Relevant bibliographies by topics / MEMS piezoresistive pressure sensor

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  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers
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Academic literature on the topic 'MEMS piezoresistive pressure sensor'

Author: Grafiati
Published: 3 June 2025
Last updated: 31 July 2025

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Journal articles on the topic "MEMS piezoresistive pressure sensor"

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Gao, Rui, Wenjun Zhang, Junmin Jing, et al. "Design, Fabrication, and Dynamic Environmental Test of a Piezoresistive Pressure Sensor." Micromachines 13, no. 7 (2022): 1142. http://dx.doi.org/10.3390/mi13071142.

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Microelectromechanical system (MEMS) pressure sensors have a wide range of applications based on the advantages of mature technology and easy integration. Among them, piezoresistive sensors have attracted great attention with the advantage of simple back-end processing circuits. However, less research has been reported on the performance of piezoresistive pressure sensors in dynamic environments, especially considering the vibrations and shocks frequently encountered during the application of the sensors. To address these issues, this paper proposes a design method for a MEMS piezoresistive pr
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Samridhi, Manish Kumar, Sachin Dhariwal, Kulwant Singh, and P. A. Alvi. "Stress and frequency analysis of silicon diaphragm of MEMS based piezoresistive pressure sensor." International Journal of Modern Physics B 33, no. 07 (2019): 1950040. http://dx.doi.org/10.1142/s0217979219500401.

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This paper reports the stress and frequency analysis of dynamic silicon diaphragm during the simulation of micro-electro-mechanical-systems (MEMS) based piezoresistive pressure sensor with the help of finite element method (FEM) within the frame work of COMSOL software. Vibrational modes of rectangular diaphragm of piezoresistive pressure sensor have been determined at different frequencies for different pressure ranges. Optimal frequency range for particular applications for any diaphragm is a very important so that MEMS sensors performance should not degrade during the dynamic environment. T
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Shi, Xiaoqing, Yulan Lu, Bo Xie, et al. "A Double-Ended Tuning Fork Based Resonant Pressure Micro-Sensor Relying on Electrostatic Excitation and Piezoresistive Detection." Proceedings 2, no. 13 (2018): 875. http://dx.doi.org/10.3390/proceedings2130875.

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This study proposes a microfabricated resonant pressure sensor based on electrostatic excitation and low-impedance piezoresistive detection in which a pair of double-ended tuning forks were utilized as resonators for differential outputs. In operations, targeted pressures deforms the pressure-sensitive membrane, resulting in stress variations of two resonators, leading to shifts of the intrinsic resonant frequencies, which were then measured piezoresistively. The developed microfabricated resonant pressure sensor was fabricated using simple SOI-MEMS processes and quantified in both open-loop a
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Sokolov, L. V. "Analysis of the Main Causes of Piezoresistive Sensors Temporary Instability and Constructive Solutions of the Problem." Nano- i Mikrosistemnaya Tehnika 26, no. 3 (2024): 145–49. http://dx.doi.org/10.17587/nmst.26.145-149.

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The main reasons for the temporary instability of silicon piezoresistive sensors and MEMS in harsh operating conditions are analyzed. An innovative design of a pressure sensor MEMS-KNIMT with an integral micromechanical structure and a monolithic frame, a pressure module and an innovative method for manufacturing a pressure sensor have been developed.
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Du, Li Dong, Zhan Zhao, Li Xiao, Meng Ying Zhang, and Zhen Fang. "A SOI-MEMS Piezoresistive Atmosphere Pressure Sensor." Key Engineering Materials 562-565 (July 2013): 394–97. http://dx.doi.org/10.4028/www.scientific.net/kem.562-565.394.

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In this paper, a SOI-MEMS (silicon on insulator- micro electro mechanical system) pizeoresistive atmosphere pressure sensor is presented using anodic bonding. Differently from the prevailing fabrication process of silicon piezoresistive pressure sensor: the device layer monocrystalline of SOI silicon wafer is used as the strain gauge with a simple deep etching process; and the SiO2 layer of SOI silicon wafer as the insulator between strain gauge and substrate. The whole fabrication processes of the designed sensor are very simple, and can reduce the cost of sensor. The Pressure-Voltage charact
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Frantlovic, Milos, Ivana Jokic, Zarko Lazic, et al. "Temperature measurement performance of silicon piezoresistive MEMS pressure sensors for industrial applications." Facta universitatis - series: Electronics and Energetics 28, no. 1 (2015): 123–31. http://dx.doi.org/10.2298/fuee1501123f.

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Temperature and pressure are the most common parameters to be measured and monitored not only in industrial processes but in many other fields from vehicles and healthcare to household appliances. Silicon microelectromechanical (MEMS) piezoresistive pressure sensors are the first and the most successful MEMS sensors, offering high sensitivity, solid-state reliability and small dimensions at a low cost achieved by mass production. The inherent temperature dependence of the output signal of such sensors adversely affects their pressure measurement performance, necessitating the use of correction
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Hossain, Awlad, and Ahsan Mian. "Four-Terminal Square Piezoresistive Sensors for MEMS Pressure Sensing." Journal of Sensors 2017 (2017): 1–11. http://dx.doi.org/10.1155/2017/6954875.

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The sensitivity of four-terminal piezoresistive sensors commonly referred to as van der Pauw (VDP) structure is investigated. The VDP sensor is considered to be fabricated on (100) silicon due to its potential application in MEMS (microelectromechanical systems) pressure sensors. The sensitivity of the VDP sensor may be affected by misalignment during the etching/diffusion process, the nonuniformity of piezoresistive coefficients through the sensor thickness, and pad size with respect to the sensor size. For this particular analysis, the effect of VDP stress sensitivity on variations in pad si
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Kordrostami, Zoheir, Kourosh Hassanli, and Amir Akbarian. "MEMS piezoresistive pressure sensor with patterned thinning of diaphragm." Microelectronics International 37, no. 3 (2020): 147–53. http://dx.doi.org/10.1108/mi-09-2019-0060.

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Purpose The purpose of this study is to find a new design that can increase the sensitivity of the sensor without sacrificing the linearity. A novel and very efficient method for increasing the sensitivity of MEMS pressure sensor has been proposed for the first time. Rather than perforation, we propose patterned thinning of the diaphragm so that specific regions on it are thinner. This method allows the diaphragm to deflect more in response with regard to the pressure. The best excavation depth has been calculated and a pressure sensor with an optimal pattern for thinned regions has been desig
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Pan, Hai Bin, Jian Ning Ding, Guang Gui Cheng, and Hui Juan Fan. "FEM Simulation of a Twin-Island Structure Chip in Piezoresistive Pressure Sensor." Key Engineering Materials 464 (January 2011): 208–12. http://dx.doi.org/10.4028/www.scientific.net/kem.464.208.

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In this paper a twin-island structure in piezoresistive pressure sensor based on MEMS technology has been presented, and a finite element mechanical model has been developed to simulate the static mechanical behavior of this twin-island structure sensor chip, especially the stress distributions in diaphragm of the sensor chip, which has a vital significance on piezoresistive pressure sensors’ sensitivity. The possible impacts of twin-island’s location and twin-island’s width on the stress distributions, as well as the maximum value of compressive stress and tensile stress, have been investigat
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Maflin Shaby, S., and A. Vimala Juliet. "Analysis and Optimization of Sensitivity of a MEMS Peizoresistive Pressure Sensor." Advanced Materials Research 548 (July 2012): 652–56. http://dx.doi.org/10.4028/www.scientific.net/amr.548.652.

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This paper presents a MEMS Piezoresistive pressure sensor which utilizes a circular shaped polysilicon diaphragm with a nanowire to enhance the sensitivity of the pressure sensor. The polysilicon nanowire is fabricated in such a way that it forms a bridge between the circular polysilicon diaphragm and the substrate. The high Piezoresistive effect of Silicon nanowires is used to enhance the sensitivity. A circular polysilicon nanowire piezoresistor was fabricated by means of reactive ion etching. This paper describes the performance analysis, structural design and fabrication of piezoresistive
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Dissertations / Theses on the topic "MEMS piezoresistive pressure sensor"

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Olszacki, Michal. "Modelling and optimization of piezoresistive pressure sensors." Toulouse, INSA, 2009. http://eprint.insa-toulouse.fr/archive/00000297/.

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Depuis 1954, où l’effet piézorésistif a été découvert dans Silicium, la démarche pour mesurer la pression a changé et de nouveaux dispositifs avec des performances remarquables sont apparus sur le marché. Grâce au développement des microtechnologies, une nouvelle famille de capteurs de pression piézorésistifs miniatures s’est ainsi progressivement imposée pour de nombreuses applications. Même si le principe de fonctionnement des capteurs de pression piézorésistif en silicium reste le même depuis de nombreuses années, l’optimisation des capteurs pour une application donnée reste toujours une ét
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Aiyar, Avishek R. "Microfabrication of a MEMS piezoresistive flow sensor - materials and processes." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/24696.

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Ibrahim, Amr. "Remotely interrogated MEMS pressure sensor." Thesis, University of Glasgow, 2012. http://theses.gla.ac.uk/4149/.

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This thesis considers the design and implementation of passive wireless microwave readable pressure sensors on a single chip. Two novel-all passive devices are considered for wireless pressure operation. The first device consists of a tuned circuit operating at 10 GHz fabricated on SiO2 membrane, supported on a silicon wafer. A pressure difference across the membrane causes it to deflect so that a passive resonant circuit detunes. The circuit is remotely interrogated to read off the sensor data. The chip area is 20 mm2 and the membrane area is 2mm2 with thickness of 4 µm. Two on chip passive r
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Waterfall, Tyler Lane. "Design of Piezoresistive MEMS Force and Displacement Sensors." Diss., CLICK HERE for online access, 2006. http://contentdm.lib.byu.edu/ETD/image/etd1549.pdf.

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Tan, T. H. "Silicon piezoresistors for MEMS pressure sensor applications." Thesis, Queen's University Belfast, 2014. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.677842.

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Silicon based micromachining technology enables the realization of high performance micro electromechanical systems (MEMS) including a range of physical and environmental sensors. Pressure sensors are used for a wide range of monitoring and control applications, e.g. environmental, industrial, aircraft, automotive. Monitoring of vehicle tyre pressures offers benefits such as improved safety, fuel economy, and tyre life. Micromachined pressure sensors are used at present, but require further research to improve their performance in terms of size, power consumption and manufacturing cost. This t
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Chen, Xiaopei. "Fiber Optic Pressure Sensor Fabrication Using MEMS Technology." Thesis, Virginia Tech, 2003. http://hdl.handle.net/10919/32744.

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A technology for fabricating fiber optic pressure sensors is described. This technology is based on intermediate-layer bonding of a fused silica ferrule to a patterned, micro-machined fused silica diaphragm, providing low temperature fabrication of optical pressure sensor heads that can operate at high temperature. Fused silica ferrules and fused silica diaphragms are chosen to reduce the temperature dependence. The fused silica diaphragms have been micro-machined using wet chemical etching in order to form extrinsic Fabry-Perot (FP) interferometric cavities. Sol-gel is used as an inter
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Rathore, Pradeep Kumar. "Cmos compatible mems structures for pressure sensing applications." Thesis, IIT Delhi, 2015. http://localhost:8080/iit/handle/2074/6894.

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Abeysinghe, Don Chandana. "Novel MEMS Pressure and Temperature Sensors Fabricated on Optical Fibers." University of Cincinnati / OhioLINK, 2001. http://rave.ohiolink.edu/etdc/view?acc_num=ucin997987327.

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Tosolini, Giordano. "Force sensors based on piezoresistive and MOSFET cantilevers for biomolecular sensing." Doctoral thesis, Universitat Autònoma de Barcelona, 2013. http://hdl.handle.net/10803/131408.

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Los procesos de reconocimiento biomolecular entre receptores y ligandos son muy importantes en biología. Estas biomoléculas pueden desarrollar complejos muy específicos y tener una variedad de funciones como replicación y transcripción genómica, actividad enzimática, respuesta inmune, señalamiento celular, etc. La complementariedad inequívoca mostrada por estos componentes biológicos es ampliamente utilizada para desarrollar biosensores. Dependiendo de la naturaleza de las señales que se convierten, los biosensores pueden ser clasificados en ópticos, eléctricos o mecánicos. Entre los sensores
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Li, Gang. "Piezoresistive pressure sensor with integrated amplifier realized using metal-induced laterally crystallized polycrystalline silicon /." View abstract or full-text, 2004. http://library.ust.hk/cgi/db/thesis.pl?ELEC%202004%20LIG.

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Book chapters on the topic "MEMS piezoresistive pressure sensor"

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Ruiz, Pilar González, Kristin De Meyer, and Ann Witvrouw. "CMOS Integrated Poly-SiGe Piezoresistive Pressure Sensor." In Poly-SiGe for MEMS-above-CMOS Sensors. Springer Netherlands, 2013. http://dx.doi.org/10.1007/978-94-007-6799-7_7.

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González Ruiz, Pilar, Kristin De Meyer, and Ann Witvrouw. "Design of a Poly-SiGe Piezoresistive Pressure Sensor." In Poly-SiGe for MEMS-above-CMOS Sensors. Springer Netherlands, 2013. http://dx.doi.org/10.1007/978-94-007-6799-7_3.

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Raj, T. Pravin, S. B. Burje, and R. Joseph Daniel. "Design of High Sensitivity SOI Piezoresistive MEMS Pressure Sensor." In Communications in Computer and Information Science. Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-20499-9_18.

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Rahman, S. H. A., N. Soin, and F. Ibrahim. "Optimization of CNT Based MEMS Piezoresistive Pressure Sensor for Intracranial Pressure Monitoring." In IFMBE Proceedings. Springer Singapore, 2015. http://dx.doi.org/10.1007/978-981-10-0266-3_12.

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Samridhi and Parvej Ahmad Alvi. "State of Art for Virtual Fabrication of Piezoresistive MEMS Pressure Sensor." In Electrical and Electronic Devices, Circuits and Materials. CRC Press, 2021. http://dx.doi.org/10.1201/9781003097723-20.

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Lenk, Claudia, Kalpan Ved, Steve Durstewitz, Tzvetan Ivanov, Martin Ziegler, and Philipp Hövel. "Bio-inspired, Neuromorphic Acoustic Sensing." In Springer Series on Bio- and Neurosystems. Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-36705-2_12.

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AbstractWe present an overview of recent developments in the area of acoustic sensing that is inspired by biology and realized by micro-electromechanical systems (MEMS). To support understanding, an overview of the principles of human hearing is presented first. After the review of bio-inspired sensing systems, we continue with an outline of an adaptable acoustic MEMS-based sensor that offers adaptable sensing properties due to a simple, real-time feedback. The transducer itself is based on an active cantilever, which offers the advantage of an integrated deflection sensing based on piezoresis
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Lakshmi, G. Sai, K. Srinivasa Rao, Koushik Guha, and K. Girija Sravani. "Design of Piezoresistive-Based Microcantilever for MEMS Pressure Sensor in Continuous Glucose Monitoring System." In Lecture Notes in Electrical Engineering. Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-3767-4_35.

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Sai Lakshmi, G., K. Srinivasa Rao, Koushik Guha, and K. Girija Sravani. "Design, Analysis and Simulation of a Piezoresistive Microbridge and Microcantilever for MEMS Pressure Sensor in Continuous Glucose." In Lecture Notes in Electrical Engineering. Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-1570-2_22.

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Mohd Noor, Anas, Zulkarnay Zakaria, and Norlaili Saad. "Intraocular MEMS Capacitive Pressure Sensor." In Lecture Notes in Mechanical Engineering. Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-0866-7_42.

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Ciampolini, P., A. Rossi, A. Pierantoni, and M. Rudan. "Electro-Elastic Simulation of Piezoresistive Pressure Sensor." In Simulation of Semiconductor Devices and Processes. Springer Vienna, 1993. http://dx.doi.org/10.1007/978-3-7091-6657-4_94.

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Conference papers on the topic "MEMS piezoresistive pressure sensor"

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Guo, Junwei, Siyuan Lv, Chen Zhang, et al. "Device optimized simulation for Silicon-Based MEMS Piezoresistive Pressure Sensors." In 2024 3rd International Symposium on Sensor Technology and Control (ISSTC). IEEE, 2024. https://doi.org/10.1109/isstc63573.2024.10824070.

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Tulaev, Artyom, Vera Loboda, and Yakob Belyaev. "System Level IC Analog Processing Design For Piezoresistive MEMS Pressure Sensor." In 2024 International Conference on Electrical Engineering and Photonics (EExPolytech). IEEE, 2024. http://dx.doi.org/10.1109/eexpolytech62224.2024.10755734.

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Suresh, M., Sadanand Singh, Nibedita Rakshit, Anirudh Santhosh, Varun Ram S, and Rishita Singh. "Computational Analysis and Performance Optimization of Square Membrane Piezoresistive MEMS Pressure Sensor." In 2024 IEEE Third International Conference on Power Electronics, Intelligent Control and Energy Systems (ICPEICES). IEEE, 2024. http://dx.doi.org/10.1109/icpeices62430.2024.10719057.

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Dhoriyani, Urva, Radha Debal Goswami, Dadasikandar Kanekal, Sumit Kumar Jindal, and Rajat Tiwari. "Analysis of MEMS Piezoresistive Pressure Sensor with Dual-Island Structures using Circular Silicon Diaphragm." In 2024 Global Conference on Communications and Information Technologies (GCCIT). IEEE, 2024. https://doi.org/10.1109/gccit63234.2024.10862846.

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Wang, Chen, Appo van der Wiel, Ben Maes, Michiel Gidts, and Michael Kraft. "A Novel Mems Resonant Pressure Sensor Operating in Air with Thermal Actuation and Piezoresistive Sensing." In 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, 2025. https://doi.org/10.1109/mems61431.2025.10917584.

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Xia, Yuqing, Peng Zhou, Chunming Zhou, Yubao Zhen, and Xiyao Du. "Investigation of the Output Voltage of a Piezoresistive MEMS Pressure Sensor Using Finite Element Modelling." In 2024 25th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2024. http://dx.doi.org/10.1109/icept63120.2024.10668457.

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Meng Yuan, Ping Liu, Bo She, Youliang Tang, and Yan Xu. "Research of MEMS piezoresistive pressure sensor." In 2010 International Conference on Future Information Technology and Management Engineering (FITME). IEEE, 2010. http://dx.doi.org/10.1109/fitme.2010.5655814.

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Kumar, S., and B. D. Pant. "Design of piezoresistive MEMS absolute pressure sensor." In 16th International Workshop on Physics of Semiconductor Devices, edited by Monica Katiyar, B. Mazhari, and Y. N. Mohapatra. SPIE, 2012. http://dx.doi.org/10.1117/12.923644.

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Nguyen, Thanh, Toan Dinh, Hoang-Phuong Phan, et al. "Optoelectronic Enhancement for Piezoresistive Pressure Sensor." In 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, 2020. http://dx.doi.org/10.1109/mems46641.2020.9056281.

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Pryputniewicz, Ryszard J. "Thermomechanics of High-Pressure MEMS Sensors." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33501.

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Increasing demand for high performance, stable, and affordable sensors for applications in process control industry has led to development of a miniature pressure sensor. This development, made possible by recent advances in microelectromechanical systems (MEMS) fabrication, utilizes polysilicon-sensing technology. The unique polysilicon piezoresistive sensor (PPS) measures differential pressure (DP) based on deformations of a multilayer/multimaterial diaphragm, which is about 2 μm thick. Deformations of a diaphragm, subjected to changes in pressure, are sensed by the piezoresistive bridge ele
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Reports on the topic "MEMS piezoresistive pressure sensor"

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Delwiche, Michael, Boaz Zion, Robert BonDurant, Judith Rishpon, Ephraim Maltz, and Miriam Rosenberg. Biosensors for On-Line Measurement of Reproductive Hormones and Milk Proteins to Improve Dairy Herd Management. United States Department of Agriculture, 2001. http://dx.doi.org/10.32747/2001.7573998.bard.

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The original objectives of this research project were to: (1) develop immunoassays, photometric sensors, and electrochemical sensors for real-time measurement of progesterone and estradiol in milk, (2) develop biosensors for measurement of caseins in milk, and (3) integrate and adapt these sensor technologies to create an automated electronic sensing system for operation in dairy parlors during milking. The overall direction of research was not changed, although the work was expanded to include other milk components such as urea and lactose. A second generation biosensor for on-line measuremen
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