and terahertz applications as a next driver of gallium arsenide market." Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering 23, no. 3 (2020): 167–76. http://dx.doi.org/10.17073/1609-3577-2020-3-167-176.

Full text

Abstract:

Analysis of current GaAs and related device market initiated in a number of earlier works has been continued. Binary semiconductor GaAs compound is a conventional MW electronics material. Until recently GaAs based HF ICs for mobile phones were among the most rapidly growing segments of GaAs market. However the GaAs market development trend is changing. Photonics and TeraHertz engineering are becoming the new world GaAs market drivers. This means that the current emphasize of GaAs single crystal technologies will shift toward vertical directional crystallization of “optoelectronic quality” crys

APA, Harvard, Vancouver, ISO, and other styles

49

Lee, Amy H. I., Tzu Ning Liu, Jian Shun Chen, and Chun Yu Lin. "New Product Development Model for Solar Cells." Applied Mechanics and Materials 543-547 (March 2014): 737–40. http://dx.doi.org/10.4028/www.scientific.net/amm.543-547.737.

Full text

Abstract:

Global warming is a major reason for dramatic climate changes around the world. Among various renewable energy sources, solar energy is one of the most promising for environmental protection and natural resource scarcity resolution. With the technical advantages obtained from the semiconductor and TFT-LCD industries, the Photovoltaic (PV) industry in Taiwan can achieve a solid global position. Current PV products, however, still face a large obstacle due to high production cost and low PV conversion efficiency. An important source of competitive advantage, survival and renewal for firms in tod

APA, Harvard, Vancouver, ISO, and other styles

50

Papanu, Victor. "Comparative Test Data for TIM Materials for LED Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (2012): 000655–83. http://dx.doi.org/10.4071/2012dpc-ta41.

Full text

Abstract:

Developments in thermal interface materials (TIMs) continue across the industry with a variety of different types of materials. Thermal and mechanical design engineers are often confronted with the need to select which type or category of TIM material is the most appropriate for a specific LED module application, which can be confusing, and how to determine which materials provide the best thermal performance. The next step is understanding which TIM material types meet requirements for ease of shipping, handling, placement, cost, and rework. These are important distinctions, in addition to th

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!