Books on the topic 'Surface mount technology'
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Prasad, Ray P. Surface Mount Technology. Boston, MA: Springer US, 1997. http://dx.doi.org/10.1007/978-1-4615-4084-7.
Prasad, Ray P. Surface Mount Technology. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-011-6532-7.
Strauss, Rudolf. Surface mount technology. Oxford: Butterworth-Heinemann, 1994.
Hinch, Stephen W. Handbook of surface mount technology. Harlow, Essex, England: Longman Scientific & Technical, 1988.
Prasad, Ray P. Surface mount technology: Principles and practice. 2nd ed. New York: Chapman & Hall, 1997.
Prasad, Ray P. Surface mount technology: Principles and practice. New York: Van Nostrand Reinhold, 1989.
Miller, Richard Kendall. Survey on surface mount technology. Madison, GA: Future Technology Surveys, 1989.
Marcoux, Phil P. Fine Pitch Surface Mount Technology. Boston, MA: Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3532-4.
Council, Hong Kong Productivity, and Hong Kong. Industry Development Board., eds. Study on surface mount technology. [Hong Kong: Govt. Printer, 1987.
Gurnett, Keith W. Surface mount handbook. Sutton: Reed Electronics Research, 1999.
Prasad, Ray P. Surface mount technology: Principles and practice. 2nd ed. Boston: Kluwer Academic, 2000.
Zarrow, Phil. Surface mount technology terms and concepts. Boston: Newnes, 1997.
Traister, John E. Design guidelines for surface mount technology. San Diego: Academic Press, 1990.
Solberg, Vern. Design guidelines for surface mount technology. Blue Ridge Summit, PA: TAB Professional and Reference Books, 1989.
Rowland, Robert. Applied surface mount assembly: A guide to surface mount materials and processes. New York: Van Nostrand Reinhold, 1993.
Zarrow, Phil. Surface mount technology glossary: Terms and definitions. Durham, N.H: ITM Inc., 1994.
Lau, John H., ed. Handbook of Fine Pitch Surface Mount Technology. Boston, MA: Springer US, 1994. http://dx.doi.org/10.1007/978-1-4684-1437-0.
Hollomon, James K. Surface-Mount Technology for PC Board Design. Indianapolis, IN: Howard W. Sams & Co., 1989.
H, Lau John, ed. Handbook of fine pitch surface mount technology. New York: Van Nostrand Reinhold, 1994.
Lea, C. A scientific guide to surface mount technology. Ayr, Scotland: Electrochemical Publications, 1988.
Capillo, Carmen. Surface mount technology: Materials, processes, and equipment. New York: McGraw-Hill, 1990.
Capillo, Carmen. Surface mount technology: Materials, processes, and equipment. New York: McGraw-Hill, 1989.
Ginsberg, Gerald L. Surface mount and related technologies. New York: M. Dekker, 1989.
Hollomon, James K. Surface-mount technology for P C board design. Indianapolis: Howard W. Sams, 1989.
Stockman, Susan B. Surface mount technology: A reliability review, summer 1986. Griffiss AFB, N.Y: Rome Air Development Center, 1986.
Classon, Frank. Surface mount technology for concurrent engineering and manufacturing. New York: McGraw-Hill, 1993.
Walton, Richard S. Surface mount technology: The connection to the future. Scottsdale, Ariz. (15022 N. 75th St., Scottsdale 85260-2476): Integrated Circuit Engineering Corp., 1985.
L, Heiserman David. Surface-mount devices: Troubleshooting and repair. Englewood Cliffs, N.J: Prentice Hall, 1990.
Trsan, Mạnh Hòa. Học liueu khóa electronics assembly: Thru hole technology & surface mount technology. San Jose, CA: [s.n.], 1995.
Solberg, Vern. Design guidelines for surface mount and fine pitch technology. 2nd ed. New York: McGraw-Hill, 1996.
Savage, Robert M. Automated inspection of soldered joints for surface mount technology. [Washington, D.C.]: National Aeronautics and Space Administration, Scientific and Technical Information Branch, 1993.
Danielsson, Hans. Surface mount technology with fine pitch components: The manufacturing issues. London: Chapman & Hall, 1995.
Marcoux, Philip P. Fine pitch surface mount technology: Quality, design, and manufacturing techniques. New York: Van Nostrand Reinhold, 1992.
Danielsson, Hans. Surface mount technology with fine pitch components: The manufacturing issues. London: Chapman & Hall, 1995.
Béla, Laczkó, ed. Felületszerelési technológia az elektronikában. Budapest: OMIKK, 1988.
A, Curtis David. Surface-mount technology in electronics packaging, 1992-1996: Industry impact of new SMT generations and alternative technologies. Burlington, Mass: Decision Resources, Inc., 1992.
Flohr, Rainer. Beitrag zur optimalen Verbindungstechnik in der Oberflächenmontage (SMT). München: C. Hanser, 1991.
Gábor, Ripka. Felületre szerelhető alkatrészek. Budapest: Műszaki Könyvkiadó, 1992.
H, Lau John, ed. Chip on board technologies for multichip modules. New York: Van Nostrand Reinhold, 1994.
J, Williams David. Thermoplastic compounds for solderable electronic interconnect devices. Littleton, MA, USA (311 Great Rd., Littleton 01460): PST Group, 1991.
Dorbath, Bernd, Otto-Dietrich Hennemann, and Heinz Mieskes. Entwicklung von neuen Klebtechnologien in der Elektronik. München: Adhäsion Buchreihe, 1991.
Ismail, Ismarani. Stencil printing of solder paste for reflow soldering of surface mount technology assembly. Salford: University of Salford, 1995.
Haskard, M. R. Electronic circuit cards and surface mount technology: A guide to their design, assembly, and application. New York: Prentice Hall, 1992.
Haskard, M. R. Electronic circuit cards and surface mount technology: A guide to their design, assembly, and application. Port Erin [England]: Technical Reference Publications, 1997.
Rahn, Armin. The basics of soldering. New York: Wiley, 1993.
Hilton, Richard D. Printed circuit boards. Norwalk, CT: Business Communications Co., 1999.
Hilton, Richard D. Printed circuit boards: Markets & opportunities. Norwalk, CT: Business Communications Co., 1994.
Bailey, Chris. Computational modelling. Edited by ebrary Inc. Bradford, England: Emerald Group Publishing, 2002.
Publications, Electronic Trend, ed. SMT assembly equipment market trends. Saratoga, CA: Electronic Trend Publications, 1988.
ASM International Electronic Materials and Processing Congress (2nd 1989 Philadelphia, Pa.). Microelectronic packaging technology: Materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989. Metals Park, Ohio: ASM International, 1989.