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Books on the topic 'Microelectronic technology'

Author: Grafiati

Published: 28 May 2022

Last updated: 30 July 2025

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1

K, Board, and Cockrum Richard H, eds. An introduction to microelectronic technology. Wiley & Sons, 1985.

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2

Dick, Potter, Peters Laura, and Integrated Circuit Engineering Corporation, eds. Roadmaps of packaging technology. Integrated Circuit Engineering, 1997.

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3

Madhav, Datta, Ōsaka Tetsuya 1945-, and Schultze J. W, eds. Microelectronic packaging. CRC Press, 2005.

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4

Bhushan, Manjul, and Mark B. Ketchen. Microelectronic Test Structures for CMOS Technology. Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-9377-9.

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5

Bhushan, Manjul. Microelectronic Test Structures for CMOS Technology. Springer Science+Business Media, LLC, 2011.

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6

Barry, Chin, ed. Copper interconnect technology. SPIE Press, 2001.

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7

Sedra, Adel S. Microelectronic circuits. 3rd ed. Oxford UniversityPress, 1995.

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8

Jin, Yufeng. Introduction to microsystem packaging technology. CRC Press/Taylor & Francis, 2011.

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9

Jet Propulsion Laboratory (U.S.), ed. Microdevices Laboratory, MDL: Space Microelectronic Device Technology Section : Jet Propulsion Laboratory : Center for Space Microelectronics Technology--. National Aeronautics and Space Administration, Jet Propulsion Laboratory, California Institute of Technology, 1990.

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10

Jet Propulsion Laboratory (U.S.), ed. Microdevices Laboratory, MDL: Space Microelectronic Device Technology Section : Jet Propulsion Laboratory : Center for Space Microelectronics Technology--. National Aeronautics and Space Administration, Jet Propulsion Laboratory, California Institute of Technology, 1990.

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11

Jet Propulsion Laboratory (U.S.), ed. Microdevices Laboratory, MDL: Space Microelectronic Device Technology Section : Jet Propulsion Laboratory : Center for Space Microelectronics Technology--. National Aeronautics and Space Administration, Jet Propulsion Laboratory, California Institute of Technology, 1990.

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12

Reliability Analysis Center (U.S.), ed. Critical review and technology assessments '91-'92. Reliability Analysis Center, 1992.

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13

Carless, Smith Kenneth, ed. Microelectronic circuits. 4th ed. Oxford University Press, 1998.

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14

Carless, Smith Kenneth, ed. Microelectronic circuits. 3rd ed. Oxford Univ. Press, 1991.

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15

Carless, Smith Kenneth, ed. Microelectronic circuits. 3rd ed. Saunders College Pub., 1991.

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16

C, Smith Kenneth, ed. Microelectronic circuits. 5th ed. Oxford University Press, 2004.

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17

Carless, Smith Kenneth, ed. Microelectronic circuits. 2nd ed. Holt, Rinehart, and Winston, 1987.

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18

C, Smith Kenneth, ed. Microelectronic circuits. 3rd ed. Oxford University Press, 1991.

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19

Carless, Smith Kenneth, ed. Microelectronic circuits. 5th ed. Oxford University Press, 2004.

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20

C, Smith Kenneth, ed. Microelectronic circuits. 3rd ed. Saunders College Publishing, 1991.

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21

Hiroshi, Ito, Tagawa Seichi, Horie Kazuyuki 1941-, Kōbunshi Gakkai (Japan). Polymers for Microelectronics and Photonics Group., and American Chemical Society. Division of Polymeric Materials: Science and Engineering., eds. Polymeric materials for microelectronic applications: Science and technology. American Chemical Society, 1994.

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22

Jin, Yufeng. Introduction to microsystem packaging technology. Taylor & Francis, 2010.

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23

Wang, Zhiping, 1962- Oct. 6 and Chen Jing 1974-, eds. Introduction to microsystem packaging technology. Taylor & Francis, 2010.

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24

Garrou, Philip E. Multichip module technology handbook. McGraw-Hill, 1998.

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25

Steinbrüchel, Christoph. Copper interconnect technology. SPIE Optical Engineering Press, 2001.

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26

John, Child. Information technology in European services: Towards a microelectronic future. Blackwell, 1990.

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27

John, Child. Information technology in European services: Towards a microelectronic future. Basil Blackwell, 1990.

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28

J, Puttlitz Karl, and Stalter Kathleen A, eds. Handbook of lead-free solder technology for microelectronic assemblies. Marcel Dekker, 2004.

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29

Mark, Rodder, and Society of Photo-optical Instrumentation Engineers., eds. Microelectronic device technology: 1-2 October 1997, Austin, Texas. SPIE, 1997.

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30

Gilleo, Ken. Area array packaging handbook. McGraw-Hill, 2002.

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31

International Electronic Materials and Processing Congress (3rd 1990 San Francisco, Calif.). New technology in electronic packaging: Proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990. ASM International, 1990.

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32

1923-, Balde John W., ed. Foldable flex and thinned silicon multichip packaging technology. Kluwer Academic Publishers, 2003.

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33

I, Baturone, ed. Microelectronic design of fuzzy logic-based systems. CRC, 2000.

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34

Hwang, Jennie S. Ball grid array & fine pitch peripheral interconnections: A handbook of the technology & applications for microelectronics/electronics manufacturing. Electrochemical Publications Ltd, 1995.

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35

Whitehouse, Martha. Microelectronic technology and automation: Employment and training issues : a selected bibliography. Vance Bibliographies, 1988.

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36

Qin-Yi, Tong, Goesele Ulrich M, Society of Photo-optical Instrumentation Engineers., et al., eds. Advances in microelectronic device technology: 7-9 November 2001, Nanjing, China. SPIE, 2001.

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37

David, Burnett, Tsuchiya Toshiaki, Society of Photo-optical Instrumentation Engineers., and Electrochemical Society, eds. Microelectronic device technology III: 22-23 September 1999, Santa Clara, California. SPIE, 1999.

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38

Makabe, T. Plasma electronics: Applications in microelectronic device fabrication. Taylor&Francis, 2006.

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39

Ih-Chin, Chen, and Society of Photo-optical Instrumentation Engineers., eds. Microelectronic device and multilevel interconnection technology: 25-26 October 1995, Austin, Texas. SPIE, 1995.

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40

Ih-Chin, Chen, Society of Photo-optical Instrumentation Engineers., and Semiconductor Equipment and Materials International., eds. Microelectronic device and multilevel interconnection technology II: 16-17 October, 1996, Austin, Texas. SPIE, 1996.

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41

Liu, S. Modeling and simulation for microelectronic packaging assembly: Manufacture, reliability, and testing. Wiley, 2011.

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42

Hobday, Mike. The Brazilian telecommunication industry: Accumulation of microelectronic technology in the manufacturing and service sectors. United Nations, Industrial Development Organization, 1985.

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43

United Nations Industrial Development Organization, ed. The Brazilian telecommunication industry: Accumulation of microelectronic technology in the manufacturing and service sectors. United Nations Industrial Development Organization, 1985.

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44

Singh, Pooran, and Ebrahim Forati. Microelectronic Circuits. Scitus Academics LLC, 2018.

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45

Springer and Joachim Bargon. Methods and Materials in Microelectronic Technology. Springer, 2012.

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46

Bargon, Joachim. Methods and Materials in Microelectronic Technology. Springer London, Limited, 2013.

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47

Bhushan, Manjul, and Mark B. Ketchen. Microelectronic Test Structures for CMOS Technology. Springer, 2014.

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48

Bhushan, Manjul, and Mark B. Ketchen. Microelectronic Test Structures for CMOS Technology. Springer, 2011.

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49

Brewer, George. Electron-Beam Technology in Microelectronic Fabrication. Elsevier Science & Technology Books, 2012.

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50

Microelectronic Packaging (New Trends in Electrochemical Technology). CRC, 2004.

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