Relevant bibliographies by topics / Wafer manufacturing process

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Wafer manufacturing process'

Author: Grafiati
Published: 4 June 2021
Last updated: 6 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Wafer manufacturing process.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Wafer manufacturing process"

1

Lee, Seungchul, and Jun Ni. "Genetic Algorithm for Job Scheduling with Maintenance Consideration in Semiconductor Manufacturing Process." Mathematical Problems in Engineering 2012 (2012): 1–16. http://dx.doi.org/10.1155/2012/875641.

Full text
Abstract:
This paper presents wafer sequencing problems considering perceived chamber conditions and maintenance activities in a single cluster tool through the simulation-based optimization method. We develop optimization methods which would lead to the best wafer release policy in the chamber tool to maximize the overall yield of the wafers in semiconductor manufacturing system. Since chamber degradation will jeopardize wafer yields, chamber maintenance is taken into account for the wafer sequence decision-making process. Furthermore, genetic algorithm is modified for solving the scheduling problems in this paper. As results, it has been shown that job scheduling has to be managed based on the chamber degradation condition and maintenance activities to maximize overall wafer yield.
APA, Harvard, Vancouver, ISO, and other styles
2

Hagimoto, Yoshiya, Hayato Iwamoto, Yasushi Honbe, Takuro Fukunaga, and Hitoshi Abe. "Defects of Silicon Substrates Caused by Electro-Static Discharge in Single Wafer Cleaning Process." Solid State Phenomena 145-146 (January 2009): 185–88. http://dx.doi.org/10.4028/www.scientific.net/ssp.145-146.185.

Full text
Abstract:
While batch wafer cleaning processes have been conventionally used in the semiconductor manufacturing for many years, the use of single wafer cleaning processes in the manufacturing has recently become increasingly widespread. Single wafer cleaning processes have the advantages of reducing particle and metal contamination, however, electric charge or electrostatic discharge phenomena occurring in these processes causes serious problems such as device destruction through insulation failure and circuit disconnection [1,2]. Well-known examples are the breakdown of the ultra-thin gate oxide and the dissolution of Cu wiring due to charging-up damage in de-ionized water rinsing, which occur during the single wafer wet cleaning process in semiconductor manufacturing. We investigated the problem of wafer defects caused by electrostatic discharge and characterized them using transmission electron microscope (TEM) and energy dispersive X-ray (EDX) analyses.
APA, Harvard, Vancouver, ISO, and other styles
3

KANNO, Itaru. "Clean Technology Supporting Semiconductor Manufacturing Process. Wafer Cleaning Technology." Journal of the Surface Finishing Society of Japan 50, no. 10 (1999): 861–66. http://dx.doi.org/10.4139/sfj.50.861.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Strothmann, Tom, Damien Pricolo, Seung Wook Yoon, and Yaojian Lin. "A Flexible Manufacturing Method for Wafer Level Packages." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (January 1, 2014): 000815–29. http://dx.doi.org/10.4071/2014dpc-tp21.

Full text
Abstract:
The demand for Wafer Level Chip Scale Packages (WLCSP) has experienced tremendous growth due to the surge in demand for advanced mobile products. The increased demand is seen for both 200mm wafers and 300mm wafers, however a significant segment of the market continues to be driven by 200mm designs. The infrastructure capacity supporting 200mm WLCSP has been stressed as a result of the mature status of 200mm technology and the rate of conversion of alternative package formats to WLCSP. This creates a dilemma for WLP service providers because adding 200mm capacity continues to require a significant amount of capital. Since 200mm volumes will most likely decline within the next 5 years, it is difficult to justify the use of capital when the depreciation term is longer than the anticipated life cycle of the product. Conventional methods of manufacturing wafer level packages require the use of equipment specifically sized to a given silicon wafer diameter although there is no technical requirement to maintain the round silicon format. The conventional method has been beneficial since it leveraged equipment and processes developed for the IC industry, however the equipment is very expensive for larger wafer diameters and the fine geometries required in advanced node IC products are not required for wafer level packaging. The problem is serious for 200mm and 300mm wafer bump lines, however the capital equipment cost for a future 450mm bumping line may well be prohibitive for wafer level packaging. A new manufacturing method has been developed to produce a wafer level package that severs the link between wafer diameter and wafer level packaging methods. The new manufacturing method is wafer size agnostic, so one manufacturing module can produce fan-in, fan-out, and 3D fan-out products regardless of the incoming wafer size. The same bill of materials, manufacturing methods and manufacturing location can produce wafer level packages from any size silicon wafer. In this method the wafer is diced prior to processing and then the die are recombined into a uniform panel size. Once recombined into a panel format, the product is processed with conventional wafer level packing techniques, including dielectric deposition, metal plating and solder ball drop. Since the manufacturing module is wafer size agnostic, there is no risk of capital for investment in the manufacturing infrastructure. A change in loading between 200mm, 300mm, and 450mm wafers does not adversely affect the utilization of the manufacturing module. The process also enables new advanced wafer level packages otherwise unattainable with conventional manufacturing methods. This presentation will describe the new manufacturing module approach and the results of process characterization for products produced in the module.
APA, Harvard, Vancouver, ISO, and other styles
5

Tian, Y. B., Li Bo Zhou, Jun Shimizu, H. Sato, and Ren Ke Kang. "A Novel Single Step Thinning Process for Extremely Thin Si Wafers." Advanced Materials Research 76-78 (June 2009): 434–39. http://dx.doi.org/10.4028/www.scientific.net/amr.76-78.434.

Full text
Abstract:
The demand for extremely-thin Si wafers is expanding. Current manufacturing technologies are meeting great challenges with the continuous decrease in Si wafer thickness. In this study, a novel single step thinning process for extremely thin Si wafers was put forward by use of an integrated cup grinding wheel (ICGW) in which diamond segments and chemo-mechanical grinding (CMG) segments are alternately allocated along the wheel periphery. The basic machining principle and key technologies were introduced in detail. Grinding experiments were performed on 8-in. Si wafers with a developed ICGW to explore the minimal wafer thickness and grinding performance. The experimental results indicate that the proposed grinding process with the ICGW is an available thinning approach for extremely thin Si wafer down to 15μm
APA, Harvard, Vancouver, ISO, and other styles
6

Saidin, Mohd Hazmuni, and Norlena Hasnan. "HUMAN ERROR REDUCTION PROGRAM THROUGH CANONICAL ACTION RESEARCH (CAR) IN WAFER FABRICATION MANUFACTURING FACILITY." Journal of Technology and Operations Management 14, Number 1 (June 27, 2019): 8–18. http://dx.doi.org/10.32890/jtom.14.1.2.

Full text
Abstract:
In a wafer fabrication manufacturing facility, thousands of wafers are being processed daily. To manufacture the product, the wafers need to go thru hundreds of steps according to the technologies required. The cycle time to complete a standard product ranges from few weeks to few months, depends on the complexity of the technologies. Due to the difficulty and the complexity of the product, Computer Integrated Manufacturing system (CIM), is widely used as a manufacturing platform. As such, all the processes, equipment and wafers are fully integrated. Nevertheless, not all processes could be processed automatically. In the situation of the halfway processes wafer due to equipment or facility interruption, the wafer, need to be processed manually. Engineers or technicians will manually process the affected wafer according to the specification. The problem arises when; there is a human involvement that ends up with wafers misprocess. The potential revenue lost due to wafer misprocess is vast. Hence, this paper aims to discuss issues related to human error in manufacturing, specifically in Wafer Fabrication Manufacturing Facility. The paper presents partial input for the Canonical Action Research (CAR) that presently being exercised in order to minimize human error by developing a Small Group Activities (SGA) in the manufacturing facility.
APA, Harvard, Vancouver, ISO, and other styles
7

Shelton, Doug. "Advanced Manufacturing Technology for Fan-Out Wafer Level Packaging." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000251–55. http://dx.doi.org/10.4071/isom-2015-wa34.

Full text
Abstract:
Advanced process technology is required to develop and enable mass production of Fan-Out Wafer-Level Packaging (FOWLP) solutions for high-density 3D and 2.5D packaging. Canon has identified key challenges that must be solved for successful implementation of high-density integration technologies and has developed key technology for Canon Litho Systems to support the most challenging processes. In this paper, Canon will present process optimization results for high-resolution patterning of wafers across large topography as well as solutions that enable litho systems to compensate for FOWLP grid error due to die placement errors.
APA, Harvard, Vancouver, ISO, and other styles
8

Hünten, Martin, Daniel Hollstegge, and Fritz Klocke. "Wafer Level Glass Molding." Key Engineering Materials 523-524 (November 2012): 1001–5. http://dx.doi.org/10.4028/www.scientific.net/kem.523-524.1001.

Full text
Abstract:
Manufacturing of micro optical components is approached with many different technologies. In this paper it is presented how the precision glass molding process is enabled to manufacture micro optical components made out of glass. In comparison to the existing glass molding technology the new approach aims for molding entire glass wafers including multiple micro optical components. It is explained which developments in the filed of simulation, mold manufacturing and molding were accomplished in order to enable the precision glass molding on wafer scale.
APA, Harvard, Vancouver, ISO, and other styles
9

KIM, Jongwon. "New Wafer Alignment Process Using Multiple Vision Method for Industrial Manufacturing." Electronics 7, no. 3 (March 11, 2018): 39. http://dx.doi.org/10.3390/electronics7030039.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Tuck-Boon Chan, A. Pant, Lerong Cheng, and P. Gupta. "Design-Dependent Process Monitoring for Wafer Manufacturing and Test Cost Reduction." IEEE Transactions on Semiconductor Manufacturing 25, no. 3 (August 2012): 447–59. http://dx.doi.org/10.1109/tsm.2012.2196709.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Wafer manufacturing process"

1

Jin, Ran. "Variation modeling, analysis and control for multistage wafer manufacturing processes." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/41077.

Full text
Abstract:
Geometric quality variables of wafers, such as BOW and WARP, are critical in their applications. A large variation of these quality variables reduces the number of conforming products in the downstream production. Therefore, it is important to reduce the variation by variation modeling, analysis and control for multistage wafer manufacturing processes (MWMPs). First, an intermediate feedforward control strategy is developed to adjust and update the control actions based on the online measurements of intermediate wafer quality measurements. The control performance is evaluated in a MWMP to transform ingots into polished wafers. However, in a complex multistage manufacturing process, the quality variables may have nonlinear relationship with the parameters of the predictors. In this case, piecewise linear regression tree (PLRT) models are used to address nonlinear relationships in MWMP to improve the model prediction performance. The obtained PLRT model is further reconfigured to be complied with the physical layout of the MWMP for feedforward control purposes. The procedure and effectiveness of the proposed method is shown in a case study of a MWMP. Furthermore, as the geometric profiles and quality variables are important quality features for a wafer, fast and accurate measurements of those features are crucial for variation reduction and feedforward control. A sequential measurement strategy is proposed to reduce the number of samples measured in a wafer, yet provide adequate accuracy for the quality feature estimation. A Gaussian process model is used to estimate the true profile of a wafer with improved sensing efficiency. Finally, we study the multistage multimode process monitoring problem. We propose to use PLRTs to inter-relate the variables in a multistage multimode process. A unified charting system is developed. We further study the run length distribution, and optimize the control chart system by considering the modeling uncertainties. Finally, we compare the proposed method with the risk adjustment type of control chart systems based on global regression models, for both simulation study and a wafer manufacturing process.
APA, Harvard, Vancouver, ISO, and other styles
2

Liu, Jia. "Heterogeneous Sensor Data based Online Quality Assurance for Advanced Manufacturing using Spatiotemporal Modeling." Diss., Virginia Tech, 2017. http://hdl.handle.net/10919/78722.

Full text
Abstract:
Online quality assurance is crucial for elevating product quality and boosting process productivity in advanced manufacturing. However, the inherent complexity of advanced manufacturing, including nonlinear process dynamics, multiple process attributes, and low signal/noise ratio, poses severe challenges for both maintaining stable process operations and establishing efficacious online quality assurance schemes. To address these challenges, four different advanced manufacturing processes, namely, fused filament fabrication (FFF), binder jetting, chemical mechanical planarization (CMP), and the slicing process in wafer production, are investigated in this dissertation for applications of online quality assurance, with utilization of various sensors, such as thermocouples, infrared temperature sensors, accelerometers, etc. The overarching goal of this dissertation is to develop innovative integrated methodologies tailored for these individual manufacturing processes but addressing their common challenges to achieve satisfying performance in online quality assurance based on heterogeneous sensor data. Specifically, three new methodologies are created and validated using actual sensor data, namely, (1) Real-time process monitoring methods using Dirichlet process (DP) mixture model for timely detection of process changes and identification of different process states for FFF and CMP. The proposed methodology is capable of tackling non-Gaussian data from heterogeneous sensors in these advanced manufacturing processes for successful online quality assurance. (2) Spatial Dirichlet process (SDP) for modeling complex multimodal wafer thickness profiles and exploring their clustering effects. The SDP-based statistical control scheme can effectively detect out-of-control wafers and achieve wafer thickness quality assurance for the slicing process with high accuracy. (3) Augmented spatiotemporal log Gaussian Cox process (AST-LGCP) quantifying the spatiotemporal evolution of porosity in binder jetting parts, capable of predicting high-risk areas on consecutive layers. This work fills the long-standing research gap of lacking rigorous layer-wise porosity quantification for parts made by additive manufacturing (AM), and provides the basis for facilitating corrective actions for product quality improvements in a prognostic way. These developed methodologies surmount some common challenges of advanced manufacturing which paralyze traditional methods in online quality assurance, and embody key components for implementing effective online quality assurance with various sensor data. There is a promising potential to extend them to other manufacturing processes in the future.
Ph. D.
APA, Harvard, Vancouver, ISO, and other styles
3

Kieffer, Daniel W. "Feasibility of recycling air conditioner condensate for use as process water for a manufacturing facility." Oklahoma City : [s.n.], 2008.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

Heber, Dominici Victoria Blanca. "Design Improvement of a Water Recirculation System for a Cooling Process in a Tobacco Manufacturing Plant." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2019.

Find full text
Abstract:
In the industrial sector, it is possible to observe unexpected behaviours of processes, which were not anticipated in the design stage. Such is the case of a secondary cooling process existing within a tobacco manufacturing plant, which was initially designed to cool and recover clean process water with chilled water for posterior recirculation into the main cooling process. It has been observed that under the design flowrates the plate and frame heat exchanger where the process water is cooled is rapidly clogged by suspended solids coming from the main cooling process, resulting in both high maintenance costs and frequent product ion downtime due to necessary intervention for mechanical cleaning. The aim of this thesis project is to evaluate and design process improvements providing sustainable solutions, reducing the operative costs existing nowadays and avoiding any damage on the plate and frame heat exchanger. Any process design solution asks for a capital investment, which was also considered in the overall analysis of the alternatives within this study. Within the evaluation of the possible modifications, solid/liquid separation was mostly studied, together with the selection and design of an appropriate heat exchanger for the given process. After a preliminary screening, a reduced number of alternatives were analysed in detail to assess their possible application. Few alternatives to solving the problem have been studied, in spite of having a wide variety of options.
APA, Harvard, Vancouver, ISO, and other styles
5

Grossmann, Anja. "Influence of manufacturing process parameters on the physical properties of an oil-in-water cream." [S.l. : s.n.], 2007.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

George, Jonathan Alan. "Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock." Diss., CLICK HERE for online access, 2010. http://contentdm.lib.byu.edu/ETD/image/etd3494.pdf.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Vay, Kerstin. "Analysis and control of the manufacturing process and the release properties of PLGA microparticles for sustained delivery of a poorly water-soluble drug." Diss., lmu, 2012. http://nbn-resolving.de/urn:nbn:de:bvb:19-150495.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Vay, Kerstin [Verfasser], and Wolfgang [Akademischer Betreuer] Frieß. "Analysis and control of the manufacturing process and the release properties of PLGA microparticles for sustained delivery of a poorly water-soluble drug / Kerstin Vay. Betreuer: Wolfgang Frieß." München : Universitätsbibliothek der Ludwig-Maximilians-Universität, 2012. http://d-nb.info/1029040303/34.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Davico, Luca [Verfasser], Eckhard [Gutachter] Weidner, and Marcus [Gutachter] Petermann. "Manufacturing and characterization of microcapsules obtained by the PGSS process from water in oil emulsions stabilized by emulsifiers / Luca Davico ; Gutachter: Eckhard Weidner, Marcus Petermann ; Fakultät für Maschinenbau." Bochum : Ruhr-Universität Bochum, 2019. http://d-nb.info/1191481611/34.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Vacek, Jan. "Využití srážkových vod v průmyslovém objektu." Master's thesis, Vysoké učení technické v Brně. Fakulta stavební, 2016. http://www.nusl.cz/ntk/nusl-240371.

Full text
Abstract:
Diploma thesis contains a design the plumbing and gas installations in the industrial building. The theoretical part deals with the use of rainwater in the building as the process water and the experimental determination of the flow rate and water needs for the manufacturing and storage hall with built-office. The calculation part deals with the design of variants of plumbing and gas installations in the building manufacturing and storage hall with built-office. The practical part contains a design and project documentation of selected variants plumbing and gas installations in the manufacturing and storage hall with built-office, and the use of rainwater in this type of building.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Wafer manufacturing process"

1

Zhang, Wenwu. Intelligent energy field manufacturing: Interdisciplinary process innovations. Boca Raton, FL: CRC Press, 2010.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
2

National, Convention of Chemical Engineers (5th 1990 Hyderabad India). Fifth National Convention of Chemical Engineers: 5th to 7th January 1990 : convention theme, water management in process industries. [Hyderabad: The Institution of Engineers (India), Andhra Pradesh State Centre, 1990.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

National Convention of Chemical Engineers (5th 1990 Hyderabad, India). Fifth National Convention of Chemical Engineers. [Hyderabad: The Institution of Engineers (India), Andhra Pradesh State Centre, 1990.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

Laothumthut, Punnchalee. Chemistry and chemical process studies of fluoride removal in a silicon wafer manufacturing wastewater treatment plant. 1996.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
5

Zhang, Jie, and Huazhong University of Science and Technology Staff. Wafer Fabrication: Automatic Materiel Handling System. De Gruyter, Inc., 2018.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

Intelligent Energy Field Manufacturing: Interdisciplinary Process Innovations. CRC, 2010.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
7

(Editor), Marco Taisch, Klaus-Dieter Thoben (Editor), and Marco Montorio (Editor), eds. Advanced Manufacturing: An ICTand Systems Perspective (Balkema--Proceedings and Monographs in Engineering, Water and Earth Sciences). Taylor & Francis, 2007.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
8

Wong, Alfred K. Design and Process Integration for Microelectronic Manufacturing 4. Society of Photo Optical, 2006.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
9

Hustad, Douglas. How Can We Reduce Manufacturing Pollution? Lerner Publishing Group, 2016.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
10

Hustad, Douglas. How Can We Reduce Manufacturing Pollution? Lerner Publishing Group, 2016.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Book chapters on the topic "Wafer manufacturing process"

1

Wei, Xin, Rui Wei Huang, Shao Hui Lai, and Z. H. Xie. "Vibration Analysis of ID Slicing Process and Wafer Measurement." In Advances in Machining & Manufacturing Technology VIII, 641–45. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-999-7.641.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Krapf, E., and R. Preisser. "High Purity Water for Semiconductor Manufacturing." In Process Technologies for Water Treatment, 181–88. Boston, MA: Springer US, 1988. http://dx.doi.org/10.1007/978-1-4684-8556-1_17.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Cuviella-Suárez, Carlos, David Borge-Diez, and Antonio Colmenar-Santos. "Production Line: Process and Energy Modeling." In Water and Energy Use in Sanitary-ware Manufacturing, 43–95. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-72491-7_4.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Bhowmik, Sumit, Jagadish, and Kapil Gupta. "Modeling and Optimization of Abrasive Water Jet Machining Process." In Modeling and Optimization of Advanced Manufacturing Processes, 29–44. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-030-00036-3_3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Gupta, Pankaj Kumar, Rahul Sharma, and Gaurav Kumar. "Impact of Water Particles on Fly Ash–Filled E-Glass Fiber–Reinforced Epoxy Composites." In Advanced Materials and Manufacturing Processes, 257–67. Boca Raton: CRC Press, 2021. http://dx.doi.org/10.1201/9781003093213-16.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Kaur, Jaspreet, and Satyendra Singh. "Numerical Analysis of Thermo-Physical Properties Using Disc Blade Inserts with Al2O3/TiO2 Water-Based Nanofluids." In Advances in Materials Engineering and Manufacturing Processes, 59–68. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-4331-9_6.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Volf, Michal, Maryna Demianenko, Oleksandr Starynskyi, Oleksandr Liaposhchenko, and Alireza Mahdavi Nejad. "Numerical Simulation of the Mass-Transfer Process Between Ammonia and Water in the Absorption Chiller." In Advances in Design, Simulation and Manufacturing III, 239–48. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-50491-5_23.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Siva Kumar, M., N. Lenin, and D. Rajamani. "Selection of Components and Their Optimum Manufacturing Tolerance for Selective Assembly Technique Using Intelligent Water Drops Algorithm to Minimize Manufacturing Cost." In Nature-Inspired Optimization in Advanced Manufacturing Processes and Systems, 211–27. First edition. | Boca Raton : CRC Press, 2020. | Series:: CRC Press, 2020. http://dx.doi.org/10.1201/9781003081166-13.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Li, Shu, David S. Jones, and Gavin P. Andrews. "Hot Melt Extrusion: A Process Overview and Use in Manufacturing Solid Dispersions of Poorly Water-Soluble Drugs." In Drug Delivery Strategies for Poorly Water-Soluble Drugs, 325–58. Oxford, UK: John Wiley & Sons Ltd, 2013. http://dx.doi.org/10.1002/9781118444726.ch11.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Kiran, K., K. Ravi Kumar, and K. Chandrasekar. "Optimization of Abrasive Water Jet Machining Parameters of Al/Tic Using Response Surface Methodology and Modified Artificial Bee Colony Algorithm." In Nature-Inspired Optimization in Advanced Manufacturing Processes and Systems, 245–58. First edition. | Boca Raton : CRC Press, 2020. | Series:: CRC Press, 2020. http://dx.doi.org/10.1201/9781003081166-15.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Wafer manufacturing process"

1

Nadahara, Soichi, Kazuo Saki, and Hiroshi Tomita. "Process damage in single-wafer cleaning process." In Microelectronic Manufacturing, edited by Damon K. DeBusk and Sergio A. Ajuria. SPIE, 1997. http://dx.doi.org/10.1117/12.284676.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Chen, Heping, Ben Mooring, and Harold Stern. "Dynamic wafer handling process in semiconductor manufacturing." In 2011 IEEE International Conference on Robotics and Biomimetics (ROBIO). IEEE, 2011. http://dx.doi.org/10.1109/robio.2011.6181407.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Farris, Glenn. "Emerging Process and Assembly Challenges in Electronics Manufacturing." In 2020 International Wafer Level Packaging Conference (IWLPC). IEEE, 2020. http://dx.doi.org/10.23919/iwlpc52010.2020.9375875.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Shideler, J., Joseph Reedholm, and C. B. Chuck Yarling. "Solving production process challenges with wafer-level reliability techniques." In Microelectronic Manufacturing '95. SPIE, 1995. http://dx.doi.org/10.1117/12.221447.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Bokelberg, Eric H., and James L. Goetz. "Manufacturing requirements for a single-wafer develop process." In SPIE's 1995 Symposium on Microlithography, edited by Robert D. Allen. SPIE, 1995. http://dx.doi.org/10.1117/12.210410.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

PingHsu Chen, S. Wu, Junshien Lin, F. Ko, H. Lo, J. Wang, C. H. Yu, and M. S. Liang. "Virtual metrology: a solution for wafer to wafer advanced process control." In ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005. IEEE, 2005. http://dx.doi.org/10.1109/issm.2005.1513322.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Yoon-Peng Yee. "Important qualification process to wafer probing." In 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT). IEEE, 2008. http://dx.doi.org/10.1109/iemt.2008.5507868.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Lin, Hsun-Peng, Chun-Hong Chang, Chih-Hsiung Lee, Sheng-Liang Pang, and Kuo-Liang Lu. "Optimizing the clean effect of wafer backside in lithography developer process." In Microelectronic Manufacturing '99, edited by Anthony J. Toprac and Kim Dang. SPIE, 1999. http://dx.doi.org/10.1117/12.361309.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Murashima, Shigenobu. "Application of quality engineering in semiconductor wafer process." In 2006 International Symposium on Semiconductor Manufacturing (ISSM). IEEE, 2006. http://dx.doi.org/10.1109/issm.2006.4493061.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Irie, Makiko, Toshiaki Tachi, and Atushi Sawano. "Photoresist development for wafer-level packaging process." In 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM). IEEE, 2017. http://dx.doi.org/10.1109/edtm.2017.7947580.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Wafer manufacturing process' for particular source types:
Journal articles Dissertations / Theses Books
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography